JP2011020773A - Method for mounting ic tag on caster for carrying apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a caster with an IC tag for solving these problems, since there is the difficulty in reading information when a tire thickness becomes a barrier when an IC tag reader reads from the side of the caster by installing the IC tag between a wheel and a tire, and there is the difficulty of easily damaging and exfoliating the IC tag by a collision when directly sticking the IC tag to a side surface of the caster. <P>SOLUTION: The IC tag of packing a radiocommunication part having an integrated circuit and an antenna with a heat resistant material, is arranged and fixed in a molding metal mold of a wheel or a bracket or an installation part, and resin is poured into the molding metal mold of the wheel or the bracket or the installation part, and the wheel with built-in IC tag or the bracket with built-in IC tag or the installation part with built-in IC tag is molded and manufactured. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a caster attached to a logistics transport device such as a cart, a cart, a carry, and a dolly for transporting luggage, and more specifically to a method of mounting an IC tag on a caster for a transport device. It is.

  In a package collection / delivery place where a large number of packages are collected and delivered, logistics transport equipment is used to move the packages within the venue. When a package is moved by a logistics transport device, it is generally moved together with a record of package information such as package content, delivery destination, package handling conditions, and delivery date and time. This is to correctly carry the package to the target location (target delivery vehicle, planned storage location, etc.), but as a means of recording this package information, it is often handwritten on tags, slips, whiteboards, etc. In addition to troublesome work, there were also mistakes due to misreading by messy characters.

In recent years, IC tags (RFID) on which necessary information is recorded are attached to casters of physical distribution equipment and moved to avoid complicated handwriting and reading errors. This caster is usually made of a resin, and is manufactured by injecting a high temperature resin into a mold while cooling and solidifying it. Therefore, as a means for attaching the IC tag to the caster, a method of incorporating the IC tag in the caster is not adopted. This is because the IC tag is placed in a high-temperature resin during the manufacturing process, and the IC tag is thermally damaged.
Therefore, as a means for attaching the IC tag to the caster, a method of attaching it to the finished caster or the part later is adopted. Yes.

JP 2003-36422 A

  However, when an IC tag is attached between the wheel and the tire as in Patent Document 1, it is easy to read when the IC tag reader is installed on the tire ground contact surface (floor surface), but the IC tag reader is on the side of the caster. When reading from the side, there is a difficulty that it is difficult to read information because the tire wall thickness becomes a barrier. In addition, when a method of directly attaching the IC tag to the side surface of the caster is employed, there is a problem that the IC tag is easily damaged by a collision or easily peeled off.

  The problem of the present invention is that even when the IC tag reader reads from the side of the wheel, the information of the IC tag can be easily read, and the IC tag is not damaged or peeled off even in case of an unexpected collision. An object of the present invention is to provide a method of mounting an IC tag on a caster for a transfer device that does not.

  The IC tag mounting method on the transport device caster according to the present invention is the IC tag mounting method on the transport device caster attached to the logistics transport device such as the dolly, the carry, or the carriage, and the IC tag is packaged with a heat resistant material. The IC tag is placed and fixed in the caster molding die, the set portion provided on the packaging IC tag is set on the support portion of the caster molding die, the packaging IC tag is positioned, and the caster molding is performed. In this method, a package IC tag is built in the resin by pouring resin into the mold.

  In this case, one or two or more small holes, which are set parts of the packaging IC tag, are set in a protrusion which is a support part in the caster molding die, and the packaging IC tag is placed in the caster molding mold. It can also be positioned. Further, the packaging IC tag can be a sheet-like or thin plate-like packaging IC tag packaged with a heat-resistant material.

The method for mounting an IC tag on a carrier caster according to the present invention has the following effects.
(1) Since the IC tag is built in the resin of the caster, the IC tag is not damaged or peeled off even if the caster is in an unexpected collision.
(2) Since the IC tag is packaged with a heat-resistant material, even if the IC tag is placed in a high temperature resin in the caster manufacturing stage, the IC tag is not damaged by heat.
(3) Since the IC tag is fixed by the protrusion for fixing the IC tag during resin molding, the IC tag can be built in a predetermined position in the caster.
(4) Since the IC tag can be built in an arbitrary position, the caster manufactured according to the present invention can be used even when the IC tag reader is installed on the tire ground contact surface (floor surface). Even when the reader reads from the side of the caster, the information of the IC tag can be easily read.
(5) If the caster manufactured according to the present invention is attached to the transport device and moved, the troublesome trouble of handwriting for recording the package information and the mistake of reading the messy characters of the handwriting occur. Absent.

A perspective view of a dolly. The side view of the dolly explaining the condition which the caster for conveyance apparatuses communicates in front of a reader. (A) is the perspective view which notched a part of caster which incorporated the linear IC tag circularly. (B) is the perspective view which notched some casters which incorporated several independent IC tags. The metal mold | die sectional drawing which shows an example of the metal mold | die used for this invention. (A) is a side view of the caster which incorporated the linear IC tag circularly. (B) is a side view of a caster incorporating several independent IC tags.

(Embodiment)
An embodiment of a method for mounting an IC tag on a caster for transfer equipment according to the present invention will be described with reference to the drawings.
In the present embodiment, the caster 1 is described as an example attached to the dolly 2. However, the caster 1 may be attached to other transport devices such as a transport cart, a cart, and a carry. Absent.

(Caster structure)
The structure of the caster 1 manufactured by the method of mounting the IC tag on the transfer device caster of the present invention will be described below.
FIG. 1 is a perspective view showing the dolly 2. The dolly 2 includes a loading platform 3 on which a load is placed and a caster 1, and a handle for pushing can be attached. The caster 1 is equipped with a packaged IC tag 4 in which wireless functions (IC chip and antenna) are packaged with a heat-resistant material.

As shown in FIG. 2, when the dolly 2 passes in front of the IC tag reader 5 fixed to the wall surface of a warehouse or the like, the information of the packaged IC tag 4 built in the caster 1 can be read. The IC tag reader 5 includes a so-called reader / writer capable of reading and writing, and a read-only reader, either of which can be adopted depending on the purpose.

FIGS. 3A and 3B are perspective views in which a part of the caster 1 for transfer equipment is cut away. As shown in the figure, a caster 1 manufactured by the manufacturing method of the present invention includes a wheel 6, a bracket 7, and a mounting portion 8, and the package IC tag 4 is built in the wheel 6. The packaging IC tag 4 may be continuously arranged in a ring shape as shown in FIG. 3A, or a plurality of independent IC tags 4 may be dotted as shown in FIG. Of course, the present invention is not limited to the arrangement shown in the figure, and in the case of FIG. 3A, the packaging IC tags 4 may be arranged in a double or triple manner. In the case of FIG. You may arrange only.

The caster 1 is not limited to the one in which the packaging IC tag 4 is built in the wheel 6, but the one in which the packaging IC tag 4 is built in the bracket 7 or the one in which the packaging IC tag 4 is built in the attachment portion 8. Of course, the package IC tag 4 may be incorporated in each of two or three parts selected from the wheel 6, the bracket 7, and the attachment portion 8.

  The packaged IC tag 4 incorporated includes a wireless function part having an IC chip and an antenna, and a package part that wraps these parts. The IC chip is an integrated circuit (Integrated Circuit) in the form of a chip, that is, the packaged IC tag 4 is an RFID (Radio Frequency IDentification, a wireless non-contact automatic recognition technology using radio). . The packaged IC tag 4 includes a read / write type (writable) as well as a read only type (read only), but either one may be selected. If the read / write type packaging IC tag 4 is built in the caster 1 and the IC tag reader 5 is a reader / writer, the IC tag reader 5 can record necessary information on the packaging IC tag 4 of the dolly 2. it can. Further, the packaging IC tag 4 includes an active type having a power source and a passive type not having a power source, and it goes without saying that both can be selected, but the active type can transmit information by itself and communicate with the packaging IC tag 4. The distance is longer than the passive type. In addition, the packaged IC tag 4 includes a type that communicates with a certain direction being limited, and a type that can communicate with the entire periphery (so-called omnidirectional), and either can be adopted.

The wheel 6 is normally used in which a wheel 9 is disposed on the inner side and a tire 10 is disposed on the outer edge. A rotation shaft 11 is inserted through the center of the wheel 6, and the bracket 7 grips the rotation shaft 11 so as to be rotationally fixed, and the wheel 6 is attached so as to be able to rotate around the rotation shaft 11. Yes.

The bracket 7 holds the wheel 6 through the rotating shaft 11 and maintains the rotational posture of the wheel 6. Further, the bracket 7 is provided with a plate-like attachment portion 8 which is substantially horizontal at the upper portion thereof, and the bracket 7 and the wheel 6 are attached to the dolly 2 via the attachment portion 8. The attachment portion 8 is provided with, for example, four connection holes, and the caster 1 is fixed to the dolly 2 by inserting bolts into the connection holes. In addition to such a bolt fixing type, the attachment portion 8 can be structured to be detachable by using a conventional technique such as using a detachment jig or a magnet action.

The wheel 6 in which the packaged IC tag 4 is built is made of resin, and this resin can be selected from either thermoplastic or thermosetting. In this case, the bracket 7 and the attachment portion 8 can be made of resin, or can be made of metal or other materials.
On the other hand, when the packaging IC tag 4 is built in the bracket 7, the bracket 7 is made of resin, but the wheel 6 and the attachment portion 8 can be made of any material. In short, what is manufactured by incorporating the packaged IC tag 4 is made of resin, but if not, it can be manufactured of any material.

(Manufacture of casters)
FIG. 4 is a sectional view showing a mold for manufacturing the wheel 9 among the wheels 6 of the caster 1. As shown in the drawing, the packaged IC tag 4 is disposed in a cavity formed between the upper mold 12 and the lower mold 13, and a wheel 9 is formed by injecting resin into the cavity in this state.

As a method of resin molding using a mold, typical injection molding can be employed, and molding methods such as extrusion molding, blow molding, vacuum molding, and compression molding can be employed.

Since the resin injected into the mold is at a high temperature, the package IC tag 4 disposed in the cavities of the upper mold 12 and the lower mold 13 may be deformed or damaged. In order to avoid this, the present invention uses a packaged IC tag 4 that wraps a wireless function (IC chip and antenna) with a heat-resistant material. Various materials such as a heat resistant film, a heat resistant glass, a heat resistant resin, and a heat resistant sheet can be selected as the heat resistant material.
Since the wireless function (IC chip and antenna) is wrapped in a heat-resistant material, even if it touches high-temperature resin during the manufacturing process, it will not be deformed or damaged, and the packaged IC tag 4 will remain stable after commercialization. Can function.

When the packaging IC tag 4 is built in a thin member such as the wheel 9, it is desirable to install the packaging IC tag 4 at the center of the member as much as possible. The packaging IC tag 4 is closer to the surface of the member as the installation position of the packaging IC tag 4 is farther from the center. However, if the packaging IC tag 4 is installed near the surface of the member, the packaging IC tag 4 may be damaged if there is an unexpected collision. Because there is.

In order to fix the packaging IC tag 4 at the center of the member, it is necessary to place and fix the packaging IC tag 4 in a state where it is floated in the cavities of the upper mold 12 and the lower mold 13 in the manufacturing stage. Therefore, as shown in FIG. 4, a protrusion 14 that is a support part for fixing the packaging IC tag 4 is attached to the lower mold 13, and the protrusion 14 is inserted into a small hole that is a set part provided in the packaging IC tag 4 in advance. The packaging IC tag 4 is arranged and fixed in the cavity in the mold.
The number of the protrusions 14 (support portions) to be installed is appropriately designed according to the shape and number of the packaged IC tags 4 incorporated therein. For example, if the shape of the packaged IC tag 4 is a continuous ring shape (doughnut shape) as shown in FIG. 5 (a), it is provided at a plurality of locations such as three protrusions 14 and the same number of small holes (set portions). It is desirable to provide the above. When a plurality of independent packaging IC tags 4 are scattered as shown in FIG. 5B, one or more small holes are provided for each packaging IC tag 4, and the number of protrusions 14 is the number of packaging ICs to be installed. More than the number of tags 4.

The protrusion 14 shown in FIG. 4 has a pointed cone shape, and when the protrusion 14 is inserted into the small hole of the package IC tag 4 from the tip, the package IC is located at a position where the cross section of the protrusion 14 has the same diameter as the small hole. The tag 4 is fixedly arranged. That is, if the cross section of the protrusion 14 in the vicinity of the center of the cavity of the upper mold 12 and the lower mold 13 is the same diameter as the small hole, the packaging IC tag 4 is also arranged and fixed in the center of the cavity and molded. 9 is installed in the center.

The protrusion 14 can be fixed so as not to be detached from the lower mold 13 after the upper mold 12 and the lower mold 13 are removed after the wheel 9 is molded, or the upper mold 12 and the lower mold 13 can be fixed. After demolding 13, it may be detached from lower mold 13 and integrated with wheel 9.
In the former case, the molded wheel 9 has a cavity similar to the projection 14, but can be reinforced with an injection material or the like after molding. In the latter case, since the protrusion 14 is integrated with the wheel 9, it is desirable that the material of the protrusion 14 is the same as that of the wheel 9.

The support portion for fixing the packaged IC tag 4 is not limited to a pointed cone like the protrusion 14 shown in FIG. 4, and is a mode of placing and fixing the packaged IC tag 4 on the top surface as a truncated pyramid. It may be a thing. In this case, the package IC tag 4 may be stabilized by providing a protrusion on the top surface and inserting a small hole (set part) of the package IC tag 4 into the protrusion. Further, both the upper mold 12 and the lower mold 13 may be provided with support portions, and the package IC tag 4 may be held between these upper and lower support portions. Alternatively, the packaging IC tag 4 may be gripped so that a hook-shaped support portion is provided in the upper mold 12 and a small hole (set portion) of the packaging IC tag 4 is hung on the upper mold 12 and suspended.

(Example)
An embodiment of a method for mounting an IC tag on a carrier caster according to the present invention will be described below with reference to FIG.

The lower mold 13 is placed, and the protrusion 14 installed on the lower mold 13 is inserted into the small hole of the packaging IC tag 4 from the tip, and the packaging IC tag 4 is arranged and fixed. Thereafter, the upper mold 12 is combined with the lower mold 13 to set the mold.
On the other hand, the resin raw material is heated and kneaded in a heating cylinder to be in a fluid state.
In the cavity formed between the set upper mold 12 and lower mold 13, the resin in the fluid state is injected under pressure from the injection port 15 shown in FIG. The resin is injected until the resin is sufficiently filled in the cavity, and then the resin is naturally cooled or forcedly cooled to be solidified by cooling. When the resin is sufficiently cooled and solidified, the upper mold 12 is removed from the lower mold 13 and the wheel 9 built in the packaged IC tag 4 as a molded product is taken out to remove unnecessary burrs and the like.
A separately manufactured tire 10 is attached to the outer periphery of the wheel 9, the rotary shaft 11 is inserted into the center of the wheel 9, and the caster 1 is completed by combining the bracket 7 and the attaching portion 8 that are integrally formed in advance.

If the bracket 7 and the mounting portion 8 are integrally molded as described above, the caster 1 is a so-called fixed type that cannot rotate around the vertical axis, and the bracket 7 and the mounting portion 8 are molded separately. When both are attached so as to be rotatable around the vertical axis, a so-called universal type is obtained.

(Other embodiments)
In the above embodiment, as shown in FIGS. 5A and 5B, the packaging IC tag 4 is described as being built in the thin portion (main body portion) of the wheel 9. You may incorporate in a part, or you may make the tire 10 among the wheels 6 resin-made, and may be incorporated in this tire 10 part.
Further, not only the wheel 6 but also the packaging IC tag 4 is built in the bracket 7 portion, the packaging IC tag 4 is built in the mounting portion 8 portion, or the packaging IC tag 4 is built in each of the wheel 6 and the bracket 7. The packaging IC tag 4 can be incorporated in two types of members, or the packaging IC tag 4 can be incorporated in all of the wheel 6, the bracket 7 and the attachment portion 8.

  The IC tag mounting method on the transfer device caster of the present invention can be applied not only to the transfer device caster but also to other resin products incorporating the IC tag, and the transfer manufactured by the present invention. Equipment casters are not only used for logistics transport equipment in the package collection and delivery area, but are also used when organizing luggage in warehouses, or when reordering books in a library. It can be applied in various situations, such as when using.

DESCRIPTION OF SYMBOLS 1 Caster 2 Dolly 3 Loading platform 4 Packaging IC tag 5 IC tag reader 6 Wheel 7 Bracket 8 Mounting part 9 Wheel 10 Tire 11 Rotating shaft 12 Upper mold 13 Lower mold 14 Protrusion 15 Inlet

Claims (3)

In the method of attaching IC tags to casters for transport equipment attached to logistics transport equipment such as dolly, carry, and cart,
A packaging IC tag in which an IC tag is wrapped with a heat-resistant material is placed and fixed in a caster mold,
Positioning the packaging IC tag by setting the set portion provided on the packaging IC tag on the support portion of the caster mold,
A method for mounting an IC tag on a carrier caster, wherein a resin is poured into the caster mold and a packaged IC tag is built in the resin. In the method of mounting an IC tag on a caster for a transfer device according to claim 1,
One or two or more small holes, which are set parts of the packaging IC tag, are set in a protrusion which is a support part in the caster molding die, and the packaging IC tag is positioned in the caster molding die. A method for installing an IC tag on a carrier caster characterized by the above. In the method of mounting an IC tag on the carrier caster according to claim 1 or 2,
A method for mounting an IC tag on a carrier caster, wherein the packaging IC tag is a sheet-like or thin-plate-like packaging IC tag packaged with a heat-resistant material.

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