JP2011036942A - Substrate fixing tool and substrate machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To remove chips discharged from a rotary cutting tool by sucking them from the an upper side of a substrate. <P>SOLUTION: A substrate fixing tool 10 has a substrate storage part 14 for storing the substrate 12 with the part mounting surface of the substrate 12 facing upward and a lid 16 for covering the substrate 12 stored in a substrate storage part 14. A through groove 16a passing through the lid so as to be extended and allowing a rotary cutting tool 50 for cutting the substrate 12 to be inserted into is arranged at the lid 1. A lid suction passage 16b is extended in the lid 16 and is opened to the inner surface of the through groove 16a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus that processes a substrate using a rotary cutting tool.

  When manufacturing a circuit board to be incorporated in an electronic device, it has been proposed to reduce the cost in the component mounting process by mounting components on a plurality of circuit boards at once. For this purpose, it is necessary to mount components while holding a plurality of circuit boards together, and to divide the circuit boards into individual circuit boards after mounting the components. Specifically, a plurality of circuit boards are formed on one large board, components are mounted on the plurality of circuit boards with one large board, and then the large board is cut with a cutter (cutting tool). Into individual circuit boards. Hereinafter, one large substrate on which a plurality of circuit boards are formed is referred to as a “multi-chip substrate material”.

  In order to reduce the portion to be cut by the cutter as much as possible, the multi-piece substrate material is provided with cuts (grooves such as elongated slits) along the outer shape of each circuit board. When a cut is provided over the entire outer periphery of the circuit board, the circuit board is separated from the multi-piece substrate material, so the cut is interrupted at a plurality of locations, and the circuit boards are connected and integrated at the disconnected portion. It is in the state of a multi-piece substrate material.

  Therefore, after mounting components and the like on each circuit board of the multi-piece substrate material, the individual circuit boards can be separated by cutting only the portions where the cuts are interrupted (connected portions) with a cutter. When cutting a multi-piece substrate material with a cutter, the chip material (or chips) of the substrate material is discharged from the cutter, and therefore it is necessary to remove the chip material so that it does not adhere to the circuit board or the mounted component.

  As a means for removing chips, there is a method of removing discharged chips by suction. For example, a method has been proposed in which a suction nozzle is disposed in the vicinity of the outer periphery of the cutter, and suction is immediately performed by the suction nozzle when chips are discharged from the cutter.

  Here, air is blown and blown off to the chips coming out of the disk-shaped cutter (rotary blade), and the blown chips are sucked by the air suction part so that the chips do not adhere to the components on the circuit board. (For example, refer to Patent Document 1). In the case of a disc-shaped cutter, the direction in which the chips are discharged is determined, so it is only necessary to blow air from one direction and provide an air suction part on the opposite side.

  Moreover, when cooling a cutter by spraying a cooling liquid on a cutter, the method of wash | cleaning a chip by flowing a lot of cooling liquid is proposed (for example, refer to cited reference 2). This method requires a cooling liquid supply device and a recovery device, and also requires a step of removing or drying the cooling liquid adhering to the circuit board. For this reason, the substrate processing apparatus becomes large and complicated.

JP 2004-56056 A JP 2000-216113 A

  As a cutter used for cutting a substrate material, a cylindrical rotary cutting tool having a small diameter is often used. In this rotary cutting tool, a blade portion is formed by a spiral groove formed on a cylindrical outer periphery. The substrate material is cut by rotating the cutter at a high speed and pressing the side surface (outer peripheral surface) against the substrate material.

  When the substrate material is cut with the above-described cutter, the chips are discharged through the spiral groove of the cutter. If the multi-sided board material can be cut with the front side on which the component is mounted facing up, if the chips are discharged to the back side of the multi-sided board material, the chips fall down and many Almost no adhesion to the substrate material.

  However, when the mounted component protrudes from the outer shape of the circuit board, it is impossible to bring a large number of cutters close to the front side (mounting surface side) of the board material. For this reason, the multi-piece substrate material is cut from the back side with the back side facing up. At this time, if the chips are discharged downward, the chips are discharged to the front side of the circuit board and may adhere to the mounted component. For this reason, it is necessary to discharge the chips to the top, but when discharged to the top, the chips are discharged onto the multi-piece substrate material. For this reason, it is necessary to provide a means for removing the chips discharged from the cutter.

  Therefore, a suction nozzle for sucking the chips discharged from the cutter is arranged near the outer periphery of the cutter, and the chips discharged from the cutter are immediately sucked and removed. Since the above-mentioned cutter discharges cutting chips from the entire outer periphery, it is necessary to arrange suction nozzles on both sides of the cutter, for example.

  If the position of the suction nozzle with respect to the cutter is fixed, the suction nozzle can always be arranged in the vicinity of the outer periphery of the cutter, so that chips can be efficiently sucked. However, the above-mentioned cutter has a long and narrow shape, and when cutting is performed near the tip and the sharpness becomes dull, the cutting portion is gradually moved toward the root. That is, by moving the cutter in the longitudinal direction, the cutting portion of the cutter (the portion to be cut in contact with the substrate material) is gradually changed along the longitudinal direction of the cutter to maintain sharpness.

  Therefore, in order to always arrange the suction nozzle in the vicinity of the cutting portion of the cutter, the suction nozzle must also be moved up and down in accordance with the vertical movement of the cutter (movement of the cutting portion). Accordingly, it is necessary to provide a plurality of suction nozzles around the cutter, and to provide a moving mechanism that can move the suction nozzle up and down in accordance with the vertical movement of the cutter. The structure of the substrate processing apparatus is large and complicated. Become.

  According to one embodiment, a substrate fixing jig for mounting a substrate on a substrate processing apparatus, the substrate receiving portion storing the substrate with the component mounting surface of the substrate facing up, and the substrate receiving portion A lid that covers the accommodated substrate; an opening groove that extends through the lid and into which a rotary cutting tool for cutting the substrate can be inserted; and extends into the lid. There is provided a substrate fixing jig having a lid suction passage that opens on an inner surface of the opening groove.

  According to another embodiment, the above-described substrate fixing jig, a mounting table to which the substrate fixing jig is attached, a tool driving unit that drives the rotary cutting tool for cutting the substrate, The rotation through the dust collector suction passage connected to the substrate housing portion suction passage of the substrate fixing jig attached to the mounting table, the lid portion suction passage, the substrate housing portion suction passage, and the dust collector suction passage. There is provided a substrate processing apparatus having a dust collector for sucking chips discharged from a cutting tool.

  Chips discharged from the rotary cutting tool can be removed by suction from the lid suction passage on the upper side of the substrate. Therefore, it is not necessary to arrange the suction nozzle around the rotary cutting tool. In addition, even if the rotary cutting tool is moved up and down to move the cutting part, the height of the part for sucking the chips does not change, and the chips are always sucked in the vicinity of the part where the chips are discharged. be able to. For this reason, there is no need to provide a suction nozzle and a moving mechanism for moving the suction nozzle up and down, and the structure and control of the substrate processing apparatus can be simplified.

It is a perspective view of the pallet which is an example of the board | substrate fixing jig by one Embodiment. It is a top view of the board | substrate with which a pallet is mounted | worn. It is a perspective view which shows the state which mounted | wore the board | substrate with the pallet. It is a perspective view of a substrate processing apparatus. It is sectional drawing of the pallet supported by the pallet support part.

  Next, embodiments will be described with reference to the drawings.

  First, a substrate fixing jig according to an embodiment will be described. FIG. 1 is a perspective view of a pallet 10 which is an example of a substrate fixing jig according to an embodiment.

  The pallet 10 includes a substrate housing portion 14 that houses a substrate 12 to be processed, and a lid portion 16 that covers the substrate 12 housed in the substrate housing portion 14 and fixes the substrate 12. In the present embodiment, one side of the lid portion 16 is attached to the substrate housing portion 14 by a hinge so that the lid portion 16 can be opened and closed. That is, the lid portion 16 is supported so as to be rotatable with respect to the substrate housing portion 14.

  The substrate housing part 14 is formed with a recess or opening 14 a for housing the substrate 12. The substrate 12 is accommodated in the substrate accommodating portion 14 in a state where the outer periphery of the substrate 12 is fitted in the recess or the opening 14a and the substrate 12 is positioned. Then, by closing the lid 16, the substrate 12 is held and fixed in the pallet 10. By mounting the pallet 10 holding the substrate 12 on the substrate processing apparatus, the substrate 12 can be cut by a cutter of the substrate processing apparatus.

  Here, the board | substrate 12 with which the pallet 10 is mounted | worn is demonstrated. The substrate 12 is a so-called multi-piece substrate material, which is a large substrate material on which a plurality of circuit boards are formed. FIG. 2 is a plan view of the substrate 12. FIG. 2 shows a state where electronic components are mounted on the substrate 12. Three circuit boards 12 </ b> A are formed in the board 12. Each circuit board 12A is defined by an elongated opening groove 12B. However, if the opening groove 12B is formed along the entire outer periphery of the circuit board 12A, the circuit board 12A is separated from the multi-piece substrate material (substrate 12). . For this reason, the opening groove 12B is interrupted along the outer periphery of each circuit board 12A, and the interrupted portion serves as a connection portion 12C. Because of the connection portion 12C, the circuit board 12A is connected and integrated to form a multi-piece substrate material (substrate 12).

  By mounting the components on each circuit board 12A in the state of the multi-piece substrate material (substrate 12), the components can be mounted collectively on the plurality of circuit boards 12A, and the component mounting process is efficiently performed. Can be done. Thus, since components are mounted on each circuit board 12A in the state of the multi-piece substrate material (board 12), it is necessary to cut the connection portion 12C in order to separate and individualize each circuit board 12A. . In this cutting operation, the pallet 10 is used to fix the substrate 12 to the substrate processing apparatus.

  In general, a rotary cutting tool is used for the cutting operation. The rotary cutting tool is an elongated cylindrical blade, and a spiral groove is formed on the outer periphery of the cylinder to form a blade portion. That is, the rotating portion is inserted into the opening groove 12B of the substrate 12 while rotating the rotating cutting tool, and the connecting portion 12c is cut by pressing the outer peripheral surface of the rotating cutting tool against the connecting portion 12C. Therefore, the width of the opening groove 12B is set larger than the outer diameter of the rotary cutting tool so that the rotary cutting tool can be inserted.

  In FIG. 2, a portion of the connecting portion 12 </ b> C that is cut and cut is indicated by a thick solid line or a thick dotted line with circles at both ends. The portion indicated by the thick dotted line is a shaded portion of the mounted component 13, and the component 13 protrudes from the opening groove 12 </ b> B and the connecting portion 12 </ b> C, and therefore rotates from the component mounting surface side of the substrate 12. The cutting tool cannot be inserted into the opening groove 12B. Therefore, the board 12 on which such a component 13 is mounted must cut the connecting portion 12C by inserting a rotary cutting tool into the opening groove 12B from the back side opposite to the component mounting surface.

  Therefore, as shown in FIG. 3, the substrate 12 is accommodated in the opening 14 a of the substrate accommodating portion 14 with its back surface facing upward, and the lid portion 16 is closed and held in the holder 10 and fixed. Is done.

  A through groove 16 a is formed in the lid portion 16 at a position corresponding to each connection portion 12 </ b> C of the substrate 12. The through groove 16a penetrates the lid portion 16, and its width is larger than the outer shape of the rotary cutting tool used for cutting the connection portion 12C. Moreover, the length of the through groove 16a is set longer than the connecting portion 12C. Therefore, in a state where the substrate 12 is accommodated in the pallet 10 (in a state where the lid portion 16 is closed), the connection portion 12C of the substrate 12 is positioned immediately below the through groove 16a of the lid portion 16, and the rotary groove 16a is rotationally cut. The connecting portion 12C can be cut by inserting a tool.

  A lid suction passage 17 that opens to the inner wall of the through groove 16a is formed inside the lid portion 16 of the pallet 10, and the chips discharged from the rotary cutting tool are sucked through the lid suction passage. Can be removed. The internal structure of the lid 16 and the suction structure for the chips will be described later.

  Here, a substrate processing apparatus for processing the substrate 12 held on the pallet 10 will be described.

  FIG. 4 is a perspective view of the substrate processing apparatus 20. The substrate processing apparatus 20 is a processing apparatus for cutting and cutting the connection portion 12C of the substrate 12 with a rotary cutting tool. The substrate processing apparatus 20 includes a table 22 that is a mounting table for fixing the pallet, and a tool driving device 24 disposed on the table 22. The pallet 10 is fixed to the mounting surface 22 a of the table 22.

  The tool driving device 24 includes a tool head 26 that rotationally drives the rotary cutting tool. The tool head 26 can be moved in the vertical direction (Z direction) by a vertical movement mechanism 28. Further, the tool head 26 and the vertical movement mechanism 28 can be moved in the horizontal direction (X, Y direction) by the horizontal movement mechanism 30. By driving the vertical movement mechanism 28 and the horizontal movement mechanism 30, the rotary cutting tool attached to the tool head 26 can be arbitrarily moved in the X, Y, and Z directions.

  A dust collector 32 and a duct 34 serving as a dust collector suction passage are provided below the placement surface 22 a of the table 22. The dust collector 32 has a built-in suction pump or suction blower, and sucks air in the duct 34. Thereby, as will be described later, chips discharged from the rotary cutting tool can be sucked and collected through the duct 34.

  One end of the duct 34 is connected to the dust collector 32, and the other end is connected to a suction part 36 fixed to the lower side of the mounting surface 22 a of the table 22. The suction portion 36 is disposed directly below the placement surface 22a on which the pallet 10 is placed and fixed, and forms a suction space.

  On the placement surface 22 a of the table 22, a pallet support portion 38 is attached above the suction portion 36. The pallet support portion 38 includes four support columns 40 for fixing the pallet 10 and a base 42 that supports the support columns 40. The base 42 is attached to the placement surface 22a so as to cover the opening 22b of the placement surface 22a. Therefore, the bottom surface of the base 42 faces the space formed by the suction part 36. FIG. 4 shows a state where the pallet 10 is supported by the pallet support portion 38.

  FIG. 5 is a cross-sectional view of the pallet 10 supported by the pallet support portion 38. A substrate 12 is accommodated and held in the pallet 10. A lid suction passage 16 b is formed inside the lid 16 of the pallet 10. The lid suction passage 16 b opens on the inner surface of the through groove 16 a of the lid 16, extends inside the lid 16, and opens on the back surface 16 c of the lid 16. The substrate housing portion 14 is formed with a substrate housing portion suction passage 14b penetrating between the upper surface and the bottom surface, and the lid portion suction passage 16b is closed to the substrate housing portion suction passage 14b when the lid portion 16 is closed. Connected to.

  The portion where the lid suction passage 16b is opened in the inner surface of the through groove 16a is in the vicinity of the position where chips are discharged when the connecting portion 12C of the substrate 12 is cut by the rotary cutting tool 50. Accordingly, the lid suction passage 16b can be sucked through the substrate housing portion suction passage 14b from the portion opened in the bottom surface of the substrate housing portion 14, and the chips discharged from the rotary cutting tool 50 can be sucked immediately. it can.

  Here, in a state where the pallet 10 is supported by the support column 40 of the pallet support portion 38, the substrate storage portion suction passage 14 b opened in the bottom surface of the substrate storage portion 14 of the pallet 14 is a support portion suction passage extending through the support column 40. 38a. The support portion suction passage 38 a also extends through the base 42 to which the support column 40 is attached, and opens to a space formed by the suction portion 36. Since the suction part 36 is connected to the dust collector 32 via the duct 34 which is a dust collector suction passage, the suction by the dust collector 32 allows the duct 34, the suction part 36, the support part suction passage 38a, and the substrate storage part suction passage. The lid suction passage 16b can be sucked through 14b. That is, by driving the dust collector 32 to perform suction, the chips discharged into the through groove 16 a of the lid portion 16 can be immediately sucked and collected in the dust collector 32.

  Note that the upper end of the support column 40 is fitted into a recess formed in the bottom surface of the substrate accommodating portion 14 of the pallet 10, and the pallet 10 is placed on the table 22 with the pallet 10 placed on the pallet support portion 38. Will be positioned.

  As described above, by holding the substrate 12 using the pallet 10 according to the present embodiment, attaching the pallet 10 to the substrate processing apparatus 20 and processing the substrate 12, the chips discharged from the rotary cutting tool 50 are It can be removed by suction from the lid suction passage 16b on the upper side of the substrate 12. Therefore, there is no need to arrange a suction nozzle around the rotary cutting tool 50. Further, even if the rotary cutting tool 50 is moved up and down to move the cutting portion, the height of the portion for sucking chips (that is, the position of the lid suction passage 14b opened on the inner surface of the through groove 16a) changes. The chips can be sucked in the vicinity of the portion where the chips are always discharged. For this reason, it is not necessary to provide the suction nozzle and a moving mechanism for moving the suction nozzle up and down, and the structure and control of the substrate processing apparatus can be simplified.

  In the present embodiment, the substrate 16 is accommodated in the support portion suction passage 38a of the two support columns 40 (the left support column 40 in FIG. 5) on the side where the lid portion 16 is rotatably supported with respect to the substrate storage portion 14. A part suction passage 14b and a lid part suction passage 16b are provided. For the remaining two struts 40 (right strut 40 in FIG. 5), only the substrate housing portion suction passage 14b is provided, and the lid portion suction passage 16b is connected to the substrate housing portion suction passage 14b. Absent. That is, the substrate housing portion suction passage 14 b is closed by the back surface 16 c of the lid portion 16.

  When suction is performed by the dust collector 32 in such a state, a suction force is applied to the back surface 16c of the lid portion 16 facing the substrate housing portion suction passage 14b, and the lid portion 16 is attracted to the substrate housing portion 14. A force for fixing the portion 16 with the portion 16 closed (that is, a force for fixing the substrate 12 in the substrate accommodating portion 14 with the lid portion 16) is applied. For this reason, it is not necessary to fix the cover part 16 by the magnet's attractive force or screwing, and the fixing mechanism of the cover part 16 is simplified. In the state where the pallet 10 is removed from the substrate processing apparatus 20, the suction force does not work, and the fixing of the lid portion 16 is automatically released, so that the labor of the operator can be reduced.

DESCRIPTION OF SYMBOLS 10 Palette 12 Board | substrate 12A Circuit board 12B Opening groove | channel 12C Connection part 14 Substrate accommodating part 14a Opening part 14b Substrate accommodating part suction passage 16 Lid part 16a Through groove 16b Lid part suction passage 16c Back surface 20 Substrate processing apparatus 22 Table 22a Mounting surface 24 Tool drive device 26 Tool head 28 Vertical movement mechanism 30 Horizontal movement mechanism 32 Dust collector 34 Duct 36 Suction part 38 Pallet support part 38a Support part suction passage 40 Support column 42 Base 50 Rotary cutting tool

Claims (10)

A substrate fixing jig for mounting a substrate on a substrate processing apparatus,
A board housing portion for housing the board with the component mounting surface of the board facing upward;
A lid that covers the substrate accommodated in the substrate accommodating portion;
An opening groove extending through the lid and into which a rotary cutting tool for cutting the substrate can be inserted;
A substrate fixing jig having a lid suction passage that extends into the lid and opens to the inner surface of the opening groove. The substrate fixing jig according to claim 1,
The lid portion suction passage is fixed to the substrate connected to the substrate housing portion suction passage extending through the substrate housing portion with the lid portion attached to the substrate housing portion so as to cover the substrate. jig. The substrate fixing jig according to claim 2,
The substrate holding portion suction passage extends through the substrate holding portion and opens to the bottom surface of the substrate receiving portion. A substrate fixing jig according to any one of claims 1 to 3,
The lid portion is a substrate fixing jig that is rotatably supported with respect to the substrate housing portion. A substrate fixing jig according to any one of claims 1 to 4,
A lid adsorbing passage extending through from the top surface to the bottom surface of the substrate housing portion;
The lid adsorbing passage is opened to a position covered by the back surface of the lid portion on the upper surface of the substrate housing portion in a state where the lid portion is attached to the substrate housing portion so as to cover the substrate. . A substrate fixing jig according to any one of claims 2 to 4,
A mounting table to which the substrate fixing jig is attached;
A tool driving unit that drives the rotary cutting tool for cutting the substrate;
A dust collector suction passage connected to the substrate housing portion suction passage of the substrate fixing jig attached to the mounting table;
A substrate processing apparatus comprising: a dust collector that sucks chips discharged from the rotary cutting tool through the lid suction path, the substrate housing suction path, and the dust collector suction path. The substrate processing apparatus according to claim 6,
A substrate processing apparatus in which a column member to which the substrate fixing jig is attached is fixed to the mounting table. The substrate processing apparatus according to claim 7,
The substrate processing apparatus, wherein the substrate housing portion suction passage of the substrate fixing jig is connected to the dust collector suction passage through a support portion suction passage extending in a longitudinal direction of the support member. The substrate processing apparatus according to claim 6,
A lid portion adsorption passage extending through from the top surface to the bottom surface of the substrate housing portion;
The lid adsorbing passage is attached to the substrate housing portion so that the lid portion covers the substrate, and the substrate fixing treatment is opened at a position covered by the back surface of the lid portion on the upper surface of the substrate housing portion. Ingredients. The substrate processing apparatus according to claim 9, wherein
The column member to which the substrate fixing jig is attached is fixed to the mounting table,
The substrate processing apparatus, wherein the lid suction passage of the substrate fixing jig is connected to the dust collector suction passage through a support portion suction passage extending in a longitudinal direction of the support member.