JP2011058954A - Substrate inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To display instructions when parts are to be assembled to a substrate at the section of a substrate inspection apparatus and when the same parts are to be assembled. <P>SOLUTION: The substrate inspection apparatus, comprising an imaging means for capturing the actual mounting state of electronic parts as image data at a desired position to be inspected in a mounting substrate set to an inspection position, an image memory means for storing, in a paired state, image data indicating the actual mounting state of the electronic parts captured by the imaging means and image data indicating a correct mounting state specified corresponding to the electronic parts, an image processing means for determining the degree of matching between an image indicating the actual mounting state of the electronic parts and a correct image indicating the correct mounting state of the electronic parts, and an image display means, is provide with both of a storage means for storing previously taught instruction data and an instruction display control means for displaying the instruction data stored in the instruction data storage means on the image display means, so that the image display means can display instructions indicating the mounting operations of the electronic parts to the corresponding substrate in setting a substrate to which electronic parts etc. have not been mounted to the substrate inspection position and mounting electronic parts. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate inspection apparatus that determines whether or not a mounting state of an electronic component or the like on a printed circuit board is visually inspected using a predetermined imaging means.

  For example, an image showing an actual mounting state of an electronic component or the like imaged by an imaging means such as a CCD camera as a board inspection device that performs a suitability inspection of the mounting state of electronic components or the like on a printed circuit board based on predetermined inspection execution instruction data Image storage means for storing data and image data indicating a correct mounting state that has been pre-teached designated corresponding to the same electronic component, the actual captured image, and the teaching image; An image determination means for determining the degree of coincidence of the image and a visual determination means for again determining the degree of coincidence between the two images determined to be inconsistent by the image determination means with human eyes, and the determination by the image determination means In addition, there is one that can perform redetermination by the visual judgment means (see, for example, Patent Document 1).

  According to the board inspection apparatus having such a configuration, the actual mounting state of each electronic component for each position to be inspected on the board is captured as image data, and appropriate teaching is performed in advance corresponding to each of them. It is compared with the image data in the mounting state, and suitability is automatically and accurately determined based on the match or mismatch. Thereafter, the two images are visually determined as necessary.

  Therefore, the inspection device has much higher inspection accuracy than visual judgment and can inspect a large number of substrates efficiently. It is suitable not only for board inspection of production-type boards, but also for use in a board production line for producing a large number of boards of the same type such as in-line specifications.

JP 2007-178312 A

  As described above, the conventional board inspection apparatus has a role of determining the suitability of the mounting state of the mounting board on which the electronic component has already been mounted, and has no function beyond that.

  However, considering the inspection of high-mix and low-volume substrates such as the above-mentioned cell production models, unlike the in-line specification, a substrate on which electronic components etc. are manually mounted at a different location can be You have to carry them to the place and set them one by one for inspection.

  Therefore, the component mounting operation and the inspection operation cannot be performed as a continuous process, and the production efficiency is very poor.

  As a measure to solve such problems, set the board before mounting electronic parts in advance to the inspection position of the board inspection device, assemble the necessary electronic parts in the set state, and then mount the board If the inspection is performed, the production efficiency is increased to some extent.

  However, that alone can only provide benefits such as space savings due to the common mounting space and inspection space of the mounting board, and elimination of the work of transporting the mounting board. It has not led to improvement in work efficiency.

  The present invention has been made based on such circumstances, and enables the assembly of electronic components to the board at the board inspection position as described above, and the board inspection apparatus has an inspection function. Display the instruction image indicating the type and assembly position of the electronic components to be mounted on the board set at the inspection position of the board inspection apparatus using the image processing function and the display function Accordingly, it is an object of the present invention to provide a board inspection apparatus capable of improving the work efficiency of assembling an electronic component onto a board without an electronic component.

  In order to achieve the above object, the present invention is configured with the following problem solving means.

(1) The problem solving means of the invention of claim 1 The problem solving means of the invention of claim 1 captures, as image data, an actual mounting state of an electronic component at a desired inspection target position of a mounting board set at an inspection position. Image storage means for storing in a pair a pair of imaging means, image data indicating the actual mounting state of the electronic component captured by the imaging means, and image data indicating the correct mounting state designated corresponding to the electronic component And an image processing means for determining the degree of coincidence between the image indicating the actual mounting state of the electronic component and a positive image indicating the correct mounting state of the electronic component, and a board inspection apparatus comprising an image display means, Storage means for storing instruction data that has been taught in advance, and instruction display control means for displaying the instruction data stored in the instruction data storage means on the image display means If an unmounted board such as an electronic component is set at the board inspection position and the electronic component is mounted, an instruction for instructing the mounting operation of the electronic component on the corresponding board is displayed on the image display means. It is characterized by having been made.

  According to such a configuration, it is easy to understand in the form of a work instruction how to mount electronic work in what position on the target board, how to proceed with the mounting work including the order, and display the image. An image is displayed on the screen of the means.

  Therefore, the worker only needs to proceed with the mounting work in accordance with the instructions shown in the instructions on the display screen, and perform the assembly work of the electronic components quickly, properly and without error. Will be able to.

  As a result, the working efficiency of the mounting work is greatly improved.

  When the mounting operation is completed, the proper mounting state is checked by using the above-described original board inspection function, and necessary suitability data is obtained.

  As a result, in the above configuration, a series of processes from the mounting operation of the electronic component to the board to the inspection of the electronic component mounting state after completion of the mounting work can be performed at the inspection position of the board inspection apparatus. , Work efficiency and work accuracy are greatly improved.

(2) The problem solving means of the invention of claim 2 The problem solving means of the invention of claim 2 has a function of creating an instruction in the configuration of the problem solving means of the invention of claim 1 above, An appropriate electronic component mounting state of a non-defective substrate is imaged by an imaging means and taught as instruction data.

  According to such a configuration, what electronic component is to be mounted at what position on the target board, how to proceed with the mounting work including the order, and the work instruction indicating the mounting method in the form of an image display, It is completely realized in the part of the board inspection apparatus that performs the mounting operation, and can be registered and managed as library data.

(3) Problem solving means of the invention of claim 3 The problem solving means of the invention of claim 3 is the structure of the problem solving means of the invention of claim 1 or 2, wherein the instruction data is in accordance with a necessary work process flow. These are created for each work unit in the work process flow and displayed as an image.

  According to such a configuration, an operator who assembles a component or the like on the board sequentially displays the instruction image for each work unit to be performed in the work process according to the progress flow of the work process. In the case of an instruction such as paper, any continuous and efficient mounting operation can be performed.

(4) Problem solving means of the invention of claim 4 The problem solving means of the invention of claim 4 is the structure of the problem solving means of the invention of claim 1, 2 or 3, wherein the screen of the image display means An overall image of the board showing the work position on the work board being performed and an enlarged image showing the assembly state of components at the work position on the board are displayed simultaneously as a work sample image It is what.

  According to such a configuration, it becomes possible to easily assemble parts in an appropriate state at an appropriate position with respect to the substrate, and work efficiency is greatly improved.

  As a result of the above, according to the present invention, a series of steps from the mounting operation of the electronic component to the substrate to the inspection of the electronic component mounting state after the completion of the mounting operation can be executed on the inspection position of the substrate inspection device. As a result, work efficiency and work accuracy are greatly improved.

It is sectional drawing which shows the structure of the main-body part of the board | substrate inspection apparatus which concerns on embodiment of this invention. It is a front view of the same apparatus. It is a block diagram which shows the electrical system configuration | structure of the apparatus. It is a conceptual diagram which shows the working environment at the time of attaching an electronic component with respect to a board | substrate using the same apparatus. It is a flowchart which shows the relationship between the work instruction | indication preparation function in the same apparatus, the component assembly work based on the work instruction, and the collation inspection function of a part accompanying it. 6 is an operation menu screen corresponding to the flowchart of FIG. 5 in the personal computer of the apparatus. 6 is a registration screen when creating work order data in the flowchart of FIG. 5. It is an example (when the components to be assembled are resistors) of the work order registration screen of the same device. It is an example of the work order registration screen of the apparatus (when the part to be assembled is a retrofitted part). It is an example (when the components to be assembled are connectors) of the work order registration screen of the same apparatus. It is an example of the image display which shows the content of the work instruction | indication of the apparatus (when the components assembled | attached are resistance components). It is an example of the image display which shows the content of the work instruction | indication of the apparatus (when the components assembled | attached are retrofitting components). It is an example of the image display which shows the content of the work instruction | indication of the apparatus (when the components assembled | attached are connector components). It is a figure which shows the registration screen of the test | inspection data of the component collation test | inspection performed visually after completion of the component manual insertion of the apparatus. It is a figure of an example of the image display on the monitor screen at the time of the component collation inspection by the same apparatus visually (when comparing a normal image and a real image). It is a figure of an example of the image display on the monitor screen at the time of the component collation inspection by the same apparatus visually (when comparing a normal image with the component on an actual board | substrate).

  Hereinafter, referring to FIGS. 1 to 16, in addition to the function of inspecting the state of mounting a board after completion of mounting of electronic components, etc., the embodiment of the present invention is added with a work instruction function when mounting electronic components on an unmounted board. A configuration of the substrate inspection apparatus according to the embodiment will be described.

<Configuration of main body of substrate inspection device>
As shown in FIGS. 1 and 2, for example, the board inspection apparatus 1 includes a board setting apparatus 3 for setting a printed board (hereinafter simply referred to as a board) 2 on which electronic components C _{1 to} C _M as inspection objects are mounted. A base 5 having a pair of left and right guide rails 4 and 4 for moving the substrate setting device 3 in the front-rear direction in the state of FIG. 1, and a guide extending above the substrate setting device 3 in a direction perpendicular to the drawing sheet. A high-speed imaging camera 6 that is guided and moved by rails 7, 7, a camera head support base 8 that has the guide rails 7, 7 and is supported by the base 5, various drive power supplies, etc. And a built-in power supply device 9.

  The substrate setting device 3 includes a movable table (substrate table) 11 guided in the front-rear direction on the pair of left and right guide rails 4 and 4 via a pair of left and right slide members 11a to 11c and 11a to 11c. It comprises a worm gear shaft 18 for driving the table 11 in the front-rear direction and a pair of set tables 12a and 12b erected to set the substrate 2 on the movable table 11. The upper end is provided with a locking portion 13a in which a concave portion for engaging the front end side (back side) of the substrate 2 is provided, while the front (front side) set base 12b portion has its upper end. A hook-like lock member 14 that locks the base end side (front side) of the substrate 2 that is locked to the locking portion 13b provided on the shaft is pivotally supported by the support shaft 10 so as to be pivotable in the front-rear direction. A U-shaped coil wound around the spindle 10 It is provided in a state of being biased in the locking direction by an opening spring 15.

  Further, at the front end of the base 5, when the movable table 11 moves to the front side in the figure (the left side in the drawing), the lower end of the hook-shaped lock member 14 is pressed in the reverse direction to An unlocking member (protruding piece) 5a is provided to turn the locking member 14 in the direction of releasing the locking of the locking member 14 with respect to the substrate 2 against the urging force in the locking direction.

  The worm gear shaft 18 for driving the moving table 11 is supported by bearings 16a and 16b at both front and rear ends thereof, and is driven to rotate by a motor M. On the way, the worm gear shaft 18 is fixed to the moving table 11 side. A linkage member 16c that can slide and rotate relative to the gear shaft 18 is screwed together.

  On the other hand, the imaging camera 6 includes a slider 17 that is guided and moved by the guide rails 7 and 7, and a camera main body of a high-speed imaging camera (CCD) 6 that supports the slider 17 on the lower surface and functions as imaging means. 6a, a magnification lens portion 6b of the high-speed imaging camera 6 suspended downward from the front end portion of the camera body portion 6a, and a telecentric lens portion 6c provided continuously with the lower end of the magnification lens portion 6b. .

  The magnification lens portion 6b and the telecentric lens portion 6c are covered with a cylindrical hood member 19 having a desired size. Inside the hood member 19, a center illumination 19a, a top illumination 19b, Three sets of illumination means of the side illumination 19c are provided, and the inspection target position on the substrate 2 at the time of imaging is brightly imaged clearly and without reflection.

  And the image imaged by the camera main-body part 6a of the said high-speed imaging camera (henceforth only an imaging camera) 6 is transmitted to the image processing apparatus like FIG. 3 which consists of the personal computer 25 shown, for example in FIG. The image processing apparatus uses the camera body 6a of the imaging camera 6 under predetermined illumination conditions by the illuminating means to cause the substrate 2 and the electronic on the substrate 2 to pass through the magnification lens portion 6b and the telecentric lens portion 6c. An electronic device that holds each image data obtained by imaging a component and specifically instructs a method for inspecting a substrate 2 on which electronic components are mounted as described later and a method for mounting an electronic component on a non-mounted substrate 2. Calculation processing necessary for creating a general instruction and displaying the contents of the created instruction.

<System configuration of image processing apparatus>
The image processing apparatus according to this embodiment is roughly divided into three parts: an image input unit, an image processing unit, and a monitor unit. The main processing function of the image processing unit is constituted by the personal computer 25 shown in FIG.

For example, as shown in FIG. 3, the image input unit includes the above-described imaging camera 6 provided facing the upper side of the substrate 2 set at a predetermined inspection position on the movable table 11 of the substrate inspection apparatus 1. , parts for inspection on the inspected substrate 2 imaged by the imaging camera 6 (IC, resistors, capacitors, connectors, coil and other electronic components) C ₁ -C _M inspection image data temporarily memory images A normal image data memory 23 for a non-defective substrate that temporarily stores the normal image data read from the normal image data memory 21A on the personal computer 25 side via the data transfer means 22, and the above-mentioned image data to be inspected The inspection image data of the inspected substrate 2 stored in the memory 20 and the normal image data of the non-defective substrate stored in the normal image data memory 23 are respectively input. Image processing determination means 24 for comparing whether or not the two match each other, a first monitor screen 25A for displaying the inspected image data, and a second monitor screen for displaying the normal image data of the non-defective substrate 25B and the images displayed on the first and second monitor screens 25A and 25B are visually checked by the inspector W to compare (collate), and the inspector W is manually operated according to the determination result. The visual judgment means 27 having the match button 21d or the non-match button 21c and the defective image data in the image data to be inspected inputted to the first monitor screen 25A are transferred to the defective image data memory 33 and sequentially stored. And defective image data transfer means 32.

First, among the camera position data group 21B in the inspection instruction memory 21 that has been taught in advance, the position data C ₁ ′ corresponding to the component C ₁ to be inspected on the substrate 2 to be inspected is the inspection data transfer means 22. Is sent to the position control means 30 of the inspection image pickup camera 6, and the inspection image pickup camera 6 is moved by the position control means 30 to the position C ₁ ′ of the part C _{1 to} be inspected.

At this position, the mounting state of the component to be inspected C ₁ , which is one of the component groups on the substrate 2 after mounting, on the actual substrate 2 is determined by the imaging camera 6 for inputting the image to be inspected. It is taken as inspected image data b ₁ , transferred to the inspected image comparison memory 20 and temporarily stored.

On the other hand, out of the positive image data group 21A coexisting with the camera position data group 21A in the inspection instruction memory 21, the positive image data corresponding to the inspection target part C ₁ (the part C ₁ is correctly attached). The non-defective substrate image data) a ₁ is transferred to the normal image data memory 23 by the inspection data transfer means 22 and temporarily stored. Then, the inspected data image determination means 24 uses the inspected image data b ₁ stored in the inspected image data memory 20 and the positive image data a ₁ stored in the positive image data memory 23 as image processing determination means. Compare by 24.

When it is _first determined that the data b ₁ and a ₁ match, a signal is applied from the next inspection start terminal 24a to the inspection start terminal 22a of the data transfer means 22 via the signal repeater 31. The next inspection operation of the component C ₂ to be inspected is started using the next position data b ₂ and the normal image data a ₂ .

On the other hand, if the image processing determination means 24 determines that no match is found between the data b ₁ and a ₁ , the visual inspection start terminal 24b outputs an image data capture signal. Then, the first monitor screen 25A as the inspection image data display means and the second monitor screen 25B as the normal image data display means respectively capture the corresponding image data and display the images.

  The inspector W visually compares the inspected image displayed on the first monitor screen 25A and the positive image displayed on the second monitor screen 25B, and the inspected image matches the positive image. If it is determined, the match button 21d of the visual determination means 27 is pressed. Then, a test start command signal for the test start terminal 22a on the data transfer means 22 side is output from the next test start terminal 27b via the signal repeater 31.

  If the inspector W determines that the two images are not the same, the examiner W presses the non-match button 21c. As a result, an inspection start command signal is sent from the other next inspection start terminal 27 a to the inspection start terminal 22 a via the signal repeater 31, and defective image data is sent to the defective inspected image data memory 33. A defective image data transfer instruction signal is output to the defective inspected image data transfer means 32 for transfer. As a result, the defective inspection image data is sequentially accumulated in the defective inspection image data memory 33.

  Of course, two monitor devices can be used for the first and second monitor screens 25A and 25B. In this embodiment, for example, as shown in FIG. By displaying a plurality of frames of images on the monitor screen of the personal computer 25, the first and second monitor screens 21A and 21B are obtained.

  Further, as described above, the normal image data for the component verification inspection can be easily obtained by taking an image of a non-defective board using the imaging camera 6, and the image data is shown in FIG. 14, for example. It is managed using such a registration screen.

  In other words, as shown in FIG. 14, the inspection data registration screen can be managed for either the board or the component. Therefore, it is easy to deploy horizontally when changing the board and components.

  In addition, since the registration information has a figure number, model name, and the like, inspection data can be easily managed and searched.

<Assembly work of electronic parts using board inspection equipment>
As described above, the conventional board inspection apparatus is responsible for inspecting the suitability of the electronic component mounting state of the mounting board 2 on which the electronic parts are already mounted, and has no further function. .

  However, considering the above-mentioned inspection of high-mix / low-volume substrates such as cell production models, unlike the case of in-line specifications, the electronic manual is based on the corresponding paper work instructions at different locations. Various boards on which components are mounted must be transported to the board inspection apparatus and set one by one for inspection.

  Therefore, it is difficult to capture and input non-defective board data to be subjected to image determination, and the component mounting operation and the inspection operation cannot be performed as a continuous process.

  As a measure to solve such problems, set the board before mounting electronic parts in advance to the inspection position of the board inspection device, assemble the necessary electronic parts in the set state, and then mount the board If the inspection is performed, the production efficiency is increased to some extent.

  However, that alone can only provide benefits such as space savings due to the common mounting space and inspection space of the mounting board, and elimination of the work of transporting the mounting board. It does not lead to improvement of work efficiency.

  The present invention has been made based on such circumstances, and enables the assembly of electronic components to the board 2 at the board inspection position of the board inspection apparatus 1 described above. Using the above-described image processing function and display function possessed for the function, the type, assembly position, and assembly of electronic components to be mounted on the substrate 2 set at the inspection position of the substrate inspection apparatus 1 By displaying on the screen an instruction book image (electronic instruction book) showing attachment methods, precautions when assembling, etc., it is possible to improve the efficiency of assembling the electronic components onto the electronic component non-board 2 Yes.

<Instruction creation and instruction display, parts verification inspection function>
For this reason, in the board inspection apparatus of this embodiment, as a system, for example, as shown in the flowchart of FIG. 5, an electronic order creation function, the same order display function, a part verification inspection data generation function, a part verification inspection function Respectively.

When the system is activated, a menu screen as shown in FIG. 6 is displayed. By selecting a desired menu on the menu screen, the instruction creation control in steps S _{2 to} S ₅ or steps S ₂ and S _{2 are performed} . ₃ , S ₆ -S ₈ instruction display control, steps S ₂ , S ₉ , S ₁₀ , S ₁₁ , S ₁₂ parts verification inspection data creation control, steps S ₂ , S ₉ , S ₁₀ , S ₁₃ -S _Fifteen parts verification inspection control is performed.

That is, in the electronic orders system of this embodiment, when starting the same system, the menu screen of FIG. 6 is displayed first in step S _1.

  This menu screen is an electronic instruction function, an electronic instruction creation mode, and an operation mode in which the electronic instructions created in the electronic instruction creation mode are displayed and the electronic parts are assembled to an unequipped board. In addition, after the completion of the assembly of the electronic component to the non-mounted board in this way, the component verification inspection data is used as a component verification inspection function for performing a verification check on the suitability of the assembled state of the assembled component. There are two types and two sets of operation menus of a creation mode and a component verification inspection mode in which a component verification inspection is performed using the component verification inspection data created in the creation mode.

Therefore, any menu required corresponding to this is selected. For example first selected electronic orders function (YES at Step S _2), followed by selecting the electronic orders creation mode in the electronic orders function (YES at Step S _3), or there is an electron orders function, electronic selecting a working mode by the electronic orders created by orders creation mode (YES in step S _6). Rather than the menu desired by the other user electronic orders function (in step S ₂ NO, YES in step S ₉₎ when a component verification test function is subsequently parts verification test data generation mode in the component verification inspection function select (YES in step S _9, and the case of YES at step S _10), or components to select components verification test mode in the verification test function (YES in step S ₉ and NO in step S _10, step S _13, If YES)

  Then, the following measures are taken on the system according to the respective cases.

That is, the electronic orders function is selected (YES at Step S _2), in a case where electronic orders creation mode of which has been selected (YES in step S _2, and YES in step S _3), for example, as shown in the flowchart of FIG. 5, first, the process proceeds to step S _4, already refers to the registration data registered managed as standard library data, then proceeds to step S _5, the registration data as required Is updated to create an electronic order corresponding to the new work content.

Moreover, whereas the electronic orders function is selected YES (YES in step S _2), when the electronic orders work mode of which is selected (YES at step S _2, and in step S ₃ NO, in step S ₆ the cases), for example, as shown in the flowchart of FIG. 5, first, the process proceeds to step S _7, selects a predetermined work in a given work process, a proper working state of the task in the subsequent step S ₈ The work sample screen shown is displayed, and the work in the corresponding work mode (part assembly) is executed.

On the other hand, parts verification test function is selected (YES in step S _9), YES if (step S ₂ of component verification test data generation system of which has been selected NO, YES in step S _9, and in Step S ₁₀ the cases), for example, as shown in the flowchart of FIG. 5, first, the process proceeds to step S _11, already refers to the registration data registered managed as standard library data, further proceeds to step S _12, requires Accordingly, new component verification inspection data is created (updated) based on the data newly created in the above-described electronic instruction creation mode.

The component verification inspection function is selected (in step S ₉ YES), if the component verification test mode of which has been selected (YES in step S _9, and NO in step S _10, YES in step S ₁₃ the), for example as shown in the flowchart of FIG. 5, first, after selecting the parts matching inspection work proceeds to step S _14, components such as described below with reference to the component verification inspection data further proceeds to step S ₁₅ Perform a verification check.

  Details of each of these operations are given by the following description.

<Schematic configuration of the work environment when assembling the electronic components to the unmounted board>
That is, the assembling work of the electronic component using the board inspection apparatus 1 of FIGS. 1 to 3 described above is performed in a working environment as shown in FIG.

  First, reference numeral 1 in FIG. 5 is the above-described board inspection apparatus of FIGS. 1 to 3. In this case, an electronic component is assembled on the movable table 11 of the board setting apparatus 3 of the board inspection apparatus 1. The blank substrate 2 to be tried is set in a state where it is accurately positioned. This setting method is basically the same as in the case of the substrate inspection.

  A personal computer 25 as an image processing apparatus having the above-described monitor screen is combined with the apparatus 1.

  The assembly worker W sits facing the board inspection apparatus 1 as shown in the figure, and a component box in which various electronic components and other components to be mounted on the substrate 2 are stored on the left and right sides thereof. 41a-41d, 41e-41h are installed.

  Then, the assembly worker W samples a proper component mounting state indicating the work content and work method for each work unit in accordance with the flow of the work process described below shown on the monitor screen of the personal computer 25. Based on the image and the entire board image showing the work position, and an instruction book composed of an electronic screen including a display of caution points during work, the parts in the parts boxes 41a to 41d and 41e to 41h are taken out and inserted by hand. go.

<How to create instructions>
(Order data)
As described above, the instruction for assembling the board in the present embodiment is created based on the image data of the non-defective board in which the proper parts are assembled in the proper state at the proper positions. The image data is created by the following method, for example.

  (1) The pre-assembled non-defective substrate is set at the inspection position of the substrate inspection apparatus 1 described above, and is imaged by the imaging camera 6 described above.

  (2) In addition to the imaging by the imaging camera 6, for example, a digital camera is used to take a photograph from a predetermined angle (oblique direction) so that the characters of the electronic components on the non-defective substrate can be seen.

  (3) Using CAD data for board design, obtain data such as part names.

  The instruction data obtained by these methods is registered and managed as library data for standard work, and is corrected as necessary.

(Order registration)
The registration of instructions is managed as an electronic file in the same way as normal drawing management. In the file information, for example, as shown in the model data registration screen of FIG. 7, the order book number, user figure number, model generic name, model name, model progression, process name, process number, registrant, update date, etc. Management items are registered to facilitate management search.

(Instruction creation)
In creating the instructions, for example, a work position image (an image of the entire board in which the target work position is indicated by +) and specific work in the case of manual component insertion as shown in the screens of FIGS. Sample image (enlarged image showing a specific insertion state including a lead part of a resistor, for example, a resistor in the example of FIG. 8, and an enlarged image showing a specific insertion state including a pin portion of a connector in the example of FIG. 10), The work position image (the image of the entire board in which the assembly position of the retrofit part is indicated by +) and the work sample image (the proper mounting state of the retrofitted part are shown) in the case of part retrofit as shown in the screen of FIG. The perspective image shown) is created.

  A sample image of each component in the screens of FIGS. 8 and 10 and an image showing the work position on each substrate in the screens of FIGS. 8 to 10 are taken by the imaging camera 6 from above using the above-mentioned non-defective substrate as a sample. A digital camera image captured by the above-described digital camera (2) is employed as the work sample image that uses the captured image and further shows the component mounting state in the screen of FIG.

  In any of these cases, it can be created at the work site where the assembly work of the part is performed.

  Also, in creating the work sample image for each work process of FIGS. 8 to 10 described above, cursor keys for up / down and left / right image movement (adjustment) are shown in the lower left part of the screen. A predetermined amount of image movement (display position adjustment) can be performed.

  Further, in each of the screens of FIGS. 8 and 9, as information registered in the standard library, for example, the standard work name and the work point for the work shown in the work sample image are specifically described as follows. It is shown in the form of an explanatory note.

For the screen in Figure 8:
Standard working library information
Standard work name Manual part insertion Work point (actual confirmation)
Bill of materials ... 100kΩ / J
Pre-processed ··· Lead bent products (work precautions)
(1) There must be no difference in parts display.

  (2) There should be no scratches on the appearance.

For the screen in FIG. 9:
Standard working library information
Standard work name Parts fixing work Work point (work details)
Work location C761-R715 fixing Parts fixing part Adhesive surface of 6mm or more (work precautions)
(1) Pay attention to the stringing of the bond and do not adhere to any part other than the part.

  (2) Pay attention to the amount applied, and make sure that the bottom surface of the component is properly bonded.

  (3) Use bonds within the storage period.

  As a result, the horizontal development of the standard work for the component mounting work is facilitated.

  In the case of the connector part shown in FIG. 10, registration is performed in the same manner as described above.

<Display of instructions according to the work process flow>
The instructions created as described above are displayed for each work unit according to the flow of the work process, as shown in the screens of FIGS. Of course, also in this case, as work points necessary for the work, for example, actual product confirmation: parts table ... 100 kΩ · J, pre-working ... lead bending finished product, work precautions: there is no difference in parts display, All of the registered standard work information, such as no scratches on the appearance, is displayed.

  In the work screens in the work steps of FIGS. 11 to 13, for example, three cursor keys of “sume”, “return”, and “end” are shown at the bottom of the screen, and they correspond as necessary. It is possible to perform operations.

  Then, the worker sequentially performs the assembly work for each necessary process according to the work position image, the work sample image, and the instruction comment in the work screens of FIGS. 11 to 13, and the assembly work of one process is completed. Then, the above-mentioned “Proceed” key is turned ON. Then, since an instruction for the work of the next process is similarly shown, necessary work in the process is performed again according to the work position image, work sample image and work point comment of the same instruction. In this case, if the user wants to see the previous instruction one more time, the previous instruction is displayed by turning on the “return” key.

  When all the processes are completed in this way, the “end” key is turned on to complete the process.

  According to such a configuration, the mounting method and mounting method for each process including what order and what electronic components are mounted on what position on the target substrate 2 are shown in FIG. ~ The image is displayed in a particularly easy-to-understand manner in the form of an electronic work instruction (monitor screen) shown in FIG.

  Therefore, the assembly worker W has only to proceed with the mounting work for each process in accordance with the instruction content indicated in the instruction document on the display screen. As a result, the assembly work of the electronic parts can be performed quickly.

  In particular, in the case of the above configuration, the contents of the sample image of the current work can always be confirmed directly on the enlarged screen, so the work contents of the process that was difficult to express with conventional paper instructions are also included. It will be possible to confirm clearly for each worker unit.

  As a result, the working efficiency of the mounting work is greatly improved.

  In addition, the board inspection apparatus 1 having the above-described configuration has an instruction book creation function as described above, and the order book creation is performed by picking up an appropriate electronic component mounting state of a non-defective board with the imaging camera 6 from itself. , Teaching it as instruction data.

  Therefore, according to such a configuration, what electronic components are to be mounted on what position on the target board, how to proceed with the mounting work for each process including the order, and the mounting method are displayed as images. The work instructions specifically shown in the form of are realized completely in the part of the board inspection apparatus that performs the mounting work, and can be registered and managed as standard library data.

  Further, the instruction data is created for each work unit in the work process flow according to a necessary work process flow, and is displayed as an image.

  Accordingly, an operator who assembles components or the like on the board 2 sequentially displays the instruction image for each unit of work performed in the work process in accordance with the progress flow of the work process. It enables continuous and efficient mounting work that is difficult with instructions.

  In addition, on the monitor screen of the personal computer 25 which is an image display means, an entire image showing the work position on the work board 2 currently being performed and an enlarged view showing the assembly state of the components at the work position on the board. The image is displayed at the same time in separate frames.

  For this reason, it becomes possible to assemble an appropriate component at an appropriate position with respect to the substrate 2 in an appropriate state, and work efficiency is greatly improved.

<Parts verification inspection>
Then, when the mounting operation is completed as described above, the board inspection function of FIG. 3 described above is utilized to check the proper mounting state by the following method to obtain necessary suitability data.

  That is, at the time of the component verification inspection, the above-described menu screen of FIG. 6 is displayed and the component verification inspection menu is selected.

  Then, as is apparent from the flowchart of FIG. 5 described above, either the inspection data creation mode or the inspection mode can be selected. Therefore, when the inspection mode is selected, as shown in the component inspection monitor screen of FIG. 15, the model name, drawing number, work process, display of the part number, etc., the part library information (part number, confirmation point) and the board 2 An overall image A of the substrate 2 showing the upper inspection position, a non-defective image (second monitor screen 25B) B of the component to be inspected at the inspection position, and a captured image (first image) of the inspected component at the same inspection position Monitor screens 25A) C are displayed respectively.

  In particular, whether or not the non-defective image B of the inspection target part at the inspection position and the image C taken by the imaging camera 6 of the part under inspection at the inspection position are displayed at the upper and lower positions on the left side of the screen and are easily matched visually. Can be judged.

  Therefore, the determination is very easy.

  In this case, the parts inspection order is made in accordance with the registration order of inspection data at the time of teaching (see the registration screen in FIG. 14), and the two images B and C to be compared are sequentially displayed on the screen. Therefore, the inspector W can continuously check the suitability of all the parts with high work efficiency.

  As a result of this determination, if the inspected image C matches the normal image B of the non-defective substrate and the inspector W determines that the image is good, the match button of the visual determination means 27 in FIG. Press 21b. Then, the path determination is displayed on the monitor screen, and a new inspection start command signal for the inspection start terminal 22a on the data transfer means 22 side is output from the next inspection start terminal 27b.

  Further, the actually inserted component (resistor) is attached differently as shown in FIG. 15, for example (the one with a different resistance value is attached), and the inspector W does not have the same both images. Is determined (identified by the barcode), the non-match button 21a of the visual determination means 27 in FIG. 3 is pressed. As a result, the failure determination result is displayed on the monitor screen, while another inspection start terminal 27a outputs an inspection start command signal to the inspection start terminal 22a, and the defective inspection image data memory. A defective image data transfer instruction signal is output to the defective inspection image data transfer means 32 for transferring the defective image data to 33. As a result, the defective inspection image data is sequentially accumulated in the defective inspection image data memory 33.

  In this case, when the determination is, for example, the attached state of the retrofit component shown in FIG. 12 described above, the imaged camera 6 to be compared cannot be obtained with the imaging camera 6 in the fixed state.

  Therefore, in such a case, for example, the inspector W visually compares the work sample image B as shown in the visual judgment screen of FIG. The pass / fail signal is input by performing the same pass / fail operation as described above.

  1 is a substrate inspection device, 2 is a substrate, 3 is a substrate setting device, 6 is an imaging camera, and 25 is a personal computer.

Claims (4)

  Same as image data indicating the actual mounting state of the electronic component at the desired inspection target position of the mounting board set at the inspection position as image data, and image data indicating the actual mounting state of the electronic component captured by the imaging unit. An image storage means for storing image data indicating a correct mounting state designated corresponding to the electronic component in a pair, and an image indicating the mounting state of the actual electronic component and a correct mounting state of the electronic component In a substrate inspection apparatus comprising an image processing means for determining a degree of coincidence with a normal image and an image display means, a storage means for storing pre-teached instruction data, and the instruction data storage means Instruction display control means for displaying the stored instruction data on the image display means is provided, and an unmounted board such as an electronic component is set at the board inspection position to implement the electronic component. When performing the corresponding substrate inspection device orders instructing mounting operation of electronic components is characterized in that so as to be displayed on said image display means to the substrate.   2. The board inspection according to claim 1, wherein said board has a function of creating an instruction, and the instruction is created by imaging an appropriate electronic component mounting state of a non-defective board by an imaging means and teaching as instruction data. apparatus.   3. The board inspection apparatus according to claim 1, wherein the instruction data is created for each work unit in the work process flow and displayed as an image in accordance with a necessary work process flow.   On the screen of the image display means, an overall image of the board showing the current work position on the work board and an enlarged image showing the assembly state of the components at the work position on the same board are simultaneously displayed as a work sample image. 4. The substrate inspection apparatus according to claim 1, wherein the substrate inspection apparatus is configured as described above.

Images