JP5115510B2 - Imaging device, optical unit, and manufacturing method of imaging device - Google Patents

Description

  The present invention relates to a small imaging device, an optical unit, and a manufacturing method of the imaging device.

  In recent years, small electronic devices (for example, mobile phones) to which a photographing function is added by mounting a micro camera unit (MCU) are rapidly spreading. Accordingly, further miniaturization is desired for the camera module used in the MCU.

  In a conventional camera module, a lens barrel and a lens holder that support a lens, a holder that supports an infrared (IR) cut filter, a substrate, an image sensor, and a casing that holds a laminate including optical elements, such a stack A resin or the like for sealing the body is required. For this reason, it has been difficult to reduce the size of the above-mentioned many parts and to produce a camera module by accurately combining the parts.

  For such problems, a laminated member is formed by attaching a substrate, a semiconductor sheet on which a large number of imaging elements are formed, and a lens array sheet on which a large number of imaging lenses are formed through a resin layer, A technique for dicing the laminated member to complete each camera module has been proposed (for example, Patent Document 1).

JP 2007-12995 A

  However, in the technique of Patent Document 1, a camera module is formed by laminating a layer including an image sensor, a layer including a lens, and the like in a wafer state (at the wafer level). For this reason, it is difficult to form a drive mechanism for moving a lens for realizing a function such as autofocus or zoom in the camera module.

  Further, if a driving mechanism for moving the lens is formed, it is necessary to supply power to the driving mechanism while suppressing an increase in size of the camera module and the optical unit constituting the camera module. However, in order to supply electric power to the drive mechanism through different layers, there are many manufacturing problems such as ensuring conduction between layers and improving manufacturing efficiency.

  An object of the present invention is to provide a technology capable of achieving both enhancement of functions of a small-sized imaging device and an optical unit driven by a lens and overcoming of manufacturing problems such as ensuring conduction and improving manufacturing efficiency. .

  In order to solve the above-mentioned problems, the invention of claim 1 includes an imaging element layer having an imaging element part, a lens layer whose distance from the imaging element layer can be changed, and a movable part that moves the lens layer. A laminated structure formed by laminating a plurality of layers including an actuator layer, and a signal transmission unit that transmits a drive signal for driving the movable unit from the imaging element layer side to the actuator layer. In the imaging apparatus, a side portion of the stacked structure is configured by a plurality of cut surfaces, and the actuator layer transmits the drive signal from the outside of the actuator layer to the movable portion side. A drive electrode exposed on the surface, and the imaging element layer includes a supply electrode exposed on the cut surface that transmits the drive signal from the imaging element layer side to the drive electrode side. A Luo, the signal transmitting unit so as to be electrically conductive with each of the drive electrode and the supply electrode, characterized in that it is arranged on the cutting surface.

  The invention according to claim 2 is the imaging apparatus according to claim 1, wherein the actuator layer is provided with an intra-layer wiring for supplying the drive signal to the movable part, and the drive electrode is The end portion of the in-layer wiring is exposed to the cut surface to form a part of the cut surface.

  The invention according to claim 3 is the imaging apparatus according to claim 1, wherein the actuator layer includes an intra-layer wiring that supplies the driving signal to the movable part, and an electrical connection between the intra-layer wiring and the inner layer wiring. A through electrode that penetrates the actuator layer from the intra-layer wiring to the outside of the actuator layer while being conductive is provided, and the drive electrode has a part of the through electrode exposed to the cut surface, A part of the cut surface is formed.

  According to a fourth aspect of the present invention, there is provided the imaging apparatus according to the first aspect, wherein the signal transmission unit is provided on only one of the plurality of cut surfaces.

  Further, the invention of claim 5 is the imaging apparatus according to claim 1, wherein the plurality of layers are interposed between the lens layer and the actuator layer so as to support the lens layer movably. The elastic member layer further includes a cutout portion provided with an insulating portion that electrically insulates the elastic member layer and the signal transmission portion at an outer edge of the elastic member layer. It is characterized by that.

  Further, the invention of claim 6 is a laminated structure formed by laminating a plurality of layers including a lens layer that is movably supported and an actuator layer having a movable part that moves the lens layer, A signal transmission unit configured to transmit a driving signal for driving the movable unit from the outside of the multilayer structure to the actuator layer, wherein a side portion of the multilayer structure is formed by a plurality of cut surfaces. The actuator layer further includes a drive electrode exposed to the cut surface that transmits the drive signal from the outside of the actuator layer to the movable part side, and the signal transmission unit includes the drive electrode and the drive electrode. The electrode is disposed on the cut surface so as to be electrically conductive.

  The invention according to claim 7 is the optical unit according to claim 6, wherein the actuator layer is provided with an intra-layer wiring for supplying the drive signal to the movable part, and the drive electrode is The intra-layer wiring is exposed to the cut surface to form a part of the cut surface.

  The invention according to claim 8 is the optical unit according to claim 6, wherein the actuator layer includes an intra-layer wiring that supplies the driving signal to the movable part, and an electrical connection between the intra-layer wiring and the intra-layer wiring. A through electrode that penetrates the actuator layer from the intra-layer wiring to the outside of the actuator layer while being conductive is provided, and the drive electrode has a part of the through electrode exposed to the cut surface, A part of the cut surface is formed.

  According to a ninth aspect of the present invention, in the optical unit according to the sixth aspect, the signal transmission unit is provided on only one of the plurality of cut surfaces.

  The invention of claim 10 is the optical unit according to claim 6, wherein the plurality of layers are interposed between the lens layer and the actuator layer so as to movably support the lens layer. The elastic member layer further includes a cutout portion provided with an insulating portion that electrically insulates the elastic member layer and the signal transmission portion at an outer edge of the elastic member layer. It is characterized by that.

  The invention of claim 11 includes an image sensor layer having an image sensor section, a lens layer capable of changing a distance from the image sensor layer, and an actuator layer having a movable section for moving the lens layer. A laminated structure formed by laminating a plurality of layers, and disposed between the actuator layer and the imaging element layer, and a drive signal for driving the movable portion is transmitted from the imaging element layer side to the actuator layer. A plurality of image sensor substrate sheets having a plurality of the image sensor element layers, and an actuator layer sheet having a plurality of the actuator layers. And a plurality of the lens layers arranged to form a laminated member, and the laminated member is separated into individual pieces by cutting. A dicing step of creating a device, wherein in the dicing step, a plurality of the imaging devices are arranged in a line, and the signal transmission unit is disposed along a cut surface of the laminated member. .

  According to the inventions of claims 1 to 5 and claim 11, a laminated structure in which a plurality of functional element array layers each including an array of functional elements such as an imaging element, a lens, and an actuator are laminated is obtained by dicing. In an imaging device created at the wafer level by dividing into individual pieces, a signal transmission unit can be provided on a cut surface formed in the dicing process. Therefore, it is necessary to provide a signal transmission unit through the stacked structure. Therefore, the signal transmission part can be easily created.

  According to the second aspect of the present invention, the in-layer wiring disposed in the functional layer including the actuator array and transmitting the drive signal to the movable part of the actuator layer is cut by dicing, so that the cut surface of the imaging device Since the exposed part can be used as a drive electrode for electrically connecting the signal transmission part and the in-layer wiring, the drive electrode can be easily manufactured.

  According to the third aspect of the present invention, the actuator is provided in the actuator array layer, which is a functional layer including the actuator array, from the internal wiring that transmits the drive signal to the movable part of the actuator layer, to the outside of the actuator array layer. A drive for electrically connecting the signal transmission unit and the in-layer wiring at a portion exposed to the cut surface of the imaging device by creating a through electrode penetrating the array layer and cutting the through electrode by dicing Since the electrode can be used, the area of the drive electrode can be increased, and the signal transmission portion and the in-layer wiring can be more reliably electrically connected.

  According to invention of Claim 4, when the strip-shaped cut surface which the some imaging device exposed to the one-dimensional array form was formed in the dicing process of the laminated structure in which the several functional element array layer was laminated | stacked Since all the signal transmission units required for each imaging device can be provided at a time for all the imaging devices exposed on the cut surface of the laminated structure, the manufacturing efficiency of the imaging device can be improved.

  According to the invention of claim 5, in the step of laminating and joining the actuator array layer and the parallel spring array layer, each imaging device is provided at the outer edge of the parallel spring layer of each imaging device after being separated into pieces. An insulating portion that electrically insulates the parallel spring layer and the signal transmission portion can be provided in the hole portion of the parallel spring array layer provided with a plurality of holes to be cutout portions. The insulating part can be provided without requiring a new process for providing the insulating part in the stacking step, and the manufacturing efficiency of the imaging device can be improved.

  According to the inventions of claims 6 to 10, the laminated structure in which a plurality of functional element array layers each including an array of functional elements such as lenses and actuators are laminated is separated into individual pieces by dicing, thereby obtaining a wafer level. In the optical unit created in step (1), since the signal transmission part can be provided on the cut surface formed in the dicing process, there is no need to provide the signal transmission part through the laminated structure, and the signal transmission part can be created. It becomes easy.

  According to the seventh aspect of the present invention, the in-layer wiring disposed in the functional layer including the actuator array and transmitting the drive signal to the movable portion of the actuator layer is cut by dicing, so that the cut surface of the optical unit is cut. Since the exposed part can be used as a drive electrode for electrically connecting the signal transmission part and the in-layer wiring, the drive electrode can be easily manufactured.

  According to the eighth aspect of the present invention, the actuator is arranged in the actuator array layer, which is a functional layer including the actuator array, and transmits the drive signal to the movable part of the actuator layer to the outside of the actuator array layer. A drive for electrically connecting the signal transmission portion and the in-layer wiring at a portion exposed to the cut surface of the optical unit by creating a through electrode penetrating the array layer and cutting the through electrode by dicing. Since the electrode can be used, the area of the drive electrode can be increased, and the signal transmission portion and the in-layer wiring can be more reliably electrically connected.

  According to the invention of claim 9, when the strip-shaped cut surface in which the plurality of optical units are exposed in a one-dimensional array is formed in the dicing process of the stacked structure in which the plurality of functional element array layers are stacked. Since all the signal transmission parts required for each optical unit can be provided at once for all the optical units exposed on the cut surface of the laminated structure, the manufacturing efficiency of the optical unit can be improved.

  According to the invention of claim 10, in the step of laminating and joining the actuator array layer and the parallel spring array layer, each optical unit is separated into individual pieces and then provided on the outer edge of the parallel spring layer of each optical unit. An insulating portion that electrically insulates the parallel spring layer and the signal transmission portion can be provided in the hole portion of the parallel spring array layer provided with a plurality of holes to be cutout portions. The insulating part can be provided without requiring a new process for providing the insulating part in the stacking step, and the manufacturing efficiency of the optical unit can be improved.

It is a schematic diagram which shows schematic structure of the mobile telephone carrying the camera module which concerns on embodiment of this invention. It is a cross-sectional schematic diagram which paid its attention to the 1st housing | casing which concerns on embodiment of this invention. It is a cross-sectional schematic diagram of the camera module which concerns on embodiment of this invention. 1 is a side external view of a camera module according to an embodiment of the present invention. It is a cross-sectional schematic diagram of a lens group. It is a cross-sectional schematic diagram of a lens group. It is a lower surface external view of a 1st lens structure layer. It is an upper surface external view of a 2nd lens structure layer. It is a figure for demonstrating the shape of a spacer layer. It is an upper surface external view of an image sensor layer. It is a cross-sectional schematic diagram of an image pick-up element layer. It is an upper surface external view of a lens position adjustment layer. It is a side external view of a lens position adjustment layer. It is an upper surface external view of an actuator layer. It is a side external view of an actuator layer. It is a figure for demonstrating the detailed structural example of an actuator layer. It is a figure for demonstrating the operation example of a movable part. It is a lower surface external view of a 2nd parallel spring. It is a figure which shows the 2nd parallel spring with which the lens group was mounted | worn. It is a lower surface external view of a 1st parallel spring. It is a figure which shows the 1st parallel spring with which the lens group was mounted | worn. It is a flowchart which shows the manufacturing process of a camera module. It is a top view of a lens constituent layer wafer concerning the 1st and 2nd lens constituent layers. It is a top view of the spacer layer wafer which concerns on a spacer layer. It is a figure which shows the mode of preparation of the 1st lens structure layer. It is a figure which shows the mode of preparation of the 2nd lens structure layer. It is a top view which shows the structural example of the sheet | seat to prepare. It is a top view which shows the structural example of a 2nd parallel spring sheet | seat. It is a figure which shows the mode of preparation of an actuator layer sheet | seat. It is a figure which shows the preparation process of an assembly jig. It is a figure which shows typically a mode that the prepared sheet | seat etc. are laminated | stacked and joined. It is a figure which shows the mounting process of a 1st frame layer sheet. It is a figure which shows the joining process of a 1st parallel spring sheet | seat. It is a figure which shows the joining process of a 2nd frame layer sheet. It is a figure which shows the attachment process of a lens group. It is a figure which shows the joining process of a 2nd parallel spring sheet | seat. It is a figure which shows the joining process of an actuator layer sheet | seat. It is a figure which shows the joining process of a cover layer sheet. It is a figure which shows the joining process of a lens position adjustment layer sheet. It is a figure which shows the mode of laying of the side wiring in a dicing process. It is a figure which shows the mode of laying of the side wiring in a dicing process. It is a cross-sectional schematic diagram of the camera module which concerns on the modification of this invention. It is a side external view of the camera module which concerns on the modification of this invention. It is a figure which shows the modification of the actuator layer which concerns on this invention. It is a figure which shows the mode of preparation of the actuator layer sheet | seat which concerns on a modification.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Schematic configuration of mobile phone>
FIG. 1 is a schematic diagram showing a schematic configuration of a mobile phone 100 equipped with a camera module 500 according to the first embodiment of the present invention. In FIG. 1 and the drawings after FIG. 1, three axes XYZ orthogonal to each other are appropriately attached in order to clarify the orientation relationship.

  As shown in FIG. 1, the mobile phone 100 is configured as a foldable mobile phone, and includes a first housing 200, a second housing 300, and a hinge part 400.

  Each of the first casing 200 and the second casing 300 is a plate-shaped rectangular parallelepiped, and has a role as a casing for storing various electronic members. Specifically, the first casing 200 includes a camera module 500 and a display (not shown), and the second casing 300 includes a control unit that electrically controls the mobile phone 100, buttons, and the like. And an operating member (not shown).

  The hinge part 400 connects the first casing 200 and the second casing 300 so as to be rotatable. For this reason, the mobile phone 100 can be folded.

  FIG. 2 is a schematic cross-sectional view of the mobile phone 100 focusing on the first housing 200.

  As shown in FIG. 1 and FIG. 2, the camera module 500 is a small imaging device, so-called micro camera unit, having an XY cross section of about 5 mm square and a thickness (depth in the Z direction) of about 3 mm. (MCU).

  Hereinafter, the configuration of the camera module 500, the manufacturing process thereof, and the like will be sequentially described.

<Configuration of camera module>
FIG. 3 is a schematic cross-sectional view of the camera module 500, and the direction indicated by the arrow AR1 in FIG. 3 corresponds to the + Z direction. In the drawings subsequent to FIG. 3, an arrow AR <b> 1 indicating a direction corresponding to the + Z direction is attached to clarify the orientation relation. FIGS. 4A and 4B are external side views of the camera module 500 as viewed from the Y-axis direction and the X-axis direction, respectively.

  As shown in FIGS. 3 and 4, the camera module 500 includes an optical unit KB in which a lens group 20 as a photographing optical system is movably provided, and an imaging unit PB that acquires a captured image related to a subject image. Have.

  The imaging unit PB has a configuration in which, for example, an imaging element layer 18 having an imaging element 181 such as a COMS sensor or a CCD sensor, and a cover glass layer 17 are stacked in this order in the + Z direction. The cover glass layer 17 may include a filter layer that cuts infrared rays (IR).

  The optical unit KB includes a lid layer 10, a first frame layer 11, a first parallel spring (upper parallel spring) 12, a second frame layer 13, a second parallel spring (lower parallel spring) 14, an actuator layer 15, and lens position adjustment. The layer 16 and the lens group 20 are provided. The lid layer 10, the first frame layer 11, the first parallel spring 12, the second frame layer 13, the second parallel spring 14, the actuator layer 15, the lens position adjustment layer 16, and the lens group 20 are all in a wafer state (wafer Produced by level). These manufacturing processes will be described later.

  In the optical unit KB, the lens position adjusting layer 16, the actuator layer 15, the second parallel spring 14, the second frame layer 13, the first parallel spring 12, the first frame layer 11, and the lid layer 10 are arranged in this order in the + Z direction. The lens group 20 is held between the second parallel spring 14 and the first parallel spring 12 which are stacked. The first parallel spring 12, the second parallel spring 14, and the actuator layer 15 cooperate with each other to move the lens group 20 in the direction along the Z axis.

  In the camera module 500, the lid layer 10, the first and second frame layers 11 and 13, the lens position adjustment layer 16, the cover glass layer 17, and the imaging element layer 18 serve as a fixing portion for the lens group 20. The camera module 500 and the optical unit KB are manufactured in a wafer state (at the wafer level), and the side portions (side surfaces parallel to the Z-axis in FIG. 4) have exposed the laminated structure of each layer forming the side portions. It is composed of four cut surfaces. This cut surface corresponds to the “cut surface” of the present invention.

  Here, the lens group 20 is supported by the first and second parallel springs 12 and 14 coupled to the fixed portion.

  More specifically, the second parallel spring 14 is interposed between the actuator layer 15 on the −Z side of the lens group 20 and the lens group 20. A first parallel spring 12 is interposed between the first frame layer 11 on the + Z side of the lens group 20 and the lens group 20. That is, the lens group 20 is sandwiched between the first parallel spring 12 and the second parallel spring 14.

  Here, since the lens group 20 is clamped by the first and second parallel springs 12 and 14, the posture of the lens group 20 is maintained regardless of the movement of the lens group 20, and the optical axis of the lens group 20 is substantially constant. Retained.

  Further, the first and second parallel springs 12 and 14 apply a force in a direction opposite to the moving direction of the lens group 20 (that is, the + Z direction) when the lens group 20 as the moving object moves in the + Z direction. The lens group 20 is given. When the lens group 20 moves in the −Z direction, the direction of the force applied to the lens group 20 by the first and second parallel springs 12 and 14 is the moving direction of the lens group 20 (that is, −Z). Direction).

  Further, in a non-driving state in which the lens group 20 is not moving in the + Z direction (for example, a stationary state before driving), the lens group 20 is moved by the elastic force of the first and second parallel springs 12 and 14 from the lens position adjusting layer 16. The lens group 20 is supported by the lens position adjusting layer 16 by being pressed against the upper end surface of the protrusion 162. In this non-driven state, the lens group 20 is disposed at a predetermined position on the most −Z side of the range (displaceable range) that can be displaced along the Z axis and is stationary.

  For example, the predetermined position is set to a position where the focal point of the optical unit KB is arranged on a surface on the + Z side (hereinafter also referred to as “imaging surface”) on which a large number of pixel circuits are arranged in the image sensor 181. The Here, the focal point of the optical unit KB refers to a point where light beams emitted from the optical unit KB gather at one point when parallel light beams enter the optical unit KB from the + Z side. The camera module 500 and a camera module 500A described later correspond to the “imaging device” of the present invention.

  Thus, in the non-driven state, the lens group 20 is pressed against the lens position adjusting layer 16 by the elastic force of the first and second parallel springs 12 and 14, so that a strong impact is applied to the camera module 500. Even in such a case, the posture of the lens group 20 is maintained.

  The actuator layer 15 has a displacement generator that generates a drive displacement in the + Z direction, and is disposed on the −Z side of the lens group 20. The displacement generator comes into contact with the first protrusion 201 that protrudes toward the −Z side of the lens group 20, and the drive displacement generated by the displacement generator is transmitted to the lens group 20 via the first protrusion 201. That is, the actuator layer 15 moves the lens group 20 that is a moving object in a predetermined direction (here, the + Z direction). In a scene where the drive displacement in the + Z direction in the displacement generating portion is reduced, the lens group 20 is in a direction opposite to the predetermined direction (−Z direction) by the elastic force of the first and second parallel springs 12 and 14. Move to.

  The side wiring 22 is disposed on one of the side surfaces of the camera module 500, that is, one of the four cut surfaces, and is a driving signal such as an electric signal supplied from the mobile phone 100 through the imaging element layer 18 or the imaging element layer 18. Is a thin conductive member that supplies the displacement generation part of the actuator layer 15. The side wiring 22 and the side electrode 23 described later correspond to the “signal transmission unit” of the present invention.

  By adopting the side wiring 22, the signal transmission part can be provided on the cut surface formed in the dicing process, so that the signal transmission part is made to penetrate the functional layer between the imaging element layer 18 and the actuator layer 15. It is not necessary to provide a signal transmission unit, and the signal transmission unit can be easily created. Further, the parallel spring insulating portion 21 is provided in the second parallel spring 14 and electrically insulates the second parallel spring 14 and the actuator layer 15.

  As described above, in the camera module 500, the lens group 20 that is a moving object is coupled to the first and second parallel springs 12 and 14 disposed at positions facing each other via the lens group 20, The first and second parallel springs 12 and 14 are elastically deformed in a direction perpendicular to the lens group 20 (+ Z direction), and hold the posture of the lens group 20. The lens group 20 receives a driving force from the displacement generating portion of the actuator layer 15 and displaces the position along the Z axis.

  As described above, the optical unit KB provided in the camera module 500 can displace the lens group 20 in the optical axis direction (+ Z direction) of the lens group 20, and drive the camera module 500 to displace the lens group 20. To function as a device.

<About the lens group>
The lens group 20 is manufactured at a wafer level using a glass substrate as a base material, and is formed by, for example, superposing two or more lenses. In the present embodiment, a case where the lens group 20 is configured by overlapping two optical lenses is illustrated. In the present embodiment, the lens group 20 functions as an imaging lens that guides light from the subject to the imaging element 181. In this embodiment, the lens group 20 corresponds to the “lens layer” of the present invention.

  5 and 6 are schematic cross-sectional views of the lens group 20, and the direction indicated by the arrow AR2 corresponds to the + Z direction. FIG. 7 is a bottom view of the lens group 20, and FIG. 8 is a top view of the lens group 20.

  As shown in FIGS. 5 and 6, the lens group 20 includes a first lens constituent layer LY1 having a first lens G1, a second lens constituent layer LY2 having a second lens G2, and a spacer layer RB. . The first lens constituent layer LY1 and the second lens constituent layer LY2 are coupled via the spacer layer RB. Here, the outer edges of the non-lens portions of the first and second lens constituent layers LY1, LY2 have a substantially square shape.

  As shown in FIGS. 5 to 7, the first main surface (here, −Z side) of the first lens constituent layer LY <b> 1 having the first lens G <b> 1 has a first non-lens portion that does not function as a lens. A protrusion 201 is provided. Furthermore, as shown in FIGS. 5, 6, and 8, a non-lens portion that does not function as a lens is formed on one main surface (here, + Z side) of the second lens constituent layer LY <b> 2 having the second lens G <b> 2. A second protrusion 202 is provided.

  FIG. 9 is a view of the spacer layer RB as viewed from the + Z side, focusing on the shape of the spacer layer RB. As shown in FIG. 9, the spacer layer RB is provided along the outer edge of the non-lens portion of the first and second lens constituting layers LY1 and LY2, and the outer edge and the inner edge of the XY cross section are rectangular in shape. It has a configuration.

  The optical axis of the lens group 20 is set in a direction along the Z axis.

<About each functional layer>
Below, the detail of each functional layer which comprises the camera module 500 is demonstrated. For each functional layer, the −Z side surface is referred to as one main surface, and the + Z side surface is referred to as the other main surface.

○ Image sensor layer 18:
As shown in FIG. 3, the image sensor layer 18 receives light from the subject that has passed through the optical unit KB, and generates an image signal related to the image of the subject, its peripheral circuit, and the image sensor 181. It is a member provided with the outer peripheral part which surrounds. The image sensor 181 is configured by arranging a large number of pixel circuits.

  FIG. 10 is a diagram illustrating a top external view of the image sensor layer 18 to which the image sensor 181 is attached, and FIG. 11 is a schematic cross-sectional view of the image sensor layer 18 as viewed from the section line 18A-18A in FIG. FIG.

  As shown in FIGS. 3 and 10, the image sensor layer 18 receives the subject light that has passed through the photographing optical system and generates an image signal related to the subject image, its peripheral circuit 18 c, and the image sensor. This is a member including an image sensor holder 18f that holds the element 181 and the peripheral circuit 18c. The image sensor holder 18f is a box-shaped member formed of a material such as resin, for example, and the image sensor 181 and the peripheral circuit 18c are surfaces on the other main surface side of the image sensor holder 18f (in the illustrated example of FIG. 11). On the upper surface side). The peripheral circuit 18c performs application of signals to the image sensor 181 and reading of signals from the image sensor 181. Note that a solder ball HB for performing soldering by a reflow method is provided on one main surface side (the lower surface side in the illustrated example of FIG. 11) of the image sensor holder 18f.

  As shown in FIGS. 10 and 11, supply electrodes 18Ta and 18Tb are formed on the surface of the image sensor layer 18 on the other main surface side. The supply electrodes 18Ta and 18Tb are electrically connected to the side wirings 22 shown in FIGS. 3 and 4 at the edges of the imaging element layer 18, respectively.

  On one main surface side of the supply electrode 18Ta, through electrodes 18La and 18Lb penetrating the imaging element layer 18 are formed. One end of the through electrode 18La is electrically connected to the supply electrode 18Ta, and the other end is electrically connected to one of the solder balls HB provided on the surface on the one main surface side of the imaging element layer 18. Further, one end of the through electrode 18Lb is electrically connected to the supply electrode 18Tb, and the other end is electrically connected to one solder ball of the solder ball HB to which the through electrode 18La is not electrically connected.

  Here, as shown in FIGS. 1 and 2, when the camera module 500 is mounted on the mobile phone 100, the solder balls HB are electrically connected to the electric circuit in the mobile phone 100. A voltage (driving signal) for driving the actuator layer 15 of the camera module 500 is generated in the mobile phone 100 and then passed through wirings and electrodes such as the through-electrodes 18La and 18Lb and the side surface wiring 22 of the imaging element layer 18. Supplied to the actuator layer 15.

○ Cover glass layer 17:
As shown in FIG. 3, the cover glass layer 17 has a substantially flat plate shape and an XY cross section having a substantially square shape, and is made of transparent glass or the like. The cover glass layer 17 is bonded to the other main surface (+ Z side surface) of the image sensor layer 18 and has a function of protecting the image sensor 181.

  The image sensor substrate 178 is configured with the cover glass layer 17 bonded to the image sensor layer 18.

○ Lens position adjustment layer 16:
The lens position adjustment layer 16 is configured by using a resin material, is disposed between the image sensor 181 and the lens group 20, and is a member that adjusts the distance between the image sensor 181 and the lens group 20. Specifically, the lens position adjustment layer 16 defines the position (initial position) of the lens group 20 in the non-driven state. The lens position adjustment layer 16 is generated using, for example, a method of etching a resin.

  FIG. 12 is a top view of the lens position adjustment layer 16. FIG. 13 is a side view of the lens position adjusting layer 16.

  As shown in FIGS. 12 and 13, the lens position adjustment layer 16 includes a frame body 161 and a protrusion 162.

  The frame 161 is a substantially rectangular annular portion that constitutes the outer peripheral portion of the lens position adjusting layer 16, and has a plate-like shape substantially parallel to the XY plane. The frame 161 forms a hole (through-hole) 16H penetrating in the direction along the Z axis, and the + Y side plate-like member and the −Y side plate-like member constituting the frame 161 are: Each has a protruding portion 161T that protrudes toward the through hole 16H.

  Further, one main surface of the frame body 161 is bonded to the adjacent cover glass layer 17, and the other main surface of the frame body 161 is connected to the adjacent actuator layer 15 (specifically, the frame body 15 f of the actuator layer 15 ( To be described later)).

  The projecting portion 162 (also referred to as “contact portion”) is configured to stand in the + Z direction in the vicinity of the inner edge of the convex portion 161T constituting the frame body 161. The projection 162 is a plate-like portion having a substantially rectangular board surface substantially parallel to the XZ plane, and the longitudinal direction of the projection 162 is a direction substantially parallel to the X axis, and the short direction of the projection 162 Is a direction substantially parallel to the Z-axis. The end surface on the + Z side of the protrusion 162 has a function of placing the lens group 20 at the initial position when the lens group 20 comes into contact therewith.

  In FIG. 12, a region where a plurality of pixel circuits constituting the image sensor 181 are arranged (hereinafter also referred to as “pixel array region”), that is, the outer edge of the front surface (imaging surface) of the image sensor 181 is indicated by a broken line. Yes. As shown in FIG. 12, the imaging surface is configured so that the relationship of (short side length) :( long side length) :( diagonal length) = 3: 4: 5 is established. Yes.

  The protrusion 162 is disposed at a position that sandwiches the optical path from the subject through the lens group 20 to the pixel array region of the image sensor 181 in the direction in which the width of the pixel array region is the narrowest. That is, the protrusion 162 is installed so as not to adversely affect the photographing and increase the size of the apparatus.

○ Actuator layer 15:
The actuator layer 15 is a thin plate-like member in which a displacement element (also referred to as “actuator element”) that generates a driving force is provided on a metal or silicon (Si) substrate. FIG. 14 is a top view of the actuator layer 15. FIG. 15 is a side view of the actuator layer 15.

  Specifically, as shown in FIG. 14, the actuator layer 15 includes two frames that protrude from the frame body 15 f with respect to the frame body 15 f constituting the outer peripheral portion and the hollow portion inside the frame body 15 f. Plate-shaped movable parts 15ma and 15mb are provided. Thin film-like displacement elements 155a and 155b are provided on the other main surface side of the movable portions 15ma and 15mb, respectively.

As the displacement elements 155a and 155b, for example, a shape memory alloy (also referred to as “SMA”) is used. In this case, a first insulating layer 152 (FIG. 16B) such as SiO ₂ , a metal heater layer 153 (FIG. 16C), a first layer on a base layer 151 such as a Si substrate (FIG. 16A), 2 After forming the insulating layer 154 (FIG. 16D) and the displacement element layer 155 (FIG. 16E) using a sputtering method or the like, the movable portions 15ma and 15mb are set in a mold having a shape to be memorized, A heating process (shape memory process) is performed at a predetermined temperature (for example, 600 ° C.).

  The SMA has a characteristic that when it is heated and exceeds a predetermined phase transformation temperature and reaches a predetermined temperature, it is restored to a predetermined shape (also referred to as “memory shape”) stored in advance. Here, for example, a warped shape in which the free ends FT of the movable portions 15ma and 15mb are displaced in the + Z direction is stored. Therefore, when the SMA is heated by energization of the heater layer, the SMA is deformed into a memory shape, and the free ends FT of the movable portions 15ma and 15mb move in the + Z direction (see FIG. 15). That is, the free end FT side functions as a displacement transmission unit.

  The energization from the imaging element layer 18 to the heater layer is performed in the order of the through electrode 18La (18Lb) -the supply electrode 18Ta (18Tb) -the side electrode 22-the heater layer.

  Thus, in this embodiment, the frame 15f functions as a portion (movable reference portion) serving as a reference for displacement of the movable portions 15ma and 15mb, and the actuator layer 15 functions as a drive layer.

  Here, a detailed configuration and operation of the actuator layer 15 will be described. FIG. 16 is a diagram for explaining a detailed configuration of the actuator layer 15.

  The actuator layer 15 includes a first insulating layer 152 shown in FIG. 16B, a heater layer 153 shown in FIG. 16C, and a first layer shown in FIG. 16D on the base layer 151 shown in FIG. The two insulating layers 154 and the displacement element layer 155 shown in FIG. 16E are stacked in this order. Note that the heater layer 153 shown in FIG. 16C is described in a state of being disposed on the first insulating layer 152 in order to easily show the positional relationship of wirings and the like.

  As shown in FIG. 16A, the base layer 151 is made of a material having moderate rigidity such as Si (silicon), for example, and has a plate-like base having a frame portion 151f and beam portions 151a and 151b. Consists of members.

  The frame portion 151 f is a portion that is bonded and fixed to the lens position adjustment layer 16. The beam portions 151a and 151b are plate-like and arm-like portions protruding from one predetermined portion and the other predetermined portion of the frame portion 151f, respectively. The beam portions 151a and 151b are formed so as to be deformable so that the other end side is displaced with the vicinity of one end fixed to the frame portion 151f as a fulcrum. Here, the frame portion 151f and the beam portions 151a and 151b are integrally formed. However, the present invention is not limited to this. For example, the frame portion 151f is fixed by attaching the beam portions 151a and 151b to the frame portion 151f. May be.

  That is, in the base layer 151, each end of the beam portions 151a and 151b is fixed to the frame portion 151f to be a fixed end, and each other end of the beam portions 151a and 151b is a free end. 151f is formed so as to surround the beam portions 151a and 151b.

As shown in FIG. 16B, the first insulating layer 152 is, for example, a SiO ₂ thin film having a predetermined thickness formed by thermal oxidation or the like over the entire upper surface (the surface on the + Z side) of the base layer 151. It is made of a material that does not have conductivity and has the same shape as the base layer 151. Therefore, the first insulating layer 152 includes a film-like frame portion 152f formed on the upper surface of the frame portion 151f, and beam portions 152a and 152b formed on the upper surfaces of the beam portions 151a and 151b, respectively. Here, the frame portion 15f of the actuator layer 15 is mainly composed of frame portions 151f, 152f and 154f (FIG. 16D) which are stacked one above the other.

  As shown in FIG. 16C, the heater layer 153 includes two thin film resistors 153a and 153b and a wiring portion 153c provided on the frame portion 152f. The thin film resistors 153a and 153b and the wiring portion 153c correspond to the “in-layer wiring” of the present invention.

  The thin film resistors 153a and 153b are provided on the beam portions 152a and 152b, respectively, and are configured by thin film resistors that generate heat in response to voltage application. Here, the beam portions 151a and 152a and the beam portions 151b and 152b function as support portions for supporting the thin film resistors 153a and 153b, respectively.

As a material for the thin film resistors 153a and 153b and the wiring portion 153c, platinum or the like having a relatively high resistivity and easy film formation is used. In this case, the wiring portion 153c is wired with a large line width in order to reduce the resistance value. Further, as another material of the thin film resistors 153a and 153b, for example, tantalum nitride (Ta ₂ N), nichrome (NiCr), or the like having a resistivity higher than that of platinum may be used.

  The thin film resistors 153a and 153b are formed by sputtering, for example, and then a photoresist is formed using photolithography, and the thin film formed using the photoresist as an etching mask is etched by reactive ion etching. It is formed in a predetermined pattern (here, U-shaped). Alternatively, a thin film resistor that is thinly stretched in a foil shape is bonded or pressure-bonded with an adhesive or the like. As a film forming method, vapor deposition or the like is also conceivable.

  The two drive electrodes 153t are obtained by exposing the end of the wiring portion 153c to the outer edge of the actuator layer 15 when the plurality of camera modules 500 manufactured at the wafer level are separated into pieces by dicing. 153t is electrically connected to the side electrode 22 shown in FIG. Thin film resistors 153a and 153b are connected in series between the two drive electrodes 153t via the wiring portion 153c. One of the drive electrodes 153t is a portion for applying a voltage supplied via the outer surface electrode 22 to the thin film resistors 153a and 153b, and the other of the drive electrodes 153t is a thin film resistor via the outer surface electrode 22. For example, the parts 153a and 153b are grounded.

  Here, when a plurality of camera modules 500 manufactured at a wafer level are separated into pieces by dicing, a wiring pattern that uses the end portion of the wiring portion 153c exposed to the outer edge of the actuator layer 15 as the drive electrode 153t is used. When employed, for example, as shown in FIG. 16C, two or more ends of the wiring portion 153c are exposed at the outer edge of the heater layer 153. The two end portions in which the thin film resistors 153a and 153b are electrically connected in series between the end portions are employed as the drive electrode 153t.

  By applying a voltage between the two drive electrodes 153t, a current flows through the thin film resistors 153a and 153b, and the thin film resistors 153a and 153b generate heat due to Joule heat.

  In the wiring pattern example shown in FIG. 16C, the thin film resistors 153a and 153c are electrically connected in series between the two drive electrodes 153t, but the thin film resistor 153t is electrically connected between the two drive electrodes 153t. A wiring pattern in which the resistors 153a and 153c are electrically connected in parallel and the drive electrode 153t may be employed.

  As shown in FIG. 16D, the second insulating layer 154 is made of a material that does not have conductivity, and has the same shape as the first insulating layer 152. For example, the second insulating layer 154 is formed over the entire upper surface (the surface on the + Z side) of the first insulating layer 152 and the heater layer 153. Therefore, the second insulating layer 154 cooperates with the first insulating layer 152 to insulate the heater layer 153 and transfer the heat generated by the heater layer 153 to the displacement element layer 155 (FIG. 16E). The second insulating layer 154 includes a film-like frame portion 154f formed on the upper surface of the frame portion 152f, and beam portions 154a and 154b formed on the upper surfaces of the beam portions 152a and 152b, respectively.

The second insulating layer 154 is preferably made of a material having insulating properties and good thermal conductivity, and is formed, for example, by film formation by sputtering of aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The Alternatively, an SiO ₂ film may be used in the same manner as the first insulating layer.

  As shown in FIG. 16E, the displacement element layer 155 has two displacement elements 155a and 155b.

  Displacement elements 155a and 155b are constituted by thin-film elements (here, SMA) that are deformed in response to a temperature rise. The displacement elements 155a and 155b are formed by, for example, forming a film by sputtering, or joining or press-bonding elements thinly stretched in a foil shape with an adhesive or the like. In addition, plating, vapor deposition, etc. are also considered as a film-forming method.

  Note that both the displacement elements 155a and 155b are appropriately subjected to heat treatment (memory heat treatment) for storing the shape so as to warp in a concave shape with respect to the + Z direction during heating.

  Here, the operation of the movable portions 15ma and 15mb will be described by taking the operation of the movable portion 15ma as an example.

  FIG. 17 is a diagram for explaining the operation of the movable portion 15ma. 17 (a) and 17 (b) are schematic cross-sectional views taken along section line 15A-15A shown in FIG. 14, focusing on the movable portion 15ma.

  FIG. 17A shows a state where the movable portion 15ma is not deformed (initial state). In the initial state, no voltage is applied between the two drive electrodes 153t, and the thin film resistors 153a and 153b of the heater layer 153 are in the normal temperature state. Therefore, the movable portion 15ma has a substantially flat shape due to the elastic force of the beam portion 151a of the base layer 151 and the like.

  When a voltage is applied between the two drive electrodes 153t from the initial state shown in FIG. 17A, a current flows through the thin film resistors 153a and 153b, and the thin film resistor 153a is heated by Joule heat. The generated heat is transmitted to the displacement element 155a through the second insulating layer 154a, and when the displacement element 155a exceeds a predetermined transformation start temperature, the displacement element 155a is deformed so as to warp in a concave shape with respect to the + Z direction. To do.

  Further, when the application of the voltage between the two drive electrodes 153t is finished, the concave warpage deformation in the + Z direction of the displacement element 155a is stopped by natural cooling, and the elastic force of the beam portion 151a of the base layer 151, etc. The displacement element 155a returns to an undeformed initial state. As described above, the movable portion 15ma functions as a driving portion that generates a driving force by being deformed so that the free end is displaced with a place where it contacts the frame portion 15f as a fulcrum by applying an electric field. The movable portion 15ma abuts the moving object directly or indirectly, thereby applying an external force to the moving object to move the moving object.

  Here, since the two thin film resistors 153a and 153b are energized and heated at the same time, the two movable portions 15ma and 15mb are deformed to be substantially the same with substantially the same timing and mechanism.

  The frame 15 f of the actuator layer 15 is joined to the fixed frame 141 (see FIG. 18) of the second parallel spring 14. In the joined state, the free end FT side of each of the movable portions 15ma and 15mb comes into contact with the corresponding first protrusion 201. For this reason, the displacement generated at the free ends FT of the movable portions 15ma and 15mb is transmitted to the lens group 20 via the first protrusions 201. That is, the movable parts 15ma and 15mb apply a force in the + Z direction to the lens group 20 to displace the lens group 20 in the + Z direction. Thus, the movable parts 15ma and 15mb function as an action part that transmits displacement to the lens group 20.

  Note that the amount of displacement generated on the free end FT side of the movable portions 15ma and 15mb varies depending on the heating temperature of the SMA, and the amount of displacement can be adjusted by controlling the amount of current supplied to the heater layer 153.

  That is, the displacement elements 155a and 155b function as a film element that can be reversibly deformed in accordance with a drive signal, and the lens group 20 can be moved by deformation of the film element.

  In addition, the heater layer 153 is also deformed with the deformation of the SMA, and the electric resistance of the heater layer 153 is also changed according to the deformation. For this reason, the amount of displacement may be controlled by monitoring the current resistance value of the heater layer 153.

○ Second parallel spring 14:
FIG. 18 is an external view of the lower surface of the second parallel spring 14. FIG. 19 is a view showing the second parallel spring 14 joined to the lens group 20.

  As shown in FIG. 18, the second parallel spring 14 is an elastic member having a fixed frame body 141 and an elastic part 142, and is a layer (elastic layer) that forms a spring mechanism. In the present embodiment, the second parallel spring 14 corresponds to the “elastic member layer” of the present invention. As a material of the second parallel spring 14, for example, a SUS metal material or phosphor bronze is used.

  The fixed frame 141 constitutes the outer peripheral portion of the second parallel spring 14 and is joined to the frame 15 f of the adjacent actuator layer 15. Here, since the distance between the heater layer 153 of the actuator layer 15 and the second parallel spring layer 14 is usually only about 10 μm, the side electrode 22 that supplies a drive signal to the heater layer 153 is printed, for example, by printing or the like. Therefore, the side electrode 22 is usually extended to the fixed frame body 141 when it is provided from the imaging element layer 18 to the actuator layer 15.

  Therefore, when the actuator layer 15 and the parallel spring layer 14 are joined, the fixed frame 141 that faces all the ends of the wiring portion 153c exposed to the outer edge of the actuator layer 15 including the drive electrode 153t. It is necessary to electrically insulate the side electrode 22 and the second parallel spring 14 by, for example, a method of providing an insulating portion on the outer edge portion of the first electrode.

  Therefore, a local notch 143 for achieving electrical insulation between the side electrode 22 and the fixed frame 141 is provided on the outer edge of the fixed frame 141 by spatially separating them. It is done. In the actuator layer 15 shown in FIG. 16, the notches 143 are provided at four locations as shown in FIG.

  However, when only the cutout part 143 is provided, the side electrode 22 enters the cutout part 143 when the side electrode 22 is disposed, and the side electrode 22 and the fixed frame 141 are electrically short-circuited. There is a risk of causing.

  For this reason, the parallel spring insulating part 21 is provided in the notch part 143, and more reliable insulation with the side surface electrode 22 and the fixed frame 141 is achieved.

  Therefore, for example, an insulating adhesive such as an epoxy-based adhesive is used for joining the actuator layer 15 and the second parallel spring layer 14, and the adhesive enters the notch 143 to be used as the actuator. A configuration in which a parallel spring insulating portion 21 (FIGS. 3 and 4) for insulating the layer 15 and the second parallel spring layer 14 is formed is employed. The parallel spring insulating portion 21 corresponds to the “insulating portion” of the present invention.

  With this configuration, in the joining process of the actuator layer 15 and the second parallel spring layer 14, the parallel spring insulating portion 21 that electrically insulates the second parallel spring layer 14 and the side wiring 22 is provided in the notch 143. Therefore, the insulating portion can be provided without adding a new process for providing the insulating portion, and the manufacturing efficiency of the camera module 500 can be improved.

  When the side wiring 22 (FIGS. 3 and 4) is disposed in the dicing process, the side wiring 22 is disposed from above the parallel spring insulating portion 21 formed by the filled insulating adhesive.

  The elastic part 142 has a connection part PG1 with the fixed frame body 141 and a joint part PG2 with the lens group 20, and the connection part PG1 and the joint part PG2 are connected by a plate-like member EB.

  That is, the second parallel spring 14 is joined to the adjacent actuator layer 15 in the fixed frame body 141. Further, as shown in FIG. 19, the second parallel spring 14 is joined to the lens group 20 at a joint portion PG <b> 2 provided in the elastic portion 142.

  The first projecting portion 201 contacts the vicinity of the free end FT of the actuator layer 15 through the gap between the fixed frame body 141 of the second parallel spring 14 and the plate-like member EB. That is, the second parallel spring 14 has a shape that does not contact the first protrusion 201 of the lens group 20.

  For this reason, as the lens group 20 is moved in the + Z direction with respect to the fixed frame body 141, the positions of the connecting portion PG1 and the joint portion PG2 are shifted in the Z direction, and the plate-like member EB undergoes bending deformation (flexure deformation). Resulting in curvature. That is, the second parallel spring 14 can be elastically deformed in the optical axis direction (± Z direction) of the lens group 20 by elastic deformation of the plate-like member EB, and functions as a spring mechanism.

  As described above, the second parallel spring 14 is manufactured using a SUS-based metal material, phosphor bronze, or the like. For example, when the second parallel spring 14 is manufactured using a SUS-based metal material, photolithography is used. A pattern of the parallel spring is formed by patterning the shape of the parallel spring on a metal material and immersing it in an iron chloride-based etching solution to perform wet etching.

○ Second frame layer 13:
As shown in FIG. 3, the second frame layer 13 is a ring-shaped member in which the outer edge and the inner edge of the XY cross section are each substantially rectangular, and forms a hollow portion that penetrates along the Z-axis. The second frame layer 13 surrounds the lens group 20 from the side by arranging the lens group 20 in the hollow portion. In addition, resin, glass, etc. are mentioned as a raw material which comprises the 2nd frame layer 13, The 2nd frame layer 13 is manufactured by what is called a press method using a metal metal mold | die, the injection molding method, etc.

  The lower end surface (one main surface) located on the −Z side of the second frame layer 13 is joined to the fixed frame body 141 of the adjacent second parallel spring 14. Further, the upper end surface (other main surface) located on the + Z side of the second frame layer is joined to the adjacent first parallel spring 12 (specifically, a fixed frame body 121 (described later) of the first parallel spring 12). The

○ First parallel spring 12:
FIG. 20 is an external view of the lower surface of the first parallel spring 12. As shown in FIG. 20, the first parallel spring 12 is an elastic member having the same configuration and function as the second parallel spring 14 except that the notch portion 143 and the parallel spring insulating portion 21 are not provided. The fixed frame body 121 and the elastic part 122 are provided.

  One main surface of the fixed frame 121 is joined to the other main surface of the adjacent second frame layer 13, and the other main surface of the fixed frame 121 is connected to the adjacent first frame layer 11 (in detail, the first frame It is joined to the lower end surface (described later) on the −Z side of the layer 11.

  FIG. 21 is a view showing the first parallel spring 12 joined to the lens group 20. As shown in FIG. 21, the joint part PG <b> 2 provided in the elastic part 122 is joined to the upper end surface on the + Z side of the projection part 202 of the lens group 20.

  For this reason, when the lens group 20 is moved relative to the fixed frame 121 in the + Z direction, elastic deformation occurs in the plate member EB, and the first parallel spring 12 functions as a spring mechanism.

○ First frame layer 11:
As shown in FIG. 3, the first frame layer 11 is a ring-shaped member in which the outer edge and the inner edge of the XY cross section are each substantially rectangular like the second frame layer 13 and penetrates along the Z axis. Forming a hollow portion. The hollow portion of the first frame layer 11 serves as a space in which the plate-like member EB and the protrusion 202 that are elastically deformed when the lens group 20 is moved in the + Z direction can move. The first frame layer 11 is formed by the same material and manufacturing method as the second frame layer 13.

  The lower end surface (one main surface) located on the −Z side of the first frame layer 11 is joined to the fixed frame body 121 of the adjacent first parallel spring 12. Moreover, the upper end surface (other end surface) located on the + Z side of the first frame layer is joined to the adjacent lid layer 10 (specifically, near the outer peripheral portion of the lid layer).

○ Cover layer 10:
As shown in FIG. 3, the outer edge of the XY cross section has a substantially square shape, and the lid layer 10 has a hole (through hole) 10 </ b> H penetrating in a direction parallel to the Z axis at a substantially center, and is substantially in the XY plane. It is a plate-like member having a parallel board surface. The through hole 10H is a hole for guiding light from the subject to the image sensor 181 through the lens group 20, and the lid layer 10 is formed by pressing a flat resin material or patterning the resin material. The through hole 10H is formed and manufactured by a method of etching later.

  In addition, although illustration is abbreviate | omitted in FIG. 3, on the upper surface (other main surface) side of the lid | cover layer 10 so that dust etc. may not penetrate | invade into the camera module 500 from the through-hole 10H of the lid | cover layer 10, A transparent protective layer composed of glass or the like is provided as appropriate.

<Camera module manufacturing process>
Here, the manufacturing process of the camera module 500 will be described in detail.

  FIG. 22 is a flowchart showing the manufacturing process of the camera module 500. As shown in FIG. 22, (process A) generation of the lens group 20 (step SP1), (process B) sheet preparation (step SP2), (process C) assembly jig preparation (step SP3), (process D) First bonding of the sheet (step SP4), (Process E) Mounting of the lens group 20 (Step SP5), (Process F) Second bonding of the sheet (Step SP6), (Process G) Image sensor substrate 178 (Step SP7) and (process H) dicing (step SP8) are sequentially performed, and the camera module 500 is manufactured. Hereinafter, each step will be described.

○ Generation of lens group 20 (step A):
In step SP1, the lens group 20 is generated.

  First, a wafer in which a large number of lens groups 20 are arranged in a matrix (hereinafter also referred to as a “lens group wafer”) is manufactured, and a large number of lens groups 20 are separated into pieces by dicing. Produced.

  The lens group wafer includes a wafer in which a large number of first lens constituent layers LY1 are arranged (first lens constituent layer wafer), a wafer in which a large number of spacer layers RB are arranged (spacer layer wafer), and a large number of second lenses. A wafer (second lens constituent layer wafer) on which the constituent layers LY2 are arranged is stacked and bonded to each other.

  FIG. 23 is a plan view schematically showing the first and second lens constituent layer wafers U20a and U20c. FIG. 24 is a plan view schematically showing the spacer layer wafer U20b.

  As shown in FIG. 23, the first lens component layer wafer U20a is configured integrally with a large number of first lens component layers LY1 arranged in a matrix at first predetermined intervals. In addition, the second lens component layer wafer U20c is configured integrally by arranging a large number of second lens component layers LY2 in a matrix at first predetermined intervals.

  Further, as shown in FIG. 24, the spacer layer wafer U20b is configured integrally with a large number of spacer layers RB arranged in a matrix at first predetermined intervals. In other words, the spacer layer wafer U20b has a lattice structure in which a large number of through-holes having a substantially square outer edge are arranged in a matrix at first predetermined intervals.

  The first lens component layer wafer U20a, the spacer layer wafer U20b, and the second lens component layer wafer U20c are stacked in this order and bonded to each other, and then the broken lines shown in FIGS. Each lens group 20 is separated into individual pieces by dicing along the line. Hereinafter, a line that is diced along the broken line, as shown by the broken line, is referred to as a “dicing line”.

  Here, a manufacturing method of the first and second lens component layer wafers U20a and U20c will be described. The manufacturing method of each first lens constituent layer LY1 in the first lens constituent layer wafer U20a is the same, and the manufacturing method of each second lens constituent layer LY2 in the second lens constituent layer wafer U20c is also the same. For this reason, here, description will be given focusing on the production of the first and second lens constituent layers LY1, LY2.

  The first and second lens constituent layers LY1, LY2 are both produced by the same method using a glass substrate as a base material. FIG. 25 is a diagram showing a state of manufacturing the first lens constituent layer LY1 having the first lens G1, and FIG. 26 is a diagram showing a state of manufacturing the second lens constituent layer LY2 having the second lens G2. is there.

  As shown in FIG. 25, a wafer-like substrate 20BS is prepared. Examples of the material of the substrate 20BS include glass such as so-called Tempax (registered trademark), resin such as so-called PPMA, and the like.

  Next, a highly transparent acrylic or epoxy ultraviolet (UV) curable resin is applied to both surfaces of the substrate 20BS. Then, a transparent lens molding die 20CA having one curved surface shape of the first lens G1 is pressed from the upper surface of the substrate 20BS with a predetermined pressure, and the other curved surface of the first lens G1 is pressed from the lower surface of the substrate 20BS. The transparent lens molding die 20CB having the shape and the shape of the first protrusion 201 is pressed with a predetermined pressure. At this time, the ultraviolet rays UV1 are irradiated to form the polymer lenses GP1 and GP2 and the first protrusion 201 on each surface of the substrate 16BS. By such a method, the first lens constituent layer wafer U20a is manufactured. The tip of the first protrusion 201 is a surface that contacts the actuator layer 15.

  Further, as shown in FIG. 26, a highly transparent acrylic or epoxy ultraviolet (UV) curable resin is applied to each of both surfaces of the substrate 20BS. Then, a transparent lens molding die 20CC having the shape of one curved surface of the second lens G2 and the shape of the second protrusion 202 is pressed from the upper surface of the substrate 20BS with a predetermined pressure, and the second lens G2 is pressed from the lower surface of the substrate 20BS. A transparent lens molding die 20CD having the shape of the other curved surface of the two lenses G2 is pressed with a predetermined pressure. At this time, ultraviolet rays UV1 are irradiated to form polymer lenses GP3 and GP4 and second protrusions 202 on each surface of the substrate 16BS. By such a method, the second lens constituent layer wafer U20c is manufactured. The tip of the second protrusion 202 is a surface joined to the first parallel spring 12.

  Further, the spacer layer wafer U20b is manufactured, for example, by processing a wafer-like glass substrate by etching or the like.

  The first and second lens component layer wafers U20a and U20c and the spacer layer wafer U20b manufactured in this way are formed with alignment marks for alignment at two or more predetermined locations.

  Then, it is assembled into an integrated lens group 20 so that the spacer layer RB is sandwiched between the first and second lens constituent layers LY1, LY2.

  Specifically, the first lens component layer wafer U20a, the spacer layer wafer U20b, and the second lens component layer wafer U20c are aligned and bonded while confirming the respective alignment marks using a mask aligner or the like. The At this time, the first and second lens constituent layers LY1, LY2 and the spacer layer RB constitute the lens group 20.

  As a method of bonding the three wafers U20a to U20c, for example, UV curing layers are provided on the upper and lower surfaces of the spacer layer RB to be bonded to the first and second lens constituent layers LY1 and LY2, and bonded by irradiating ultraviolet rays. Or a method of irradiating the upper and lower surfaces of the spacer layer RB with plasma of an inert gas and bonding the surfaces of the spacer layer RB while being activated (surface activated bonding method).

  Further, when forming a diaphragm in the camera module 500, for example, a technique of forming a diaphragm layer with a resin material or the like colored separately in black is used.

  In this manner, a wafer (lens group wafer) in which a large number of lens groups 20 are arranged in a matrix is manufactured, and a large number of individual lens groups 20 are manufactured by dicing.

○ Sheet preparation (process B):
In step SP2, a sheet relating to each functional layer constituting the camera module 500 is formed for each layer. FIG. 27 is a plan view illustrating a configuration example of a sheet to be prepared. Here, it is assumed that a wafer-level disk-shaped sheet is prepared.

  In the sheet for each functional layer, a large number of chips corresponding to members related to the functional layer are formed in a matrix in a predetermined arrangement.

  For example, as shown in FIG. 27, on the sheet (first frame layer sheet) U11 of the first frame layer 11, a large number of chips corresponding to the first frame layer 11 are formed in a predetermined arrangement. Here, the expression “predetermined arrangement” is used to include a state in which a large number of chips are arranged at predetermined intervals in a predetermined direction.

  The first frame layer sheet U11 has a lattice shape in which side surfaces of chips corresponding to the first frame layer 11 are connected to each other. The first frame layer sheet U11 is made of a resin material, glass, or the like.

  For example, when the first frame layer sheet U11 is made of a resin material, the first frame layer sheet U11 is manufactured by a method such as press molding or injection molding using a metal mold. When the first frame layer sheet U11 is made of glass or the like, the first frame layer sheet U11 is manufactured, for example, by so-called blasting using a metal or ceramic shadow mask.

  FIG. 28 is a plan view showing a configuration example of the second parallel spring seat U14. In FIG. 28, only the part including the four second parallel springs 14 is shown in the second parallel spring sheet U14. The second parallel spring sheet U14 is manufactured from a sheet using a SUS metal material, phosphor bronze, or the like. For example, when the second parallel spring sheet U14 is manufactured using a SUS metal material, a plurality of photolithography metal sheets are used by photolithography. The shape of the parallel springs and the holes 143H are patterned on a metal material, and immersed in an iron chloride-based etching solution to perform wet etching, thereby forming a plurality of parallel spring shapes and patterns of the holes 143H.

  Here, since the dicing lines L1 and L2 are provided so that the intersections of the dicing lines L1 and L2 enter the holes 143H, the dicing is performed after the sheets related to the functional layers are laminated. In this case, the dicing lines L1 and L2 are cut, and one hole portion 143H becomes a notch portion 143 in the outer edge portion of the four second parallel springs 14.

  The hole 143H is provided so as to include each intersection of the dicing lines L1 and L2 in the hole 143H, and only the dicing line L1 or only L2 depending on the position where the side electrode 22 is provided. May pass through the hole 143H.

FIG. 29 is a diagram showing how the actuator layer sheet U15 is created. The actuator layer sheet U15 includes a first insulating layer sheet U152 such as SiO ₂ , a metal heater layer sheet U153, a second insulating layer sheet U154, and a displacement element layer sheet U155 in this order on a base layer sheet U151 such as a Si substrate. In FIG. 29, only the portion including the four actuator layers 15 is shown in the state where the layers up to the heater layer sheet U153 are stacked. The heater layer sheet U153 is a wiring pattern in which the inner wiring of each actuator layer 15 is coupled.

  Similarly to the second parallel spring sheet U14, the actuator layer sheet U15 is cut at the dicing lines L1 and L2 in the dicing step to become the actuator layers 15.

  Here, the wiring pattern is continuously arranged on the actuator layer sheet U15 while successively traversing the dicing line L1 which is a boundary between adjacent camera modules 500. Therefore, when the wiring pattern constituting the heater layer sheet U153 is cut along the dicing line L1, the cut surface has, for example, two or more end portions of the wiring portion 153c as shown in FIG. However, as described above, the thin film resistors 153a and 153b are electrically connected in series between the end portions, as described above. These two end portions are employed as the drive electrode 153t.

  That is, as a result of the wiring pattern constituting the heater layer sheet U153 combined with the internal wiring of each actuator layer 15 being cut by dicing, the portion exposed to the cut surface of the camera module 500 is replaced with the side wiring 22 and the heater layer. Since the drive electrode 153t for electrically connecting the intra-layer wiring in 153 can be formed, the manufacture of the drive electrode 153t is facilitated.

  In addition, in the lens position adjustment layer 16 sheet (lens position adjustment layer sheet) U16, a large number of chips corresponding to the lens position adjustment layer 16 are formed in a predetermined arrangement. The lens position adjustment layer sheet U16 has a shape in which side surfaces of chips corresponding to the lens position adjustment layer 16 are connected to each other. The lens position adjustment layer sheet U16 is made of a resin material or the like.

  For example, the lens position adjusting layer sheet U16 is manufactured by manufacturing a mold having the shape of the lens position adjusting layer sheet U16, pouring resin into the mold, heating the resin together with the mold, and then cooling. The The lens position adjustment layer sheet U16 may be manufactured using injection molding or the like.

  Thus, in step SP2, as with the first frame layer sheet U11 and the lens position adjustment layer 16, the lid layer 10, the first parallel spring 12, the second frame layer 13, the second parallel spring 14, and the actuator layer 15 are used. Each of the sheets U10, U12 to U15 on which a large number of chips related to each functional layer are formed in a predetermined arrangement, and a chip related to the image sensor substrate 178 formed by joining the cover glass layer 17 and the image sensor layer 18 Including sheets (imaging element substrate sheets) U178 are prepared. That is, eight sheets U10 to 16 and U178 are prepared.

  In the image pickup device substrate sheet 178 also, after dicing, the wiring pattern to be the supply electrode 18Ta (18Tb) of each image pickup device layer 18 is placed on the dicing lines L1 of the array of the image pickup device layers 18 so as to cross the dicing lines L1. Wired.

○ Preparation of assembly jig (process C):
In step SP3, the assembly jig 300 is prepared.

  FIG. 30 is a diagram focusing on the part of the assembly jig 300 that is used to manufacture each camera module 500. The assembly jig 300 is configured by providing a large number of protrusions 301 having substantially the same shape on a flat base, in a predetermined arrangement.

  In the assembly jig 300, alignment marks for alignment are formed at two or more predetermined locations. Further, the upper surface of the protrusion 301 is configured to be substantially parallel to the main surface of the flat base.

○ First joining of sheets (process D):
In step SP4, three sheets U11 to U13 among the eight prepared sheets U10 to 16 and U178 are joined.

  FIG. 31 shows a state in which three sheets U11 to U13 are laminated and joined in step S4, a state in which the lens group 20 is attached in step S5, and four sheets U10 and U14 to U16 are laminated in step S6. It is a figure which shows typically a mode that it joins, and a mode that the image pick-up element board | substrate sheet | seat U178 is joined in step SP7.

  In step SP4, as shown in FIG. 31, with respect to the first frame layer sheet U11, the first parallel spring sheet U12, and the second frame layer sheet U13, the chips included in the sheets U11 to U13 are stacked on each other. Thus, alignment (alignment) is performed with the sheet shape. And each sheet | seat U11-U13 is joined using an adhesive agent etc.

  FIGS. 32 to 34 are views showing how the sheets U11 to U13 are stacked and joined, focusing on each chip constituting one camera module 500. FIG. 32 to 34, the camera module 500 shown in FIG. 3 is shown upside down for convenience of the process.

  As shown in FIG. 32, the first frame layer sheet U11 is placed on the assembly jig 300 so that each first frame layer 11 is placed at a predetermined position on the base of the assembly jig 300. Placed. In FIG. 32, the movement direction of the first frame layer sheet U11 when the first frame layer sheet U11 is carried on the assembly jig 300 is indicated by an arrow YJ1.

  Next, as shown in FIG. 33, the first frame layer sheet is formed by joining the fixed frame body 121 constituting the outer peripheral portion of the first parallel spring 12 on one main surface of the first frame layer 11. The first parallel spring seat U12 is joined to U11.

  Specifically, the fixed frame 121 is pressed against the one main surface of the first frame layer 11 in the direction indicated by the arrow YJ2, and the other main surface of the fixed frame 121 and the first frame layer 11 The main surface is joined. At this time, the joint portion PG2 of the first parallel spring 12 is brought into contact with the upper surface of the protrusion 301 of the assembly jig 300, whereby the substantially parallel plate shape of the first parallel spring 12 is maintained.

  Furthermore, as shown in FIG. 34, the first main surface of the second frame layer 13 is joined to the first main surface of the fixed frame 121 constituting the outer peripheral portion of the first parallel spring 12. The second frame layer sheet U13 is joined to the parallel spring sheet U12.

  Specifically, the second frame layer 13 is pressed against the main surface of the fixed frame 121 of the first parallel spring 12 in the direction indicated by the arrow YJ3, and the main surface of the fixed frame 121 The other main surface of the two-frame layer 13 is joined.

○ Attaching the lens group (Process E):
FIG. 35 shows how the lens group 20 is attached.

  In step SP5, as shown in FIG. 35, the lens group 20 generated in step SP1 is attached to a hollow portion of each second frame layer 13 of the unit manufactured in step SP4 by a predetermined mounter. That is, the lens group 20 is inserted into each gap of the second frame layer sheet U13 having a lattice shape.

  Specifically, the end surfaces of the two second protrusions 202 of the lens group 20 are respectively joined to the joint PG <b> 2 of the first parallel spring 12. At this time, while the lens group 20 is pressed against the joint portion PG2 in the direction indicated by the arrow YJ4, the end surface of the second protrusion 202 is joined to the one main surface side of the joint portion PG2.

  As a joining method, an adhesive (ultraviolet curable adhesive) that is cured by irradiation of ultraviolet rays is applied in advance to the end surface of the second protrusion 202 of the lens group 20, and the second protrusion 202 of the lens group 20 is applied. The method of joining by irradiation of an ultraviolet-ray, etc. in the state which contact | abutted with respect to the junction part PG2 of the 1st parallel spring 12 is mentioned.

○ Sheet second joining (process F):
In step SP6, as shown in FIG. 31, four sheets U10 and U14 to U16 of the eight sheets U10 to 16 and U178 prepared in step SP2 are joined.

  Specifically, in step SP6, each chip included in the second parallel spring sheet U14 and the actuator layer sheet U15 is attached to the second frame layer sheet with respect to one main surface side of the units generated up to step SP5. Positioning (alignment) is performed while maintaining the sheet shape so as to be stacked on each chip included in U13. And each sheet | seat U14, U15 is joined using an adhesive agent etc. in order.

  Further, the sheet is so formed that each chip included in the lid layer sheet U10 is stacked with respect to each chip included in the first frame layer sheet U11 with respect to the other main surface side of the first frame layer sheet U11. Alignment (alignment) is performed in the shape. In this state, the lid layer sheet U10 is bonded to the other main surface side of the first frame layer sheet U11 using an adhesive or the like.

  Further, the sheet-like shape is formed so that each chip included in the lens position adjustment layer sheet U16 is stacked on each chip included in the actuator layer sheet U15 with respect to one main surface side of the actuator layer sheet U15. The alignment (alignment) is performed as it is. In this state, the lens position adjustment layer sheet U16 is bonded to the other main surface side of the actuator layer sheet U15 using an adhesive or the like.

  FIG. 36 to FIG. 39 are diagrams showing how the sheets U10 and U14 to U16 are stacked and joined, focusing on each chip constituting one camera module 500. FIG. 36 and 37, as in FIGS. 32 to 34, the camera module 500 shown in FIG. 3 is shown upside down for convenience of the process. On the other hand, in FIGS. 38 and 39, the upper and lower sides of the camera module 500 shown in FIG. 3 are shown in the same state.

  As shown in FIG. 36, the second parallel layer 14 is arranged on the main surface of the second frame layer sheet U13 so that the second parallel spring 14 is joined to the main surface side of the second frame layer 13 and the lens group 20. The spring seat U14 is joined.

  Specifically, while the fixed frame 141 of the second parallel spring 14 is pressed against the one main surface of the second frame layer 13 in the direction indicated by the arrow YJ5, the other main surface of the fixed frame 141 is It is joined to one main surface of the second frame layer 13 by an adhesive or the like. At this time, the joint part PG2 of the second parallel spring 14 is joined to the non-lens part of the first lens constituent layer LY1 of the lens group 20 by an adhesive or the like.

  Next, as shown in FIG. 37, the actuator layer sheet U15 is bonded onto one main surface of the second parallel spring sheet U14 so that the actuator layer 15 is bonded to one main surface of the second parallel spring 14. The

  Specifically, while the frame body 15f of the actuator layer 15 is pressed in the direction indicated by the arrow YJ6 against one main surface of the fixed frame body 141 of the second parallel spring 14, the other main surface of the frame body 15f. And one main surface of the fixed frame 141 are joined together by an insulating adhesive such as an epoxy adhesive.

  At this time, the adhesive enters the hole 143H of the second parallel spring sheet U14 shown in FIG. 28 to form the parallel spring insulating portion 21 that insulates the actuator layer 15 and the second parallel spring layer 14 from each other. .

  When the hole 143H in which the parallel spring insulating portion 21 is formed is diced after the sheets related to the respective functional layers are laminated, the dicing lines L1 and L2 are cut, and the parallel spring insulating portion 21 The formed hole portion 143 </ b> H becomes the parallel spring insulating portion 21 and the notch portion 143 at the outer edge portion of each second parallel spring 14.

  That is, in the process of laminating and joining the actuator array layer U15 and the parallel spring array layer U14, the notches provided at the outer edge portions of the parallel spring layers of the camera modules 500 after the camera modules 500 are separated into individual pieces. A parallel spring insulating portion 21 that electrically insulates the parallel spring layer 14 and the side wiring 22 can be provided in the hole portion of the parallel spring array layer U14 provided with a plurality of hole portions 143H to be the portion 143. Therefore, the parallel spring insulation part 21 can be provided without requiring a new process for providing the parallel spring insulation part 21 in a series of stacking steps, and the manufacturing efficiency of the camera module 500 can be improved.

  Further, at this time, the free end FT side of each movable portion 15m of the actuator layer 15 comes into contact with the corresponding first protrusion 201, and the free end FT of each movable portion 15m is pushed up in the direction corresponding to the −Z side. It becomes a state.

  Next, as shown in FIG. 38, the unit formed by joining the actuator layer sheet U15 on the second parallel spring sheet U14 is removed from the assembly jig 300, and the lid layer sheet is attached to the unit. U10 is joined. When the unit is removed from the assembly jig 300, the lens group 20 is held by the first and second parallel springs 12, 14, so that the lens group 20 floats in the air. It becomes.

At this time, the unit joined up to the actuator layer sheet U15 is turned upside down, and the outer peripheral portion of the lid layer 10 is pressed against the other main surface of the first frame layer 11 in the direction indicated by the arrow YJ7. Meanwhile, the other main surface of the first frame layer 11 and one main surface of the outer peripheral portion of the lid layer 10 are joined by an adhesive or the like.

  Further, as shown in FIG. 39, the lens with respect to one main surface of the actuator layer sheet U15 is so that the frame body 161 of the lens position adjusting layer 16 is bonded to one main surface of the frame body 15f of the actuator layer 15. The position adjustment layer sheet U16 is joined.

  Specifically, the unit formed by joining up to the lid layer sheet U10 is placed on the other main surface of the lens position adjustment layer sheet U16, and the unit is pushed down in the direction indicated by the arrow YJ8. The other main surface of the lens position adjustment layer sheet U16 and one main surface of the actuator layer sheet U15 are bonded together with an adhesive or the like.

  At this time, the upper end surface of the protrusion 162 of the lens position adjustment layer 16 contacts a part of the non-lens portion of the first lens constituent layer LY1 of the lens group 20, and the lens group 20 is pushed up to the lid layer 10 side. . Further, the force by which the movable portions 15ma and 15mb of the actuator layer 15 are pushed down by the first projection 201 is reduced, and the free ends FT of the movable portions 15ma and 15mb of the actuator layer 15 that have been pushed down by the first projection 201 are reduced. Ascend in the + Z direction. The movable portions 15ma and 15mb hardly generate elastic force, that is, the shapes of the movable portions 15ma and 15mb are substantially flat.

  However, the extending distance along the Z axis of the first protrusion 201 and the protrusion 162 is set so that the state where the first protrusion 201 and the free end FT are in contact with each other is maintained. With such a setting, when the movable portions 15ma and 15mb are deformed to displace the free end FT in the + Z direction, the free end FT does not come into contact with the first protrusion 201 and is swung away. Operation is prevented.

  Further, at this time, both the first and second parallel springs 12 and 14 have a large displacement in the + Z direction position of the joint portion PG2 with respect to the connection portion PG1, that is, bending deformation (flexure deformation) of the plate member EB. That is, each plate member EB is elastically deformed and stress (elastic force) is charged so that each joint portion PG2 is displaced toward the lid layer 10 side.

  Therefore, the lens group 20 is pressed against the upper end surface of the protrusion 162 of the lens position adjusting layer 16 by the elastic force generated in each plate member EB. The pressing force of the lens group 20 against the protrusion 162 suppresses the occurrence of deviations in the posture and position of the lens group 20 such as the tilt amount regardless of the holding posture of the camera module 500 by the user.

○ Mounting of image sensor substrate (process G):
In step SP7, the lens position adjusting layer sheet is bonded so that the outer peripheral portion of the image sensor substrate 178 is bonded to the frame 161 of the lens position adjusting layer 16 of the unit formed by bonding the lens position adjusting layer 16. The other main surface of the imaging element substrate sheet U178 is bonded to one main surface of U16.

○ Dicing (Process H):
In step SP8, a large number of lens groups 20 are inserted, and a laminated member U500 formed by laminating eight sheets U10 to U16 and U178 is protected by a dicing tape or the like and then separated for each chip by a dicing device. It is. At this time, a large number of camera modules 500 are completed.

  40 and 41 are views showing a state of laying the side surface wiring 22 in the dicing process. FIG. 40 shows the laminated member U500 of the two types of dicing lines L1 and L2 shown in FIGS. As a result of being cut out by cutting along the dicing line L1, four camera modules among a plurality of camera modules 500 arranged in a line (that is, in a one-dimensional array) are displayed. FIG. 41 shows a state in which a plurality of side-surface wirings 22 are provided on a strip-shaped cut surface PL1 in which cross sections of a plurality of camera modules 500 arranged in a one-dimensional array as shown in FIG. 40 are exposed. Show.

  The side wiring 22 is disposed by patterning a conductive material such as silver by screen printing or the like.

  Here, the side wirings 22 except for the side wirings 22 at both ends are arranged on the dicing line L2 that forms the boundary between the two camera modules, and when the dicing is performed on the dicing line L2, the adjacent camera modules are arranged. 500 side wirings 22 are divided.

  Therefore, for each camera module 500, by adopting a configuration in which the side surface wiring 22 is provided on only one of the plurality of cut surfaces constituting the side surface of the camera module 500, the cut surface PL1 has a plurality of functional element array layers. Are formed in the dicing process of the laminated structure (ie, the laminated member U500), all the signal transmission parts (ie, the side wiring parts 22) required for each camera module 500 are connected to the laminated structure. Since all the camera modules 500 exposed on the cut surface PL1 can be provided at a time, the manufacturing efficiency of the camera module 500 can be improved.

<Modification>
The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention.

  For example, in the above embodiment, the side wiring 22 is adopted, and the drive signal for driving the movable portion of the actuator layer 15 is supplied to the actuator layer 15 from the imaging element layer 18 side via the side wiring 22. However, it is not limited to this. For example, a side electrode may be provided on a cut surface constituting the side surface of the optical unit KB instead of using the side surface wiring 22. Hereinafter, a specific example will be described. Note that a structure for arranging the lens group 20 at the initial position may be provided in the lens group 20 itself without providing the lens position adjusting layer 16.

  42 is a schematic cross-sectional view of a camera module 500A according to a modification of the present invention, and FIG. 43 is a side external view of the camera module 500A according to a modification of the present invention.

  As shown in FIG. 42, in the camera module 500A according to the modified example, the side surface electrode 23 is provided instead of the side surface wiring 22, and the image sensor of the camera module 500 is provided on the image sensor layer 18A of the image capturing unit PBA. As a difference from the layer 18, the supply electrodes 18Ta and 18Tb and the through electrodes 18La and 18Lb are not provided. Except for the side electrode 23 and the imaging element layer 18A, the camera module 500A has the same configuration as the camera module 500. In addition, the mobile phone 100A according to the modification includes a first housing 200A provided with a camera module 500A. Regarding the other parts, since the mobile phone 100 according to the above embodiment and the mobile phone 100A according to this modification have the same configuration, the same reference numerals are given and description thereof is omitted, and the configuration of the camera module 500A is hereinafter described. Of these, the configuration different from the camera module 500 will be described.

  As shown in FIGS. 42 and 43, the side electrode 23 is disposed on one of the side surfaces of the camera module 500A, that is, the four cut surfaces, like the side wiring 22 of the camera module 500. Unlike the side surface wiring 22, it is not disposed up to the imaging unit PBA, and is disposed only on the cut surface constituting the optical unit KB.

  In other words, the optical unit KB of the camera module 500A has an outer edge formed by a cut surface in which the functional layers constituting the optical unit KB are stacked, and the actuator layer 15 of the optical unit KB is It has a side electrode 23 for transmitting a drive signal for displacing the movable parts 15ma and 15mb to the actuator layer 15, and the side electrode 23 is a drive electrode provided on the outer edge of the heater layer 153 of the actuator layer 15. It is electrically connected to 153t.

  Here, as described above, the imaging element layer 18A does not have a supply electrode and a through electrode for supplying a drive signal for driving the movable portions 15ma and 15mb. For example, wiring for supplying a drive signal for driving the movable portions 15ma and 15mb directly from the main body of the mobile phone 100A without going through the imaging element layer 18A is provided.

  As described above, when the side electrode 23 disposed only in the optical unit KB is employed, only the optical unit KB is shipped to the customer, and the steps after the mounting of the imaging element substrate sheet U178 are performed at the customer. You can also.

  Further, according to the configuration of the optical unit KB of the camera module 500A, each optical unit KB formed in the process of dicing the laminated structure in which the sheets related to the respective functional layers constituting the optical unit KB are laminated is configured. Since the side electrode 23 can be provided on the cut surface to be formed, it is not necessary to provide the signal transmission unit through the laminated structure, and the signal transmission unit can be easily created.

  In addition, regarding the optical unit KB of the camera module 500A, the configuration and arrangement method of the drive electrode 153t provided in the actuator layer, and the notch 143 and the notch 143 provided on the outer edge of the second parallel spring layer 14 are formed. The parallel spring insulating portion 21 is configured and created using the same configuration and arrangement / creation method as the optical unit KB of the camera module 500, and thus has the same effect.

  In addition, the arrangement method of the side electrode 23 in the dicing process due to the use of the configuration of the side electrode 23 and the effect produced by the arrangement are the same as the arrangement method of the side wiring 22. Adopted and produces a similar effect.

  Next, a modified example of the drive electrode of the actuator layer will be described. FIG. 44 is a diagram showing a modified example related to the configuration of the actuator layer 15 of the present invention, and FIG. 45 is a diagram showing a state of manufacturing an actuator layer sheet according to the modified example. 44 and 45 show a state in which the layers from the base layer and the base layer sheet to the heater layer and the heater layer sheet are sequentially laminated.

  As shown in FIG. 44, the actuator layer 15 has an intra-layer wiring (that is, the thin film resistors 153a and 153b and the wiring portion 153c) for supplying driving signals of the movable portions 15ma and 15mb to the movable portion, A through electrode 15p that is electrically conductive is provided so as to penetrate the actuator layer 15 from the in-layer wiring to the outside (one main surface side) of the actuator layer 15. Similar to the drive electrode 153t shown in FIG. 16C, the through electrode 15p functions as a drive electrode for supplying drive signals of the movable portions 15ma and 15mb to the movable portion.

  In addition, as shown in FIG. 45, the through electrode 15p is formed, for example, when each of the camera modules is diced in a laminated structure in which a base layer sheet U151, a first insulating layer sheet U152, and a heater layer sheet U153 are laminated. It is formed by opening through holes at the intersections of the dicing lines L1 and L2 corresponding to the four boundaries by etching or the like and plating with copper or the like to ensure conduction with the heater pattern. In FIG. 45, the through electrode 15p is provided at the intersection of the dicing lines L1 and L2, but only one dicing line corresponding to the boundary between the two camera modules penetrates depending on the position of the wiring in the heater layer. You may provide in the position which passes the electrode 15p.

  If the through electrode 15p is employed, the through electrode 15p provided at the intersection of the dicing lines L1 and L2 is diced to drive the portion where the cut surface of the through electrode 15p is exposed to the cut surface of the camera module. Since it can be used as an electrode, the area of the drive electrode can be increased compared to the case where the end of the in-layer wiring of the heater layer 153 is used as the drive electrode, and the signal transmission section (side wiring 22 and side electrode 23 ) And the in-layer wiring of the heater layer 153 can be electrically connected more reliably.

  Further, since the through electrode adopts a configuration that penetrates only the actuator layer 15, it is easier to create than the case where a through electrode that penetrates a plurality of functional layers including other functional layers is provided. From the standpoint of ensuring effective conduction, more reliable conduction is ensured.

  In the above embodiment, SMA is used as the displacement elements 155a and 155b. However, the present invention is not limited to this. For example, a so-called bi-metallic strip may be used. When a bimetal is adopted as the displacement element, a film made of a material having a coefficient of thermal expansion different from that of the substrate may be formed instead of SMA. That is, the movable part may be configured to include a substrate and a thin film formed on the substrate and having a different coefficient of thermal expansion from the substrate.

  As a specific example, there is a configuration in which a layer (metal layer) of a metal material such as aluminum or nickel is formed on one main surface side of the substrate of the movable part made of Si. In such a configuration, when the substrate and the metal layer are heated by energization of the heater layer, the movable portion is deformed due to the difference in thermal expansion coefficient, and the free end of the movable portion is displaced in the + Z direction.

  Even when a bimetal is used as the displacement element, the same effect as in the above embodiment can be obtained. Note that the free end of the movable part tends to be displaced unintentionally in proportion to changes in the environmental temperature. However, for example, when the lens group 20 is pressed in the −Z direction against the lens position adjustment layer 16 by the first and second parallel springs in the non-driven state, the movable portion 15ma and the upper limit of the assumed use environment temperature If 15 mb is larger than the force exerted on the lens group 20, the posture of the lens group 20 is not broken.

  Moreover, as a displacement element, you may use the thin film (piezoelectric thin film) of piezoelectric elements, such as an inorganic piezoelectric material (PZT) or an organic piezoelectric material (PVDF), for example. That is, the movable part may be configured to include a substrate and a thin film of a piezoelectric element formed on the substrate. When a piezoelectric thin film is used as the displacement element, an electrode, a piezoelectric thin film, and an electrode are formed on the Si substrate in this order using a sputtering method or the like, and poling with a high electric field is performed.

  Note that it is needless to say that a part of each of the above embodiments and various modifications can be appropriately combined within a consistent range.

DESCRIPTION OF SYMBOLS 10 Cover layer 11 1st frame layer 12 1st parallel spring 13 2nd frame layer 14 2nd parallel spring 15 Actuator layer 16 Lens position adjustment layer 17 Cover glass layer 18, 18A Imaging element layer 20 Lens group 162 Protrusion part 178 Imaging element Substrate 181 Imaging element 201 First projection 202 Second projection 203 Third projection 500, 500A Camera module KB Optical unit PB, PBA Imaging unit

Claims (11)

An image sensor layer having an image sensor section;
A lens layer capable of changing a distance from the imaging element layer;
An actuator layer having a movable part for moving the lens layer;
A laminated structure formed by laminating a plurality of layers including:
A signal transmission unit for transmitting a drive signal for driving the movable unit from the imaging element layer side to the actuator layer;
An imaging device comprising:
The side part of the laminated structure is constituted by a plurality of cut surfaces,
The actuator layer further includes a drive electrode exposed to the cut surface that transmits the drive signal from the outside of the actuator layer to the movable part side, and
The imaging element layer further includes a supply electrode exposed on the cut surface that transmits the drive signal from the imaging element layer side to the drive electrode side,
The imaging apparatus, wherein the signal transmission unit is disposed on the cut surface so as to be electrically connected to each of the drive electrode and the supply electrode. The imaging apparatus according to claim 1,
The actuator layer is provided with an intra-layer wiring that supplies the drive signal to the movable part,
The image pickup apparatus, wherein the drive electrode is formed by exposing an end portion of the in-layer wiring to the cut surface and forming a part of the cut surface. The imaging apparatus according to claim 1,
The actuator layer penetrates the actuator layer from the intra-layer wiring to the outside of the actuator layer while being electrically connected to the intra-layer wiring that supplies the drive signal to the movable portion. A through electrode is provided,
The drive device is an image pickup apparatus in which a part of the through electrode is exposed to the cut surface to form a part of the cut surface. The imaging apparatus according to claim 1,
The image pickup apparatus, wherein the signal transmission unit is provided on only one of the plurality of cut surfaces. The imaging apparatus according to claim 1,
The plurality of layers further includes an elastic member layer interposed between the lens layer and the actuator layer to movably support the lens layer,
The imaging apparatus according to claim 1, wherein the elastic member layer has a cutout portion provided with an insulating portion for electrically insulating the elastic member layer and the signal transmission portion at an outer edge of the elastic member layer. A lens layer movably supported;
An actuator layer having a movable part for moving the lens layer;
A laminated structure formed by laminating a plurality of layers including:
A signal transmission unit configured to transmit a driving signal for driving the movable unit from the outside of the multilayer structure to the actuator layer;
An optical unit comprising:
The side part of the laminated structure is constituted by a plurality of cut surfaces,
The actuator layer further includes a drive electrode exposed to the cut surface that transmits the drive signal from the outside of the actuator layer to the movable part side, and
The optical unit, wherein the signal transmission unit is an electrode disposed on the cut surface so as to be electrically connected to the drive electrode. The optical unit according to claim 6,
The actuator layer is provided with an intra-layer wiring that supplies the drive signal to the movable part,
The optical unit, wherein the drive electrode is formed by exposing the intra-layer wiring to the cut surface and forming a part of the cut surface. The optical unit according to claim 6,
The actuator layer penetrates the actuator layer from the intra-layer wiring to the outside of the actuator layer while being electrically connected to the intra-layer wiring that supplies the drive signal to the movable portion. A through electrode is provided,
The drive unit is an optical unit in which a part of the through electrode is exposed to the cut surface to form a part of the cut surface. The optical unit according to claim 6,
The optical unit, wherein the signal transmission unit is provided on only one of the plurality of cut surfaces. The optical unit according to claim 6,
The plurality of layers further includes an elastic member layer interposed between the lens layer and the actuator layer to movably support the lens layer,
2. The optical unit according to claim 1, wherein the elastic member layer has a notch portion provided with an insulating portion for electrically insulating the elastic member layer and the signal transmission portion at an outer edge of the elastic member layer. An image sensor layer having an image sensor section;
A lens layer capable of changing a distance from the imaging element layer;
An actuator layer having a movable part for moving the lens layer;
A laminated structure formed by laminating a plurality of layers including:
A signal transmission unit disposed between the actuator layer and the imaging element layer and transmitting a drive signal for driving the movable part from the imaging element layer side to the actuator layer;
A method of manufacturing an imaging device comprising:
(A) an image pickup device substrate sheet having a plurality of the image pickup device layers;
An actuator layer sheet having a plurality of the actuator layers,
A plurality of sheets including
A plurality of the lens layers arranged;
Laminating layers to create a laminated member;
(B) a dicing step of creating a plurality of the imaging devices by dividing the laminated member into pieces by cutting;
With
In the dicing step, the signal transmission unit is disposed along a cut surface of the laminated member in which a plurality of the imaging devices are arranged in a line.

Images