JP2011017580A - Physical quantity detection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small physical quantity detection device having high detection accuracy of the physical quantity of an object.SOLUTION: In a relay substrate 250 relaying the connection between a vibration piece 100 and a package base 202 in a vibration gyro 201, equipotential fourth and sixth relay electrodes 244 and 249 are electrically connected to two-electrode connection wiring 252 not shown in the figure in the hidden state below the figure. Accordingly, six connection points of the vibration piece 100, namely a first relay electrode 247, a second relay electrode 245, a third relay electrode 246, the fourth relay electrode 244, the fifth relay electrode 248, and the sixth relay electrode 249, may be output to only five relay terminals such as a third relay terminal 256 and fifth relay terminal 258 provided on the other major surface of the relay substrate 250 corresponding to them, and joined to a first protruding terminal 234, a second protruding terminal 235, a third protruding terminal 236, a fourth protruding terminal 237, and the fifth protruding terminal 238 of the package base 202, respectively.

Description

  The present invention relates to an improvement in a physical quantity detection device that detects a physical quantity by detecting vibration and displacement of a piezoelectric vibrating piece.

In recent years, a vibration gyro sensor (hereinafter referred to as vibration) as a physical measurement device that enhances vehicle body control in vehicles, vehicle position detection in car navigation systems, and vibration control correction functions (so-called camera shake correction) for digital cameras and digital video cameras, etc. Called gyro) is widely used. A vibrating gyroscope uses a gyro vibrating piece made of a piezoelectric single crystal such as quartz to detect an electrical signal generated in a part of the gyro vibrating piece by vibration such as shaking or rotation of an object as an angular velocity, and calculates a rotation angle. Thus, the displacement of the object is obtained.
As electronic devices equipped with such vibratory gyros have been increasingly demanded for higher functionality in recent years, vibratory gyros are strongly required to be highly sensitive to realize more accurate angular velocity detection. It has been.

  A vibrating gyroscope is a vibrating piece (gyro element) formed by processing a piezoelectric thin plate such as a quartz substrate, a driving circuit that drives and vibrates the vibrating piece, and detection that occurs in the vibrating piece when an angular velocity is applied. An IC chip as an electronic component including a detection circuit for detecting vibration has a structure hermetically sealed in a package as a base substrate. That is, for example, it has the same structure as the piezoelectric vibrating device shown in Patent Document 1 and having a piezoelectric vibrating piece that has been widely used conventionally.

A piezoelectric vibration device (crystal oscillator) described in Patent Document 1 includes a vibration piece (piezoelectric vibration plate) and an IC chip (integrated circuit element) as an electronic component that constitutes an oscillation circuit together with the vibration piece. Package) and hermetically sealed.
The package base constituting the package storage unit has a recess having an upper opening. Further, the concave portion has a lower storage portion in which the IC chip is stored by bonding and an upper storage portion in which the resonator element is bonded and stored. The IC chip is bonded to the lower storage portion and the upper storage portion is stored. A vibrating piece is joined to the part. More specifically, the lower storage portion includes a concave bottom portion of a concave portion where the IC chip is die-bonded, and an electrode pad as an electronic component side bonding portion of the IC chip formed at a level higher than the region surrounding the IC chip. And a base substrate side bonding portion connected by a bonding wire. Furthermore, a bonding electrode (electrode pad) to which one end side of the vibrating piece is bonded is provided at a level higher than the region outside the base substrate side bonding portion, and vibration or dropping is provided below the other end side of the vibrating piece. A pillow part (auxiliary support part) that mechanically restricts the displacement of the vibration piece in the piezoelectric vibration device due to the above is provided.

JP 2006-54602 A

  However, in the configuration of the piezoelectric vibration device described in Patent Document 1, the junction terminals of the respective storage units are arranged at positions extending outward in plan view from the lower storage unit toward the upper storage unit. That is, in plan view, the base substrate side bonding portion is disposed in a region surrounding the IC chip die-bonded to the lower storage portion, and the bonding terminal and pillow of the resonator element are disposed in a region further outside the base substrate side bonding portion. The part is arranged. For this reason, there is a problem that it is difficult to reduce the size of the piezoelectric vibration device, in particular, to reduce the planar size.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A physical quantity detection device according to this application example includes a base, a connecting arm extending from the base to both sides, and an extending direction of the connecting arm from the vicinity of one end of the connecting arm. A first drive vibrating arm having the same length in each of the two directions and having a first drive electrode and a second drive electrode, and two orthogonal to the extension direction of the connection arm from the vicinity of the tip of the other connection arm A second drive vibrating arm having a third drive electrode and a fourth drive electrode extending in the same length in each direction, and provided between the first drive vibrating arm and the second drive vibrating arm in plan view A first detection vibrating arm extending from the base to one side and having a first detection electrode and a second detection electrode; and a second detection arm extending from the base to the other side and having a third detection electrode and a fourth detection electrode. A detection vibrating arm, the first drive electrode, and the third drive electrode are electrically connected. A resonator element having a first drive wiring that is electrically connected, and a second drive wiring that electrically connects the second drive electrode and the fourth drive electrode, and the first drive electrode and the third drive. A first relay electrode to which an electrode is connected; a second relay electrode to which the second drive electrode and the fourth drive electrode are connected; a third relay electrode to which the first detection electrode is connected; A fourth relay electrode to which the detection electrode is connected; a fifth relay electrode to which the third detection electrode is connected; a sixth relay electrode to which the fourth detection electrode is connected; the fourth relay electrode; A relay portion having two electrode connection wirings for electrically connecting the six relay electrodes, at least one of the first drive electrode and the second drive electrode, and the third drive electrode and the fourth drive A drive circuit for supplying a drive signal to at least one of the electrodes; A first detection signal generated in the first detection electrode or the second detection electrode formed on one detection vibrating arm and a third detection electrode or the fourth detection electrode formed on the second detection vibration arm A detection circuit that differentially amplifies the second detection signal to generate a differential amplification signal and detects a physical quantity based on the operation amplification signal, and has a plurality of electronic component side bonding parts A first base substrate-side bonding portion, a second base substrate-side bonding portion, and other base substrate-side bonding portions that are electrically connected to a plurality of electronic component-side bonding portions of the electronic component; A connection terminal for electrical connection with the relay portion is provided on a protrusion protruding in the vertical direction from one base substrate side bonding portion and the second base substrate side bonding portion. A base substrate having a first protrusion, a second protrusion, a third protrusion, a fourth protrusion, and a fifth protrusion provided, the first base substrate-side bonding portion in plan view And the second base substrate-side bonding part, and at least a part of the fourth relay electrode, the sixth relay electrode, and the two-electrode connection wiring is electrically connected. The first protrusion and the first base substrate side bonding part, the second base substrate side bonding part, and at least a part of the first protrusion in a positional relationship in a plan view. The second protrusion and the third protrusion, which are disposed on one end side of the base substrate and in the vicinity of one end of the electronic component, and one of the first relay electrode and the second relay electrode is The second protrusion electrically connected; The third protrusion, to which one of the third relay electrode and the fifth relay electrode is electrically connected, is arranged near the other end of the base substrate and in the vicinity of the other end of the electronic component in plan view. The fourth protrusion and the fifth protrusion, wherein the fourth protrusion and the third relay electrode are electrically connected to the other of the first relay electrode and the second relay electrode. And a base substrate having the fifth protrusion to which the other of the fifth relay electrodes is electrically connected.

  According to the physical quantity detection device of the above application example, the first relay electrode and the sixth relay electrode are electrically connected by the two-electrode connection wiring in the relay unit that relays the connection between the resonator element and the base substrate. Thus, the six connection points of the resonator element can be reduced to five and output. As a result, it is possible to reduce the number of protrusions of the base substrate that becomes a junction terminal with the relay portion to which the resonator element is bonded, so that it is possible to provide a functional structure provided on the base substrate in a limited area. Thus, it is possible to provide a physical quantity detection device having a high function.

  Application Example 2 In the physical quantity detection device according to the application example described above, each of the connection terminals provided in the first to fifth protrusions has the same potential as the connection terminal in the base substrate side bonding part. The base substrate side bonding portion is arranged so as to be adjacent in a plan view.

  According to this configuration, when a bonding member that is pasted before solidification, such as a conductive adhesive used when bonding the relay portion on the protrusion, is used, the bonding member before solidification is the base substrate side bonding portion. Even if it flows or hangs down, electrical problems such as short circuits are unlikely to occur.

  Application Example 3 In the physical quantity detection device according to the application example described above, the base material of the relay unit is formed of a material that does not transmit laser.

  According to this configuration, in the manufacturing process of the physical quantity detection device, the laser beam vibrates when performing frequency adjustment to change the frequency by trimming a part of the electrode of the resonator element using a laser to reduce the mass. It is possible to avoid problems such as damage caused by irradiation of an electronic component below the piece.

The schematic plan view which looked at the vibration piece concerning the vibration gyro of this embodiment from the one main surface side. The vibration piece applied to the vibration gyro according to this embodiment is a schematic plan view as viewed from the other main surface side. FIG. 6 is a schematic plan view for explaining the operation of a vibrating piece. FIG. 6 is a schematic plan view for explaining the operation of a vibrating piece. (A) is a schematic plan view seen from the upper side explaining one Embodiment of a vibration gyro, (b) is a schematic sectional drawing which shows the AA line cross section of (a). The schematic plan view which looked at one Embodiment of the vibration gyro from the bottom face side. The schematic plan view explaining the IC mounting part concerning the vibration gyro of this embodiment. (A) is the schematic plan view which looked at the relay board | substrate concerning the vibration gyroscope of this embodiment from the upper side, (b) is the schematic plan view seen from the lower side.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

[Vibration piece]
First, the resonator element 100 according to the present embodiment will be described with reference to the drawings. FIG. 1 is a schematic plan view of the resonator element 100 as viewed from one main surface (first surface 101) side. FIG. 2 is a schematic plan view of the resonator element 100 as viewed from the other main surface (second surface 102) side. FIG. 2 is a perspective view of FIG. In FIGS. 1 and 2, the drive vibration electrodes, wiring, terminals, etc. are hatched with diagonal lines, which is provided for convenience to make the configuration of each part easy to understand. It is not shown.

  Hereinafter, first, the shape and the like of the vibrating piece 100 will be described, then the arrangement of electrodes, wirings, and terminals formed on the vibrating piece 100 will be described, and then the operation of the vibrating piece 100 will be described.

[Shape of vibrating piece, etc.]
Examples of the material of the resonator element 100 include piezoelectric materials such as quartz, lithium tantalate, and lithium niobate, and silicon. As shown in FIGS. 1 and 2, the resonator element 100 can be a so-called double T-type gyroscope. For example, the resonator element 100 has a spread in a plane defined by the X axis and the Y axis of the crystal axis of quartz (hereinafter referred to as an XY plane), and can have a thickness in the Z axis direction. The resonator element 100 includes a first surface 101 (see FIG. 1) and a second surface 102 (see FIG. 2) that face opposite to each other, and a side surface 103 that connects the first surface 101 and the second surface 102. The first surface 101 and the second surface 102 are parallel to the XY plane, and the second surface 102 faces the surface of the concave bottom portion of the recess of the package base 202 as shown in FIG. Surface. The side surface 103 is a surface orthogonal to the first surface 101 and the second surface 102 and parallel to the Z axis. In the description according to the present invention, the term “X-axis” is used to mean an axis tilted in the range of greater than 0 degrees and less than or equal to 2 degrees around the X-axis and the X-axis. The same applies to the “Y axis” and the “Z axis”.

  As shown in FIGS. 1 and 2, the resonator element 100 includes a base 10, a first connecting arm 20 and a second connecting arm 22, a first detecting vibrating arm 30 and a second detecting vibrating arm 32, and a first drive. The vibrating arm 40 and the second drive vibrating arm 42, the first beam 50, the second beam 52, the third beam 54 and the fourth beam 56, and the first support part 60 and the second support part 62 are included.

  The base 10 has a center of gravity G of the resonator element 100. The center of gravity G can be the position of the center of gravity of the resonator element 100. The X axis, the Y axis, and the Z axis are orthogonal to each other and pass through the center of gravity G. The vibrating piece 100 can be point-symmetric with respect to the center of gravity G. That is, the resonator element 100 can be plane-symmetric with respect to the XZ plane and plane-symmetric with respect to the YZ plane.

  The first connecting arm 20 and the second connecting arm 22 extend from the base 10 along the X axis in the positive and negative directions, respectively. The first detection vibrating arm 30 and the second detection vibrating arm 32 extend in the positive and negative directions from the base 10 along the Y axis, respectively. The first drive vibrating arm 40 extends from the first connecting arm 20 along the Y axis in the positive and negative directions, respectively. The second drive vibrating arm 42 extends from the second connecting arm 22 along the Y axis in the positive and negative directions, respectively. The first detection vibrating arm 30 and the second detection vibrating arm 32 constitute a detection vibration system that detects angular velocity. Further, the first connecting arm 20 and the second connecting arm 22, the first driving vibrating arm 40 and the second driving vibrating arm 42 constitute a driving vibration system for driving the vibrating piece 100.

  The distal end portions 30a and 32a of the first detection vibrating arm 30 and the second detection vibrating arm 32 have a substantially rectangular shape having a larger width (the length in the X-axis direction is larger) than other portions. Similarly, the front end portions 40a and 42a and the front end portions 44a and 46a of the first drive vibrating arm 40 and the second drive vibrating arm 42 have a substantially rectangular shape having a width larger than that of the other portions. With the tip portions 30a, 32a, 40a, 42a, 44a, and 46a having such shapes, the resonator element 100 can improve the angular velocity detection sensitivity.

  The first support part 60 is disposed on the positive direction side of the Y axis with respect to the first detection vibrating arm 30. The second support portion 62 is disposed on the negative direction side of the Y axis with respect to the second detection vibrating arm 32. The lengths of the support portions 60 and 62 in the X-axis direction are larger than the lengths of the tip end portions 30a and 32a of the first detection vibrating arm 30 and the second detection vibrating arm 32 in the X-axis direction. The total length of the second connecting arm 22 and the base 10 in the X-axis direction is about the same. In the illustrated example, the planar shape of the support portions 60 and 62 is substantially rectangular, but is not particularly limited. The support portions 60 and 62 are disposed apart from the first detection vibrating arm 30 and the second detection vibrating arm 32, and the first driving vibrating arm 40 and the second driving vibrating arm 42. The first support part 60 and the second support part 62 are parts fixed to the package base 202 as shown in FIG.

  As shown in FIGS. 1 and 2, the first beam 50 extends from the base portion 10 to the first support portion 60 through between the first detection vibrating arm 30 and the first drive vibrating arm 40. . The second beam 52 extends from the base portion 10 to the second support portion 62 through the space between the second detection vibrating arm 32 and the first drive vibrating arm 40. The third beam 54 extends from the base portion 10 to the first support portion 60 through between the first detection vibrating arm 30 and the second drive vibrating arm 42. The fourth beam 56 extends from the base portion 10 to the second support portion 62 through the space between the second detection vibrating arm 32 and the second drive vibrating arm 42. Thus, the first and third beams 50 and 54 are connected to the first support portion 60, and the second and fourth beams 52 and 56 are connected to the second support portion 62, and the base portion 10 is connected to the first support portion 60. Can be supported. The beams 50, 52, 54, 56 can have S-shaped portions 50a, 52a, 54a, 56a, respectively. In the illustrated example, for example, the first beam 50 extends from the base 10 in the positive direction of the X axis, then extends in the positive direction of the Y axis, and then extends in the negative direction of the X axis. Are extended in the positive direction of the Y axis, then extended in the positive direction of the X axis, and then extended in the positive direction of the Y axis, and connected to the first support portion 60. That is, in the illustrated example, the first beam 50 has three portions in the S-shaped portion 50a that are parallel to the X-axis direction. Similarly, each of the second beam 52, the third beam 54, and the fourth beam 56 has three portions that are parallel to the X-axis direction in the S-shaped portions 52a, 54a, and 56a. The first beam 50, the second beam 52, the third beam 54, and the fourth beam 56 can obtain elasticity in the X-axis direction and the Y-axis direction by the S-shaped portions 50a, 52a, 54a, and 56a.

  As described above, the outer shape of the resonator element 100 described above can be precisely formed by wet etching a piezoelectric substrate material such as a quartz wafer with a hydrofluoric acid solution or by dry etching.

[Placement of electrodes, wiring, terminals, etc.]
As shown in FIGS. 1 and 2, the resonator element 100 includes a detection signal electrode 110 as a first detection electrode and a third detection electrode, a detection signal wiring 112, a detection signal terminal 114, a second detection electrode, and a fourth detection electrode. Detection ground electrode 120 as an electrode, detection ground wiring 122, detection ground terminal 124, drive signal electrode 130 as first and third drive electrodes, drive signal wiring 132, drive signal terminal 134, second drive electrode and second drive electrode A driving ground electrode 140 as four driving electrodes, a driving ground wiring 142, and a driving ground terminal 144 are formed. 1 and 2, the detection signal electrode 110, the detection signal wiring 112, and the detection signal terminal 114 are indicated by a lower right diagonal line for the sake of convenience in distinguishing and explaining the various electrodes, wirings, and terminals. The ground wiring 122 and the detection ground terminal 124 are indicated by cross diagonal lines, the drive signal electrode 130, the drive signal wiring 132, and the drive signal terminal 134 are indicated by lower left diagonal lines, and the drive ground electrode 140, the drive ground wiring 142, and the drive ground terminal 144 are crossed. It is indicated by vertical and horizontal lines. 1 and 2, electrodes, wirings, and terminals formed on the side surface 103 of the resonator element 100 are indicated by bold lines.

  As materials for the above various electrodes, various wirings, and various terminals, for example, those laminated in the order of chromium and gold from the vibrating piece 100 side can be used. Various electrodes are electrically separated from each other. Various wirings are electrically separated from each other. The various terminals are electrically separated from each other.

  Hereinafter, various electrodes, wiring, and terminals will be described in detail.

[Detection signal electrode, detection signal wiring and detection signal terminal]
As shown in FIGS. 1 and 2, the detection signal electrode 110 is formed on the first detection vibrating arm 30 and the second detection vibrating arm 32. In the present invention, the detection signal electrode 110 formed on the first detection vibrating arm 30 is a first detection electrode, and the detection signal electrode 110 formed on the second detection vibrating arm 32 is a third detection electrode. However, in the illustrated example, the detection signal electrode 110 is not formed on each of the tip portions 30 a and 32 a of the first detection vibrating arm 30 and the second detection vibrating arm 32. More specifically, the detection signal electrode 110 is formed on the first surface 101 and the second surface 102 of the first detection vibrating arm 30 and the second detection vibrating arm 32. The detection signal electrodes 110 are arranged symmetrically with respect to the XZ plane. The detection signal electrode 110 is an electrode for detecting the distortion of the piezoelectric material generated by the vibration when the detection vibration of the first detection vibration arm 30 and the second detection vibration arm 32 is excited.

  As shown in FIG. 1, the detection signal wiring 112 is formed on the first and second beams 50 and 52. More specifically, the detection signal wiring 112 can be formed on the first surface 101 of the first and second beams 50 and 52. Further, as shown in FIGS. 1 and 2, the detection signal wiring 112 includes a side surface 103a of the joint portion between the first beam 50 and the base portion 10, a side surface 103b of the joint portion of the second beam 52 and the base portion 10, and The first and second surfaces 101 and 102 of the base 10 can be formed. The detection signal wiring 112 is arranged symmetrically with respect to the XZ plane.

  The detection signal terminal 114 is formed on the first support part 60 and the second support part 62. More specifically, the detection signal terminal 114 can be formed on the first and second surfaces 101 and 102 of the first support portion 60 and the second support portion 62, and further on the side surface 103. The detection signal terminals 114 formed on the surfaces 101 and 102 and the side surface 103 of the first support part 60 are electrically connected to each other. Further, the detection signal terminals 114 formed on the surfaces 101 and 102 and the side surface 103 of the second support portion 62 are electrically connected to each other. In the illustrated example, the detection signal terminal 114 formed on the first support portion 60 has a Y-axis with respect to one tip portion 40a of the first drive vibrating arm 40 on which the drive ground electrode 140 is formed as described later. It is arranged on the positive direction side. That is, it can be said that the detection signal terminal 114 formed on the first support portion 60 and the drive ground electrode 140 formed on the tip end portion 40a face each other in the Y-axis direction. Further, the detection signal terminal 114 formed on the second support portion 62 has a negative Y-axis with respect to the other tip end portion 42a of the first drive vibrating arm 40 on which the drive ground electrode 140 is formed, as will be described later. It is arranged on the direction side. That is, it can be said that the detection signal terminal 114 formed on the second support portion 62 and the drive ground electrode 140 formed on the tip end portion 42a face each other in the Y-axis direction. The detection signal terminals 114 are arranged symmetrically with respect to the XZ plane.

  As shown in FIG. 1, the detection signal terminal 114 formed on the first support portion 60 is formed on the first detection vibrating arm 30 via the detection signal wiring 112 formed on the first beam 50. Are electrically connected to a detection signal electrode 110 as a first detection electrode. More specifically, as shown in FIGS. 1 and 2, the detection signal terminal 114 formed on the first support portion 60 is connected to the detection signal wiring 112 formed on the first surface 101 of the first beam 50. The detection signal wiring 112 passes from the first surface 101 of the first beam 50, the side surface 103 a of the joint portion between the first beam 50 and the base 10, and the first and second surfaces 101 and 102 of the base 10. The detection signal electrode 110 formed on the first and second surfaces 101 and 102 of the first detection vibrating arm 30 can be connected. Thereby, the first detection signal generated by the vibration of the first detection vibrating arm 30 can be transmitted from the detection signal electrode 110 to the detection signal terminal 114 formed on the first support portion 60.

  As shown in FIG. 1, the detection signal terminal 114 formed on the second support portion 62 is formed on the second detection vibrating arm 32 via the detection signal wiring 112 formed on the second beam 52. Are electrically connected to a detection signal electrode 110 as a third detection electrode. More specifically, as shown in FIGS. 1 and 2, the detection signal terminal 114 formed on the second support portion 62 is connected to the detection signal wiring 112 formed on the first surface 101 of the second beam 52. The detection signal wiring 112 passes from the first surface 101 of the second beam 52, through the side surface 103 b of the joint portion between the second beam 52 and the base 10, and through the first and second surfaces 101 and 102 of the base 10. The detection signal electrode 110 formed on the first and second surfaces 101 and 102 of the second detection vibrating arm 32 can be connected. Thereby, the second detection signal generated by the vibration of the second detection vibrating arm 32 can be transmitted from the detection signal electrode 110 to the detection signal terminal 114 formed on the second support portion 62.

[Detection ground electrode, detection ground wiring and detection ground terminal]
As shown in FIGS. 1 and 2, the detection ground electrode 120 is formed on the tip portions 30 a and 32 a on the tip side of the detection signal electrode 110 of the first detection vibrating arm 30 and the second detection vibrating arm 32. In the present invention, the detection ground electrode 120 formed at the distal end portion 30a is the second detection electrode, and the detection ground electrode 120 formed at the distal end portion 32a is the fourth detection electrode. More specifically, the detection ground electrode 120 can be formed on the first and second surfaces 101 and 102 of the tip portions 30a and 32a. Further, the detection ground electrode 120 can be formed on the side surface 103 of the first detection vibrating arm 30 and the second detection vibrating arm 32. The detection ground electrodes 120 formed on the surfaces 101 and 102 and the side surface 103 of the first detection vibrating arm 30 are electrically connected to each other. The detection ground electrodes 120 formed on the surfaces 101 and 102 and the side surface 103 of the second detection vibrating arm 32 are electrically connected to each other. In the illustrated example, the detection ground electrode 120 is disposed symmetrically with respect to the XZ plane. The detection ground electrode 120 can have a potential that serves as a ground with respect to the detection signal electrode 110.

  The detection ground wiring 122 is formed on the first and second beams 50 and 52. More specifically, the detection ground wiring 122 can be formed on the second surface 102 and the side surface 103 of the first and second beams 50 and 52. Further, the detection ground wiring 122 can be formed on the first and second surfaces 101 and 102 of the base 10. In the example shown in the drawing, the detection ground wiring 122 is arranged symmetrically with respect to the XZ plane.

  The detection ground terminal 124 is formed on the first support portion 60 and the second support portion 62. More specifically, the detection ground terminal 124 can be formed on the first and second surfaces 101 and 102 of the first support portion 60 and the second support portion 62, and further on the side surface 103. The detection ground terminals 124 formed on the surfaces 101 and 102 and the side surface 103 of the first support part 60 are electrically connected to each other. In addition, the detection ground terminals 124 formed on the surfaces 101 and 102 and the side surface 103 of the second support portion 62 are electrically connected to each other. In the illustrated example, the detection ground terminal 124 formed on the first support portion 60 is on the positive direction side of the Y axis with respect to the distal end portion 30a of the first detection vibrating arm 30 on which the detection ground electrode 120 is formed. Has been placed. That is, it can be said that the detection ground terminal 124 formed on the first support portion 60 and the detection ground electrode 120 formed on the distal end portion 30a face each other in the Y-axis direction. Further, the detection ground terminal 124 formed on the second support portion 62 is disposed on the negative direction side of the Y axis with respect to the distal end portion 32a of the second detection vibrating arm 32 on which the detection ground electrode 120 is formed. Yes. That is, it can be said that the detection ground terminal 124 formed on the second support portion 62 and the detection ground electrode 120 formed on the distal end portion 32a face each other in the Y-axis direction. In the example shown in the figure, the detection ground terminals 124 are arranged symmetrically with respect to the XZ plane.

  The detection ground terminal 124 formed on the first support portion 60 is connected to the detection ground electrode as the second detection electrode formed on the first detection vibrating arm 30 via the detection ground wiring 122 formed on the first beam 50. 120 is electrically connected. More specifically, the detection ground terminal 124 formed on the first support portion 60 is connected to the detection ground wiring 122 formed on the second surface 102 and the side surface 103 of the first beam 50, and the detection ground wiring 122 is The first beam 50 is connected to the detection ground electrode 120 formed on the side surface 103 of the first detection vibrating arm 30 from the second surface 102 and the side surface 103 of the first beam 50 through the first and second surfaces 101 and 102 of the base 10. Can be.

  The detection ground terminal 124 formed on the second support portion 62 is connected to the detection ground electrode as the fourth detection electrode formed on the second detection vibrating arm 32 via the detection ground wiring 122 formed on the second beam 52. 120 is electrically connected. More specifically, the detection ground terminal 124 formed on the second support portion 62 is connected to the detection ground wiring 122 formed on the second surface 102 and the side surface 103 of the second beam 52, and the detection ground wiring 122 is The second surface 52 and the side surface 103 of the second beam 52 are connected to the detection ground electrode 120 formed on the side surface 103 of the second detection vibrating arm 32 through the first and second surfaces 101 and 102 of the base 10. Can be.

  As described above, the resonator element 100 includes detection signal electrodes, wirings, and terminals (reference numerals: 110,: 112,: 114) and detection ground electrodes, wirings, and terminals (reference numerals: 120,: 122, :). 124). Thereby, the detection vibration generated in the first detection vibrating arm 30 appears as a charge between the detection signal electrode 110 and the detection ground electrode 120 formed in the first detection vibrating arm 30 and is formed in the first support portion 60. The detected signal terminal 114 and the detected ground terminal 124 can be taken out as signals. Further, the detected vibration generated in the second detection vibrating arm 32 appears as a charge between the detection signal electrode 110 and the detection ground electrode 120 formed on the second detection vibrating arm 32, and is formed on the second support portion 62. The detection signal terminal 114 and the detection ground terminal 124 can be taken out as signals.

[Drive signal electrode, drive signal wiring and drive signal terminal]
As shown in FIGS. 1 and 2, the drive signal electrode 130 is formed on the first drive vibrating arm 40. However, in the illustrated example, the drive signal electrode 130 is not formed at the distal end portions 40 a and 42 a of the first drive vibrating arm 40. More specifically, the drive signal electrode 130 is formed on the first surface 101 and the second surface 102 of the first drive vibrating arm 40. Further, the drive signal electrode 130 is formed on the side surface 103 of the second drive vibration arm 42 and the first and second surfaces 101 and 102 of the tip portions 44 a and 46 a of the second drive vibration arm 42. The drive signal electrodes 130 formed on the surfaces 101 and 102 and the side surface 103 of the second drive vibrating arm 42 are electrically connected to each other. Further, the drive signal electrodes 130 formed on the surfaces 101 and 102 and the side surface 103 of the second drive vibrating arm 42 are electrically connected to each other. In the illustrated example, the drive signal electrodes 130 are arranged symmetrically with respect to the XZ plane. The drive signal electrode 130 is an electrode for exciting the drive vibration of the first drive vibration arm 40 and the second drive vibration arm 42. In the present invention, the drive signal electrode 130 formed on the first drive vibration arm 40 is used as the first drive electrode, and the drive signal electrode 130 formed on the distal end portions 44a and 46a of the second drive vibration arm 42 is the third drive electrode. A driving electrode is used.

  As shown in FIG. 1, the drive signal wiring 132 is formed on the third and fourth beams 54 and 56. More specifically, the drive signal wiring 132 can be formed on the first surface 101 of the third and fourth beams 54 and 56. Furthermore, the drive signal wiring 132 includes the first surface 101 of the base 10, the first surface 101 of the first connecting arm 20, the side surface 103 c parallel to the YZ plane of the first connecting arm 20, and the second connecting arm 22. The side surface 103d is parallel to the XZ plane. In the illustrated example, the drive signal wirings 132 are arranged symmetrically with respect to the XZ plane.

  As shown in FIGS. 1 and 2, the drive signal terminal 134 is formed on the second support portion 62. More specifically, the drive signal terminal 134 can be formed on the first and second surfaces 101 and 102 of the second support portion 62 and further on the side surface 103. The drive signal terminals 134 formed on the surfaces 101 and 102 and the side surface 103 of the second support part 62 are electrically connected to each other. In the illustrated example, the drive signal terminal 134 formed on the second support portion 62 has a negative Y-axis direction with respect to the one end portion 46a of the second drive vibrating arm 42 on which the drive signal electrode 130 is formed. Arranged on the side. That is, it can be said that the drive signal terminal 134 formed on the second support portion 62 and the drive signal electrode 130 formed on the distal end portion 46a face each other in the Y-axis direction.

  As shown in FIG. 1, the drive signal terminal 134 formed on the second support portion 62 is connected to the first drive vibration arm 40 and the second drive vibration arm via the drive signal wiring 132 formed on the fourth beam 56. The drive signal electrode 130 formed on the electrode 42 is electrically connected. More specifically, the drive signal terminal 134 is connected to the drive signal wiring 132 formed on the first surface 101 of the fourth beam 56, and the drive signal wiring 132 is connected to the first surface 101 of the fourth beam 56 from the first surface 101. Connected to the drive signal electrode 130 as the first drive electrode formed on the first surface 101 of the first drive vibrating arm 40 through the first surface 101 of the base 10 and the first surface 101 of the first connecting arm 20. Can be. Further, as shown in FIGS. 1 and 2, the drive signal wiring 132 extends from the first surface 101 of the first connecting arm 20 through the side surface 103 c of the first connecting arm 20 to the first driving vibration arm 40. Two drive signal electrodes 130 formed on the surface 102 are connected. Further, the drive signal wiring 132 is connected from the first surface 101 of the base 10 to the drive signal electrode 130 formed on the side surface 103 of the second drive vibrating arm 42 through the side surface 103 d of the second connecting arm 22. Further, the second drive vibrating arm 42 is connected to a drive signal electrode 130 as a third drive electrode formed on the first surface 101 and the second surface 102 of the tip portions 44a and 46a. Thereby, a drive signal for driving and vibrating the first drive vibrating arm 40 and the second drive vibrating arm 42 can be transmitted from the drive signal terminal 134 to the drive signal electrode 130.

[Drive ground electrode, drive ground wiring and drive ground terminal]
As shown in FIGS. 1 and 2, the drive ground electrode 140 as the second drive electrode is formed at the tip portions 40 a and 42 a on the tip side of the drive signal electrode 130 of the first drive vibrating arm 40. More specifically, the drive ground electrode 140 is formed on the first and second surfaces 101 and 102 of the tip portions 40 a and 42 a of the first drive vibrating arm 40. Further, the drive ground electrode 140 is formed on the side surface 103 of the first drive vibrating arm 40. The drive ground electrodes 140 formed on the surfaces 101 and 102 and the side surface 103 of the first drive vibrating arm 40 are electrically connected to each other. Further, the drive ground electrodes 140 as the fourth drive electrodes formed on the surfaces 101 and 102 and the side surface 103 of the second drive vibrating arm 42 are electrically connected to each other. Further, the drive ground electrode 140 is formed on the first and second surfaces 101 and 102 of the second drive vibrating arm 42. However, in the illustrated example, the drive ground electrode 140 is not formed on the tip portions 44a and 46a. In the illustrated example, the drive ground electrode 140 is disposed symmetrically with respect to the XZ plane. The drive ground electrode 140 has a potential that serves as a ground with respect to the drive signal electrode 130.

  The drive ground wiring 142 is formed on the third and fourth beams 54 and 56. More specifically, the drive ground wiring 142 can be formed on the second surface 102 and the side surface 103 of the third and fourth beams 54 and 56. Further, the drive ground wiring 142 includes the second surface 102 of the base 10, the side surface 103 e parallel to the XZ plane of the first connecting arm 20, the second surface 102 of the second connecting arm 22, and the second connecting arm 22. The side surface 103f is parallel to the YZ plane. In the example shown in the drawing, the drive ground wiring 142 is arranged in plane symmetry with respect to the XZ plane.

  The drive ground terminal 144 is formed on the first support portion 60. More specifically, the drive ground terminal 144 can be formed on the first and second surfaces 101 and 102 of the first support portion 60 and on the side surface 103. The drive ground terminals 144 formed on the surfaces 101 and 102 and the side surface 103 of the first support part 60 are electrically connected to each other. In the illustrated example, the drive ground terminal 144 formed on the first support portion 60 is on the positive direction side of the Y axis with respect to the distal end portion 44a of the second drive vibrating arm 42 on which the drive signal electrode 130 is formed. Has been placed. That is, it can be said that the drive ground terminal 144 formed on the first support portion 60 and the drive signal electrode 130 formed on the distal end portion 44a face each other in the Y-axis direction.

  The drive ground terminal 144 formed on the first support portion 60 is connected to the drive ground formed on the first drive vibration arm 40 and the second drive vibration arm 42 via the drive ground wiring 142 formed on the third beam 54. The electrode 140 is electrically connected. More specifically, the drive ground terminal 144 is connected to the drive ground wiring 142 formed on the second surface 102 and the side surface 103 of the third beam 54, and the drive ground wiring 142 is connected to the second surface of the third beam 54. 102 and the side surface 103 are connected to the drive ground electrode 140 formed on the side surface 103 of the first drive vibration arm 40 through the second surface 102 of the base 10 and the side surface 103e of the first connecting arm 20. Further, the drive ground wiring 142 passes from the second surface 102 of the base 10 through the second surface 102 of the second connecting arm 22, and the drive ground electrode 140 is formed on the second surface 102 of the second drive vibrating arm 42. It is connected to the. Further, the drive ground wiring 142 is driven on the first surface 101 of the second drive vibration arm 42 from the second surface 102 of the second connection arm 22 through the side surface 103f of the second connection arm 22. It is connected to the ground electrode 140.

  As described above, the resonator element 100 includes various drive signal electrodes, wirings, and terminals (symbols: 130, 132, and 134), various driving ground electrodes, wirings, and terminals (symbols: 140, 142, and 144) and Is arranged. Accordingly, in the resonator element 100, the drive signal is applied between the drive signal terminal 134 formed on the second support portion 62 and the drive ground terminal 144 formed on the first support portion 60, thereby An electric field is generated between the drive signal electrode 130 and the drive ground electrode 140 formed on the drive vibration arm 40 and the second drive vibration arm 42 to drive and vibrate the first drive vibration arm 40 and the second drive vibration arm 42. be able to.

[Operation of vibrating piece]
3 and 4 are schematic plan views for explaining the operation of the resonator element 100. 3 and 4, for convenience, the base 10, the first connecting arm 20 and the second connecting arm 22, the first detecting vibrating arm 30 and the second detecting vibrating arm 32, the first driving vibrating arm 40 and the second driving. Illustrations other than the vibrating arm 42 are omitted.

  As shown in FIG. 3, in the vibration piece 100, when an electric field is generated between the drive signal electrode and the drive ground electrode in a state where the angular velocity is not applied, the first drive vibration arm 40 and the second drive vibration arm 42 are moved to the arrow A Bending vibration is performed in the direction shown in FIG. At this time, since the first drive vibrating arm 40 and the second drive vibrating arm 42 perform plane-symmetric vibration with respect to the YZ plane passing through the center of gravity G of the resonator element 100, the base 10, the first connecting arm 20, and The second connecting arm 22, the first detection vibrating arm 30, and the second detection vibrating arm 32 hardly vibrate.

  When an angular velocity ω around the Z axis is applied to the resonator element 100 in a state where this driving vibration is being performed, vibration as shown in FIG. 4 is performed. That is, Coriolis force in the direction of arrow B acts on the first drive vibration arm 40, the second drive vibration arm 42, and the connecting arms 20 and 22 constituting the drive vibration system, and new vibration is excited. This vibration in the direction of arrow B is a vibration in the circumferential direction with respect to the center of gravity G. At the same time, the detection vibration arms 30 and 32 are excited in the direction indicated by the arrow C in response to the vibration indicated by the arrow B. The distortion of the piezoelectric material generated by this vibration is detected by the detection signal electrode and the detection ground electrode formed on the detection vibrating arms 30 and 32, and the angular velocity is obtained.

(Vibration gyro)
Next, a vibration gyro as a physical quantity detection device including the vibration piece 100 will be described with reference to the drawings.
5A and 5B are diagrams for explaining the vibrating gyroscope 201 of the present embodiment, in which FIG. 5A is a schematic plan view seen from above, and FIG. 5B is a schematic cross-sectional view showing a cross section taken along line AA of FIG. 5A shows a state in which the lid 203 as a lid provided above the vibrating gyroscope is removed for convenience of explaining the internal structure of the vibrating gyroscope, and the mounting position of the lid 203 is shown. It is indicated by a broken line. FIG. 6 is a schematic plan view of the vibrating gyroscope as seen from the bottom side. FIG. 7 is a schematic plan view for explaining an IC mounting portion 201A to which an IC chip 260 as an electronic component included in the vibration gyro 201 of the present embodiment is bonded. FIG. 8 illustrates a relay board 250 as a relay unit that relays the connection between the vibrating piece 100 and the package base 202 in the vibrating gyroscope 201 of the present embodiment. 100 is a schematic plan view seen from the side to which 100 is joined, and FIG. 9B is a schematic plan view seen from the lower side (side to be joined to the package base 202).
Note that in the vibrating gyroscope 201 according to the present embodiment, members having the same functions as those of the constituent members of the resonator element 100 according to the present embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. Illustration is omitted.

  As shown in FIG. 5, the vibration gyro 201 includes a package having a package base 202 as a base substrate and a lid 203, an IC chip 260 as an electronic component joined in the package, and a relay substrate as a relay unit. And the resonator element 100 joined through the connector 250.

[Package base]
The package base 202 is formed, for example, by providing a rectangular annular second layer substrate 221 and a third layer substrate 231 having different opening sizes on a flat plate first layer substrate 211 in this order. A recess having a portion is formed, and the resonator element 100 and the IC chip 260 can be accommodated in the recess. As a material of the package base 202, for example, ceramic, glass or the like can be used.

  As shown in FIG. 5 and FIG. 7, a die pad 212 on which the IC chip 260 is disposed is provided on the first layer substrate 211 that is a concave bottom portion of the concave portion of the package base 202. Further, as shown in FIGS. 5B and 6, an external surface used for bonding to an external substrate is provided on a surface different from the surface provided with the die pad 212 of the first layer substrate 211 that becomes the outer bottom surface of the package base 202. Mounting terminals 214 to 219 are provided. A sealing hole 213 that communicates the recessed space of the package base 202 with the outside is provided in a region that does not overlap in plan view with the region where the die pad 212 and the external mounting terminals 214 to 219 are provided on the first layer substrate 211. The sealing hole 213 is closed by a sealing material 293.

  In the recess of the package base 202, a step formed so as to surround the die pad 212 by the second layer substrate 221 is bonded corresponding to the plurality of electrode pads 265 as the electronic component side bonding portions of the IC chip 260. A first IC connection terminal 225a as a first base substrate side bonding part, a second IC connection terminal 225b as a second base substrate side bonding part, and a plurality of other base substrate side bonding parts An IC connection terminal 225 is provided.

Further, in the recess of the package base 202, a third layer substrate is provided on the second layer substrate 221 provided with the first IC connection terminal 225a, the second IC connection terminal 225b, and the other IC connection terminals 225. As the first protrusion terminal 234 and the second protrusion as a first protrusion having a plurality of protrusions formed by 231 and connection terminals provided on the protrusions and electrically connected to the relay substrate 250. A second protrusion terminal 235, a third protrusion terminal 236 as a third protrusion, a fourth protrusion terminal 237 as a fourth protrusion, and a fifth protrusion terminal 238 as a fifth protrusion. ing.
The above-mentioned various terminals provided on the package base 202 are connected to each other by inter-layer wirings such as routing wirings and through holes (not shown).

Here, the positional relationship between the IC connection terminal and the protrusion terminal, which is an important configuration in the vibration gyro 201 of the present embodiment, will be described in detail.
As shown in FIG. 7, among the IC connection terminals that are electrically connected in correspondence with the plurality of electrode pads 265 of the IC chip 260, the first IC connection terminal 225a and the second IC connection terminal 225b are: It is arranged on one end side of the package base 202 in the plan view and adjacent to one end of the IC chip 260.
In addition, a plurality of other IC connection terminals 225 are arranged in the region sandwiching the adjacent first IC connection terminal 225a and the second IC connection terminal 225b and the other end side of the package base 202. Yes.

  Between the first IC connection terminal 225a and the second IC connection terminal 225b in plan view, at least a part of the first protrusion terminal 234 is disposed. In the present embodiment, the first protrusion terminal 234 and the first IC connection terminal 225a and the second IC connection terminal 225b disposed adjacent to both sides of the first protrusion terminal 234 are described later. In the electric circuit formed in the vibration gyro 201, the terminals have the same potential.

  Further, the first IC connection terminal 225a, the second IC connection terminal 225b, and the first protrusion terminal 234 are sandwiched between the first IC connection terminal 225a and the first protrusion connection terminal 234 in the plan view. The second projecting terminal 235 and the third projecting terminal 236 are provided in a positional relationship in which at least a part of the IC connecting terminal 225 other than the second IC connecting terminal 225b is further sandwiched therebetween. In the present embodiment, the IC connection terminal 225 adjacent to each of the second protrusion terminal 235 and the third protrusion terminal 236 in plan view is a terminal having the same potential in an electric circuit formed in the vibration gyro 201 as will be described later. It has become.

  Further, at least one of the IC connection terminals 225 other than the first IC connection terminal 225a and the second IC connection terminal 225b is located near the other end of the package base 202 in plan view and in the vicinity of the other end of the IC chip 260. The fourth projecting terminal 237 and the fifth projecting terminal 238 are provided in a positional relationship with the parts sandwiched therebetween. In the present embodiment, the IC connection terminal 225 adjacent to each of the fourth protrusion terminal 237 and the fifth protrusion terminal 238 in plan view is a terminal having the same potential in an electric circuit formed in the vibration gyro 201 as will be described later. It has become.

[IC mounting part]
Next, the IC mounting part 201A on which the IC chip 260 is mounted in the package base 202 will be described.
In FIG. 7, the IC chip 260 includes a drive circuit for driving and vibrating the vibrating piece 100 and a detection circuit for detecting detected vibration generated in the vibrating piece 100 when an angular velocity is applied. Specifically, the drive circuit included in the IC chip 260 supplies a drive signal to the drive signal electrode 130 formed on the first drive vibrating arm 40 of the vibrating piece 100. Further, the detection circuit included in the IC chip 260 includes a first detection signal generated in the detection signal electrode 110 formed on the first detection vibrating arm 30 of the vibrating piece 100 and a detection ground electrode formed on the second detection vibrating arm 32. The second detection signal generated at 120 is differentially amplified to generate a differential amplification signal, and a physical quantity is detected based on the differential amplification signal.

  In FIG. 7 and FIG. 5B, the IC chip 260 is bonded and fixed on the die pad 212 provided at the concave bottom portion of the concave portion of the package base 202 by, for example, a brazing material 294. In the present embodiment, the IC chip 260 and the package base 202 are electrically connected using a wire bonding method. That is, the plurality of electrode pads 265 provided on the IC chip 260 and the corresponding first IC connection terminal 225a, the second IC connection terminal 225b, or the IC connection terminal 225 of the package base 202 are connected to the bonding wire 291. Connected by.

[Vibration piece mounting part]
Next, the vibration piece 100 mounting portion in the vibration gyro 201 will be described.
As shown in FIG. 5, the resonator element 100 is bonded via the relay substrate 250 above the IC chip 260 in the recess of the package base 202.
First, the relay board 250 that relays the connection of the resonator element 100 to the package base 202 will be described in detail.
As shown in FIG. 8, the relay substrate 250 includes a base material 251 and relay electrodes and connection wirings formed on the base material 251. That is, on one main surface of the base material 251 (the main surface on the side to which the resonator element 100 is joined), as shown in FIG. 8A, two opposing sides of the substantially rectangular base material 251 in plan view. The second relay electrode 245, the fourth relay electrode 244, and the third relay electrode 246 are provided on one end side in the vicinity (in the present embodiment, the short side of the base member 251). In the present embodiment, the fourth relay electrode 244 is provided in the approximate center on one side of the base material 251, and the second relay electrode 245 and the third relay electrode 246 are disposed on both sides of the fourth relay electrode 244. .
Further, a first relay electrode 247, a sixth relay electrode 249, and a fifth relay electrode 248 are provided on the other end side of the base material 251. In the present embodiment, a sixth relay electrode 249 is provided at a position facing the fourth relay electrode 244 on the other end side of the base 251, and the second relay electrode is provided on both sides of the sixth relay electrode 249. The first relay electrode 247 and the fifth relay electrode 248 are disposed at positions facing the 245 and the third relay electrode 246, respectively.

  Further, on the other main surface of the relay substrate 250 (the side to be joined to the package base 202), the first relay electrode 247, the second relay electrode 245, the third relay electrode 246, the fourth relay electrode 244, and the fifth relay electrode. 248 and the sixth relay electrode 249 overlap with the first relay terminal 257, the second relay terminal 255, the third relay terminal 256, the fourth relay terminal 254, the fifth relay terminal 258, A relay terminal 259 is provided. The first relay terminal 257, the second relay terminal 255, the third relay terminal 256, the fourth relay terminal 254, the fifth relay terminal 258, the sixth relay terminal 259, and the corresponding first relay electrode 247 and second relay electrode 245. The third relay electrode 246, the fourth relay electrode 244, the fifth relay electrode 248, and the sixth relay electrode 249 are electrically connected. In the present embodiment, the first to sixth relay terminals are connected to the corner portions of the substantially rectangular base material 251 and the side wirings (not shown) formed on the side walls of the notches C1 to C9 provided on each side. The corresponding first to sixth relay electrodes are electrically connected. In other words, the first relay electrode 247 and the first relay terminal 257 are connected by the side wiring provided in the notch C7, and the second relay electrode 245 and the second relay terminal 255 are provided in the notch C4. The third relay electrode 246 and the third relay terminal 256 are connected by the side wiring provided in the cutout portion C6, and the fourth relay electrode 244 and the fourth relay terminal 254 are connected in the cutout portion C5. The fifth relay electrode 248 and the fifth relay terminal 258 are connected by the side wiring provided in the notch portion C8, and the sixth relay electrode 249 and the sixth relay terminal 259 are connected. They are connected by side wiring provided in the notch C9.

In addition, on the other main surface side of the relay substrate 250, the fourth relay terminal 254 and the sixth relay connected to the fourth relay electrode 244 and the sixth relay electrode 249 provided on the one main surface, respectively. The terminal 259 is electrically connected by the two-electrode connection wiring 252.
Various materials can be used as the material for the base 251 of the relay substrate 250. In this embodiment, a material that does not transmit laser light, such as polyimide or glass epoxy resin, is used. In the manufacturing process of the vibrating gyroscope 201, when the frequency is adjusted by trimming a part of the electrode of the vibrating piece 100 using a laser, the laser beam suppresses damage to the IC chip 260 and the like below the vibrating piece 100. Because.

Next, a description will be given of bonding involving electrical connection of the resonator element 100 to the package base 202 via the relay substrate 250 and the positional relationship between the electrodes and terminals of each part at that time.
As shown in FIG. 5, the vibrating piece 100 has its support portions 60 and 62 electrically connected to and fixed to the relay board 250 by, for example, a conductive adhesive 295, and the relay board 250 has a conductive property, for example. The adhesive 296 is fixed in a state of being electrically connected to the package base 202.

  The drive ground terminal 144, the detection ground terminal 124, the detection signal terminal 114, and the drive signal terminal 134, the detection ground terminal 124, and the detection that are formed on the first support portion 60 of the resonator element 100. The signal terminal 114 (see also FIGS. 1 and 2) is connected to a corresponding relay electrode provided on one main surface side of the relay substrate 250 by, for example, a conductive adhesive 295. In the present embodiment, the drive ground terminal 144, the detection ground terminal 124, and the detection signal terminal 114 provided on the first support unit 60 are provided with the second relay electrode 245 and the fourth relay provided on one end side of the relay board 250. The electrode 244 and the third relay electrode 246 are joined in this order, and the drive signal terminal 134, the detection ground terminal 124, and the detection signal terminal 114 of the second support portion 62 are provided on the other end side of the relay substrate 250. The first relay electrode 247, the sixth relay electrode 249, and the fifth relay electrode 248 are connected in this order.

  The relay substrate 250 to which the resonator element 100 is bonded is, for example, a first protrusion terminal 234, a second protrusion terminal 235, and a third protrusion formed by the third layer substrate 231 of the package base 202 by using a conductive adhesive 296. It is connected and fixed to the part terminal 236, the fourth projecting terminal 237, and the fifth projecting terminal 238. In the present embodiment, a first relay terminal 257, a second relay terminal 255, a third relay terminal 256, a fourth relay terminal 254, and a fifth relay terminal 258 provided on the other main surface side of the relay board 250, respectively. Corresponding fourth projecting terminal 237, second projecting terminal 235, third projecting terminal 236, first projecting terminal 234, and fifth projecting terminal 238 are respectively connected.

  As described above, the resonator element 100 includes the first relay electrode 247, the second relay electrode 245, the third relay electrode 246, the fourth relay electrode 244, and the fifth relay electrode 248 on one main surface side of the relay substrate 250. , And the six relay electrodes of the sixth relay electrode 249. Here, the detection ground terminal 124 connected to the fourth relay electrode 244 and the detection ground terminal 124 connected to the sixth relay electrode 249 (see also FIGS. 1 and 2) have the same potential, In the embodiment, the corresponding fourth relay terminal 254 and the sixth relay terminal 259 provided on the other main surface side of the relay board 250 are connected by the two-electrode connection wiring 252, so that the relay board 250 has 1 Output as two common terminals. Therefore, the connection between the relay substrate 250 and the package base 202 is made by connecting the five relay terminals (reference numerals: 254, 255, 256, 257, 258) and the projecting terminals (reference numerals: 234, 235, 236, 237, 238). Can be done by joining.

In the present embodiment, among the fourth relay terminal 254 and the sixth relay terminal 259 connected by the two-electrode connection wiring 252, the first relay terminal 257 and the fourth protrusion terminal 234 of the package base 202 are connected. However, the sixth relay terminal 259 may be connected to the protruding terminal of the package base 202.
Further, another relay terminal connected to the fourth relay terminal 254, the sixth relay terminal 259, and the two-electrode connection wiring 252 is provided on the relay board, and is connected to the projecting terminal of the package base 202. Also good.

In this way, by combining the six connection points of the resonator element 100 into five by the relay substrate 250, the projecting terminals of the package base 202 can be reduced by one. This increases the degree of freedom in designing the package base 202 in a limited area, and is effective in reducing the size of the vibration gyro.
In this embodiment, as shown in FIG. 5B and FIG. 7, the projecting terminal is not required at the position on the other end side corresponding to the first projecting terminal 234 on the one end side of the package base 202. A sealing hole 213 is provided in the region.

  As shown in FIG. 5, a lid 203 as a lid is disposed on the package base 202 to which the IC chip 260 and the resonator element 100 are joined, and the opening of the package base 202 is sealed. As a material of the lid 203, for example, a metal such as 42 alloy (an alloy containing 42% nickel in iron) or Kovar (an alloy of iron, nickel, and cobalt), ceramics, glass, or the like can be used. For example, the lid 203 made of metal is joined to the package base 202 by seam welding via a seal ring 209 formed by punching a Kovar alloy or the like into a rectangular ring shape. A cavity T1 formed by the package base 202 and the lid 203 is a space for the vibration piece 100 to operate.

In the vibrating gyroscope 201 of the present embodiment, the cavity T1 can be sealed and sealed in a reduced pressure space or an inert gas atmosphere. For example, when the inside of the cavity T1 is hermetically sealed with a reduced pressure space, for example, a solid sealing material serving as a prototype of the spherical sealing material 293 is disposed in the sealing hole 213 of the package base 202 In the vacuum chamber, the pressure is reduced to a predetermined degree of vacuum, the gas exiting from the inside of the vibrating gyroscope 201 is discharged from the sealing hole 213, and then the solid sealing material is irradiated with an electron beam or laser. The sealing material 293 is melted and then solidified, whereby the sealing hole 213 is closed and sealed.
Note that the material of the sealing material 293 preferably has a melting point that is higher than the reflow temperature when the completed vibration gyro 201 is mounted on the external mounting substrate. For example, gold and tin (Sn) An alloy, an alloy of gold and germanium (Ge), or the like can be used.

  Next, the effect of the vibration gyro 201 of the above embodiment will be described.

(1) In the vibrating gyroscope 201 of the above embodiment, in the relay board 250 that relays the connection between the resonator element 100 and the package base 202, the fourth relay terminal 254 and the sixth relay terminal 259 having the same potential are connected to the two-electrode connection wiring. By being electrically connected by 252, the six connection points of the resonator element 100 can be reduced to five and output.
Accordingly, one protrusion terminal of the package base 202 that becomes a joint terminal of the relay substrate 250 to which the resonator element 100 is joined can be reduced, so that a functional structure provided on the package base 202 is provided in a limited area. Therefore, a vibration gyro having a small size and high functionality can be provided. For example, in the above-described embodiment, the size of the package base 202 in plan view is increased by eliminating the need for the projecting terminal at the position on the other end side corresponding to the first projecting terminal 234 on the one end side of the package base 202. The sealing hole 213 for hermetically sealing the resonator element 100 could be provided without causing the vibration piece 100 to be sealed.

(2) In the vibration gyro 201 of the above-described embodiment, the protruding terminals and the IC connection terminals that are adjacently arranged in plan view are terminals having the same potential in the electric circuit formed in the vibration gyro 201. It was set as the structure to arrange.
As a result, when using a joining member that is in a paste form before solidification, such as the conductive adhesive 296 used when joining the relay substrate 250 on the protruding terminal, the joining member before solidification is placed on the IC connection terminal side. Even if it flows or droops, it is difficult to cause electrical problems such as a short circuit.

(3) In the said embodiment, the material which does not permeate | transmit a laser, such as a polyimide and a glass epoxy resin, was used for the base material 251 of the relay substrate 250. FIG.
Thus, in the manufacturing process of the vibrating gyroscope 201, when performing frequency adjustment to change the frequency by trimming a part of the electrode of the vibrating piece 100 using a laser to reduce the mass, the laser beam is emitted from the vibrating piece 100. It is possible to avoid problems such as damage caused by irradiation of the IC chip 260 and the like below.

  Although the embodiments of the present invention made by the inventor have been specifically described above, the present invention is not limited to the above-described embodiments and modifications thereof, and various modifications can be made without departing from the spirit of the present invention. It is possible to make changes.

  For example, in the vibrating gyroscope 201 of the above-described embodiment, a configuration in which a material that does not easily transmit laser, such as polyimide or glass epoxy resin, has been described as the material of the base material 251 of the relay substrate 250. For example, in the case of adjusting the frequency by changing the frequency by a mass load method by sputtering a metal film on the resonator element 100 or the like, if there is no need to use a laser, it is not necessary to consider the laser transmittance.

  In the above embodiment, the electrode pad 265 of the IC chip 260 as an electronic component, the corresponding first IC connection terminal 225a, the second IC connection terminal 225b, and a plurality of other IC connection terminals 225, Were bonded by a bonding wire 291 using a wire bonding method. However, the present invention is not limited thereto, and an electronic component such as the IC chip 260 may be face-down bonded using a bonding member such as a metal bump or a conductive adhesive.

  Moreover, in the said embodiment, it was set as the structure which uses the relay board | substrate 250 which provided the relay electrode and the relay terminal in the base material 251 as a relay part. For example, a package smaller than the package base 202 may be used as the relay unit.

Further, in the above-described embodiment, the configuration using the metal material for forming each electrode, wiring, terminal, and the like, which is laminated in the order of chromium and gold from the vibrating piece 100 side, has been described.
Not limited to this, a layer in which nickel and chromium are laminated in order is used as a base layer, and an electrode layer made of, for example, gold is formed thereon by vapor deposition or sputtering, or titanium, tantalum, tungsten, aluminum A metal material such as can also be used. Magnesium or the like can also be used.

In addition, the specific form described in the embodiment and the modified example, for example, the base 10 of the resonator element 100, the first connecting arm 20 and the second connecting arm 22, the first detecting vibrating arm 30 and the second detecting vibrating arm 32, The shapes of the first drive vibrating arm 40 and the second drive vibrating arm 42, the first beam 50, the second beam 52, the third beam 54, the fourth beam 56, the first support portion 60, the second support portion 62, and the like are as follows. It is not limited.
Similarly, the position and shape of each electrode, wiring, terminal, etc. are not limited to the above embodiment.

  In the above embodiment, the vibration gyro 201 as the physical quantity detection device has been described. The present invention is not limited to this, and the present invention is formed by processing a piezoelectric substrate into a desired shape, and when the vibration state of the piezoelectric substrate changes due to the influence of a physical quantity acting from the outside, the change of the vibration state is performed. The present invention is directed to a physical quantity detection device that detects a physical quantity that can be detected through a detection circuit. As such physical quantities, acceleration, angular velocity, and angular acceleration applied to the piezoelectric vibrating piece are particularly preferable. Moreover, an inertial sensor is preferable as the physical quantity detection device.

  DESCRIPTION OF SYMBOLS 10 ... Base part, 20 ... 1st connection arm, 22 ... 2nd connection arm, 30 ... 1st detection vibration arm, 30a ... Tip part, 32 ... 2nd detection vibration arm, 32a ... Tip part, 40 ... 1st drive vibration Arm 40a ... tip part 42 ... second drive vibration arm 42a ... tip part 44a ... tip part 46a ... tip part 50 ... first beam 50a ... S-shaped part 52 ... second beam 52a ... S-shaped part, 54 ... third beam, 54a ... S-shaped part, 56 ... fourth beam, 56a ... S-shaped part, 60 ... first support part, 62 ... second support part, 100 ... vibrating piece 101 ... first surface, 102 ... second surface, 103 ... side surface, 103a ... side surface, 103b ... side surface, 103c ... side surface, 103d ... side surface, 103e ... side surface, 103f ... side surface, 110 ... first and third detection electrodes Detection signal electrode, 112... Detection signal wiring, 114... Detection signal terminal, 12 ... detection ground electrode as second and fourth detection electrodes, 122 ... detection ground wiring, 124 ... detection ground terminal, 130 ... drive signal electrode as first and third drive electrodes, 132 ... drive signal wiring, 134 ... drive Signal terminal, 140 ... Drive ground electrode as second and fourth drive electrodes, 142 ... Drive ground wire, 144 ... Drive ground terminal, 201 ... Vibrating gyro as a physical quantity detection device, 201A ... IC mounting portion, 202 ... Base substrate Package base as 203, lid, 209 ... seal ring, 211 ... first layer substrate, 212 ... die pad, 213 ... sealing hole, 214-219 ... external mounting terminal, 221 ... second layer substrate, 225 ... base substrate IC connection terminal as side bonding part, 225a... First IC connection terminal as first connection terminal, 225b... Second connection Second IC connection terminal as a child, 231... Third layer substrate, 234... First protrusion terminal, 235... Second protrusion terminal, 236... Third protrusion terminal, 237. ... 5th projecting terminal, 244 ... 4th relay electrode, 245 ... 2nd relay electrode, 246 ... 3rd relay electrode, 247 ... 1st relay electrode, 248 ... 5th relay electrode, 249 ... 6th relay electrode, 250 ... Relay board as relay part, 251 ... Base material, 252 ... Two-electrode connection wiring, 254 ... Fourth relay terminal, 255 ... Second relay terminal, 256 ... Third relay terminal, 257 ... First relay terminal, 258 ... 5th relay terminal, 259... 6th relay terminal, 260... IC chip as electronic component, 265... Multiple electrode pads as bonding part on electronic component side, 291... Bonding wire, 293. Adhesive, 296 ... lead Electrical adhesive, C1 to C9 ... notch, G ... center of gravity, T1 ... cavity, ω ... angular velocity.

Claims (3)

A base, a connecting arm extending to both sides from the base, and a first drive extending from the vicinity of one end of the connecting arm to each of two directions orthogonal to the extending direction of the connecting arm. A first driving vibrating arm having an electrode and a second driving electrode, and a third driving electrode extending from the vicinity of the tip of the other connecting arm in the two directions orthogonal to the extending direction of the connecting arm. And a second drive vibration arm having a fourth drive electrode, and between the first drive vibration arm and the second drive vibration arm in plan view, extending from the base to one side, and a first detection electrode and A first detection vibrating arm having a second detection electrode; a second detection vibrating arm having a third detection electrode and a fourth detection electrode extending from the base to the other; the first drive electrode and the third drive; A first drive wiring for electrically connecting an electrode; and the second drive electrode A vibrating piece having a second driving wiring for electrically connecting the said fourth driving electrodes,
A first relay electrode to which the first drive electrode and the third drive electrode are connected, a second relay electrode to which the second drive electrode and the fourth drive electrode are connected, and the first detection electrode are connected A third relay electrode, a fourth relay electrode to which the second detection electrode is connected, a fifth relay electrode to which the third detection electrode is connected, and a sixth relay electrode to which the fourth detection electrode is connected A two-electrode connection wiring that electrically connects the fourth relay electrode and the sixth relay electrode;
A drive circuit for supplying a drive signal to at least one of the first drive electrode and the second drive electrode and at least one of the third drive electrode and the fourth drive electrode; and A first detection signal generated in the formed first detection electrode or the second detection electrode, and a second detection signal generated in the third detection electrode or the fourth detection electrode formed in the second detection vibrating arm. A detection circuit that differentially amplifies the signal to generate a differential amplification signal and detects a physical quantity based on the differential amplification signal, and an electronic component having a plurality of electronic component side bonding portions,
A first base substrate side bonding portion, a second base substrate side bonding portion, and other base substrate side bonding portions that are electrically connected to a plurality of electronic component side bonding portions of the electronic component; A first protrusion and a second protrusion provided with a connection terminal for electrical connection with the relay part on a protrusion protruding in a vertical direction from the base substrate side bonding part and the second base substrate side bonding part. A base substrate having a portion, a third protrusion, a fourth protrusion, and a fifth protrusion,
In plan view, at least a portion is disposed between the first base substrate side bonding portion and the second base substrate side bonding portion, and the fourth relay electrode, the sixth relay electrode, and the two-electrode connection The first protrusion to which at least a part of the wiring is electrically connected;
The second protrusions in a positional relationship in which at least a part of each of the first base substrate-side bonding part, the second base substrate-side bonding part, and the first protrusion is disposed in plan view; The third protrusion, which is disposed on one end side of the base substrate and in the vicinity of one end of the electronic component, and one of the first relay electrode and the second relay electrode is electrically connected A second protrusion, and the third protrusion to which one of the third relay electrode and the fifth relay electrode is electrically connected;
The fourth protrusion and the fifth protrusion, which are disposed near the other end of the base substrate in the plan view and near the other end of the electronic component, the first relay electrode and the second relay. A base substrate having the fourth protrusion to which the other of the electrodes is electrically connected, and the fifth protrusion to which the other of the third relay electrode and the fifth relay electrode is electrically connected; And a physical quantity detecting device. The physical quantity detection device according to claim 1,
Each of the connection terminals provided on the first to fifth protrusions is adjacent to the base substrate-side bonding portion having the same potential as the connection terminal in the base substrate-side bonding portion in plan view. A physical quantity detection device characterized by being arranged. The physical quantity detection device according to claim 1 or 2,
A physical quantity detection device, wherein the base material of the relay portion is formed of a material that does not transmit laser.

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