JP2011066222A - Component feeder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component feeder which can be reduced in size by a simple structure at a low cost while having a mechanism for aligning the front and back of a chip component. <P>SOLUTION: A component feeder is provided with: a component feeding rail for conveying a chip component P1 to a recessed part 48 which is a feeding position; a detection sensor 50 for determining the front and back of the chip component P1 that is located at the feeding position; and a front/back alignment section 60 for aligning the chip component P1 to be at the front side when it is determined that the chip component P1 is at the back side. The chip component P1 comprises a magnetic material. The front/back alignment section 60 reverses the chip component P1 from the back side to the front side by rotating the direction of a magnetic line of a force B by a predetermined angle while directing the magnetic line of the force B to the chip component P1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component supply device, and more particularly to a component supply device that sequentially conveys a plurality of small electronic components to a supply position.

As a component supply device that separately supplies chip-type electronic components (hereinafter referred to as “chip components”) one by one to an electronic component mounting device or the like, a vibration-type component supply device (vibration type) as shown in Patent Document 1 is provided. Parts feeder) is known.
This vibration-type component supply device generates vibration in a certain direction in the component passage by applying vibration at a predetermined excitation frequency from a vibration source to a component passage for supplying chip components. This is a component supply device that supplies chip components in a certain direction.

  The chip parts are various small electronic parts having an outer shape such as a rectangular cubic body and a rectangular parallelepiped, and are chip type parts such as capacitors, resistors, diodes, switches, connectors, and the like. Some of these chip parts have a front side surface and a back side surface that are distinguished from each other. For example, some chip parts must be supplied with the front side facing up.

  For this reason, for example, in the component supply apparatus described in Patent Document 1, a sensor that detects the target surface (for example, the front side surface) of the chip component is provided in the transport path, and the target surface is located on the upper side according to the detection result of the sensor. A front / back alignment mechanism for reversing the chip parts by blowing air is provided.

JP 2002-68460 A

  However, in the component supply apparatus, the structure of the conveying path is complicated and large overall in order to align the front and back of the chip components. For this reason, there has been a demand for a component supply apparatus that has a mechanism for aligning the front and back of chip components, has a simplified and miniaturized structure, and can be realized at low cost.

  The present invention has been made to solve the above-described problems of the prior art, and can be miniaturized while having a mechanism for aligning the front and back of chip parts, and can be realized with a simple structure and low cost. The object is to provide a component supply device.

  In order to achieve the above object, according to the present invention, a conveyance unit that conveys a component to a supply position, a front / back determination unit that determines the front / back of the component at the supply position, and a front / back determination unit that the component is facing down A front and back aligning unit that aligns the front and back parts, and the part is configured to include a magnetic material, and the front and back aligning unit directs magnetic lines of force to the part, By rotating the direction of the magnetic lines of force by a predetermined angle, the component is reversed from the reverse side to the front side.

  In this invention comprised in this way, when the components sent from the conveyance part are turned over, the front and back alignment part which reverses the components with a magnetic force is provided. In this case, the component is configured to include a magnetic material so as to have a characteristic of taking a predetermined posture along the direction of the magnetic force lines when arranged in the magnetic force lines. In order to invert the part, the front and back alignment unit outputs magnetic lines of force toward the part, holds the part in a predetermined posture, and rotates the magnetic lines of force by a predetermined angle. Thus, the component can be rotated and reversed. With such a configuration, the components can be reversed without contact, and a reversal function can be added with a simple configuration. Therefore, the overall configuration of the apparatus can be simplified and miniaturized to reduce costs. Can do.

  In the present invention, preferably, the front / back alignment section rotates the direction of the magnetic lines of force directed to the component by a predetermined angle continuously or stepwise. In the present invention configured as described above, the front / back alignment portion can be configured to continuously rotate the direction of the magnetic lines of force directed to the component, or can be configured to rotate intermittently. An appropriate configuration can be adopted depending on the component and the device.

  In the present invention, the front and back alignment section preferably includes a magnetic force line generating means for generating a magnetic force line toward the component, and a moving means for moving the magnetic force line generating means so that the direction of the magnetic force line rotates. In the present invention configured as described above, the direction of the magnetic force lines can be rotated in a state where the magnetic force lines are directed to the component by moving the magnetic force lines generating device such as a permanent magnet or an electromagnet by the moving means. it can.

  In the present invention, preferably, the front and back alignment portions are arranged at different positions and are configured to rotate a plurality of magnetic force line generating means positioned so as to be able to generate magnetic force lines toward the supply position, and the direction of the magnetic force lines toward the component. Switching means for sequentially switching and operating the plurality of magnetic force line generating means. In the present invention configured as described above, the direction of the magnetic force lines is rotated stepwise by switching the magnetic force line generating means arranged in a time sequence sequentially by the switching means instead of moving the magnetic force line generating means. Can be made.

  ADVANTAGE OF THE INVENTION According to this invention, while providing the mechanism which aligns the front and back of a chip component, size reduction and simplification of a structure can be achieved, and the component supply apparatus which can be implement | achieved at low cost can be provided.

It is a general view which shows the state which attached the component supply apparatus by 1st Embodiment of this invention to the component mounting apparatus. FIG. 2 is a front view (FIG. 2A), a plan view (FIG. 2B), a right side view (FIG. 2C), and a left side view (FIG. 2) showing the component supply apparatus according to the first embodiment of the present invention. (D)). It is a front view which notches and shows a part supply apparatus by 1st Embodiment of this invention. It is a principal part enlarged front view of FIG. It is a partial expanded front view which expands and shows a part of vibration apparatus of the components supply apparatus by 1st Embodiment of this invention. It is an enlarged front view which expands and shows the component channel | path of the component by 1st Embodiment of this invention. It is a block diagram which shows the system configuration | structure of the components supply apparatus by 1st Embodiment of this invention. It is a top view which shows the vicinity part of the taking-out position of the components of the components supply apparatus by 1st Embodiment of this invention. It is a side view of FIG. It is a front view of the front and back alignment part of the components supply apparatus by 1st Embodiment of this invention. It is a figure explaining the principle which reverses a chip component by the front and back alignment part of the component supply apparatus of 1st Embodiment of this invention. It is explanatory drawing of chip | tip component inversion operation | movement by the front-and-back alignment part of the component supply apparatus of 1st Embodiment of this invention. It is explanatory drawing of chip | tip component inversion operation | movement by the front-and-back alignment part of the component supply apparatus of 2nd Embodiment of this invention.

Hereinafter, a component supply apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.
First, the component supply apparatus according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an overall view showing a state in which the component supply device is attached to the component mounting device, and FIG. 2 is a front view (FIG. 2A), a plan view (FIG. 2B), and a right side view showing the component supply device. (FIG. 2 (c)), left side view (FIG. 2 (d)), FIG. 3 is a front view showing a part supply device with a part cut away, FIG. 4 is an enlarged front view of the main part of FIG. FIG. 6 is an enlarged front view showing an enlarged part passage, FIG. 7 is a block diagram showing the system configuration of the parts supplying apparatus, and FIG. FIG. 9 is a side view of FIG. 8, FIG. 10 is a front view of the front / back alignment portion, FIG. 11 is a diagram for explaining the principle of inverting the chip parts by the front / back alignment portion, and FIG. It is explanatory drawing of the chip component inversion operation | movement by.

  As shown in FIG. 1, reference numeral 1 denotes a component supply device, and this component supply device 1 is attached and fixed to a table 4 of an electronic component mounting device (mounter) 2. The component supply apparatus 1 supplies a chip-type electronic component P (chip component P) such as a capacitor or a register having an outer shape such as a rectangular solid body or a rectangular parallelepiped to the electronic component mounting apparatus 2.

  The electronic component mounting apparatus 2 is provided with a component suction nozzle 6 and a printed circuit board 8. The component suction nozzle 6 picks up and takes out a chip component P supplied from the component supply device 1 at a take-out position. The component P is mounted at a predetermined position on the printed circuit board 8.

  The component supply device 1 according to the present embodiment is a device that supplies the chip components P toward a device arranged on the downstream side in a state where the chip components P are sequentially arranged. As the downstream device, other than the electronic component mounting device 2 It is also applicable to. For example, an electronic component characteristic sorter that sorts good / bad electronic components based on measured electrical characteristics, an external appearance sorter that sorts good / bad electronic components based on captured images, and parts of target packaging You may make it attach to the electronic component packaging apparatus which transfers and inserts in a storage part, another component conveyance apparatus, etc.

Next, as shown in FIGS. 2 and 3, the component supply device 1 includes a platform 10 and a component supply attachment 12. The component supply attachment 12 includes a component storage case 14 that stores chip components P in a stacked state, and a component supply rail that is a component passage that guides the chip components P in the component storage case 14 and aligns them in a row. 16. Further, the component supply attachment 12 is detachably attached to the platform 10 by a fixing means 18.
The component supply attachment 12 is prepared for each type of chip component, and is attached to a common platform 10.

  As shown in FIG. 2B, the component supply rail 16 that is a conveying portion of the component supply attachment 12 is provided with a component supply passage 16 a and a component collection passage 16 b.

3 and 4, the platform 10 is provided with vibration devices 22a and 22b for driving the component supply passage 16a and the component collection passage 16b of the component supply attachment 12, respectively. ing.
The vibration device 22a for the component supply passage 16a includes a base plate 24a, a top plate 26a, a piezoelectric element 28a that is a vibration source attached to the base plate 24a, and vibrations generated by the piezoelectric element 28a. And a leaf spring 30a which is an excitation mechanism for transmission. Here, as described above, the top plate 26a is fixed to the component supply passage 16a of the component supply rail 16 of the component supply attachment 12 by the fixing means 18, and the vibration from the piezoelectric element 28a is applied to the plate spring 30a. Is communicated via Here, the leaf spring 30a is inclined in the right direction in FIG. 4, and when the leaf spring 30a vibrates, the chip component P on the component supply passage 16a is moved in the component supply direction (left direction). To move to.

  Similarly, the vibration exciter 22b for the parts collection passage 16b also has a base plate 24b, a top plate 26b, a piezoelectric element 28b which is a vibration source attached to the base plate 24b, and vibration generated by the piezoelectric element 28b. And a plate spring 30b which is an excitation mechanism for transmitting to the plate 26b. Here, the top plate 26b is also fixed to the component collection passage 16b of the component supply rail 16 of the component supply attachment 12 by the fixing means 18, and the vibration from the piezoelectric element 28b is transmitted via the leaf spring 30b. It has become. Here, the leaf spring 30b is inclined to the left in FIG. 4, and when the leaf spring 30b vibrates, the chip component P on the component collection passage 16b is moved in the component collection direction (right direction). To move to.

  Next, as shown in FIG. 5, the detection piece 32 is attached to the tip side of the top plate 26 a, while the vibration sensor 34 is attached to the detection piece 32 via a minute gap on the base 36 of the platform 10. Is attached. The vibration sensor 34 detects the amplitude and phase of vibration generated in the top plate 26a excited by the piezoelectric element 28a. A similar vibration detection mechanism is also provided on the top plate 26b side.

  Next, as shown in FIG. 6, a chip component P extraction position 38 is provided at the downstream (supply side) end of the component supply passage 16 a of the component supply rail 16 of the component supply attachment 12. The chip component P supplied up to the take-out position 38 is picked up and taken out by the component pick-up nozzle 6 of the electronic component mounting apparatus 2 described above, and then, as shown in FIG. And is mounted on the printed circuit board 8.

Next, as shown in FIG. 3, the platform 10 of the component supply apparatus 1 is further provided with an AC voltage generator 40 and a controller 42.
Here, as shown in FIG. 7, in one embodiment of the present invention, the control unit 42 sends a signal to the AC voltage generation unit 40, and the AC voltage generation unit 40 causes the piezoelectric elements 28 a of the vibration devices 22 a and 22 b to be transmitted. , 28b are driven, the top plate 26a, 26b and the component supply passage 16a and the component collection passage 16b attached to the top plates 26a, 26b are vibrated and vibrated. As described above, in this embodiment, the control unit 42 is connected to the vibration sensor 34 that detects the vibration amplitude of the top plates 26a and 26b, and the piezoelectric element that is a vibration source according to the detected amplitude value. Voltage control is performed so as to generate a predetermined vibration in 28a and 28b.

Next, a mechanism for taking out the chip component P at the take-out position 38 of the component supply apparatus 1 will be described with reference to FIGS.
Above the component supply passage 16a, a chute guide 44 for preventing the chip component P from popping out is provided. Further, at the take-out position 38, a stopper member 46 for receiving the leading chip component P1 is fixedly arranged at the downstream end of the component supply passage 16a.

  The stopper member 46 includes a component receiving portion or a recess 48 serving as a supply position that is open on the component supply passage 16a side and on the upper side. The recess 48 is formed so that the bottom surface thereof is continuous with the component supply passage 16a, and has a depth and a width for accommodating only one leading chip component P1 pushed out from the component supply passage 16a by the subsequent chip component P2. have. As shown in FIG. 9, the chip component P <b> 1 accommodated in the recess 48 is sucked by the component suction nozzle 6 of the electronic component mounting apparatus 2 and is carried out from the recess 48 upward.

In the stopper member 46, the detection sensor 50 is disposed below the bottom wall of the concave portion 48, and the front / back alignment portion 60 is disposed on the downstream side in the transport direction A across the side wall forming the concave portion 48.
The detection sensor 50 is, for example, a photoelectric sensor, and optically detects the bottom surface of the chip component P <b> 1 and outputs a detection signal to the control unit 42. From this detection signal, the control unit 42 determines whether or not the front side surface a of the chip component P1 is positioned on the upper side (or whether the back side surface b is positioned on the lower side), that is, the chip component P1 is facing upward. It is judged whether it is or face down. The control unit 42 and the detection sensor 50 constitute a front / back determination unit. In the present specification, the front surface a of the chip component P means a surface that should face upward in the concave portion 48 that is a component receiving portion, and is therefore different from the practical front surface of the chip component P. There is a case.

  In the present embodiment, the bottom surface of the recess 48 is formed of a transparent or translucent material that can transmit light, and the detection sensor 50 can detect the bottom surface of the chip component P1 through this bottom surface. . Not limited to this, a through hole may be formed in the bottom surface of the recess 48, and the detection sensor 50 may detect the bottom surface of the chip component P1 through the through hole.

  Further, in the present embodiment, the detection sensor 50 is disposed at the lower part of the recess 48, but the present invention is not limited to this, and the detection sensor 50 may be disposed above or obliquely above the recess 48. Further, the detection sensor 50 may be arranged on the component supply passage 16a side so that the front and back of the chip component P1 are detected in advance before the chip component P1 is received in the recess 48. In this case, the detection sensor 50 detects the future chip component P1 in advance at a stage several times before being received in the recess 48.

  As shown in FIGS. 9 and 10, the front / back alignment unit 60 is a permanent magnet 62 that is a magnetic line of force generating means, a disk-like support member 63 that supports the permanent magnet 62, and a moving means that rotates the support member 63. And a rotating unit 64. The front / back alignment portion 60 is positioned on the conveyance direction A side so as to face the chip component P1 disposed in the recess 48 and the length direction (conveyance direction A), width direction, and height direction of the chip component P1. ing.

  As shown in FIG. 10, the permanent magnet 62 is normally supported by the support member 63 in a state where the N pole and the S pole are arranged in the horizontal direction. The permanent magnet 62 is arranged so that the center position thereof corresponds to the rotation center O of the support member 63. The rotating unit 64 includes a motor, a speed reduction mechanism, and the like, and rotates the support member 63 by 180 degrees in a predetermined time by a single drive signal from the control unit 42. This rotation operation may be continuous rotation or stepwise stepwise rotation.

Next, based on FIG. 11, the principle by which the front / back alignment unit 60 inverts the front / back of the chip component P1 will be described.
The chip component P of this embodiment is a rectangular body (length L, width W, height H) having front and back surfaces, and includes a portion formed of a magnetic material. The chip component P is configured to include a magnetic material. When the chip component P is disposed in the magnetic force line B, the chip component P has a characteristic of being aligned along the extending direction of the magnetic force line B in a predetermined posture by receiving a rotational moment due to the magnetic force. Have. In this example, it is assumed that the chip components P are aligned so that the width direction (W) of the magnetic force lines B coincides with the direction of the magnetic force lines B.

  FIG. 11A shows a situation where the chip component P is arranged on a horizontal plane so that the back side surface b faces upward. Further, a permanent magnet 70 is arranged in front of the chip component P in the length direction so as to face the front surface of the chip component P. Therefore, the central portion of the permanent magnet 70 in the longitudinal direction is located in front of the chip component P in the length direction. The permanent magnet 70 is oriented in the horizontal direction so that its longitudinal direction is along the width direction of the chip part P, and the N pole is located on the left side and the S pole is located on the right side. In this state, the magnetic flux from the N pole to the S pole of the permanent magnet 70 passes through the chip part P along the width direction.

  From this state, as shown in FIGS. 11B and 11C, the permanent magnet 70 is rotated in the counterclockwise direction D around the virtual rotation axis C along the length direction of the chip part P. The rotation axis C crosses the longitudinal center of the permanent magnet 70 in the short direction and also crosses the widthwise center of the chip component P in the length direction. FIGS. 11B and 11C show a state in which the permanent magnet 70 is rotated 90 degrees and 180 degrees in the counterclockwise direction D, respectively.

  As described above, when the permanent magnet 70 is rotated, the direction of the magnetic lines of force B at the position of the chip component P is rotated along with the rotation. For this reason, the chip component P receives a rotational moment due to a magnetic interaction with the magnetic field lines B so that the width direction thereof coincides with the direction of the magnetic field lines B. Thereby, the chip component P rotates so that the attitude | position with the permanent magnet 70 may synchronize.

  When the permanent magnet 70 is rotated up to 180 degrees, the magnetic force lines B at the position of the chip part P are also rotated 180 degrees along with this rotation, so that the chip part P is rotated 180 degrees. Thereby, the front and back of the chip component P are reversed so that the front side surface a faces upward.

  In the above description, the case where the chip component P has the characteristic that the width direction of the chip component P is in the direction of the magnetic force line B in the magnetic force line B has been described. In the case where the vertical direction has the characteristic that the direction of the magnetic field line B is along, the permanent line is generated so that the magnetic field line B along the length direction or the height direction is generated at the initial position corresponding to FIG. A magnet 70 may be disposed. Similarly, the chip part P can be reversed by rotating the permanent magnet 70 180 degrees from this state. Further, when the chip component P has a characteristic that takes a posture that makes a predetermined angle with respect to the direction of the magnetic force line B in the magnetic force line B, the permanent magnet 70 can be arranged and rotated in accordance with the posture direction. That's fine.

  Next, the operation of the component supply apparatus 1 according to the above-described embodiment will be described. The chip components P stored in the component storage case 14 in a stacked state fall on the component supply passage 16a, and thereafter, vibration is applied to the component supply passage 16a by the vibration device 22a, and the component supply passage 16a. , The chip components P are aligned in a line and moved to the take-out position 38 at the downstream end of the component supply passage 16a. The excessive chip component P on the component supply passage 16a moves to the component collection passage 16b, and vibration is applied to the component collection passage 16b by the vibration device 22b, and the component collection passage 16b vibrates. As a result, the chip part P is returned to the upstream side.

  Next, as schematically shown in FIG. 12A, when the leading chip component P1 moves forward in the conveying direction A and reaches the recess 48 at the take-out position 38 of the component supply apparatus 1, the detection sensor 50 The detection signal is sent to the control unit 42, and the control unit 42 determines whether or not the front side surface a of the chip component P1 is facing upward based on the detection signal.

If it is determined that the front side surface a of the chip component P1 is facing upward, the control unit 42 does not output a drive signal to the front / back alignment unit 60. For this reason, the front / back alignment unit 60 does not operate, and the chip part P1 is sucked by the part suction nozzle 6 without being inverted, and is carried outside.
On the other hand, if it is determined that the front side surface a of the chip component P1 is not facing upward, the control unit 42 outputs a drive signal to the front / back alignment unit 60. As a result, as shown in FIGS. 12B and 12C, in the front / back alignment unit 60, the rotation unit 64 operates to rotate the support member 63 by 180 degrees. As a result, the permanent magnet 62 rotates from the horizontal state shown in FIG. 3A to the horizontal state shown in FIG. 1C through the upright state shown in FIG.

  As described above with reference to FIG. 11, the permanent magnet 62 rotates 180 degrees, so that the magnetic field lines B passing through the chip component P1 rotate 180 degrees. The chip component P1 is inverted so that a faces upward. The component suction nozzle 6 sucks the inverted chip component P1 and carries it out.

  As described above, in the component supply apparatus 1 according to the present embodiment, when the chip component P1 including the magnetic material is conveyed to the recess 48 in an inverted state, the front / back alignment unit 60 passes through the chip component P1. By rotating the direction of the line of magnetic force B to be rotated 180 degrees, the chip component P is reversed by the rotational moment of the magnetic force. Thereby, it can hand over to the following process in the state which turned the correct surface (front side surface a) upward.

  In the present embodiment, since the front / back alignment unit 60 uses magnetic force, the chip component P can be reversed in the correct direction without mechanical contact with the chip component P1. Further, since the front / back alignment unit 60 is a mechanism for reversing the magnetic lines of force B at the position of the recess 48, it is not necessary to have a shape for reversing the component supply rail 16, and the configuration of the entire apparatus is simplified and reduced in size. In addition, since the control process is simple, the cost of the apparatus can be reduced.

  In the present embodiment, the chip component P is structured to receive a rotational moment so that the width direction of the magnetic force line B coincides with the direction of the magnetic force line B. Is arranged. However, the present invention is not limited to this, and when the chip component P has a structure that receives a rotational moment so that the length direction of the magnetic force line B matches the direction of the magnetic force line B, for example, the front / back alignment unit 60 is moved in the transport direction A. However, it may be arranged on either the left or right side of the recess 48.

  Similarly, when the chip component P has a structure that receives a rotational moment so that the height direction of the magnetic force line B coincides with the direction of the magnetic force line B, the front / back alignment part 60 is disposed downstream of the recessed part 48 in the transport direction. can do. However, in this case, the front / back alignment unit 60 is arranged so that the magnetic lines B pass through the chip component P1 in the vertical direction at the initial position corresponding to FIG. The front / back alignment unit 60 may be arranged so that the magnetic force lines B are output in such a direction that the chip component P1 transported to the initial position receives a rotational moment due to the magnetic force at the initial position and the posture is not displaced. .

Next, a component supply apparatus according to a second embodiment of the present invention will be described with reference to FIG. Since the component supply apparatus of this embodiment is different from the above embodiment only in the front and back alignment unit, only the front and back alignment unit will be described.
In the above embodiment, the direction of the magnetic force line B passing through the chip component P1 is reversed by rotating the permanent magnet 62 itself that is the magnetic force line generating means. However, in the embodiment described below, a plurality of magnetic force line generating means is provided. Similarly, these are sequentially switched and operated to similarly reverse or rotate the direction of the magnetic lines of force B passing through the chip component P1.

  As schematically shown in FIG. 13, in this embodiment, the front / back alignment portion 160 is centered on the chip component P <b> 1 disposed in the concave portion 48, with respect to the traveling direction A in the direction of the drawing sheet. A plurality of electromagnets 162a, 162b, 162c, 162d arranged in a radial and discrete manner are provided. The electromagnets 162a and 162d are arranged symmetrically with respect to each other with the recess 48 interposed therebetween. The electromagnets 162a to 162d are arranged so that the central angle of the electromagnets 162a to 162d is about 45 degrees with respect to the concave portion 48, and the magnetic force line output direction faces the chip component P1 arranged in the concave portion 48. In this example, four electromagnets are used. However, the present invention is not limited to this, and a plurality of electromagnets may be used.

  Each of the electromagnets 162a to 162d has a configuration in which a coil is wound around an iron core made of a magnetic material. When the electromagnet 162a to 162d is activated by receiving a driving current from the control unit 42, the magnetic field lines B are output in a predetermined magnetic field line output direction. It has become. The electromagnets 162a to 162d are oriented so that the magnetic field lines B to be output pass through the chip component P1 disposed in the recess 48.

Next, the operation of the front / back alignment unit 160 of this embodiment will be described.
As shown in FIG. 13A, when the chip component P1 is arranged in the recess 48, a detection signal is sent from the detection sensor 50 to the control unit 42, and the control unit 42 detects the chip component based on the detection signal. It is determined whether the front side surface a of P1 is facing upward.

If it is determined that the front side surface a of the chip component P1 is facing upward, the control unit 42 does not output a drive signal to the front / back alignment unit 160, so the front side surface a is not picked up and the chip side component P1 is reversed. It is adsorbed by the nozzle 6 and carried outside.
On the other hand, when it is determined that the front side surface a of the chip component P1 is not facing upward, the control unit 42 serving as a switching unit outputs a drive signal to the front / back alignment unit 160. Thereby, as shown to FIG. 13 (A), the control part 42 makes only the electromagnet 162a an operation state first. Thereby, the magnetic force line B is output from the electromagnet 162a so that the width direction of the chip component P1 may follow.

  Subsequently, the control unit 42 deactivates the electromagnet 162a and activates only the electromagnet 162b (see FIG. 13B). As a result, the lines of magnetic force B are output from the electromagnet 162b so as to cross the chip component P1 obliquely upward. The chip component P <b> 1 receives the magnetic force line B traveling in the oblique direction, so that a rotational moment is applied by the magnetic force, and the chip part P <b> 1 is displaced along the width direction of the magnetic force line B. Further, similarly, the control unit 42 sequentially activates only the electromagnets 162c and 162d in this order (see FIGS. 13C and 13D).

  Thereby, the direction of the magnetic force line B passing through the chip part P1 is rotated by 180 degrees stepwise, and accordingly, the chip part P1 is reversed so that the front side surface a faces upward. The component suction nozzle 6 sucks the inverted chip component P1 and carries it out.

  In the present embodiment, the front / back alignment unit 160 is a mechanism that reverses the magnetic field lines B at the positions of the recesses 48 by sequentially setting the electromagnets 162a-162d, which are a plurality of magnetic force generation units, to an operating state. Compared to the configuration and control, it can be realized at low cost.

  In the present embodiment, the electromagnets 162a to 162d are configured so that the direction of the magnetic lines of force B is rotated by 180 degrees as a whole. However, the present invention is not limited to this, and the chip component P1 is inverted by displacement of the direction of the magnetic lines of force B. If possible, the rotation may be 180 degrees or more or 180 degrees or less.

  In the above embodiment, the operation of the plurality of electromagnets is switched to reverse the direction of the magnetic force line B at the position of the recess 48 in a stepwise manner. However, the present invention is not limited to this, and the magnetic force line B is output toward the recess 48. You may comprise a magnetism generation means (an electromagnet, a permanent magnet, etc.) so that the direction of the magnetic force line B may be reversed continuously by rotating the recess 48 around the rotation center.

DESCRIPTION OF SYMBOLS 1 Component supply apparatus 2 Electronic component mounting apparatus 6 Component adsorption nozzle 10 Platform 14 Component storage case 16 Component supply rail 16a Component supply path 16b Component collection path 38 Extraction position 42 Control section 48 Recess 50 Detection sensor 60 Front / back alignment section 70 Permanent magnet 160 Front / back alignment part A Transport direction B Magnetic field lines P, P1, P2 Chip-type electronic components

Claims (4)

A transport unit for transporting parts to a supply position;
A front / back determination unit for determining the front / back of the component at the supply position;
When the front / back determination unit determines that the component is facing down, a front / back alignment unit that aligns the component in front / back, a component supply device comprising:
The component includes a magnetic material,
The component supply apparatus according to claim 1, wherein the front / back alignment unit reverses the component from the reverse side to the front side by rotating the direction of the magnetic force line by a predetermined angle while directing the magnetic line of force to the component.   The component supply apparatus according to claim 1, wherein the front / back alignment unit rotates the direction of the magnetic lines of force toward the component by a predetermined angle continuously or stepwise. The front and back alignment part is
Magnetic force line generating means for generating magnetic force lines toward the component;
Moving means for moving the magnetic force line generating means so that the direction of the magnetic force lines rotates;
The component supply apparatus according to claim 1, further comprising: The front and back alignment part is
A plurality of magnetic force lines generating means arranged at different positions and positioned so as to generate magnetic force lines toward the supply position;
Switching means for sequentially switching and operating the plurality of magnetic force line generating means so as to rotate the direction of the magnetic force lines directed to the component;
The component supply apparatus according to claim 1, further comprising:

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