JP2011029673A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To correct and reduce a loss resulting from the collapse of cooperation between two beams. <P>SOLUTION: This electronic component mounting device calculates a printed circuit board position seen from beams 10A, 10B (a position where y has a position relation opposite to a mounting area occupancy time ratio of each beam) to set a position deviated to one of the beams as an optimal position. In a state that a chute 5C of a positioning section 5 moves to the deviated position to fix the position of the positioning section 5, a supply conveyor 4 which has received a printed circuit board P from an upstream device 7, moves a pair of chutes 4C in the Y direction along a guide 4B provided between a pair of fixing parts 4A through a drive circuit 4D using a drive motor 4E so as to connect the chute with the chute 5C of the positioning section 5, and passes it to the substrate positioning section 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

In the present invention, a pair of beams that can be moved in one direction by a driving source is provided with a mounting head that can be moved by the driving source in a direction along the pair of beams, and electronic components are attracted to the mounting head and mounted on a printed circuit board. The present invention relates to an electronic component mounting apparatus provided with a suction nozzle.

  This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1 and the like. The multifunctional electronic component mounting apparatus disclosed in, for example, an electronic component mounting apparatus including a pair of beams efficiently operates the apparatus. In order to do this, it is important to establish a balanced two-beam cooperative operation by allocating the number of component mounting points (product type / number) processed by each beam facing each other as evenly as possible to each beam. .

JP 2000-136904 A

  However, since the components are mounted on the printed circuit board positioned between the front and rear beams, inevitably colliding with each other between the opposing beams (displacement due to positional interference with the other beam) In many cases, the waiting time (non-operation time) occurs, which affects the length of the substrate finishing time. In order to increase the throughput, it is important to determine the optimal component arrangement (allocation). If it is a low-mix, high-volume production model, it is better to produce with the best parts layout over time. However, in the high-mix, low-volume production form, each time the model is switched, the layout of the parts is changed and two beams are allocated. In many cases, the setup work itself, such as optimizing the process, results in lost time from the overall perspective and affects production.

  In view of the above, the present invention has an object of correcting and reducing a loss caused by collapsing between two beams. In other words, if the component allocation between the two beams cannot be equalized and there is a bias, the coordinated balance can be adjusted by bringing the substrate positioning position to the beam side with the larger amount of component processing in advance. It is something to be realized.

  Therefore, according to the first aspect of the present invention, a pair of beams movable in one direction by a driving source is provided with a mounting head that can be moved by the driving source in a direction along the pair of beams, and the electronic component is sucked to the mounting head for printing. In the electronic component mounting apparatus provided with the suction nozzle to be mounted on the substrate, the electronic component mounting apparatus has a pair of chutes movable in the one direction, and the pair of chutes is one of the beams based on mounting data in the mounting area. A positioning unit that moves to a position that has been offset in advance and positions and fixes the printed circuit board for each type of the printed circuit board at the position that has been offset, and corresponds to the positioning unit after the printed circuit board is inherited from an upstream device. A supply cord that slides and moves the printed circuit board in the one direction to be connected to the chute of the positioning unit and to pass to the positioning unit. After the bearer and the printed board are delivered from the positioning unit, the downstream side apparatus slides in correspondence with the chute of the downstream apparatus and moves the printed board in the one direction so as to be connected to the chute of the downstream apparatus and the downstream side. A discharge conveyor for delivery to the side device is provided.

  According to the present invention, it is possible to correct and reduce a loss caused by collapsing between two beams.

It is a top view of the electronic component mounting apparatus which shows the state which passed the big printed circuit board from the supply conveyor to the positioning part. It is BB sectional drawing of FIG. It is a top view of the electronic component mounting apparatus which shows the state which passed the small printed circuit board from the upstream apparatus to the supply conveyor. It is a top view of the electronic component mounting apparatus which shows the state which passed the small printed circuit board from the supply conveyor to the positioning part. It is a control block diagram of an electronic component mounting apparatus. The schematic diagram of an electronic component mounting apparatus is shown.

  An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. Various electronic components are placed on a base 2 of the apparatus 1. A plurality of component supply units 3 that supply one by one to the component adsorption position) are arranged side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the groups of opposing units 3. The supply conveyor 4 conveys the printed circuit board P received from the upstream device 7 to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by the positioning unit 5 (not shown), the discharge conveyor 6 is conveyed.

  The positioning portion 5 is for positioning and fixing the printed circuit board P at a position preliminarily offset to a later-described beam 10A or 10B which has a larger component processing amount to the printed circuit board P. Along with both guides 5B provided between 5A, the pair of chutes 5C can be moved in the Y direction according to the size of the printed circuit board P independently by each drive motor 5E via each drive circuit 5D.

  The supply conveyor 4 is for transferring the printed board P to the board positioning unit 5 by moving the printed board P in the Y direction every time the printed board P is inherited from the chute of the upstream apparatus 7. 7, along the guide 4B provided between the pair of fixed portions 4A, the pair of chutes 4C are independently driven by the respective drive motors 4E via the respective drive circuits 4D, and the chutes 5C of the positioning portions 5 are respectively provided. And move in the Y direction so as to be connected to the substrate positioning unit 5.

  The discharge conveyor 6 is received by the downstream device 8 by moving the printed circuit board P delivered from the positioning unit 5 in the Y direction every time mounting of electronic components based on mounting data is completed in the positioning unit 5. After handing over the printed circuit board P from the positioning part 5, the pair of chutes 6C are connected to the drive motors 6E via the drive circuits 6D along the guides 6B provided between the pair of fixed parts 6A. Thus, each moves independently in the Y direction so as to be connected to the chute of the downstream device 8, and is transferred to the downstream device 8.

  Two drive motors are provided in the supply conveyor 4, the positioning unit 5, and the discharge conveyor 6. However, it may be configured such that each chute is moved by providing a single clutch.

  Reference numerals 10A and 10B denote a pair of beams that are long in the X direction. A screw shaft (not shown) is rotated by driving a Y-axis motor 21 via a drive circuit 20, and the positioning unit 5 is moved along a pair of left and right guides 11. The printed circuit board P and the component supply unit 3 of the component supply unit 3 are individually moved in the Y direction.

  Each of the beams 10A and 10B is provided with mounting heads 12A and 12B that move along a guide (not shown) by an X-axis motor 23 via a drive circuit 22 in the longitudinal direction, that is, in the X direction. Each mounting head 12A or 12B is equipped with a vertical axis motor 24 for moving the two suction nozzles 13 up and down, and a θ-axis motor 25 for rotating around the vertical axis. Accordingly, the suction nozzles 13 of the two mounting heads 12A and 12B can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.

  Reference numeral 14 denotes a component recognition camera for component position recognition, which is provided in correspondence with each of the mounting heads 12A and 12B, and how much the electronic component is displaced and held with respect to the suction nozzle 13 in the XY directions. In addition, the electronic component is imaged to recognize the position of the rotation angle. Reference numerals 15 and 15 denote nozzle stockers for storing various suction nozzles 13 for replacement of the suction nozzles 13.

  Each of the mounting heads 12A and 12B is provided with a board recognition camera 17, and images the marks in order to recognize the positions of the marks attached to the printed board P.

  Then, the cables and air tubes for the mounting heads 12A and 12 are placed in a parallel state and fixed with an adhesive to form a flat cable 16 and 16 with a substantially flat plate shape, and one end thereof is connected to each motor. Then, the other end is connected to a control circuit board (not shown) and an air supply source (not shown).

  Next, the control block diagram of FIG. 5 will be described. Based on the data stored in the RAM 31, the CPU 30 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 32. That is, the CPU 30 drives the X-axis motor 23 via the drive circuit 22, drives the Y-axis motor 21 via the drive circuit 20, and drives the θ-axis motor 25 via the drive circuit 26. The drive of the vertical axis motor 24 of the suction nozzle 13 is controlled via the drive circuit 27.

  Reference numeral 35 denotes a component recognition processing unit connected to the CPU 30 via the interface 33, and recognition processing of an image captured by the component recognition camera 14 is performed by the recognition processing unit 35 and processed by the CPU 30. The result is sent out. That is, the CPU 30 outputs an instruction to the component recognition processing unit 35 so as to perform recognition processing (calculation of the amount of misalignment) of the image captured by the component recognition camera 14 and receives the recognition processing result from the recognition processing unit 35. Is.

  A substrate recognition processing unit 34 recognizes an image captured by the substrate recognition camera 17 and is captured by the substrate recognition processing unit 34, and a processing result is sent to the CPU 30. That is, the CPU 30 outputs an instruction to the substrate recognition processing unit 34 to perform recognition processing (calculation of the amount of positional deviation, etc.) on the image captured by the substrate recognition camera 17, and the recognition processing result is output from the substrate recognition processing unit 34. It is what you receive.

  That is, when the amount of positional deviation is grasped by the recognition processing of the component recognition processing unit 35 and the board recognition processing unit 34, the result is sent to the CPU 30, and the CPU 30 outputs the Y-axis motor 21, the X-axis motor 23, and the θ-axis. By driving the motor 25, it is possible to correct the rotational angle position around the X and Y directions and the vertical axis.

  Here, the determination of the optimal position of the printed circuit board P in the Y direction will be described with the above configuration. First, the basic operations of the beams 10A and 10B are component adsorption, component recognition, and component mounting, and a multi-processing unit that processes a plurality of components in a single reciprocating operation so that the number of beam adsorption and mounting operations does not increase. Although the number of suction types is increasing, here, what is focused on determining the position of the printed circuit board P in the Y direction will be described regardless of whether it is a single mounting head or a multi mounting head.

  In the region (mounting area) where the two beams are shared by simulating the component mounting sequence assigned to the two beams 10A and 10B and executed by the individual beams based on the production model data (mounting data) for each printed circuit board P. Calculate the cumulative total of work hours.

  That is, the simulation is performed in the following manner, and will be described with reference to the schematic diagram shown in FIG. The position in the Y direction of the printed circuit board P is assumed that the center of the printed circuit board P in the Y direction is the center of the L dimension at the opening limit of both the chutes 5C (the position of L / 2 as viewed from the upper chute opening limit). The control command calculation values (speed / acceleration) of each axis such as the X axis and the Y axis, the component suction position and the mounting coordinate position of the component supply unit 3 are determined.

  Here, for each of the beams 10A and 10B, the operation pattern of one time is as follows, and this is repeated until all the component mountings that the user is responsible for are completed. An example of the operation of 1 beam that mounts a total of 5 points in 3 reciprocations is shown below: The first reciprocation (2 points mounting) is suction movement → suction → suction movement → suction → both parts recognition → mounting movement → mounting → mounting movement → Mounting, 2nd round-trip (2 point mounting) is suction movement → Suction → Suction movement → Suction → Recognition of both parts → Mounting movement → Mounting → Mounting movement → Mounting 3rd round-trip (1 point mounting) Nozzle replacement → suction movement → suction → part recognition → mounting movement → mounting → nozzle replacement → origin movement.

  In this sequence flow, the total time required for the beam indicated by “mounting movement” and “mounting” to occupy the mounting area is calculated for each of the beams 10A and 10B. Assume that MA is the cumulative mounting area occupation time of beam 10A, and MB is the cumulative mounting area occupation time of beam 10B, and the ratio: RATIO = MA / MB. The position where the printed circuit board position y seen from the beams 10A and 10B is opposite to the mounting area occupation time ratio of each beam may be calculated and set as the optimum position. In other words, y using the distances and dimensions shown in FIG.

  In this example, RATIO is determined based on the total mounting area occupation time by the beams 10A and 10B. However, simply, the ratio of the number of mounting points by the mounting heads 12A and 12B of the beams 10A and 10B or the beams 10A and 10B. It may be calculated as a ratio of the number of round trips to the mounting area. That is, the substrate position is preliminarily offset to the beam having the higher mounting point ratio, or the substrate position is preliminarily offset to the beam having the higher reciprocation frequency ratio. Further, the calculation and the storage of the calculation result may be performed manually or automatically (under the control of the CPU 30) by a program stored in the ROM 32.

  Since the interval y is calculated based on the above equation 1, and the position of the one or other chute is determined based on the calculated interval y, the position of the one or other chute is determined for each type of printed circuit board P. Can be appropriate.

  Thus, conventionally, the printed circuit board P is biased to the fixed chute side of the chute and is close to the beam 10A, but is far from the beam 10B. This has changed the concept of the fixed chute, which caused the loss of waiting time for mounting and other reasons, resulting in longer board finishing time, and the adsorption / mounting of the beam according to the Y dimension of the printed circuit board P Even if the strokes are equalized and the parts 10A and 10B are not evenly allocated, the printed circuit board finishing time can be shortened by deliberately biasing the board position so that the balance can be corrected. Improvements can be made.

  As described above, the positioning position of the printed circuit board P by the positioning unit 5 in the Y direction is determined according to the type of the printed circuit board P, that is, the mounting data stored in the RAM 31 and the component supply unit 3 group stored in the RAM 31 as well. The positioning position of the printed circuit board P in the Y direction is calculated based on the suction line position in FIG. 1, the opening limit position of each chute 5C stored in the RAM 31 and the size in the Y direction of the printed circuit board also stored in the RAM 31. The calculation result is stored in the RAM 31. Based on the calculation result stored in the RAM 31, the CPU 30 controls the drive motor 5E of the positioning unit 5 to move it according to the type of the printed circuit board P that produces each chute 5C.

  In other words, the position in the Y direction for positioning the board is determined and set up in advance at the time of switching the model, and is not moved in the Y direction to the beam side for mounting the board position during automatic component mounting. The printed circuit board P is not moved after the positioning by the unit 5 is completed. The reason is that the absolute value accuracy at the time of correction mounting is ensured by not changing the board position captured by the board recognition, and the printed board P does not move so as not to apply stress to the mounted parts.

  As shown in FIGS. 3 and 4, the supply conveyor 4 that has inherited the printed circuit board P from the upstream device 7 in the state where the position of the positioning portion 5 is determined as described above is between the pair of fixing portions 4A. A pair of chutes 4C are moved in the Y direction so as to be connected to the chutes 5C of the positioning unit 5 via the drive circuit 4D along the provided guide 4B, and transferred to the substrate positioning unit 5. The printed board P is positioned and fixed in the board positioning unit 5 by a positioning mechanism (not shown).

  Then, according to the mounting data in which the XY coordinate position to be mounted on the printed circuit board P stored in the RAM 31, the rotation angle position about the vertical axis, the arrangement number of each component supply unit 3, and the like are specified, the component type of the electronic component is set. The electronic component to be mounted by the corresponding suction nozzle is picked up and taken out from the predetermined component supply unit 3.

  Next, the suction nozzle 13 of the mounting head 12A moves so as to be positioned above the component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the Y-axis motor 21 is driven by the drive circuit 20 and a pair of guides. 11, the beam 10 </ b> A moves along the X direction, the X-axis motor 23 is driven by the drive circuit 22 in the X direction, and the mounting head 12 </ b> A moves, and the predetermined supply unit 3 is already driven to take out the component at the component suction position. Since the vertical axis motor 24 is driven by the drive circuit 27 by the drive circuit 27 and the suction nozzle 13 is lowered to suck and take out the electronic components, the mounting head 12A is then lifted and the suction nozzle 13 is next mounted. The electronic component moves to the upper part of the component supply unit 3 for storing the electronic component, and the nozzle 13 is lowered to suck and take out the electronic component.

  At this time, the suction nozzle 13 of the mounting head 12B moves above the component supply unit 3 that stores the electronic component to be mounted, the nozzle 13 descends to suck and take out the electronic component, and then the mounting head 12B moves up. At the same time, the suction nozzle 13 moves above the component supply unit 3 for storing the electronic component to be mounted next, and similarly, the nozzle 13 descends to suck and take out the electronic component.

  The electronic components that are moved by the Y-axis motor 21 and the X-axis motor 23 as described above so that the respective suction nozzles 13 of the mounting head 12A are positioned above the respective component recognition cameras 14, and are sucked by the respective nozzles 13. Is picked up, and each suction nozzle 13 of the mounting head 12B moves so as to be positioned above the component recognition camera 14, and each electronic component picked up by each nozzle 13 is picked up, and each electronic component is directed to the nozzle. The component recognition processing unit 35 calculates a recognition result for the XY direction and the rotation angle to determine how much the position is shifted and held.

  Then, the CPU 30 determines whether or not the mounting area is unused. Since it is not used, the beam 10A acquires the mounting area. Specifically, the CPU 30 writes in the RAM 31 that the beam 10A occupies the mounting area, and moves the beam 10A and the mounting head 12A to perform the substrate recognition operation for the beam 10A that has processed the mounting area. In order to recognize the position of the mark on the printed circuit board P, each mark is picked up by the board recognition camera 17, the recognition process is performed by the board recognition processing unit 34, stored in the RAM 31, and again the beam 10A and the mounting head. 12A is moved, and the suction nozzle 13 mounts each electronic component on the printed circuit board P while correcting the displacement by adding the component recognition result to the substrate recognition result, and advances the sequence data to cut out the next step. Since there is next step data, the mounting area is released (unused state).

  Next, after the mounting area is released by the beam 10A, the beam 10B occupies the mounting area. Therefore, in order to recognize the position of the mark on the printed circuit board P by moving the beam 10B and the mounting head 12B in order to perform the board recognition operation for the beam 10B that has processed the mounting area, each board recognition camera 17 performs each recognition operation. The mark is imaged, and the recognition processing is performed by the substrate recognition processing unit 34 and stored in the RAM 31, and each suction nozzle 13 is shifted on the printed circuit board P by adding the component recognition result to the substrate recognition result. Each electronic component is mounted with correction, the sequence data is advanced, and the next step is cut out. Since there is next step data, the mounting area is opened (unused state).

  As described above, according to the mounting data sequentially stored in the RAM 31, mounting is performed on the printed circuit board P. However, before all component mounting is completed, as shown in FIG. Is connected to the chute 5C of the positioning portion 5, and the printed circuit board P is transferred from the positioning portion 5 to the discharge conveyor 6 and is inherited after the mounting is completed. Then, after the printed circuit board P delivered from the positioning unit 5 is inherited from the positioning unit 5, along the guide 6B provided between the pair of fixing units 6A, the pair of chutes 6C has the respective driving circuits 6D. Then, each drive motor 6 </ b> E moves in the Y direction so as to be connected to the downstream device 8, and transfers it to the downstream device 8.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 4 Supply conveyor 5 Positioning part 6 Discharge conveyor 10A, B beam 12A, B mounting head 13 Adsorption nozzle 30 CPU
31 RAM

Claims (1)

  A pair of beams movable in one direction by a driving source is provided with a mounting head that can be moved by the driving source in a direction along the beam, and a suction nozzle that sucks electronic components onto the mounting head and mounts on the printed circuit board. The electronic component mounting apparatus provided has a pair of chutes that can move in the one direction, and the pair of chutes move to a position offset in advance from any of the beams based on mounting data in the mounting area. A positioning portion that positions and fixes the printed circuit board for each type of the printed circuit board at the offset position, and after the printed circuit board is inherited from the upstream device, the printed circuit board is slid in correspondence with the positioning section. A supply conveyor for connecting the chute of the positioning part to the chute by moving it in a direction, and the print After the plate is transferred from the positioning unit, the plate is slid in correspondence with the chute of the downstream device, and the printed circuit board is moved in the one direction so as to be connected to the chute of the downstream device and transferred to the downstream device. An electronic component mounting apparatus characterized by comprising a discharge conveyor.

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