JP2011035135A - Liquid processing apparatus, liquid processing method, program, and program storage medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid processing apparatus suppressing variation in temperature of a liquid used for processing an object to be processed. <P>SOLUTION: The liquid processing apparatus 10 has: a circulation line 20; a plurality of supply lines 30 branched from the circulation line; a plurality of processing units 50 provided so as to correspond to supply lines respectively; and a plurality of return lines 35 for returning a liquid flown from a circulation line to each of the supply lines to the circulation line. The processing unit is configured so as to process the object to be processed by using the temperature-controlled liquid discharged from each of the supply lines. The return lines are connected to the circulation line in a position downstream of a connection position between the lowermost downstream supply line in the plurality of supply lines. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a liquid processing apparatus and a liquid processing method for processing an object to be processed using a temperature-controlled liquid. The present invention also relates to a program for executing a liquid processing method for processing an object to be processed using a temperature-controlled liquid, and a recording medium on which the program is recorded.

  2. Description of the Related Art Conventionally, a technique for processing an object to be processed while supplying a temperature-controlled liquid to the object to be processed, such as an etching process for a semiconductor wafer (hereinafter simply referred to as a wafer) or a glass substrate for display, has been widely used ( For example, Patent Document 1). Generally, when the temperature of the liquid used for the treatment is high, the reaction by the liquid is activated and the treatment easily proceeds. Therefore, the advantage of shortening the processing time can be expected by heating the liquid used for the processing.

  Furthermore, the present inventor has also found an advantage of heating a drying liquid represented by IPA (isopropyl alcohol) and the like to dry the object to be processed such as a wafer. Specifically, when the drying liquid heated for the drying process of the object to be processed is used, the endothermic amount from the object to be processed during the evaporation of the drying liquid is reduced, and the temperature of the object to be processed is decreased during the drying process. Can be suppressed. Thereby, the dew condensation to a to-be-processed object is suppressed, and generation | occurrence | production of the watermark to a to-be-processed object can be prevented effectively.

  By the way, when the temperature of the liquid used for processing the object to be processed is adjusted, the progress of the process greatly changes depending on the temperature of the liquid as described above. Therefore, it is important to keep the temperature of the liquid used for the treatment constant in order to ensure the uniformity of the treatment between the objects to be treated.

JP2007-123393A

  In Patent Document 1, a tank storing a chemical liquid, a main pipe (chemical liquid processing supply pipe 163) connected to the tank at one end, and a large number of supply pipes (chemical liquid processing supply pipe 64 branched from the other end of the main pipe). , 83) and a number of processing units connected to a supply pipe. In this substrate processing apparatus, a temperature adjustment mechanism for adjusting the temperature of the chemical solution is provided on the main pipe, and a valve is provided for each supply pipe. Then, by opening and closing the valve, the temperature-adjusted chemical solution is supplied to each processing unit.

  In this conventional substrate processing apparatus, when the valve is closed, the temperature-controlled chemical solution does not flow in the supply pipe. For example, when the liquid is heated by adjusting the temperature, when the processing in the processing unit stops, that is, when the supply of the heated liquid to the processing unit stops, the temperature of the supply pipe decreases. For this reason, when the supply of the heated liquid to the processing unit is resumed, the heat of the heated liquid is absorbed by the supply pipe whose temperature has been lowered, and the temperature of the liquid used for the process is lowered. As the temperature of the liquid changes, the progress of the process on the object to be processed becomes unstable.

A liquid processing apparatus according to an aspect of the present invention is a liquid processing apparatus that processes an object to be processed using a heated liquid,
A circulation line having a liquid supply source for supplying a temperature-controlled liquid, and a circulation path through which the liquid from the liquid supply source can circulate;
A plurality of supply lines branched from the circulation path of the circulation line;
A plurality of processing units provided corresponding to each supply line, and configured to process the object to be processed using temperature-adjusted liquid discharged from each supply line Unit,
A plurality of return lines for returning the liquid flowing into the supply lines from the circulation line to the circulation line;
Each return line is connected to the circulation line at a position downstream of a connection position between the supply line on the most downstream side of the plurality of supply lines and the circulation line.

A liquid processing method according to one embodiment of the present invention is a method of processing an object to be processed using a heated liquid,
A step of filling the circulation line with a circulation path having a plurality of supply lines extending to separate processing units, and a liquid supply source for supplying a temperature-controlled liquid to the circulation path; When,
Allowing the temperature-adjusted liquid to flow from the circulation line to each of the supply lines in a state where the temperature-adjusted liquid is circulating in the circulation line, and
In each of the plurality of processing units, while the temperature-controlled liquid flows into the supply line,
The temperature-adjusted liquid flowing into the supply line from the circulation line is disposed downstream of the connection position between the most downstream supply line and the circulation line through the return line. Returning the temperature in the circulation line at a position so that the temperature-adjusted liquid circulates in a path including the supply line and the return line, and temperature-adjusts the supply line;
Thereafter, the temperature-controlled liquid flowing from the circulation line to the supply line is discharged from the discharge opening of the supply line, and the object to be processed is processed.

  A program according to one embodiment of the present invention is a program executed by a control device that controls a liquid processing apparatus that processes an object to be processed using heated liquid, and is executed by the control device. The liquid processing method according to the embodiment of the present invention is performed by a liquid processing apparatus.

  A recording medium according to an aspect of the present invention is a recording medium on which a program executed by a control device that controls a liquid processing apparatus that processes a target object using heated liquid is recorded, and the program is By being executed by the control device, the liquid processing method according to the above-described aspect of the present invention is caused to be performed by the liquid processing device.

  According to this invention, the return line which returns the liquid which flowed into the supply line from the circulation line to the circulation line is provided. For this reason, the temperature of the supply line can be adjusted even when the object is not being processed by circulating the temperature-controlled liquid in the circulation path including the supply line and the return line. Can do. In particular, the return line is connected to the circulation line at a position downstream of the connection position between the supply line and the circulation line on the most downstream side of the plurality of supply lines. Therefore, the liquid used to adjust the temperature of one supply line and returned to the circulation line via the return line corresponding to the supply line is effectively suppressed from affecting the temperature adjustment of the other supply line. can do. From the above, according to the present invention, it is possible to suppress the temperature fluctuation of the liquid used for processing to the object to be processed, and thereby to stably process the object to be processed.

FIG. 1 is a diagram schematically showing an overall configuration of a liquid processing apparatus according to an embodiment of the present invention. FIG. 2 is a diagram showing piping in the vicinity of the processing unit of the liquid processing apparatus of FIG. FIG. 3 is a longitudinal sectional view showing a processing unit of the liquid processing apparatus of FIG. FIG. 4 is a view showing the support member of the processing unit of FIG. 1 from above. FIG. 5 is a flowchart for explaining an example of a liquid processing method that can be performed using the liquid processing apparatus of FIG. 1. FIG. 6 is a flowchart for explaining the operation of the liquid processing apparatus of FIG. 1 when liquid processing is performed on an object to be processed. FIG. 7 is a view corresponding to FIG. 2 and showing a modification of the liquid processing apparatus. FIG. 8 is a view corresponding to FIG. 2 and showing another modified example of the liquid processing apparatus.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  1 to 6 are diagrams for explaining an embodiment of the present invention, and FIGS. 7 and 8 are for explaining a modification to the embodiment shown in FIGS. FIG. Among these, FIG. 1 is a diagram schematically showing the overall configuration of the liquid processing apparatus. FIG. 2 is an enlarged view showing a region surrounded by a dotted line in FIG. 3 and 4 are a longitudinal sectional view and a top view, respectively, showing one of the processing units incorporated in the liquid processing apparatus.

  In the following embodiment, an example in which the present invention is applied to a cleaning process of a semiconductor wafer (an example of an object to be processed) is shown. Then, as a cleaning process, a process using a chemical solution, a process using pure water, and a process using a drying solution are performed on a disk-shaped wafer that is an object to be processed. Among these, the drying liquid is heated and used so as to have a higher temperature than the chemical liquid and pure water. However, of course, the present invention is not limited to application to wafer cleaning.

  As shown in FIGS. 1 to 4, the liquid processing apparatus 10 includes a first liquid supply mechanism 15 that supplies a first liquid, a second liquid supply mechanism 40 that supplies a second liquid, and one end thereof. The first supply line 30 connected to the first liquid supply mechanism 15, the second supply line 45 whose one end is connected to the second liquid supply mechanism 40, the first liquid and the second liquid And a processing unit 50 configured to process the wafer W using the liquid. Further, the liquid processing apparatus 10 includes a return line 35 that is connected to the circulation line 20 at one end and returns the first liquid supplied to the first supply line 30 to the first liquid supply mechanism 15. . Furthermore, the liquid processing apparatus 10 also includes a control device 12 that controls the operation of each component of the liquid processing apparatus 10 and the flow path of the liquid. In the illustrated example, the liquid processing apparatus 10 includes a large number (for example, eight) of processing units 50, and the first supply line 30 and the second supply line 45 extend into each processing unit 50.

  First, a supply system for supplying the first liquid to the processing unit 50 will be described. In the following example, a drying liquid, more specifically, IPA (isopropyl alcohol) is supplied as the first liquid.

  As shown in FIG. 1, the first liquid supply mechanism 15 includes a circulation line 20 formed in an annular shape and a delivery mechanism (for example, a pump) 26 provided on the circulation line 20. Among these, the circulation line 20 includes a first liquid supply source 22 that supplies the temperature-adjusted first liquid, and a circulation path 24 through which the temperature-adjusted first liquid supplied from the first liquid supply source 22 can circulate. ,have.

  The first liquid supply source 22 includes a storage device 22a that can store the first liquid, for example, a tank, and a replenishment mechanism (not shown) that supplies the temperature-controlled first liquid to the storage device 22a. Have. The circulation path 24 is configured by connecting both ends of the pipeline to the storage device 22a so that the first liquid supplied from the first liquid supply source 22 can circulate.

  The first liquid supply mechanism 15 supplies the first liquid to each of the multiple processing units 50 via the first supply line 30. Then, the supply mechanism of the first liquid supply source 22 supplies the first liquid to the circulation line 20 as the first liquid is consumed from the circulation line 20 of the first liquid supply mechanism 15. As an example, the replenishment mechanism may be configured to automatically replenish the first liquid into the storage device 22 according to the amount of liquid in the storage device 22a.

  In the illustrated example, the first liquid supply source 22 further includes a temperature adjustment mechanism 22b that adjusts the temperature of the first liquid in the storage device 22a. That is, the first liquid supply source 22 not only replenishes the temperature-adjusted first liquid to the circulation line 20, but also adjusts the temperature of the first liquid circulating in the circulation path 24 as necessary, and then again the circulation path 24 It is comprised so that it may supply. As described above, in the present embodiment, the temperature adjustment mechanism 22b is configured as a heating mechanism, and heats the first liquid as temperature adjustment of the first liquid. Therefore, in the present embodiment described below, the temperature adjustment mechanism 22b is also referred to as a heating mechanism 22b.

  The delivery mechanism 26 is composed of a pump, for example, and is attached on the circulation path 24. The delivery mechanism 26 drives the first liquid so that the heated first liquid supplied from the first liquid supply source 22 to the circulation path 24 circulates in the circulation path 24. Accordingly, the first liquid delivered by the delivery mechanism 26 can circulate in the circulation line 20 and return to the delivery mechanism 26 again.

  Next, the first supply line 30 and the return line 35 will be described. As shown in FIG. 1, a large number of first supply lines 30 branch off from the circulation line 20 and extend to the corresponding processing units 50. A plurality of return lines 35 are provided corresponding to the first supply lines 30. Each return line 35 is configured to return the first liquid flowing from the circulation line 20 to the corresponding first supply line 30 to the circulation line 20.

  As shown in FIGS. 2 and 3, the first supply line 30 has a discharge opening 30 a for discharging the first liquid. The discharge opening 30a is configured as a nozzle supported by the arm 62 of the processing unit 50. As will be described later, the heated first liquid is discharged from the discharge opening 30a toward the wafer W that is the object to be processed. obtain.

  As shown in FIG. 2, the first supply line 30 is divided into a plurality of pipelines and extends in at least one section upstream of the connection position with the return line 35. The control device 12 is configured to control the amount of the first liquid flowing into the first supply line 30 from the circulation line 20 by operating the opening and closing of the plurality of pipelines.

  In the example shown in FIG. 2, the first supply line 30 is divided into two pipes, a first pipe 31 a and a second pipe 31 b extending in parallel with the first pipe 31 a. The first conduit 31a is provided with a flow rate adjustment valve (for example, a needle valve) 32 that can manually adjust the opening degree in advance. Further, the opening degree is manually set at a position on the first supply line 30 that is outside the section divided into the plurality of pipelines 31 a and 31 b and upstream of the connection position with the return line 35. A flow control valve 37 that can be adjusted in advance is provided. Further, as shown in FIG. 2, a flow meter 36 for measuring the amount of the first liquid flowing in the first supply line 30 is provided on the first supply line 30 in the vicinity of the flow rate control valve 37. .

  On the other hand, the second pipe 31b is provided with an on-off valve 33 that can be opened and closed by fluid pressure driving. The on-off valve 33 is composed of, for example, an air operated valve whose opening / closing operation is driven by air pressure. The opening / closing operation of the opening / closing valve 33 is controlled by the control device 12.

  According to such a configuration, the first liquid can flow through the first supply line 30 at two different flow rates only by opening and closing the on-off valve 33. Specifically, the maximum flow rate of the first pipeline 31a is set to A (l / min) by the flow rate control valve 32, and the maximum flow rate of the first supply line 30 is set to B (l / min) by the flow rate control valve 37. Suppose that it is set. In addition, it is assumed that the second pipe line 31b is designed so that the liquid can flow at a flow rate of (BA) (l / min) or more. In this example, the first liquid of B (l / min) can flow through the first supply line 30 while the on-off valve 33 is open. Further, while the on-off valve 33 is closed, the first liquid can flow through the first supply line 30 at a flow rate of A (l / min).

  On the other hand, as shown in FIGS. 2 and 3, the upstream end of each return line 35 is connected to the corresponding supply line 30 via the flow path control mechanism 38. That is, each return line 35 corresponds to the corresponding supply line 30 at a position between the end of the corresponding supply line 30 on the side connected to the circulation line 20 and the discharge opening 30a of the corresponding supply line 30. Connected to. The control device 12 controls the flow path control mechanism 38 (more specifically, a liquid supply switching valve 38a of the flow path control mechanism 38, which will be described later), whereby the first liquid is discharged from the discharge opening 30a of the first supply line 30. It is configured to control whether or not to discharge.

  In the illustrated example, the flow path control mechanism 38 is in a state where the liquid that has flowed from the circulation line 20 into the first supply line 30 further flows through the first supply line 30 toward the discharge opening 30a and toward the discharge opening 30a. One of the states toward the return line 35 without being selectively maintained. As a specific example of such a channel control mechanism, the illustrated channel control mechanism 38 includes a three-way valve 38 a provided on the first supply line 30 and connected to one end of the return line 35, and the return line 35. And an on-off valve 38b. Both the three-way valve 38a and the on-off valve 38b are configured as air-operated valves driven to open and close by air pressure, for example, as valves that can be opened and closed by fluid pressure driving.

  The three-way valve 38a is in a state where the first supply line 30 and the return line 35 on the upstream side (the circulation line 20 side) communicate with each other, and the upstream first supply line 30, the return line 35, and the downstream side The first supply line 30 (on the processing unit 50 side) is maintained in one of the states in which the first supply line 30 is communicated. In other words, in the illustrated example, the three-way valve 38a functions as a liquid supply switching valve that switches supply and stop of supply of liquid used for processing the object to be processed in the processing unit. Therefore, the three-way valve 38a constituting the flow path control mechanism 38 is also referred to as a liquid supply switching valve 38a.

  The control device 12 controls the switching operation of the two states of the liquid supply switching valve (three-way valve) 38a and the opening / closing operation of the on-off valve 38b. Specifically, the operations of the liquid supply switching valve 38a and the on-off valve 38b are controlled as follows. When the flow control mechanism 38 is maintained in a state in which the liquid flowing from the circulation line 20 into the first supply line 30 further flows through the first supply line 30 toward the discharge opening 30a, the liquid supply switching valve 38a is three-way. Is kept open and the on-off valve 38b is kept closed. That is, the liquid supply switching valve 38a is held in an open state on three sides, whereby the first supply line 30 on the upstream side of the liquid supply switching valve 38a and the first supply line on the downstream side of the liquid supply switching valve 38a. 30 is secured, and the first liquid used for processing the workpiece W can be supplied to the processing unit 50.

  The on-off valve 38b is preferably disposed in the vicinity of the liquid supply switching valve 38a. The liquid supply switching valve 38a is held in the three-way open state, and the first liquid does not stagnate between the three-way valve 38a and the on-off valve 38b when the on-off valve 38b is closed. It is.

  On the other hand, when the flow control mechanism 38 is maintained in a state where the liquid flowing into the first supply line 30 from the circulation line 20 is directed to the return line 35, the liquid supply switching valve 38a is in a state where only two sides are opened. While being held, the on-off valve 38b is held open. That is, the liquid supply switching valve 38a is maintained in a state in which the first supply line 30 upstream of the liquid supply switching valve 38a is connected only to the return line 35, whereby the liquid supply switching valve 38a is located upstream of the liquid supply switching valve 38a. The flow path connecting the first supply line 30 and the first supply line 30 on the downstream side of the liquid supply switching valve 38a is closed, and the first liquid used for processing the workpiece W can be supplied to the processing unit 50. No state.

  Further, in the example shown in FIG. 1, the plurality of return lines 35 merge together and are connected to the circulation line 20 of the first liquid supply mechanism 15. More specifically, the end of the return line 35 is connected to the circulation path 24 of the circulation line 20. As described above, when the plurality of return lines 35 merge with each other and are connected to the circulation line 20, it is possible to effectively save the space required for installing the plurality of return lines 35. . However, the present invention is not limited to such an example, and a plurality of return lines 35 may be separately connected to the first liquid supply mechanism 15. The storage device 22 may be connected to the first liquid supply mechanism 15 to return the first liquid to the storage device 22.

  As shown in FIG. 1, the connection position between the return line 35 and the circulation line 20 is the first supply line 30 on the most downstream side of the circulation line 20 among the plurality of first supply lines 30, the circulation line 20, and It is located downstream from the connection position. A first relief valve 39a is provided on the circulation line 20 between the connection position of the return line 35 and the circulation line 20 and the connection position of the circulation line 20 and the first supply line 30 on the most downstream side. Yes. A second relief valve 39 b is provided on the return line 35, preferably on the return line 35 in the vicinity of the connection position with the circulation line 20. The set pressure of the first relief valve 39a is higher than the set pressure of the second relief valve 39b. That is, the pressure of the first liquid in the return line 35 is set to be lower than the pressure of the first liquid in the circulation line 20 in the region connected to the first supply line 30.

  The upstream side and the downstream side in the circulation line 20 are determined on the basis of the liquid flow of the heated first liquid in the circulation line 20. That is, based on the liquid flow in the circulation line 20 of the first liquid supplied from the first liquid supply source 22 to the circulation path 24, the connection position between the storage device 22 and the pipe line forming the circulation path 24 is circulated. It becomes the most upstream side in the line 20, and the direction along the liquid flow of the first liquid from the connection position (the most upstream side position) is the direction toward the downstream.

  Next, a supply system for supplying the second liquid to the processing unit 50 will be described. As described above, the second liquid is supplied from the second liquid supply mechanism 40. A second supply line 45 is provided between the second liquid supply mechanism 40 and each processing unit 50. As shown in FIGS. 3 and 4, the second supply line 45 has a discharge opening 45 a for discharging the second liquid. The discharge opening 45 a is configured as a nozzle supported by the arm 62 of the processing unit 50.

  In the present embodiment configured as a cleaning apparatus for the wafer W, the second liquid supply mechanism 40 is, for example, a chemical liquid (dilute hydrofluoric acid, ammonia perwater (SC1), hydrochloric acid perwater ( SC2)), and water used for rinsing the wafer W, particularly pure water (DIW), can be supplied as the second liquid.

  As the supply system for supplying the second liquid to the processing unit 50, a known supply system can be used, and detailed description thereof is omitted here.

  Next, the processing unit 50 that processes the wafer W using the first liquid and the second liquid will be described. As shown in FIGS. 3 and 4, each processing unit 50 includes a holding mechanism 52 that holds the wafer W, and a support member that supports the discharge opening 30 a of the first supply line 30 and the discharge opening 45 a of the second supply line 45. 60, and a partition wall 54 that defines a processing chamber for performing processing on an object to be processed.

  As shown in FIG. 3, the holding mechanism 52 holds the wafer W so that the surface of the wafer W is substantially in the horizontal direction, and holds the wafer W held around the center of the disk-shaped wafer W as an axis. It is configured so that it can be rotated.

  As shown in FIGS. 3 and 4, the support member 60 has a processing position where the supported discharge openings 30 a and 45 a can supply liquid to the wafer W held by the holding mechanism 52 (position indicated by a solid line in FIG. 4). And a non-processing position shifted from the processing position (a position indicated by a two-dot chain line in FIG. 4).

  In the illustrated example, the support member 60 includes a rotatable cylindrical shaft member 64 and an arm 62 that is connected to the cylindrical shaft member 64 and can swing as the cylindrical shaft member 64 rotates. Have. The discharge opening 30 a of the first supply line 30 and the discharge opening 45 a of the second supply line 45 are supported by one end region (tip region) 62 a of the arm 62. The arm 62 is connected to one end of a cylindrical shaft member 64 extending through the partition wall 54 in the other end region (base end region) 62b. The cylindrical shaft member 64 is formed in a cylindrical shape, and is held rotatably about its central axis. According to such a configuration, as shown in FIG. 4, the discharge openings 30 a and 45 a supported by the support member 60 can be disposed at positions facing the center of the wafer W from above as processing positions. Further, the discharge openings 30a and 45a can be arranged at positions shifted laterally from the upper region of the wafer W as non-processing positions.

  The discharge openings 30a and 45a of the supply lines 30 and 45 are supported by the tip end region 62a of the arm 62 that is arranged above the wafer W during processing. Therefore, as shown in FIGS. 3 and 4, at least a part of the supply lines 30 and 45 near the discharge openings 30 a and 45 a extends through the support member 60. In the present embodiment, the first supply line 30 and the second supply line 45 extend along the arm 62 substantially in parallel. However, as shown in FIG. 3, the first supply line 30 extends on one side of the arm 62, and the second supply line 45 extends on the other side of the arm 62. That is, the arm 62 of the support member 60 is configured as a partition member 63 extending between the first supply line 30 and the second supply line 45, and partitions the path of the first supply line 30 and the passage path of the second supply line 45. ing. Specifically, the first supply line 30 extends above the partition member 63 while being supported by the partition member 63, and the second supply line 45 extends below the partition member 63 while being supported by the partition member 63.

  Further, as shown in FIGS. 3 and 4, a part of the support member 60 is configured as a cylindrical portion 66 formed in a cylindrical shape. Then, one of the first supply line 30 and the second supply line 45 passes through the inside of the tubular portion 66 of the support member 60 and extends to the corresponding liquid supply mechanisms 15 and 40, and the first supply line 30 and the second supply line 45. The other of the supply lines 45 extends to the corresponding liquid supply mechanisms 15 and 40 through the outside of the cylindrical portion 66 of the support member 60.

  Specifically, the cylindrical shaft member 64 of the support member 60 is formed as a portion of the cylindrical portion 66. In addition, a base end region 62 b of the arm 62 connected to the cylindrical shaft member 64, that is, a part of the partition member 63 is formed as a portion of the cylindrical portion 66. The second supply line 45 passes through the cylindrical portion 66. Specifically, as shown in FIG. 3, the second supply line 45 has a cylindrical portion formed on the arm 62 from the distal end region 62 a to the proximal end region 62 b of the arm 62 where the discharge opening 45 a is supported. 66 extends through the interior of 66. And as shown in FIG. 3, the inside of the cylindrical part 66 which consists of a part of arm 62, and the inside of the cylindrical part 66 which consists of the cylindrical shaft member 64 are connected, The 2nd supply line 45 is The tube extends from the inside of the cylindrical portion 66 formed of a part of the arm 62 to the inside of the cylindrical portion 66 formed of the cylindrical shaft member 64. Thereafter, as shown in FIG. 3, the second supply line 45 passes through the inside of the cylindrical portion 66 formed of the cylindrical shaft member 64 and crosses the partition wall 54 of the processing unit 50.

  On the other hand, as shown in FIGS. 3 and 4, the first supply line 30 extends from the distal end region 62 a of the arm 62 to the proximal end region 62 b through the outside of the cylindrical portion 66 formed of a part of the arm 62. ing. The first supply line 30 is separated from the support member 60 in the proximal end region 62 b of the arm 62 and penetrates the partition wall 54. In addition, the part which is not comprised as the cylindrical part 66 of the arm 62 (partition member 63) is formed in plate shape. As described above, even in the region where the arm 62 (partition member 63) is formed in a plate shape, the first supply line 30 and the second supply line 45 sandwich the arm 62 (partition member 63) therebetween, They are spaced apart.

  The control device 12 includes an input including a keyboard on which a process manager or the like performs command input operations to manage the liquid processing apparatus 10, a display that visualizes and displays the operating status of the liquid processing apparatus 10, and the like. An output device is connected. Further, the control device 12 can access a recording medium 13 on which a program for realizing the processing executed by the liquid processing device 10 is recorded. The recording medium 13 can be configured by a known program recording medium such as a memory such as a ROM and a RAM, a disk-shaped recording medium such as a hard disk, a CD-ROM, a DVD-ROM, and a flexible disk.

  Next, an example of a liquid processing method that can be executed using the liquid processing apparatus 10 configured as described above will be described. In the liquid processing method described below, as shown in FIG. 5, the wafer W as the object to be processed is subjected to a cleaning process in one processing unit 50. In the processing step S3 using the first liquid in the series of liquid processing methods shown in FIG. 5, the wafer W is heated and supplied from the first liquid supply mechanism 15 of the liquid processing apparatus 10 described above. One liquid is used for processing. In the following, first, an outline of the liquid processing method performed on the wafer W in one processing unit 50 will be described with reference to the flowchart shown in FIG. 5, and then the processing using the first liquid is performed. Operation | movement of the liquid processing apparatus 10 relevant to performing process S3 is demonstrated.

  The operation of each component for executing the liquid processing method described below is controlled by a control signal from the control device 12 according to a program stored in the program recording medium 13 in advance.

  As shown in FIG. 5, first, the wafer W to be cleaned is brought into each processing unit 50 of the liquid processing apparatus 10 and held by the holding mechanism 52 in each processing unit 50 (step S1). .

  Next, step S2 of processing the wafer W is performed using the second liquid. As a specific example of the processing using the second liquid, the following processing is performed. First, dilute hydrofluoric acid (DHF) is supplied from the second liquid supply mechanism 40 as the second liquid, and the wafer W is etched. Next, pure water (DIW) is supplied from the second liquid supply mechanism 40 as the second liquid, and the wafer W is rinsed. In this way, the wafer W is processed using the two types of second liquid. In this example, the second liquid supplied from the second liquid supply mechanism 45 is used for processing the wafer W in the processing unit 50 without being heated.

  Thereafter, step S3 of processing the wafer W is performed using the heated first liquid (step S3). As a specific example of the processing using the third liquid, IPA heated to about 45 to 60 ° C. is supplied to the wafer W that has been subjected to etching processing using dilute hydrofluoric acid (DHF) and rinsing processing using pure water. Thereby, the pure water remaining on the wafer W is replaced by the IPA, and the IPA evaporates from the wafer W. That is, the wafer W is dried using the heated IPA. By heating and using the IPA, the amount of heat absorbed from the wafer W when the IPA evaporates from the wafer W can be reduced. Therefore, it is possible to suppress a decrease in the temperature of the wafer W and to prevent condensation on the wafer W that causes a watermark.

  As described above, the cleaning process of the wafer W in one processing unit 50 is completed, and the processed wafer W is unloaded from the processing unit 50 (step S4).

  Next, the operation of the liquid processing apparatus 10 related to the process S3 for processing the wafer W using the heated first liquid will be described.

  First, as shown in FIG. 6, prior to the above-described step S3 of processing the wafer W in the processing unit using the heated first liquid, the step Sp1 for preparing the first liquid and the heated first liquid Two preparatory steps Sp2 are performed, which are preheated using

  As will be apparent from the following description, the two processes of the process Sp1 for preparing the first liquid and the process Sp2 for preheating using the heated first liquid are the wafer W using the second liquid described above. This does not affect the processing step S2 or the wafer W loading step S1. On the other hand, the two preparation steps Sp1 and Sp2 must be completed before the step S3 of processing the wafer W using the first liquid in the processing unit 50. Therefore, the two processes, the process Sp1 for preparing the first liquid and the process Sp2 for preheating using the heated first liquid, process the wafer W using the process S1 for loading the wafer W and the second liquid described above. The process S2 may be performed prior to the process S2 or may be performed in parallel with these processes S1 and S2.

  First, the process Sp1 for preparing the first liquid will be described. In this step Sp1, the first liquid is filled into the circulation line 20 in which a plurality of first supply lines 30 extending to the separate processing units 50 extend. Specifically, the first liquid is supplied into the storage device 22a from a supply mechanism (not shown) of the first liquid supply source 22. The first liquid supplied from the supply mechanism to the storage device 22a is preferably heated to a predetermined temperature in advance. Further, the heating mechanism 22b heats the first liquid supplied into the storage device 22a. In this way, the heated first liquid is filled in the storage device 22 and the circulation path 24 of the circulation line 20. Furthermore, in this example, after the first liquid is filled or in parallel with the filling of the first liquid, the delivery mechanism 26 is operated, and the first liquid is circulated in the circulation line 20.

  In the subsequent processes, the heated first liquid is circulated in the circulation line 20 of the first liquid supply mechanism 15 by driving the delivery mechanism 26, and the circulation line 20 of the first liquid supply mechanism 15. The heated first liquid flows into each of the plurality of first supply lines 30. Then, the first liquid is discharged from the discharge opening 30a of the first supply line 30 and consumed. During this time, a replenishment mechanism (not shown) of the first liquid supply source 22 incorporated in the first liquid supply mechanism 15 replenishes the first liquid to the circulation line 20, and the heating mechanism 22 b heats the first liquid in the circulation line 20. Then, the temperature of the first liquid is continuously adjusted so as to be within a desired temperature range.

  Next, the supply system to the processing unit 50 of the 1st liquid is heated using the heated 1st liquid (process Sp2). Specifically, the first liquid is poured from the circulation line 20 into the first supply line 30 while the heated first liquid is circulating in the circulation line 20 of the first liquid supply mechanism 15. The heated first liquid preheats the flow path of the first liquid until it reaches the same temperature as the temperature of the first liquid.

  As described above, the liquid processing apparatus 10 includes the return line 35 that returns the first liquid flowing into the first supply line 30 to the circulation line 20. Then, the flow path control mechanism 38 provided between the first supply line 30 and the return line 35 during the process Sp2 and the immediately preceding process Sp1 described above sets the upstream side of the first supply line 30 to the return line 35. Communicating with Further, the pressure of the first liquid in the return line 35 is adjusted to be lower than the pressure in the circulation line 20 by the first relief valve 39a and the second relief valve 39b. As a result, the first liquid flowing into the first supply line 30 from the circulation line 20 is returned again to the circulation line 20 via the return line 35. That is, separately from the circulation path of the first liquid constituted by the circulation line 20, a part of the circulation line 20, a part of the first supply line 30 and the return line 35 are included for heating (in the present embodiment). , For preheating) is formed, and the heated first liquid circulates stably through the second circulation path.

  When the heated first liquid circulates in the preheating circulation path, the portion of the supply system to the first liquid processing unit 50 that constitutes the preheating circulation path is the temperature of the heated first liquid. It will be heated to the same temperature. That is, a part of the first supply line 30 and the return line 35 are heated to the same temperature as the temperature of the heated first liquid. Further, a liquid supply switching valve (three-way valve) 38a and an on-off valve 38b of the flow path control mechanism 38 are also provided on the preheating circulation path. That is, in this step Sp2, valves having a large heat capacity can be preheated.

  Further, during the preheating step Sp2, the on-off valve 33 provided in the second pipeline 31b of the first supply line 30 is open. Therefore, the first liquid flows through both the first pipe line 31a and the second pipe line 31b. The flow rate of the first liquid flowing into the first supply line 30 from the circulation line 20 is set by adjusting a manual flow rate adjustment valve 37 in advance, and is monitored by the flow meter 36.

  By the way, in this example, also in the filling step Sp1, the liquid supply switching valve (three-way valve) 38a returns the upstream side of the first supply line 30 to stop supplying the first liquid to the processing unit 50. It communicates with the line 35. Therefore, also in the filling step Sp1, a part of the first supply line 30 and the valves 38a and 38b are heated by the heated first liquid being filled. In this regard, the process Sp1 for preparing the first liquid and the process Sp2 for preheating the first supply line 30 using the first liquid may be performed in parallel.

  Subsequent to the preheating step Sp2, the valve 38a, 38b is switched to discharge the heated first liquid from the discharge opening 30a of the first supply line 30, and the above-described step S3 of processing the wafer W is performed. Specifically, the liquid supply switching valve 38 a of the flow path control mechanism 38 communicates the upstream side of the first supply line 30 with the downstream side of the first supply line 30 instead of the return line 35. At this time, the wafer W in the processing unit 50 is held by the holding mechanism 52 and is rotated by driving the holding mechanism 52. Then, the heated first liquid is discharged toward the wafer W from the discharge opening 30a supported by the support member 60 at the processing position facing the rotating wafer W.

  Note that while the first liquid is being discharged from the discharge opening 30a, the support member 60 is swung so that the discharge opening 30a scans from a position facing the center of the wafer W to a position facing the peripheral edge of the wafer W. It may be moved. Further, a discharge port for discharging an inert gas (for example, nitrogen) is provided in the vicinity of the discharge opening 30a, and the inert gas is discharged together with the discharge of the first liquid, and further the drying of the first liquid is promoted. You may make it do.

  As described above, the first supply line 30 and the liquid supply switching valve 38a are preheated to substantially the same temperature as the heated first liquid in the preheating step Sp2 performed in advance. As shown in FIG. 3, the return line 35 forming the preheating circulation path is connected to the first supply line 30 in the vicinity of the discharge opening 30a.

  Note that, during the processing step S3, the on-off valve 33 provided in the second pipeline 31b of the first supply line 30 is closed. Therefore, the first liquid flows through only the first pipeline 31a of the first pipeline 31a and the second pipeline 31b. The flow rate of the first liquid flowing into the first supply line 30 from the circulation line 20 is set by adjusting a manual flow rate adjustment valve 32 in advance, and is monitored by the flow meter 36.

  That is, when the processing of the wafer W is not performed in the processing unit 50, the first liquid constitutes a section of the first supply line 30 and includes two or more of a plurality of pipelines extending in parallel. It flows through the pipes 31a and 31b. On the other hand, when the processing of the wafer W is performed in the processing unit 50, the first liquid constitutes a section of the first supply line 30 and extends in parallel. It flows through only some of the pipes 31a included in the two or more pipes 31a and 31b. As a result, when the first supply line 30 is preheated, the amount of the first liquid flowing in each return line 35 per unit time corresponds to the first supply line when the wafer W is processed. The amount of the first liquid discharged from the 30 discharge openings 30a is larger than the amount per unit time.

  According to such a method, the wafer W can be processed with an appropriate amount of the first liquid. Further, at the time of preheating, the heated first liquid can be poured at a large flow rate into the preheating circulation path including the first supply line 30 and the return line 35. It is possible to heat in a short time to the same temperature as the temperature of the first liquid.

  In addition, the pipe line 31a through which the first liquid passes when the wafer W is processed using the first liquid is a pipe line that constitutes a preheating circulation path at the time of preheating. Is heated to the same temperature as the first liquid. Therefore, the temperature fluctuation of the first liquid during the processing of the wafer W using the first liquid can be suppressed, thereby effectively suppressing the variation in the level of processing of the wafer W. Can do.

  By the way, in each processing unit 50, a first supply line 30 through which the heated first liquid flows and a second supply line 45 having a temperature different from that of the first liquid extend. The first supply line 30 and the second supply line 45 are both supported by the support member 60 and extend substantially in parallel. However, in the present embodiment, the second supply line 45 extends through the inside of the tubular portion 66 of the support member 60, and the first supply line 30 extends through the outside of the tubular portion 66 of the support member 60. ing. In particular, the second supply line 45 crosses the partition wall 54 that passes through the inside of the tubular portion 66 and demarcates the processing chamber, and the degree of freedom of path setting for the supply lines 30 and 45 is much higher than that in the processing chamber. It extends out of the processing chamber. In the first place, a partition member 63 constituted by an arm 62 extends between the first supply line 30 and the second supply line 45, and the path of the first supply line 30 and the path of the second supply line 45 are connected. It is partitioned by a partition member 63. That is, the first supply line 30 and the second supply line 45 sandwich the partition member 63 including the arm 62 in the tip end region 62a of the arm 62 where the cylindrical portion 66 of the support member 60 is not formed. Different sides of the partition member 63 extend. For these reasons, heat transfer between the first liquid in the first supply line 30 and the second liquid in the second supply line 45 can be extremely effectively suppressed. Accordingly, the first liquid can be discharged from the discharge opening 30a of the first supply line 30 at the expected temperature, and the second liquid can be discharged from the discharge opening 45a of the second supply line 45 at the expected temperature. .

  In the processing step S3 of the wafer W using the first liquid as described above, the liquid supply switching valve 38a provided on the first supply line 30 connects the upstream first supply line 30 to the return line 35. The process is terminated by stopping the supply of the heated first liquid to the processing unit 50. At this time, the open / close valve 38b on the return line 35 is closed along with the operation of the liquid supply switching valve 38a. As a result, a temperature adjustment circulation path (heating circulation path) including the first supply line 30 and the return line 35 is formed again, and the first liquid flowing into the first supply line 30 from the circulation line 20 is It flows through the circulation path for heating.

  That is, as shown in FIG. 6, the temperature adjustment process (heating process) Sp2 is started again. In the heating step Sp2, the wafer to be processed next is transferred to the processing unit 50, and the processing using the second liquid for the wafer W is completed, and the first wafer W to be processed next is processed. It can be carried out until the treatment (step S3) with the liquid is started. In this way, the temperature of the first supply line 30 and the liquid supply switching valve 38a is maintained during the processing step S3 using the first liquid by repeating the heating process Sp2 and the processing process S3 using the first liquid. As a result, in the process step S3 using the first liquid, the temperature fluctuation of the first liquid supplied to the wafer W is effectively suppressed.

  According to the present embodiment as described above, the return line 35 for returning the first liquid flowing into the first supply line 30 from the circulation line 20 to the circulation line 20 is provided. Therefore, the heated first liquid can circulate not only in the circulation line 20 but also in a circulation path including the first supply line 30 and the return line 35. Therefore, before the processing using the first liquid is started in the processing unit 50, the heated first liquid is used to reach the same temperature as the heated first liquid in at least a part of the first supply line 30. Can be preheated. In particular, the return line 35 is provided separately from the circulation line 20 so as to correspond to the first supply line 30 leading to each processing unit, so that the first supply line 30 in the vicinity of the discharge opening 30a of the corresponding first supply line 30. 1 supply line 30 can be connected. Thereby, the temperature fall of the 1st liquid at the time of the processing start in the said processing unit 50 can be suppressed effectively. In addition, since the liquid used for heating circulates in the circulation path including the first supply line 30 and the return line 35, the consumption of the first liquid is not increased.

  In particular, the return line 35 includes a branch pipe 30 on the most downstream side of the plurality of branch pipes 30 based on the liquid flow in the circulation line 20 of the liquid supplied from the liquid supply source 22 to the circulation path. It is connected to the circulation line 20 at a position downstream of the connection position with the circulation line 20. Therefore, during the preheating step Sp2, the first liquid used for preheating whose temperature may be lowered is directly sent to another processing unit 50 and used for processing the wafer W in the processing unit 50. It will never be done. The first liquid used for the preheating is supplied again from the circulation line 20 to any one of the first supply lines 30 via the liquid supply source 22 in which the heated liquid is replenished and the heating mechanism 22b is provided. It starts to flow. For this reason, a large number of processing units 50 are provided in the liquid processing apparatus 50, and the processing of the wafers W proceeds at different timings in each processing unit 50, but from the circulation line 20 to each first supply line 30. The temperature of the supplied first liquid can be stabilized. That is, it is possible to suppress the processing on the wafer W in one processing unit 50 from affecting the processing of the wafer W performed in the other processing unit 50. Thereby, in each processing unit 50, it is possible to perform stable processing using the heated first liquid, and fluctuations in the degree of processing of the wafer W using the heated first liquid are changed between the processing units 50. Thus, it can be effectively suppressed.

  In addition, a liquid supply switching valve 38a that switches between supply and stop of supply of the first liquid used for processing the wafer W in the processing unit 50 is provided from the first supply line 30 via the return line 35 to the first liquid supply mechanism. It is located on the circulation path for the preheating of the 1st liquid which returns to 15. Normally, it is not necessary to further provide valves on the downstream side of the liquid supply switching valve 38a of the first supply line 30 extending into the processing unit 50. Therefore, as in the present embodiment, the liquid supply switching valve 38 a is a valve provided on the most downstream side on the first supply line 30 to the processing unit 50. Therefore, on the first supply line 30 that supplies the heated first liquid to the processing unit 50 before the processing unit 50 starts processing the wafer W and between the processing unit 50 processing the wafer W. All valves can be heated (preheated). In general, the valves have a much larger heat capacity than the pipes forming the first supply line 30. Therefore, according to the present embodiment in which the temperature of such valves can be stabilized, the temperature variation of the heated first liquid used for processing in the processing unit 50 as compared with the conventional apparatus and method. Can be suppressed extremely effectively.

  From the above, according to the present embodiment, temperature variation of the heated first liquid during processing of one wafer W can be suppressed, and the same processing unit 50 or different processing can be performed. The temperature variation of the first liquid used when processing different wafers W in the unit 50 can also be suppressed. As a result, it is possible to stably perform a process with little variation on the wafer W.

  Further, according to the present embodiment, when the processing of the wafer W is not performed in the processing unit 50, the amount of the first liquid flowing in the return line 35 per unit time is within the processing unit 50. When the process of W is performed, the amount of the first liquid discharged from the discharge opening 30a of the first supply line 30 is larger than the amount per unit time. Therefore, preheating of the circulation path including the first supply line 30 and the return line 35 can be performed in a short time. That is, even if the processing is performed intermittently in the processing unit 50 in a short time, the circulation path including the first supply line 30 and the return line 35 can be sufficiently preheated. The temperature drop of the first liquid at the start of processing can be effectively suppressed.

  Furthermore, according to the present embodiment, one of the first supply line 30 and the second supply line 45 passes through one side of the partition member 63 of the support member 60 and extends to the corresponding liquid supply mechanisms 15 and 40. The other of the first supply line 30 and the second supply line 45 extends through the other side of the partition member 63 of the support member 60 to the corresponding liquid supply mechanisms 15 and 40. Therefore, it is possible to effectively suppress the occurrence of heat transfer between the first liquid in the first supply line 30 and the second liquid in the second supply line 45. As a result, the first liquid can be supplied at a desired temperature, and the second liquid can be supplied at a desired temperature.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, an example of modification will be described.

  For example, in the above-described embodiment, the flow rate adjustment valve 37 that can manually adjust the opening degree is provided on the first supply line 30 before branching to the first pipeline 31a and the second pipeline 31b. However, the present invention is not limited to this, and as an example, it may be provided on the second pipeline 31b as shown by a two-dot chain line in FIG. In such a modified example, the flow rate adjusting valve 32 provided in the first pipeline 31a determines the amount of liquid that can pass through the first pipeline 31a, and the flow rate regulating valve provided in the second pipeline 31b. Therefore, the amount of liquid that can pass through the second pipe line 31b is determined.

  In the above-described embodiment, the example in which one section of the first supply line 30 is divided into the two pipe lines 31a and 31b is shown, but the present invention is not limited thereto. For example, one section of the first supply line 30 may be divided into three or more pipelines. Similarly, two or more sections of the first supply line 30 may be divided into a plurality of pipelines and extend. According to these modified examples, the flow rate of the first liquid that can flow from the circulation line 20 to the first supply line 30 can be changed to various values by appropriately changing the combination of the closed and open pipe lines. It becomes possible.

  Further, in the above-described embodiment, an example in which the return line 35 is connected in the middle of the first supply line 30, that is, an example in which the return line 35 is connected to the first supply line 30 at a position between the discharge opening 30 a and the circulation line 20. Although shown, it is not limited to this. For example, as shown in FIG. 7, the return line 35 may be connected to the discharge opening 30 a of the first supply line 30. The “connection” referred to here includes not only a connection in a state where the return line 35 and the discharge opening 30 a of the first supply line 30 are in contact, but also the discharge opening 30 a of the first supply line 30 to the return line 35. Connection in the sense that a flow path into which the liquid flows is formed is also included.

  In the example illustrated in FIG. 7, the cup-shaped end portion 35 a of the return line 35 is configured to be connectable to the discharge opening 30 a of the first supply line 30 in the non-processing position. In particular, the cup-shaped end portion 35a of the return line 35 is configured to be relatively movable with respect to the discharge opening 30a in the non-processing position, so that it can approach the discharge opening 30a and be separated from the discharge opening 30a. Good. Furthermore, the cup-shaped end portion 35a of the return line 35 may be connectable with the discharge opening 30a of the first supply line 30 in the non-processing position in a sealed state. In the heating process Sp2, the return line 35 collects the first liquid discharged from the discharge opening 30a of the first supply line 30. In this example, a fluid pressure driven on-off valve 34 is provided on the first supply line 30. The on-off valve 34 functions as a liquid supply switching valve that switches between supply and stop of supply of liquid used for processing the object to be processed in the processing unit 50. According to this example, the first supply line 30 can be heated by being included in the heating circulation path over the entire length thereof. That is, all the valves provided on the first supply line 30 including the liquid supply switching valve (open / close valve) 34 are located on the heating circulation path and can be heated. Yes.

  In the modification shown in FIG. 7, a part 35b of the return line 35 is configured to have flexibility and stretchability so that the cup-shaped end portion 35a can be moved. Moreover, the other structure in the modified example shown in FIG. 7 can be comprised the same as embodiment mentioned above, and the overlapping description is abbreviate | omitted here.

  Furthermore, in the above-described embodiment, the state in which the first liquid that has flowed through the first supply line 30 to the flow path control mechanism 38 further flows through the first supply line 30 toward only the discharge opening 30a, and returns. Although the example in which the flow path control mechanism 38 is configured so as to selectively maintain one of the states toward the line 35 only is shown, the present invention is not limited thereto. For example, as shown in FIG. 8, the first liquid that has flowed through the first supply line 30 to the flow path control mechanism 38 is directed to both the discharge opening 30 a and the return line 35, and is directed only to the return line 35. The flow path control mechanism 38 may be configured to selectively maintain any one of the states. In the example shown in FIG. 8, the flow path control mechanism 38 is provided on the first supply line 30 and is provided on the return line 38a and a fluid pressure driven three-way valve 38a connected to one end of the return line 35. A flow control valve 38c. The flow rate control valve 38c is configured by a valve (for example, a mass flow controller) in which a driving machine capable of adjusting the opening degree is built based on a control signal from the control device 12. In this modification as well, the three-way valve 38a functions as a liquid supply switching valve that switches between supply and stop of supply of the liquid used for processing the object to be processed in the processing unit 50, as in the above-described embodiment.

  In such a modification, the flow rate of the first liquid flowing into the first supply line 30 from the circulation line 20 is maintained at a constant amount (for example, A (l / min)) by the flow rate adjustment valve 37. The flow control valve 38c has a certain amount (for example, A (l / L) that the flow control valve 37 can flow when the three-way valve 38a connects the upstream side of the first supply line 30 only to the return line 35. min)) The opening degree is set so that the above first liquid can flow. On the other hand, when the three-way valve 38a is open in three directions, the flow rate control valve 38c has a flow rate (for example, B (l / min) less than a certain amount (for example, A (l / min)) that the flow rate control valve 37 can flow. The opening degree is set so that the first liquid can flow only for min)). In this case, the flow rate of the first liquid discharged from the discharge opening 30a is set to the flow rate of the first liquid that can flow into the first supply line 30 (for example, A (l / min)) and the first flow rate that can flow through the return line 35. The difference between the flow rate of the liquid (for example, B (l / min)) (for example, (A−B) (l / min)) can be used.

  In this modification, the heated first liquid circulates in the heating circulation path including the return line 35 and the first supply line 30 even while the wafer W is processed using the first liquid. ing. Therefore, in each processing unit 50, even if the heating process Sp2 and the processing process S3 are repeated, the temperature of the first liquid that circulates in the heating circulation path including the return line 35 and the first supply line 30. , And the temperature of the first liquid circulating through the circulation line 20 can be substantially prevented from fluctuating. Thereby, the temperature fluctuation of the heated 1st liquid used for a process can be suppressed more effectively.

  Other configurations in the modified example shown in FIG. 8 can be the same as those in the above-described embodiment, and a duplicate description is omitted here.

  Furthermore, although the example in which the second liquid is not heated has been shown in the above-described embodiment, the present invention is not limited to this. Even when the second liquid is heated, the above-described useful effects can be expected.

  Furthermore, although the heating mechanism 22b was incorporated in the 1st liquid supply mechanism 15 and heated the 1st liquid in the storage device 22 in embodiment mentioned above, it was not restricted to this. For example, a heating mechanism for heating the circulation path 24 of the circulation line 20 may be further provided. Further, a heating device for heating the first supply line 30 and the return line 35 may be further provided.

  Further, in the above-described embodiment, the example in which the treatment with the second liquid is first performed and the treatment with the heated first liquid is performed thereafter is not limited thereto, but the heated first liquid is not limited thereto. The process by may be performed before the process by the second liquid.

  In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.

  Furthermore, as described at the beginning, the present invention can be applied to a process other than the wafer cleaning process, and the first liquid to be heated can be a liquid other than the drying liquid. .

DESCRIPTION OF SYMBOLS 10 Liquid processing apparatus 12 Control apparatus 13 Recording medium 15 Liquid supply mechanism (1st liquid supply mechanism)
20 Circulation Line 22 Liquid Supply Mechanism 22a Storage Device 22b Temperature Control Mechanism (Heating Mechanism)
24 Circulation path 26 Delivery mechanism 30 Supply line (first supply line)
30a Discharge opening 31a, 31b Pipe line 35 Return line 34 On-off valve (liquid supply switching valve)
35a End 38 Flow path control mechanism 38a Three-way valve (liquid supply switching valve)
38b On-off valve 38c Flow control valve 39a First relief valve 39b Second relief valve 40 Liquid supply mechanism (second liquid supply mechanism)
45 Supply line (second supply line)
45a Discharge opening 50 Processing unit 52 Holding mechanism 54 Partition 60 Support member 62 Arm 62a Tip end flow area 62b Base end flow area 63 Partition member 64 Shaft member 66 Cylindrical part

Claims (23)

A liquid processing apparatus for processing an object to be processed using a temperature-controlled liquid,
A circulation line having a liquid supply source for supplying a temperature-controlled liquid, and a circulation path through which the liquid from the liquid supply source can circulate;
A plurality of supply lines branched from the circulation path of the circulation line;
A plurality of processing units provided corresponding to each supply line, and configured to process the object to be processed using temperature-adjusted liquid discharged from each supply line Unit,
A plurality of return lines for returning the liquid flowing into the supply lines from the circulation line to the circulation line;
Each return line is connected to the circulation line at a position downstream of the connection position between the supply line on the most downstream side of the plurality of supply lines and the circulation line.   The liquid processing apparatus according to claim 1, wherein the plurality of return lines merge with each other and are connected to the circulation line.   The liquid processing apparatus according to claim 1, wherein the return line is connected to the circulation path of the circulation line. The liquid supply source has a storage device that is connected to the circulation path and stores liquid.
The liquid processing apparatus according to claim 1, wherein the return line returns the liquid into the storage device of the circulation line. A first relief valve is provided at a position between the connection position with the most downstream supply line and the connection position with the return line on the return line,
The liquid processing apparatus as described in any one of Claims 1-3 with which the 2nd relief valve set to the pressure lower than the setting pressure of the said 1st relief valve is provided on the said return line. A plurality of liquid supply switching valves provided in each of the plurality of supply lines, each of which switches supply and stop of supply of the liquid used for processing the object to be processed in each processing unit. A valve,
A plurality of on-off valves provided in each of the plurality of return lines,
The liquid processing apparatus according to claim 1, wherein the liquid supply switching valve is configured as a three-way valve provided on the supply line and connected to one end of the return line. A plurality of liquid supply switching valves provided in each of the plurality of supply lines, each of which switches supply and stop of supply of the liquid used for processing the object to be processed in each processing unit. A valve,
A plurality of flow control valves provided in each of the plurality of return lines, each of which can adjust the flow rate of the liquid that can pass through each return line;
The liquid processing apparatus according to claim 1, wherein the liquid supply switching valve is configured as a three-way valve provided on the supply line and connected to one end of the return line. A plurality of liquid supply switching valves provided in each of the plurality of supply lines, each of which switches supply and stop of supply of the liquid used for processing the object to be processed in each processing unit. A valve, and
Each processing unit has a holding mechanism that holds the object to be processed, and a support member that supports the supply line,
The support so that the discharge opening of the supply line can move between a processing position where the liquid can be supplied to the object to be processed held by the holding mechanism and a non-processing position shifted from the processing position. The component is composed of
Each liquid return apparatus is a liquid processing apparatus as described in any one of Claims 1-5 comprised so that it can connect with the said discharge opening in the said non-processing position.   When the processing object is not processed in the processing unit, the amount of the liquid flowing in the return line per unit time is processed in the processing unit. The apparatus further includes a control device for controlling the flow rate of the liquid so that the amount of the liquid discharged from the discharge opening of the supply line is larger than the amount per unit time. The liquid processing apparatus according to item. The supply line is divided into a plurality of pipelines and extends in at least one section upstream from the connection position with the return line,
When the processing of the object to be processed is not performed in the processing unit, the control device causes the liquid to flow through two or more pipelines, and the processing of the object to be processed is performed in the processing unit. 10. The liquid processing apparatus according to claim 9, wherein the liquid processing apparatus controls the opening and closing of the plurality of pipes so that the liquid flows through only some of the pipes included in the two or more pipes when the liquids are separated. . A method for treating an object to be treated using a temperature-controlled liquid,
A step of filling the circulation line with a circulation path having a plurality of supply lines extending to separate processing units, and a liquid supply source for supplying a temperature-controlled liquid to the circulation path; When,
Allowing the temperature-adjusted liquid to flow from the circulation line to each of the supply lines in a state where the temperature-adjusted liquid is circulating in the circulation line, and
In each of the plurality of processing units, while the temperature-controlled liquid flows into the supply line,
The temperature-adjusted liquid flowing into the supply line from the circulation line is disposed downstream of the connection position between the most downstream supply line and the circulation line through the return line. Returning the temperature in the circulation line at a position so that the temperature-adjusted liquid circulates in a path including the supply line and the return line, and temperature-adjusts the supply line;
Then, the liquid processing method which discharges the temperature-controlled liquid which flows into the said supply line from the said circulation line from the discharge opening of the said supply line, and processes the said to-be-processed object.   The liquid processing method according to claim 11, wherein the liquid is returned to the circulation line through the plurality of return lines joined together and connected to the circulation line while the temperature of the supply line is adjusted.   The liquid processing method according to claim 11 or 12, wherein the liquid is returned to the circulation path of the circulation line while the temperature of the supply line is adjusted. The liquid supply source has a storage device for storing the liquid,
The liquid processing method according to claim 11 or 12, wherein the liquid is returned to the storage device of the circulation line while the temperature of the supply line is adjusted.   While the temperature of the supply line is adjusted, the temperature-controlled liquid flows from the circulation line to each of the supply lines by keeping the pressure in each return line lower than the pressure in the circulation line. The liquid processing method according to any one of claims 11 to 13, which is configured as described above.   A liquid supply switching valve that switches supply and stop of supply of liquid used for processing of the object to be processed in the processing unit when the temperature of the supply line is adjusted, provided on the supply line and the supply The liquid processing method according to claim 11, wherein the temperature of the liquid supply switching valve located on a path including the line and the return line is also adjusted. The return line branches from the middle of the supply line via the liquid supply switching valve composed of a three-way valve, and an open / close valve is provided on the return line,
When the temperature of the supply line is adjusted, the liquid flowing through the supply line flows into the return line through the three-way valve forming the liquid supply switching valve, and flows through the open / close valve.
When processing the object to be processed, the liquid flowing through the supply line passes through the three-way valve forming the liquid supply switching valve, further flows through the supply line, and is discharged from the discharge opening. The liquid processing method according to claim 16. The return line branches from the middle of the supply line via the liquid supply switching valve composed of a three-way valve, and the flow rate capable of adjusting the flow rate of the liquid that can pass through the return line on the return line. A control valve is provided,
When the temperature of the supply line is adjusted, the liquid flowing through the supply line flows into the return line through the three-way valve that forms the liquid supply switching valve, and flows through the flow control valve. ,
When processing the object to be processed, the liquid flowing through the supply line further passes through the three-way valve forming the liquid supply switching valve and further flows through the supply line, and is discharged from the discharge opening.
The liquid processing method according to claim 16, wherein the opening degree of the flow control valve is smaller during the processing of the object to be processed than during the temperature adjustment of the supply line. The discharge opening of the supply line is disposed at a processing position where a liquid can be supplied to the object to be processed when the object to be processed is processed, and the temperature is adjusted from the processing position when the temperature of the supply line is adjusted. Placed in a shifted non-processing position,
When the temperature of the supply line is adjusted, the return line is connected to the discharge opening at the non-processing position, and the temperature of the liquid supply switching valve including an on-off valve provided on the supply line is adjusted. The liquid processing method according to claim 16.   When the temperature of the supply line is adjusted, the amount of liquid flowing in the return line per unit time is a unit of liquid discharged from the discharge opening when processing the object to be processed. The liquid processing method as described in any one of Claims 11-19 which is more than the quantity per time. The supply line is divided into a plurality of pipelines in at least one section, and extends.
When adjusting the temperature of the supply line, the liquid flows through two or more pipelines,
The liquid according to any one of claims 11 to 20, wherein the liquid flows through only some of the pipes included in the two or more pipes when the object to be processed is processed. Processing method. A program executed by a control device that controls a liquid processing apparatus that processes an object to be processed using a temperature-adjusted liquid,
The program which makes a liquid processing apparatus implement the liquid processing method as described in any one of Claims 11-21 by being performed by the said control apparatus. A recording medium on which a program executed by a control device that controls a liquid processing apparatus that processes an object to be processed using a temperature-adjusted liquid is recorded,
The recording medium which makes a liquid processing apparatus implement the liquid processing method as described in any one of Claims 11-21 by the said program being performed by the said control apparatus.

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