JP2011046196A - Mold - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold wherein a corona generating voltage is high, and an interval between metal sheets is small, and the assembling work thereof is easy. <P>SOLUTION: For the mold, an adhesive material layer 1 is installed on both surfaces of an insulating polymer film 2, and a sheet-like metal body 3 is respectively bonded to each adhesive material layer 1. At the same time, those both surfaces are molded with an external layer insulating polymer 6. When the sheet-like metal body 3 is bonded to the insulating polymer film 2, the bonding is performed in such a manner that the end sections 5 of the sheet-like metal body 3 may be covered with an adhesive material, and then, the peripheries of the bonded articles are molded with the external layer insulating polymer 6. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention is a molded product that maintains an interval between a plurality of plate-shaped metal bodies using an insulating polymer film, and is particularly intended to suppress voids at the end portions of the plate-shaped metal bodies.

  Conventionally, in order to insulate between a plurality of plate-like metal bodies (metal plates), as shown in FIG. 4, an epoxy-based thermosetting adhesive is applied to a film-like insulating polymer (hereinafter referred to as an insulating polymer film) 2. Is applied in advance with a thickness of several μm to several tens of μm, and both sides of the metal plate are bonded (laminated) with the adhesive surface of the insulating polymer 15 with adhesive.

  There are two types of methods for insulating these metal plates. One of them is, as shown in FIG. 5 (a), in which metal plates 3 laminated with an insulating polymer 15 are bonded together using an adhesive 16 to form an insulating layer. Called. The other is a type used when used at a higher voltage. As shown in FIG. 5B, insulation is provided between the metal plates 3 laminated with the insulating polymer 15 in order to secure a sufficient insulation distance. The spacer 4 is inserted and is called “insulating spacer separation type”.

JP 2005-32465 A

  The prior art has the following two problems because it has a shape and structure in which a metal plate is laminated with an insulating film.

  (1) In the case of the insulating film laminated integrated type shown in FIG. 5A, the void 17 is generated (formed) at the end of the metal plate 3, so that there is a problem that the corona generation voltage is low. there were.

  (2) When using the high voltage shown in FIG. 5B (insulating spacer separation type), a large space is required because the distance between the metal plates 3 must be wide. was there. For this reason, it has been difficult to reduce the distance between the metal plates 3 and reduce the inductance of the wiring.

  Further, since the metal plates 3 are separated from each other, there is a problem in that it takes time to assemble.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a molded product having a high corona generation voltage, a narrow interval between metal plates, and an easy assembling work, and a method for manufacturing the same.

  In order to achieve the above object, the invention of claim 1 is provided with layers of an adhesive material on both surfaces of an insulating polymer film, and a plate-like metal body is bonded to each of the layers of the adhesive material, and both surfaces are insulated. In a molded body molded with a polymer, when the plate-like metal body is bonded to the insulating polymer film, the end of the plate-like metal body is bonded so as to be covered with an adhesive material, and then bonded. The periphery of the object is molded with an outer insulating polymer.

  In the invention of claim 2, it is preferable to cover the end of the plate-shaped metal body with the adhesive material with a thickness of 1/10 or more of the thickness of the plate-shaped metal body.

  In the invention of claim 3, the insulating polymer film may be made of engineering plastics having an aromatic ring.

  According to a fourth aspect of the present invention, an outer layer insulating polymer sheet is sandwiched between the insulating polymer film and the plate-shaped metal body bonded, and each outer layer insulating polymer sheet is melted with a hot press, and the periphery of the adhesive is coated with an outer layer insulating polymer. It is preferable to mold.

  In the invention of claim 5, it is preferable that an adhesive layer is provided on one side of each of the outer insulating polymer sheets, and the outer insulating polymer sheets and the adhesive are bonded using the adhesive layer.

  The present invention provides a method for producing a molded body in which layers of an adhesive material are provided on both surfaces of an insulating polymer film, and a plate-like metal body is bonded to each adhesive material layer, and these both surfaces are molded with an outer insulating polymer. In the above, a layer of an adhesive material is provided on both surfaces of the insulating polymer film, the plate-like metal body is disposed on both surfaces of the insulating polymer film, and then the adhesive layer is melted by heating and pressing, and the molten adhesive material Part of the metal plate is raised to a thickness of 1/10 or more of the thickness of the plate-like metal body, and at least a part of the end of the plate-like metal body is bonded with an adhesive material. The outer layer insulating polymer sheet is sandwiched between the outer layer insulating polymer sheets, and the outer layer insulating polymer sheet is melted with a hot press, and the periphery of the adhesive is molded with the outer layer insulating polymer sheet.

  The present invention provides a method for producing a molded body in which layers of an adhesive material are provided on both surfaces of an insulating polymer film, and a plate-like metal body is bonded to each adhesive material layer, and these both surfaces are molded with an outer insulating polymer. In this case, a thermosetting adhesive is applied to both sides of the insulating polymer film, the plate-like metal bodies are arranged on both sides of the insulating polymer film, and then heated and pressed, and one of the applied thermosetting adhesives is applied. The part is raised to a thickness of 1/10 or more of the thickness of the plate-like metal body, and at least a part of the end of the plate-like metal body is covered with a thermosetting adhesive, and the thermosetting adhesive is thermoset. After that, these adhesives are sandwiched between outer layer insulating polymer sheets, the outer layer insulating polymer sheet is melted with a hot press, and the periphery of the adhesive is molded with the outer layer insulating polymer.

  According to the present invention, it is possible to suppress the formation of voids between the outer insulating polymer and the metal plate edge by covering and molding the metal plate edge with an adhesive material, thereby reducing the concentration of the electric field. can do.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of the invention will be described with reference to the accompanying drawings.

  As shown in FIG. 2, the molded body according to the present embodiment has a layer (adhesive film) 1 of an adhesive material having a predetermined layer thickness on both surfaces of a laminated insulating polymer film 2 (hereinafter referred to as a laminated film). A metal plate (plate-like metal body) 3 is bonded to each adhesive film 1 and both surfaces (peripheries) thereof are molded with an outer insulating polymer 6.

  The laminated film is formed by bonding a plurality of insulating polymer films 2 in FIG. 2, and the metal plates 3 and 3 are kept at a predetermined interval by the laminated film. The number of laminated insulating polymer films 2 in the laminated film is appropriately determined according to the interval (separation distance) between the metal plates 3 and 3.

  The laminated film and the metal plate 3 are bonded via the adhesive film 1 so that at least a part of the end of the metal plate 3 is covered with an adhesive material. More specifically, as shown in FIG. 1, a part of the adhesive material is raised with a thickness and width equal to or greater than t / 10 of the thickness t of the metal plate 3 by the pressure applied at the time of bonding. The end of the metal plate 3 is covered with the raised portion 5. That is, the boundary between the end portion of the metal plate 3 and the laminated film is covered with the raised portion 5 made of the adhesive material.

  It is preferable that the metal plate 3, the adhesive film 1, the laminated film adhesive (hereinafter referred to as “inner part”) and the outer insulating polymer 6 are bonded via an adhesive layer 7.

  When the thickness and width of the raised portion 5 are set to t / 10 or more of the thickness t of the metal plate 3, if less than t / 10, the end of the metal plate 3 and the boundary portion of the laminated film are shielded from the outside air. This is because the effect of this is insufficient, the concentration of the electric field, which will be described later, cannot be relaxed, and the corona generation voltage becomes low.

  The layer thickness of the adhesive film 1 is such a thickness that the raised portion 5 can be formed at the end portion of the metal plate 3 at the time of bonding and melting. For example, t / 10 of the thickness t of the metal plate 3 It is supposed to be before and after. However, since the layer thickness of the adhesive film 1 varies depending on press molding conditions (temperature, pressure, time) described later and the thickness of the metal plate 3, it is not particularly limited thereto. The layer thickness of the adhesive layer 7 is preferably the same as the layer thickness of the adhesive film 1.

  Next, a method for manufacturing a molded body according to the present embodiment will be described.

  The metal plate 3, the adhesive film 1, and the insulating polymer film 2 are laminated and arranged in a predetermined number of steps. For example, as shown in FIG. 2, each layer is laminated and disposed in the order of the metal plate 3, the adhesive film 1, the laminated film, the adhesive film 1, and the metal plate 3 from the top. As the adhesive material constituting the layer 1 of the adhesive material, a material having a melting point (or softening point) T1 lower than the melting point (or softening point) T2 of the insulating polymer film 2 is used.

  Next, the adhesive film 1 is melted by press molding at a temperature higher than the melting point T1 and lower than the melting point T2, that is, heat-pressed, and a part of the melted adhesive material has the thickness of the metal plate 3. Swelling occurs at a thickness of 1/10 or more, and a swelled portion 5 is formed. As a result, the metal plate 3 and the insulating polymer film 2 are bonded to each other, and the end portions of the metal plate 3 are bonded so as to be covered with the adhesive material, thereby forming the internal component.

  Next, using an outer layer insulating polymer sheet (not shown) provided with an adhesive layer 7 on one side, the internal components are sandwiched. By melting the outer layer insulating polymer sheet with a hot press, the periphery of the inner part is molded with the outer layer insulating polymer 6, and a molded body is obtained.

  When press-molding the metal plate 3, the adhesive film 1, and the laminated film (insulating polymer film 2), it is necessary that the insulating polymer film 2 is not deformed by heat or pressure, so that the difference between the melting point T1 and the melting point T2 is large. It is desirable. For this reason, the insulating polymer film 2 is preferably a polymer having excellent heat resistance such as engineering plastics (hereinafter referred to as engineering plastic), and the adhesive material is preferably a modified polyolefin-based one.

  As the outer layer insulating polymer 6 for molding the inner part composed of the metal plate 3, the adhesive film 1, and the laminated film, a material whose melting point (or softening point) T3 is lower than the melting point T2 described above is used. For example, polyolefin polymers such as polyethylene and polypropylene are preferable.

  Representative examples of engineering plastics that are rigid materials having aromatic rings include polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyphenylene ether (PPE), polycarbonate (PC), polyamide (PA), polyphenylene sulfide (PPS). , Polyether ether ketone (PEEK), liquid crystal polymer (LCP), polyether sulfone (PES), etc., but are not limited thereto.

  Typical examples of the adhesive material include polyethylene and polypropylene modified with maleic anhydride.

  Next, the operation of the present embodiment will be described.

  In the molded product according to the present embodiment, one side (laminated film side) of the end portion of the metal plate 3 is covered with an adhesive material at a thickness of 1/10 or more of the thickness of the metal plate 3. . For this reason, even if the fluidity of the outer layer insulating polymer 6 is insufficient, the outer layer insulating polymer 6 is not filled in the boundary portion between the end portion of the metal plate 3 and the laminated film, and voids are formed in this boundary portion (see FIG. 5A). ) Is formed, one side of the end of the metal plate 3 is completely cut off from the outside air. Therefore, the concentration of the electric field on one side of the end portion of the metal plate 3 can be alleviated, and use with a high electric field is possible.

  In the molded product, since the adhesive layer 7 is provided on one side of the outer insulating polymer sheet constituting the outer insulating polymer 6, the other side of the end portion of the metal plate 3 is formed when the outer insulating polymer 6 is molded. Also, the adhesive layer 7 is covered with a thickness of 1/10 or more of the thickness of the metal plate 3. For this reason, the other side of the end of the metal plate 3 is also completely shielded from the outside air. Therefore, the concentration of the electric field can be alleviated also on the other side of the end portion of the metal plate 3, and the use with a high electric field becomes possible.

  When the corona generation voltage of the molded product according to the present embodiment was measured, for example, a value of 5 kV or more was obtained, and the corona generation voltage was high. Compared with this, the corona generation voltage of the molded body in which one side of the end portion of the metal plate 3 is not covered with the adhesive material was low. When the cross section of the molded body was observed, the outer insulating polymer 6 was not filled around one side of the end of the metal plate, and voids were formed. From these, like the molded body according to the present embodiment, the end of the metal plate 3 is covered with an adhesive material with a thickness of 1/10 or more of the thickness of the metal plate 3, thereby It can be seen that void formation at the end can be suppressed.

  Further, unlike the insulating spacer separation type, it is not necessary to insert an insulating spacer between the metal plates 3 and 3, so that the interval between the metal plates 3 and 3 can be reduced, and the wiring can be reduced in inductance. be able to.

  Moreover, since the metal plates 3 and 3 are bonded together via a laminated film, the handling of the internal components in the molded body is simple, and the assembly work is also easy.

  The molded body according to the present embodiment can be applied to a laminate bus bar for an inverter power source, for example, a laminate bus bar for an inverter power source such as an HEV (hybrid vehicle), a train, and an elevator / escalator.

  Next, another embodiment of the present invention will be described with reference to FIGS.

  The manufacturing method of the molded object which concerns on previous embodiment provided the adhesive film 1 on both surfaces of the laminated | multilayer film, and adhere | attached the metal plate 3 on each adhesive film 1, respectively. On the other hand, the method for producing a molded body according to the present embodiment applies a thermosetting adhesive to both surfaces of a laminated film, and bonds the metal plate 3 to each thermosetting adhesive layer. It is.

  First, a thermosetting adhesive having a predetermined layer thickness is applied to both surfaces of the laminated film. As the thermosetting adhesive, a material whose curing temperature T4 is lower than the melting point (or softening point) T2 of the insulating polymer film 2 is used. As the thermosetting adhesive, one having a low curing temperature is preferable, and representative examples include epoxy-based adhesives and acrylic-based adhesives.

  Next, the layers are laminated and arranged in the order of the metal plate 3, the laminated film with the adhesive applied to both surfaces, and the metal plate 3 from the top. Then, by heating and pressing at a temperature higher than the curing temperature T4 and lower than the melting point T2, first, the metal plate 3 is pressed against the laminated film side, and a part of the uncured thermosetting adhesive is metal plate. 3 swelled to a thickness of 1/10 or more of the thickness of 3, and a swelled portion 5 is formed. Thereby, one side of the end of the metal plate 3 is covered with the uncured thermosetting adhesive. Subsequently, the thermosetting adhesive is thermoset. As a result, the metal plate 3 and the insulating polymer film 2 are bonded, and one end of the metal plate 3 is bonded so as to be covered with the thermosetting adhesive, thereby forming the internal component.

  Next, using an outer insulating polymer sheet provided with an adhesive layer 7 on one side, the internal components are sandwiched. By melting the outer layer insulating polymer sheet with a hot press, the periphery of the inner part is molded with the outer layer insulating polymer 6, and a molded body is obtained.

  Also in the molded product obtained by the manufacturing method according to the present embodiment, the same effects as the molded product obtained by the manufacturing method according to the previous embodiment can be obtained.

Example 1
An example of the implementation of the present invention is shown in FIG. Copper electrode (large 11:55 mm × 55 mm, t = 1 mm (FIG. 3A)), small 12:55 mm × 35 mm, t = 1 mm (FIG. 3B) as metal plate, LCP as insulating film (inner layer film) (Japan Gore-Tex Co., Ltd., ST225N-BT1, 40 mm × 40 mm, t = 0.225 mm), flame retardant polyolefin (linear low density polyethylene (LLDPE) / polypropylene (PP)) as an insulating polymer (outer layer material) = 1/1 blend, magnesium hydroxide (Mg (OH) ₂ ) with a particle size of 1 μm, 200 parts by weight per 100 parts by weight of blend polymer, acid-modified polypropylene (Mitsubishi Chemical Corporation, Modic) as adhesive material (adhesive film) P594, t = 0.1 mm) 14 in FIG.3 (a) and FIG.3 (b) is a hole for letting a terminal pass. .

  Two insulating films were heat-sealed at 180 ° C. using an adhesive film to produce a laminated film 13 (see FIG. 3C) composed of two insulating films. An adhesive film having a thickness of 0.1 mm was similarly adhered to both surfaces of the laminated film 13.

  Next, as shown in FIG.3 (c), the laminated film 13 is set in the state which protruded 5 mm of the edge part of the copper electrode small 12, and the copper electrode large 11 was mounted | worn from it, and 180 degreeC hot press molding was carried out. By heating, pressurizing and cooling, the adhesive film of the laminated film 13 was melted, pressure-bonded and solidified, and the small copper electrode 12, the laminated film 13 and the large copper electrode 11 were adhered to form an internal part. The adhesive film was heated and melted during press molding, and a raised portion was formed at a height of 0.1 mm or more at the end of the copper electrode.

  Next, an adhesive film was adhered to the outer layer material sheet (thickness: 2 mm) at 180 ° C., and the outer layer material sheets with the adhesive film adhered were arranged on both surfaces of the internal component, and pressed at 180 ° C. As shown in FIG. 2, by pressing, a molded insulating electrode (molded body) in which the inner part was molded with the outer layer material was obtained.

  When this mold insulated electrode is manufactured, even if the fluidity of the outer layer material is poor, the end of the copper electrode is covered with the adhesive material (swelled part), so no voids are generated and the internal parts are completely covered. I was able to mold.

  When the corona generation voltage (corona discharge start voltage) was measured at a sensitivity of 10 pC with the mold insulating electrode obtained by such a method, a value of 5 kV or more was obtained. Further, when the cross section of this molded product was observed, it was confirmed that no void having a size that adversely affects electrical insulation was generated around the end of the copper electrode.

(Example 2)
As in Example 1, a copper electrode (large 11:55 mm × 55 mm, t = 1 mm, small 12:55 mm × 35 mm, t = 1 mm) as a metal plate, and PPS (manufactured by Toray Industries, Inc.) as an insulating film (inner layer film) Torelina, 40 mm × 40 mm, t = 0.3 mm), flame retardant polyolefin (outer layer material), flame retardant polyolefin (manufactured by Riken Technos Co., Ltd., Trinity ANA9954N), two-component mixed silicone adhesive as an adhesive material used for inner layer film (Manufactured by Konishi Co., Ltd., Bond MOS7, t = 0.1 mm), and acid-modified polypropylene (Mitsubishi Chemical Corporation, Modic P594, t = 0.1 mm) was used as an adhesive material used for the outer layer material.

  Two insulating films were heat-cured at 180 ° C. using an adhesive and adhered to produce a laminated film 13 made of two insulating films. An adhesive was applied to both sides of the laminated film 13 with a thickness of 0.1 mm.

  Next, the laminated film 13 was set with the end of the copper electrode small 12 protruding 5 mm, and the copper electrode large 11 was placed thereon. Then, by heating with a 180 ° C. heating press, first, an uncured adhesive forms a raised portion at a height of 0.1 mm or more at the end of the copper electrode, and then the adhesive is thermally cured, The small copper electrode 12, the laminated film 13, and the large copper electrode 11 were bonded to form an internal part.

  Next, an adhesive was adhered to the sheet of outer layer material (thickness 2 mm) at 180 ° C., and the outer layer material sheet with the adhesive adhered was disposed on both surfaces of the internal component, and pressed at 180 ° C. As shown in FIG. 2, by pressing, a molded insulating electrode (molded body) in which the inner part was molded with the outer layer material was obtained.

  In the molded insulating electrode of Example 2, no void was generated as in Example 1, and the internal part could be completely molded.

  When the voltage generated by the corona was measured with the mold insulating electrode obtained by such a method, a value of 5 kV or more was obtained. Further, when the cross section of this molded product was observed, it was confirmed that no void having a size that adversely affects electrical insulation was generated around the end of the copper electrode.

(Example 3)
Using the same electrode as in Examples 1 and 2, modified PPE (made by Asahi Kasei Co., Ltd., Zylon 540Z, t = 0.3 mm) as an insulating film (inner layer film), flame retardant polyethylene (Ube Maruzen) as an insulating polymer (outer layer material) Polyethylene Co., Ltd., UBE polyethylene C790N), hot melt adhesive (manufactured by Asahi Kasei Co., Ltd.), SEBS (styrene-ethylene-butylene block copolymer, t = 0.3 mm) and acid-modified polyethylene (Mitsubishi) A laminated film made by Chemical Co., Ltd., Modic M545, t = 0.2 mm) was used.

  The internal temperature was produced in the same procedure as in Example 1 with the pressing temperature set to 120 ° C. The adhesive film (laminated film 13) was heated and melted during press molding, and a raised portion was formed at a height of 0.1 mm or more at the end of the copper electrode.

  Next, the outer layer material sheet was pressed at a press temperature of 120 ° C. and molded in the same procedure as in Example 1 to produce a molded insulating electrode.

  When the corona generation voltage of the mold insulating electrode obtained by such a method was measured, a value of 5 kV or more was obtained. Further, when the cross section of this molded product was observed, it was confirmed that no void having a size that adversely affects electrical insulation was generated around the end of the copper electrode.

(Comparative Example 1)
Copper electrode (large 11:55 mm × 55 mm, t = 1 mm, small 12:55 mm × 35 mm, t = 1 mm) as a metal plate, PPS (Toray Industries, Torelina, 40 mm × 40 mm, as an insulating film (inner layer film), t = 0.3mm), flame retardant polyolefin (made by Riken Technos Co., Ltd., Trinity ANA9954N) as an insulating polymer (outer layer material), and two-component mixed silicone adhesive (made by Konishi Co., Ltd.) as an adhesive material used for the inner layer film , Bond MOS7, t = 0.02 mm), and acid-modified polypropylene (Mitsubishi Chemical Corporation, Modic P594, t = 0.1 mm) was used as the adhesive material used for the outer layer material.

  Two insulating films were thermally cured at 180 ° C. using an adhesive to produce a laminated film 13 composed of two insulating films. The adhesive material was applied thinly (with a thickness of 0.02 mm) on both surfaces of the laminated film 13.

  Next, the laminated film 13 was set with the end of the copper electrode small 12 protruding 5 mm, and the copper electrode large 11 was placed thereon. Then, the adhesive was thermally cured by heating with a 180 ° C. hot press, and the small copper electrode 12, the laminated film 13, and the large copper electrode 11 were bonded to form an internal part. At the time of this hot pressing, since the coating thickness of the adhesive was thin, it was impossible to form a raised portion at a height of 0.1 mm or more at the end of the copper electrode.

  Next, an adhesive was adhered to the sheet of outer layer material (thickness 2 mm) at 180 ° C., and the outer layer material sheet with the adhesive adhered was disposed on both surfaces of the internal component, and pressed at 180 ° C. By pressing, a molded insulated electrode (molded article) in which the internal part was molded with the outer layer material was obtained.

  When the corona generation voltage of the mold insulating electrode obtained by such a method was measured, corona discharge was generated at about 2 kV. When the mold insulating electrode was cut and the cross section was observed, voids were confirmed around the end of the copper electrode.

  From the above, in Examples 1 to 3, since the copper electrode end portion is covered with the adhesive material, the formation of voids around the copper electrode end portion is suppressed, and a high corona generation voltage (5 kV or more). was gotten.

  On the other hand, in the case of Comparative Example 1 in which the copper electrode end is not covered with the adhesive material, the corona generation voltage is as low as less than 5 kV (about 2 kV), and when the cross section is observed, the outer layer material is formed around the end of the copper electrode. Was not filled, and voids were formed around the edge of the copper electrode.

It is sectional drawing which shows the state which covered the edge part of the metal plate with the adhesive material. 1 is a cross-sectional view of a molded product according to a preferred embodiment of the present invention. It is a top view of the copper electrode used for [Example]. 3A is a large copper electrode, FIG. 3B is a small copper electrode, and FIG. 3C is a plan view of internal components. It is sectional drawing of a film-like insulating polymer. It is a figure for demonstrating the insulation method of the conventional metal plate. FIG. 5A is a cross-sectional view of an insulating film lamination integrated type, and FIG. 5B is a cross-sectional view of an insulating spacer separation type.

1 Adhesive film (layer of adhesive material)
2 Insulating polymer film 3 Metal plate (plate metal body)
5 Swelling part (edge of plate metal)
6 Outer insulation polymer

Claims (5)

  In a molded product in which layers of adhesive material are provided on both sides of an insulating polymer film, and a plate-like metal body is bonded to each adhesive material layer, and both surfaces are molded with an outer layer insulating polymer, the insulating polymer film is coated with the insulating polymer film. When the plate-like metal body is bonded, the ends of the plate-like metal body are bonded so as to be covered with an adhesive material, and then the periphery of the bonded metal mold is molded with an outer insulating polymer. Molded body.   The molded body according to claim 1, wherein the end of the plate-like metal body is covered with the adhesive material with a thickness of 1/10 or more of the thickness of the plate-like metal body.   The molded article according to claim 1 or 2, wherein the insulating polymer film is made of engineering plastics having an aromatic ring.   From what the said insulating polymer film and the said plate-shaped metal body were adhere | attached between outer-layer insulating polymer sheets, each outer-layer insulating polymer sheet was fuse | melted with the hot press, and the circumference | surroundings of the adhesive material were molded by the outer-layer insulating polymer. 3. The molded article according to any one of 3.   The molded article according to any one of claims 1 to 4, wherein an adhesive layer is provided on one side of each outer layer insulating polymer sheet, and each outer layer insulating polymer sheet and the adhesive are bonded using an adhesive layer.

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