JP2011059222A - Method for manufacturing camera module, and camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique for facilitating manufacture of a camera module. <P>SOLUTION: A following process is adopted when manufacturing a plurality of camera modules by cutting and dividing, for every imaging sensor, a lens assembly in which optical lenses are respectively arranged to correspond to a plurality of imaging sensors on a sensor substrate where the imaging sensors are two-dimensionally arrayed. First, a plurality of optical lens sections which are not coupled with each other, a plurality of lens supporting members for supporting the plurality of optical lens sections directly or indirectly through other member, which are not coupled with each other, and the sensor substrate on which the plurality of imaging sensors are two-dimensionally arrayed are prepared. Next, by arranging the plurality of lens supporting members and the plurality of optical lens sections on a tool, an optical unit assembly including a plurality of optical units having the optical lens section and the lens supporting member respectively is formed. Then, the optical unit assembly is fixed on the sensor substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a camera module and a manufacturing method thereof.

  In recent years, a camera module is often mounted on a small electronic device such as a mobile phone, and further miniaturization of the camera module is aimed at.

  With regard to this camera module, conventionally, a lens barrel and a lens holder that support a lens, a holder that supports an infrared (IR) cut filter, a substrate, an image sensor, and an optical element, and a housing that holds the stack. There is a need for a body and a resin for sealing the laminate. Therefore, it is not easy to produce a camera module by accurately combining a large number of components while reducing the size of the large number of components.

  Therefore, a plurality of sheets including a substrate, a semiconductor sheet on which a large number of imaging elements are formed, and a lens array sheet on which a large number of imaging lenses are formed are bonded with a resin adhesive or the like to form a wafer-like laminated member And a technique for completing individual camera modules by dicing the laminated member (for example, Patent Documents 1 and 2). With this technology, it is possible to cut out several hundred camera modules from a single wafer-like laminated member, and matching with a fine processing process is also good. For this reason, it is considered that the camera module greatly contributes to miniaturization, thinning, and cost reduction.

JP 2007-12995 A Japanese Patent Laid-Open No. 2004-200965

  However, it takes a long time to cut the wafer-like laminated member quickly and without breakage. In addition, the cutting of the laminated member is generally performed by dicing. However, in this dicing, there is a concern that the resin layer is swollen by cooling water and a load at the time of cutting is generated. And in order to verify the identity of the optical performance before and after cutting by dicing, many inspection steps are required in the manufacture of the camera module.

  The present invention has been made in view of the above problems, and an object thereof is to provide a technique for facilitating the manufacture of a camera module.

  In order to solve the above-described problem, in the method of manufacturing the camera module according to the first aspect, an optical lens is provided so as to correspond to each of the image sensors with respect to a sensor substrate on which a plurality of image sensors are two-dimensionally arranged. A camera module manufacturing method for manufacturing a plurality of camera modules by dividing each lens assembly disposed for each of the imaging sensors by cutting, and a plurality of optical lens units not connected to each other, A preparatory step for preparing a plurality of lens support members that are not connected to each other and for supporting the plurality of optical lens portions directly or indirectly via other members, and the sensor substrate; and a jig On the upper side, the plurality of lens support members and the plurality of optical lens portions are arranged to have the optical lens portion and the lens support member, respectively. Comprising a forming step of forming an optical unit assembly comprising a plurality of optical units, a fixing step of fixing the optical unit assembly with respect to the sensor substrate.

  A method for manufacturing a camera module according to a second aspect is a method for manufacturing a camera module according to the first aspect, wherein in the forming step, the plurality of lens support members are arranged on the jig, The optical unit assembly is formed by attaching the optical lens portion to each of the lens support members.

  A method for manufacturing a camera module according to a third aspect is the method for manufacturing a camera module according to the first aspect, wherein each of the lens support members prepared in the preparation step directly or directly connects the optical lens unit. Each is indirectly supported through another member.

  A method for manufacturing a camera module according to a fourth aspect is a method for manufacturing a camera module according to any one of the first to third aspects, wherein the side surfaces of the lens support members are sequentially provided. , A second surface, a third surface, a fourth surface, and a fifth surface, wherein the first to fourth surfaces are sequentially provided with a substantially vertical relationship, and the fifth surface is Each of the first and fourth surfaces is provided with an obtuse angle and has an area smaller than any one of the first to fourth surfaces. In the forming step, the position of the fifth surface The plurality of lens support members are arranged on the jig with reference to.

  A method for manufacturing a camera module according to a fifth aspect is a method for manufacturing a camera module according to any one of the first to third aspects, wherein the side surfaces of the lens support members are sequentially provided. , Second surface, third surface, fourth surface, fifth surface, and sixth surface, and the first, second, fourth, and sixth surfaces have a substantially vertical relationship in order. The third surface is provided with an obtuse angle with respect to the second and fourth surfaces, and any one of the first, second, fourth, and sixth surfaces is provided. An area smaller than the surface, the fifth surface is provided at an obtuse angle with respect to the fourth and sixth surfaces, and one of the first, second, fourth, and sixth surfaces The area is smaller than any surface, and in the forming step, the healing is performed with reference to the positions of the third and fifth surfaces. Arranging the plurality of lens supporting member in the above.

  A camera module manufacturing method according to a sixth aspect is a camera module manufacturing method according to a fifth aspect, wherein the third surface and the fifth surface are at least one of area and shape mutually. It is a different aspect.

  A method for manufacturing a camera module according to a seventh aspect is a method for manufacturing a camera module according to any one of the first to third aspects, wherein the side surfaces of the lens support members are sequentially provided. , The second surface, the third surface, the fourth surface, the fifth surface, the sixth surface, and the seventh surface, and the first, second, fourth, and sixth surfaces are sequentially substantially vertical. The third surface is provided at an obtuse angle with respect to the second and fourth surfaces, and the first, second, fourth, and sixth surfaces are provided. The area is smaller than any of the surfaces, the fifth surface is provided at an obtuse angle with respect to the fourth and sixth surfaces, and the first, second, fourth, and sixth The area is smaller than any of the surfaces, and the seventh surface forms an obtuse angle with respect to the sixth and first surfaces, respectively. Provided and has an area smaller than any of the first, second, fourth, and sixth surfaces, and in the forming step, the positions of the third, fifth, and seventh surfaces are used as a reference. As above, the plurality of lens support members are arranged on the jig.

  A method for manufacturing a camera module according to an eighth aspect is a method for manufacturing a camera module according to the seventh aspect, wherein one or two of the third, fifth, and seventh surfaces; The other one or two of the third, fifth, and seventh surfaces are surfaces that differ from each other in at least one of area and shape.

  A camera module manufacturing method according to a ninth aspect is a camera module manufacturing method according to any one of the first to eighth aspects, wherein the plurality of lenses is formed on the jig in the forming step. Support members are arranged in a matrix.

  A method for manufacturing a camera module according to a tenth aspect is a method for manufacturing a camera module according to any one of the first to ninth aspects, wherein the jig is configured so that each lens support member is placed on the jig. Has a stepped portion at a position where is disposed.

  A camera module according to an eleventh aspect is provided with an optical lens unit, an imaging sensor unit, and the imaging sensor unit, and a lens that supports the optical lens unit directly or indirectly through another member. And a side surface of the lens support portion has a first surface, a second surface, a third surface, a fourth surface, and a fifth surface that are sequentially provided, and the first to fourth surfaces Are provided sequentially in a substantially vertical relationship, and the fifth surface is provided at an obtuse angle with respect to the first and fourth surfaces, and the first to fourth surfaces The area is smaller than any of these surfaces.

  A camera module according to a twelfth aspect is provided with an optical lens unit, an imaging sensor unit, and the imaging sensor unit, and supports the optical lens unit directly or indirectly through another member. And a side surface of the lens support portion has a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface that are sequentially provided. The second, fourth, and sixth surfaces are sequentially provided with a substantially vertical relationship, and the third surface is provided with an obtuse angle with respect to the second and fourth surfaces, respectively. And an area smaller than any one of the first, second, fourth, and sixth surfaces, and the fifth surface forms an obtuse angle with respect to the fourth and sixth surfaces, respectively. And has an area smaller than any of the first, second, fourth and sixth surfaces.

  A camera module according to a thirteenth aspect is the camera module according to the twelfth aspect, wherein the third surface and the fifth surface are surfaces different from each other in at least one of area and shape.

  A camera module according to a fourteenth aspect is provided with an optical lens unit, an imaging sensor unit, and the imaging sensor unit, and supports the optical lens unit directly or indirectly through another member. And a side surface of the lens support portion has a first surface, a second surface, a third surface, a fourth surface, a fifth surface, a sixth surface, and a seventh surface that are sequentially provided. The first, second, fourth, and sixth surfaces are sequentially provided with a substantially vertical relationship, and the third surface has an obtuse angle with respect to the second and fourth surfaces, respectively. And the area is smaller than any one of the first, second, fourth, and sixth surfaces, and the fifth surface is relative to the fourth and sixth surfaces, respectively. An obtuse angle is provided, and the area is greater than any of the first, second, fourth, and sixth surfaces. The seventh surface is provided with an obtuse angle with respect to each of the sixth and first surfaces, and more than any of the first, second, fourth, and sixth surfaces. The area is small.

  A camera module according to a fifteenth aspect is the camera module according to the fourteenth aspect, wherein one or two of the third, fifth, and seventh surfaces, and the third, fifth, , And the other one or two of the seventh surfaces are surfaces different from each other in at least one of area and shape.

  A camera module according to a sixteenth aspect is provided with an optical lens unit, an imaging sensor unit, and the imaging sensor unit, and supports the optical lens unit directly or indirectly through another member. A support unit; an actuator unit that moves the optical lens unit along the optical axis of the optical lens unit; and an electrical connection between the actuator unit and the imaging sensor unit that is provided in a recessed portion on a side surface of the lens support unit. And a wiring portion connected to.

  The camera module manufacturing method according to any one of the first to tenth aspects also makes it possible to simplify the cutting process and avoid problems caused by cutting, thereby facilitating the manufacturing of the camera module.

  The camera module manufacturing method according to any of the fourth to eighth aspects can also facilitate the manufacture of the camera module because the posture in which the lens support member should be disposed can be known.

  According to the camera module manufacturing method according to any of the sixth and eighth aspects, since the posture and the front and back of the lens support member to be arranged can be known, the camera module can be further easily manufactured.

  According to the method for manufacturing a camera module according to the tenth aspect, since it is easy to dispose the plurality of lens support members on the jig, the manufacturing of the camera module can be facilitated.

  According to any of the eleventh to fifteenth aspects, the camera module can be easily manufactured because the posture in which the lens support portion is to be arranged is known in the manufacturing process. Further, for example, when the camera module is mounted on various devices, it is possible to grasp the posture in which the camera module should be arranged.

  With the camera module according to any of the thirteenth and fifteenth aspects, since the posture and front and back of the lens support portion to be arranged in the manufacturing process can be known, the manufacturing of the camera module can be further facilitated. Further, for example, when the camera module is mounted on various devices, it is possible to grasp the posture in which the camera module should be arranged.

  According to the camera module of the sixteenth aspect, it is easy to install wiring that electrically connects the actuator unit and the imaging sensor unit, and thus the manufacturing of the camera module can be facilitated.

It is a schematic diagram which shows schematic structure of the mobile telephone carrying the camera module which concerns on 1st and 2nd embodiment. It is a cross-sectional schematic diagram paying attention to the 1st housing | casing which concerns on 1st and 2nd embodiment. It is a cross-sectional schematic diagram of the camera module which concerns on 1st Embodiment. It is a schematic diagram which shows the structure of an image pick-up element layer. It is a schematic diagram which shows the structure of a cover glass layer. It is a schematic diagram which shows the structure of a lens support frame. It is a schematic diagram which shows the structure of an optical lens part. It is a schematic diagram which shows the structure of a cover layer. It is a flowchart which shows the manufacturing flow of the camera module which concerns on 1st Embodiment. It is a perspective view which shows the structure of a lens support frame. It is a perspective view which shows the structure of an imaging sensor board | substrate sheet | seat. It is a perspective view which shows the structure of a jig | tool. It is a perspective view which illustrates the arrangement state of the lens support frame on a jig. It is a top view which illustrates the arrangement state of the lens support frame on a jig. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 1st Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 1st Embodiment. It is a cross-sectional schematic diagram of the camera module which concerns on 2nd Embodiment. It is the schematic diagram which looked at the camera module which concerns on 2nd Embodiment from the side. It is a schematic diagram which shows the structure of a lens group. It is a schematic diagram which shows the structure of a lens group. It is a figure for demonstrating the structure of a lens group. It is a figure for demonstrating the structure of a lens group. It is a figure for demonstrating the structure of a lens group. It is an upper surface schematic diagram which shows the structure of a lens position adjustment layer. It is a cross-sectional schematic diagram which shows the structure of a lens position adjustment layer. It is an upper surface schematic diagram which shows the structure of an actuator layer. It is the schematic diagram which looked at the structure of the actuator layer from the side. It is a figure for demonstrating the structure of an actuator layer. It is a figure for demonstrating the structure of an actuator layer. It is a lower surface schematic diagram which shows the structure of a 2nd parallel spring. It is a schematic diagram which shows the relationship between a lens group and a 2nd parallel spring. It is a lower surface schematic diagram which shows the structure of a 1st parallel spring. It is a schematic diagram which shows the relationship between a lens group and a 1st parallel spring. It is a flowchart which shows the manufacture flow of the camera module which concerns on 2nd Embodiment. It is a flowchart which shows the manufacture flow of the camera module which concerns on 2nd Embodiment. It is a flowchart which shows the manufacture flow of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing which shows the manufacturing process of the camera module which concerns on 2nd Embodiment. It is sectional drawing for demonstrating the manufacturing process of the camera module which concerns on a modification. It is sectional drawing for demonstrating the manufacturing process of the camera module which concerns on a modification. It is sectional drawing for demonstrating the manufacturing process of the camera module which concerns on a modification. It is an upper surface schematic diagram which shows the structure of the 1st modification of a lens support frame. It is a side surface schematic diagram which shows the structure of the 1st modification of a lens support frame. It is an upper surface schematic diagram which shows the structure of the 2nd modification of a lens support frame. It is an upper surface schematic diagram which shows the structure of the 3rd modification of a lens support frame. It is an upper surface schematic diagram which shows the structure of the 4th modification of a lens support frame. It is an upper surface schematic diagram which shows the structure of the 5th modification of a lens support frame. It is the schematic diagram which looked at the camera module which concerns on a modification from the side. It is an upper surface schematic diagram which shows the structure of the lens position adjustment layer which concerns on a modification. It is an upper surface schematic diagram which shows the structure of the image pick-up element layer which concerns on a modification. It is an upper surface schematic diagram which shows the structure of the cover glass layer which concerns on a modification. It is an upper surface schematic diagram which shows the structure of the actuator layer which concerns on a modification. It is a perspective view which shows the structural example of the jig | tool which concerns on a modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<(1) First Embodiment>
<(1-1) Schematic configuration of mobile phone>
FIG. 1 is a schematic diagram showing a schematic configuration of a mobile phone 1 equipped with a camera module 500 according to the first embodiment. In FIG. 1 and other drawings, three axes XYZ orthogonal to each other are appropriately attached in order to clarify the orientation relation.

  As shown in FIG. 1, the mobile phone 1 is configured as a foldable mobile phone, and includes a first housing 301, a second housing 302, and a hinge part 400. Each of the first housing 301 and the second housing 302 has a plate-like substantially rectangular parallelepiped shape, and serves as a housing for storing various electronic members. Specifically, the first casing 301 includes a camera module 500 and a display, and the second casing 302 includes a control unit that electrically controls the mobile phone 1 and an operation member such as a button. Have. In addition, the hinge part 400 connects the 1st housing | casing 301 and the 2nd housing | casing 302 so that rotation is possible. For this reason, the mobile phone 1 can be folded.

  FIG. 2 is a schematic cross-sectional view focusing on the first casing 301 of the mobile phone 1. As shown in FIG. 1 and FIG. 2, the camera module 500 is a small imaging device, so-called micro camera unit, having an XY cross-section of about 5 mm square and a thickness (depth in the Z direction) of about several mm. (MCU).

  Hereinafter, the configuration of the camera module 500 and the manufacturing process of the camera module 500 will be sequentially described.

<(1-2) Camera module configuration>
FIG. 3 is a schematic cross-sectional view of the camera module 500. The direction indicated by the arrow AR1 in FIG. 3 corresponds to the + Z direction. In addition, the arrow AR1 is appropriately attached to other drawings after FIG. 3 in order to clarify the orientation relation.

  As shown in FIG. 3, the camera module 500 includes a lid layer 10, an optical lens unit 20, a lens support frame 170, a cover glass layer 17, and an image sensor layer 18. Hereinafter, the −Z side surface of each part is referred to as one main surface, and the + Z side surface is referred to as another main surface.

  FIG. 4 is a schematic diagram illustrating the configuration of the imaging element layer 18 focusing on the configuration of the imaging element layer 18. The imaging element layer 18 includes, for example, an imaging element 181 such as a COMS sensor or a CCD sensor, and an outer peripheral portion that forms the periphery of the imaging element 181. As shown in FIG. 3, a solder ball HB is provided on the lower surface (the surface on the −Z side) of the imaging element layer 18 and is electrically connected to the control unit or the like by reflow soldering. Is done.

  FIG. 5 is a schematic diagram showing the configuration of the cover glass layer 17 focusing on the configuration of the cover glass layer 17. The cover glass layer 17 covers the image sensor 181 from the upper surface side, and protects the image sensor 181 while introducing light rays from the subject into the image sensor 181. The cover glass layer 18 may include a filter layer that cuts infrared rays (IR).

  And the image sensor layer 18 and the cover glass layer 17 are laminated | stacked in this order in + Z direction, and the image sensor board | substrate 178 as an image sensor part is comprised.

  FIG. 6 is a schematic diagram showing the structure of the lens support frame 170 focusing on the structure of the lens support frame 170 as a lens support portion. As shown in FIG. 6, the lens support frame 170 is a cylindrical member whose outer edge and inner edge in a cross section parallel to the XY plane are substantially rectangular. The lens support frame 170 has a hollow portion 170H penetrating in the Z-axis direction, and a stepped portion 170S is provided near the central portion of the inner wall. Specifically, the lens support frame 170 has an upper and lower surface provided with an opening of a through hole and four side surfaces, and the four side surfaces have a substantially vertical angular relationship with an adjacent side surface, and the upper and lower surfaces are The four side surfaces and the upper and lower surfaces have a substantially parallel relationship, and are configured to have a substantially vertical angular relationship. Then, one main surface (the surface on the −Z side) of the lens support frame 170 is fixed to the other main surface of the outer peripheral portion of the imaging sensor substrate 178. The “substantially vertical angular relationship” referred to here indicates an angular relationship that forms an angle included in a predetermined angle range close to 90 degrees, for example, about 70 to 110 degrees.

  FIG. 7 is a schematic diagram illustrating the configuration of the optical lens unit 20 focusing on the configuration of the optical lens unit 20. As shown in FIG. 7, the optical lens unit 20 includes a lens body 20L having various optical characteristics as a lens, and a plate-shaped lens holder that protrudes from the side surface of the lens body 20L and has a rectangular outer edge. Part 20P. Then, the optical lens unit 20 is fixed to the stepped portion 170S on the inner wall side of the lens support frame 170. Specifically, the other main surface of the outer peripheral portion near the outer edge of the lens holding portion 20P is fixed to one main surface of the stepped portion 170S. Thus, the optical unit OU having the lens support frame 170 and the optical lens unit 20 is formed by attaching the optical lens unit 20 to the lens support frame 170.

  FIG. 8 is a schematic diagram showing the structure of the lid layer 10 focusing on the structure of the lid layer 10. As shown in FIG. 8, the lid layer 10 is made of a plate-like member made of glass or the like that has a substantially square outer edge in a cross section parallel to the XY plane and transmits light. Then, one main surface of the portion (outer peripheral portion) near the outer edge of the lid layer 10 is fixed to the other main surface (surface on the + Z side) of the lens support frame 170.

  In this way, the optical lens unit 20 is supported by the lens support frame 170 and fixed to the imaging sensor substrate 178, so that the distance between the optical lens unit 20 and the imaging sensor substrate 178 is kept substantially constant. It is. The light SL from the subject passes through the lid layer 10 and is irradiated to the image sensor 181 through the optical lens unit 20 and the cover glass layer 17. At this time, the image sensor 181 obtains image data corresponding to the subject.

  Further, the space in which the optical lens unit 20 is disposed is surrounded by the lid layer 10, the lens support frame 170, and the imaging sensor substrate 178, thereby forming a sealed space and suppressing entry of dust and the like from the surroundings into the optical lens unit 20. Is done.

  Here, the lens support frame 170 is provided on the imaging sensor substrate 178, and the optical lens unit 20 is directly supported by the lens support frame 170, but is not limited thereto. A configuration in which the optical lens unit 20 is supported not indirectly by the lens support frame 170 but indirectly through another member or the like may be employed.

<(1-3) Camera module manufacturing process>
When manufacturing the plurality of camera modules 500, first, the plurality of optical lens units 20 and the like are arranged on the imaging sensor substrate sheet 178U so as to correspond to the arrangement of the imaging sensor substrates 178, and the optical lens unit 20 is arranged. Is formed (lens integrated body). Then, the lens assembly is divided for each image sensor substrate 178 by cutting by dicing or the like. The process for manufacturing such a camera module 500 conventionally requires a relatively large cutting process such as dicing. On the other hand, in this embodiment, a jig is used to form a configuration corresponding to the lens assembly, thereby simplifying the cutting process by dicing or the like.

  FIG. 9 is a flowchart showing the flow of the manufacturing process of the camera module 500 according to this embodiment. As shown in FIG. 9, (process A) preparation process (steps SP1 to SP3), (process B) formation process (steps SP4 to SP6), (process C) fixing process (step SP7), (process D) separation Process (step SP8), (process E) division process (step SP9), and (process F) camera module completion process are sequentially performed.

  Hereinafter, the manufacturing process of the camera module 500 will be described with reference to the flowchart shown in FIG. Here, in order to prevent complication of the drawing, an example in which 16 camera modules 500 are manufactured will be described. However, this manufacturing process includes a plurality of camera modules from several tens to several hundreds. It is applicable to the process in which 500 is manufactured.

  In step SP1, a plurality of optical lens portions 20 as shown in FIG. 7 (for example, 16 pieces) are produced. Here, the plurality of optical lens units 20 are not manufactured in the form of a sheet in which the plurality of optical lens units 20 are arranged, but in the form of individual chips that are not connected to each other. Be prepared by that. Each optical lens unit 20 is manufactured by molding using a resin or the like.

  In step SP2, a plurality (for example, 16 pieces) of lens support frames 170 corresponding to the lens support members as shown in FIG. 6 are produced. Here, the plurality of lens support frames 170 are not manufactured in the form of a sheet in which the plurality of lens support frames 170 are arranged, but in the form of individual chips that are not connected to each other. Be prepared by that. FIG. 10 is a perspective view showing the structure of the lens support frame 170. Each lens support frame 170 is manufactured by molding using resin or the like.

  In step SP3, a sheet in which a plurality of (for example, 16) chips related to the image sensor substrate 178 formed by joining the cover glass layer 17 (FIG. 5) and the image sensor layer 18 (FIG. 4) are arranged ( An imaging sensor substrate sheet) 178U is prepared. FIG. 11 is a perspective view schematically illustrating a configuration example of the imaging sensor substrate sheet 178U. In FIG. 11, hatched hatching is given to portions corresponding to the respective image sensor substrates 178. As shown in FIG. 11, a plurality of imaging sensor substrates 178 are two-dimensionally arranged in a matrix on the imaging sensor substrate sheet 178U.

  In step SP4, the jig 100 for manufacturing the camera module 500 is installed. FIG. 12 is a perspective view schematically showing the structure of the jig 100. As shown in FIG. 12, the jig 100 has a plurality of recesses 100H formed in a matrix. The recess 100H has an outer edge corresponding to the outer edges of the upper and lower surfaces of the lens support frame 170. The plurality of recesses 100H have substantially the same depth, and the bottom surfaces of the plurality of recesses 100H have a parallel relationship with each other.

  In step SP5, the plurality of lens support frames 170 prepared in step SP2 are arranged on the jig 100. Here, as shown in FIG. 13 and FIG. 14, the lens support frame 170 is fitted in each recess 100 </ b> H of the jig 100. FIG. 15 is a cross-sectional view of a configuration in which a plurality of lens support frames 170 are arranged on the jig 100 viewed in the direction of the arrow along the cut surface XV-XV in FIG. As shown in FIGS. 14 and 15, a plurality of lens support frames 170 are arranged in a matrix on the jig 100 using the steps of the jig 100. In other words, the jig 100 is provided with a step at a position where each lens support frame 170 is disposed on the jig 100.

  In step SP6, the optical lens unit 20 is attached to each lens support frame 170 arranged on the jig 100. FIG. 16 is a diagram illustrating a state in which the optical lens unit 20 is attached to each lens support frame 170 based on the state illustrated in FIG. 15. Here, the outer peripheral portion of the optical lens portion 20 is bonded to the step portion 170S of each lens support frame 170 using an adhesive or the like. At this time, a plurality of lens support frames 170 that respectively support the optical lens unit 20 are arranged on the jig 100, so that the relative positional relationship of the plurality of optical units OU is fixed. (Hereinafter referred to as “optical unit assembly”).

  In step SP7, the imaging sensor substrate sheet 178U and the optical unit assembly are bonded using an adhesive or the like. FIG. 17 shows a state in which the optical unit assembly is fixed to the imaging sensor substrate sheet 178U so that the optical unit OU is fixed to each imaging sensor substrate 178, based on the state shown in FIG. FIG.

  In step SP8, the optical unit assembly is detached from the jig 100 and separated. At this time, FIG. 18 is a view showing a state in which the jig 100 is removed based on the state shown in FIG. As shown in FIG. 18, the relative positional relationship in which the plurality of optical units OU constituting the optical unit aggregate are arranged in a matrix is maintained by the presence of the imaging sensor substrate sheet 178U.

  In step SP9, the imaging sensor substrate sheet 178U is divided for each imaging sensor substrate 178 by cutting by dicing. Here, as shown in FIG. 18, a portion indicated by a thick broken line CL is cut by dicing, whereby a plurality of units each including an imaging sensor substrate 178 and an optical unit OU are produced.

  In step SP10, the plurality of camera modules 500 are completed by attaching the lid layer 10 to each of the plurality of units manufactured in step SP9 using an adhesive or the like. The lid layer 10 may be attached between step SP8 and step SP9, for example, from the viewpoint of preventing the optical lens unit 20 from being soiled.

  As described above, according to the method for manufacturing the camera module 500 according to the first embodiment, the plurality of optical units OU that are not connected to each other are fixed to the imaging sensor substrate sheet 178U. For this reason, the simplification of the cutting process causes the swelling of the resin layer by the cooling water at the time of cutting, the occurrence of the necessity of an inspection process for inspecting whether there is a difference in optical performance before and after cutting due to the load at the time of cutting, etc. Defects are suppressed. As a result, the camera module can be easily manufactured.

  Specifically, since the cutting location and the time required for cutting are reduced, the swelling of the resin layer due to cooling water hardly occurs. In addition, since the possibility that the optical characteristics of the optical unit OU are deviated before and after cutting is extremely low, it is sufficient to inspect the optical performance after the cutting process.

  Further, in the related art, when a plurality of imaging lens units and a plurality of imaging elements are combined, if the yield related to the characteristics of either the imaging lens unit or the imaging element is not good, the camera module The yield of the whole manufacturing was reduced. With regard to this problem as well, according to the manufacturing method according to the present embodiment, the optical unit OU is individually prepared, so that the optical unit OU having poor optical performance can be prevented from being used. In addition, the optical unit OU can be prevented from being attached to an image sensor having poor sensor characteristics. As a result, the yield in the manufacture of the entire camera module is improved, and the increase in cost and the waste of resources in the manufacture of the camera module are suppressed.

  Further, the jig 100 is provided with a step at a position where each lens support frame 170 is disposed on the jig 100. For this reason, arrangement | positioning of the some lens support frame 170 on the jig | tool 100 becomes easy. As a result, the manufacturing of the camera module 500 can be facilitated.

<(2) Second Embodiment>
In the camera module 500 according to the first embodiment, the distance between the image sensor 181 and the optical lens unit 20 is fixed. On the other hand, in the camera module 500A according to the second embodiment, the distance between the image sensor 181 and the optical lens is variable. Note that the mobile phone 1A according to the second embodiment has a camera module 500 that is changed to a camera module 500A having a different configuration compared to the mobile phone 1 according to the first embodiment. One housing 301 is changed to a first housing 301A.

  Hereinafter, the configuration of the camera module 500A according to the second embodiment and the manufacturing method thereof will be sequentially described. Note that, in the camera module 500A according to the second embodiment, the same configurations as those of the camera module 500 according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

<(2-1) Configuration of camera module>
<(2-1-1) Schematic configuration of camera module>
FIG. 19 is a schematic cross-sectional view of the camera module 500A. FIG. 20 is a side view of the camera module 500A viewed from the side. As described above, the direction indicated by the arrow AR1 corresponds to the + Z direction.

  As shown in FIG. 19, the camera module 500A includes an optical system unit KB in which a lens group 200 as a photographing optical system is movably provided, and an imaging unit PB that acquires a photographed image related to a subject image.

  The imaging unit PB has a configuration in which an imaging element layer 18A having an imaging element 181 such as a COMS sensor or a CCD sensor and a cover glass layer 17 are laminated in this order in the + Z direction.

  The optical system unit KB includes a lid layer 10, a first frame layer 11, a first parallel spring (upper layer parallel spring) 12, a second frame layer 13, a second parallel spring (lower layer parallel spring) 14, an actuator layer 15, and a lens position. An adjustment layer 16 and a lens group 200 are provided. The first parallel spring 12, the second parallel spring 14, and the actuator layer 15 are all manufactured in a wafer state (at the wafer level).

  In the optical system unit KB, the lens position adjusting layer 16, the actuator layer 15, the second parallel spring 14, the second frame layer 13, the first parallel spring 12, the first frame layer 11, and the lid layer 10 are arranged in this order in the + Z direction. The lens group 200 as a moving object is held between the second parallel spring 14 and the first parallel spring 12. The first parallel spring 12, the second parallel spring 14, and the actuator layer 15 cooperate with each other to move the lens group 200 in the direction along the Z axis.

  In the camera module 500 </ b> A, the lid layer 10, the first and second frame layers 11 and 13, the lens position adjustment layer 16, the cover glass layer 17, and the imaging element layer 18 serve as a fixing portion for the lens group 200.

  Here, the lens group 200 is supported by the first and second parallel springs 12 and 14 coupled to the fixed portion. More specifically, the second parallel spring 14 is interposed between the actuator layer 15 and the lens group 200 on the −Z side (the side on which the image sensor 181 is disposed) of the lens group 200. A first parallel spring 12 is interposed between the first frame layer 11 and the lens group 200 on the + Z side (the side where the lid layer 10 is disposed) of the lens group 200. That is, the lens group 200 is sandwiched between the first parallel spring 12 and the second parallel spring 14. Here, since the lens group 200 is clamped by the first and second parallel springs 12 and 14, the posture of the lens group 200 is maintained regardless of the movement of the lens group 200, and the optical axis of the lens group 200 is substantially constant. Retained.

  Further, the first and second parallel springs 12 and 14 generate a force in a direction opposite to the moving direction of the lens group 200 (that is, the + Z direction) when the lens group 200 as the moving object moves in the + Z direction. This is applied to the lens group 200. When the lens group 200 moves in the −Z direction, the direction of the force applied to the lens group 200 by the first and second parallel springs 12 and 14 is the moving direction of the lens group 200 (that is, −Z). Direction).

  Further, in a non-driving state where the lens group 200 is not moving in the + Z direction (for example, a stationary state before driving), the lens group 200 is moved to the lens position adjusting layer 16 by the elastic force of the first and second parallel springs 12 and 14. The lens group 200 is also supported by the lens position adjustment layer 16 by being pressed against the upper end surface of the protrusion 162. In this non-driven state, the lens group 200 is placed at a predetermined position on the most −Z side of the range (displaceable range) that can be displaced along the Z axis and is stationary.

  The predetermined position is, for example, a position at which the focal point of the optical system unit KB is disposed on the + Z side surface (hereinafter also referred to as “imaging surface”) on which a large number of pixel circuits are arranged in the image sensor 181. Set to The focal point of the optical system unit KB here means a point where light beams emitted from the optical system unit KB gather at one point when parallel light beams enter the optical system unit KB from the + Z side.

  Further, as described above, in the non-driven state, the lens group 200 is pressed against the lens position adjusting layer 16 by the elastic force of the first and second parallel springs 12 and 14, and thus is strong against the camera module 500. Even when an impact is applied, the posture of the lens group 200 is maintained.

  The actuator layer 15 as an actuator unit has movable units 15a and 15b (FIG. 28) that generate drive displacement in the + Z direction, and is disposed on the −Z side of the lens group 200. The movable portions 15a and 15b are in contact with the first protrusion 201 that protrudes toward the −Z side of the lens group 200, and the drive displacement generated in the movable portions 15a and 15b is transmitted to the lens group 200 via the first protrusion 201. Is done. That is, the actuator layer 15 moves the lens group 200 that is a moving object in a predetermined direction (here, the + Z direction). In a scene where the drive displacement in the + Z direction in the movable portions 15a and 15b is reduced, the lens group 200 is moved in a direction opposite to the predetermined direction (−Z by the elastic force of the first and second parallel springs 12 and 14). Direction).

  The side wiring 21 is a thin conductive member disposed on one of the four side surfaces of the camera module 500A. As shown in FIG. 20, the side wiring 21 detects the electrical resistance of the heater layer 155 (FIG. 31), a driver for supplying current (current supply driver), and the heater layer 155 via the imaging element layer 18 </ b> A. The part (electric resistance detection part) is electrically connected. Note that an insulating portion 14ep is provided between the second parallel spring 14 and the side wiring 21 so that the side wiring 21 and the second parallel spring 14 are not short-circuited.

<(2-1-2) Lens group>
The lens group 200 as the optical lens unit is formed by stacking two or more lenses, for example, using a glass substrate as a base material. In this embodiment, the case where the lens group 200 is configured by superimposing two optical lenses is illustrated. In the present embodiment, the lens group 200 functions as an imaging lens that guides light from the subject to the imaging element 181.

  21 and 22 are schematic sectional views of the lens group 200, and the direction indicated by the arrow AR2 corresponds to the + Z direction. FIG. 23 is a bottom external view of the lens group 200 when the lens group 200 is viewed from below (−Z side), and FIG. 24 is a top external view of the lens group 200 when the lens group 200 is viewed from above (+ Z side). It is.

  As shown in FIGS. 21 and 22, the lens group 200 includes a first lens constituent layer LY1 having a first lens G1, a second lens constituent layer LY2 having a second lens G2, and a spacer layer RB. . Then, the first lens constituent layer LY1 and the second lens constituent layer LY2 are coupled via the spacer layer RB. Here, the outer edge of the cross section parallel to the XY plane among the non-lens portions of the first and second lens constituent layers LY1, LY2 has a substantially square shape.

  As shown in FIGS. 21 to 23, the first main surface (here, −Z side) of the first lens constituent layer LY1 having the first lens G1 has a first non-lens portion that does not function as a lens. A protrusion 201 is provided. Furthermore, as shown in FIG. 21, FIG. 22, and FIG. 24, on one main surface (here, + Z side) of the second lens constituent layer LY2 having the second lens G2, there is a non-lens portion that does not function as a lens. A second protrusion 202 is provided.

  FIG. 25 is a view of the spacer layer RB as viewed from above (+ Z side), focusing on the shape of the spacer layer RB. As shown in FIG. 25, the spacer layer RB is provided along the outer edge of the non-lens portion of the first and second lens constituting layers LY1, LY2, and the shape of the outer edge and the inner edge of the cross section parallel to the XY plane is rectangular. It has the cyclic structure which is. Then, the optical axis of the lens group 200 is set in a direction along the Z axis.

<(2-1-3) About each functional layer>
Below, the detail of each functional layer which comprises camera module 500A is demonstrated. For each functional layer, the −Z side surface is referred to as one main surface, and the + Z side surface is referred to as the other main surface.

<(2-1-3-1) Image sensor layer>
As shown in FIG. 19, the image sensor layer 18A receives the light from the subject that has passed through the optical system unit KB and generates an image signal related to the image of the subject, its peripheral circuit, and the image sensor. 181 is a member having an outer peripheral portion surrounding 181. The image sensor 181 is configured by arranging a large number of pixel circuits. A solder ball HB for performing reflow soldering is provided on one main surface (the surface on the −Z side) of the image sensor layer 18A. Further, on one main surface of the image sensor layer 18A, various terminals for connecting wirings for applying signals to the image sensor 181 and reading signals from the image sensor 181 are provided.

<(2-1-3-2) Cover glass layer>
As shown in FIG. 19, the cover glass layer 17 has a substantially flat plate shape and a substantially square shape in cross section parallel to the XY plane, and is made of transparent glass or the like. The cover glass layer 17 is bonded to the other main surface (+ Z side surface) of the image sensor layer 18A, and has a function of protecting the image sensor 181. The image sensor substrate 178A is configured with the cover glass layer 17 bonded onto the image sensor layer 18A.

<(2-1-3-3) Lens position adjustment layer>
The lens position adjustment layer 16 is a member that is disposed between the image sensor 181 and the lens group 200 and adjusts the distance between the image sensor 181 and the lens group 200. Specifically, the lens position adjustment layer 16 defines the position (initial position) of the lens group 200 in the non-driven state. The lens position adjustment layer 16 is generated using, for example, a method of etching a resin.

  FIG. 26 is a top view of the lens position adjusting layer 16 as viewed from above (+ Z side). FIG. 27 is a cross-sectional view of the lens position adjusting layer 16 as viewed in the direction of the arrow along the cutting plane XXVI-XXVI of the lens position adjusting layer 16. As shown in FIGS. 26 and 27, the lens position adjustment layer 16 includes a frame body 161 and a protrusion 162.

  The frame 161 is a substantially rectangular annular portion that constitutes the outer peripheral portion of the lens position adjusting layer 16, and has a plate-like shape substantially parallel to the XY plane. The frame 161 forms a hole (through-hole) 16HL that penetrates in the direction along the Z axis, and the + Y side plate-like member and the −Y side plate-like member constituting the frame 161 are: Each has a protruding portion 161T that protrudes toward the through hole 16HL. Further, one main surface of the frame body 161 is bonded to the adjacent cover glass layer 17, and the other main surface of the frame body 161 is connected to the adjacent actuator layer 15 (specifically, the frame body 15 f of the actuator layer 15 ( 28)).

  The protrusion 162 is erected upward (in the + Z direction) in the vicinity of the inner edge of the convex portion 161T constituting the frame body 161. The projection 162 is a plate-like portion having a substantially rectangular board surface substantially parallel to the XZ plane, and the longitudinal direction of the projection 162 is a direction substantially parallel to the X axis, and the short direction of the projection 162 Is a direction substantially parallel to the Z-axis. The end surface on the + Z side of the protrusion 162 has a function of placing the lens group 200 at the initial position when the lens group 200 abuts.

  In FIG. 26, a region (pixel array region) in which a plurality of pixel circuits constituting the image sensor 181 are arranged, that is, an outer edge of the front surface (imaging surface) of the image sensor 181 is indicated by a broken line.

<(2-1-3-4) Actuator layer>
FIG. 28 is a top view of the actuator layer 15 as seen from above (+ Z side). FIG. 29 is a side view of the actuator layer 15 as seen from the side. Further, FIG. 30 is a view for explaining the laminated structure of the actuator layer 15.

  As shown in FIG. 28 and FIG. 29, the actuator layer 15 includes a frame 15f constituting the outer peripheral portion and two plate-like shapes protruding from the frame 15f with respect to a hollow portion inside the frame 15f. Movable parts 15a and 15b. One main surface of the frame 15f is bonded to the adjacent lens position adjustment layer 16 (specifically, the frame 161), and the other main surface of the frame 15f is the adjacent second parallel spring 14. (Specifically, it is joined to the fixed frame 141 (FIG. 32)).

  In addition, as shown in FIG. 30, the actuator layer 15 includes a high thermal expansion layer 151, a heat conductive layer 152, a low thermal expansion layer 153, an insulating layer 154, and a heater layer 155 that are arranged from the −Z side toward the + Z side. It is constructed by stacking in order. That is, so-called bimetal (Bi-metallic strip) is employed in the movable portions 15a and 15b.

  The high thermal expansion layer 151, the heat conductive layer 152, the low thermal expansion layer 153, and the insulating layer 154 have the same shape as the planar shape of the actuator layer 15 shown in FIG. That is, the actuator layer 15 has a structure in which four layers of the high thermal expansion layer 151, the heat conductive layer 152, the low thermal expansion layer 153, and the insulating layer 154 are laminated over the entire area.

  Further, the high thermal expansion layer 151 is made of a material having a larger coefficient of thermal expansion than the material constituting the low thermal expansion layer 153. The heat conductive layer 152 is made of a material having a higher thermal conductivity than the material forming the high thermal expansion layer 151 and the low thermal expansion layer 153. The insulating layer 154 is made of an insulator such as silica (silicon dioxide).

  FIG. 31 is a top view showing a detailed configuration of the actuator layer 15 when the actuator layer 15 is viewed from above (+ Z side).

  The heater layer 155 is patterned on the insulating layer 154 and is made of a metal having high conductivity such as platinum. In the heater layer 155, the wiring portion 1551, the heater portion 155b, the wiring portion 1552, the heater portion 155a, and the wiring portion 1553 are extended in this order, and are sequentially electrically connected. The wiring portions 1551, 1552, and 1553 constitute the frame 15f, the heater portion 155a constitutes the movable portion 15a, and the heater portion 155b constitutes the movable portion 15b.

  In addition, the wiring portions 1551, 1552, and 1553 are configured to be wider and have lower electrical resistance than the heater portions 155a and 155b. Therefore, when a voltage is applied between one end of the heater layer 155 (here, the end surface on the −Y side of the wiring portion 1551) and the other end (here, the end surface on the −Y side of the wiring portion 1553), The heater portions 155a and 155b having high resistance generate heat due to their own Joule heat. That is, the heater portions 155a and 155b as the heat generating portions generate heat in response to current supply. Note that a voltage and a current are supplied to the one end and the other end of the heater layer 155 by providing the side wiring 21 (FIGS. 19 and 20).

  In the actuator layer 15 having such a configuration, the movable portions 15a and 15b are provided in accordance with the difference in thermal expansion between the high thermal expansion layer 151 and the low thermal expansion layer 153 due to heat generated by energizing the heater portions 155a and 155b. The free ends FT of the movable portions 15a and 15b are deformed so as to be displaced and warped in the + Z direction. The amount of displacement of the free end FT is an amount corresponding to the degree of heating of the movable parts 15a and 15b. On the other hand, when the energization of the heater portions 155a and 155b is stopped, the heat of the movable portions 15a and 15b is rapidly transmitted to the frame body 15f due to the presence of the heat conductive layer 152, and the heat dissipation from the frame body 15f causes the movable portions 15a and 155b to dissipate. 15b is cooled rapidly. At this time, the upward displacement (+ Z direction) of the free end FT is reduced, and the movable portions 15a and 15b return to a flat plate shape.

  With respect to the actuator layer 15, first, a sheet (actuator layer sheet) in which chips corresponding to the actuator layer 15 are formed in a predetermined arrangement is generated, and then the actuator layer sheet is subjected to a dicing process to be described later. Is divided into shapes.

<(2-1-3-5) Second parallel spring>
FIG. 32 is a bottom external view of the second parallel spring 14 when the second parallel spring 14 is viewed from below (−Z direction). FIG. 33 is a view showing the second parallel spring 14 joined to the lens group 200. As shown in FIG. 32, the second parallel spring 14 is an elastic member having a fixed frame body 141 and an elastic portion 142, and is a layer (elastic layer) forming a spring mechanism.

  The fixed frame 141 constitutes the outer peripheral portion of the second parallel spring 14 and is joined to the frame 15 f of the adjacent actuator layer 15. Here, the distance between the heater layer 155 of the actuator layer 15 and the second second parallel spring 14 is usually only about 10 μm. For this reason, if the side wiring 21 for supplying voltage and current to the heater layer 155 is simply provided from the imaging element layer 18 to the actuator layer 15 by printing or the like, for example, the side wiring 21 extends to the fixed frame 141. End up. That is, the side wiring 21 and the second parallel spring 14 are short-circuited.

  Therefore, in order to prevent this short circuit, a notch 143 that is recessed at the outer edge near the four corners of the fixed frame 141 of the second parallel spring 14 is provided. The notch 143 is an epoxy system used for joining when the second frame layer 13 and the second parallel spring 14 are joined and when the second parallel spring 14 and the actuator layer 15 are joined. The insulating part 14ep (FIGS. 19 and 20) is formed by filling the adhesive such as the resin. Due to the presence of the insulating portion 14ep, unnecessary short circuit due to contact between the side wiring 21 and the second parallel spring 14 is prevented.

  The elastic part 142 has a connection part PG1 with the fixed frame body 141 and a joint part PG2 with the lens group 200, and the connection part PG1 and the joint part PG2 are connected by a plate-like member EB. As shown in FIG. 33, the second parallel spring 14 is joined to the lens group 200 at the joint PG <b> 2 provided in the elastic part 142. Here, the first protrusion 201 contacts the free end FT of the actuator layer 15 through the gap between the fixed frame 141 of the second parallel spring 14 and the plate member EB.

  Then, as the lens group 200 is moved in the + Z direction with respect to the fixed frame body 141, the positions of the connecting portion PG1 and the joint portion PG2 in the Z direction are shifted, and the plate-like member EB undergoes bending deformation (deflection deformation). Bend. That is, the second parallel spring 14 can be elastically deformed in the optical axis direction (± Z direction) of the lens group 200 by elastic deformation of the plate member EB, and functions as a spring mechanism.

  The second parallel spring 14 is manufactured using a SUS metal material or phosphor bronze. For example, when the second parallel spring 14 is made of a SUS-based metal material, a resist in the shape of a parallel spring is patterned on the metal material by a photolithography technique, and dipped in an iron chloride-based etching solution to be wet. Etching is performed to form a parallel spring pattern.

<(2-1-3-6) Second frame layer>
As shown in FIG. 19, the second frame layer 13 as one of the lens support portions is a ring-shaped member in which the outer edge and the inner edge of the cross section parallel to the XY plane are each substantially rectangular, and the Z axis is A hollow portion penetrating along is formed. The second frame layer 13 surrounds the lens group 200 from the side by arranging the lens group 200 in the hollow portion. In addition, resin, glass, etc. are mentioned as a raw material which comprises the 2nd frame layer 13, The 2nd frame layer 13 is manufactured by what is called a press method using a metal metal mold | die, the injection molding method, etc. The lower end surface (one main surface) located on the −Z side of the second frame layer 13 is joined to the fixed frame body 141 of the adjacent second parallel spring 14. Further, the upper end surface (other main surface) located on the + Z side of the second frame layer is joined to the adjacent first parallel spring 12 (specifically, the fixed frame body 121 (FIG. 34) of the first parallel spring 12). Is done.

<(2-1-3-7) First parallel spring>
FIG. 34 is a bottom external view of the first parallel spring 12 when the first parallel spring 12 is viewed from below (−Z direction). As shown in FIG. 34, the first parallel spring 12 is an elastic member having the same configuration and function as the second parallel spring 14 except that the notch 143 is not provided. 121 and an elastic part 122. One main surface of the fixed frame 121 is joined to the other main surface of the adjacent second frame layer 13, and the other main surface of the fixed frame 121 is connected to the adjacent first frame layer 11 (in detail, the first 1 frame layer 11-lower end surface on the -Z side).

  FIG. 35 is a diagram showing the first parallel spring 12 joined to the lens group 200. As shown in FIG. 35, the joint portion PG <b> 2 provided in the elastic portion 122 is joined to the + Z side upper end surface of the projection 202 of the lens group 200. For this reason, when the lens group 200 is moved relative to the fixed frame 121 in the + Z direction, elastic deformation occurs in the plate-like member EB, and the first parallel spring 12 functions as a spring mechanism.

<(2-1-3-8) First frame layer>
As shown in FIG. 19, the first frame layer 11 as one of the lens support portions is a ring whose outer edge and inner edge are substantially rectangular in cross section parallel to the XY plane, like the second frame layer 13. A hollow member penetrating along the Z-axis. The hollow portion of the first frame layer 11 becomes a space in which the plate-like member EB and the protrusion 202 that are elastically deformed when the lens group 200 is moved in the + Z direction can move. The first frame layer 11 is formed by the same material and manufacturing method as the second frame layer 13. The lower end surface (one main surface) located on the −Z side of the first frame layer 11 is joined to the fixed frame body 121 of the adjacent first parallel spring 12. Moreover, the upper end surface (other end surface) located on the + Z side of the first frame layer is joined to the adjacent lid layer 10 (specifically, near the outer peripheral portion of the lid layer).

<(2-1-3-9) Lid layer>
As shown in FIG. 19, the lid layer 10 is made of a plate-like member made of glass or the like that has a substantially square outer edge in a cross section parallel to the XY plane and transmits light.

  In the camera module 500A having such a configuration, the amount of displacement of the free ends FT of the movable portions 15a and 15b is controlled by utilizing the fact that the relationship between the shape and the electrical resistance in the heater portions 155a and 155b is uniquely determined. The Specifically, the electrical resistance of the heater layer 155 is monitored, and the current supplied to the heater portions 155a and 155b is controlled according to the electrical resistance. Thereby, the displacement amount of the free ends FT of the movable portions 15a and 15b is controlled. The distance between the image sensor 181 and the lens group 200 is freely changed by controlling the amount of displacement of the free ends FT of the movable portions 15a and 15b.

<(2-2) Camera module manufacturing process>
36 to 38 are flowcharts showing the flow of the manufacturing process of the camera module 500A. As shown in FIG. 36, (process a) preparation process (step ST1), (process b) formation process (step ST2), (process c) fixing process (step ST3), (process d) separation process (step ST4). ), (Step e) dividing step (step ST5), and (step f) camera module completion step (step ST6). FIG. 37 shows a detailed manufacturing process flow of the preparation process (step ST1), and FIG. 38 shows a detailed manufacturing process flow of the formation process (step ST2).

  Hereinafter, the manufacturing process of the camera module 500A will be described with reference to the flowcharts shown in FIGS. Here, in order to prevent complication of the drawing, an example in which 16 camera modules 500A are manufactured will be described. However, in this manufacturing process, a plurality of camera modules 500A from 2 to several hundreds are manufactured. It is applicable to the process to be manufactured. Further, here, the manufacturing process of the camera module 500A will be described while showing the change in the state of one cross section in the same manner as shown in FIG.

  In step ST1, steps ST11 to ST14 shown in FIG. 37 are performed.

  Specifically, fabrication of the lens group 200 (step ST11), members corresponding to the first and second frame layers 11 and 13 (first and second frame members) and members corresponding to the lens position adjustment layer 16 ( Lens position adjusting member) (step ST12), a sheet in which the first parallel springs are arranged in a two-dimensional matrix (first parallel spring sheet) and a second parallel spring are arranged in a two-dimensional matrix. A sheet (second parallel spring sheet) (step ST13) and a sheet (image sensor substrate sheet) 178UA (FIG. 11) in which the image sensor board 178A is two-dimensionally arranged in a matrix (step ST14). Is done.

  In step ST11, the plurality of lens groups 200 are not manufactured in the form of a sheet in which the plurality of lens groups 200 are arranged, but in the form of individual chips that are not connected to each other. To be prepared. Further, in step ST12, the plurality of first frame members corresponding to the plurality of first frame layers 11 are not manufactured in a sheet-like form in which the plurality of first frame members are arranged, but mutually. It is prepared by being produced in the form of individual chips that are not connected. In addition, the plurality of second frame members corresponding to the plurality of second frame layers 13 are not formed in a sheet form in which the plurality of second frame members are arranged, but are not connected to each other. It is prepared by being manufactured in the form of individual chips. Further, the plurality of lens position adjusting members corresponding to the plurality of lens position adjusting layers 16 are not formed in a sheet form in which the plurality of lens position adjusting members are arranged, but are not connected to each other. It is prepared by being manufactured in the form of individual chips.

  In step ST2, the manufacturing process of steps ST21 to ST28 shown in FIG. 38 is executed.

  Specifically, in step ST21, as shown in FIG. 39, a jig 100A for manufacturing the camera module 500A is installed. Compared with the jig 100 according to the first embodiment, the jig 100A is configured such that each of the recessed portions 100H is changed to a recessed portion 100HA in which a protrusion TK is provided at the center. Note that the upper end of the protrusion TK is smooth and substantially parallel to the bottom surface of the recess 100HA.

  In step ST22, as shown in FIG. 40, the plurality of first frame members 11 prepared in step ST12 are arranged on the jig 100A. Here, each first frame member 11 is fitted into each recess 100HA of the jig 100A.

  In step ST23, as shown in FIG. 41, the first parallel spring sheet 12U prepared in step ST13 is joined to the upper surfaces of the plurality of first frame members 11 arranged in step ST22. At this time, portions corresponding to the first parallel springs 12 constituting one camera module 500 </ b> A are stacked on each first frame member 11.

  In step ST24, as shown in FIG. 42, the second frame member 13 corresponding to the second frame layer 13 prepared in step ST12 is formed on the upper surface of the first parallel spring sheet 12U joined in step ST23. Arranged and joined. At this time, the second frame member 13 is laminated on the portions corresponding to the first parallel springs 12 constituting the camera module 500A.

  In step ST25, as shown in FIG. 43, the plurality of lens groups 200 prepared in step ST11 are arranged and joined to the upper surface of the first parallel spring sheet 12U joined in step ST23. Here, the end surfaces of the second protrusions 202 of the lens group 200 are joined to the portions corresponding to the first parallel springs 12 constituting the camera module 500A and supported by the protrusions TK, respectively. At this time, the lens group 200 is disposed in the hollow portion of each second frame member 13.

  In step ST26, as shown in FIG. 44, the upper surfaces of the plurality of second frame members 13 arranged in step ST24 and the non-lens portions of the lens group 200 arranged in step ST25 are prepared in step ST13. The second parallel spring sheet 14U is joined. At this time, portions corresponding to the second parallel springs 14 constituting one camera module 500 </ b> A are stacked on each second frame member 13.

  In step ST27, as shown in FIG. 45, the actuator layer sheet 15U prepared in step ST13 is joined to the upper surface of the second parallel spring sheet 14U joined in step ST26. At this time, a portion corresponding to the actuator layer 15 constituting one camera module 500A is laminated on a portion corresponding to each second parallel spring 14 constituting each camera module 500A. Then, the vicinity of the free ends FT of the movable portions 15 a and 15 b of the actuator layer 15 is in contact with the end surface of the first protrusion 201 of the lens group 200.

  At this point, the optical unit OUA including the first frame layer 11, the first parallel spring 12, the second frame layer 13, the lens group 200, the second parallel spring 14, and the actuator layer 15 is formed. That is, in steps ST21 to ST27, a plurality of first and second frame layers 11 and 13 corresponding to lens support members are disposed on the jig 100A, and the first and second frame layers 11 and 13 are disposed on the first and second frame layers 11 and 13, respectively. On the other hand, an assembly of optical units OUA in which the relative positions of the plurality of optical units OUA are fixed on the jig 100A by attaching the lens group 200 via the first and second parallel springs 12 and 14. (Optical unit assembly) is formed.

  In step ST28, as shown in FIG. 46, a plurality of lens position adjusting members 16 are arranged and bonded to the actuator layer sheet 15U bonded in step ST27. At this time, the lens position adjusting member 16 is laminated on the portion corresponding to the actuator layer 15 constituting one camera module 500 </ b> A, and the end surface of the protrusion 162 of the lens position adjusting member 16 is the lens group 200. Abuts against the non-lens portion. However, in order to secure a space in which the lens group 200 moves by the contact of the lens position adjusting member 16 with the lens group 200, for example, a plurality of lens position adjusting members 16 are bonded to the actuator layer sheet 15U. Before, the optical unit aggregate is changed from the state of being placed on the jig 100A to the state of being placed on the jig 100.

  Next, in step ST3 of FIG. 36, the imaging sensor substrate sheet 178UA and the optical unit assembly are bonded using an adhesive or the like. FIG. 47 shows a state in which the optical unit assembly is fixed to the imaging sensor substrate sheet 178UA so that the optical unit OUA is fixed to each imaging sensor substrate 178A based on the state shown in FIG. FIG.

  In step ST4, the optical unit assembly is detached from the jig 100 and separated. At this time, FIG. 48 is a view showing a state in which the jig 100 is removed based on the state shown in FIG. As shown in FIG. 48, the relative positional relationship in which the plurality of optical units OUA constituting the optical unit aggregate are arranged in a matrix is maintained by the presence of the imaging sensor substrate sheet 178U and the like.

  In step ST5, the imaging sensor substrate sheet 178UA is divided for each imaging sensor substrate 178A by cutting by dicing. Here, as shown in FIG. 48, a portion indicated by a thick broken line CLA is cut by dicing, whereby a plurality of units each including an imaging sensor substrate 178A and an optical unit OUA are produced. At this time, in addition to the imaging sensor substrate sheet 178UA, the thin film-like first and second parallel spring sheets 12U and 14U and the actuator layer sheet 15U are cut. However, since the first and second parallel spring sheets 12U and 14U and the actuator layer sheet 15U are very thin, the image sensor board sheet 178UA is mainly cut.

  In step ST6, the plurality of camera modules 500A are completed by attaching the lid layer 10 to each of the plurality of units manufactured in step ST5 using an adhesive or the like. The lid layer 10 may be attached between step ST4 and step ST5, for example, from the viewpoint of preventing the lens group 200 from being soiled.

  As described above, according to the manufacturing method of the camera module 500A according to the second embodiment, the plurality of optical units OUA that are connected to each other by several thin films are fixed to the imaging sensor substrate sheet 178UA. The For this reason, as in the first embodiment, by simplifying the cutting process, the resin layer is swollen by the cooling water at the time of cutting, and the inspection for checking whether there is a difference in optical performance before and after cutting due to the load at the time of cutting. Inconveniences such as occurrence of necessity of the process are suppressed. As a result, the manufacturing of the camera module can be facilitated.

  Further, similar to the jig 100 according to the first embodiment, the jig 100A is provided with a step at a position where the first frame member 11 is disposed on the jig 100A. For this reason, arrangement | positioning of the some 1st frame member 11 on the jig | tool 100A becomes easy, and manufacture of the camera module 500 becomes easy.

<(3) Modification>
It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

  For example, in the second embodiment, the plurality of optical units OUA are fixed to the imaging sensor substrate sheet 178UA in a state where they are connected to each other by several thin films. However, the present invention is not limited to this. For example, a plurality of optical devices each including a lid layer 10, a first frame layer 11, a first parallel spring 12, a second frame layer 13, a second parallel spring 14, an actuator layer 15, a lens position adjustment layer 16, and a lens group 200. The system unit KB is prepared in advance, and a plurality of the optical system units KB are provided as a plurality of optical units OUB in a plurality of recesses 100H on the jig 100 as shown in FIG. The optical unit assembly may be formed by arranging the optical unit OUB.

  In such an embodiment, as shown in FIG. 50, the imaging sensor substrate sheet 178UA and the optical unit assembly are joined by an adhesive or the like, and the portion indicated by the thick broken line CLB is dicing as shown in FIG. A plurality of units each including the imaging sensor substrate 178A and the optical unit OUB are produced.

  In the second embodiment, the actuator layer 15 generates the driving force by bending the movable portions 15a and 15b. However, the present invention is not limited to this. For example, an optical lens is bonded to a member that supports the lens (lens support member), and a large number of optical units are prepared in which piezoelectric elements that expand and contract along the optical axis of the optical lens are connected to the lens support member. An optical unit assembly may be formed by arranging the multiple optical units on the jig 100.

  In the first embodiment, the lens group 200 is directly supported by the lens support frame 170 as a lens support portion. In the second embodiment, the first and second frame layers 11 as lens support portions. , 13 indirectly supports the lens group 200 via the first and second parallel springs 12, 14 which are other members. That is, the optical lens may be directly supported by the lens support portion, or may be indirectly supported via another member.

  In the first and second embodiments described above, the side surfaces forming the lens support frame 170 as the lens support portion and the first and second frame layers 11 and 13 are mainly composed of four large side surfaces, and are adjacent to each other. However, the present invention is not limited to this. For example, the lens support frame 170 and the corners of the side surfaces of the first and second frame layers 11 and 13 may be formed with a surface that is chamfered in a flat or curved shape.

  Here, with reference to the lens support frame 170, a description will be given by showing a specific modification example in which the side surface includes four relatively large surfaces and relatively small one to three surfaces. Here, similarly to the lens support frame 170 according to the first embodiment, the lens support frames 170C to 170G according to the respective modifications have a cylindrical shape having a hollow portion 170H penetrating from the upper surface to the lower surface. It will be explained as a thing.

○ First modification of the lens support frame:
FIG. 52 is a top view showing the configuration of the lens support frame 170C formed with one relatively small side surface, and FIG. 53 is a side view showing the configuration of the lens support frame 170C.

  As shown in FIGS. 52 and 53, the side surface of the lens support frame 170C has a first surface S1C, a second surface S2C, a third surface S3C, a fourth surface S4C, and a fifth surface S5C that are sequentially provided. . Further, the first to fourth surfaces S1C to S4C are sequentially provided with a substantially vertical relationship. The fifth surface S5C is provided with an obtuse angle with respect to the first to fourth surfaces S1C to S4C, respectively, and has an area smaller than any of the first to fourth surfaces S1C to S4C.

  When the side surface of the lens support frame 170C has such a configuration, for example, if the plurality of lens support frames 170C are arranged on the jig 100 so that the fifth surface S5C is directed in a certain direction. By referring to the orientation of the lens support frame 170C, it is possible to grasp the vertical and horizontal directions of the camera module as a finished product.

  Therefore, in the process of forming the optical unit assembly, the lens surface is supported by adopting a configuration in which the plurality of lens support frames 170C are arranged on the jig 100 with the fifth surface S5C as a reference. The posture in which the frame 170C should be arranged can be easily grasped. As a result, the manufacturing of the camera module can be facilitated, and, for example, when the camera module is mounted on various devices, it is possible to grasp the posture where the camera module should be arranged.

  52 and 53 show an example in which the fifth surface S5C is configured by a flat surface, the fifth surface S5C may be a curved surface. In other words, one of the four main corners formed by the side surface of the lens support frame 170C is configured to be distinguishable from the other corners by using a flat surface or a curved surface. It ’s fine. That is, one of the four main corners formed by the side surface of the lens support frame 170C may have various characteristic shapes that can be distinguished from other corners such as a notch. good. Moreover, although the example in which 1st-4th surface S1C-S4C has a smooth plane was shown here, it is not restricted to this, You may have some unevenness | corrugations.

○ Second modification of the lens support frame:
FIG. 54 is a top view showing a configuration of a lens support frame 170D formed with two relatively small side surfaces.

  As shown in FIG. 54, the side surfaces of the lens support frame 170D are provided in order, the first surface S1D, the second surface S2D, the third surface S3D, the fourth surface S4D, the fifth surface S5D, and the sixth surface S6D. Have Also, the first, second, fourth, and sixth surfaces S1D, S2D, S4D, and S6D are sequentially provided with a substantially vertical relationship. Here, the third surface S3D is provided at an obtuse angle with respect to the second and fourth surfaces S2D, S4D, and the first, second, fourth, and sixth surfaces S1D, S2D, S4D, S6D. The area is smaller than any of the surfaces. The fifth surface S5D is provided with an obtuse angle with respect to the fourth and sixth surfaces S4D, S6D, and the first, second, fourth, and sixth surfaces S1D, S2D, S4D, S6D. The area is smaller than any of these surfaces.

  Thus, the side surface of the lens support frame 170D has four main corners by the first, second, fourth, and sixth surfaces S1D, S2D, S4D, and S6D, and two adjacent main corners. The part has a configuration in which the third and fifth surfaces S3D, S5D are provided. When such a configuration is adopted, for example, if a plurality of lens support frames 170D are arranged on the jig 100 so that the third and fifth surfaces S3D, S5D are oriented in a predetermined direction, By referring to the direction of the lens support frame 170D, it is possible to grasp the vertical and horizontal directions of the camera module as a finished product.

  Therefore, in the step of forming the optical unit aggregate, a configuration is adopted in which a plurality of lens support frames 170D are arranged on the jig 100 with the third and fifth surfaces S3D and S5D as a reference. This makes it possible to grasp the posture in which the lens support frame 170D is to be disposed. As a result, the manufacturing of the camera module can be facilitated, and, for example, when the camera module is mounted on various devices, it is possible to grasp the posture where the camera module should be arranged.

○ Third modification of the lens support frame:
FIG. 54 shows an example in which the third and fifth surfaces S3D and S5D are configured by planes, but at least one of the third and fifth surfaces S3D and S5D may be a curved surface. . For example, as shown in FIG. 55, the lens support frame 170D may be changed to a lens support frame 170E in which the third surface S3D is changed to a third surface S3E having a curvature. At this time, the third surface S3E and the fifth surface S5D have different areas and shapes.

  If the third surface and the fifth surface provided at two adjacent corners constituting the side surface of the lens support frame are surfaces having different areas and shapes, the lens support frame The posture to be placed and the front and back can be grasped. For this reason, manufacture of a camera module can be facilitated. Further, for example, when the camera module is mounted on various devices, it is possible to grasp the posture in which the camera module should be arranged.

  Thus, two adjacent corners of the four main corners formed by the side surfaces of the lens support frame are configured in a manner that can be distinguished from other corners by using a flat surface, a curved surface, or the like. Just do it. That is, of the four main corners formed by the side surface of the lens support frame, two adjacent corners have various characteristic shapes that can be distinguished from other corners such as notches. Also good. In addition, here, an example in which the first, second, fourth, and sixth surfaces S1D, S2D, S4D, and S6D have a smooth plane is shown, but the present invention is not limited to this, and has some unevenness. May be.

○ Fourth modification of the lens support frame:
FIG. 56 is a top view showing a configuration of a lens support frame 170F in which three relatively small side surfaces are formed.

  As shown in FIG. 56, the side surfaces of the lens support frame 170F are provided in order, the first surface S1F, the second surface S2F, the third surface S3F, the fourth surface S4F, the fifth surface S5F, the sixth surface S6F, And a seventh surface S7F. The first, second, fourth, and sixth surfaces S1F, S2F, S4F, and S6F are sequentially provided with a substantially vertical relationship. Here, the third surface S3F is provided with an obtuse angle with respect to the second and fourth surfaces S2F, S4F, and the first, second, fourth, and sixth surfaces S1F, S2F, S4F, S6F. The area is smaller than any of the surfaces. Further, the fifth surface is provided with an obtuse angle with respect to the fourth and sixth surfaces S4F, S6F, and among the first, second, fourth, and sixth surfaces S1F, S2F, S4F, S6F The area is smaller than any of these surfaces. Further, the seventh surface is provided with an obtuse angle with respect to the sixth and first surfaces S6F, S1F, and among the first, second, fourth, and sixth surfaces S1F, S2F, S4F, S6F The area is smaller than any of these surfaces.

  Thus, the side surface of the lens support frame 170F has four main corners by the first, second, fourth, and sixth surfaces S1F, S2F, S4F, and S6F, and three adjacent main corners. The third, fifth, and seventh surfaces S3F, S5F, and S7F are provided in the part. When such a configuration is adopted, for example, the plurality of lens support frames 170F are mounted on the jig 100 so that the third, fifth, and seventh surfaces S3F, S5F, and S7F are oriented in a predetermined direction. If the lens module is disposed at the position, the orientation of the lens support frame 170F is referred to, so that it is possible to grasp the vertical and horizontal directions of the camera module as a finished product.

  Accordingly, in the step of forming the optical unit assembly, the third, fifth and seventh surfaces S3F, S5F, S7F are used as a reference, and a plurality of lens support frames 170F are arranged on the jig 100. By adopting the configuration, it is possible to grasp the posture in which the lens support frame 170F is to be disposed. As a result, the manufacturing of the camera module can be facilitated, and, for example, when the camera module is mounted on various devices, it is possible to grasp the posture where the camera module should be arranged.

○ Fifth modification of the lens support frame:
FIG. 56 shows an example in which the third, fifth, and seventh surfaces S3F, S5F, and S7F are configured by planes. Of the third, fifth, and seventh surfaces S3F, S5F, and S7F, FIG. One or more of the surfaces may be curved. For example, as shown in FIG. 57, the lens support frame 170F may be changed to a lens support frame 170G in which the seventh surface S3F is changed to a seventh surface S7G having a curvature. At this time, the areas and shapes of the third and fifth surfaces S3F, S5F and the seventh surface S7G are different from each other.

  And one or more of the third, fifth, and seventh surfaces provided at the three corners constituting the side surface of the lens support frame, and the third, fifth, and seventh surfaces If the other one or more surfaces are surfaces in which at least one of the area and the shape is different from each other, it is possible to grasp the posture and the front and back where the lens support frame should be arranged. For this reason, manufacture of a camera module can be facilitated. Further, for example, when the camera module is mounted on various devices, it is possible to grasp the posture in which the camera module should be arranged.

  Thus, if three corners of the four main corners formed by the side surface of the lens support frame are configured in a manner that can be distinguished from other corners by using a flat surface, a curved surface, or the like. good. That is, three of the four main corners formed by the side surface of the lens support frame may have various characteristic shapes that can be distinguished from other corners such as notches. . In addition, here, an example in which the first, second, fourth, and sixth surfaces S1F, S2F, S4F, and S6F have a smooth plane is shown, but the present invention is not limited to this, and has some unevenness. May be.

  As described above, when a curved surface is provided in at least one main corner portion constituting the side surface of the lens support frame, the curvature radius of the curved surface is 0. 0 of the thickness (for example, 0.5 μm) of the lens support frame. By setting it to about 4 to 1.2 times, it becomes easy to identify the curved surface provided at the corner. This is because, when the lens support frame is formed by resin molding or the like, strictly speaking, a curved surface having a radius of curvature of about 0.2 times the wall thickness of the lens support frame tends to occur at the corners. It is. Note that the radius of curvature of the curved surface is about 0.7 to 0.9 times the thickness of the lens support frame in order to satisfy the balance between easy identification of the curved surface and ensuring the strength by the thickness of the lens support frame. Is preferable, and is more preferably set to about 0.8 times.

  In the second embodiment, the side surface wiring 21 is provided on the side surface of the camera module 500A by a printing technique or the like. However, the present invention is not limited to this. For example, as shown in FIG. 58, in the camera module 500A, the lens position adjusting layer 16 is changed to the lens position adjusting layer 16H provided with the recessed portion 21H on the side surface, and the recessed portion 21H is filled with a conductive material. Thus, the camera module 500H in which a wiring portion that electrically connects the actuator layer 15H and the imaging sensor substrate 178H (specifically, the imaging element layer 18H) may be formed. In such a configuration, the lens position adjustment layer 16H functions as a part constituting the lens support portion.

  FIG. 59 is a schematic top view showing the configuration of the lens position adjusting layer 16H. The lens position adjustment layer 16H is provided with a groove-like recess 21H along the Z axis on the side surface on the −Y side with respect to the lens position adjustment layer 16 (FIG. 26) according to the second embodiment. The side wiring is formed by filling the portion 21H with the conductive material. The recess 21H may be formed by resin molding or the like when the lens position adjustment layer 16H is manufactured.

  FIG. 60 is a schematic top view showing the configuration of the imaging element layer 18H that constitutes the imaging sensor substrate 178H. The imaging element layer 18H is provided with terminal portions 18a and 18b with respect to the imaging element layer 18 according to the second embodiment.

  FIG. 61 is a schematic top view showing the configuration of the cover glass layer 17H that constitutes the imaging sensor substrate 178H. The cover glass layer 17H is provided with through electrodes 17a and 17b with respect to the cover glass layer 17 according to the second embodiment.

  FIG. 62 is a top view showing the configuration of the actuator layer 15H. The actuator layer 15H has a high thermal expansion layer 151, a heat conductive layer 152, a low thermal expansion layer 153, and an insulating layer in the vicinity of both ends on the −Y side of the heater layer 155 with respect to the actuator layer 15 according to the second embodiment. Through-electrodes 1551a and 1553b penetrating 154 are provided.

  The heater layer 155 and the imaging element layer 18H are electrically connected to the terminal portions 18a and 18b and the through electrodes 1551a and 1553b via the side wiring formed in the recessed portion 21H and the through electrodes 17a and 17b. Connected.

  If such a configuration is adopted, it is easy to dispose wiring for supplying power to the actuator layer 15H by electrically connecting the imaging element layer 18H and the actuator layer 15H. Manufacturing is easy. In addition, the configuration of electrical connection using leads is reduced, and the camera module can be downsized.

  Further, for example, if a configuration in which the side wiring is formed by filling the recess 21H with the conductive material when the lens position adjusting member corresponding to the lens position adjusting layer 16H is formed is as follows. It is possible to adopt a simple manufacturing process. When the imaging sensor substrate 178H is bonded to the lens position adjusting layer 16H, a manufacturing process is adopted in which the solder paste provided on the through electrodes 17a and 17b and the side wiring are electrically connected. Is possible. If such a manufacturing process is adopted, the camera module can be easily manufactured.

  It is also conceivable to form side wiring by filling the recess 21H with a conductive material after the dicing process.

  In the first and second embodiments, the jigs 100 and 100A are provided with the plurality of recessed portions 100H in which the plurality of lens support frames 170 and the plurality of first frame members 11 are disposed. Not limited to. For example, a protrusion that defines the position of two adjacent side surfaces of each lens support frame 170 or the position of two adjacent side surfaces of each first frame member 11 may be provided.

  FIG. 63 is a perspective view schematically showing the appearance of a jig 100I in which a plurality of L-shaped projections 100HI defining the positions of two adjacent side surfaces of each lens support frame 170 are arranged. As described above, the jig in which the plurality of lens support frames 170 and the plurality of first frame members 11 are arranged is at a position on the jig where the plurality of lens support frames 170 and the plurality of first frame members 11 are arranged. What is necessary is just to be comprised so that it may have a level | step difference part containing a dent part, a projection part, etc. FIG. In other words, it is only necessary to provide stepped portions that define the positions where the outer edge portions (side surfaces) on the side of the plurality of lens support frames 170 and the plurality of first frame members 11 are disposed.

  In the first and second embodiments, the plurality of lens support frames 170 and the plurality of first frame members 11 are arranged on the jigs 100 and 100A while being provided with a predetermined interval. Not limited to. For example, a configuration in which a plurality of lens support frames 170 and a plurality of first frame members 11 are arranged so as to be closely arranged so as to be spread is also conceivable.

  In the first and second embodiments, the optical units OU and OUA are joined to the imaging sensor substrate sheets 178U and 178UA without going through the dicing process. However, the present invention is not limited to this. For example, in a wafer state, a sheet in which a large number of optical units OU and OUA are arranged is formed, and the sheet is divided by dicing to produce a large number of optical units OU and OUA. It is also conceivable that OU and OUA are arranged on the jig 100, the imaging sensor substrate sheets 178U and 178UA are joined, and then a large number of camera modules are manufactured by dicing. When such a manufacturing process is adopted, if the optical characteristics of the optical units OU and OUA are inspected at the time when a large number of optical units OU and OUA are manufactured, the optical process is performed in the subsequent manufacturing process. The possibility that the optical characteristics of the units OU and OUA are deteriorated is reduced. For this reason, simplification of the inspection process and improvement of the yield in the manufacture of the camera module can be achieved.

  In the first and second embodiments, the size of the outer edge in the cross section perpendicular to the optical axis of the imaging sensor substrates 178 and 178A and the size of the outer edge in the cross section perpendicular to the optical axis of the optical units OU and OUA are as follows. Although it was substantially the same, it is not restricted to this. For example, the size of the outer edge in the cross section perpendicular to the optical axis of the imaging sensor substrates 178 and 178A may be relatively small. For example, after the optical units OU and OUA are arranged so as to be in close contact with each other on the jig, the imaging sensor substrate sheet is joined, and the imaging sensor substrate sheet is cut by dicing, so that the cutting allowance is achieved. However, the size of the outer edge in the cross section perpendicular to the optical axis of the imaging sensor substrates 178 and 178A is relatively smaller than the size of the outer edge in the cross section perpendicular to the optical axis of the optical units OU and OUA. When such a configuration is adopted, for example, it becomes easy to secure the volume of the hollow portions of the optical units OU and OUA, so that the manufacture of the optical units OU and OUA is facilitated, or the optical system is driven. Is easy to manufacture. In addition, since it is possible to increase the thickness of the member that supports the optical lens, there is an advantage that it is easy to ensure the rigidity necessary when driving the optical system.

  Of course, it is needless to say that all or part of the configurations of the first and second embodiments and various modifications may be combined as appropriate within a consistent range.

1,1A mobile phone 11 first frame layer (first frame member)
13 Second frame layer (second frame member)
15, 15H Actuator layer 15U Actuator layer sheet 16, 16H Lens position adjustment layer (lens position adjustment member)
18, 18A, 18H Image sensor layer 20 Optical lens part 21H Recessed part 100, 100A, 100I Jig 100H, 100HA Recessed part 100HI Protrusion part 170, 170C-170G Lens support frame 178, 178A, 178H Image sensor board 178U, 178UA Imaging Sensor substrate sheet 181 Imaging element 200 Lens group 500, 500A, 500H Camera module OU, OUA, OUB Optical unit S1C, S1D, S1F First surface S2C, S2D, S2F Second surface S3C, S3D, S3E, S3F Third surface S4C , S4D, S4F 4th surface S5C, S5D, S5F 5th surface S6D, S6F 6th surface S7F, S7G 7th surface

Claims (16)

By dividing a lens assembly in which optical lenses are respectively arranged so as to correspond to the respective image sensors with respect to a sensor substrate on which a plurality of image sensors are two-dimensionally arranged, by dividing each lens image sensor by cutting. A camera module manufacturing method for manufacturing a camera module of
A plurality of optical lens portions that are not connected to each other, and a plurality of lens support members that are not connected to each other to support the plurality of optical lens portions directly or indirectly via other members, and A preparation step of preparing the sensor substrate;
An optical unit assembly including a plurality of optical units each having the optical lens portion and the lens support member is formed by arranging the plurality of lens support members and the plurality of optical lens portions on a jig. Forming process to
A fixing step of fixing the optical unit assembly to the sensor substrate;
A method for manufacturing a camera module, comprising: It is a manufacturing method of the camera module according to claim 1,
In the forming step,
A camera module, wherein the plurality of lens support members are arranged on the jig, and the optical unit assembly is formed by attaching the optical lens portion to each of the lens support members. Manufacturing method. It is a manufacturing method of the camera module according to claim 1,
Each lens support member prepared in the preparation step,
A method of manufacturing a camera module, wherein the optical lens unit is supported directly or indirectly via another member. A method for manufacturing a camera module according to any one of claims 1 to 3,
The side surface of the lens support member is
Having a first surface, a second surface, a third surface, a fourth surface, and a fifth surface provided in sequence,
The first to fourth surfaces are
It is provided with a substantially vertical relationship sequentially,
The fifth surface is
The obtuse angle is provided with respect to each of the first and fourth surfaces, and the area is smaller than any of the first to fourth surfaces,
In the forming step,
The method of manufacturing a camera module, wherein the plurality of lens support members are arranged on the jig with reference to the position of the fifth surface. A method for manufacturing a camera module according to any one of claims 1 to 3,
The side surface of the lens support member is
The first surface, the second surface, the third surface, the fourth surface, the fifth surface, and the sixth surface that are sequentially provided,
The first, second, fourth and sixth surfaces are
It is provided with a substantially vertical relationship sequentially,
The third surface is
An obtuse angle with respect to each of the second and fourth surfaces, and an area smaller than any of the first, second, fourth, and sixth surfaces;
The fifth surface is
An obtuse angle with respect to each of the fourth and sixth surfaces, and an area smaller than any of the first, second, fourth, and sixth surfaces;
In the forming step,
A method of manufacturing a camera module, comprising: arranging the plurality of lens support members on the jig with reference to positions of the third and fifth surfaces. It is a manufacturing method of the camera module according to claim 5,
The method for manufacturing a camera module, wherein the third surface and the fifth surface are surfaces having different areas and / or shapes. A method for manufacturing a camera module according to any one of claims 1 to 3,
The side surface of the lens support member is
A first surface, a second surface, a third surface, a fourth surface, a fifth surface, a sixth surface, and a seventh surface, which are sequentially provided;
The first, second, fourth and sixth surfaces are
It is provided with a substantially vertical relationship sequentially,
The third surface is
An obtuse angle with respect to each of the second and fourth surfaces, and an area smaller than any of the first, second, fourth, and sixth surfaces;
The fifth surface is
An obtuse angle with respect to each of the fourth and sixth surfaces, and an area smaller than any of the first, second, fourth, and sixth surfaces;
The seventh surface is
The obtuse angle is provided with respect to each of the sixth and first surfaces, and the area is smaller than any one of the first, second, fourth, and sixth surfaces,
In the forming step,
A method of manufacturing a camera module, comprising: arranging the plurality of lens support members on the jig with reference to positions of the third, fifth, and seventh surfaces. It is a manufacturing method of the camera module according to claim 7,
One or two surfaces of the third, fifth, and seventh surfaces and another one or two surfaces of the third, fifth, and seventh surfaces have an area and shape. A method of manufacturing a camera module, wherein at least one of the two is a surface different from each other. A method of manufacturing a camera module according to any one of claims 1 to 8,
In the forming step,
A method of manufacturing a camera module, wherein the plurality of lens support members are arranged in a matrix on the jig. A method for manufacturing a camera module according to any one of claims 1 to 9,
The jig is
A method of manufacturing a camera module, comprising a step portion at a position where each of the lens support members is disposed on the jig. An optical lens unit;
An imaging sensor unit;
A lens support provided for the imaging sensor unit and supporting the optical lens unit directly or indirectly through another member;
With
The side surface of the lens support portion is
Having a first surface, a second surface, a third surface, a fourth surface, and a fifth surface provided in sequence,
The first to fourth surfaces are
It is provided with a substantially vertical relationship sequentially,
The fifth surface is
A camera module, wherein the camera module is provided with an obtuse angle with respect to the first and fourth surfaces, and has an area smaller than any of the first to fourth surfaces. An optical lens unit;
An imaging sensor unit;
A lens support provided for the imaging sensor unit and supporting the optical lens unit directly or indirectly through another member;
With
The side surface of the lens support portion is
The first surface, the second surface, the third surface, the fourth surface, the fifth surface, and the sixth surface that are sequentially provided,
The first, second, fourth and sixth surfaces are
It is provided with a substantially vertical relationship sequentially,
The third surface is
An obtuse angle with respect to each of the second and fourth surfaces, and an area smaller than any of the first, second, fourth, and sixth surfaces;
The fifth surface is
Each of the fourth and sixth surfaces is provided with an obtuse angle, and has an area smaller than any of the first, second, fourth, and sixth surfaces. The camera module. The camera module according to claim 12, wherein
The camera module, wherein the third surface and the fifth surface are surfaces different from each other in at least one of area and shape. An optical lens unit;
An imaging sensor unit;
A lens support provided for the imaging sensor unit and supporting the optical lens unit directly or indirectly through another member;
With
The side surface of the lens support portion is
A first surface, a second surface, a third surface, a fourth surface, a fifth surface, a sixth surface, and a seventh surface, which are sequentially provided;
The first, second, fourth and sixth surfaces are
It is provided with a substantially vertical relationship sequentially,
The third surface is
An obtuse angle with respect to each of the second and fourth surfaces, and an area smaller than any of the first, second, fourth, and sixth surfaces;
The fifth surface is
An obtuse angle with respect to each of the fourth and sixth surfaces, and an area smaller than any of the first, second, fourth, and sixth surfaces;
The seventh surface is
Each of the sixth and first surfaces is provided with an obtuse angle, and has an area smaller than any of the first, second, fourth, and sixth surfaces. The camera module. The camera module according to claim 14,
One or two surfaces of the third, fifth, and seventh surfaces and another one or two surfaces of the third, fifth, and seventh surfaces have an area and shape. A camera module, wherein at least one of the surfaces is different from each other. An optical lens unit;
An imaging sensor unit;
A lens support provided for the imaging sensor unit and supporting the optical lens unit directly or indirectly through another member;
An actuator unit for moving the optical lens unit along the optical axis of the optical lens unit;
A wiring portion that is provided in a recessed portion on a side surface of the lens support portion and electrically connects the actuator portion and the imaging sensor portion;
A camera module comprising:

Images