JP2011032696A - Flooring material and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make the number of components as small as possible, and to easily manufacture a flooring material. <P>SOLUTION: This flooring material 1 includes upper and lower layers 2 and 3, and a frame material 4 which is provided between the upper and lower layers 2 and 3. The upper and lower layers 2 and 3, and the frame material 4 are made of a synthetic resin. The upper layer 2 and the frame material 4 are joined together; and the frame material 4 and the lower layer 3 are joined together. Thus, a storage portion 5 for housing electric equipment E is formed of the upper layer 2, the frame material 4 and the lower layer 3 inside the flooring material 1. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a flooring that can accommodate an electrical device therein and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, for example, a glass floor (hereinafter simply referred to as “floor material”) in which a surface is composed of a glass material (floor glass) and a lighting device is accommodated therein and a pedestrian can be guided by the illumination. It has been proposed (see, for example, Patent Document 1).

  This flooring is constituted by a glass floor unit assembled in a predetermined procedure. This glass floor unit is assembled in the following procedure.

  First, two long branch support frames 2a, 2a and two short branch support frames 2b, 2b are arranged in a state along a rectangular side from a plane, and four corners are formed by L-shaped connecting members. Connect.

  In the lower part of the support frame 2 configured in this manner, a face material 3d on which the mounting base 5a on which the LEDs 5b are arranged is placed, and on the upper part of the support frame 2, the floor glass 4 that transmits the light of the LEDs 5b. Is placed.

JP 2007-332538 A (paragraphs 0077 to 0083)

  As described above, the conventional flooring has a complicated assembly work because a plurality of members such as a long support frame, a short support frame, a connection member, a face material, and a glass floor are assembled in a plurality of procedures. Yes, the manufacturing cost was also high. Further, in apartment houses such as apartments, floor materials are often laid on the ground of concrete or mortar. The underlying ground of concrete or mortar often has unevenness even though it appears to be relatively smooth.

  However, if high rigidity aluminum or wood is used for the support frame, even the relatively small unevenness (in the range of 2mm to 8mm) cannot absorb the unevenness between the ground surface and the floor board, and it becomes loose. The shortcoming is inevitable. When rattling occurs, inconveniences such as generation of floor noise, poor walking feeling, a step at the joint between floor materials, and a poor appearance in appearance.

  In particular, if a step is generated at the joint between floor materials, not only the feeling of walking becomes unstable, but also it becomes easy to trip, which is not preferable for safety. For this reason, in order to lay a good floor material, the floor material needs so-called “non-land trackability” that absorbs unevenness between the base surface and the floor board. In addition, it is conceivable to lay a flooring material on a buffer mat that has been laid in advance to absorb unevenness. However, in addition to inconveniences such as an increase in construction time and construction cost, the flooring material becomes higher than necessary. There is a case where inconveniences such as difficulty in connecting each other occur.

  On the other hand, if a soft frame is used in order to suppress rattling defects, if the frame is laid on an uneven surface, the frame is so soft that it cannot withstand the weight of heavy objects. It will be.

  The present invention has been made in view of the above circumstances, can accommodate electrical equipment with a simple configuration, has a non-land trackability to absorb unevenness of the laying surface, and can withstand the weight of heavy objects at the same time. It is an object of the present invention to provide a flooring material that can be manufactured and a method for manufacturing the same.

  The flooring according to the present invention is made in view of the above circumstances, and includes an upper layer, a lower layer, and a frame member provided between the upper layer and the lower layer, and includes an upper layer, a lower layer, and a frame member. Consists of a synthetic resin, the upper layer and the frame material are joined, and the frame material and the lower layer are joined to form an accommodation portion that accommodates an electrical device inside the upper layer, the frame material, and the lower layer. It is characterized by that.

  According to such a configuration, the upper layer and the frame material are joined, and the frame material and the lower layer are joined, thereby forming an accommodating portion that accommodates an electric device therein, and thereby withstanding the weight of a heavy object. High-strength flooring that can be manufactured easily. Moreover, since the lower layer can be made of a synthetic resin, a flooring material excellent in unevenness following property that absorbs unevenness on the laying surface can be easily manufactured by appropriately adjusting the thickness and hardness thereof.

  In the “joining” in the present invention, for example, when the upper layer and the frame material, and the frame material and the lower layer are fixed together through an adhesive, or when the components are fixed together by welding such as solvent welding or heat welding. Etc. are included.

  Further, the flooring according to the present invention is preferably formed by joining the upper layer and the frame member by thermal welding and joining the frame member and the lower layer by thermal welding.

  According to such a configuration, the upper layer, the frame member, and the lower layer are integrally formed by heat welding, so that the joint portion (welded portion) between the upper layer and the frame member and the joint portion (welded portion) between the frame member and the lower layer are formed. Compared with the case of joining with an adhesive, it can be integrated more firmly. This makes it possible to easily manufacture a high-strength flooring material that can withstand the weight of a heavy object.

  Further, in the flooring according to the present invention, the frame member may be formed in an annular shape so as to form the housing portion.

  According to such a configuration, since the frame member is configured in an annular shape, the frame member surrounds the side portion of the electric device as a part of the accommodating portion only by welding the frame member to the upper layer and the lower layer. This makes it possible to reduce the work process and easily manufacture the frame material.

  In addition, the flooring according to the present invention can employ a configuration in which the frame member has a wiring housing portion that houses wiring of an electrical device housed in the housing portion.

  According to such a configuration, by forming the wiring housing portion in the frame material, it is possible to perform the flooring work without the wiring being in the way.

  In addition, the flooring according to the present invention can employ a configuration in which a protective member for protecting an electrical device is provided in the housing portion.

  According to such a configuration, the function of the electric device can be maintained for a long period of time by protecting the electric device with the protective member.

  In addition, the present invention is a method for manufacturing a flooring material that includes an upper layer, a lower layer, and a frame member provided between the upper layer and the lower layer, and that can accommodate electrical equipment therein, and the upper layer and the frame member In addition, by joining the frame material and the lower layer, an accommodation portion that accommodates an electric device is formed by the upper layer, the frame material, and the lower frame.

  According to such a configuration, the upper layer and the frame material are welded, and the frame material and the lower layer are welded, thereby forming an accommodating portion that accommodates an electrical device therein, thereby withstanding the weight of a heavy object. High-strength flooring that can be manufactured easily. In addition, by forming the lower layer with a synthetic resin, it is possible to easily manufacture a flooring material that is excellent in unevenness following the unevenness of the laying surface by appropriately adjusting its thickness and hardness.

  According to the present invention, it is possible to easily manufacture a flooring material that can accommodate an electric device with a simple configuration, has an unevenness to absorb unevenness of a laying surface, and can withstand the weight of a heavy object at the same time. become.

It is a longitudinal cross-sectional view of a flooring. It is a top view of a frame material. (A) is an end view of the side part of the frame material corresponding to FIG. 2, (b), (c) is an end view of the side part showing another example of the frame material. It is a top view showing the state at the time of constructing a plurality of flooring materials.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. 1 to 4 show an embodiment of a flooring according to the present invention.

  As shown in FIG. 1, the flooring 1 is configured so that a predetermined electrical device E can be accommodated therein. Here, the electric device E includes all devices that perform a predetermined function using electricity. Examples of the electrical equipment E include lighting equipment, air conditioning equipment, acoustic equipment, sensors, floor power generation boards, circuit boards that perform various other functions, electronic equipment, and the like.

  The flooring 1 includes an upper layer 2, a lower layer 3, a frame member 4 provided between the upper layer 2 and the lower layer 3, an accommodating portion 5 that can accommodate the electric device E, and a protective member 6 for protecting the electric device E. Have

  The upper layer 2 has a surface (upper surface) 2a that constitutes a floor surface, and is made of synthetic resin, for example, in a square shape in plan view. As the upper layer 2, a tile carpet (TCP) or a resin tile is used. When a tile carpet is used for the upper layer 2, a tufted shape, a woven shape, or a needle punch shape using a material such as nylon, PP, acrylic, PET, or wool as a pile material is used.

  Further, as the backing material, PVC, polyester, synthetic rubber, EVA, olefin and other various materials can be used. Further, the upper layer 2 made of a tile carpet may contain a material such as glass fiber or glass net in order to stabilize the dimensions in terms of structure. In this case, the thickness of the upper layer 2 is desirably 2 to 12 mm, and more desirably 3 to 10 mm.

  When resin tiles are used for the upper layer 2, all thermoplastic resins can be used as the material, but vinyl chloride, rubber, and olefin thermoplastic resins are particularly durable and have non-landscape characteristics. Are preferably used. In addition, as for its structure, it has a printed layer including a combination of a clear layer, a printed layer, an intermediate layer, a base layer, and uses a design expression such as a resin kneading or spraying method such as chip spraying or plain color, which is durable From the viewpoint of design, it is desirable. In this case, the thickness of the upper layer 2 is desirably 0.5 to 7 mm, and more desirably 1 to 5 mm. Moreover, when vinyl chloride is used for the upper layer 2, the hardness is Shore hardness A40-100. In addition, by providing glass fiber or glass net in the intermediate layer or lower layer, the strength against pressure from the top increases, so the effect of protecting the circuit accommodated in the flooring increases, and the dimensional stability against tile temperature change Can be secured.

  Since the lower surface (outer surface) 3b of the lower layer 3 is in contact with the installation surface of the flooring 1, the functions of the lower layer 3 are to protect the electrical equipment E accommodated in the accommodating portion 5, non-land followability, adhesiveness, and the like. Desired. For this reason, it is desirable that the lower layer 3 is formed in a sheet shape by a synthetic resin such as soft vinyl chloride. The lower layer 3 is formed in a quadrangular shape in plan view, like the upper layer 2. In this case, the thickness of the lower layer 3 is desirably 0.1 to 3 mm, and more desirably 0.5 to 2 mm. If the thickness of the lower layer 3 is too thin, there is a risk that the protection of the electric device E will be insufficient, and if it is too thick, there is a risk that sufficient uneven land followability cannot be obtained.

  The addition amount of the plasticizer in the lower layer 3 is preferably about 5 to 70 phr, more preferably 10 to 60 phr. If the amount of plasticizer added is too small, the flexibility of the resin may be reduced and sufficient uneven trackability may not be obtained. Conversely, if the amount added is too large, the resin will be too soft and the electrical equipment E will be protected. May be insufficient. Further, the amount of filler added is preferably 20 to 500 phr, more preferably 50 to 150 phr in consideration of mechanical strength characteristics such as tearing. If the amount of filler added is too small, the dimensional stability, temperature sensitivity, flexibility, and mechanical strength may be reduced. The decrease in temperature sensitivity referred to here means a phenomenon in which the flooring material becomes too hard at a low temperature, resulting in poor trackability. In particular, if the mechanical strength becomes too low, there is a risk that the protection of the electrical device E will be insufficient. On the other hand, if the addition amount is too large, the resin hardness is increased and sufficient uneven surface followability may not be obtained.

  Moreover, you may comprise the lower layer 3 with the nonwoven fabric by needle punch, felt, etc. In this case, the thickness of the lower layer 3 is desirably 0.5 to 10 mm, and more desirably 1 to 5 mm. By forming the lower layer 3 with a non-woven fabric or forming irregularities (embosses) on the lower surface 3b, the effect of preventing misalignment during construction, and the biting property of the adhesive when laid using an adhesive or adhesive An improvement effect can be obtained. In particular, when the biting property of the adhesive is improved, the adhesiveness with the base surface is improved, so that the unevenness following property can be further improved.

  On the lower surface (outer surface) 3b of the lower layer 3, as an anti-slip means, an adhesive, an adsorbent made of foam, a rubber / olefin elastomer, or a double-sided adhesive tape may be laminated. Thereby, when the flooring 1 is placed on the installation surface, the flooring 1 can be fixed without sliding against the installation surface by bringing them into contact with each other.

  Laying with adhesives, adsorbents, elastomers, and double-sided adhesive tape makes it easier to peel off the flooring material once attached to the base, compared to construction using adhesive. The point is that it is very easy to correct the position. For this reason, laying with an adsorbent or an adhesive is widely used for construction of floor tiles and tile carpets.

  In particular, the construction using the adsorbent, the elastomer, and the double-sided adhesive tape can be applied in advance to the floor of the floor at the factory where the floor is manufactured, and the process of applying and drying the adhesive or the adhesive on site can be omitted. If the on-site coating / drying process can be omitted, the working time and man-hours can be greatly reduced, so the construction efficiency is greatly improved.

  However, construction with adhesives, adsorbents, elastomers, and double-sided adhesive tape is easy to peel off the adhered flooring, but if the flooring is uneven or has a step, the flooring cannot follow the unevenness. , Only when it is stepped on, it will temporarily move into the recess and then move away, causing unpleasant flooring of the sticky material. When the configuration of the present invention is used, it is possible to ensure the followability of the ground to the unevenness even though the electrical equipment is accommodated, and thus it is possible to suppress the occurrence of unpleasant floor noise.

  As shown in FIG. 2, the frame member 4 is formed in an annular shape having a quadrangular shape in plan view. The frame member 4 is made of a synthetic resin harder than the upper layer 2. As for the hardness of the frame material 4, Shore hardness D50-100 is desirable, More preferably, it is D60-85. If the hardness of the frame material 4 is too low, the frame 4 may be deformed when the floor material is stepped on, and the housed electrical equipment may be damaged. If the hardness is too high, the unevenness of tracking may be reduced.

  The housing part 5 is formed by joining the upper layer 2 and the lower layer 3 to the frame member 4. The means for performing the joining is not particularly limited, and examples thereof include welding, adhesion, and the like, and particularly, welding that has a strong joining force and can maintain the strength of the entire flooring is desirable. In addition, the processing by welding can be suitably used in the present invention because there is little possibility of peeling even if the entire flooring is deformed during follow-up. In particular, the joining by welding can maintain hermeticity with high strength stably over a long period of time. For this reason, even if it is used in a place where there is a lot of dust, etc. or in a high-humidity environment, the surrounding dust, moisture, etc. do not enter the interior of the flooring, reducing the reliability of the stored electrical equipment. It can be used for a long time without causing Moreover, it is preferable to join by welding also in terms of inexpensive equipment and high productivity.

  As a welding method, there are a method using a solvent and a method using heating, but a heating method that is easy to process and has a strong bonding strength can be suitably used in the present invention. Examples of the welding include locally possible heating welding such as welding with a high-frequency welder, welding with a high-pressure press, welding with an ultrasonic welder, and heat sealing. Such locally possible heat welding can be performed with high strength without damaging the heat transmitted to the electrical equipment accommodated in the floor material to a minimum. As the locally possible heat welding, welding by a high frequency welder is preferable.

  The heat welding process using a high frequency welder device is a method in which a material is placed between electrodes, a high frequency voltage is applied, and the material is heated and pressed using heat generated by intense friction between molecules. When a high-frequency welder is used, various devices are commercially available, so it is easy to cope with various forms of welding, such as the range and strength of welding, and only the locations where welding is desired are concentrated. Since it can heat, it can suppress that an internal electric device is damaged at the time of manufacture. Examples of the high-frequency welder include KW-4000T (manufactured by Seidensha Electronics Co., Ltd.), LW5500-APH (manufactured by Quinlight Electronics Seiko Co., Ltd.), VW5000 (manufactured by Yamamoto Vinita Co., Ltd.), and the like. Such a high-frequency welder device has an elongated bar that can be moved up and down above a sheet mounting table. A sheet to be welded is overlaid on the sheet mounting table, and a stamp or cutting die according to the shape of the part to be bonded is attached to the bar, and an insulator (sheet The underlay) is placed, the bar is lowered, the sheet is brought into contact with the mold, and a high frequency current having a specific output and a specific frequency is applied to perform dielectric welding. If you want to cut off the edge of the welded part, use a cutting blade (die) with a slightly sharper outer edge than the commonly used air blade (die), and simultaneously cut by welding alone. If not, use a die with a flat bottom.

Conditions such as temperature, pressure, pressing time, frequency, etc. in processing may be appropriately determined so as to obtain a desired strength by conducting a preliminary test, but in the present invention, while avoiding damage to an internal electric device. In order to obtain a desired welding strength, it is preferable to perform hot welding for 3 to 12 seconds in a dry heat range within a temperature range of 130 to 160 ° C. and a pressure range of 1 to 100 kg / cm ² . Moreover, it is preferable to use the frequency in the range of 10-50 MHz as the frequency at the time of applying a high frequency voltage between electrodes. If it is less than 10 MHz, it is not heated sufficiently and softening becomes insufficient. If it exceeds 50 MHz, the oscillator that oscillates a high frequency becomes complicated and large, and the cost of the apparatus becomes very high, which is economically disadvantageous.

  In addition, when using tile carpet as the surface material, if high-frequency welder processing and ultrasonic welder processing are used, it melts leaving the fiber form of the pile yarn at the weld location, and the surface of the molten adhesive layer generated by the melting is uneven. It is also possible to apply a handle to the substrate and impregnate the base fabric to treat the edge. In particular, it is preferable to use a high-frequency welder device because the insulator itself can generate heat internally by high-frequency dielectric heating. In order to leave the fiber form of the pile yarn, a skin layer having a pile yarn and a backing layer were laminated between a smooth flooring substrate and a mold formed on the uneven surface. Heat welding process is performed across the carpet. When a high frequency welder electrode was connected to both the flooring substrate and the mold formed on the uneven surface, and a high frequency voltage was applied between the electrodes, the pile yarn of the skin layer was softened by high frequency dielectric heating. By cooling later, a three-dimensional pattern formed with an uneven surface can be formed on the carpet surface.

  The frame member 4 is made of the same material as the upper layer 2 and the lower layer 3 or a material having good compatibility with the upper layer 2 and the lower layer 3 so that the frame member 4 can be easily welded to the upper layer 2 and the lower layer 3. As the material of the frame member 4, for example, acrylic resin, nylon resin, ABS resin, polyester resin, or the like is used.

  Further, for example, an EVA-based, polyamide-based, polyurethane-based or other hot-melt resin may be used as an adhesive layer and welded between the frame material 4 and the upper layer 2 or between the frame material 4 and the lower layer 3. In this case, since the difference in compatibility can be alleviated by the adhesive layer, the upper layer 2 and the frame material 4 or the lower layer 3 and the frame material 4 may be made of different resin materials having low compatibility. .

  The thickness of the frame member 4 (indicated by t in FIG. 2) is sufficient to ensure sufficient strength to support the load applied to the upper layer 2, and the electric device E in the flooring 1 has a sufficient function. Is preferably 3 to 50 mm, more preferably 5 to 30 mm, and most preferably 10 to 25 mm. Moreover, when the thickness of the frame material 4 is too thick, there is a possibility that the uneven trackability may be lowered.

  As shown in FIGS. 2 and 3, on one side of the rectangular frame member 4, a wiring port for allowing the wiring 10 connected to the electric device E accommodated in the accommodating portion 5 to pass inside and outside the flooring 1. 11 is formed. As shown in FIG. 3A, the wiring port 11 is a recess 11 a formed at a predetermined depth from one end (upper end) in the vertical direction of the frame member 4.

  The wiring port 11 is not limited to the concave portion 11a, and may be a through hole 11b penetrating in the thickness direction of the frame member 4 as shown in FIG. Moreover, the wiring port 11 may be a gap 11c formed by dividing one side of the frame member 4 as shown in FIG.

  On the outer side surface 4 a of the frame member 4, a wiring accommodating portion 12 that accommodates the wiring 10 of the electric device E accommodated in the accommodating portion 5 is formed. The wiring housing portion 12 is a recess formed by being recessed in the thickness direction from the outer surface 4 a of the frame member 4. Moreover, the wiring accommodating part 12 is formed as a linear concave strip along the longitudinal direction of each edge | side of the frame material 4, as shown in FIG. In the present embodiment, the wiring housing portion 12 is configured in a ring shape according to the ring shape of the frame member 4. Moreover, since this wiring accommodating part 12 is connected and formed with the wiring port 11 as shown to Fig.3 (a), the wiring 10 which passed through the wiring port 11 as shown in FIG. Wiring can be performed without exiting the projection plane. The specific configuration of FIG. 4 will be described later.

  The frame member 4 is configured to have a quadrangular shape in sectional view, and one end surface (upper surface) in the vertical direction is a bonding surface (hereinafter referred to as “first bonding surface”) 4 b bonded to the upper layer 2. Further, the other end surface (lower surface) in the vertical direction of the frame member 4 is a bonding surface (hereinafter referred to as “second bonding surface”) 4 c bonded to the lower layer 3. The first bonding surface 4b is bonded to the back surface (lower surface) 2b of the upper layer 2 by welding, and the second welding surface 4c is bonded to the surface (upper surface) 3a of the lower layer 3 by welding. Since the upper layer 2, the frame member 4, and the lower layer 3 are joined by welding to form an integral box-shaped resin structure, it is not easily crushed by pressure from above and below, but is deformed as a unit, so that it is within a certain range. Can be followed.

  The accommodating portion 5 is a space formed inside the upper layer 2, the frame material 4, and the lower layer 3. More specifically, the accommodating portion 5 welds the back surface (lower surface) 2b of the upper layer 2 and the first bonding surface 4c of the frame material 4 to the second bonding surface 4c of the frame material 4 and the surface (upper surface) of the lower layer 3. ) In the internal space of the flooring 1 formed by being welded with 3a, it is surrounded by the back surface (lower surface) 2b of the upper layer 2, the inner surface 4d of the frame member 4, and the surface (upper surface) 3a of the lower layer 3. is there.

  In the accommodating portion 5, it is desirable that a gap (interval) 13 is provided between the side surface of the electric device E to be accommodated and the inner side surface 4 d of the frame member 4. Even if the gap 13 is expanded due to the heat of the electric device E or there is a dimensional error, the electric device E can be reliably and reliably attached to the electric device E or the frame material 4 without causing unnecessary stress. Can be accommodated. The gap (interval) 13 is desirably 0.5 to 5 mm, and more desirably 0.5 to 3 mm.

  The protection member 6 is provided between the electric device E and the lower layer 3 and functions as a buffer member (cushion member) that absorbs an impact applied to the electric device E. The protective member 6 is made of, for example, a foam made of a synthetic resin such as urethane, vinyl chloride, or PE, or a non-woven fabric such as needle punch or felt. Moreover, this protective member 6 can function also as a heat insulating material, for example, when the electric equipment E is a heating equipment.

  Depending on the type of the electric device E, the electric device E may be fixed and supported on the upper layer 2 without being supported by the lower layer 3. In this case, the protection member 6 may not be provided between the electric device E and the lower layer 3. In this case, it is desirable to provide a gap between the electric device E fixed to the upper layer 2 and the lower layer 3.

  FIG. 4 shows a plan view when a floor surface is formed by arranging a plurality of flooring materials 1 side by side. As shown in FIG. 4, a plurality (four in the illustrated example) of flooring materials 1 are arranged side by side on the installation surface. Each flooring 1 is in contact with the other flooring 1 at its side surface. A connector 14 to which the wiring 10 can be connected is provided on the side portion of the electric device E accommodated in the accommodating portion 5, and the flooring materials 1 are connected in series by the connector 14 and the wiring 10. In addition, each flooring 1 is connected to a power source 15 via a wiring 10.

  Hereinafter, the manufacturing method of the flooring 1 is demonstrated. In addition, about the manufacturing method of the flooring 1, the case where the upper layer 2 and the frame material 4 and the frame material 4 and the lower layer 3 are joined by heat welding is illustrated. For manufacturing the flooring 1 of the present embodiment, a welding apparatus such as a high frequency welder apparatus, an ultrasonic welder apparatus, or a hot press apparatus is used.

  In order to manufacture the flooring 1, first, the back surface (lower surface) 2b of the upper layer 2 and the first bonding surface 4b of the frame member 4 are welded by a welding apparatus. Next, the protective member 6 is placed on the surface (upper surface) 3 a of the lower layer 3, and the electric device E is placed on the protective member 6.

  Next, the wiring 10 of the electric device E is passed through the wiring port 11 of the frame member 4, and then the second bonding surface 4c of the frame member 4 is brought into contact with the surface (upper surface) 3a of the lower layer 3, and these are welded by a welding apparatus. . As a result, the upper layer 2, the frame member 4, and the lower layer 3 are integrated, and the accommodating portion 5 surrounded by the upper layer 2, the frame member 4, and the lower layer 3 is formed. At this time, since the part heated by the welding apparatus is limited to the upper and lower surfaces 4b and 4c of the frame member 4, the electric device E is not adversely affected. By adopting such a manufacturing method, it is possible to reduce the number of parts as much as possible and to easily manufacture a floor material that houses electrical equipment. In addition, since the manufacturing apparatus used is only the welding apparatus, the work can be performed in the same process, and the workability is also good.

  At this time, it is desirable that the end surface of the upper layer 2, the outer surface 4 a of the frame member 4, and the end surface of the lower layer 3 are flush with each other. When these end surfaces are flush with each other, a gap is generated between the flooring materials 1 when laying, and it is possible to prevent the occurrence of so-called “joint clearance” and deformation of the end portions due to depression from above.

  Thereafter, the wiring port 11 is closed by a closing means such as caulking. As this closing means, packing or the like may be used in addition to caulking. By closing the wiring port 11, the electric device E is sealed, so that it is possible to prevent water, dust, and the like from entering from the outside to have an adverse effect. At this time, when the wiring port 11 is closed by the closing means, it is desirable that the accommodating portion 5 inside the flooring 1 be maintained in an airtight state. By setting it in an airtight state, air is sealed in the accommodating portion 5. The sealed air acts against the pressure from the inside when the upper surface of the flooring 1 is stepped on, and can reduce deformation of the central portion of the flooring 1. Therefore, even when the present invention is applied to a relatively large flooring 1 and the distance between the center of the flooring 1 and the frame 4 is increased, the central part is recessed due to the action of air sealed inside the flooring 1 and the It is possible to prevent the device E from being hit.

  In addition, the wiring 10 which has come out of the floor material 1 from the wiring port 11 is accommodated in the wiring accommodating portion 12 after the upper layer 2, the frame material 4 and the lower layer 3 are welded.

  The floor material 1 which accommodated the electric equipment E in the inside is completed by the above.

  In addition to the manufacturing method described above, the surface 3a of the lower layer 3 on which the protective member 6 and the electric device E are placed and the second joint surface 4c of the frame member 4 are welded to connect the wiring 10 of the electric device E to the frame member. It is also possible to manufacture the flooring 1 by closing the wiring port 11 after the first joint surface 4b of the frame member 4 and the back surface (lower surface) 2b of the upper layer 2 are welded through the wiring port 11 of 4. It is.

  In addition to the manufacturing method described above, the protective member 6 and the electric device E are mounted on the surface 3a of the lower layer 3 and the wire 10 of the electric device E is passed through the wiring port 11 of the frame member 4, The upper layer 2 is placed on the frame member 4, and the contact portion between the upper layer 2 and the first joint surface 4 b of the frame member 4 in the state where the lower layer 3, the frame member 4, and the upper layer 2 are overlapped, and the frame member 4. It is also possible to manufacture the flooring 1 by simultaneously welding the contact portion between the second joint surface 4c and the lower layer 3 using a welding device. If welding is performed at the same time, the working time can be further shortened.

  In addition, the flooring 1 manufactured as mentioned above can comprise the floor (floor surface) of a predetermined area by arranging two or more in parallel at the installation surface of a construction place. At this time, the floor materials 1 arranged side by side are in close contact with each other, but since the wiring 10 is accommodated in the wiring accommodating portion 12, the wiring 10 also falls within the range of the projected area of the floor material. It does not hinder the close contact between the flooring materials 1. The wiring 10 that comes out of the flooring 1 and is accommodated in the wiring accommodating portion 12 is connected to the wiring 10 of another flooring 1, other external devices, or various devices such as a power supply 15.

  According to the floor material 1 and the manufacturing method thereof described above, the upper layer 2 and the frame material 4 are welded, and the frame material 4 is welded and joined to the lower layer 3 so that the electrical equipment is attached to the housing portion 5 inside. Since it is manufactured in a state where E is accommodated, the number of parts can be reduced as much as possible, and the manufacturing can be easily performed without complicating the assembling work. Moreover, by joining the upper layer 2, the lower layer 3, and the frame member 4 by heat welding, it is possible to easily manufacture a high-strength flooring material that can increase the strength of the joint portion and can withstand the weight of a heavy object. It becomes like this.

  In particular, when a flooring using a metal or wooden frame such as aluminum is compared with a flooring 1 according to the present invention, the flooring using a metal or wooden frame is electrically In order to form the accommodating portion 5 that accommodates the device E, it is necessary to cut metal or wood. On the other hand, the flooring 1 according to the present invention is composed of the upper layer 2, the frame material 4, and the lower layer 3, which are constituent elements, all made of synthetic resin, and can be integrally formed by welding. The cycle is short and the productivity is excellent. In addition, since the flooring 1 according to the present invention can be formed of the same kind of resin for all materials, it is easy to recycle as long as the stored electrical equipment E is taken out.

  In addition, by configuring the lower layer 3 with a synthetic resin, it is possible to easily manufacture a flooring material excellent in unevenness following property that absorbs unevenness on the laying surface by appropriately setting the thickness and hardness.

  Further, since the frame member 4 is formed in an annular shape, when the frame member 4 is joined to the upper layer 2 and the lower layer 3, the frame member 4 serves as a part of the housing portion 5 and is on the side of the internal electrical equipment E. Enclose the part almost all around. Therefore, by forming the frame member 4 in an annular shape, the housing portion 5 that houses the electrical device E can be easily formed simply by joining the frame member 4 to the upper layer 2 and the lower layer 3, and in this respect, Useful.

  Unlike floor materials using metal or wooden frames such as aluminum, the floor material 1 according to the present invention is formed of an integral resin with the frame 4 and the upper and lower surfaces, so that the pressure from above is reduced. Despite being hard to be crushed, it has moderate flexibility, so it can keep track of unevenness. In addition, it is lightweight due to the resin integrated structure, and has durability and material characteristics as a flooring material.

  Moreover, since the frame material 4 has the wiring accommodating part 12 which accommodates the wiring 10 of the electric equipment E, when arranging several flooring 1 in parallel and comprising a floor in a predetermined construction place, each floor Installation of the flooring 1 and wiring work can be performed without the wiring 10 of the material 1 being in the way.

  Moreover, since the protective member 6 for protecting the electrical equipment E is provided in the housing part 5, the impact applied to the electrical equipment E is reduced, and the electrical equipment E is prevented from being damaged. The function of the electric device E can be surely exhibited.

  Further, after joining the frame member 4, the upper layer 2, and the lower layer 3, the wiring port 11 is closed by the closing means, and the accommodating portion 5 of the flooring 1 is maintained in an airtight state. When added, the air filling the housing 5 absorbs the impact. By this air cushion effect, vibration and impact of the flooring 1 can be reduced, and transmission of vibration of the electric device E in the housing portion 5 can be prevented and protected. In addition, it can have heat insulation and soundproofing by air sealed inside.

  In addition, the upper layer 2, the lower layer 3 and the frame material 4 are made of synthetic resin to form the flooring 1, so that compared to the case of other materials, wear resistance, impact resistance, water resistance, design, Therefore, the flooring material 1 can be manufactured not only for housing use but also suitable for non-residential use environments such as offices, stores, schools, hospitals and the like where earth and sand enter by soil foot.

  Moreover, since the thickness of the lower layer 3 is 0.1 to 3 mm, the lower layer 3 can be easily peeled off by cutting the lower layer 3 with a blade such as a cutter. As a result, the electric device E taken out of the flooring 1 can be removed from the housing 5 and reused. Moreover, when the addition amount of the plasticizer added to the lower layer 3 is set to 5 to 70 phr, the lower layer 3 is easily incised by the blade, which is also useful in this respect.

  In addition, by adjusting the vertical lengths of the upper layer 2, the lower layer 3, and the frame material 4, the vertical thickness of the floor material according to the present embodiment is set to the thickness of the existing floor material (for example, 5 mm, 12 mm). By making it the same, a part or all of the existing floor surface (floor) can be replaced with the flooring 1 according to the present embodiment, which is particularly useful when renovating an existing house, for example.

  In addition, this invention is not restricted to said embodiment, A various change and deformation | transformation are possible.

  For example, in the above-described embodiment, an example in which the frame member 4 is formed in a quadrangular annular shape has been described. However, the present invention is not limited to this, and the frame material 4 is configured in a triangular shape or other polygonal shape, a circular shape, an elliptical shape, or an irregularly shaped annular shape. be able to.

  In addition, as shown in FIG. 2, the “annular” in the present invention is not only in a state of being connected in an endless and continuous state in advance, but for example, as shown in FIG. Even if the middle part is divided through the wiring port 11 before the connection, the frame material 4 is joined to the upper layer 2 and the lower layer 3, and the wiring port 11 is closed by the closing means, and then annular (continuous). The case where it joins is also included.

  Therefore, for example, one side of the quadrangular frame 4 is configured separately from the other three sides, and after the three sides are joined to the upper layer 2 and / or the lower layer 3, the remaining one side is defined as the three sides. By joining the upper layer 2 and the lower layer 3, the frame member 4 can be formed in an annular shape. Naturally, each side of the quadrangular frame 4 is separated, or two sides are separated and joined to each other to form an annular shape, and joined to the upper layer 2 and lower layer 3 to form a floor. Material 1 may be manufactured. In addition, after a part of the frame material 4 that is separated is joined to the upper layer 2 and the other part is joined to the lower layer 3, the parts of the frame material 4 are joined to each other to form an annular shape. Good.

  In the above embodiment, the case where the wiring port 11 is the gap 11c formed by dividing the recess 11a, the through hole 11b, and the middle part of the frame material 4 is illustrated. 11 may be provided with a connector, and after the flooring 1 is configured, wiring work may be performed via this connector.

  In the above embodiment, an example in which one wiring port 11 is formed in the frame member 4 is shown. However, the present invention is not limited thereto, and a plurality of wiring ports 11 are formed on each side of the frame member 4 in the frame member 4. Alternatively, a plurality of wiring openings 11 can be formed on one side of the frame member 4.

  In the above-described embodiment, an example in which the concave portion is formed on the outer surface 4a of the frame member 4 to form the wiring accommodating portion 12 is shown, but the present invention is not limited to this. For example, when the frame member 4 is joined to the upper layer 2 and the lower layer 3 by forming the outer shape of the frame member 4 to be smaller than that of the upper layer 2 and the lower layer 3, the upper layer 2 extends from the outer surface 4 a of the frame member 4 in plan view. And the lower layer 3 protrudes, and a recessed portion is formed by the protruding upper layer 2 portion, the lower layer 3 portion, and the outer surface 4 a of the frame member 4. It is also possible to use this concave portion as the wiring housing portion 12.

  In the said embodiment, although the example which sealed the wiring port 11 with the closure means was shown, but the accommodating part was shown, it is not necessarily restricted to this, if waterproofness can be ensured.

  On the contrary, the air cushion effect described above may be further improved by enclosing compressed air in the accommodating portion 5. In this case, an inlet for injecting air into the accommodating portion 5 is provided on the outer surface 4 a of the frame member 4. The inlet has a check valve that allows inflow of air at a predetermined pressure from the outside of the frame member 4 to the housing portion 5 and disables outflow of air from the housing portion 5 to the outside. In this case, a recess that is recessed in the thickness direction is formed on the outer surface 4a of the frame member 4 so that the injection port does not protrude from the outer surface 4a of the frame member 4, and the injection port is provided in this recess. By increasing the air cushion effect in this way, it is possible to further reduce the weight of the constituent material.

  When the electrical device accommodated in the accommodating portion is, for example, a lighting device, the upper layer 2 is made of a material that is transparent or semi-transparent or translucent and excellent in translucency in order to transmit the light. It is desirable. Further, when the housed light source has a high luminance such as an LED, it can be used even if it is an opaque resin as long as a certain level of translucency can be secured.

  In the above-described embodiment, an example in which the plurality of flooring materials 1 are connected in series with the power supply 15 has been described. However, the present invention is not limited to this, and various connection methods can be adopted depending on the application and construction environment.

  In the above embodiment, an example in which the upper layer, the frame member, and the lower layer are integrally bonded by heat welding has been shown. However, the present invention is not limited to this, and for example, the upper layer and the frame member and the frame member and the lower layer are bonded by an adhesive. These may be joined together.

  Examples of the present invention will be described below. However, the present invention is not limited to the following examples.

Example 1
The frame material 4 is made of hard polyvinyl chloride having a plasticizer part number of 5 phr, a thickness of 10 mm, and a height (length in the vertical direction, the length from the first joint surface 4b to the second joint surface 4c) of 8 mm. Used was a rectangular shape in plan view of 500 mm. A concave portion 11 a was formed as a wiring port 11 on one side of the frame member 4.

A high-frequency welder with an output of 15 kW scale, with the first joint surface 4b of the frame member 4 facing upward, a nylon pile having a glass nonwoven fabric layer, and a tile carpet having a thickness of 6.5 mm placed on the first joint surface 4b as the upper layer 2. Second bonding of the frame material 4 under the conditions of a current value of 0.4 to 1.0 A, a welding time of 6 seconds, a cooling time of 20 seconds and a maximum press load of 49 × 10 ⁴ Pa (5 kgf / cm ² ) using the apparatus. A contact portion between the surface 4c and the back surface (lower surface) 2b of the upper layer 2 was welded.

  After the frame material 4 and the upper layer 2 are welded, the second joint surface 4c of the frame material 4 is turned upward, and a heater sheet having a thickness of 3 mm is fixed to the center of the back surface 2b of the upper layer 2 with an adhesive as the electric device E, A soft vinyl chloride sheet having a thickness of 1.2 mm, a plasticizer part of 20 phr, and a filler amount of 100 phr is placed on the second joining surface 4c as the lower layer 3 and is subjected to the same conditions as in the case of welding the frame material 4 and the upper layer 2 by a high frequency welder device. A contact portion between the second joint surface 4 c of the frame member 4 and the lower layer 3 was welded.

  After the frame member 4 and the lower layer 3 are welded, the upper layer 2 portion and the lower layer 3 portion that protrude from the outer surface 4a of the frame member 4 are cut out, and the outer surface 4a of the frame member 4 and the end surfaces of the upper layer 2 and the lower layer 3 are cut out. And the end face of the same.

  Thereafter, the wiring port 11 was closed by a caulking process, and the flooring 1 according to Example 1 was manufactured as described above. When the floor material 1 of Example 1 produced in this way was laid on the mortar base surface, the followability to unevenness was good. Moreover, even if it walked on the flooring 1, the heater sheet accommodated was not damaged.

(Example 2)
As the upper layer 2, a resin floor was used in which a glass woven fabric layer was laminated inside. The upper layer 2 includes a clear layer of 0.3 mm, a print layer of 0.1 mm, an intermediate layer (including a glass fabric) of 1.2 mm, and a base layer of 1.4 mm, and has a total thickness of 3 mm.

  The frame material 4 and the lower layer 3 were made the same as in Example 1, and the flooring 1 according to the second example was manufactured under the same processing conditions and the same process as in the first example. When the flooring material 1 of Example 2 produced in this way was laid on the mortar base surface, the followability against unevenness was good. Moreover, even if it walked on the flooring 1, the heater sheet accommodated was not damaged.

  DESCRIPTION OF SYMBOLS 1 ... Floor material, 2 ... Upper layer, 2a ... Upper layer surface (upper surface), 2b ... Upper layer back surface (lower surface), 3 ... Lower layer, 3a ... Lower layer surface (upper surface), 3b ... Lower layer lower surface (outer surface), 4 ... frame material, 4a ... outer side surface of frame material, 4b ... first joint surface, 4c ... second joint surface, 4d ... inner side surface of frame material, 5 ... housing portion, 6 ... protective member, 10 ... wiring, 11 ... Wiring port, 12 ... wiring housing part, 13 ... gap, 14 ... connector, 15 ... power supply, E ... electrical equipment, t ... thickness of frame material

Claims (6)

An upper layer, a lower layer, and a frame member provided between the upper layer and the lower layer,
The upper layer, lower layer, and frame material are made of synthetic resin,
A floor formed by joining an upper layer and a frame material and joining a frame material and a lower layer to form an accommodating portion for accommodating an electric device therein by the upper layer, the frame material, and the lower layer. Wood.   The flooring according to claim 1, wherein the upper layer and the frame member are joined by thermal welding, and the frame member and the lower layer are joined by thermal welding.   The flooring according to claim 1 or 2, wherein the frame member is formed in an annular shape so as to constitute the housing portion.   The floor material according to any one of claims 1 to 3, wherein the frame member has a wiring housing portion that houses wiring of an electrical device housed in the housing portion.   The flooring according to any one of claims 1 to 4, wherein the housing portion is provided with a protective member for protecting the electrical equipment. A method for producing a flooring material that includes an upper layer, a lower layer, and a frame member provided between the upper layer and the lower layer, and that can accommodate an electric device therein,
An upper portion, a frame material, and a frame material and a lower frame are joined to form an accommodating portion for accommodating an electrical device therein by the upper layer, the frame material, and the lower frame. Production method.

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