JP2011057734A - Highly tough and highly thermally conductive curable resin composition, cured product thereof, and mold electrical apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly tough and highly thermally conductive thermosetting resin composition for molds that reduces peeling and cracks occurred between a mold cured product and an insulated cylinder. <P>SOLUTION: A resin cured product of the highly tough and highly thermally conductive thermosetting resin composition for molds is provided. In the cured product of the thermosetting resin composition containing a polyfunctional epoxy resin having two or more epoxy groups per molecule, a curing agent of an acid anhydride, an inorganic filler, and a surfactant, the stress safety factor is 7 or more, the strain safety factor is 10 or more, the permissible defect size is 0.1 mm or more, and the thermal conductivity of the cured product is 0.7 to 2.5 W/m×K when mold of alumina ceramics with the composition and cooling the same to room temperature are performed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a high toughness and high thermal conductivity thermosetting resin composition, a cured product thereof, and a molded electric machine that is cast and cured with the thermosetting resin composition. Good, less void entrainment, and when cured at -30 ° C to 90 ° C heat cycle, no cracks occur in the cured product, high partial discharge start voltage and dielectric breakdown voltage, and high heat dissipation when energized High toughness and high thermal conductivity thermosetting resin composition for molds that gives a cured product with little temperature rise due to its properties, mold electrical equipment cast and cured with the thermosetting resin composition, and electric device incorporating the same About.

When electricity is sent from a power plant to factory facilities or ordinary households, the voltage is increased to reduce power transmission loss. When a failure occurs in such a high-voltage path, a switchgear (switching device) that instantaneously cuts off the faulty part, switches the electrical path, turns on / off the load, and monitors current / voltage changes is It is installed in transmission and substation facilities at all electric power establishments such as hospitals and buildings, and contributes to stable power supply. Compressed air was once used to insulate switchgear, but later turned to SF ₆ gas. Recently, thermosetting resin composition molded solid insulation using a vacuum valve has been used due to environmental problems.

  In a medium voltage circuit with a rated voltage of 33 kV or less, many vacuum valves are used for the switch gear. The vacuum valve is insulated and reinforced by molding with a thermosetting resin composition because the outer creepage is in the air and the dielectric strength is low compared to the vacuum insulation inside the container. An example of a conventional vacuum valve molded with a thermosetting resin composition is shown in FIG. In FIG. 1, a vacuum valve 1 forms a vacuum vessel 5 by hermetically sealing both ends of an insulating cylinder 2 made of an alumina ceramic material or the like with a fixed side end plate 3 and a movable side end plate 4. The fixed end plate 3 is vacuum-tightly fixed, and the movable shaft 7 is attached to the movable side end plate 4 via a bellows 8 so that the contact 9 can be opened and closed while maintaining a vacuum. The arc generated when the contact 9 opens and closes is immediately extinguished in a high vacuum, and when a failure occurs in the high piezoelectric path, the disconnection high voltage circuit is instantaneously interrupted. Since the vacuum valve 1 opens and closes the contact 9 in a high vacuum, the high-voltage circuit can be cut off with a short electrode opening / closing distance required for interruption. For this reason, the insulating cylinder 2 can be shortened. This shortens the creeping distance on the outside of the vacuum vessel 5, and when dirt (humidity, dust) in the atmosphere adheres to the vacuum vessel 5, the withstand voltage decreases and external flashing is likely to occur. Become. As a countermeasure against this, an insulating outer shell 11 such as an epoxy resin composition mold cured product is integrally provided on the outside of the vacuum vessel 5 by casting. However, since the thermal expansion coefficients of the cured mold 11 and the alumina ceramic (insulating cylinder) 2 are different, thermal stress is generated between the mold curing / cooling or when a heat cycle is applied, and the mold cured product Cracks come in. Therefore, in order to avoid cracks in the cured mold due to thermal stress, a stress relaxation layer 10 such as a silicone resin is provided between the insulating cylinder 2 and the cured mold 11. Providing such a stress relaxation layer between the insulating cylinder and the mold cured product is described in Patent Documents 7 to 9.

Japanese Patent Laid-Open No. 2001-6502 JP-A-7-278413 JP-A-8-217957 JP 2002-15621 A JP 2007-56049 A Japanese Patent Laid-Open No. 10-60085 JP-A-5-298974 Japanese Patent Laid-Open No. 6-231661 JP 2008-258021 A Japanese Patent No. 2853550 Japanese Patent No. 2938177 Japanese Patent No. 2524011 Japanese Patent No. 2680029

“Development of high-toughness and high-strength epoxy resin casting technology that realizes high-voltage solid-insulated switchgear”, “Shape Material”, December 2007, pages 36-39.

Shigeyoshi Fujii, Osamu Sakaguchi, Junichi Sato “24 / 36kV Solid Insulated Switchgear” “Toshiba Review” Vol. 59, no. 12 (2004), pp. 56-59.

  (a) In the above-described conventional vacuum valve, cracks generated in the mold cured product 11 of the thermosetting resin composition, low stress adhesion between the stress relaxation layer 10 and the mold cured product 11 of the thermosetting resin composition, the mold Since the thermal shrinkage of the stress relaxation layer 10 during post-cooling is larger than the mold cured product 11 of the thermosetting resin composition, peeling occurs between the stress relaxation layer 10 and the mold cured product 11 of the thermosetting resin composition. As a result, corona was generated, resulting in dielectric breakdown.

  (B) Also, when high voltage electricity is applied to the vacuum valve, it generates heat, and since the cured resin of the thermosetting resin composition is a heat insulating material, the temperature of the vacuum valve rises and the thermosetting resin composition is cured. The glass transition temperature and thermal deformation temperature of the resin exceeded the danger of deformation and dielectric breakdown. In order to solve this problem, it has been necessary to increase the surface area of the electric conductor or to cool the vacuum valve by attaching a radiation fin as described in Patent Document 1.

The following four points (1) to (4) can be cited as causes of cracks and peeling in the cured resin of the thermosetting resin composition.
(1) Since the fracture strain of the cured resin is small and the elastic modulus is large, external strain and thermal stress cannot be absorbed by deformation of the resin.
(2) The mold vacuum valve is made of an insulating cylinder such as alumina ceramic, an electric conductor such as copper or aluminum, a corona shield such as SUS or aluminum, and an insulating and structural material such as a cured resin. The thermal expansion coefficient of an insulating cylinder made of an alumina ceramic material or the like is three times or more smaller than that of a shield or conductor metal or resin cured product. Due to the mismatch of thermal expansion coefficients, large thermal stresses and thermal strains are generated in the cooling process at the time of manufacture and the heat cycle at the time of use, resulting in cracks and peeling that exceed the breaking strength and breaking strain of the cured resin.
(3) When the resin is cured, “(a) the temperature is partially increased due to heat generation, and (b) the thermosetting resin composition shrinks upon curing”, a large internal stress remains. Residual internal stress exceeds the breaking strength of the cured resin and cracks and peeling occur.
(4) Stress concentration occurs in the edge portion of the mold, the insulating cylinder, the metal, etc., and the stress exceeds the strength of the cured resin, and fine cracks occur in the cured resin. Since the toughness of the cured resin is low, the fine crack exceeds the allowable defect size, the fine crack progresses, and reaches the cured resin crack.

  In order to improve the toughness of the cured product as a measure of the above (1), “1) reduce the crosslinking density in the cured product, 2) blend a thermoplastic resin, 3) an elastomer component, and give flexibility, or 4) Addition of glass fiber "has been studied. The method 1) weakens the constraint of network chain motion and increases toughness, but the molecular weight of the resin in the resin composition before curing increases, the viscosity increases, and casting and mold defects tend to occur. . In addition, the decrease in the crosslink density of the cured product tends to greatly reduce the heat resistance and elastic modulus at the same time, and the low viscosity at the time of molding satisfies the characteristics of high toughness, high heat resistance and high thermal conductivity after curing. It is difficult. In the method 2), the toughness is insufficient and the viscosity tends to increase during casting and molding.

  3) As a method of non-reactive elastomer (for example, NBR, liquid rubber such as polybutadiene and chloroprene rubber, silicone oil, silicone rubber, carboxyl, or epoxy-modified crosslinked NBR, acrylic rubber, core shell rubber, urethane rubber, Thermoplastic polyester elastomers) and reactive elastomers (carboxyl-modified butadiene-acrylonitrile copolymer CTBN, amino-modified butadiene-acrylonitrile copolymer ATBN, NBR containing a carboxyl group in the main chain, carboxyl-modified polybutadiene, liquid polysulfide, It is known to add a modified silicone urethane prepolymer or the like to a thermosetting resin composition.

  In order to exhibit toughness, it is important to finely and uniformly disperse the elastomer component in the cured resin, but it is difficult in terms of morphology. Therefore, as a method of 3), as described in Patent Documents 2 to 4, mainly in a vacuum valve mold, silicone rubber, core-shell rubber (core-shell rubber particles obtained by graft polymerization of a different polymer as a shell on the surface of a crosslinked rubber particle as a core) ) And the like are dispersed. However, in any case, the viscosity increases before curing, or after curing, the dispersion of rubber becomes non-uniform and the characteristics tend to vary. Patent Document 5 discloses a composition in which a layered silicate, oxide particles and high dielectric constant particles are dispersed in a resin, but the effect of the layered silicate improving the slip of the oxide particles is insufficient. The fluidity of is not improved.

  The method 4) increases the toughness by adding a glass fiber (filament) as described in Patent Document 6, but the glass fiber flows when molding by a method such as pressure gelation. Although the toughness increases in the direction of orientation and the toughness increases in the orientation direction, the toughness does not increase in the direction perpendicular to the orientation and becomes the starting point of cracks, which is not a fundamental solution.

The thermal expansion coefficient of the resin single cured product is generally (60 to 200) × 10 ⁻⁶ / ° C. On the other hand, the thermal expansion coefficients of copper and aluminum used for the conductor are 17 × 10 ⁻⁶ / ° C. and 23 × 10 ⁻⁶ / ° C., respectively. The thermal expansion coefficient of SUS used for the shield is (16-17) × 10 ⁻⁶ / ° C. On the other hand, the thermal expansion coefficient of alumina ceramics used for the insulating cylinder is 7.9 × 10 ⁻⁶ / ° C. That is, the thermal expansion coefficient of the resin single cured product is 3 to 11 times as large as that of the conductor or shield material and 7 to 25 times as large as that of the insulating cylinder material. Therefore, after casting / mold curing of resin composition, large thermal stress and thermal distortion occur due to mismatch of thermal expansion coefficient during the process of cooling to room temperature or during heat cycle, and it peels off to the cured product of the thermosetting resin composition And cracks occur, and the vacuum valve breaks down. Therefore, fillers such as crushed fused silica (thermal expansion coefficient: 0.5 × 10 ⁻⁶ / ° C.) and crushed crystalline silica (thermal expansion coefficient: 10 × 10 ⁻⁶ / ° C.) are added to the thermosetting resin composition. By adding, it is necessary to reduce the thermal expansion coefficient of the cured resin and minimize the generation of thermal stress due to mismatch of thermal expansion coefficients.

  As a measure of the above (2), the thermal expansion coefficient of the cured product of the resin itself is lowered, the filler is highly filled, and the thermal expansion coefficient of the cured product of the thermosetting resin composition is set to the thermal expansion coefficient of metal or alumina. A study was made to bring it closer to. The addition of the filler is as follows: “(1) The cured product has a low coefficient of thermal expansion and the thermal expansion coefficient approaches the insulating cylinder and the conductor, so the thermal stress and thermal strain are reduced. (2) The curing shrinkage of the cured product is reduced. Residual internal stress during curing is reduced (3) The cured product has high thermal conductivity, heat dissipation is improved, and uneven temperature distribution is reduced, resulting in reduced residual internal stress. (4) Since the filler is cheaper than the resin itself, the cost of the mold is reduced, etc. As described above, the addition of the filler lowers the cost, and the vacuum valve is manufactured and heated. The thermal stress and thermal strain generated during the cycle are reduced and the reliability of the vacuum valve is increased, so the addition of a filler is indispensable.

  On the other hand, when the filler is added, “(1) ′ viscosity increases and it becomes difficult to cast. (2) ′ Peeling and cracking are likely to occur from the interface between the filler and the resin. (3) ′ (4) Since the filler is heavier than the base thermosetting resin composition, the sedimentation of the filler occurs during curing and the insulating layer becomes non-uniform. ” It is necessary to use it. In general, when the average particle size is reduced, the bending strength after curing increases, but the viscosity increases before curing, and the mold failure and the fracture toughness value after curing tend to decrease, making it difficult to achieve both. In order to suppress the increase in viscosity as much as possible even when a large amount of filler is added, a method for controlling the particle size distribution has been proposed. Patent Document 4 also proposes adding crystalline or molten spherical silica, a small-diameter filler, and a core-shell rubber as particles having a large particle diameter as an inorganic filler. As described in Non-Patent Documents 1 and 2, two or more types of particles are actually used as fillers for the thermosetting resin composition for vacuum valve molds, although unsatisfactory from the viewpoint of compatibility of viscosity, strength and toughness. High cost spherical fused silica with a diameter distribution is used.

  As countermeasures for the above (3), there are a method in which the reaction is performed slowly by reducing the density of reactive groups, a lowering of the curing temperature, and the like, and a method of adding a large amount of an organic filler that does not shrink and cure. Decreasing the density of reactive groups or adding a large amount of filler increases the viscosity at the time of molding, and its effect is limited. In addition, the method of lowering the curing temperature has a drawback that the cost is increased because the curing time becomes longer.

  For the method (4), a method such as addition of a cushion layer such as silicone or a reinforcing material is employed as described in Patent Documents 7 to 9. However, it is necessary to attach a mold for the cushion layer and a reinforcing material in advance, resulting in an increase in cost, and conversely, the interface between the cushion layer and the mold resin is peeled off, resulting in increased corona generation.

  In addition, the measures (a) and (b) must be taken at the same time, but at the same time they are not satisfied and the product yield is low, the size is large, and heat dissipation fins must be attached. It was.

  Patent Document 10 discloses a resin composition to which amorphous silica, inorganic powder, and spherical amorphous silica powder having a particle size of 1 μm or less are added, and Patent Document 11 discloses 5 to 30 μm crystalline silica and 5 to 5 μm. A resin composition to which 40 μm spherical fused silica is added is disclosed. In Patent Document 12, a composition in which 0.1 to 0.9 μm of spherical silica (A) and 3 to 24 μm of crystalline silica are added. In Patent Document 13, a surfactant and an interface that is intertwined with a resin and an interface chemically bonded to a filler. A resin composition to which an activator and a filler are added is disclosed.

  However, none of the conventional techniques described above can simultaneously solve (1) to (4).

  The present invention has been made in view of the above circumstances, and its purpose is low cost, low viscosity at the time of casting, good workability, little void entrainment, and a heat cycle of -30 ° C to 90 ° C after curing is added. The cured product is free from cracks, has a high partial discharge voltage and dielectric breakdown voltage, and has a high heat dissipation during energization operation, so that the temperature rise is small, the cured product, and the cured product. An object of the present invention is to provide a molded electric machine that is cast and cured with a conductive resin composition and an electric device incorporating the same.

In order to achieve the above object, the present invention
A cured product of a thermosetting resin composition containing a polyfunctional epoxy resin having two or more epoxy groups per molecule, an acid anhydride curing agent, an inorganic filler, and a surfactant, the composition When the alumina ceramic is molded with an object and cooled to room temperature, the stress safety factor is 7 or more, particularly preferably 7 to 10, the strain safety factor is preferably 10 or more, particularly preferably 10 to 15, and the allowable defect size is 0.1 mm or more. 0.1 to 0.3 mm is particularly preferable, and the heat conductivity of the cured product is 0.7 W / m · K or more, and particularly preferably 0.7 to 2.5 W / m · K. Provided is a cured resin product of a tough, highly thermally conductive thermosetting resin composition.

Moreover, this invention includes the following embodiments in the resin hardened | cured material of the toughness high heat conductive thermosetting resin composition for molds which concerns on this invention in order to achieve the said objective.
(1) The resin composition has a bending fracture strain of 1.5% or more, particularly preferably 1.5 to 2.5%, and a thermal conductivity of 0.7 W / m · K or more, particularly 0.7 to 1. 5W / m · K are preferred, fracture toughness value is 2.7 MPa ^{· m 1/2} or more, particularly 2.7~6.2MPa ^{· m 1/2} is preferred.
(2) The inorganic filler is 55 to 71 vol% with respect to the entire resin composition, and the inorganic filler is crushed crystalline silica having an average particle diameter of 2 to 9 μm and crushed with an average particle diameter of 4 to 20 μm. The ratio X / Y of the average particle diameter X of the crushed crystalline silica and the average particle diameter Y of the crushed fused silica is 0.1 to 2.25. X / Y is preferably 0.3 to 1.5, and more preferably 0.5 to 1.1. When X / Y is 0.7 to 1.1, a resin composition that gives a cured product having the most excellent characteristics can be obtained.
(3) The surfactant is 0.05 to 2 wt% of the inorganic filler, and the surfactant A reacts with the polyfunctional epoxy resin, the curing agent and the inorganic filler, and the polyfunctional epoxy resin. And surfactant B that does not react with the curing agent but reacts with the inorganic filler,
The surfactant A is 15 to 75 wt% with respect to the total surfactant, and the surfactant B is 25 to 85 wt% with respect to the total surfactant.
(4) A core-shell rubber is added as a flexibilizer in an amount of 0.5 to 3.5 wt% based on the total weight of the resin composition.
(5) The core-shell rubber preferably has a core-shell ratio (% by weight) of 40/60 to 95/5.
(6) The lubricant is contained in an amount of 0.5 to 7 wt% with respect to the weight of the crushed crystalline silica.
(7) The lubricant is spherical silica having a particle size of 1 μm or less.
(8) Contains a plate-like anti-settling material.

  In order to achieve the above object, the present invention is a vacuum valve having a fixed shaft provided with a fixed electrode at an end portion and a movable shaft provided with a movable electrode at an end portion facing the fixed shaft, Provided is a mold vacuum valve, wherein the fixed electrode, the fixed shaft, the movable electrode, and a vacuum container and a conductor for housing the movable shaft are covered with the resin cured product.

  In order to achieve the above object, the present invention is provided with a winding, an inner peripheral insulating layer and an outer peripheral insulating layer formed on the inner periphery and outer periphery of the winding, respectively, and an end face in the axial direction of the winding. In the molded coil comprising an end insulating layer, at least one of the inner peripheral insulating layer, the outer peripheral insulating layer, the end insulating layer, and the space inside the winding is made of the cured resin. A molded coil characterized by being coated is provided.

  In order to achieve the above object, the present invention provides a molded-type instrument transformer in which a primary winding and a secondary winding are covered with an insulating resin, and an iron core is attached, and the insulating resin is the resin cured product. An instrument transformer is provided.

In order to achieve the above object, the present invention is a high toughness and high thermal conductivity thermosetting resin composition for molding,
Inorganic filling containing polyfunctional epoxy resin having two or more epoxy groups per molecule, acid anhydride curing agent, crushed crystalline silica having an average particle diameter of 2 to 9 μm, and crushed fused silica having an average particle diameter of 4 to 20 μm A material and a surfactant,
The filler containing the crushed crystalline silica and crushed fused silica contains 55 to 71 vol% of the thermosetting resin composition,
The blending ratio of the crushed crystalline silica and the crushed fused silica is such that the former is 10 to 98 wt% and the rest is the latter.
The ratio A / B of the average particle diameter A of the crushed crystalline silica and the average particle diameter B of the crushed fused silica is 0.1 to 2.25. A composition is provided. A / B is preferably 0.3 to 1.5, more preferably 0.5 to 1.1. When the anti-settling agent / B is 0.6 to 1.1, a resin composition that gives a cured product having the best properties is obtained.

In order to achieve the above object, the present invention includes the following embodiments in the above-mentioned high toughness and high thermal conductivity thermosetting resin composition for molds according to the present invention.
It gives a cured product having a bending fracture strain of 1.5% or more, a thermal conductivity of 0.7 W / m · K or more, and a fracture toughness value of 2.7 MPa · m ^1/2 or more.
(10) Curing characterized in that when alumina ceramic is mold-cured and cooled from the glass transition temperature to room temperature, the stress safety factor is 7 or more, the strain safety factor is 10 or more, and the allowable defect size is 0.1 mm or more. It gives things.
(11) The core shell rubber is contained as a flexibilizer in an amount of 0.5 to 3.5 wt% with respect to the total weight of the thermosetting resin composition having high toughness and high thermal conductivity for molding.
(12) The polyfunctional epoxy resin is one obtained by a reaction of bisphenol A, bisphenol F, bisphenol AF, bisphenol AD, anthracenediol or / and naphthalenediol and epichlorohydrin.
(13) The inorganic filler is crushed crystalline silica having an average particle diameter of 2 to 9 μm and fused silica having an average particle diameter of 4 to 20 μm.
(14) As the surfactant, a surfactant A that reacts with an epoxy resin, an inorganic filler, and a curing agent, and a surfactant B that does not react with the epoxy resin and the curing agent, but reacts with an inorganic filler, The surfactant A is 15 to 75 wt%, the surfactant B is 25 to 85 wt%, and the surfactant is 0.05 to 2 wt% with respect to the inorganic filler. is there.
(15) The total amount of the crushed crystalline silica and crushed fused silica is 90 wt% or more, preferably 95% or more of the total inorganic filler.

  In order to achieve the above object, the present invention is a vacuum valve having a fixed shaft provided with a fixed electrode at an end portion and a movable shaft provided with a movable electrode at an end portion facing the fixed shaft, Provided is a mold vacuum valve comprising: a fixed container, a fixed shaft, a movable electrode, and a vacuum container and a conductor that house the movable shaft, which are molded with the thermosetting resin composition and cured. .

  In order to achieve the above object, the present invention is provided with a winding, an inner peripheral insulating layer and an outer peripheral insulating layer formed on the inner periphery and outer periphery of the winding, respectively, and an end face in the axial direction of the winding. In the molded coil comprising an end insulating layer, at least one of the inner peripheral insulating layer, the outer peripheral insulating layer, the end insulating layer, and the space inside the winding is provided with the high toughness and high thermal conductivity. A molded coil comprising a resin insulator molded and cured with a heat-curable thermosetting resin composition.

  In order to achieve the above object, the present invention provides a molded-type instrument transformer in which a primary winding and a secondary winding are covered with an insulating resin, and an iron core is mounted. An instrument transformer characterized by being a cured product of a high thermal conductivity thermosetting resin composition.

In order to achieve the above object, the present invention is a vacuum valve having a fixed shaft provided with a fixed electrode at an end portion and a movable shaft provided with a movable electrode at an end portion facing the fixed shaft, A method of forming a solid insulation in which a fixed container, a fixed shaft, a movable electrode and a vacuum container containing the movable shaft and a conductor are mold-cured with a thermosetting resin composition,
(1) (a) a polyfunctional epoxy resin having two or more epoxy groups per molecule, (c) an inorganic filler, and (d1) acid anhydride curing for the inorganic filler, epoxy resin and epoxy resin An epoxy resin main resin composition E mixed with a surfactant A that reacts with the agent;
(2) (b) Acid anhydride curing agent for epoxy resin, (c) Inorganic filler, (d2) Interface that does not react with polyfunctional epoxy resin and acid anhydride curing agent for epoxy resin, but reacts with inorganic filler The epoxy resin curing agent composition H mixed with the activator B is mixed with the epoxy resin main resin composition E and the epoxy resin curing agent composition H, and the above (1) to (6). Provided is a method for forming a solid insulation by adjusting the thermosetting resin composition according to any one of the above, and molding and curing the outer periphery of an electrical device including a conductor. Examples of the electrical device include a vacuum switch, a coil, and the like, and the cured mold product may be in contact with the conductor or may be in contact with the periphery of the insulator.

In order to achieve the above object, the present invention includes the following embodiments in the above-described method for forming a solid insulation according to the present invention.
(16) A core shell rubber is mixed with the epoxy resin curing agent resin composition H as a flexibilizer.
(17) A plate-like anti-settling material is mixed with the epoxy resin curing agent-based resin composition H.
(18) A lubricant is mixed with the epoxy resin curing agent resin composition H.

  The high toughness and high thermal conductivity thermosetting resin composition for molds of the present invention is low in cost, has little sedimentation of the filler during storage, has low viscosity during casting, good workability, has few voids, and has high toughness after curing. High thermal conductivity. In addition, the cured resin molded with the high toughness and high thermal conductivity thermosetting resin composition for molds of the present invention does not generate cracks without using a stress relieving material. The breakdown voltage is high, the temperature rises little when energized, and there is an excellent effect that the size and weight can be reduced. The electric device having the cured resin as a solid insulation according to the present invention has high reliability without cracks or cracks occurring in the insulator under various operating conditions.

It is a cross-sectional schematic diagram of a conventional mold vacuum valve. It is a cross-sectional schematic diagram which shows an example of the mold vacuum valve which concerns on this invention. It is a perspective schematic diagram which shows an example which applied the toughness high heat conductive thermosetting resin composition which concerns on this invention to the linear motor car ground coil. It is an expanded sectional schematic diagram of the II-II line | wire part in FIG. 3A. It is a perspective schematic diagram of the mold coil for transformers molded with the high toughness high thermal conductivity thermosetting resin composition concerning the present invention. It is a perspective schematic diagram of the mold coil for transformers molded with the high toughness high thermal conductivity thermosetting resin composition concerning the present invention. It is a perspective schematic diagram which shows an example of the transformer incorporating the mold coil of FIG. 5A. It is a plane schematic diagram which shows an example of the structure of the instrument transformer molded with the toughness high heat conductive thermosetting resin composition which concerns on this invention. It is a cross-sectional schematic diagram which shows an example of a structure of the instrument transformer incorporating the mold coil of FIG. 6A.

  Hereinafter, embodiments according to the present invention will be described in detail. However, the present invention is not limited to the embodiment taken up here.

  Below, the high toughness high heat conductive thermosetting resin composition of this invention is demonstrated for every structural material.

(Polyfunctional epoxy resin)
Examples of the polyfunctional epoxy resin in the present invention include diglycidyl ether obtained by reaction of bisphenol A and bisphenol F with epichlorohydrin, diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, and diphthalic dinaphthalene. Glycidyl ether, diglycidyl ether of anthracene, diglycidyl ether of biphenyl, diglycidyl ether of water-added bisphenol A, diglycidyl ether of water-added bisphenol F, butadiene diepoxide, 3,4-epoxycyclohexylmethyl- (3 4-epoxy) cyclohexanecarboxylate, vinylcyclohexene dioxide, 4,4'-di (1,2-epoxyethyl) diphenyl ether, 4,4'-di (1,2-epoxy ether) ) Diphenyl ether, 4,4 '-(1,2-epoxyethyl) biphenyl, 2,2'-bis (3,4-epoxycyclohexyl) propane, diglycidyl ether of resorcin, diglycidyl ether of phloroglycin, methyl fluoro Glycine diglycidyl ether, bis (2,3-epoxycyclopentyl) ether, 3- (3,4-epoxy) cyclohexene-5,5-spiro (3,4-epoxy) -cyclohexane-m-dioxane, bis- (3,4-epoxy-6-methylcyclohexyl) adipate, N, N'-m-phenylenbis (4,5-epoxy-1,2-cyclohexanedicarboximide, diglycidyl ester of hexahydrophthalic acid, tetrahydrophthalic acid Bifunctional epoxy compounds such as diglycidyl ester , Triglycidyl ether of paraaminophenol, 1,3,5-tri (1,2-epoxyethyl) benzene, 2,2 ', 4,4'-tetraglycidoxybenzophenone, tetraglycidoxytetraphenylethane Polyglycidyl ether of phenol formaldehyde novolak, polyglycidyl ether of cresol formaldehyde novolak, polyglycidyl ether of xylenol formaldehyde novolac, polyglycidyl ether of nonyl phenol formaldehyde novolak, polyglycidyl ether of phenyl phenol formaldehyde novolak, bisphenol A formaldehyde Novolak polyglycidyl ether, bisphenol F formaldehyde Novolak polyglycidyl ether, glycerin Triglycidyl ether, epoxy compound having three or more functional groups such as triglycidyl ether of trimethylolpropane is used.

  The polyfunctional epoxy compound can be used alone or in combination of two or more. Among the epoxy resins, diglycidyl ether obtained by reaction of bisphenol A and bisphenol F with epichlorohydrin and having an epoxy equivalent of 160 to 190 is particularly preferable from the viewpoint of the balance between viscosity and toughness. Also, for applications that place importance on weather resistance, diglycidyl ester of hexahydrophthalic acid, diglycidyl ether of bisphenol A with water addition, 3,4-epoxycyclohexylmethyl- (3,4-epoxy) cyclohexanecarboxylate, etc. It may be used.

(Acid anhydride curing agent)
Examples of the curing agent in the present invention include phthalic anhydride, itaconic anhydride, succinic anhydride, citraconic anhydride, alkenyl anhydride, dodecenyl succinic anhydride, maleic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, Methyl hexahydrophthalic anhydride, pyromellitic anhydride, cyclopentane tetracarboxylic anhydride, benzophenone tetracarboxylic anhydride, ethylene glycol bis trimellitate, glyceryl tris trimellitate, maleic anhydride adduct of methyl cyclopentadiene, anhydrous Acid anhydrides such as chlorendic acid, anhydrous alkylated endoalkylenetetrahydrophthalic acid, methyl 2-substituted butynyltetrahydrophthalic acid, phenol, cresol, xylenol, nonylphenol, phenylphenol A novolak resin, poly-p-vinylphenol, polyamide obtained by reacting one or a mixture of two or more of bisphenol A and formaldehyde or paraformaldehyde with an acid, base or neutral salt as a catalyst, An amine or the like is used. Of these, liquid acid anhydrides such as maleic anhydride adduct of methylcyclopentadiene, methyltetrahydrophthalic anhydride, and methylhexahydrophthalic anhydride are useful.

  There is no restriction | limiting in particular in the mixture ratio of a polyfunctional epoxy resin and a hardening | curing agent. When a hardening accelerator exists, it is preferable to mix | blend 0.7-1.2 equivalent with respect to a polyfunctional epoxy resin, and it is more preferable to mix | blend 0.98-1.2 equivalent.

(Curing catalyst)
Any curing accelerator may be used in the present invention as long as it promotes the reaction between the polyfunctional epoxy resin and the acid anhydride. Examples of such a curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, and 1-benzyl-2-methylimidazole. 1-cyanoethyl-2-metalimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6- [2-methylimidazolyl- ( 1)]-Ethyl-s-triazine, 2,4-diamino-6- [2-ethyl-4-methylimidazolyl- (1)]-ethyl-s-triazine, 2,4-diamino-6- [2 -Undecylimidazolyl- (1)] ethyl-s-triazine, 2-phenyl4,5-dihydroxymethylimidazole 2-imidazole, 2-methylimidazolium isocyanurate, 2-phenyl, 2-phenyl 4-methyl-5-hydroxymethylimidazole, 1-cyanoethyl-2-phenyl 4,5-di (cyanoethoxymethyl) imidazole, etc. Imidazole and isocyanuric acid salts such as imidazolium and isocyanurates, 1-cyanoethyl-2-undecylimidazolium trimellitate, imidazole organic acid salts such as 1-cyanoethyl-2-phenylimidazolium and trimellitate, 2-ethyl Imidazole borate such as -4-methyl-imidazole tetraphenylborate, 2-methylimidazole tetraphenylborate, tertiary amine such as triethylamine, n-tripropylamine, N-benzyldimethylamine, - methylmorpholine, N- methylpiperazine, 1,8 Jiazabishinro (5,4,0) - undecene, tetramethylbutyl guanidine, triphenyl phosphine, and the like tetraphenylphosphonium-tetraphenyl borate. Also, amine or quaternary ammonium organic acid salt, amine intermolecular coordination compound, amine intramolecular coordination compound, reaction product of amine and aldehyde or ketone, urea derivative and dicyandiamide, compound having hydrazino group, Borate, ferrocene, phosphorus compounds, amine microcapsules, and the like can be used. These curing accelerators may be used alone or in combination. The blending amount of the curing accelerator is preferably 0.2 to 10 parts by weight with respect to 100 parts by weight of the polyfunctional epoxy resin and 80 to 120 parts by weight of the curing agent.

(Inorganic filler)
The inorganic filler in the present invention is used according to the purpose and application of the thermosetting resin composition of the present invention. Crushed crystalline silica having an average particle diameter of 2 to 9 μm and crushed fused silica having an average particle diameter of 4 to 20 μm are used as essential components. Both crushed crystalline silica and crushed fused silica are crushed raw materials, and have an indeterminate and square shape at low cost. This is different from spherical fused silica. However, since it has an angular shape, it is necessary to appropriately select the ratio of the average particle size of the crushed crystalline silica and the crushed fused silica. Fillability may be impaired.

  Even with fillers having the same chemical component, the influence on various properties of the resin varies greatly depending on the size, particle size distribution, and shape of the particles. In general, in order to improve the mechanical strength of the resin composition, it is considered good to use a fibrous or acicular material such as glass, asbestos, calcium silicate, and the like. The viscosity of the resin composition greatly depends on the particle size distribution of the filler, the type of surfactant, and the amount added, in addition to the amount of filler added. Conventionally, the addition of a filler having a small particle size is said to increase the viscosity, and a filler having a relatively large particle size has been used. However, since sedimentation tends to occur when the particle size is large, a method has been adopted in which a small amount of a filler having a small particle size is added to increase the viscosity and shorten the curing time at the expense of workability. However, this method has a problem that voids tend to remain due to high viscosity, and the residual strain is large because the curing speed is high. Therefore, in order to prevent sedimentation and high viscosity, an attempt was made to control the particle size distribution by the Rosin-Rammler equation shown in (Equation 1). As a result, if particles having a particle size of 80 μm or more are cut, fillers having different particle size distributions are mixed appropriately, the n value of (Equation 1) is made as small as 0.9 or less, and the particle size distribution is widened, It has been found that the viscosity can be reduced without causing

R _(Dp) = 100exp (−bDp) ⁿ (Expression 1)
R _(Dp) : Cumulative weight% from the maximum particle size to the particle size Dp
Dp: Particle size b and n: Constant Here, the particle size of 80 μm or more is cut because if a particle size of 80 μm or more exists, sedimentation occurs and cracks are likely to occur. The present inventors were able to adjust the n value of the Rosin-Rammler equation of (Equation 1) to 0.3 to 0.9 by mixing crushed crystalline silica with different pulverization conditions, thereby reducing the viscosity. . Further, when the average particle size of the crushed crystalline silica is 3 to 9 μm and the average particle size of the crushed fused silica is 3 to 15 μm, the n value of the Rosin-Rammler equation of (Equation 1) is 0.3 to 0.00. It was possible to adjust to 9. As for the addition amount of the inorganic filler of this invention, 55-71 vol% is preferable with respect to a thermosetting resin composition. When the added amount of the inorganic filler exceeds 71 Vol%, the viscosity becomes high and voids are contained, or the unfilled portion becomes large, so that it cannot be used. Further, if the amount of filler added falls below 55 vol%, the thermal conductivity is lowered, the temperature during operation increases, and dielectric breakdown occurs in a short time.

  In addition, the inventors of the present invention have a ratio (X / Y) of the average particle size (X) of crushed crystalline silica constituting the inorganic filler to the average particle size (Y) of crushed fused silica of 0.1-2. .25 was preferred and 0.3 to 1.5 was more preferred.

  In general, the coarser the average particle diameter, and the wider the particle size distribution, the lower the viscosity and the easier the filling of details. However, if it is too rough, the filler will settle out and the properties of the cured product will vary, resulting in poor electrical properties of the molded product. The specific gravity and elastic modulus of the crushed crystalline silica are 2.65 and 130 GPa, respectively. The specific gravity and elastic modulus of crushed fused silica are 2.21 and 78 GPa, respectively. The crushed crystalline silica has a larger specific gravity than the crushed fused silica and is more likely to settle, so the average particle size cannot be increased. This is the difference in the maximum usable average particle diameter between crushed crystalline silica and crushed fused silica.

  Further, when submicron fine particles are mixed, the viscosity rapidly increases. The crushed fused silica has a large minimum average particle size because fine powder is likely to be produced at the time of melting and fine particles are easily produced because the elastic modulus is smaller than that of crystalline silica.

  The ratio (X / Y) of the average particle size (X) of crushed crystalline silica to the average particle size (Y) of crushed fused silica is greater than 2.25, that is, X is greater than 9 μm, Is smaller than 4 μm. When the particles of crystalline silica having a relatively large specific gravity and coarseness increase, the crushed crystalline silica having a large particle size settles, the characteristics of the cured product vary, and the electrical characteristics of the molded product deteriorate. On the other hand, if the average particle diameter Y of the crushed fused silica is smaller than 4 μm, the amount of submicron fine particles increases, the viscosity increases, unfilling easily occurs, and the electrical characteristics of the molded product deteriorate.

  That (X / Y) is smaller than 0.1 means that the crushed crystalline silica particles are smaller than 2 μm or the particle size of the crushed fused silica is larger than 9 μm. In this case, as described above, when the particle size of the crushed crystalline silica is smaller than 2 μm, the amount of fine particles of submicron increases, the viscosity increases, unfilling easily occurs, and the electrical characteristics of the molded product are poor. Become. On the other hand, when the particle size of the crushed fused silica is larger than 9 μm, it settles, the characteristics of the cured product vary, and the electrical characteristics of the molded product deteriorate.

  When X / Y is in the range of 0.3 to 1.5, the fluidity of the resin composition is good, and the properties of the cured product are also good.

  As other inorganic fillers, specifically, alumina, asbestos, attabulgite, kaolin clay, volcanic ash, carbon black, graphite, calcium silicate, diatomaceous earth, oxidation of 10 wt% or less, preferably 5 wt% or less of the total amount of inorganic filler Magnesium, titanium oxide, iron oxide, magnesium hydroxide, aluminum hydroxide, slate powder, sericite, boron nitride, calcium carbonate, magnesium carbonate, talc, feldspar powder, molybdenum dioxide, barite, meteorite, white teating, mica, wax There are stone clay, anhydrous gypsum, beryllia, mullite, zircon, silicon carbide, silicon nitride, and various metal powders. Among these, from the viewpoint of thermal conductivity, various aluminum compound systems, various metal powders, beryllia, silicon carbide, boron nitride, and the like are preferable.

(Lubricant)
As described in Patent Document 10, the inventors of the present invention have a spherical inorganic filler having an average particle size of 0.1 to 0.9 μm attached to the surface of a coarse inorganic filler to serve as a roller. It was estimated that the fluidity was improved when the shear rate was large, and further studies were made. As a result, when 0.5 to 7 wt% of spherical silica having a particle size of 1/10 to 1/100 of crushed crystalline silica is adhered to crushed crystalline silica having an average particle size of 3 to 9 μm, the amount of spherical silica added It has been found that the apparent viscosity increases as conventionally stated at a low shear rate as measured with a B-type viscometer. However, when the shear rate is large, that is, when casting in a high shear state, molding, the apparent viscosity is lower than when spherical silica is not added, and the fluidity is increased. In other words, it was found that the high pressure shear gel method is advantageous. Further, when the average particle size of the adhering spherical inorganic filler is small, the influence of van der Waals force acting between the fine particles becomes too large, and the viscosity tends to increase. Conversely, if the average particle size of the adhering spherical filler is too large, the effect of addition tends to be reduced.

  Further, when the amount of the spherical filler adhering is small, there is no effect of improving the fluidity, and conversely, when the amount is large, the fluidity tends to deteriorate. This is probably because the adhering spherical filler acts as a roller of the coarse inorganic filler, and the fluidity is improved when the shear rate is large. Adding 0.5 to 7 wt% of spherical silica of 1/10 to 1/100 of crushed crystalline silica as a lubricant to the thermosetting resin composition of the present invention is a matter of the vacuum valve. It has been found that it is extremely effective for improving the fluidity at the time of mold and molding.

(Anti-settling material)
Addition of 1 to 5 wt% of flaky (flaky) inorganic filler (anti-settling material) such as hydrated alumina and mica, thermosetting resin composition in the storage state or heating state of the thermosetting resin Sedimentation of the inorganic filler inside can be prevented. Examples of the anti-settling material include flaky glass, talc, mica, clay, sericite, carbon, etc. The size of the anti-settling material is not particularly limited, but the rigidity and dimensional stability of the molded product are not limited. More preferably, the average particle size is 10 to 600 μm, and the average shape ratio (major axis / thickness) is 2 to 120.

(Surfactant)
A surfactant is indispensable for improving the familiarity between the filler and the thermosetting resin composition and reducing cracks generated at the interface between the filler and the resin. The surfactant in the present invention is chemically bonded to the inorganic filler and a surfactant having a reactive functional group chemically bonded to the organic matrix resin (in the present invention, referred to as surfactant A), and the inorganic filler. It is preferable to use a surfactant having a non-reactive organic group intertwined with the organic matrix resin (in the present invention, referred to as “surfactant B”) from the viewpoint of achieving both low viscosity and high toughness. Surfactant A reacts with an epoxy resin, an inorganic filler, and a curing agent. Surfactant B does not react with the epoxy resin and the curing agent, but reacts with an inorganic filler.

  Examples of the surfactant A include a silane-based surfactant represented by (General Formula 1).

Here, n is 2 or 3, R is a methyl group or ethyl group, and X is an organic group having an epoxy group, amino group, vinyl group, mercapto group, methacryl group or the like at the terminal. Hereinafter, the definitions of n and R are the same for general formulas described later. For example, vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N-β- (aminoethyl) γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenylγ-aminopropyltrimethoxysilane , Γ-mercaptopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, and the like. Of these, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, and γ-ureidopropyltriethoxysilane are useful.

  The surfactant B is not particularly limited as long as it is a surfactant having a non-reactive organic group that is chemically bonded to the inorganic filler and entangled with the organic matrix resin. For example, there is a silane coupling agent represented by (General Formula 2).

Here, R ′ is an organic group that is non-reactive with an organic matrix resin such as a long-chain alkyl group or an aralkyl group. Hereinafter, the definition of R ′ is the same for general formulas described later. Specifically, isopropyltriethoxysilane, isopropyltrimethoxysilane, benzoltrimethoxysilane, isopropylmethyldimethoxysilane, n-butyltrimethoxysilane, n-hexyltriethoxysilane, stearyltrimethoxysilane, t-butyltrimethoxy There are silane, n-decamethylenetriethoxysilane, isobutyltrimethoxysilane, decyltrimethoxysilane and the like.

  Further, for example, there are titanate surfactants represented by (General Formula 3) to (General Formula 10).

Here, a and b in (General Formula 3) to (General Formula 6) satisfy a + b = 4. Specifically, isopropyl triisostearoyl titanate, isopropyl tristearoyl titanate, isopropyl tridecylbenzenesulfonyl titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl tri (lauryl-myristyl) titanate, isopropyl di (lauryl-myristyl) methacryl titanate , Isopropyl, lauryl-myristyl dimethacryl titanate, isopropyl triricinoyl titanate, isopropyl methacrylate titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl trimethacryl titanate, isopropyl diisostearoyl acrylic titanate, isopropyl isostearoyl diacryl titanate, isopropyl triacryl titanate Ne , Isopropyl-4-aminobenzenesulfonyldi (dodecylbenzenesulfonyl) titanate, isopropyldi (aminobenzoyl) isostearoyl titanate, isopropyltrichymylphenyl titanate, isopropyltri (methoxyphenyl) titanate, isopropyldi (2-formylphenyl) iso Stearoyl titanate, isopropyl tri (2-formylphenyl) titanate, isopropyl tri (N, N-dimethylethylamino) titanate, isopropyl tri (N-ethylaminoethylamino) titanate, isopropyl tri (dioctyl pyrophosphate) titanate, isopropyl Monoalkoxy titanates such as tri (dibutylprophosphite) titanate, tetraisopropylbis (dilauryl phosphate) G) Titanate, Tetraisopropylbis (dioctylphosphite) titanate, Tetraoctylbis (ditridecylphosphite) titanate, Tetraoctylbis (dilaurylphosphite) titanate, Tetra (2,2-diallyloxymethyl-1-butyl) Cordinate-type titanates such as bis (ditridecylphosphite) titanate, diisostearoyloxyacetate titanate, di (dioctyl phosphate) oxyacetate titanate, di (dioctyl phosphate) oxyacetate titanate, di (dioctyl pyrophosphate) oxy Acetate titanate, di (dibutylprophosphate) oxyacetate titanate, isostearoyl methacryloyloxyacetate titanate, dimethacrylo Loxyacetate titanate, isostearoyl acryloyloxyacetate, diacryloyloxyacetate titanate, bis (cumylphenyl) oxyacetate titanate, 4-aminophenylsulfonyldodecylphenylsulfonyloxyacetate titanate, 4-aminophenylisostearoyloxyacetate titanate, bis (2 -Formylphenoxy) oxyacetate titanate, dianthraroyloxyacetate titanate, diisostearoyl ethylene titanate, bis (octyl phosphate) ethylene titanate, di (dioctyl pyrophosphite) ethylene titanate, methacryloyl isostaroyl ethylene titanate, dimethacryloyl Ethylene titanate, diacryloyl ethylene titanate Chelate types such as 4-aminophenylisostearoyl titanate, dianthranylethylene titanate, 4-aminophenylsulfonyldodecylphenylsulfonylethylene titanate, bis (cumylphenoxy) isostearoylethylene titanate, bis (2-formylphenyl) ethylene titanate Trialkoxy titanates such as titanate, triisopropylisostearoyl titanate, and trioctylisostearoyl titanate can be used. Of these, monoalkoxysilane and monoalkoxy titanate are particularly useful.

  When there is too much compounding quantity of surfactant A, it exists in the tendency for crack resistance to fall. Moreover, when there are too many compounding quantities of surfactant B, there exists a tendency for heat resistance to fall. The surfactant is preferably blended in an amount of 0.05 to 2 wt%, more preferably 0.1 to 1.5 wt%, based on the inorganic filler.

(Flexibility agent)
In the present invention, a non-reactive elastomer (for example, NBR, liquid rubber such as polybutadiene or chloroprene rubber, silicone oil, silicone rubber, carboxyl or epoxy-modified crosslinking is used for the epoxy resin composition to increase toughness or reduce internal stress. NBR, acrylic rubber, core shell rubber, urethane rubber, thermoplastic polyester elastomer, etc.), reactive elastomer (carboxyl-modified butadiene-acrylonitrile copolymer CTBN, amino-modified butadiene-acrylonitrile copolymer ATBN, carboxyl group in the main chain) NBR, carboxyl-modified polybutadiene, liquid polysulfide, modified silicone urethane prepolymer, core-shell rubber, etc.) and organic particles (flexibility agent) such as thermoplastic resin particles can be blended. In the present invention, it is particularly useful to use a core-shell rubber as a flexibilizing agent. Here, the core-shell rubber in the present invention is a spherical polymer particle made of a polymer having a different center portion and surface layer portion, and has a two-layer structure of a core phase and a single shell phase.

  The component of the core of the core-shell rubber is not particularly limited. For example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, i-butyl (meth) Acrylate, 2-ethylhexyl (meth) acrylate, ethoxyethoxyethyl (meth) acrylate, methoxytripropylene glycol (meth) acrylate, 4-hydroxybutyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, etc. It is done. N-butyl acrylate and ethyl acrylate are preferred. These monomers may include monomers having two or more vinylic functional groups. Although not particularly limited, ethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, 1,4-butylene glycol dimethacrylate, divinylbenzene and the like can be mentioned. Allyl methacrylate is preferred. Also, butadiene-acrylonitrile-styrene (ABS), methyl methacrylate-butadiene-styrene (MBS), methyl methacrylate-butyl acrylate-styrene (MAS), octyl acrylate-butadiene-styrene (OABS), alkyl acrylate-butadiene-acrylonitrile-styrene Particulate elastic bodies such as siloxanes such as (ABS), butadiene-styrene (SBR) and methyl methacrylate-butyl acrylate-siloxane, or rubbers modified from these.

  Although it does not specifically limit as a structural component of a shell, For example, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate etc. are mentioned. Preferred are methyl methacrylate and ethyl acrylate. The monomer may include a monomer having two or more vinylic functional groups. Although not particularly limited, ethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,3-butylene glycol dimethacrylate, 1,4-butylene glycol dimethacrylate, divinylbenzene and the like can be mentioned. Allyl methacrylate is preferred. In order to improve the interfacial adhesion with the epoxy resin, a monomer having a functional group can be introduced as a constituent component of the shell portion. Examples of functional groups include epoxy groups, hydroxyl groups, amide groups, imide groups, amine groups, imine groups, carboxylic acid groups, and carboxylic anhydride groups.

  The ratio (weight ratio) of the core / shell layer is 40/60 to 95/5, more preferably 60/40 to 85/15. If the core / shell layer ratio is off 40/60 and the core ratio decreases, the toughness of the resulting cured product may be inferior, which is not preferable. On the other hand, if the ratio of the core / shell layer exceeds 95/5 and the ratio of the shell layer decreases, the polymer particles are difficult to disperse in the composition, and the expected physical properties and the electrical properties of the vacuum valve may not be obtained. There is.

  As the core-shell rubber described above, those commercially available in a state of being uniformly dispersed in the epoxy resin can be used. However, it is preferable to use an epoxy resin composition that is commercially available as a core-shell rubber alone. It is more preferable because the degree of freedom can be widened. Examples of commercially available core-shell rubber include “paraloid” EXL-2655 (Rohm & Haas) made of butadiene, alkyl methacrylate, and styrene copolymer, and “staphyloid” made of acrylic acid ester / methacrylic acid ester copolymer. AC-3355, TΓ-2122 (manufactured by Takeda Pharmaceutical Co., Ltd., currently transferred to Gantz Chemical Co., Ltd.), “Paraloid” EXL-261, D11L-26ID, EXL made of butyl acrylate / methyl methacrylate copolymer -3387 (Rohm & Haas) can be used.

A core-shell paraloid KM355 having core-shell particles mainly composed of a butyl acrylate core and a poly (methyl methacrylate) shell can be used. Metabrene C, E, acrylic rubber consisting of core-shell particles, in which a core composed mainly of polybutadiene having a particle size of 80 to 120 nanometers and having a shell based on methyl methacrylate formed thereon, was used. It is commercially available under the name METABLEN W, Methbrene S using silicone / acrylic composite rubber. A core-shell rubber comprising a cross-linked silicone core and a polymethyl methacrylate shell is commercially available from Asahi Kasei Wacker Silicone Co. under the name Genio Pearl. Also, Zefiac F351, Staphyloid IM-203, IM-401, IM-601, Kaneace MX commercially available from Kaneka Corp. as a functional group-modified core shell rubber, etc. can be used. In particular, when using low molecular weight diglycidyl ether obtained by the reaction of at least bisphenol A having an epoxy equivalent of 160 to 180 or / and bisphenol F and epichlorohydrin as an epoxy resin, core-shell rubber fine particles may be added. It is essential. The core-shell rubber fine particles are preferably added in an amount of 0.5 to 3.5 wt%, more preferably 0.65 to 3.14 wt% with respect to the thermosetting resin composition (Experimental example).
The present invention will be specifically described with reference to experimental examples, but the present invention is not limited to the following experimental examples. Abbreviations used in the following experimental examples and comparative examples are as follows. In addition, the following experiment examples mean what applied the idea of this invention, and do not mean the thing outside the scope of the present invention.
(Polyfunctional epoxy resin)
E1: Diglycidyl ether of bisphenol AF (epoxy equivalent 174)
E2: Diglycidyl ether of bisphenol AD (epoxy equivalent 173)
E3: Diglycidyl ether of bisphenol F (epoxy equivalent 160)
E4: Diglycidyl ether of bisphenol A (epoxy equivalent 175)
E5: Diglycidyl ether of bisphenol AF (epoxy equivalent 184)
E6: Diglycidyl ether of bisphenol A (epoxy equivalent 187)
E7: Diglycidyl ether of bisphenol F (epoxy equivalent 190)
E8: Diglycidyl ether of bisphenol AF (epoxy equivalent 192)
E9: Diglycidyl ether of bisphenol AD (epoxy equivalent 203)
E10: Diglycidyl ether of bisphenol AF (epoxy equivalent 224)
E11: Diglycidyl ether of bisphenol AF (epoxy equivalent 295)
E12: Diglycidyl ether of bisphenol AD (epoxy equivalent 295)
(Acid anhydride curing agent)
H1: Methyl nadic acid anhydride (anhydride equivalent 178)
H2: Methyltetrahydrophthalic anhydride (acid anhydride equivalent 166)
H3: Methylhexahydrophthalic anhydride (acid anhydride equivalent 168)
(Inorganic filler)
(Crushed crystalline silica); CS-1 shown using the initial CS of crystalline silica (Crystalline Silica) CS-1: Crushed crystalline silica, average particle size 23.3 μm, particle size cumulative distribution 60 μm or less 100%
CS-2: Crushed crystalline silica, average particle size 10.0 μm, particle size cumulative distribution 60 μm or less 100%
CS-3: Crushed crystalline silica, average particle size 5.0 μm, particle size cumulative distribution 48 μm or less 100%
CS-4: Crushed crystalline silica, average particle size 1.0 μm, particle size cumulative distribution 10 μm or less 100%, 1 μm or less 60%
CS-5: Crushed crystalline silica, average particle size 4.5 μm, particle size cumulative distribution 48 μm or less 100%
CS-6: Crushed crystalline silica, average particle size 5.4 μm, particle size cumulative distribution 48 μm or less 100%
CS-7: Crushed crystalline silica, average particle size 6.2 μm, particle size cumulative distribution 48 μm or less 100%
CS-8: Crushed crystalline silica, average particle size 7.1 μm, particle size cumulative distribution 48 μm or less 100%
CS-9: Crushed crystalline silica, average particle size 8.2 μm, particle size cumulative distribution 48 μm or less 100%
(Crumbled fused silica); MS-1 shown using the initial MS of fused silica (Molten Silica) MS-1: Crushed fused silica, average particle size 30 μm, particle size distribution 80% or less 100%, 48 μm or less 80%
MS-2: Crushed fused silica, average particle size 15.1 μm, particle size distribution 80% or less 100%, 48 μm or less 85%,
MS-3: Crushed fused silica, average particle size 9 μm, particle size distribution 48 μm or less 100%
MS-4: Crushed fused silica, average particle size 8 μm, particle size distribution 48 μm or less 100%
MS-5: Crushed fused silica, average particle size 5.4 μm, particle size cumulative distribution 48 μm or less 100%
MS-6: Crushed fused silica, average particle size 2.5 μm, particle size distribution 48 μm or less 100%
(Lubricant); LM-1 shown using the initial LM of Lubricating Material LM-1: Lubricant, spherical fused silica, average particle size 0.1 μm, particle size cumulative distribution 1 μm or less 100%
LM-2: Lubricant, spherical fused silica, average particle size 0.55 μm, particle size cumulative distribution 1 μm or less 100%
LM-3: Lubricant, spherical fused silica, average particle size 0.8 μm, particle size cumulative distribution 1 μm or less 100%
(Anti-settling material); indicated by using the initial PP of the anti-settling material (Precipitation Prevention Material) PP1: Anti-settling material, plate-like aluminum hydroxide, average particle size 0.5 μm, particle size cumulative distribution 1 μm or less 60%
(Curing accelerator)
C1: 2-phenyl-4-methyl-5-hydroxymethylimidazole C2: 1-cyanoethyl-2-phenylimidazole C3: 1-cyanoethyl-2-ethyl-4-methylolimidazole C4: 1-cyanoethyl-2-phenylimidazo Lithium trimellitate C5: 2-methylimidazole tetraphenylborate C6: 2-ethyl-4-methyl-imidazole tetraphenylborate C7: Tetraphenylphosphonium tetraphenylborate (surfactant)
1. Silane surfactant A
S1: β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane S2: γ-glycidoxypropyltrimethoxysilane S3: γ-aminopropyltriethoxysilane S4: γ-ureidopropyltriethoxysilane S5: γ- ( 2-aminoethyl) aminopropyltrimethoxysilane Titanate surfactant B
T1: Isopropyltriethoxysilane T2: Isopropyltriisostearoyl titanate T3: Isopropyltridodecylbenzenesulfonyl titanate T4: Isopropyltrioctanoyl titanate T5: Isopropyltri (lauryl-myristyl) titanate T6: Tetraisopropylbis (dilaurylphosphite) titanate T7: Trioctyl isostearoyl titanate (flexibility agent)
A1: MBS core / shell true spherical rubber Paraloid EXL-2655
A2: Silicone core / methacryl shell spherical rubber GENIOPERL P52 100-150 nm
A3: Core shell rubber Epoxy group-modified PMMA Zefiac F301, average primary particle diameter 2 μm
A4: Acrylic copolymer core / shell spherical rubber staphyloid IM-203, primary particle average diameter 0.3 μm
A5: Acrylic copolymer core / shell true spherical rubber Zefiac F351, primary particle average diameter 0.3 μm
A6: Core shell rubber Paraloid EXL-261
A7: Core shell rubber Paraloid EXL-3387
A8: Core shell rubber Paraloid KM355
A9: Core shell rubber KANEACE MX
Various characteristics were evaluated as follows.
(Viscosity of varnish)
The viscosity of the thermosetting resin composition at a high shear rate (200 Hz) was measured using a vibration viscometer. The viscosity at a low shear rate was measured using a B-type viscometer.
(Pot life)
The epoxy resin main resin composition E and the epoxy resin curing agent composition H were mixed at 60 ° C., and the time when the viscosity of the B-type viscometer reached twice the initial viscosity was defined as the pot life.
(Presence or absence of precipitation of acid anhydride curing agent with inorganic filler added)
After the epoxy resin curing agent composition H was held at 60 ° C. for 12 hours, the case where the inorganic filler had settled was regarded as having a sedimentation of the filler-added acid anhydride composition. As can be seen from the term of pot life, when the epoxy resin main resin composition E and the epoxy resin curing agent composition H are mixed, a reaction occurs and the viscosity increases in a short time. Therefore, it is assumed that the epoxy resin main component resin composition E and the epoxy resin curing agent composition H are separately prepared and stored, and both are mixed and used immediately before use. Therefore, if the inorganic filler settles during storage, the inorganic filler becomes non-uniform and cannot be used. In all experimental examples, the epoxy resin main resin-based resin composition E does not precipitate after being held at 60 ° C. for 12 hours.
(Bending properties of cured product)
The bending strength (σ _{B25 ° C.} ), flexural modulus (E _{B25 ° C.} ), and bending fracture strain (ε _{B25 ° C.} ) of the cured product were determined according to JIS K 7171: 2008.
(Measurement of glass transition temperature and thermal expansion coefficient of cured product)
In accordance with JIS K7197: 1991, the linear expansion coefficient was measured using thermomechanical analysis (TMA). Also, the inflection point of linear expansion was determined and used as the glass transition temperature.
(Heat deformation temperature of cured product)
A test piece of 5 × 12.7 × 120 mm was cut, and the thermal deformation temperature (deflection temperature under load) was determined in accordance with JIS K 7191: 1996.
(The thermal conductivity of the cured product)
The thermal conductivity was measured using a TCHM-1 type thermal conductivity measuring device manufactured by DYNATECH R / D COMPANY using a thermosetting resin composition casted in a size of 50φ × 9 mm and a cured disc as a test piece. .
(Measurement of fracture toughness value of cured product)
The fracture toughness test for determining the plane strain fracture toughness value K _IC was performed at room temperature using the Double Cantilever method. Cooling restraint thermal stress (σ _{25 ° C.} ), stress safety factor (σ _{B25 °} C./σ _{25 ° C.} ), cooling restraint thermal stress (σ _{−30 ° C.} ), stress safety factor (Σ _{B25 °} C./σ _{−30 ° C.} ), strain safety factor (F _{25 ° C.} ), strain safety factor (F _{−30 ° C.} ) and allowable defect size were calculated as follows.
[I] Cooling restraint thermal stress (σ _{25 ° C.} ) = (Glass transition temperature of epoxy cured product−25) × (thermal expansion coefficient less than glass transition temperature of epoxy cured product−expansion coefficient of alumina ceramic of vacuum valve) × epoxy Elastic modulus of cured product E _{B25 ℃} ÷ 1000
[II] Stress safety factor (σ _{B25 °} C./σ _{25 ° C.} ) = Bending strength of epoxy cured product σ _{B25 ° C.} ÷ cooling restraint thermal stress σ _{25 ° C.}
[III] Strain safety factor (F _{25 ° C.} ) = {(Coefficient of thermal expansion below glass transition temperature of epoxy cured product−Expansion coefficient of alumina ceramic of vacuum valve) × (Glass transition temperature of epoxy cured product−25)} ÷ Bending fracture strain ε _{B25 ° C of} cured epoxy
[IV] Cooling restraint thermal stress (σ _{−30 ° C.} ) = (Glass transition temperature of epoxy cured product + 30) × (thermal expansion coefficient equal to or lower than glass transition temperature of epoxy cured product−expansion coefficient of alumina ceramic of vacuum valve) × epoxy Elastic modulus of cured product E _{B25 ° C} ÷ 1000
[V] Stress safety factor (σ _{B25 °} C./σ _{−30 ° C.} ) = Bending strength of epoxy cured product σ _{B25 ° C.} ÷ Cooling restraint thermal stress σ _{−30 ° C.}
[VI] Strain safety factor (F- _{30 ° C.} ) = {(Coefficient of thermal expansion below the glass transition temperature of the epoxy cured product−Expansion coefficient of alumina ceramic of the vacuum valve) × (Glass transition temperature of the epoxy cured product + 30)} ÷ Bending fracture strain ε _{B25 ° C of} cured epoxy
[VII] Permissible defect size = (planar strain fracture toughness value of epoxy cured product K _IC ÷ bending strength of epoxy cured product σ _{B25 ° C.} ) ² ÷ 1.26 ÷ π × 1000
(Partial discharge start voltage of mold vacuum bulb, DC breakdown voltage)
Set to SF ₆ gas insulation test tank with high voltage shield and ground electrode attached to mold vacuum valve, and with commercial frequency by 500kV test transformer with 0.45MPa of SF ₆ gas for external insulation sealed While applying an AC voltage of (50 Hz) for 1 minute or longer, the voltage was increased in 5 kV steps to confirm non-destructiveness, and the partial discharge amount was measured. A voltage at which a partial discharge of 10 picocoulomb was generated was defined as a partial discharge start voltage. The determination value of the partial discharge start voltage of the mold vacuum bulb was 25 kV or more, the determination value of the DC breakdown voltage was 75 kV or more, and the determination value of the temperature rise value when 1250 A was energized was 60 ° C. or less.
(1) Experimental Examples 1 to 8 (Influence of blending ratio of crushed crystalline silica to inorganic filler)
Diglycidyl ether of bisphenol AF having an epoxy equivalent of 174 is used as the polyfunctional epoxy resin, and crushed crystalline silica and crushed fused silica are used as the inorganic filler, and the blending ratio is related to the physical properties of the resin composition and the electrical characteristics of the vacuum valve. Table 1 shows the results of studying the effect on the effect. 100 parts by weight of diglycidyl ether (E1) of bisphenol AF having an epoxy equivalent weight of 174 and half amount of crushed crystalline silica having an average particle size of 4.5 μm as described in Table 1 (CS-5: C-BASE-1; registered trademark) ) And crushed fused silica (MS-5: ZA-30; registered trademark) having an average particle size of 5.4 μm and a surfactant γ-glycidoxypropyltrimethoxysilane (S2), and the mixture is thoroughly stirred to obtain an epoxy resin main ingredient. Resin composition E was used. Next, 95.0 parts by weight of methylhexahydrophthalic anhydride (H3) having an acid anhydride equivalent of 168, half of the crushed crystalline silica CS-5 and crushed fused silica MS-5 listed in Table 1, and an interface Activator S2, an acrylic copolymer core / shell spherical rubber Zefiac F351 (A5) having an average primary particle size of 0.3 μm, which is a flexibilizer in the amounts shown in Table 1, and a plate-like material that is an anti-settling material Aluminum hydroxide (PP-1: C-3005; registered trademark), spherical fused silica (LM-1: SO-05H; registered trademark) having an average particle size of 0.1 μm as a lubricant, and a surfactant Isopropyltrioctanoyl titanate (T4) and 1-cyanoethyl-2-ethyl-4-methylolimidazole (C3) as a curing catalyst were mixed and stirred well to obtain an epoxy resin curing agent composition H.

  E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, E and H were heated, and both were mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 1 shows the results and the results of the presence or absence of sedimentation of the inorganic filler when held at 60 ° C. for 12 hours.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The movable electrode side electric field concentration mitigation shield, the fixed electrode side electric field concentration mitigation shield, the conductor electric field concentration mitigation shield, and the surface conductive layer are all grounded. In FIG. 2, the vacuum valve 1 forms a vacuum container 5 by hermetically sealing both end openings of an insulating cylinder 2 made of an alumina ceramic material or the like with a fixed side end plate 3 and a movable side end plate 4. The fixed shaft 6 is vacuum-tightly fixed by the fixed end plate 3, and the movable shaft 7 is attached to the movable side end plate 4 via the bellows 8, so that the contact 9 can be opened and closed while maintaining the vacuum. The arc generated when the contact 9 opens and closes is immediately extinguished in a high vacuum, and when a failure occurs in the high piezoelectric path, the disconnection high voltage circuit is instantaneously interrupted.

  Since the vacuum valve 1 opens and closes the contact 9 in a high vacuum, the high-voltage circuit can be cut off with a short electrode opening / closing distance required for interruption. For this reason, the insulating cylinder 2 can be shortened. This shortens the creeping distance on the outside of the vacuum vessel 5, and when dirt (humidity, dust) in the atmosphere adheres to the vacuum vessel 5, the withstand voltage decreases and external flashing is likely to occur. Become. For this reason, the resin insulator 11 such as an epoxy resin composition mold cured product is integrally provided outside the vacuum vessel 5 by casting. The movable electrode side electric field concentration relaxation shield 12, the fixed electrode side electric field concentration relaxation shield 13, the conductor electric field concentration relaxation shield 14, and the conductor 15 are molded together with the vacuum container 5. One of the conductors 15 is electrically and mechanically connected and fixed to the fixed shaft 6, and the other is a part of the connection terminal. The conductor 15 is exposed at the bushing portion 17 and can be electrically connected. The movable electrode side electric field concentration relaxation shield 12 is a ring body made of aluminum, SUS, or the like that is disposed on the movable side end plate 4 side of the vacuum vessel 5, passes through the movable shaft 7, and is arranged coaxially with the vacuum vessel 5. .

The fixed electrode side electric field concentration relaxation shield 13 is a ring body made of aluminum, SUS, or the like that is disposed on the fixed side end plate 3 side of the vacuum vessel 5, passes through the fixed shaft 6, and is arranged coaxially with the vacuum vessel 5. . The conductor electric field concentration reduction shield 14 is a ring body made of aluminum, SUS, or the like that is in a state in which the conductor 15 penetrates and is disposed near the lead-out port of the bushing portion 17 on the connection terminal side of the conductor 15. . A conductive paint is applied to the outer surface of the vacuum valve 1 to form a conductive layer 16, which is connected to the ground. The movable electrode side electric field concentration reduction shield 12, the fixed electrode side electric field concentration reduction shield 13, and the conductor electric field concentration reduction shield 14 are all electrically connected to the conductive layer 16. The presence or absence of voids in this mold vacuum bulb, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 1. Table 1 shows that the amount of inorganic filler added is adjusted so that the thermal expansion coefficient of the cured product matches the thermal expansion coefficient of aluminum of the electrolytic relaxation shield (23 × 10 ⁻⁶ / ° C.). The mixing ratio of silica is changed.

  As shown in Table 1, precipitation of E and H was not observed in all samples. In addition, the partial discharge start voltage and the DC breakdown voltage of the mold vacuum bulb at the initial stage and after the heat cycle are as follows: the content of crushed crystalline silica is 0 wt%, that is, only crushed fused silica, and 100 wt%, that is, crushed crystals. It can be seen that the case of only silica is low, and it is high when crushed crystalline silica and crushed fused silica are mixed. In particular, the content of crushed crystalline silica is in the range of 70 to 97 wt%. On the other hand, the temperature rise value when 1250 A is energized increases as the blended amount of crushed crystalline silica decreases. In the case of only crushed fused silica, the temperature rise value is 105 ° C., and if the ambient temperature exceeds 27 ° C., the heat distortion temperature of the cured resin product is exceeded, and the molded product starts to deform and cannot be put into practical use.

  The stress safety factor and the strain safety factor are the highest when the content of crushed crystalline silica is 0 wt%, that is, crushed fused silica alone, and is almost the same in the range of 10 to 97 wt% of crushed crystalline silica. When the content ratio of becomes 100 wt%, it rapidly decreases. The partial discharge start voltage of the mold vacuum bulb should be 100 kV or higher when there is no void, exfoliation or fine crack, and the electrical characteristics of the mold vacuum bulb deteriorate when the content of crushed crystalline silica is 100 wt%. The stress safety factor and the strain safety factor are low, and this is considered to be due to the occurrence of peeling and fine cracks.

On the other hand, when the content of crushed crystalline silica is 0 wt%, the electrical characteristics of the mold vacuum valve are lowered despite the high stress safety factor and strain safety factor. This is considered to be due to the fact that when the content of crushed crystalline silica becomes 0 wt%, the allowable defect size decreases, that is, the fracture toughness value is small. The temperature rise during 1250A energization is inversely proportional to the thermal conductivity, and the higher the thermal conductivity, the lower the temperature rise.
(2) Experimental Examples 9 to 15 (Influence of added amount of core shell rubber)
Next, diglycidyl ether of bisphenol AF having an epoxy equivalent of 174 is used as the polyfunctional epoxy resin, and A5 having an average primary particle diameter of 0.3 μm is used as the flexibilizing agent. The effect on the electrical characteristics of the valve was investigated. Mix 100 parts by weight of the polyfunctional epoxy resin E1, half the amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 listed in Table 2, and the surfactant S2, stir well, and composition of epoxy resin main component It was set as thing E. Next, 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Table 2, surfactant S2, and the amount described in Table 2 were used. Flexible agent A5, anti-settling material PP-1, lubricant LM-1, surfactant isopropyltrioctanoyl titanate (T4), curing catalyst 1-cyanoethyl-2-ethyl-4-methynimidazole ( C3) was mixed and stirred well to obtain an epoxy resin curing agent composition H. E and H were kept separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, E and H were heated, and both were mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 2 shows the results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The presence or absence of voids in this mold vacuum bulb, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 2.

As shown in Table 2, no sedimentation was observed in E and H. Further, when a diglycidyl ether of bisphenol AF having an epoxy equivalent of 174 is used as the epoxy resin, the mold vacuum valve after the initial stage and after the heat cycle when the blending ratio of the core shell rubber to the resin composition is in the range of 0 to 3.75 wt%. The partial discharge start voltage and the direct current breakdown voltage have a convex curve. On the other hand, the temperature rise value of the mold vacuum valve shows a downwardly convex curve. When diglycidyl ether of bisphenol AF having an epoxy equivalent of 174 is used, the addition of no core shell rubber cannot be used. The addition amount of the core-shell rubber is preferably 0.5 to 3.5% by weight, particularly preferably 0.65 to 3.14% by weight. If the amount of core-shell rubber added is increased, the viscosity before curing tends to increase and casting failure tends to occur, and the elastic modulus, glass transition temperature, thermal deformation temperature, thermal conductivity of the cured product decreases, fracture strain and The coefficient of thermal expansion increases. Accordingly, the stress safety factor, the strain safety factor and the allowable defect size increase.
(3) Experimental example 3, 16-23 (Influence of kind of core shell rubber)
Using diglycidyl ether of bisphenol AF having a low molecular weight epoxy equivalent of 174 as a polyfunctional epoxy resin, the effect of the type of core-shell rubber-based flexibilizer on the physical properties of the resin composition and the electrical properties of the vacuum valve was examined. . Mix 100 parts by weight of the polyfunctional epoxy resin E1, half the amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 listed in Table 3, and the surfactant S2, and stir well. E. Next, 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Table 1, surfactant S2, and the amount described in Table 3 Epoxy resin curing agent system composition of A1 to A4, A6 to A9, anti-settling material PP-1, lubricant LM-1, surfactant T4 and curing catalyst C3 It was set as the thing H. E and H were kept separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, E and H were heated, and both were mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 3 shows these results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The presence or absence of voids in this mold vacuum bulb, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 3.

As shown in Experimental Examples 16 to 23, no sedimentation was observed in E and H. Further, as the core-shell rubber, in addition to the acrylic copolymer core / shell true spherical rubber Zefiac F351 (primary particle average diameter 0.3 μm) used in Experimental Example 3, the acrylic copolymer core / shell true spherical rubber staphyloid IM -203 (average primary particle diameter 0.3 μm), epoxy group-modified PMMA ZEFIAC F301 (average primary particle diameter 2 μm), silicone core / methacryl shell spherical rubber GENIOPERLP52 (100 to 150 nm), MBS core / shell spherical rubber paraloid EXL- 2655, Paraloid EXL-261, Paraloid EXL-3387, Paraloid KM355, Kane Ace MX and the like were found to be suitable.
(4) Experimental example 3, 24-32 (effect of blending amount of surfactant)
Using diglycidyl ether of bisphenol AF having a low molecular weight epoxy equivalent of 174 as a polyfunctional epoxy resin, a silane-based surfactant chemically bonded to an inorganic filler and an organic matrix resin, and a chemical bond to an inorganic filler The effect of the amount of titanate surfactant molecularly intertwined with the matrix resin on the physical properties of the resin composition and the electrical properties of the vacuum valve was investigated. Mix 100 parts by weight of diglycidyl ether (E1) of bisphenol AF with epoxy equivalent of 174, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 listed in Table 4, and surfactant S2. The mixture was stirred to obtain an epoxy resin main component composition E. Next, 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Table 4, surfactant S2, and the amount described in Table 4 The anti-settling material PP-1, the lubricant LM-1, the surfactant T4, and the curing catalyst C3 were mixed and stirred well to obtain an epoxy resin curing agent-based resin H. E and H were kept separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, E and H were heated, and both were mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 4 shows the results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours.

  Next, using this varnish, a molded product shown in FIG. The appearance of this mold vacuum bulb was observed, and the presence or absence of voids, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 4.

  As shown in Table 4, no sedimentation was observed in E and H. Further, from the results of Experimental Examples 3 and 24-27, when the amount of the surfactant added to the inorganic filler is low, the viscosity before curing is high and casting defects and voids are easily involved, and the fracture strain and fracture toughness value after curing. , Stress safety factor, strain safety factor and allowable defect size are small, and partial discharge starting voltage after heat cycle tends to be low. The blending ratio of the surfactant with respect to the inorganic filler is preferably 0.5 to 10 wt%, particularly preferably 1.2 to 5 wt%.

Further, from the results of Experimental Examples 28 to 32, when the blending ratio of the titanate surfactant that is chemically bonded to the inorganic filler and molecularly entangled with the organic matrix resin increases, the viscosity before curing decreases, and the fracture toughness after curing. As the value increases, the flexural modulus decreases and the bending fracture strain increases. Furthermore, the glass transition temperature and the heat distortion temperature are lowered. It is not preferable that the surfactant that is molecularly entangled with the organic matrix resin is not added because the partial discharge start voltage after the heat cycle becomes small. When no inorganic filler or silane-based surfactant chemically bonded to the organic matrix resin is added, the temperature rise value when the mold vacuum valve is energized is 69 ° C., but the thermal deformation temperature is low, so the ambient temperature is low. If it exceeds 30 ° C., deformation starts, which is not preferable. The blending amount of the titanate surfactant that is molecularly entangled with the organic matrix resin is preferably 25 to 85 wt%.
(5) Experimental Examples 33 to 37 (Influence of the amount of lubricant added)
Using diglycidyl ether of bisphenol AF having a low molecular weight epoxy equivalent of 174 as a polyfunctional epoxy resin, the effect of the addition amount of the lubricant on the physical properties of the resin composition and the electrical physical properties of the vacuum valve was examined. 100 parts by weight of diglycidyl ether (E1) of bisphenol AF having an epoxy equivalent of 174, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-1 listed in Table 5, and surfactant S2 were mixed, The mixture was well stirred to obtain an epoxy resin main component composition E. Next, 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-1 listed in Table 5, surfactant S2, and the amount listed in Table 5 The anti-settling material PP-1, the lubricant LM-1, the surfactant T4, and the curing catalyst C3 were mixed and stirred well to obtain an epoxy resin curing agent composition H. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, E and H were heated, and both were mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 5 shows the results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours.

  Next, using this varnish, a molded product shown in FIG. The appearance of this mold vacuum bulb was observed, and the presence or absence of voids, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 5.

As shown in Table 5, no sedimentation was observed in E and H. Further, from the results of Experimental Examples 33 to 37, the partial discharge start voltage and the DC breakdown voltage of the mold vacuum bulb at the initial stage and after the heat cycle have a convex curve relationship with respect to the amount of lubricant added. I understand. When a lubricant is added before curing, a so-called viscosity which is relatively close to a static state, which is not sheared, is observed with a B-type viscometer. On the other hand, the viscosity close to the pressure gelation with the share observed with the vibration viscometer is the sub-micron spherical lubricant when the lubricant is added, the crushed crystalline silica CS-5 and the crushed fused silica MS-5 It adheres to the surface of the material and becomes a roller and becomes low, and it becomes filled with details, and void generation is reduced. When the amount of the lubricant added is too large, the effect of increasing the viscosity is stronger than the effect of the roller, so that the void tends to be easily caught. Therefore, it seems that it became the convex curve relation with respect to the addition amount of a lubricant. The addition amount of the lubricant is preferably 0.1 to 1.5 wt%, particularly preferably 0.11 to 1.0 wt% with respect to the filler.
(6) Experimental Examples 38 to 42 (Influence of the amount of anti-settling material added)
Using diglycidyl ether E1 of bisphenol AF having a low molecular weight epoxy equivalent of 174 as a polyfunctional epoxy resin, the influence of the addition amount of anti-settling material on the physical properties of the resin composition and the electrical properties of the vacuum valve was examined. . Mix 100 parts by weight of diglycidyl ether (E1) of bisphenol AF with an epoxy equivalent of 174, half amount of crushed crystalline silica CS-5, crushed fused silica MS-5 and surfactant S2 listed in Table 5, and stir well The main resin resin composition E was obtained. Next, 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 listed in Table 5, surfactant S2, and the amount listed in Table 5 The anti-settling material PP-1, the lubricant LM-1, the surfactant T4, and the curing catalyst C3 were mixed and stirred well to obtain a curing agent-based resin composition H. E and H were kept separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. These results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours are shown in Table 5.

  Next, using this varnish, a molded product shown in FIG. The appearance of this mold vacuum bulb was observed, and the presence or absence of voids, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 5.

As can be seen from Experimental Example 38 in Table 5, sedimentation occurs in H to which the anti-settling material PP-1 is not added, and the two-liquid system of E and H cannot be used. Therefore, when storing and using in a two-component system, the addition of an anti-settling material to H is indispensable. In addition, from Experimental Examples 39 to 42, the addition of the anti-settling material tends to increase the viscosity of the resin composition before curing, so it should be kept to the minimum necessary.
(7) Experimental Examples 43 to 49 (Influence of addition amount of acid anhydride curing agent)
Using diglycidyl ether of bisphenol AF having a low molecular weight epoxy equivalent of 174 as a polyfunctional epoxy resin, the influence of the addition amount of an acid anhydride curing agent on the physical properties of the resin composition and the electrical properties of the vacuum valve was investigated. Mix 100 parts by weight of diglycidyl ether (E1) of bisphenol AF having an epoxy equivalent of 174 with half of the crushed crystalline silica CS-5, crushed fused silica MS-5 and surfactant S2 listed in Table 6. The mixture was stirred to obtain a main resin composition E. Acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 listed in Table 6, surfactant S2, and amount of anti-settling material PP-1 listed in Table 6 The lubricant LM-1, the surfactant T4, and the curing catalyst C3 were mixed and stirred well to obtain a curing agent-based resin composition H. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 6 shows these results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours.

  Next, using this varnish, a molded product shown in FIG. The appearance of this mold vacuum bulb was observed, and the presence or absence of voids, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 6.

As shown in Table 6, no sedimentation was observed in E and H. It can also be seen that the partial discharge start voltage and the DC breakdown voltage of the mold vacuum bulb at the initial stage and after the heat cycle have a convex curve relationship with respect to the equivalent ratio of (acid anhydride curing agent / epoxy resin). On the contrary, it can be seen that the temperature rise value of the mold vacuum valve has a downwardly convex relationship with respect to the equivalent ratio of (acid anhydride curing agent / epoxy resin). If the equivalent ratio of (anhydride curing agent / epoxy resin) is small, the viscosity of the resin composition before curing becomes high and it becomes difficult to fill, and the linear expansion coefficient of the cured product increases, resulting in a decrease in the glass transition temperature. It becomes fragile. On the other hand, when the equivalent ratio of (acid anhydride curing agent / epoxy resin) is increased, the viscosity before curing is lowered and the molding work is facilitated. If the equivalent ratio is too large, the glass transition temperature is lowered, and it becomes hard and brittle. The equivalent ratio of (acid anhydride curing agent / epoxy resin) is preferably 0.7 to 1.2, and particularly preferably 0.98 to 1.2 from the viewpoint of reducing the viscosity before curing.
(8) Experimental Examples 50 to 62 (Influence of the type of acid anhydride curing agent and epoxy resin)
In Experimental Examples 50 to 62, the effects of the type of acid anhydride curing agent and the type of polyfunctional epoxy resin were examined. The polyfunctional epoxy resins described in Experimental Examples 50 to 62 in Table 7 and Table 8, and the half amount of crushed crystalline silica CS-5 and crushed fused silica MS- described in Experimental Examples 50 to 62 in Table 7 and Table 8 5 and surfactant S2 were mixed and stirred well to obtain a main resin composition E. Next, the acid anhydride curing agent described in Experimental Examples 50 to 62 in Table 7 and Table 8, half the amount of crushed crystalline silica CS-5 described in Experimental Examples 50 to 62 in Table 7 and Table 8, and crushed melt Silica MS-5, surfactant S2, anti-settling material PP-1 in the amounts described in Experimental Examples 50 to 62 in Table 7 and Table 8, lubricant LM-1, surfactant T4, and curing Catalyst C3 was mixed and stirred well to obtain a curing agent-based resin composition H. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition). The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. These results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours are shown in Tables 7 and 8.

  Next, using this varnish, a molded product shown in FIG. The appearance of this mold vacuum bulb was observed, and the presence or absence of voids, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 7 and Table 8.

As shown in Experimental Examples 60 to 62 in Tables 7 and 8, no sedimentation was observed in E and H. The acid anhydride curing agent is not particularly limited as long as it is an acid anhydride, but a low viscosity is preferable from the viewpoint of castability. From Tables 7 and 8, the epoxy resin is not particularly limited as long as it is an epoxy resin, but a low viscosity is preferred from the viewpoint of castability.
(11) Experimental Examples 63 to 69 (Relationship between molecular weight of epoxy resin and addition amount of core shell rubber)
The relationship between the molecular weight of the polyfunctional epoxy resin and the core-shell rubber was investigated. As the polyfunctional epoxy resin, the polyfunctional epoxy resin described in Experimental Examples 63 to 69 in Table 8, half the amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Experimental Examples 63 to 79 in Table 8, Surfactant S2 was mixed and stirred well to obtain a main resin composition E. The amount of acid anhydride curing agent H3 described in Experimental Examples 63 to 69 in Table 8 and half of the crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Experimental Examples 63 to 69 in Table 8 Activator S2, anti-settling material PP-1, amounts of lubricant LM-1, surfactant T4, and curing catalyst C3 in the amounts described in Experimental Examples 63 to 69 in Table 8 are mixed and stirred well to form a curing agent system. Resin composition H was designated. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 8 shows the results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours.

  Next, using this varnish, a molded product shown in FIG. The appearance of this mold vacuum bulb was observed, and the presence or absence of voids, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 8.

As shown in Experimental Examples 63 to 69 in Table 8, no sedimentation was observed in E and H. When diglycidyl ether such as bisphenol F type, bisphenol AF type or bisphenol AD type is used as the epoxy resin, the viscosity of the epoxy resin composition before curing increases as the molecular weight increases, It can be seen that the toughness has increased. Although not shown in the experimental examples, the same tendency is shown even if bisphenol A type is added to the above group. In Experimental Example 63 with an epoxy equivalent of 184, when no core shell rubber was added, the toughness of the cured product was insufficient, the partial discharge starting voltage after the heat cycle was lowered, and the temperature rise during energization operation exceeded 100 ° C. It becomes impossible to use practically. This is probably due to the occurrence of peeling, cracks, etc. due to the low toughness of the cured product. When the molecular weight is small, the addition of core-shell rubber is indispensable to increase toughness. On the other hand, as can be seen from Experimental Example 64, when the molecular weight is 190, the partial discharge start voltage after the heat cycle is as high as 55 kV or more. That is, when the molecular weight is 190 or more, the addition of an expensive core-shell rubber becomes unnecessary, which is not preferable in terms of economy. However, when the molecular weight is too high, the viscosity increases and casting becomes difficult. The molecular weight is preferably about 190 to 300.
(10) Experimental Example 3, 70-77 (Influence of particle size of crushed crystalline silica)
Using diglycidyl ether of bisphenol AF having a low molecular weight epoxy equivalent of 174 as a polyfunctional epoxy resin, the influence of the particle size of crushed crystalline silica on the physical properties of the resin composition and the electrical physical properties of the vacuum valve was investigated. Mix 100 parts by weight of diglycidyl ether (E1) of bisphenol AF with an epoxy equivalent of 174, half amount of crushed crystalline silica, crushed fused silica MS-5 and surfactant S2 listed in Table 9, and stir well. Resin composition E was used. 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica and crushed fused silica MS-5 listed in Table 9, surfactant S2, and amount of flexibilizer described in Table 9 Mix A5, anti-settling material PP-1, lubricant LM-1, surfactant T4, and curing catalyst C3, stir well and make E and H as curing agent resin composition H separately at 60 ° C. For 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition). The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 9 shows these results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The presence or absence of voids in this mold vacuum bulb, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 9.

As shown in Table 9, in Example 70 (crushed crystalline silica CS-1: 3K-S) and Example 71 (crushed crystalline silica CS-2: D), an anti-settling material is added. Nevertheless, sedimentation occurs in H, and the characteristics of the mold vacuum valve are unstable. Further, as shown in Experimental Example 73, when crushed crystalline silica CS-4: 5X is used, the viscosity before curing becomes high, casting becomes defective, voids exist, and the characteristics of the mold vacuum valve are deteriorated ( The partial discharge start voltage tends to be low). From the above, the average particle size of the crushed crystalline silica is preferably 2 to 9 μm, particularly preferably 4 to 8.5 μm.
(11) Experimental Examples 78 to 85 (Effect of blending ratio of crushed crystalline silica on inorganic filler)
A diglycidyl ether of bisphenol AF having a relatively high molecular weight epoxy equivalent of 192 is used as the polyfunctional epoxy resin, and crushed crystalline silica and crushed fused silica are used as the inorganic filler. The effect of the vacuum valve on the electrical properties was investigated. 100 parts by weight of diglycidyl ether (E8) of bisphenol AF having an epoxy equivalent of 192, half of the crushed crystalline silica CS-5 and crushed fused silica MS-5 listed in Table 10, and surfactant S2 were mixed. The main resin resin composition E was stirred well. Then, 85.7 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Table 10, surfactant S2, and Table 10 The amount of the flexibilizer A5, the anti-settling material PP-1, the lubricant LM-1, the surfactant T4, and the curing catalyst C3 were mixed and stirred well to obtain a curing agent-based resin composition H. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 10 shows these results and the results of the presence or absence of H sedimentation when held at 60 ° C. for 12 hours.

Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The presence or absence of voids in this mold vacuum bulb, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 10. Table 10 shows that the amount of inorganic filler added is adjusted so that the thermal expansion coefficient of the cured product matches the thermal expansion coefficient (23 × 10 ⁻⁶ / ° C.) of aluminum of electrolytic relaxation silured, and crushed crystalline silica and crushed melt. The mixing ratio of silica is changed.

  As shown in Table 10, no sedimentation was observed in E and H. In addition, the partial discharge start voltage and the DC breakdown voltage of the mold vacuum bulb after the initial stage and after the heat cycle are as follows. It can be seen that the case of only crystalline silica is low, and it is high when crushed crystalline silica and crushed fused silica are mixed. In particular, the content of crushed crystalline silica is in the range of 70 to 97 wt%. On the other hand, the temperature rise value when 1250 A is energized increases as the blended amount of crushed crystalline silica decreases. In the case of only crushed fused silica, the temperature rise value is 105 ° C., and if the ambient temperature exceeds 27 ° C., the heat distortion temperature of the cured resin product is exceeded, and the molded product starts to deform and cannot be put into practical use. The stress safety factor and the strain safety factor are the highest when the content of crushed crystalline silica is 0 wt%, that is, crushed fused silica alone, and the crushed crystalline silica is almost equal in the range of 10 to 97 wt%. When the content ratio of becomes 100 wt%, it rapidly decreases.

The partial discharge start voltage of the mold vacuum bulb should be 100 kV or higher when there is no void, exfoliation or fine crack, and the electrical characteristics of the mold vacuum bulb deteriorate when the content of crushed crystalline silica is 100 wt%. The stress safety factor and the strain safety factor are low, and this is thought to be due to the occurrence of peeling and fine cracks. On the other hand, the electrical characteristics of the mold vacuum valve are lowered despite the fact that the stress safety factor and the strain safety factor when the content of crushed crystalline silica is 0 wt% are high. This is considered to be due to the fact that when the content of crushed crystalline silica becomes 0 wt%, the allowable defect size decreases, that is, the fracture toughness value is small. The temperature rise during 1250A energization shows an inverse correlation with the thermal conductivity, and the higher the thermal conductivity, the lower the temperature rise.
(12) Experimental Examples 86 to 92 (Influence of the amount of the flexible agent added)
Using diglycidyl ether of bisphenol AF having a high molecular weight epoxy equivalent of 192 as a polyfunctional epoxy resin and A5 as a flexibilizer, the effect of the blending amount on the physical properties of the resin composition and the electrical properties of the vacuum valve investigated. 100 parts by weight of diglycidyl ether E8 of bisphenol AF having an epoxy equivalent of 192, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Experimental Examples 86 to 92 in Table 11, surface activity Agent S2 was mixed and stirred well to obtain a main resin composition E. Next, 85.7 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Experimental Examples 86 to 92 in Table 11, silane-based surface activity Agent S2, a flexibilizer A5 in an amount described in Experimental Examples 86 to 92 in Table 11, an anti-settling material PP-1, a lubricant LM-1, a system surfactant T4, and a curing catalyst C3. The resulting mixture was thoroughly stirred to obtain a curing agent-based resin composition H. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, E and H were heated, and both were mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. These results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours are shown in Table 11.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The mold vacuum bulb was measured for the presence or absence of voids, partial discharge start voltage, DC breakdown voltage, and temperature rise when 1250 A was energized. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 11.

As can be seen from Experimental Examples 86 to 92 in Table 11, when diglycidyl ether of bisphenol AF having an epoxy equivalent of 192 is used as the epoxy resin, the blending ratio of the core shell rubber to the resin composition is in the range of 0 to 3.75 wt%. Then, the partial discharge start voltage and the DC breakdown voltage of the mold vacuum bulb after the initial stage and after the heat cycle draw a convex curve upward, and the characteristics deteriorate when the addition amount of the core shell rubber is zero or too large. On the other hand, the temperature rise value of the mold vacuum valve shows a downwardly convex curve. When the amount of the core-shell rubber added is zero or too much, the characteristics are deteriorated. When diglycidyl ether of bisphenol AF having an epoxy equivalent of 192 is used, it can be used unlike the case of epoxy equivalent of 174 because the partial discharge voltage after the heat cycle is 60 kV even without the addition of core-shell rubber. The addition amount of the core-shell rubber is preferably 0 to 3.5% by weight, particularly preferably 0.65 to 3.14% by weight. When the amount of the core-shell rubber added is increased, the viscosity before curing tends to increase, resulting in poor casting. After curing, the elastic modulus, glass transition temperature, thermal deformation temperature, and thermal conductivity are decreased, and the breaking strain and the thermal linear expansion coefficient are increased. Accordingly, the stress safety factor, the strain safety factor, and the allowable defect size are increasing.
(13) Experimental Examples 93 to 95 (Effect of presence / absence of lubricant, anti-settling material, and surfactant)
Using diglycidyl ether of bisphenol AF having an epoxy equivalent of 192 as a polyfunctional epoxy resin, the effects of the presence or absence of a lubricant, anti-settling material, and surfactant on the physical properties of the resin composition and the electrical properties of the vacuum valve were investigated. .

  100 parts by weight of diglycidyl ether (E8) of bisphenol AF having an epoxy equivalent of 192, half the amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Experimental Examples 93 to 95 in Table 11; Surfactant S2 was mixed and stirred well to obtain a main resin composition E. Next, 85.7 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica MS-5 described in Experimental Examples 93 to 95 in Table 11, silane-based surface activity Agent S2, a flexibilizer A5 in an amount described in Experimental Examples 93 to 95 in Table 11, an anti-settling material PP-1, a lubricant LM-1, a system surfactant T4, and a curing catalyst C3. The resulting mixture was thoroughly stirred to obtain a curing agent-based resin composition H. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, E and H were heated, and both were mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. These results and the results of the presence or absence of H precipitation when held at 60 ° C. for 12 hours are shown in Table 11.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The mold vacuum bulb was measured for the presence or absence of voids, partial discharge start voltage, DC breakdown voltage, and temperature rise when 1250 A was energized. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 11.

As can be seen from Experimental Examples 93 to 95 in Table 11, if any one of the lubricant, the anti-settling material, and the surfactant is missing, the electrical characteristics of the vacuum valve are deteriorated. In particular, in Experimental Example 95 in which the surfactant T4 was not added, the viscosity of the cured product was high, and voids were included when the vacuum valve was molded, resulting in poor electrical characteristics. From these results, it is understood that it is necessary to add a lubricant, an anti-settling material, and a surfactant to the resin composition.
(14) Experimental Example 3, 96-100 (Influence of particle size of crushed fused silica)
Diglycidyl ether of bisphenol AF having a low molecular weight epoxy equivalent of 174 was used as the polyfunctional epoxy resin, and the influence of the particle size of the crushed fused silica on the physical properties of the resin composition and the electrical properties of the vacuum valve was examined. Mix 100 parts by weight of diglycidyl ether (E1) of bisphenol AF with an epoxy equivalent of 174, half amount of crushed crystalline silica CS-5 and crushed fused silica described in Table 12, and surfactant S2, and stir well. Resin composition E was used. Next, 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica CS-5 and crushed fused silica described in Table 12, crushed fused silica, surfactant S2, and the amount of flexibility described in Table 12 Agent A5, anti-settling material PP-1, lubricant LM-1, surfactant T4, and curing catalyst C3 were mixed and stirred well to obtain a curing agent-based resin composition H. E and H were held at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 12 shows these results and the results of the presence or absence of precipitation of H when held at 60 ° C. for 12 hours.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The presence or absence of voids in this mold vacuum bulb, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 12.

In Experimental Example 96, when crushed fused silica MS-1 (RD-120; registered trademark) having an average particle diameter of 30.0 μm was used, the curing agent-based resin composition H was used despite the addition of an anti-settling material. Sedimentation occurs in the mold, and the characteristics of the mold vacuum valve are unstable. Further, as shown in Experimental Example 100, when crushed fused silica MS-6 (X; registered trademark) having an average particle diameter of 2.5 μm is used, the viscosity before curing becomes high, casting becomes defective, and voids exist. The characteristics of the mold vacuum valve tend to deteriorate. The average particle size of the crushed fused silica is preferably 4 to 20 μm, particularly preferably 5 to 16 μm.
(15) Examples 101 and 102 (influence of particle size of lubricant)
Using diglycidyl ether of bisphenol AF having a low molecular weight epoxy equivalent of 174 as a polyfunctional epoxy resin, the effect of the particle size of the lubricant on the physical properties of the resin composition and the electrical properties of the vacuum valve was investigated. 100 parts by weight of the polyfunctional epoxy resin E1, half the amount of crushed crystalline silica and crushed fused silica described in Experimental Examples 101 and 102 in Table 12, and the surfactant S2, are mixed and stirred well to be a main resin composition. E. In addition, 95.0 parts by weight of acid anhydride curing agent H3, half amount of crushed crystalline silica and crushed fused silica described in Experimental Examples 101 and 102 of Table 12, surfactant S2, and Table 12 The amount of the flexibilizer A5, the anti-settling material PP-1, the lubricant, the surfactant T4, and the curing catalyst C3 were mixed and stirred well to obtain a curing agent-based resin composition H. E and H were held separately at 60 ° C. for 12 hours, and the presence or absence of sedimentation of the inorganic filler was observed. Immediately before use, the main agent E and the main agent H were heated and mixed to obtain a varnish (thermosetting resin composition).

  The viscosity of the varnish was measured with a B-type viscometer and a vibration viscometer. Moreover, the pot life of the varnish was measured. The varnish was then placed in a mold and held at 130 ° C. for 1 hour and 170 ° C. for 5 hours. The bending properties, thermal expansion coefficient, glass transition temperature, thermal deformation temperature, thermal conductivity, and fracture toughness of the obtained cured product were measured. From these data, cooling restraint thermal stress, stress safety factor, strain safety factor and allowable defect size were calculated. Table 12 shows these results and the results of the presence or absence of precipitation of H when held at 60 ° C. for 12 hours.

  Next, using this varnish, a vacuum valve was molded by a pressure gelation method to produce a mold vacuum valve shown in FIG. The presence or absence of voids in this mold vacuum bulb, the partial discharge start voltage, the DC breakdown voltage, and the temperature rise value during 1250 A energization were measured. Moreover, after repeating the heat cycle which hold | maintains at -30 degreeC for 3 hours and hold | maintains at 90 degreeC for 3 hours 5 cycles, the partial discharge start voltage was measured again. The results are also shown in Table 12.

From Experimental Examples 101 and 102 in Table 12, it was found that spherical fused silica having an average particle size of submicron (0.1 μm, 0.55 μm) can be used as a lubricant.
(16) Experimental example 109 (production of a propulsion coil for a linear motor car)
3A and 3B show a linear motor car propulsion coil manufactured using the high toughness and high thermal conductivity thermosetting resin composition of Experimental Example 3 of the present invention. 3A is a schematic perspective view of a coil, and FIG. 3B is a schematic cross-sectional view taken along the line II-II in FIG. 3A.

A cured product 21 of a thermosetting resin composition is wound with a glass-lined prepreg mica tape 20 by a pressure gelation method, molded into an Al wire conductor 19 that has been heat and pressure cured, and a propulsion coil 18 for a linear motor car is produced. did. The thermosetting resin composition for casting a high-pressure coil according to the present invention has excellent workability because of its low viscosity before curing, no voids, no cracks, and excellent electrical and mechanical characteristics. Moreover, since it has high thermal conductivity, there was little temperature rise during operation.
(17) Experimental example 110 (production of molded coil for transformer)
The perspective schematic diagram of the mold coil for transformers produced using the high toughness high thermal conductivity thermosetting resin composition of Experimental Example 4 of the present invention is shown in FIG. In the transformer molded coil 23, the inner and outer peripheries are respectively insulated by prepreg insulators 25 and 27 to form an inner peripheral insulating layer 24 and an outer peripheral insulating layer 26, and the thermosetting resin composition of Experimental Example 4 of the present invention is formed inside the coil. The cured product 28 was made by pouring between the inside and the outer periphery of the winding 29 and heat curing. This was incorporated into an iron core to produce a molded transformer. The temperature rise during operation was small and the characteristics were superior to those of conventional transformers.
(18) Experimental example 111 (production of molded coil for transformer and molded transformer)
A molded coil for a transformer and a molded transformer were produced using the high toughness and high thermal conductivity thermosetting resin composition of Experimental Example 3 of the present invention. FIG. 5A shows a perspective schematic view of the produced molded mold coil, and FIG. 5B shows a schematic view of the molded transformer incorporating the same. The transformer molded coil 32 is formed by forming ribs around terminals on the surface of the outer peripheral insulating layer 34 to obtain an insulating distance. Reference numeral 36 denotes a winding start side terminal, 37 denotes a winding end side terminal, and 38 denotes a tap switching terminal. Ribs 39 and 40 are provided around the terminals 36 and 37 so as to surround them. The protruding height of the ribs 39 and 40 from the surface of the molded coil 32 is set to be smaller than the protruding height of the terminals 36 and 37, and is configured not to obstruct the lead wire connection. This relationship is the same for the protruding height of the tap switching terminal 38 and the protruding height of the rib 41. The molded coil 32 is fitted into the iron core 42, the primary power connection terminal 43 is connected to the terminal 36, the connection bar 44 is connected to the terminal 37, and the tap connection bar 45 is connected to the tap terminal 38. The secondary terminal 46 is a secondary terminal and is connected so as to obtain a single-phase two-wire secondary output.

  The transformer molded coil 32 is molded between the inner insulating layer 33 and the outer peripheral insulating layer 34, and the end insulating layer 35 is molded with the high toughness and high thermal conductivity thermosetting resin composition of the present invention. Since the high toughness and high thermal conductivity thermosetting resin composition of the present invention has a low viscosity at a high share before curing, it is molded in detail. In addition, since it has high toughness and high thermal conductivity, cracks do not occur, temperature rise during operation is small, and the apparatus can be miniaturized.

In the present invention, it is not preferable to provide a buffer layer between the insulating cylinder or the conductor as described above because it leads to delamination between layers and deterioration of electrical and mechanical characteristics, and it is preferable not to provide this.
(19) Experimental Example 112 (Preparation of instrument transformer)
An iron core wound with a primary winding and a secondary winding is placed in a mold, molded and cured with the high toughness and high thermal conductivity thermosetting resin composition of Experimental Example 3 of the present invention, and a 6.6 kV three-phase three-wire. A transformer for measuring instruments used for power receiving facilities of high voltage type consumers. FIG. 6A shows a schematic plan view of the produced instrument transformer, and FIG. 6B shows a schematic sectional view seen from the side. The mold cured product (insulating skin) 47 is an insulating material represented by the high toughness and high thermal conductivity thermosetting resin composition of Example 3 of the present invention in a state where a primary winding and a secondary winding (not shown) are stacked. The resin is molded and cured, and the primary terminal 48, the secondary terminal 49, and the iron core insertion window 50 are integrally formed. Since the high toughness and high thermal conductivity thermosetting resin composition of the present invention has a low viscosity at a high share before curing, it is molded in detail. In addition, since it has high toughness and high thermal conductivity, cracks do not occur, temperature rise during operation is small, and the apparatus can be miniaturized.

  DESCRIPTION OF SYMBOLS 1 ... Vacuum valve, 2 ... Insulating cylinder, 3 ... Fixed side end plate, 4 ... Movable side end plate, 5 ... Vacuum container, 6 ... Fixed shaft, 7 ... Movable shaft, 8 ... Bellows, 9 ... Contact, 10 ... Stress Relaxation layer, 11 ... mold cured product (insulation outer skin), 12 ... movable electrode side electric field concentration relaxation shield, 13 ... fixed electrode side electric field concentration relaxation shield, 14 ... electric field concentration relaxation shield for conductor, 15 ... conductor, 16 ... surface conductivity Layer, 17 ... bushing, 18 ... coil, 19 ... conductor, 20 ... glass-lined prepreg mica tape, 21 ... cured product of thermosetting resin composition, 22 ... terminal, 23 ... molded coil for transformer, 24 ... inner circumference insulation Layer, 25 ... prepreg insulator, 26 ... outer peripheral insulating layer, 27 ... prepreg insulator, 28 ... cured product of thermosetting resin composition, 29 ... winding, 30 ... lead wire, 31 ... lead wire, 32 ... transformer Mold for carp 33 ... Inner peripheral insulating layer, 34 ... Outer peripheral insulating layer, 35 ... End insulating layer, 36 ... Terminal on the winding start side, 37 ... Terminal on the winding end side, 38 ... Terminal for tap switching, 39 ... Rib, 40 ... Rib, 41 ... Rib, 42 ... Iron core, 43 ... Primary power supply connection terminal, 44 ... Connection bar, 45 ... Tap connection bar, 46 ... Secondary terminal, 47 ... Molded cured product (insulation shell), 48 ... Primary terminal 49 ... Secondary terminal, 50 ... Iron core insertion window

Claims (24)

  A cured product of a thermosetting resin composition containing a polyfunctional epoxy resin having two or more epoxy groups per molecule, an acid anhydride curing agent, an inorganic filler, and a surfactant, the composition When the alumina ceramic is molded with an object and cooled to room temperature, the stress safety factor is 7 or more, the strain safety factor is 10 or more, the allowable defect size is 0.1 mm or more, and the thermal conductivity of the cured product is 0.7-2. Resin cured product of high toughness and high thermal conductivity thermosetting resin composition for mold, characterized in that it is 5 W / m · K. The bending fracture strain is 1.5% or more, the thermal conductivity is 0.7 W / m · K or more, and the fracture toughness value is 2.7 MPa · m ^1/2 or more. Hardened resin of high toughness and high thermal conductivity thermosetting resin composition for mold.   The inorganic filler is 55 to 71 vol% with respect to the entire resin composition, and the inorganic filler is made of crushed crystalline silica having an average particle diameter of 2 to 9 μm and crushed fused silica having an average particle diameter of 4 to 20 μm. 2. The mold according to claim 1, wherein the ratio X / Y of the average particle size X of the crushed crystalline silica and the average particle size Y of the crushed fused silica is 0.1 to 2.25. Resin cured product of high toughness and high thermal conductivity thermosetting resin composition. The surfactant is 0.05 to 2 wt% of the inorganic filler, and the surfactant A reacts with the polyfunctional epoxy resin, the curing agent and the inorganic filler, and the polyfunctional epoxy resin and the curing agent. Is a surfactant B that does not react with the inorganic filler but reacts with the inorganic filler,
The surfactant A is 15 to 75 wt% with respect to the total surfactant, and the surfactant B is 25 to 85 wt% with respect to the total surfactant. A resin cured product of the high toughness and high thermal conductivity thermosetting resin composition for a mold according to any one of the above.   The core shell rubber is added as a flexibilizing agent in an amount of 0.5 to 3.5 wt% based on the total weight of the high toughness and high thermal conductivity thermosetting resin composition for molding. A cured resin product of the high toughness and high thermal conductivity thermosetting resin composition for mold according to claim 1.   The resin of the high toughness and high thermal conductivity thermosetting resin composition for mold according to claim 5, wherein the core shell rubber has a core to shell ratio (wt%) of 40/60 to 95/5. Cured product.   7. A high toughness and high thermal conductivity thermosetting resin composition for molds according to claim 1, wherein the lubricant is contained in an amount of 0.5 to 7 wt% based on the weight of the crushed crystalline silica. Cured resin.   The cured resin of the high toughness and high thermal conductivity thermosetting resin composition for mold according to claim 7, wherein the lubricant is spherical silica having a particle diameter of 1 μm or less.   Furthermore, a plate-shaped anti-settling material is contained, The resin hardened | cured material of the toughness high heat conductive thermosetting resin composition for molds of Claim 1 characterized by the above-mentioned.   A vacuum valve having a fixed shaft provided with a fixed electrode at an end and a movable shaft provided with a movable electrode at an end opposite to the fixed shaft, the fixed electrode, the fixed shaft, the movable electrode, and the movable shaft A molded vacuum valve, wherein a vacuum container and a conductor for housing the resin are coated with the cured resin product according to claim 1.   A molded coil comprising a winding, an inner peripheral insulating layer and an outer peripheral insulating layer formed on the inner periphery and outer periphery of the winding, respectively, and an end insulating layer formed on an end surface in the axial direction of the winding. At least one of the inner peripheral insulating layer, the outer peripheral insulating layer, the end insulating layer, and the space inside the winding is covered with the cured resin product according to any one of claims 1 to 9. A molded coil characterized by that.   In a molded-type instrument transformer in which a primary winding and a secondary winding are covered with an insulating resin and an iron core is mounted, the insulating resin is the resin cured product according to any one of claims 1 to 9. Instrument transformer characterized by. A high toughness and high thermal conductivity thermosetting resin composition for molds,
Inorganic filling containing polyfunctional epoxy resin having two or more epoxy groups per molecule, acid anhydride curing agent, crushed crystalline silica having an average particle diameter of 2 to 9 μm, and crushed fused silica having an average particle diameter of 4 to 20 μm A material and a surfactant,
The filler containing the crushed crystalline silica and crushed fused silica contains 55 to 71 vol% of the thermosetting resin composition,
The blending ratio of the crushed crystalline silica and the crushed fused silica is such that the former is 10 to 98 wt% and the rest is the latter.
The ratio X / Y of the average particle diameter X of the crushed crystalline silica and the average particle diameter Y of the crushed fused silica is 0.1 to 2.25, and the mold has high toughness and high thermal conductivity thermosetting resin. Composition. A cured product having a bending fracture strain of 1.5% or more, a thermal conductivity of 0.7 W / m · K or more, and a fracture toughness value of 2.7 MPa · m ^1/2 or more is provided. Item 14. A tough and high heat conductive thermosetting resin composition for a mold according to Item 13.   It is intended to give a cured product having a stress safety factor of 7 or more, a strain safety factor of 10 or more, and an allowable defect size of 0.1 mm or more when the alumina ceramic is mold-cured and cooled from the glass transition temperature to room temperature. The high toughness and high thermal conductivity thermosetting resin composition for molds according to claim 13, which is characterized by:   The core-shell rubber is added as a flexibilizing agent in an amount of 0.5 to 3.5 wt% based on the total weight of the thermosetting resin composition having high toughness and high thermal conductivity for molding. High toughness and high thermal conductivity thermosetting resin composition for molds.   The polyfunctional epoxy resin is obtained by reaction of at least one selected from the group consisting of bisphenol A, bisphenol F, bisphenol AF, bisphenol AD, anthracenediol, and naphthalenediol with epichlorohydrin, and the inorganic filler Is crushed crystalline silica having an average particle diameter of 2 to 9 μm and crushed fused silica having an average particle diameter of 4 to 20 μm, and as the surfactant, a surfactant A that reacts with an epoxy resin, an inorganic filler, and a curing agent, Surfactant B that does not react with the epoxy resin and the curing agent but reacts with the inorganic filler is included. The surfactant A is 15 to 75 wt%, and the surfactant B is 25% based on the total weight of the surfactant. ˜85 wt%, wherein the surfactant is 0.05 to 10 wt% based on the weight of the inorganic filler. The high toughness high heat conductive thermosetting resin composition for molds according to claim 13.   A vacuum valve having a fixed shaft provided with a fixed electrode at an end and a movable shaft provided with a movable electrode at an end opposite to the fixed shaft, the fixed electrode, the fixed shaft, the movable electrode, and the movable shaft A molded vacuum valve comprising a resin insulator that is molded with the thermosetting resin composition according to any one of claims 13 to 17 and a cured resin insulator.   A molded coil comprising a winding, an inner peripheral insulating layer and an outer peripheral insulating layer formed on the inner periphery and outer periphery of the winding, respectively, and an end insulating layer formed on an end surface in the axial direction of the winding. 18. The high-toughness high-thermal-conductive heat according to claim 13, wherein at least one of the inner peripheral insulating layer, the outer peripheral insulating layer, the end insulating layer, and the space inside the winding is used. A molded coil comprising a resin insulator molded and cured with a curable resin composition. In a molded-type instrument transformer in which the primary and secondary windings are covered with insulating resin and an iron core is attached,
An instrument transformer, wherein the insulating resin is a cured product of the high toughness and high thermal conductivity thermosetting resin composition for molds according to any one of claims 13 to 17. A vacuum valve having a fixed shaft provided with a fixed electrode at an end and a movable shaft provided with a movable electrode at an end opposite to the fixed shaft, the fixed electrode, the fixed shaft, the movable electrode, and the movable shaft A method of forming a solid insulation by mold-curing a vacuum container and a conductor with a thermosetting resin composition,
(1) (a) a polyfunctional epoxy resin having two or more epoxy groups per molecule, (c) an inorganic filler, and (d1) acid anhydride curing for the inorganic filler, epoxy resin and epoxy resin An epoxy resin main resin composition E mixed with a surfactant A that reacts with the agent;
(2) (b) Acid anhydride curing agent for epoxy resin, (c) Inorganic filler, (d2) Interface that does not react with polyfunctional epoxy resin and acid anhydride curing agent for epoxy resin, but reacts with inorganic filler The epoxy resin curing agent composition H mixed with the activator B is mixed with the epoxy resin main resin composition E and the epoxy resin curing agent composition H to any one of claims 13 to 17. A method for forming a solid insulation, comprising preparing the thermosetting resin composition described above and molding and curing an outer periphery of an electrical device including a conductor.   The method for forming a solid insulation according to claim 21, wherein a core-shell rubber is mixed with the epoxy resin curing agent-based resin composition H as a flexibilizing agent.   The method for forming solid insulation according to claim 21, wherein a plate-like anti-settling material is mixed with the epoxy resin curing agent-based resin composition H.   The method for forming solid insulation according to claim 21, wherein a lubricant is mixed with the epoxy resin curing agent-based resin composition H.

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