JP2011035140A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
- Publication number
- JP2011035140A JP2011035140A JP2009179541A JP2009179541A JP2011035140A JP 2011035140 A JP2011035140 A JP 2011035140A JP 2009179541 A JP2009179541 A JP 2009179541A JP 2009179541 A JP2009179541 A JP 2009179541A JP 2011035140 A JP2011035140 A JP 2011035140A
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- semiconductor device
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- semiconductor substrate
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 70
- 229910052710 silicon Inorganic materials 0.000 abstract description 70
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- 229910052796 boron Inorganic materials 0.000 description 1
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- 230000035882 stress Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009179541A JP2011035140A (ja) | 2009-07-31 | 2009-07-31 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009179541A JP2011035140A (ja) | 2009-07-31 | 2009-07-31 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011035140A true JP2011035140A (ja) | 2011-02-17 |
| JP2011035140A5 JP2011035140A5 (enExample) | 2012-09-06 |
Family
ID=43763922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009179541A Pending JP2011035140A (ja) | 2009-07-31 | 2009-07-31 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011035140A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017349A (ja) * | 2012-07-09 | 2014-01-30 | Fujitsu Semiconductor Ltd | 半導体装置、基板の製造方法およびシステム |
| CN105140200A (zh) * | 2015-07-22 | 2015-12-09 | 华进半导体封装先导技术研发中心有限公司 | 晶圆级凸点封装结构的制作方法 |
| EP4283664A1 (en) * | 2022-05-24 | 2023-11-29 | MediaTek Inc. | Wafer level chip scale package with sidewall protection |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201641A (ja) * | 1993-12-29 | 1995-08-04 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法 |
| JP2002164240A (ja) * | 2000-11-27 | 2002-06-07 | Koa Corp | 積層チップ部品及びその製造方法 |
| JP2005268414A (ja) * | 2004-03-17 | 2005-09-29 | Mitsubishi Electric Corp | 多層セラミック基板およびその製造方法 |
| JP2009099838A (ja) * | 2007-10-18 | 2009-05-07 | Nec Electronics Corp | 半導体装置およびその製造方法 |
-
2009
- 2009-07-31 JP JP2009179541A patent/JP2011035140A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201641A (ja) * | 1993-12-29 | 1995-08-04 | Murata Mfg Co Ltd | 積層セラミック電子部品の製造方法 |
| JP2002164240A (ja) * | 2000-11-27 | 2002-06-07 | Koa Corp | 積層チップ部品及びその製造方法 |
| JP2005268414A (ja) * | 2004-03-17 | 2005-09-29 | Mitsubishi Electric Corp | 多層セラミック基板およびその製造方法 |
| JP2009099838A (ja) * | 2007-10-18 | 2009-05-07 | Nec Electronics Corp | 半導体装置およびその製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014017349A (ja) * | 2012-07-09 | 2014-01-30 | Fujitsu Semiconductor Ltd | 半導体装置、基板の製造方法およびシステム |
| CN105140200A (zh) * | 2015-07-22 | 2015-12-09 | 华进半导体封装先导技术研发中心有限公司 | 晶圆级凸点封装结构的制作方法 |
| EP4283664A1 (en) * | 2022-05-24 | 2023-11-29 | MediaTek Inc. | Wafer level chip scale package with sidewall protection |
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