JP2011049491A - Multilayer electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer electronic component having improved reliability, by preventing a parallel connection through-hole conductor from peeling off from a connecting conductor, during baking. <P>SOLUTION: The multilayer electronic component has a structure in which a first connecting conductor 21 and a second connecting conductor 23 that linearly extend from conductor end portions 21a, 23a of corner portions of an insulator layer 10 to conductor end portions 21b, 23b of a circumferential center line RL side, and a first parallel connection through-hole conductor 65 has a diameter smaller than that of a lead-out conductor through-hole conductor 71. By employing the configuration in which the insulator layer 10 extends linearly in an oblique direction, the conductor end portion 21b of the first connecting conductor 21 and the conductor end portion 23b of the second connecting conductor 23 can sink in an inner layer side by a large amount. Furthermore, since the first parallel connection through hole conductor 65 has a diameter smaller than that of the lead-out conductor through hole 71, the first parallel connection through-hole conductor 65 can bite into the second connecting conductor 23 and the first connecting conductor 21. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a multilayer electronic component.

  As a conventional multilayer electronic component, an element body formed by laminating a plurality of rectangular insulator layers, a coil formed in the element body, and both ends in the element stacking direction are formed. An apparatus including a pair of external electrodes is known (see, for example, Patent Document 1). In this multilayer electronic component, in order to lower the direct current resistance, a coil is configured by connecting a plurality of pairs of coil conductors connected in parallel in series in the stacking direction. Further, a pair of connection conductors connecting the coil ends and the lead conductors have a substantially L-shape. Specifically, as shown in FIG. 6A, the connection conductor extends from the corner of the insulator layer to the center position along the edge of the insulator layer, and bends by 90 ° at the center position. Extends to the center of the layer.

JP 2001-44038 A

  However, there is a step of firing after laminating a plurality of ferrite green sheets and pressing them during the manufacturing process of the multilayer electronic component. In this firing step, each conductor or through-hole conductor undergoes heat shrinkage. In the multilayer electronic component, as shown in FIG. 5 in particular, the volume of the lead conductor and the lead conductor through-hole conductor is large, and the heat shrinks as one lump. At this time, as shown in FIG. 5B, the first parallel connection through-hole conductor may be disconnected from each connection conductor due to the influence of heat shrinkage, as shown in FIG. 5B. Specifically, the first parallel connection through-hole conductor is most dislocated between the upper surface of the second connection conductor (indicated by GP1 in the figure) and between the lower surface of the first connection conductor (GP2 in the figure). Next, there are many misses.

  An object of the present invention is to provide a multilayer electronic component in which the through-hole conductor for parallel connection is prevented from coming off from the connection conductor during firing and the reliability is improved.

  The multilayer electronic component according to the present invention includes a combination of an element body formed by laminating a plurality of rectangular insulator layers and a plurality of coil conductors connected in parallel with the insulator layers interposed therebetween. A plurality of sets of coils connected in series to form a spiral coil inside the element body, a pair of external electrodes formed at both ends of the element body in the stacking direction, and at least one external electrode and coil coil Laminated between the ends, the coil conductor is led out in the laminating direction to electrically connect the external electrode and the coil, and is laminated between the lead conductor and the coil end of the coil. A first connection conductor that electrically connects the lead conductor disposed on the side and the coil end disposed on the corner side of the insulator layer, and is laminated between the first connection conductor and the coil end, Parallel to and parallel to the connecting conductor A second connection conductor to be connected; a through-hole conductor for a lead conductor that electrically connects the lead conductor and one end of the first connection conductor; one end of the first connection conductor and one end of the second connection conductor; A first parallel connection through-hole conductor, and a second parallel connection through-hole conductor that electrically connects the other end of the first connection conductor and the other end of the second connection conductor; A through-hole conductor for series connection that electrically connects the other end of the second connection conductor and the coil end, and the first connection conductor and the second connection conductor are centered around the corner of the insulator layer. The first parallel connection through-hole conductor extends in a straight line toward the line side, and has a smaller diameter than the lead conductor through-hole conductor.

  In the multilayer electronic component according to the present invention, the first connection conductor and the second connection conductor extend linearly from the corner side of the insulator layer to the circuit center line side, and the first parallel connection through-hole conductor Is configured to have a smaller diameter than the through-hole conductor for the lead conductor. For example, as shown in FIG. 6, in a connection conductor of a type that bends in an L shape like the first connection conductor in a conventional multilayer electronic component, the range in which pressure acts because it sinks to the inner layer side during lamination crimping. The conductor length is about half of one side of the insulator layer (indicated by L1 in the figure). On the other hand, in the first connection conductor according to the present invention, the conductor length in the range in which the pressure acts to sink to the inner layer side at the time of laminated crimping is about half the oblique line of the insulator layer (L2 in the figure). Indicated by). In other words, the first connection conductor according to the present invention has a shape that is more likely to sink to the inner layer side at the time of laminating and crimping than the conventional first connection conductor. Further, since the first parallel connection through-hole conductor has a smaller diameter than the lead conductor through-hole conductor, the first parallel connection through-hole conductor is connected to the second connection conductor and the first connection at the time of laminated crimping. Can bite into the conductor. Accordingly, the first connection conductor and the second connection conductor can easily sink to the inner layer side, and the contact property with the first parallel connection through-hole conductor can be improved. The amount of sinking of the first connection conductor and the second connection conductor is increased, and the through-hole conductor for first parallel connection bites into the second connection conductor and the first connection conductor to improve the contact property. Even if the first connection conductor and the second connection conductor are pulled to the outer layer side due to the heat shrinkage of the large volume lead conductor and the lead conductor through hole conductor, the first parallel connection through hole conductor is connected to each connection conductor. Can be prevented from coming off. As a result, the reliability of the multilayer electronic component can be improved.

  In the multilayer electronic component according to the present invention, it is preferable that the center axis of the first parallel connection through-hole conductor coincides with the center axis of the lead-through conductor through-hole conductor. The central axis of the first parallel connection through-hole conductor matches the central axis of the lead-through conductor for the lead conductor having a large volume volume, so that the pressure during lamination crimping is transmitted to the first parallel connection through-hole conductor. Therefore, the first parallel connection through-hole conductor can be surely bitten into the first connection conductor and the second connection conductor.

  Further, in the multilayer electronic component according to the present invention, the central axis of the first parallel connection through-hole conductor overlaps with the lead-through conductor through-hole conductor when viewed from the stacking direction. It is preferable to deviate from the central axis of the. The center axis of the lead conductor through-hole conductor having a large volume and the first parallel connection through-hole conductor is deviated, so that the first parallel connection through-hole conductor can hardly be detached during firing.

  In the multilayer electronic component according to the present invention, it is preferable that the first parallel connection through-hole conductor has the same diameter as the second parallel connection through-hole conductor. The through hole for forming the first parallel connection through hole conductor and the through hole for forming the second parallel connection through hole conductor are formed in the same ferrite sheet, but each has the same diameter. Therefore, a processing tool having the same diameter can be used, and the manufacturing efficiency is improved.

  In the multilayer electronic component according to the present invention, it is preferable that the first parallel connection through-hole conductor is thicker than the lead conductor through-hole conductor. Thus, by increasing the thickness of the first parallel connection through-hole conductor, the first parallel connection through-hole conductor can easily bite into the first connection conductor and the second connection conductor at the time of laminating and crimping. It is possible to further prevent the connecting through-hole conductor from being detached from each connecting conductor.

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent that the through-hole conductor for parallel connection remove | deviates from a connection conductor at the time of baking, and can improve the reliability of a multilayer electronic component.

1 is a perspective view of a multilayer electronic component according to an embodiment. FIG. 3 is a developed perspective view of an element body of the multilayer electronic component according to the present embodiment. It is sectional drawing along the III-III line | wire shown in FIG. It is the figure which looked at the extraction conductor, the 1st connection conductor, the 2nd connection conductor, the through-hole conductor for extraction conductors, the 1st parallel connection through-hole conductor, and the 2nd parallel connection through-hole conductor from the direction orthogonal to the lamination direction. . It is the schematic which shows the mode of each conductor and each through-hole conductor at the time of the lamination | stacking crimping | compression-bonding of the conventional multilayer electronic component, and baking. It is a perspective view which shows the shape of the 1st connection conductor of the conventional multilayer electronic component and the multilayer electronic component which concerns on this embodiment. It is the schematic which shows the mode of each conductor and each through-hole conductor at the time of lamination | stacking crimping | compression-bonding of the multilayer electronic component which concerns on this embodiment, and baking. It is a figure which shows the structure of the multilayer electronic component which concerns on a modification, Comprising: It is a figure corresponding to FIG.

  Hereinafter, preferred embodiments of a multilayer electronic component according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view of the multilayer electronic component according to the present embodiment. FIG. 2 is an exploded perspective view of an element body of the multilayer electronic component according to the present embodiment. FIG. 3 is a cross-sectional view taken along line III-III shown in FIG.

  The multilayer electronic component 1 according to this embodiment is a multilayer chip inductor mounted on the surface of a circuit board (not shown), and a plurality of insulator layers are laminated as shown in FIGS. A rectangular parallelepiped element body 2 formed by the above, a coil 3 wound in the element body 2 so that the circumferential center line RL extends in the stacking direction, and both ends of the element body 2 in the stacking direction of the insulator layers It comprises a pair of external electrodes 4 and 5 formed respectively on the part.

  The external electrode 4 is provided so as to cover one end surface 2 a of the element body 2. Further, the external electrode 4 is formed so as to cover a part of the four side surfaces 2c, 2d, 2e, 2f adjacent to the end surface 2a so as to go around from the end surface 2a. The external electrode 5 is provided so as to cover one end surface 2 b of the element body 2. Further, the external electrode 5 is formed so as to cover a part of the four side surfaces 2c, 2d, 2e, 2f adjacent to the end surface 2b so as to go around from the end surface 2b. The portion of the external electrode 4 that extends from the end surface 2a to the side surfaces 2c, 2d, 2e, and 2f and the portion of the external electrode 5 that extends from the end surface 2b to the side surfaces 2c, 2d, 2e, and 2f are the terminal portions of the circuit board. This is the part where contact is made and soldering is performed. Thus, any one of the side surfaces 2c, 2d, 2e, and 2f is disposed so as to face the surface of the circuit board, and the circumferential center line RL of the coil 3 is parallel to the surface of the circuit board. The external electrodes 4 and 5 are formed by applying a conductive paste mainly composed of Ag or glass by dipping or the like after the element body 2 is fired, followed by plating after firing.

  The element body 2 is configured by laminating a plurality of rectangular insulator layers 10. Specifically, a predetermined conductor pattern such as a coil conductor is printed and a through hole is formed on the surface of a ferrite green sheet made of a ferrite material mainly composed of Fe, Ni, Cu, and Zn. Thereafter, a plurality of ferrite green sheets are laminated and pressure-bonded by applying pressure in the laminating direction to obtain a sheet laminate. And the element | base_body 2 is formed by baking after the said sheet | seat laminated body is cut into the unit shape of the element | base_body 2. As shown in FIG. As for the size of the element body 2 after firing, the length in the stacking direction is 0.90 to 0.95 mm, and the size of the side perpendicular to the stacking direction is 0.45 to 0.50 mm. Moreover, the thickness of the insulator layer 10 after baking is set to 0.010 to 0.015 mm.

  As shown in FIGS. 2 and 3, a conductor pattern printed on a ferrite green sheet is laminated inside the element body 2 to draw out the coil 3 and the coil ends 3a and 3b in the laminating direction. 4, 5 and the lead conductors 11, 12, 13 and lead conductors 14, 15, 16 electrically connecting the coil 3 and the coil ends 3a, 3b and the lead conductors 13, 16 are respectively electrically connected. One connection conductors 21 and 22 and second connection conductors 23 and 24 connected in parallel to the first connection conductors 21 and 22 are configured. The conductors are connected to each other by through-hole conductors in the stacking direction.

  The coil 3 is a coil formed in a spiral shape inside the element body 2 by connecting a plurality of sets of a pair of coil conductors connected in parallel across the insulator layer 10 in the stacking direction. Thus, the direct current resistance can be lowered by making the coil have a double structure. Specifically, the coil 3 includes a pair 41 of a pair of coil conductors 30 and 31 connected in parallel, a pair 42 of a pair of coil conductors 32 and 33 connected in parallel, and a pair of coil conductors 34 and 35 connected in parallel. , A pair of coil conductors 36 and 37 connected in parallel, and a pair 45 of a pair of coil conductors 38 and 39 connected in parallel are connected in series in the stacking direction. The insulator layer 10 has edges 10a, 10b, 10c, and 10d in four directions. In FIG. 2, only the insulator layer 10 on the uppermost side and the insulator layer 10 on the lowermost side are only Although the reference numerals of the edge portions 10a, 10b, 10c, and 10d are shown, the following description will be made assuming that the edge portions of the other insulator layers 10 also correspond to the edge portions 10a, 10b, 10c, and 10d.

  One coil conductor 30 constituting the set 41 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The other coil conductor 31 constituting the set 41 is formed on the insulator layer 10 on the lower side of the coil conductor 30 and has the same shape as the coil conductor 30 when viewed from the stacking direction. That is, the coil conductor 31 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The conductor end 30a located on the corner side between the edge 10a and the edge 10d of the insulator layer 10 and the conductor end 30b located on the corner side between the edge 10c and the edge 10d. Each of the conductor end portions 30a and 30b is electrically connected to the conductor end portions 31a and 31b of the other coil conductor 31 through the parallel connection through-hole conductors 51 and 52, respectively. It is connected. Thereby, one coil conductor 30 and the other coil conductor 31 constituting the set 41 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end 31 b of the other coil conductor 31, and the conductor end 31 b passes through the conductor end 32 a of the coil conductor 32 of the set 42 and the through-hole conductor 53 for series connection. Are electrically connected. Thereby, the set 41 and the set 42 are connected in series in the stacking direction. The conductor end 30a of the coil conductor 30 of the set 41 constitutes the coil end 3a of the coil 3 itself.

  One coil conductor 32 constituting the set 42 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10d of the insulator layer 10 and opens at the edge 10c. The other coil conductor 33 constituting the set 42 is formed in the insulator layer 10 on the lower side of the coil conductor 32 and has the same shape as the coil conductor 32 when viewed from the stacking direction. That is, the coil conductor 33 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10d of the insulator layer 10 and opens at the edge 10c. The conductor end 32a located on the corner side between the edge 10c and the edge 10d of the insulator layer 10 and the conductor end 32b located on the corner side between the edge 10b and the edge 10c. Each of the conductor end portions 32a and 32b is electrically connected to the other coil conductor 33 via the conductor end portions 33a and 33b and the parallel connection through-hole conductors 54 and 55, respectively. It is connected. As a result, one coil conductor 32 and the other coil conductor 33 constituting the set 42 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 33 b of the other coil conductor 33, and the conductor end portion 33 b is connected to the conductor end portion 34 a of the coil conductor 34 of the set 43 and the series connection through hole conductor 56. Are electrically connected. Thereby, the set 42 and the set 43 are connected in series in the stacking direction.

  One coil conductor 34 constituting the set 43 is a U-shaped conductor pattern that extends along the edges 10a, 10c, and 10d of the insulator layer 10 and opens at the edge 10b. The other coil conductor 35 constituting the set 43 is formed on the insulator layer 10 on the lower side of the coil conductor 34 and has the same shape as the coil conductor 34 when viewed from the stacking direction. That is, the coil conductor 35 is a U-shaped conductor pattern that extends along the edges 10a, 10c, and 10d of the insulator layer 10 and opens at the edge 10b. The conductor end 34a located on the corner side between the edge 10b and the edge 10c of the insulator layer 10 and the conductor end 34b located on the corner side between the edge 10a and the edge 10b. Each of the conductor end portions 34a and 34b is electrically connected to the other coil conductor 35 via the conductor end portions 35a and 35b and the parallel connection through-hole conductors 57 and 58, respectively. It is connected. As a result, one coil conductor 34 and the other coil conductor 35 constituting the set 43 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 35b of the other coil conductor 35. The conductor end portion 35b is connected to the conductor end portion 36a of the coil conductor 36 of the set 44 and the through-hole conductor 58 for series connection. Are electrically connected. Thereby, the set 43 and the set 44 are connected in series in the stacking direction.

  One coil conductor 36 constituting the set 44 is a U-shaped conductor pattern that extends along the edges 10b, 10c, and 10d of the insulator layer 10 and opens at the edge 10a. The other coil conductor 37 constituting the set 44 is formed on the insulator layer 10 on the lower side of the coil conductor 36 and has the same shape as the coil conductor 36 when viewed from the stacking direction. That is, the coil conductor 37 is a U-shaped conductor pattern that extends along the edges 10b, 10c, and 10d of the insulator layer 10 and opens at the edge 10a. The conductor end 36a located on the corner side between the edge 10a and the edge 10b of the insulator layer 10 and the conductor end 36b located on the corner side between the edge 10a and the edge 10d. Each of the conductor end portions 36a and 36b is electrically connected to the other coil conductor 37 through the conductor end portions 37a and 37b and the parallel connection through-hole conductors 59 and 60, respectively. It is connected. As a result, one coil conductor 36 and the other coil conductor 37 constituting the set 44 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end portion 37 b of the other coil conductor 37, and the conductor end portion 37 b passes through the conductor end portion 38 a of the coil conductor 38 of the set 45 and the series connection through hole conductor 61. Are electrically connected. As a result, the set 44 and the set 45 are connected in series in the stacking direction.

  One coil conductor 38 constituting the set 45 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The other coil conductor 39 constituting the set 45 is formed on the lower insulator layer 10 of the coil conductor 38 and has the same shape as the coil conductor 38 when viewed from the stacking direction. That is, the coil conductor 39 is a U-shaped conductor pattern that extends along the edges 10a, 10b, and 10c of the insulator layer 10 and opens at the edge 10d. The conductor end 38a located on the corner side between the edge 10a and the edge 10d of the insulator layer 10 and the conductor end 38b located on the corner side between the edge 10c and the edge 10d. Each of the conductor end portions 38a and 38b is electrically connected to the conductor end portions 39a and 39b of the other coil conductor 39 via the parallel connection through-hole conductors 62 and 63, respectively. It is connected. As a result, one coil conductor 38 and the other coil conductor 39 constituting the set 45 are connected in parallel in the stacking direction. The conductor end 39b of the coil conductor 39 of the set 45 constitutes the coil end 3b of the coil 3 itself.

  A first connection conductor 21 and a second connection conductor 23 are formed on the insulator layer 10 on the outer layer side of the coil conductor 30 of the coil 3. The first connection conductor 21 extends from the conductor end (other end) 21a on the corner side between the edge 10a and the edge 10d of the insulator layer 10 to the center position of the insulator layer 10, that is, the coil 3 This is a conductor pattern extending linearly toward the conductor end (one end) 21b on the circuit center line RL. The second connection conductors 23 are disposed one by one between the first connection conductor 21 and the coil conductor 30, and have the same shape as the first connection conductor 21 when viewed from the stacking direction. is doing. In other words, the second connection conductor 23 is connected to the central position of the insulator layer 10, that is, the coil, from the conductor end (other end) 23 a on the corner portion between the edge 10 a and the edge 10 d of the insulator layer 10. 3 is a conductor pattern that extends linearly toward the conductor end (one end) 23b on the third center line RL. A through hole is formed in the conductor end portion 21b of the first connection conductor 21, and is electrically connected to the conductor end portion 23b of the second connection conductor 23 via the first parallel connection through hole conductor 65. Yes. Also, a through hole is formed in the conductor end 21a of the first connection conductor 21, and is electrically connected to the conductor end 23a of the second connection conductor via the second parallel connection through hole conductor 66. ing. Thereby, the first connection conductor 21 and the second connection conductor 23 are connected in parallel in the stacking direction. Further, a through hole is formed in the conductor end 23 a of the second connection conductor 23, and is electrically connected to the coil end 3 a of the coil 3 through a series connection through hole conductor 67. Thus, the first connection conductor 21 and the second connection conductor 23 and the coil 3 are connected in series.

  A first connection conductor 22 and a second connection conductor 24 are formed on the insulator layer 10 on the outer layer side of the coil conductor 39 of the coil 3. The first connection conductor 22 extends from the conductor end (other end) 22a on the corner portion between the edge 10c and the edge 10d of the insulator layer 10 to the center position of the insulator layer 10, that is, the coil 3. This is a conductor pattern extending linearly toward the conductor end (one end) 22b on the circuit center line RL. The second connecting conductors 24 are disposed one by one between the first connecting conductor 22 and the coil conductor 39, and have the same shape as the first connecting conductor 22 when viewed from the stacking direction. is doing. In other words, the second connection conductor 24 is connected to the central position of the insulator layer 10, that is, the coil from the conductor end (other end) 24 a on the corner portion between the edge 10 c and the edge 10 d of the insulator layer 10. 3 is a conductor pattern that extends linearly toward the conductor end (one end) 24b on the third center line RL. A through hole is formed in the conductor end 24b of the second connection conductor 24, and is electrically connected to the conductor end 22b of the first connection conductor 22 via the first parallel connection through hole conductor 68. Yes. A through hole is formed in the conductor end 24a of the second connection conductor 24, and is electrically connected to the conductor end 22a of the first connection conductor via the second parallel connection through hole conductor 69. ing. Thus, the first connection conductor 22 and the second connection conductor 24 are connected in parallel in the stacking direction. Further, a through hole is formed in the coil end 3 b of the coil 3, and is electrically connected to the conductor end 24 a of the second connection conductor 24 through the series connection through hole conductor 70. Thus, the first connection conductor 22 and the second connection conductor 24 and the coil 3 are connected in series.

  Lead conductors 11, 12, and 13 are formed on the insulator layer 10 on the outer layer side of the first connection conductor 21, respectively. The lead conductors 11, 12, and 13 are arranged at the center position of each insulator layer 10, that is, on the rotation center line RL of the coil 3. The lead conductor 11 provided on the outermost insulator layer 10 is in contact with the external electrode 4. A through hole is formed in each of the lead conductors 11, 12, and 13 and is electrically connected to the conductor end portion 21 b of the first connection conductor 21 via the lead conductor through hole conductor 71. Thereby, the external electrode 4 and the lead conductors 11, 12, 13, the first connection conductor 21, the second connection conductor 23, and the coil 3 are electrically connected.

  In the insulator layer 10 on the outer layer side of the first connection conductor 22, lead conductors 14, 15, and 16 are formed, respectively. The lead conductors 14, 15, and 16 are arranged at the center position of each insulator layer 10, that is, on the circumferential center line RL of the coil 3. The lead conductor 14 provided on the lower surface of the outermost insulator layer 10 is in contact with the external electrode 5. Through-holes are formed in the lead conductors 15 and 16 and the conductor end portions 22b of the first connection conductors 22, respectively, and the conductor end portions 22b of the first connection conductors 22 and the lead-out conductors 14 through the lead-through conductor through-hole conductors 72. , 15, 16 are electrically connected. Thereby, the external electrode 5 and the lead conductors 14, 15, 16, the first connection conductor 22, the second connection conductor 24, and the coil 3 are electrically connected.

  Each conductor pattern and through-hole conductor are formed by printing and baking a conductive paste mainly composed of Ag on a ferrite green sheet. The thickness of each conductor pattern after firing is set to 5 to 20 μm, more preferably 10 to 15 μm.

  4 shows the lead conductors 11, 12, 13, the first connection conductor 21, the second connection conductor 23, the lead conductor through-hole conductor 71, the first parallel connection through-hole conductor 65, and the second parallel connection through-hole conductor. It is the figure which looked at 66 from the direction orthogonal to the lamination direction. In FIG. 4, the insulator layer 10 is omitted. As shown in FIG. 4, since each through hole is formed by a laser or the like, the lead conductor through hole conductor 71, the first parallel connecting through hole conductor 65, and the second parallel connecting through hole conductor 66 are arranged in the stacking direction. It becomes the shape which makes a taper toward. In the present embodiment, the center axes of the lead conductor through-hole conductor 71 and the first parallel connection through-hole conductor 65 coincide with the center line RL of the coil 3. That is, the central axis of the lead-through conductor 71 and the first parallel connection through-hole conductor 65 coincide with each other. The center axes of the lead conductor through-hole conductor 72 and the first parallel connection through-hole conductor 68 (not shown) also coincide with the center line RL of the coil 3.

  The diameter of the through-hole conductor 71 for the lead conductor can be set to φ30 to 60 μm, and in this embodiment is set to φ50 μm. On the other hand, the diameter of the first parallel connection through-hole conductor 65 is smaller than the diameter of the lead-out conductor through-hole conductor 71, and the diameter can be set to φ20 to 40 μm. In the present embodiment, the diameter is set to φ30 μm. Has been. The diameter of the first parallel connection through-hole conductor 65 is set to the same diameter as the second parallel connection through-hole conductor 66 and the series connection through-hole conductor and parallel connection through-hole conductor of the coil 3. In addition, the diameter of the through-hole conductor in this embodiment has shown the diameter in the position of the narrowest part (GP1 side in FIG.5 (b)). Further, in the present embodiment, the thickness of the first parallel connection through-hole conductor 65 between the first connection conductor 21 and the second connection conductor 23 (indicated by t1 in the figure), the lead conductor 13 and the first connection The thickness of the through-hole conductor 71 for the lead conductor (shown by t2 in the figure) between the conductor 21 and the conductor 21 is the same, and can be set to about 10 μm to 40 μm, more preferably 20 μm to 30 μm. it can. The same relationship applies to the lead-through conductor 72, the first parallel connection through-hole conductor 68, and the second parallel connection through-hole conductor 69, which are not shown in FIG.

  Next, operations and effects of the multilayer electronic component 1 according to the present embodiment will be described with reference to FIGS. 5, 6, and 7.

  FIG. 5 is a schematic view showing a state of each conductor and each through-hole conductor at the time of lamination and pressure bonding of the conventional multilayer electronic component 100, and (a) shows a state at the time of lamination pressure bonding, and (b) ) Shows the state during firing. FIG. 6 is a perspective view showing the shapes of the first connection conductors of the conventional multilayer electronic component 100 and the multilayer electronic component 1 according to the present embodiment. FIG. The shape of a connection conductor is shown, (b) has shown the shape of the 1st connection conductor of the multilayer electronic component 1 which concerns on this embodiment. FIG. 7 is a schematic view showing the state of each conductor and each through-hole conductor at the time of laminated crimping and firing of the multilayer electronic component 1 according to this embodiment, and (a) shows the manner at the time of laminated crimping. , (B) shows a state during firing. 5 and 7 show a portion corresponding to the portion shown in FIG. 5 and 7 are schematic diagrams, and in order to clarify the operation and effect of the present invention and the difference from the conventional multilayer electronic component, and to facilitate the understanding of the explanation, the sinking amount of each conductor And the amount of bite are partially exaggerated or omitted.

  As shown in FIGS. 5 and 6A, the conventional multilayer electronic component 100 is different from the first connecting conductor 101 and the second connecting conductor 102 in the shape of the first parallel connecting through-hole conductor 103. This is different from the multilayer electronic component 1 according to the present embodiment in that the diameter is the same as the diameter of the lead-through conductor 71 for lead conductor. As shown in FIG. 6A, the first connection conductor 101 and the second connection conductor 102 have a shape bent in an L shape, and from the conductor end portion 101 a on the corner portion side of the insulator layer 10. It extends to the center along the edge, bends 90 °, and extends to the conductor end 101b at the center of the insulator layer 10.

  First, in the conventional multilayer electronic component 100, the size of the first parallel connection through-hole conductor 103 is larger than that of the second parallel connection through-hole conductor 66, and is the same size as the lead conductor through-hole conductor 71. Therefore, as shown in FIG. 5A, the first parallel connection through-hole conductor 103 does not bite into the conductor end portion 102b of the second connection conductor 102 and the first connection conductor as shown in FIG. 101 is crimped without biting into the conductor end 101b. Furthermore, a portion (a portion indicated by A in FIG. 6) extending along the edge of the insulator layer 10 among the first connection conductor 101 and the second connection conductor 102 is a coil conductor of the coil 3 when viewed from the stacking direction. Since the first connecting conductor 101 and the second connecting conductor 102 are partially supported by the coil 3, the sinking amount of the conductor end portions 101b and 102b at the time of stacking and crimping can be suppressed.

  Next, when firing is performed, each conductor and the through-hole conductor undergo thermal contraction. In particular, in the multilayer electronic component, the volume of the lead conductors 11, 12, 13 and the lead conductor through-hole conductor 71 is large, and the heat shrinks as one lump. At this time, as shown in FIG. 5B, the conductor end portion 101b of the first connection conductor 101 is pulled by the influence of heat shrinkage, so that the first parallel connection through-hole conductor 103 is connected to each connection conductor 101, In some cases, it would be out of 102. Specifically, the first parallel connection through-hole conductor 103 is most dislocated from the top surface of the conductor end portion 102b of the second connection conductor 102 (indicated by GP1 in the figure), and the first connection conductor 101 Next, there are many dislocations between the lower surface of the conductor end portion 101b (indicated by GP2 in the figure).

  On the other hand, in the multilayer electronic component 1 according to the present embodiment, the first connection conductor 21 and the second connection conductor 23 are located on the circuit center line RL side from the conductor end portions 21a and 23a on the corner portion side of the insulator layer 10. The first parallel connection through-hole conductor 65 has a diameter smaller than that of the lead conductor through-hole conductor 71 and extends linearly to the conductor end portions 21b and 23b.

  As shown in FIG. 6, in the conventional first connection conductor 101, the portion indicated by A in FIG. 6 (a) is supported by the coil conductor on the inner layer side. The distance between the position where a large force acts and the position supported by each coil conductor on the inner layer side is about half the length of one side of the insulator layer 10 (indicated by L1 in FIG. 6). On the other hand, in the first connection conductor 21 according to the present embodiment, the conductor end 21a in FIG. 6B is supported by the coil conductor on the inner layer side. The distance between the position where the force acts and the position supported by the coil conductor on the inner layer side is approximately half the length of the diagonal of the insulator layer 10 (indicated by L2 in FIG. 6), which is greater than L1. become longer. That is, the first connecting conductor 21 has a long conductor length between the position where the force mainly acts and the position supported by the coil conductor, and the inner side of the first connecting conductor 21 is larger than that of the first connecting conductor 101 in the past. The shape is easy to sink. Therefore, as shown in FIG. 7 (a), the conductor end portion 21b of the first connection conductor 21 and the conductor end portion 23b of the second connection conductor 23 are formed in the inner layer as compared with the conventional connection conductor at the time of laminated crimping. Sinks greatly to the side.

  Further, since the first parallel connection through-hole conductor 65 has a smaller diameter than the lead conductor through-hole conductor 71, as shown in FIG. 7A, the first parallel connection through-hole conductor 65 is provided. Can bite into the second connection conductor 23 and the first connection conductor 21. As a result, the conductor end 21b of the first connection conductor 21 and the conductor end 23b of the second connection conductor 23 are likely to sink to the inner layer side, and the contact property with the first parallel connection through-hole conductor 65 is improved. Can do.

  The amount of sinking of the first connection conductor 21 and the second connection conductor 23 increases, and the first parallel connection through-hole conductor 65 bites into the second connection conductor 23 and the first connection conductor 21 to improve the contact property. During firing, as shown in FIG. 7 (b), the lead conductors 11, 12, 13 and the lead conductor through-hole conductor 71 having a large volume volume undergo thermal contraction, thereby causing the first connection conductor 21 and the second connection. Even if the conductor 23 is pulled to the outer layer side, the first parallel connection through-hole conductor 65 can be prevented from being detached from each connection conductor. Thereby, the reliability of the multilayer electronic component 1 can be improved.

  In the multilayer electronic component 1 according to the present embodiment, the central axis of the first parallel connection through-hole conductor 65 coincides with the central axis of the lead-through conductor through-hole conductor 71. Since the central axis of the first parallel connection through-hole conductor 65 coincides with the central axis of the lead conductor through-hole conductor 71 having a large volume, the pressure at the time of laminated crimping is increased. By being easy to transmit to 65, the first parallel connection through-hole conductor 65 can be surely bited into the first connection conductor 21 and the second connection conductor 23.

  In the multilayer electronic component 1 according to the present embodiment, the first parallel connection through-hole conductor 65 has the same diameter as the second parallel connection through-hole conductor 66. The through-hole for forming the first parallel connection through-hole conductor 65 and the through-hole for forming the second parallel connection through-hole conductor 66 are formed in the same ferrite sheet, but each has the same diameter. By doing so, a processing tool having the same diameter can be used, and the manufacturing efficiency is improved.

  The present invention is not limited to the embodiment described above.

  For example, in the above-described embodiment, the center axis of the first parallel connection through-hole conductor 65 coincides with the center axis of the lead-through conductor through-hole conductor 71, but instead, as shown in FIG. The central axis of the first parallel connection through-hole conductor 65 may be shifted from the central axis of the lead conductor through-hole conductor 71 in a state of overlapping with the lead-through conductor through-hole conductor 71 when viewed from the stacking direction. By shifting the center axis of the lead conductor through-hole conductor 71 having a large volume and the first parallel connection through-hole conductor 65, the first parallel connection through-hole conductor 65 can be made difficult to come off during firing. .

  Further, in the above-described embodiment, the thickness of the first parallel connection through-hole conductor 65 and the thickness of the lead conductor through-hole conductor 71 are the same. The thickness of the conductor 65 may be larger than the thickness of the through-hole conductor 71 for the lead conductor. As shown in FIG. 8, the dimension indicated by t1 in the figure can be made larger than the dimension indicated by t2 in the figure. In this way, by increasing the thickness of the first parallel connection through-hole conductor 65, the first parallel connection through-hole conductor 65 is likely to bite into the first connection conductor 21 and the second connection conductor 23 at the time of stacking and crimping. Further, it is possible to further prevent the first parallel connection through-hole conductor 65 from being detached from each connection conductor. In addition, the range of the dimension t1 and the dimension t2 can be set in the range of about 10 μm to 40 μm, more preferably 20 μm to 30 μm, as in the above-described embodiment, and each dimension may satisfy the relationship of t1> t2. Is set.

  In the above-described embodiment, the configuration in which the first parallel connection through-hole conductor has a smaller diameter than the through-conductor for the lead conductor is applied to both end sides of the element body 2 in the stacking direction. Even if it is applied only to at least one end side, the effect of the present invention can be obtained.

  DESCRIPTION OF SYMBOLS 1 ... Laminated type electronic component, 2 ... Element body, 3 ... Coil, 3a, 3b ... Coil end, 4, 5 ... External electrode, 10 ... Insulator layer, 11, 12, 13, 14, 15, 16 ... Lead conductor 21, 22 ... first connection conductor, 21 a, 22 a ... conductor end (other end) 21 b, 22 b ... conductor end (one end), 23, 24 ... second connection conductor, 23 a, 24 a ... conductor end (Other end part), 23b, 24b ... conductor end part (one end part), 30, 31, 32, 33, 34, 35, 36, 37, 38, 39 ... coil conductor, 41, 42, 43, 44, 45 ... A set of a plurality of coil conductors, 65 and 68 ... First through-hole conductor for parallel connection, 66 and 69 ... Second through-hole conductor for parallel connection, 67 and 70 ... Through-hole conductor for series connection, 71 and 72 ... Through-hole conductor for conductor.

Claims (5)

An element body formed by laminating a plurality of rectangular insulator layers;
A plurality of sets of coil conductors connected in parallel across the insulator layer, a plurality of sets connected in series in the stacking direction, a coil formed in a spiral shape inside the element body,
A pair of external electrodes respectively formed at both ends of the element body in the stacking direction;
A lead conductor that is laminated between at least one of the external electrodes and a coil end of the coil, and that draws the coil end in a laminating direction to electrically connect the external electrode and the coil;
The lead conductor, which is laminated between the lead conductor and the coil end of the coil, is disposed on the side of the coil around the center line, and the coil end disposed on the corner side of the insulator layer is electrically connected. A first connecting conductor to be connected
A second connection conductor laminated between the first connection conductor and the coil end, parallel to the first connection conductor and connected in parallel;
A through-hole conductor for a lead conductor that electrically connects the lead conductor and one end of the first connection conductor;
A first parallel connection through-hole conductor for electrically connecting the one end of the first connection conductor and one end of the second connection conductor;
A second parallel connection through-hole conductor for electrically connecting the other end of the first connection conductor and the other end of the second connection conductor;
A series connection through-hole conductor for electrically connecting the other end of the second connection conductor and the coil end;
The first connection conductor and the second connection conductor extend linearly from the corner side of the insulator layer to the circumferential centerline side,
The multilayer electronic component according to claim 1, wherein the first parallel connection through-hole conductor has a smaller diameter than the lead conductor through-hole conductor.   2. The multilayer electronic component according to claim 1, wherein a central axis of the first parallel connection through-hole conductor coincides with a central axis of the lead-through conductor through-hole conductor.   The center axis of the first parallel connection through-hole conductor is deviated from the center axis of the lead conductor through-hole conductor in a state of being overlapped with the lead-through conductor through-hole conductor when viewed from the stacking direction. The multilayer electronic component according to claim 1, wherein:   The multilayer electronic component according to claim 1, wherein the first parallel connection through-hole conductor has the same diameter as the second parallel connection through-hole conductor.   The multilayer electronic component according to claim 1, wherein the first parallel connection through-hole conductor is thicker than a thickness of the lead conductor through-hole conductor.

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