JP2011031570A5 - - Google Patents
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- Publication number
- JP2011031570A5 JP2011031570A5 JP2009182336A JP2009182336A JP2011031570A5 JP 2011031570 A5 JP2011031570 A5 JP 2011031570A5 JP 2009182336 A JP2009182336 A JP 2009182336A JP 2009182336 A JP2009182336 A JP 2009182336A JP 2011031570 A5 JP2011031570 A5 JP 2011031570A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- conductive adhesive
- layer
- metal
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 90
- 239000010410 layer Substances 0.000 claims description 80
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000007769 metal material Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009182336A JP5358785B2 (ja) | 2009-08-05 | 2009-08-05 | 両面導通粘着金属フィルムの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009182336A JP5358785B2 (ja) | 2009-08-05 | 2009-08-05 | 両面導通粘着金属フィルムの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011031570A JP2011031570A (ja) | 2011-02-17 |
JP2011031570A5 true JP2011031570A5 (enrdf_load_stackoverflow) | 2012-08-16 |
JP5358785B2 JP5358785B2 (ja) | 2013-12-04 |
Family
ID=43761120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009182336A Active JP5358785B2 (ja) | 2009-08-05 | 2009-08-05 | 両面導通粘着金属フィルムの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5358785B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102241950A (zh) * | 2010-05-14 | 2011-11-16 | 3M创新有限公司 | 电磁屏蔽胶带 |
JP5861790B1 (ja) * | 2015-02-25 | 2016-02-16 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005150626A (ja) * | 2003-11-19 | 2005-06-09 | Panac Co Ltd | 電磁バリヤー性弾性シート |
JP2005277145A (ja) * | 2004-03-25 | 2005-10-06 | Dainippon Ink & Chem Inc | 電磁波シールド用粘着シート |
JP2006210762A (ja) * | 2005-01-31 | 2006-08-10 | Dainippon Printing Co Ltd | 電磁波シールドフィルタ |
JP4884948B2 (ja) * | 2006-12-12 | 2012-02-29 | 藤森工業株式会社 | 電磁波シールド材ロール体及びその製造方法、ディスプレイ用電磁波シールドフィルム |
JP2009032923A (ja) * | 2007-07-27 | 2009-02-12 | Dainippon Printing Co Ltd | 表面を平坦化した、印刷法利用の電磁波シールド材 |
-
2009
- 2009-08-05 JP JP2009182336A patent/JP5358785B2/ja active Active
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