JP2011058831A5

JP2011058831A5 -

Info

Publication number: JP2011058831A5
Application number: JP2009205887A
Authority: JP
Filing date: 2009-09-07
Publication date: 2012-10-11
Anticipated expiration: 2029-09-07

Description

上述の目的を達成するため、本発明の放射線検出器は、蛍光を電気信号に変換する光電変換素子を有する基板と、前記光電変換素子上に形成され、放射線を前記蛍光に変換するシンチレータ層と、前記シンチレータ層を覆うように形成される導電性の防湿層と、前記防湿層と前記基板とを接着する接着層を備える放射線検出器において、前記接着層は、無機又は樹脂の材質からなり前記防湿層と前記基板との間隔を規定するスペーサと、無機材質からなり透湿性を抑制するフィラーとを含むことを特徴とする。 In order to achieve the above object, a radiation detector of the present invention includes a substrate having a photoelectric conversion element that converts fluorescence into an electrical signal, and a scintillator layer that is formed on the photoelectric conversion element and converts radiation into the fluorescence. The radiation detector includes a conductive moisture-proof layer formed so as to cover the scintillator layer, and an adhesive layer that adheres the moisture-proof layer and the substrate, and the adhesive layer is made of an inorganic or resin material. It includes a spacer that defines a distance between the moisture-proof layer and the substrate, and a filler that is made of an inorganic material and suppresses moisture permeability.

一方、樹脂スペーサの場合には、重なりが生じても基板への局所的な加圧は樹脂の弾性によって緩和され、基板保護膜の破壊や基板配線へのダメージなど生じ難い。しかし、樹脂スペーサの場合には無機質のスペーサに比較して透湿性は大きく、接着層全体としての防湿性能を確保する観点から添加率を抑えるのが望ましい。 On the other hand, in the case of the resin spacer, even if the overlap occurs, the local pressurization to the substrate is alleviated by the elasticity of the resin, so that the substrate protective film is not broken or the substrate wiring is hardly damaged. However, large moisture permeability as compared to the spacer minerals in the case of the resin spacer, to suppress the addition rate in order to ensure the anti-wet performance of the entire adhesive layer is desirable.

（フィラーの体積充填率）
後述する実施例６の図１０の結果からも明らかなように、フィラーの体積充填率が３０％程度以上になると透湿係数の低下が顕著になる。また、製造上の観点から７０％程度以下が好ましい。フィラー材質に関しては、他の一般的な酸化物や窒化物などのセラミック材料系、メタル系などが、実質的に水分を透過しないので同様な効果が得られると考えられる。 (Filler volume filling rate)
As is apparent from the results of FIG. 10 of Example 6 described later, when the volume filling rate of the filler is about 30% or more, the moisture permeability coefficient is significantly reduced . Moreover, about 70% or less is preferable from a viewpoint on manufacture. With regard to the filler material, other general ceramic material systems such as oxides and nitrides, metal systems, and the like do not substantially permeate moisture, and it is considered that the same effect can be obtained.

ＵＶ硬化型接着剤を用いてハットの鍔部とアレイ基板１２とを接着シールする場合、導電性防湿層１５は一般にＡＬなどの金属でＵＶを反射してしまう為、アレイ基板１２の裏面側からＵＶ照射することになる。この場合、アレイ基板１２の接着部分には信号線１９又は制御線１８のリード配線が存在し、この配線の部分が接着剤へのＵＶ照射の影になる。この影の部分が硬化しないとその後の接着部の密着強度や防湿性などの信頼性面で望ましくない。 When the hat collar and the array substrate 12 are bonded and sealed using a UV curable adhesive, the conductive moisture-proof layer 15 generally reflects UV with a metal such as AL. UV irradiation will be performed. In this case, the adhesive portion of the array substrate 12 there is a lead wiring of the signal line 19 or control line 18, the portion of the wiring becomes shadow of UV irradiation to the adhesive. If this shadow portion does not harden, it is not desirable in terms of reliability such as adhesion strength and moisture resistance of the subsequent adhesive portion.

Claims

A substrate having a photoelectric conversion element that converts fluorescence into an electrical signal, a scintillator layer that is formed on the photoelectric conversion element and converts radiation into the fluorescence, and a conductive moisture-proof layer formed so as to cover the scintillator layer And in a radiation detector comprising an adhesive layer that bonds the moisture-proof layer and the substrate,
The radiation detector, wherein the adhesive layer is made of an inorganic or resin material, and includes a spacer that defines a distance between the moisture-proof layer and the substrate, and a filler that is made of an inorganic material and suppresses moisture permeability.