JP2011066025A - Package for optical semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the reliability of a package for optical semiconductor element, and to improve the leakage resistance at manufacturing. <P>SOLUTION: The package for optical semiconductor element includes an insulating base portion 100, a pair of lead frames 101 provided on the base portion 100, a reflector portion 102 provided on the pair of lead frames 101 and containing ceramic, and an insulating organic adhesive sealing portion 103, which bonds the base portion 100 and the pair of lead frames 101 and the reflector portion 102. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a package for an optical semiconductor element for mounting an optical semiconductor element used for a general lighting fixture, a backlight light source of a liquid crystal display, a headlight, an optical sensor, and the like.

  In recent years, as the use of light-emitting devices equipped with optical semiconductor elements is rapidly expanding, there is an increasing demand for higher output and longer life of light-emitting devices. The package for an optical semiconductor element is used as a light emitting device by mounting an optical semiconductor element such as an LED on the bottom surface of a recess at the top of the package, and is electrically and mechanically connected to the mounting substrate by an electrode exposed to the outside from the package. Connection can be made. As a package for an optical semiconductor element, a resin package in which a metal lead frame member for supplying power to the optical semiconductor element is integrally molded with a resin has been proposed (for example, see Patent Document 1).

JP 2007-335762 A

  However, in a resin package, the thermal conductivity of the resin is smaller than that of a metal lead frame and the like, so the temperature is likely to rise. In addition, the resin portion is affected by the influence of ultraviolet rays such as light from the optical semiconductor element and sunlight. In some cases, the yellowing deteriorates and the reflectance decreases, and the lifetime of the light emitting device may decrease.

  In addition, when manufacturing light-emitting devices using packages, the process of bonding and mounting optical semiconductor elements with die attach materials, sealing the resin for the purpose of protecting elements and converting the wavelength of light, etc. In the process of mounting, the process of mounting the package on a heat dissipation board, etc., the resin part was exposed to a high temperature atmosphere, and the resin part was deteriorated by yellowing in the same manner as described above.

  Furthermore, when manufacturing, due to the above temperature change, the adhesion between the mold resin and the metal is reduced, and the sealing resin may leak.

  In view of the above problems, an object of the present invention is to provide an optical semiconductor device package that improves reliability and improves liquid leakage resistance during manufacturing.

  In order to solve the above problems, the present invention provides an insulating base member, a pair of lead frames provided on the base member, a reflector member including ceramic provided on the pair of lead frames, and a base member. And a pair of lead frames and a reflector member, and an organic-based adhesive sealing member having an insulating property.

ADVANTAGE OF THE INVENTION According to this invention, the reliability of the package for optical semiconductor elements can be improved, and the liquid leakage resistance at the time of manufacture can be improved.

Schematic of a single package for an optical semiconductor device in Example 1 of the present invention The top view of the package for optical semiconductor elements in Example 1 of this invention Sectional schematic diagram of the package for optical semiconductor elements in Example 1 of the present invention 1 is a collective diagram of a package for an optical semiconductor device in Example 1 of the present invention. Schematic of a single package for an optical semiconductor device in Example 2 of the present invention Overview of optical semiconductor device package with optical semiconductor device

  According to a first aspect of the present invention, an insulating base member, a pair of lead frames provided on the base member, a reflector member including a ceramic provided on the pair of lead frames, and a base member And a pair of lead frames and a reflector member, and an organic-based adhesive sealing member having an insulating property.

  Thereby, the reliability of the package for semiconductor elements can be improved, and the liquid leakage resistance at the time of manufacture can be improved.

  The invention according to claim 2 of the present invention is the optical semiconductor device package according to claim 1, wherein the elastic modulus of the adhesive sealing member is smaller than both of the elastic modulus of the lead frame and the reflector member. Features. Thereby, stress generated by thermal shock or the like can be relieved, and the reliability of adhesion fixing and prevention of liquid leakage can be greatly improved.

  Invention of Claim 3 of this invention is a package for optical semiconductor elements of Claim 1, Comprising: The adhesive agent used for an adhesive sealing member is any one of an epoxy type, a silicone type, and a polyimide type | system | group. It is characterized by including two or more. As a result, it is possible to bond across the electrodes of the lead frame, simplifying the joining process and improving the reliability of the product.

  The package for a semiconductor element according to claim 4 of the present invention is characterized in that the outer dimension of the base member is larger or smaller than the outer dimension of the reflector member. As a result, in the process of joining two members each of the base member and the reflector member, it is greatly caused that a combination failure due to an influence of an external accuracy error such as a burr generated at the time of molding of each member or a misalignment failure at the time of joining occurs. Can be reduced.

  Hereinafter, an optical semiconductor device package of the present invention will be described with reference to the drawings. In addition, although the Example described below is a suitable specific example of this invention and limitation of technically favorable conditions is described, the scope of the present invention limits this invention especially in the following description. Unless otherwise stated, it is not limited to these conditions.

Example 1
FIG. 1 is a schematic diagram of a single package for an optical semiconductor device in Embodiment 1 of the present invention, FIG. 2 is a top view of the package for optical semiconductor device in Embodiment 1 of the present invention, and FIG. 3 is an embodiment of the present invention. 4 is a schematic cross-sectional view of the package for optical semiconductor elements in FIG. 1, and FIG. 4 is an aggregate view of the package for optical semiconductor elements in Embodiment 1 of the present invention.

  As shown in FIG. 1, the package for an optical semiconductor device in Example 1 of the present invention is provided on a base member 100, a pair of lead frames 101 provided on the base member 100, and a pair of lead frames 101. Adhesive seal that adheres and fixes the reflector member 102 including ceramic and having a through-hole, the base member 100, the pair of lead frames 101, and the reflector member 102, and prevents liquid leakage of the resin sealed in the reflector member The member 103 is configured.

  In the top view of FIG. 2, the through hole 104 of the reflector member 102 is shown. The package of the present invention is used as a light emitting device by mounting a semiconductor element that emits light on a lead frame 101 near the center of the upper surface. The entire surface of the reflector, which is the concave portion of the upper part of the package including the wall surface of the through hole, is reflected by the light of the optical semiconductor element that is the light source, thereby providing a large and stable supply of light directivity control and light extraction efficiency. Has function.

  In this embodiment, in FIG. 2, the size of the reflector member 102 is a square of 4 mm × 4 mm, and the distance from one terminal of the lead frame 101 to the other terminal is 6.5 mm. The height was 1.3 mm.

  In the schematic diagram of the cross section of FIG. 3, three bottom surfaces 101a of a pair of lead frames are portions for electrical, mechanical, and thermal connection with the mounting substrate via a conductive material such as solder. Function as. The three bottom surfaces 101a of the lead frame need to be connected to the mounting substrate with high accuracy and stability, and thus have a structure on the same plane as the base member 100 or slightly projecting.

  For example, in this embodiment, the bottom surface 101a has a structure protruding 0.1 mm from the base member.

  Further, the lead frame 101 has a function of efficiently diffusing heat in the surface direction and the thickness direction, and further conducting the heat to a mounting substrate below. In particular, the thick portion 101b of the lead frame greatly contributes to the heat conduction to the lower mounting substrate, and the thickness of the thick portion 101b is further reduced, so that the distance between the optical semiconductor element that is a heat source and the mounting substrate is reduced. The thermal resistance is reduced because of shrinkage, and the amount of heat transfer can be increased by making it wider.

  As shown in FIG. 4, the plurality of packages are densely assembled as an aggregate via the lead frame 101 so that they can be efficiently produced in each assembly process.

  Here, how to use the package for the optical semiconductor element will be described in order to deepen the understanding of the functions required for the package. Resin adhesive is widely used as a die attach material in the process of mounting an optical semiconductor element on a package, but since it is the material closest to the heat source, the use of a metal adhesive with excellent thermal conductivity It has spread. For example, when die-bonding using Au / Sn paste (80 wt% / 20 wt%, melting point of about 280 ° C.) or Sn / Ge alloy (98 wt% / 2 wt%, melting point of 360 ° C.), an atmosphere of about 300 ° C. to 380 ° C. Will be held for a few minutes under. Next, after wiring using wire bonding, etc., the phosphor and sealing resin for protecting the elements and wiring, or converting the wavelength of light from blue to white, etc. are filled in the recesses on the top of the package and sealed To do. Since this sealing resin is required to be filled into a narrow gap, a low-viscosity organic resin (for example, silicone resin) is often used.

  For this reason, as a package, it is necessary to prevent the liquid resin that has flowed into the concave portion at the top from leaking out from the side surface or the bottom surface of the package. Further, for the purpose of curing the sealing resin, there is a step of holding at a temperature of about 200 ° C., for example. Further, when a package is mounted on a mounting substrate or the like, for example, solder having a melting point of about 220 ° C. to 260 ° C. is often used, and exposed to a temperature several tens of degrees C. higher than the melting point for several minutes. Also for use in the general market, when a high-output type optical semiconductor element continuously emits light, the ambient temperature of the optical semiconductor element may rapidly increase to about 180 ° C.

  Of course, as a basic function as a light emitting device, the light extraction efficiency is high by using a highly reflective member, and the light extraction efficiency is difficult to decrease due to member deterioration due to heat, ultraviolet rays, etc. due to the use environment. is important.

  In the present invention, a resin that improves and improves heat dissipation and light extraction efficiency and maintains high reliability (heat resistance, moisture resistance, UV resistance, etc.) and seals against temperature and thermal shock as described above. The material and structure are resistant to liquid leakage.

  Hereinafter, the function and material of each member will be described in detail. The base member 100 mainly fixes a pair of lead frames 101 to ensure electrical insulation and mechanical strength, and reflects light of the optical semiconductor element that leaks from the electrodes of the pair of lead frames toward the bottom surface. It has the function to do.

  The reflector member 102 mainly controls the directivity of light and has a role of efficiently transferring heat generated from the optical semiconductor element upward. The shape of the through hole of the reflector member 102 ensures the thickness of the thinnest part between the inner wall surface and the outer wall surface by straightening four points of the perfect circle in order to reduce the size of the entire package and maintain the strength of the reflector member 102. However, it may be a perfect circle or an ellipse while ensuring the strength of the reflector member, or the shape of the mortar with a gradient on the inner wall surface to change the directivity of light. You can also.

  The base member 100 and the reflector member 102 are made of alumina ceramic that is inexpensive, excellent in reflectivity, thermal conductivity, and emissivity, and has very little deterioration due to heat and light. Ceramics having insulating properties and high thermal conductivity such as oxides, oxynitrides, and carbides can be used.

  In addition, it is possible to maintain the connection fixing strength by using a metal that is oxidized with heat or chemicals to form an insulating film on the surface, or a metal surface that is formed with an insulating film such as aluminum oxide or titanium oxide by thermal spraying. However, it is possible to improve heat dissipation.

  Furthermore, by forming a film of ceramic or the like having a higher emissivity than the original material on the metal surface, the heat dissipation can be improved by improving the emissivity.

  In the present invention, the base member 100 and the reflector member 102 can be made of different materials by having different structures. For example, the base member 100 can be made of aluminum nitride or insulating surface having excellent thermal conductivity. By using a metal member having a layer and using an alumina ceramic having excellent reflectivity for the reflector member 102, it is possible to improve the light extraction efficiency and the heat dissipation.

  In the lead frame 101, various elements are bonded and mounted with a die attach material on the bottom surface of the through hole of the reflector member 102 forming the concave portion on the upper part of the package, wiring is formed by wire bonding, and the package side surface is exposed to the outside. The pair of terminal portions has an electrical, mechanical, and thermal connection with the heat dissipation mounting substrate. Moreover, it is necessary to have sufficient strength to maintain the shape in the transporting process and delivery form (see FIG. 4).

  As the material of the lead frame 101, a metal material such as oxygen-free copper, oxygen-free copper, a copper alloy, or an Fe-based material (for example, Fe-42% Ni) can be used. In particular, it is desirable to use materials with excellent electrical conductivity to suppress heat generation due to wiring resistance, and excellent thermal conductivity to improve heat diffusion. A copper alloy as the main material is suitable, and in this example, a copper alloy having oxygen-free copper as the main material was used.

  In addition, the surface of the lead frame 101 has high light reflectance, excellent wire bonding, and good wettability with a die bond material for fixing an optical semiconductor element and solder for fixing to a mounting substrate. Silver or gold that is difficult to oxidize is desirable, and can be formed by plating or the like.

  In the present embodiment, as shown in FIG. 4, an assembly of a plurality of packages is formed via the lead frame 101, so that the electrolytic plating is more excellent in chemical stability and cost than the electroless plating. Using this, Ag plating was performed. In addition, in this embodiment, the Ag plating thickness is set to 2 μm or more in order to prevent the underlying metal from diffusing to the plating surface and reducing functions such as solder wettability. Further, by improving the radiation rate by forming an oxide film with a chemical on the surface of a part of the lead frame 101 or by forming a ceramic layer by spraying or the like, the heat dissipation of the entire package is improved. be able to.

  The adhesive sealing member 103 is bonded and fixed to the base member 100, the lead frame 101, and the reflector member 102 to ensure the mechanical strength of the entire package, and is poured into a recess in the upper part of the package in order to complete the package as a light emitting device. It serves as a sealing function to prevent resin leakage.

  In other words, the adhesive sealing member 103 is not suitable as an adhesive that only maintains mechanical connection strength by, for example, point contact, and needs a function that does not leak a liquid having low viscosity or surface tension from the adhesive interface by surface adhesion. Adhesive sealing material with high adhesive strength and excellent surface adhesion was used.

  Further, when the package is further reduced in size and thickness, it is difficult to control the amount and shape of the adhesive sealing member 103 in the joining process with the base member 100, the lead frame 101, and the reflector member 102. If the adhesive sealing member 103 leaks into the reflector or the outer wall of the package, there is a possibility that the wire bonding property on the surface of the lead frame is deteriorated or the appearance is deteriorated. In addition, depending on the type of the adhesive sealing member 103, there is a material with high adhesive strength but low reflectivity. When the adhesive seal member 103 protrudes greatly into the reflector, the reflectivity decreases, and the light extraction efficiency deteriorates. obtain.

  Therefore, the adhesive sealing material 103 is first formed into a sheet having a uniform thickness of 10 μm to 40 μm and then finely processed with a laser or a mold to form the adhesive sealing member 103 with a quantitative and highly accurate shape. And used for joining each member. Furthermore, by making the size of the sheet-like adhesive sealing member 103 smaller than the adhesive surface of each member, it was possible to prevent the adhesive sealing member 103 from leaking into the reflector or the package outer wall.

  Similarly, the adhesive sealing material can be applied using transfer or a dispenser within a range in which the adhesive sealing member 103 can be controlled quantitatively and with high accuracy.

  By controlling the shape of the adhesive sealing member 103 as described above, the inside of the reflector can be formed by the base member 100, the lead frame 101, and the reflector member 102 having high reflectivity and high reliability. The light extraction efficiency could be improved.

  At this time, since the base member 100 and the reflector member 102 need to be bonded to each other across the pair of electrodes of the lead frame 101, the bonding process can be simplified if the adhesive sealing member has high electrical insulation. In addition, the reliability of the product can be improved.

  Further, as described above, the bonding strength and the sealing function should not be impaired even when exposed to a high temperature during production process and product use.

  Furthermore, it is necessary to withstand the stress generated by the difference in thermal expansion coefficient between the base member 100, the lead frame 101, and the reflector member 102. This is a particularly important function because the stress applied to the bonded sealing member increases as the adhesion area increases.

  As a result of various investigations as an adhesive sealing member that satisfies these functions, it is an organic adhesive having insulating properties and heat resistance, which is more than a metal lead frame 101 and a reflector member 102 containing ceramic. By using a material with an extremely small elastic coefficient, it is possible to relieve stress caused by external vibration and shock, or thermal shock applied to the package due to the difference in thermal expansion coefficient of each member, It has been found that interfacial peeling which causes liquid leakage can be prevented.

  For example, in this embodiment, the elastic modulus of the lead frame 101 made of a copper alloy is 120 GPa, and the elastic modulus of the base member 100 and the reflector member 102 made of alumina ceramic is about 300 GPa. By using a polyimide organic adhesive having an elastic modulus of 1.3 GPa, it was possible to obtain a package having excellent adhesive strength and liquid leakage resistance even after the package was left at a high temperature of 400 ° C. for several minutes. Here, when the elastic modulus of the adhesive sealing member is too small, the mechanical strength cannot be maintained, so the range of 0.1 to 2.0 GPa is preferable. In addition, as the material of the adhesive sealing member 103, an epoxy type or a silicone type can also be used. These materials may be used alone or in combination.

  Further, in order to ensure the adhesive strength and the sealing performance for preventing liquid leakage, the base member 100, the lead frame 101, and the reflector member 102 may be joined in a plurality of steps. For example, after fixing the shape of each member completely by thermocompression bonding using the adhesive sealing member 103 having particularly excellent adhesive strength, it is possible to prevent liquid leakage using a dispenser or the like so as to fill the gap between the members. The excellent adhesive sealing member 103 can be reliably sealed by making line or surface contact.

  Furthermore, the thickness of the bonded sealing material after bonding is preferably 100 μm or less. Optimally, it should be 20 μm or less, and in this example, it was adjusted in the range of 5 to 20 μm. If it is thicker than 100 μm, the light extraction efficiency from the optical semiconductor element as a package may deteriorate. On the other hand, when the thickness is extremely thin, the stress relaxation function is lowered, and the bonding interface may be peeled off due to thermal shock or the like.

  As described above, in the present invention, each surface of the base member 100, the lead frame 101, and the reflector member 102 related to the reflectivity in the reflector has a high reflectivity, and further, deterioration due to heat or ultraviolet rays such as metal or ceramic is caused. By using as much a proportion of a material with a small amount of heat conductivity as possible, it is possible to obtain an optical semiconductor element package with high heat dissipation, high reflection, and high reliability. In addition, by using the above-described adhesive sealing member, it is possible to maintain the adhesive strength at the interface between the joining members, and to relieve stress, external vibration, and impact caused by the difference in thermal expansion coefficient of each material. In addition, it is possible to prevent a defect in which liquid leakage of the sealing resin occurs.

(Example 2)
A second embodiment of the present invention will be described below with reference to the drawings. The second embodiment is characterized in that the outer dimension of the base member is larger or smaller than the outer dimension of the reflector member, and the same part as the first embodiment uses the first embodiment.

  FIG. 5A shows an example when the outer dimension of the base member 100 is smaller than the outer dimension of the reflector member 102. As shown in the cross-sectional view of FIG. 5B, the outer shape is determined only by the molding accuracy of the reflector member 102. In the process of joining the base member 100, the lead frame 101, and the reflector member 102, many defects may occur due to the influence of external accuracy errors such as burrs that occur during molding of the respective members. By designing the outer dimension of the base member to be larger or smaller than the outer dimension of the reflector member, it is possible to significantly reduce the occurrence of poor combination and misalignment at the time of joining.

  FIG. 6 shows an example of a usage pattern of the above-described package for an optical semiconductor element. FIG. 6 is an overview of an optical semiconductor element package on which an optical semiconductor element is mounted.

  As shown in FIG. 6, an optical semiconductor element 105 and a protective element 106 are mounted on a lead frame 101 by die bonding using a high thermal conductive adhesive resin or a metal adhesive, and power is supplied by wire bonding 107 such as Au or Al. To do.

  In addition, a sealing resin 108 is injected from the reflector member 102 for the purpose of protecting the optical semiconductor element and the bonding wire from dust, moisture, and impact from the outside, and converting the wavelength of the light, thereby sealing the inside of the reflector member 102. To do. In a process for configuring a usage pattern of a light emitting device package, a metal-based adhesive having a thermal conductivity superior to that of a resin is used as a die bond material. For example, a Sn / Ge alloy (98 wt%) is used. / 2 wt%, melting point 360 ° C.), the bonding temperature is maintained at 380 ° C. for several minutes. Further, as the sealing resin 108, an epoxy resin, a silicon resin, or the like is used.

  Further, as the heat treatment of the sealing resin 108 thereafter, for example, there is a process such as 200 ° C. for 2 hours.

  By making as described above, the package for the optical semiconductor element of this embodiment can be used as a package of a light emitting device.

  The package for optical semiconductor elements of the present invention is useful for use as a long-life light-emitting device having excellent heat dissipation, light extraction efficiency, and reliability, and having liquid leakage resistance of the sealing resin.

DESCRIPTION OF SYMBOLS 100 Base member 101 Lead frame 101a Bottom surface 101b Thick part 102 Reflector member 103 Adhesive sealing member 104 Through hole of reflector member

In order to solve the above problems, the present invention includes an insulating lead frame one pair, and a reflector member comprising a ceramic in contact with on the pair of lead frames, and said reflector member and said pair of lead frames A package for an optical semiconductor element , wherein the elastic modulus of the adhesive sealing member is smaller than both of the elastic modulus of the lead frame and the reflector member. is there.

According to a first aspect of the present invention, an insulating lead frame one pair, and a reflector member comprising a ceramic in contact with on the pair of lead frames, and said reflector member and said pair of lead frames A package for an optical semiconductor element , wherein the elastic modulus of the adhesive sealing member is smaller than both of the elastic modulus of the lead frame and the reflector member. is there.

Thereby, the reliability of the package for semiconductor elements can be improved, and the liquid leakage resistance at the time of manufacture can be improved. In addition, stress generated by thermal shock or the like can be relaxed, and the reliability of adhesion fixing and liquid leakage prevention can be greatly improved.

Invention of Claim 2 of this invention is a package for optical semiconductor elements of Claim 1 , Comprising: The elastic modulus of the said adhesive sealing member is in the range of 0.1-2.0 GPa. Features. As a result, the stress generated by the thermal shock applied to the package due to external vibration and impact or the difference in thermal expansion coefficient of each member can be relieved, and interface peeling that causes a decrease in bonding strength and liquid leakage can be achieved. Can be prevented.

A third aspect of the present invention is the optical semiconductor device package according to the first aspect, wherein the adhesive sealing member has a thickness in the range of 5 to 20 μm . Thereby, the thickness of the adhesive sealing member can be optimized. That is, if it is too thick, the light extraction efficiency from the optical semiconductor element as a package may deteriorate. On the other hand, when the thickness is extremely thin, the stress relaxation function is lowered, and the bonding interface may be peeled off due to thermal shock or the like.

According to a fourth aspect of the present invention, there is provided a base member including a ceramic, a pair of lead frames in contact with the base member, and a reflector member including the ceramic provided on the pair of lead frames. The pair of lead members are sandwiched between surfaces of the base member and the reflector member facing each other, and a part of the pair of lead members protrudes from opposite side surfaces of the base member and the reflector member. The pair of lead frames and the reflector member are joined by an organic adhesive sealing member having an insulating property, and the elastic modulus of the adhesive sealing member is determined by either the elastic modulus of the lead frame or the reflector member. It is a package for optical semiconductor elements characterized by being small. Thereby, the reliability of the package for semiconductor elements can be improved, and the liquid leakage resistance at the time of manufacture can be improved. In addition, stress generated by thermal shock or the like can be relaxed, and the reliability of adhesion fixing and liquid leakage prevention can be greatly improved.

In order to solve the above-described problems, the present invention includes a pair of lead frames and a reflector member including a ceramic that contacts the pair of lead frames, and the pair of lead frames and the reflector member face each other. The surfaces are joined by an organic adhesive sealing member having an insulating property, and the elastic coefficient of the adhesive sealing member is smaller than both of the elastic modulus of the lead frame and the reflector member This is a device package.

The invention according to claim 1 of the present invention includes a pair of lead frames and a reflector member including a ceramic that contacts the pair of lead frames, and the pair of lead frames and the reflector member face each other. The surfaces are joined by an organic adhesive sealing member having an insulating property, and the elastic coefficient of the adhesive sealing member is smaller than both of the elastic modulus of the lead frame and the reflector member This is a device package.

According to a fourth aspect of the present invention, there is provided a base member including a ceramic, a pair of lead frames in contact with the base member, and a reflector member including the ceramic provided on the pair of lead frames. The pair of lead members are sandwiched between surfaces of the base member and the reflector member facing each other, and a part of the pair of lead members protrudes from opposite side surfaces of the base member and the reflector member. The surfaces of the pair of lead frames and the reflector member facing each other are joined by an organic adhesive sealing member having an insulating property, and the elastic modulus of the adhesive sealing member is that of the lead frame and the reflector member. An optical semiconductor device package characterized by being smaller than either of the elastic coefficients. Thereby, the reliability of the package for semiconductor elements can be improved, and the liquid leakage resistance at the time of manufacture can be improved. In addition, stress generated by thermal shock or the like can be relieved to greatly improve the reliability of adhesion fixation and liquid leakage prevention.

Claims (4)

An insulating base member;
A pair of lead frames provided on the base member;
A reflector member including ceramic provided on the pair of lead frames;
An optical semiconductor element package comprising: an organic adhesive sealing member having an insulating property by bonding the base member, the pair of lead frames, and the reflector member. 2. The package for an optical semiconductor element according to claim 1, wherein an elastic coefficient of the adhesive sealing member is smaller than both of the elastic modulus of the lead frame and the reflector member. 3. The package for an optical semiconductor element according to claim 1, wherein the adhesive used for the adhesive sealing member includes one or more of an epoxy system, a silicone system, and a polyimide system. 3. The package for an optical semiconductor element according to claim 1, wherein an outer dimension of the base member is larger than or smaller than an outer dimension of the reflector member.

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