JP2011034915A - Organic el display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent peeling-off of an element substrate and a sealing substrate due to a pressure cycle or the like in an organic EL display device. <P>SOLUTION: The sealing substrate 40 with a drying agent 42 disposed around a recessed part 41 is disposed in opposition to the element substrate 10 formed with an organic EL layer 30. The element substrate 10 is adhered to the sealing substrate 40 with a sealing material 50 formed around them to seal an inner part. The inner part is filled with nitrogen gas. The inner part of the organic EL display device is set at a negative pressure relative to an outer atmosphere and the element substrate 10 and sealing substrate 40 are curved inwards. Since force of acting to always adhere is exerted onto the sealing material 50 by the element substrate 10 and the sealing substrate 40, a failure that the element substrate 10 or the sealing substrate 40 is peeled off from the sealing material 50 can be avoided regardless of application of the pressure cycle. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a display device, and in particular, has a configuration that prevents a sealing material for bonding an element substrate on which an organic EL element is formed and a sealing substrate for protecting the organic EL element from external moisture from being peeled off. The present invention relates to an organic EL display device.

  The demand for liquid crystal display devices, organic EL display devices, and the like is increasing as flat displays for monitors, TVs, and the like because the screen is flat and thin. Since the organic EL display device is self-luminous, it has excellent viewing angle characteristics and has a wide range of application fields as a display due to the feature that a backlight is unnecessary.

  The organic EL layer is formed of a plurality of organic thin films, but has a problem that light emission characteristics deteriorate when moisture is present. For this purpose, the organic EL layer is sealed from moisture by sealing the element substrate on which the organic EL layer is formed with a glass sealing substrate or a sealing cap made of metal or the like.

  “Patent Document 1” describes that an organic EL display device having a curved surface is formed using a shape memory alloy for a sealing cap for protecting an organic EL layer. In “Patent Document 1”, an organic EL layer or the like is formed on a flat element substrate, a sealing cap is sealed, and then the organic EL display device is heated to a temperature above the transformation temperature to form a screen. It is described that the element substrate has a curved surface. This document describes a configuration in which the element substrate is convex outward and the sealing cap is convex inward. On the other hand, the element substrate on which the organic EL element is formed is convex outward.

  “Patent Document 2” describes a configuration in which a thermal shock to an organic EL display device is mitigated by using a material that deforms flexibly with pressure as a sealing cap. That is, the inside where the organic EL layer is formed is filled with an inert gas. If this gas expands and contracts depending on the temperature, this causes stress on the seal portion and degrades the sealing characteristics. The thermal shock is alleviated by using a flexible deformable sealing cap. This document describes a configuration in which the sealing cap is convex outward or concave, but the seal portion bonded to the element substrate is flat.

JP 2001-118680 A JP 2001-217069 A

  The characteristics of the organic EL layer are degraded when moisture is present, and the organic EL layer does not emit light. The part where the light is not emitted appears as a black spot on the screen. The area and number of the black spots increase as time passes. This is because the influence of moisture gradually appears over a long period of time. The organic EL element is formed on an element substrate formed of glass, but is generally covered with a sealing substrate formed of glass in order to protect the organic EL element from external moisture. The element substrate and the sealing substrate are bonded together by a sealing material formed in the periphery. If the sealing material is peeled off, moisture from the outside air enters and the organic EL layer does not emit light in a short time. Therefore, adhesion of the sealing material to the element substrate or the sealing substrate is very important.

  When the liquid crystal display device is transported to an airplane and exported overseas, the air pressure at the flight altitude of the airplane is about 1/3 of the ground. Therefore, the relationship between the atmospheric pressure inside and outside the organic EL display device is different from the ground, and the stress received by the seal portion is also different from the ground. This may cause peeling of the sealing material.

  In particular, a small organic EL display device is used for a mobile phone, a DSC (Digital Still Camera), and the like, and is exposed to a severe outdoor environment. In summer, winter, etc., the temperature difference is often large between outdoors and indoors, and such a small organic EL display device undergoes a temperature cycle. When the organic EL display device undergoes a temperature cycle, stress is applied particularly to the sealing material that bonds the element substrate and the sealing substrate. When stress is repeatedly applied, the sealing material may be peeled off from the element substrate or the sealing substrate.

  An object of the present invention is to realize a highly reliable organic EL display device in which a sealing material does not peel from an element substrate or a sealing substrate.

  The present invention has been made to solve the above problems, and specific means are as follows.

  (1) An element substrate on which an organic EL layer is formed and a sealing substrate are arranged opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other through a sealing material formed in the periphery. In the organic EL display device, the element substrate or the sealing substrate is bent inward by 5 μm or more in an atmospheric pressure atmosphere, and the element substrate and the sealing substrate are not in contact with each other. Organic EL display device.

  (2) The element substrate and the sealing substrate are bent inward by 5 μm or more in an atmospheric pressure atmosphere, and the element substrate and the sealing substrate are not in contact with each other. Organic EL display device.

  (3) The organic EL display device according to (1), wherein the element substrate or the sealing substrate is bent inwardly by 5 μm or more and 150 μm or less in an atmospheric pressure atmosphere.

  (4) An element substrate on which an organic EL layer is formed and a sealing substrate are arranged opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other via a sealing material formed in the periphery. The element substrate or the sealing substrate is bent inward by 5 μm or more in an atmospheric pressure atmosphere, and the element substrate and the sealing substrate are in contact with each other. Organic EL display device characterized by not having.

  (5) An element substrate on which an organic EL layer is formed and a sealing substrate are arranged opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other via a sealing material formed in the periphery. An organic EL display device, wherein the element substrate or the sealing substrate is bent inward by 5 μm or more in an atmospheric pressure atmosphere.

  (6) An element substrate on which an organic EL layer is formed and a sealing substrate are disposed opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other via a sealing material formed in the periphery. The organic EL display device is filled with a resin and nitrogen gas is sealed in a portion where the resin is not present, and the element substrate or the sealing substrate is 5 μm or more inside in an atmospheric pressure atmosphere. An organic EL display device characterized by being bent.

  According to the present invention, since the element substrate or the sealing substrate is curved inward in an atmospheric pressure atmosphere, the element substrate formed in the periphery and the sealing material for bonding the sealing substrate are more Since the stress in the bonding direction is received, the reliability of bonding between the sealing material and the element substrate or between the sealing material and the sealing substrate is improved.

  According to another embodiment of the present invention, even in an organic EL display device of a type in which a resin is filled in the organic EL display device, the element substrate or the sealing substrate is curved inward in an atmospheric pressure atmosphere. Therefore, similarly, the reliability of adhesion between the sealing material and the element substrate or between the sealing material and the sealing substrate is improved.

1 is a cross-sectional view of an organic EL display device of Example 1. FIG. It is sectional drawing of the display area of an organic electroluminescence display. It is sectional drawing of the conventional organic electroluminescence display. It is other sectional drawing of the conventional organic electroluminescence display. It is a graph which shows the effect of the organic electroluminescence display of this invention. 2 shows a manufacturing process of the organic EL display device of Example 1. It is the process following FIG. It is the process following FIG. 6 is a cross-sectional view of an organic EL display device of Example 2. FIG. 6 is a cross-sectional view of a display area of an organic EL display device according to Example 2. FIG. 6 shows a manufacturing process of the organic EL display device of Example 2. It is a process following FIG. It is the process following FIG. 6 is a cross-sectional view showing another example of the organic EL display device of Example 2. FIG.

  Before describing specific embodiments of the present invention, the configuration of an organic EL display device to which the present invention is applied will be described. FIG. 2 is a cross-sectional view of a display region of a top emission type organic EL display device to which the present invention is applied. In this embodiment, a top emission type organic EL display device will be described as an example. However, the present invention can be similarly applied to a bottom emission type organic EL display device. The top emission type organic EL display device includes a top anode type in which an anode is present on an organic EL layer and a top cathode type in which a cathode is present on an organic EL layer. Although FIG. 1 shows a case of a top anode type, the present invention can be similarly applied to a case of a top cathode.

In FIG. 2, a first base film 11 made of SiN and a second base film 12 made of SiO ₂ are formed on the element substrate 10. This is to prevent impurities from the glass substrate from contaminating the semiconductor layer 13. A semiconductor layer 13 is formed on the second base film 12. The semiconductor layer 13 is converted to a poly-Si film by laser irradiation after an a-Si film is formed by CVD.

A gate insulating film 14 made of SiO ₂ is formed so as to cover the semiconductor layer 13. A gate electrode 15 is formed in a portion facing the semiconductor layer 13 with the gate insulating film 14 interposed therebetween. Using the gate electrode 15 as a mask, an impurity such as phosphorus or boron is implanted into the semiconductor layer 13 by ion implantation to impart conductivity, thereby forming a source portion or a drain portion in the semiconductor layer 13.

An interlayer insulating film 16 is formed of SiO ₂ so as to cover the gate electrode 15. This is because the gate wiring and the drain wiring 171 are insulated. A drain wiring 171 is formed on the interlayer insulating film 16. The drain wiring 171 is connected to the drain of the semiconductor layer 13 through the interlayer insulating film 16 and the gate insulating film 14 through a through hole.

  Thereafter, in order to protect the thin film transistor (TFT) manufactured as described above, an inorganic passivation film 18 made of SiN is deposited. An organic passivation film 19 is formed on the inorganic passivation film 18. The organic passivation film 19 has a role of protecting the TFT more completely together with the inorganic passivation film 18 and a function of flattening the surface on which the organic EL layer 22 is formed. Therefore, the organic passivation film 19 is formed as thick as 1 to 4 μm.

  A reflective electrode 24 is formed of Al or an Al alloy on the organic passivation film 19. Since Al or Al alloy has a high reflectance, it is suitable as the reflective electrode 24. On the reflective electrode 24, the lower electrode 21 is formed of ITO which is a transparent conductive film. The lower electrode 21 is connected to the drain wiring 171 through a through hole formed in the organic passivation film 19 and the inorganic passivation film 18. Since the present embodiment is a top cathode type organic EL display device, the lower electrode 21 of the organic EL layer 22 is an anode.

  An organic EL layer 22 is formed on the lower electrode 21. The organic EL layer 22 is, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a hole injection layer from the lower layer. An upper electrode 23 serving as a cathode is formed on the organic EL layer 22. In this embodiment, IZO is used as the upper electrode 23. IZO is deposited on the entire display area without using a mask. The thickness of IZO is formed to be about 30 nm in order to maintain the light transmittance. ITO can also be used instead of IZO.

  In order to prevent the organic EL layer 22 from being broken at the end portion due to disconnection, a bank 20 is formed between the pixels. The bank 20 may be formed of an organic material or an inorganic material such as SiN. When using an organic material, it is generally formed of an acrylic resin.

  An auxiliary electrode may be used on the upper electrode 23 on the bank 20 to assist conduction. This is because luminance unevenness may occur when the resistance of the upper electrode 23 is large. Although the auxiliary electrode is not used in this embodiment, it goes without saying that the present invention can be applied to an organic EL display device using the auxiliary electrode.

  A space is formed on the upper electrode 23, and a sealing substrate 40 made of glass is disposed across the space. Nitrogen gas is sealed between the upper electrode 23 and the sealing substrate in a decompressed state.

  Hereinafter, the contents of the present invention will be described in detail using examples.

  FIG. 1 is a schematic sectional view of an organic EL display device according to the present invention. FIG. 1 shows a sealing method called so-called hollow sealing. In FIG. 1, an organic EL element 30 is formed on the element substrate 10. In this specification, the organic EL element 30 refers to an element in which pixels including the organic EL layer, TFT, and the like in FIG. 2 are formed in a matrix. A wiring (not shown) for supplying a video signal, a scanning signal, a power source and the like to the organic EL element 30 extends from the organic EL element 30 to the terminal portion 60 through the sealing material 50. The element substrate 10 is formed larger than the sealing substrate 40 by the amount of the terminal portion 60. The plate thickness t1 of the element substrate 10 in the present embodiment is 0.5 mm. Note that nitrogen gas is sealed between the element substrate 10 and the sealing substrate 40.

  Since the organic EL element 30 is vulnerable to moisture, the organic EL element 30 is protected by the sealing substrate 40. In FIG. 1, the sealing substrate 40 is formed of glass. The sealing substrate 40 is bonded to the element substrate 10 by the sealing material 50, and the organic EL display device is sealed. The portion of the sealing substrate 40 that is in contact with the sealing material 50 and the inside thereof have different plate thicknesses, and the recess 41 is formed over a wide range inside the sealing substrate 40. Such a recess 41 is formed by, for example, sand blasting. In the present embodiment, the thickness of the peripheral portion of the sealing substrate 40 is 0.7 mm, and the thickness of the recess 41 is 0.4 mm.

  In FIG. 1, a desiccant is disposed around the recess 41 of the sealing substrate 40. The desiccant 42 has a role of absorbing moisture remaining after sealing and absorbing moisture that has entered from the outside via the sealing material 50. Since FIG. 1 is a top emission type organic EL display device, light for forming an image is emitted to the outside from the sealing substrate 40 side.

  Since the element substrate 10 and the sealing substrate 40 are made of glass, moisture does not enter from these substrates. It is the portion of the sealing material 50 that is likely to receive moisture. That is, the sealing material 50 is formed of a resin such as epoxy, and the resin allows a slight amount of moisture to pass therethrough.

  If the width of the sealing material 50 is large, the passage of moisture is correspondingly reduced. Therefore, the sealing material 50 in the case of an organic EL display device is formed wider than a liquid crystal display device or the like. In addition, the adhesive force between the sealing material 50 and the element substrate 10 or between the sealing material 50 and the sealing substrate 40 increases as the width w1 of the sealing material 50 increases. In this embodiment, the width w1 of the sealing material 50 is 1.2 mm to 1.5 mm. However, when the width of the sealing material 50 is increased, a so-called frame area outside the display area is increased. Recently, there is a strong demand for reducing the outer shape of the display device and increasing the display area, so the width of the sealing material 50 cannot be increased without limit.

  In the present invention, as shown in FIG. 1, the element substrate 10 and the sealing substrate 40 are bent inward by setting the inside of the organic EL display device to a negative pressure with respect to the outside air. Even if the external environment changes by bending the element substrate 10 and the sealing substrate 40 inward, the sealing material 50 is always subjected to a compressive stress opposite to that of the peeling, so that the sealing material 50 is difficult to peel off. Become.

  In FIG. 1, the plate thickness t1 of the element substrate 10 is 0.5 mm, and the plate thickness t3 of the sealing substrate 40 is 0.4 mm. Therefore, although the bending amount d1 of the element substrate 10 and the bending amount d2 of the sealing substrate 40 are different, in order to obtain the effect of the present invention, it is necessary that at least either d1 or d2 be bent by 5 μm or more. . It should be noted that both of d1 and d2 are more desirably 5 μm or more. On the other hand, if d1 or d2 is large, the element substrate 10 and the sealing substrate 40 come into contact with each other. When the element substrate 10 and the sealing substrate 40 come into contact with each other, the organic EL layer may be destroyed. Therefore, in order not to contact the element substrate 10 and the sealing substrate 40, both d1 and d2 need to be 150 μm or less.

  FIG. 3 shows a case where the pressure inside and outside the organic EL display device is the same. Therefore, the element substrate 10 and the sealing substrate 40 are not bent. Also in this case, the inside is filled with nitrogen gas. Other configurations are the same as those described in FIG. In the configuration shown in FIG. 3, when the organic EL display device is stored at normal temperature and normal atmospheric pressure, the stress on the sealing material is small.

  However, problems arise when the organic EL display device is shipped by airplane or the like. That is, the atmospheric pressure is 1013000 pa, but the atmospheric pressure at the altitude at which the international flight plane flies is about 35000 pa. Under such an atmosphere, the element substrate 10 and the sealing substrate 40 bend outward. Thus, peeling stress is applied to the sealing material 50 and the element substrate 10, or the sealing material 50 and the sealing substrate 40, and the reliability of adhesion is lowered.

  FIG. 4 shows a case where the inside of the organic EL display device is at a positive pressure relative to the outside atmosphere. In this case as well, the organic EL display device is filled with nitrogen gas. In this case, both the element substrate 10 and the sealing substrate 40 are bent so as to protrude outward, and the sealing material 50 is always subjected to peeling stress. Therefore, the configuration of FIG. 4 is the worst in terms of peeling off the sealing material 50.

  FIG. 5 is a graph evaluating the degree of peeling of the sealing material 50 in the case of the configuration of FIGS. In FIG. 5, the horizontal axis d is the amount of deflection. When d is positive, the element substrate 10 or the sealing substrate 40 is bent inward as in FIG. 1, and when d is zero, it is the case of FIG. 3, where d is negative. In this case, as shown in FIG. 4, the element substrate 10 or the sealing substrate 40 is bent outward. As the value of d, 10 samples each having a value of −30 μm, −20 μm, −10 μm, −5 μm, 0, 5 μm, 10 μm, 20 μm, and 30 μm were manufactured. The display area of the manufactured organic EL display device has a diagonal of 3 inches and an aspect ratio of 3: 4. FIG. 5d shows a case where either the sealing substrate 40 or the element substrate 10 is bent by 5 μm or more. The width of the sealing material 50 is 1.2 mm.

  Such a sample was tested for 100 cycles every 30 minutes under normal pressure (101300 pa) and reduced pressure (35000 pa) to inspect for the presence or absence of peeling of the sealing material 50. The reason why the decompression condition is 35000 pa is based on the atmospheric pressure at the altitude at which the international jets fly.

  As can be seen from FIG. 5, when the element substrate 10 or the sealing substrate 40 is bent outward, if the bending amount is 20 μm or more, the entire number is peeled off at the seal portion. Further, even when the amount of bending was zero, peeling of the sealing material 50 was observed for one of ten pieces. On the other hand, when the element substrate 10 or the sealing substrate 40 is bent inward, no peeling was observed when the bending amount was 5 μm or more. FIG. 5 shows a case where either the element substrate 10 or the sealing substrate 40 is bent by 5 μm or more. Therefore, if both the element substrate 10 and the sealing substrate 40 are bent inward by 5 μm or more, the probability of the sealing material 50 peeling off becomes smaller.

  6-8 is a figure which shows the manufacturing method of the organic electroluminescence display in FIG. FIG. 6A shows the element substrate 10 on which the organic EL element 30 is formed. FIG. 6B shows a sealing substrate 40 in which a recess 41 is formed and a desiccant is disposed around the recess 41. A sealing material 50 is disposed around the sealing substrate 40.

  The element substrate 10 and the sealing substrate 40 shown in FIG. 6 are bonded together in a decompression chamber 200 in which nitrogen gas is sealed. In order to manufacture the organic EL display device having a shape as shown in FIG. After that, after the ultraviolet protection mask 100 is disposed in a reduced-pressure atmosphere, the sealing material 50 is cured by irradiating ultraviolet rays from an ultraviolet (UV) lamp. When the ultraviolet light hits the organic EL layer, the organic EL layer is destroyed. Therefore, the ultraviolet ray prevention mask 100 is used to irradiate only the seal portion with the ultraviolet light.

  When the organic EL display device thus formed is returned from the decompression chamber 200 to the atmosphere, the element substrate 10 and the sealing substrate 40 are pushed by the atmospheric pressure and bent inward. The deflection amount d1 or d2 in FIG. 1 can be adjusted by the pressure of nitrogen gas in the decompression chamber 200.

  FIG. 9 is a cross-sectional view of an organic EL display device showing a second embodiment of the present invention. In FIG. 9, an organic resin 70 containing a desiccant 42 is filled between the element substrate 10 and the sealing substrate 40. This sealing method is a so-called solid sealing method. As this resin, for example, an epoxy-based transparent resin can be used. In FIG. 9, the filling resin 70 is filled with no gap between the element substrate 10 and the sealing substrate 40, but it is not always necessary that the filling resin 70 completely fills the inside. As will be described later, since the element substrate 10 and the sealing substrate 40 are bonded in a reduced-pressure atmosphere of nitrogen, even if a space in which nitrogen gas exists remains, it does not cause a big problem. The only part where the nitrogen gas exists is the same as in Example 1.

  The present embodiment is characterized in that the gap between the element substrate 10 and the sealing substrate 40 is fixed by the filling resin 70. That is, even if an external force is applied to the element substrate 10 or the sealing substrate 40, the element substrate 10 and the sealing substrate 40 do not come into direct contact. Therefore, when the element substrate 10 and the sealing substrate 40 are separated from each other after contact, the organic EL layer is held on the sealing substrate 40, and the phenomenon that this portion becomes a black spot defect can be eliminated.

  In the present embodiment, since the desiccant 42 is contained in the filling resin 70, it is not necessary to separately arrange the desiccant 42 on the sealing substrate 40. Therefore, there is no need to form the recess 41 in the sealing substrate 40. Since it is not necessary to form the recess 41 in the sealing substrate 40, the same thickness of the sealing substrate 40 and the element substrate 10 can be used. In this embodiment, both the element substrate 10 and the sealing substrate 40 are 0.5 mm. In this case, the deflection amount d1 of the element substrate 10 and the deflection amount d2 of the sealing substrate 40 are the same.

  Even in the configuration shown in FIG. 9, since the element substrate 10 or the sealing substrate 40 is bent inward, stress in a direction that does not cause peeling is always applied to the sealing material 50. Can improve the reliability.

  FIG. 10 is a cross-sectional view corresponding to one pixel in the display region in which the organic EL element 30 of the organic EL display device shown in FIG. 9 is formed. In FIG. 10, a transparent filling resin 70 exists between the upper electrode on the organic EL layer formed on the element substrate 10 and the sealing substrate 40. Since it is the same as that of FIG. 2 except that the transparent filling resin 70 exists, the description is omitted.

  11 to 13 are views showing a method of manufacturing the organic EL display device in FIG. FIG. 11A shows the element substrate 10 on which the organic EL element 30 is formed. In FIG. 11B, the sealing material 50 is formed in the periphery, and the filling resin 70 is disposed on the inner side surrounded by the sealing material 50. The element substrate 10 and the sealing substrate 40 in this state are arranged in the decompression chamber 200. Nitrogen gas is sealed in the decompression chamber 200. Then, in the decompression chamber 200, the element substrate 10 and the sealing substrate 40 are bonded together.

  FIG. 13 shows a state where the element substrate 10 and the sealing substrate 40 are bonded together. In FIG. 13, the gap between the element substrate 10 and the sealing substrate 40 is not completely filled with the filling resin 70, and a gap 75 exists in part. Nitrogen gas having the same pressure as that in the decompression chamber 200 exists in the gap 75. In this state, the seal material 50 is cured by irradiating the seal material 50 with UV from the UV lamp through the UV protection mask 100.

  Even when the sealing material 50 is cured by UV irradiation, the filling resin 70 between the element substrate 10 and the sealing substrate 40 is not yet cured. When the organic EL display device in this state is returned from the decompression chamber 200 to the atmosphere, the element substrate 10 and the sealing substrate 40 are bent inward by the atmospheric pressure. That is, in this state, since the filling resin 70 has not yet been cured, the element substrate 10 and the sealing substrate 40 can be bent.

  As shown in FIG. 13, in the decompression chamber 200, the organic EL display device has a gap 75 between the element substrate 10 and the sealing substrate 40. By filling in, a space in which the element substrate 10 or the sealing substrate 40 bends inward can be secured. Although the decompressed nitrogen gas exists in the gap 75 in FIG. 13, since the pressure is reduced, the pressure by the nitrogen gas can be ignored. Thereafter, the filler is thermally cured at about 80 ° C. or less in a baking furnace or the like, and an organic EL display device as shown in FIG. 9 can be manufactured.

  In the present embodiment, the amount of bending of the substrate can be controlled by the amount of the filling resin 70 installed on the sealing substrate 40 in FIG. Further, as shown in FIG. 14, even if the space between the element substrate 10 and the sealing substrate 40 is not completely filled with the filler, the predetermined effect of the present embodiment can be obtained. That is, the portion without the filling resin is filled with nitrogen gas having a low pressure, and this portion only has the same conditions as in the first embodiment.

  In FIG. 9 or FIG. 14, the extent to which d1 and d2 are not peeled off from the sealing material 50 is the same as in the first embodiment. That is, the stress in the direction opposite to the direction in which the sealing material 50 and the element substrate 10 or the sealing substrate 40 are peeled off may be constantly applied. Therefore, also in Example 2, the amount of bending inward of the element substrate 10 or the sealing substrate 40 may be 5 μm or more.

  As described above, according to the present invention, the sealing material 50 is used for the element substrate 10 or the sealing substrate 40 for both the organic EL display device in the case of so-called hollow sealing and the organic EL display device in the case of solid sealing. Can be prevented, and a highly reliable organic EL display device can be realized. In the above description, the top emission type organic EL display device has been described. However, the present invention can also be applied to a bottom emission type organic EL display device.

  DESCRIPTION OF SYMBOLS 10 ... Element board | substrate 11 ... 1st base film, 12 ... 2nd base film, 13 ... Semiconductor layer, 14 ... Gate insulating film, 15 ... Gate electrode, 16 ... Interlayer insulating film, 17 ... Source wiring, 18 ... Inorganic passivation Membrane, 19 ... Organic passivation film, 20 ... Bank, 21 ... Lower electrode, 22 ... Organic EL layer, 23 ... Upper electrode, 24 ... Reflective electrode, 30 ... Organic EL element, 40 ... Sealing substrate, 41 ... Recess, 42 DESCRIPTION OF SYMBOLS ... Drying material, 50 ... Sealing material, 60 ... Terminal part, 70 ... Filling resin, 75 ... Gap, 100 ... UV protection mask, 171 ... Drain wiring, 200 ... Chamber.

Claims (6)

An organic EL display in which an element substrate on which an organic EL layer is formed and a sealing substrate are arranged opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other through a sealing material formed in the periphery A device,
The organic EL display device, wherein the element substrate or the sealing substrate is bent at least 5 μm inward in an atmospheric pressure atmosphere, and the element substrate and the sealing substrate are not in contact with each other.   2. The organic EL display according to claim 1, wherein the element substrate and the sealing substrate are bent inward by 5 μm or more in an atmospheric pressure atmosphere, and the element substrate and the sealing substrate are not in contact with each other. apparatus.   2. The organic EL display device according to claim 1, wherein the element substrate or the sealing substrate is bent in a range of 5 μm to 150 μm in an atmospheric pressure atmosphere. 3. An element substrate on which an organic EL layer is formed and a sealing substrate are disposed opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other through a sealing material formed in the periphery, and nitrogen gas is contained therein. Is an organic EL display device in which is enclosed,
The organic EL display device, wherein the element substrate or the sealing substrate is bent at least 5 μm inward in an atmospheric pressure atmosphere, and the element substrate and the sealing substrate are not in contact with each other. An element substrate on which an organic EL layer is formed and a sealing substrate are arranged opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other through a sealing material formed in the periphery, and resin is contained inside A filled organic EL display device,
The organic EL display device according to claim 1, wherein the element substrate or the sealing substrate is bent inward by 5 μm or more in an atmospheric pressure atmosphere. An element substrate on which an organic EL layer is formed and a sealing substrate are arranged opposite to the element substrate, and the element substrate and the sealing substrate are bonded to each other through a sealing material formed in the periphery, and resin is contained inside The organic EL display device is filled and filled with nitrogen gas in a portion where the resin does not exist,
The organic EL display device according to claim 1, wherein the element substrate or the sealing substrate is bent inward by 5 μm or more in an atmospheric pressure atmosphere.

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