JP2011117858A - Physical quantity detection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact physical quantity detection device having a plurality of detection axes, while being a single detector. <P>SOLUTION: An IC chip 30 is adhered and fixed by a brazing filler material 29 onto a die pad 15, provided over a first layer substrate 11 serving as the bottom section of the recession of a recession section of a package 10. A plurality of electrode pads 35, provided for the IC chip 30, are connected by bonding wires 27 to IC connection terminals 16 to which the package 10 corresponds. A gyro vibration piece 20 is adhered and fixed to a side surface on the side of a (+) X-axis in Fig. among four side surfaces of the IC chip 30, by insulating adhesive 39 via a relay substrate 40 with its principal surface being turned parallel to the side surface on the X-axis side of the IC chip 30. The gyro vibration piece 20 is adhered and fixed with an electrically conductive silver paste 49, or the like. Here, the detection axes of the gyro vibration piece 20 are turned in a positive direction (+) of the X-axis in Fig. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a physical quantity detection device that detects a physical quantity by detecting vibration and displacement of a piezoelectric vibrating piece.

  Vibration gyro sensor (hereinafter referred to as vibration gyro sensor) as a physical quantity detection device that enhances vehicle body control in vehicles and vehicle position detection in car navigation systems, and vibration control correction functions (so-called camera shake correction) such as digital cameras and digital video cameras. Is widely used. A vibrating gyroscope uses, for example, a gyro vibrating piece as a physical quantity detection element formed by processing a piezoelectric single crystal such as quartz, and generates electricity in a part of the gyro vibrating piece due to vibration such as shaking or rotation of an object. The displacement of the object is obtained by detecting the signal as an angular velocity.

  In recent years, vibration gyros are strongly required to have high sensitivity for realizing more accurate angular velocity detection, and also have a function capable of detecting (sensing) angular velocities in a plurality of directions. For example, when a user-side electronic device equipped with a vibrating gyroscope is identified, the angular velocity (rowing) in the rotation direction about the front-rear direction (X direction) of the user-side electronic device or the left-right direction of the user-side electronic device Sensing (detection) of angular velocity (pitching) in the rotational direction around the (Y direction) or angular velocity (yawing) in the horizontal direction around the vertical direction (Z direction) of the user-side electronic device. Realization is required. As described above, in order to realize sensing of angular velocities in multiple directions, a plurality of gyro devices (piezoelectric devices) in which gyro vibrating pieces (piezoelectric elements) are housed in a package are vertically connected using a connector connection on the substrate. A gyro device that is placed vertically by a connector connection in which a connector terminal portion is provided on the board side that is provided for placement with a user-side electronic device and a connector terminal portion of the gyro device is inserted into the connector portion is provided. A vibrating gyroscope including a plurality of gyro devices is introduced (for example, see Patent Document 1).

  The vibration gyro described in Patent Document 1 includes three gyro devices (piezoelectric devices) in which a gyro vibrating piece (piezoelectric element) is housed in a package in which external connection electrodes (electrodes) are provided on the outer bottom surface, and these gyroscopes. And a board (main board) on which the device is mounted. Of the three gyro devices arranged on the substrate, one gyro device is a conductive adhesive in a state where the external connection electrode and the corresponding connection electrode (land) provided on the main surface of the substrate are aligned. The chip is flip-chip mounted in a horizontal state with the crystal axis of the gyro device in the vertical direction (Z direction) with respect to the substrate by solder or solder. Of the remaining two gyro devices, one is inserted and fixed in the connector section with the detection axis oriented in the X direction with respect to the substrate, and the other is oriented with the crystal axis in the Y direction. It is inserted and fixed in the connector part in the vertical position. Thereby, the angular velocities in the three directions of yawing, rowing, and pitching can be detected by the three gyro devices (piezoelectric devices).

JP 2006-229121 A

  However, in the configuration of the vibrating gyroscope described in Patent Document 1, since the gyro device arranged in a vertical state is connected by connector connection, a connector component is prepared and installed on the board, or external connection of the gyro device is performed. It is necessary to form the electrode in a shape corresponding to the connector part. In addition, in connector connection, a predetermined dimensional difference (play) is required to fit the connector part and the gyro device, and there is a variation in the shape of the connector part and the package. In other words, the vertical axis of the gyro device arranged vertically shifts and the detection axis shifts, and there is a problem that the accuracy of detecting the angular velocity may not be ensured.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A physical quantity detection device according to this application example includes a physical quantity detection element that has a detection axis in a direction orthogonal to both main surfaces, detects a physical quantity, and a drive circuit that drives the physical quantity detection element. A semiconductor circuit element electrically connected to the physical quantity detection element, the physical quantity detection element and the semiconductor circuit element are mounted on one main surface side, and an external substrate on the other main surface side parallel to the one main surface side The semiconductor circuit element has a rectangular parallelepiped outer shape having both main surfaces parallel to each other and side surfaces connecting the two main surfaces with four sides. And the said physical quantity detection element is joined to the said side surface of the said semiconductor circuit element through the relay board | substrate in the aspect which made the both said main surfaces of the said physical quantity detection element parallel.

According to the physical quantity detection device of the above application example, the physical quantity detection element is arranged in a state where the physical quantity detection element is vertically arranged in the physical quantity detection apparatus relatively easily without using a special part such as a connector. The detection axis can be oriented in a desired direction.
Moreover, since the side surface of the semiconductor circuit element is a surface formed by dicing, it can be a highly accurate vertical surface with respect to both main surfaces of the semiconductor circuit element, and also has high flatness. The physical quantity detection element fixed to the side surface can be arranged in a vertical posture with high accuracy. Thereby, a physical quantity detection device in which the detection axis is precisely adjusted in a desired direction can be provided.
Further, the physical quantity detection device can be downsized in plan view by the structure in which the physical quantity detection element is vertically arranged on the side surface of the semiconductor circuit element via the relay substrate.

  Application Example 2 In the physical quantity detection device according to the application example described above, the substrate is a package having a concave bottom surface of a concave portion as the one main surface of the substrate.

  According to this configuration, it is possible to provide a so-called package-type physical quantity detection device such as an SMD component which is small in size and whose detection axis is precisely adjusted in a desired direction.

  Application Example 3 In the physical quantity detection device according to the application example described above, the second physical quantity detection element is provided in the same manner as the physical quantity detection element on the side surface orthogonal to the side surface to which the physical quantity detection element of the semiconductor circuit element is joined. And the second physical quantity detection element is electrically connected to the semiconductor circuit element.

  According to this configuration, the structure of the physical quantity detection device corresponding to two-axis sensing of the X axis and the Y axis, for example, detection of angular velocity, can be realized with a single device relatively easily.

  Application Example 4 In the physical quantity detection device according to the application example described above, a third physical quantity detection element is bonded to the main surface of the semiconductor circuit element on a side different from the side facing the substrate. In addition, the third physical quantity detection element is electrically connected to the semiconductor circuit element.

  According to this configuration, it is possible to provide a physical quantity detection device that can handle triaxial sensing of the X axis, the Y axis, and the Z axis, for example, angular velocity detection, with a single device, relatively easily.

  Application Example 5 In the physical quantity detection device according to the application example described above, the thickness between the two principal surfaces of the semiconductor circuit element and the thickness direction between the two principal surfaces of the previous semiconductor circuit element of the physical quantity detection element. The length is approximate.

  According to this configuration, it is possible to reduce the height of the physical quantity detection device that can handle multi-axis sensing, for example, detection of angular velocity.

The schematic plan view explaining one Embodiment of the vibration gyro as a physical quantity detection apparatus. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 for explaining a schematic structure of the vibration gyro according to the embodiment. The schematic plan view for demonstrating the modification 1 of a vibration gyro. The schematic plan view explaining the modification 2 of a vibration gyro. FIG. 5 is a cross-sectional view taken along the line BB in FIG.

  Preferred embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic plan view for explaining an embodiment of a vibrating gyroscope as a physical quantity detection device, and FIG. 2 is a schematic cross-sectional view showing a cross section taken along line AA of FIG. FIG. 1 shows a state in which a lid (19) provided above the vibrating gyroscope is removed for convenience of explaining the internal structure of the vibrating gyroscope.

  1 and 2, the vibrating gyroscope 1 includes an IC chip 30 as a semiconductor circuit element joined in a package 10 as a substrate and a gyro vibrating piece 20 as a physical quantity detection element on a lid 19. Are hermetically sealed by bonding.

The gyro vibrating piece 20 includes, for example, an excitation vibration part, a detection vibration part, an excitation electrode for exciting the excitation vibration part, and a detection vibration part integrally formed by processing a piezoelectric material such as quartz. And a detection electrode (none of which is shown) for detecting the charge generated from the substrate. The outer shape of the gyro vibrating piece 20 can be precisely formed by wet etching or dry etching a piezoelectric substrate material such as a quartz wafer with a hydrofluoric acid solution or the like.
Further, the gyro vibrating piece 20 of the present embodiment has a detection axis in a direction (X-axis direction in FIGS. 1 and 2) perpendicular to both main surfaces parallel to each other.
As a material of the gyro vibrating piece 20, examples of the piezoelectric material other than quartz include lithium tantalate and lithium niobate, and examples of materials other than the piezoelectric material include silicon.

In the gyro vibrating piece 20, when the angular velocity is applied, the detection vibrating portion vibrates, and an electric charge is generated in the detection electrode. The charge is detected by the detection electrode, and is output as a detection signal to the outside of the vibrating gyroscope 1 through the wiring pattern, connection terminal, and electrode of the relay substrate 40, and is applied to the gyro vibrating piece 20 by a processing device (not shown). The magnitude of the rotational angular velocity can be recognized.
In the description of the present invention, the term “X-axis” is used to mean an axis tilted in the range of greater than 0 degrees and less than or equal to 2 degrees around the (−) X axis and the X axis. The same applies to the “Y axis” and the “Z axis”.

  The package 10 has, for example, a rectangular ring-shaped second layer substrate 12 and a third layer substrate 13 having different opening sizes on a flat plate-like first layer substrate 11 so as to overlap each other in this order. A recess having an opening and a step or a protrusion is formed inside, and the gyro vibrating piece 20 and the IC chip 30 can be accommodated in the recess. As a material of the package 10, for example, ceramic, glass or the like can be used.

As shown in FIGS. 1 and 2, a die pad 15 on which the IC chip 30 is disposed is provided on the first layer substrate 11 which is a concave bottom portion of the concave portion of the package 10. Although not shown, an external mounting terminal used for bonding to an external substrate is provided on the bottom surface (a surface different from the surface on which the die pad 15 is provided) 10b of the first layer substrate 11 serving as the outer bottom surface of the package 10. ing.
In the recess of the package 10, a plurality of IC connection terminals 16 for electrical connection with the IC chip 30 are provided on the step formed by the second layer substrate 12.
The above-mentioned various terminals provided in the package 10 are connected to each other by inter-layer wirings such as routing wirings and through holes (not shown).

  The IC chip 30 includes a drive circuit for driving and vibrating the gyro vibrating piece 20 and a detection circuit for detecting detection vibration generated in the gyro vibrating piece 20 when an angular velocity is applied. Specifically, the drive circuit included in the IC chip 30 supplies a drive signal to the excitation electrode formed on the drive vibrating piece of the gyro vibrating piece 20. Further, the detection circuit included in the IC chip 30 amplifies a detection signal generated in the detection electrode formed in the detection vibration part of the gyro vibrating piece 20 to generate an amplification signal, and a physical quantity based on the amplification signal, for example, Detect angular velocity.

The IC chip 30 includes an active surface 30t as one main surface having a substantially rectangular shape in a plan view provided with a plurality of electrode pads 35, and both main surfaces including the other main surface parallel to the active surface 30t, And a side surface connecting the main surface at four sides. Each side surface is a surface formed by dicing by cutting out individual IC chips 30 from an IC wafer on which a large number of IC chips 30 are formed in the manufacturing process of the IC chip 30, and is exactly perpendicular to both main surfaces. It is formed as a surface.
The IC chip 30 is bonded and fixed to the die pad 15 provided at the bottom of the recess of the package 10 by, for example, a brazing material 29. Further, in this embodiment, the IC chip 30 and the package 10 are electrically connected using a wire bonding method. That is, the plurality of electrode pads 35 provided on the IC chip 30 and the corresponding IC connection terminals 16 of the package 10 are connected by the bonding wires 27.

Of the four side surfaces of the IC chip 30, the gyro vibrating piece 20 is parallel to the X-axis side surface of the IC chip 30 on the (+) X-axis side surface in FIGS. 1 and 2. It is joined via the relay substrate 40 in a manner oriented toward the center.
The relay substrate 40 has a plate-like insulating base material having both main surfaces parallel to each other, and a side surface that is disposed horizontally with the active surface 30t of the IC chip 30 among the side surfaces that connect the two main surfaces of the base material. And a plurality of IC connection terminals 45 formed in the circuit board, and vibration piece connection terminals drawn from the IC connection terminals 45 and used for connection to the gyro vibration piece 20, lead wiring (not shown), and the like. It is configured. The relay substrate 40 is bonded and fixed with an insulating adhesive 39 or the like with one main surface facing the side surface on the (+) X side of the IC chip 30.

The gyro vibrating piece 20 has a vibrating piece connection terminal (not shown) that is provided by pulling out a connection electrode (not shown) formed on one main surface from the excitation electrode and the detection electrode from the IC connection terminal 45 of the relay substrate 40. In a state of being aligned with, for example, silver paste 49 or the like. At this time, as described above, the detection axis of the gyro vibrating piece 20 is arranged with the X-axis direction shown in FIGS.
The plurality of IC connection terminals 45 of the relay substrate 40 and the corresponding electrode pads 35 of the IC chip 30 are joined and electrically connected by the bonding wires 27, whereby the IC chip 30 and the gyro vibrating piece 20 are connected. Electrically connected.

  In the structure in which the gyro vibrating piece 20 is disposed on the side surface of the IC chip 30 via the relay substrate 40, the thickness between the two main surfaces of the IC chip 30 is the gyro vibrating piece 20 vertically disposed on the side surface of the IC chip 30. The IC chip 30 is built in the manufacturing process according to the vertical length. That is, in the lapping process for adjusting the thickness of an IC wafer (silicon wafer) that forms a large number of IC chips 30, the vertical length of the gyro vibrating piece 20 that is vertically arranged on the side surface of the IC chip 30 later is used as a reference. IC wafer wrapping. At this time, the thickness of the IC wafer is set to a length approximate to the length in the vertical direction of the gyro vibrating piece 20 that is vertically disposed on the side surface of the IC chip 30 later. Can be turned upside down.

  As shown in FIG. 2, a lid 19 as a lid is disposed on the package 10 in which the IC chip 30 and the gyro vibrating piece 20 are joined in the recess, and the opening of the package 10 is sealed. As the material of the lid 19, for example, a metal such as 42 alloy (an alloy containing 42% nickel in iron) or Kovar (an alloy of iron, nickel, and cobalt), ceramics, glass, or the like can be used. For example, the lid 19 made of metal is joined to the package 10 by seam welding via a seal ring 18 formed by punching a Kovar alloy or the like into a rectangular ring shape.

A space formed by the recess of the package 10 and the lid 19 is a space for the gyro vibrating piece 20 to operate. This space can be sealed and sealed in a reduced pressure space or an inert gas atmosphere.
For example, in a case where the inside of the space is hermetically sealed with a reduced pressure space, the solid sealing material is placed in a sealing hole (not shown) provided on the bottom surface 10b of the package 10 and is placed in a vacuum chamber. The gas discharged from the inside of the vibrating gyroscope 1 is sufficiently exhausted from the sealing hole by depressurizing to a degree of vacuum, and then the sealing material is melted by irradiating the solid sealing material with an electron beam or a laser. By solidifying, the sealing hole can be closed and sealed.
In this case, it is desirable that the material of the sealing material has a melting point that is higher than the reflow temperature when the completed vibration gyroscope 1 is mounted on the external mounting substrate. For example, the material of the gold and tin (Sn) An alloy, an alloy of gold and germanium (Ge), or the like can be used.

  Next, the effect of the vibration gyro 1 of the above embodiment will be described.

(1) In the vibrating gyroscope 1 of the above-described embodiment, the gyro vibrating piece 20 is joined to the side surface of the IC chip 30 on the (+) X-axis side in the figure via the relay substrate 40, and the detection axis of the gyro vibrating piece 20 is used as the detection axis. They are arranged in the X-axis direction in the figure.
Thereby, for example, the gyro vibrating piece 20 can be disposed in a vertically standing state in the package 10 without using a special component such as a connector. In addition, since the side surface of the IC chip 30 is a surface formed by dicing, the perpendicularity and the flatness with respect to both main surfaces of the IC chip 30 are formed. For example, can be placed upright vertically with respect to the bottom surface 10b of the package 10 (the surface facing the external mounting substrate).
Therefore, it is possible to provide the vibrating gyroscope 1 in which the detection axis is adjusted in a desired direction with relative ease and accuracy.

  (2) Further, according to the vibrating gyroscope 1 of the above embodiment in which the gyro vibrating piece 20 is arranged on the side surface of the IC chip 30 via the relay substrate 40, the vibrating gyroscope is vertically arranged using, for example, a connector or the like. This is advantageous for downsizing compared to the structure.

(3) In the vibrating gyroscope 1 of the above embodiment, the gyro vibrating piece 20 and the IC chip 30 are mounted in the package 10 as a substrate.
Thereby, it can provide as a general-purpose package type vibration gyroscope 1 called what is called a SMD component.

  (4) Further, according to the vibrating gyroscope 1 of the above embodiment, the connection between the IC chip 30 and the gyro vibrating piece 20 via the relay substrate 40 can be performed at a short distance, so that the wiring path is long. There is also an effect that it is possible to avoid the adverse effects of the generated noise.

  The vibration gyro (physical quantity detection device) described in the above embodiment can also be implemented as the following modification.

(Modification 1)
In the above embodiment, the gyro vibrating piece 20 is arranged on one side surface among the four side surfaces of the IC chip 30. Not only this but the vibration gyro which has a some detection axis | shaft can be obtained by arrange | positioning a gyro vibration piece on one side and another side orthogonal to it.
FIG. 3 is a schematic plan view for explaining a modification of the vibration gyro in which gyro vibrating pieces are arranged on two side surfaces of the IC chip. In FIG. 3, as in FIG. 1, for the sake of convenience in explaining the internal structure, a state in which the lid disposed above the vibrating gyroscope is removed is illustrated. Moreover, in this modification shown in FIG. 3, the same code | symbol is attached | subjected about the same structure as the said embodiment, and description is abbreviate | omitted.

  In FIG. 3, the vibration gyro 51 of Modification 1 includes an IC chip 70 bonded in a package 60, and first and second gyro vibrating pieces 20 </ b> A and second gyro disposed on two side surfaces of the IC chip 70. The resonator element 20 </ b> B is hermetically sealed by bonding a lid (not shown) on the package 60.

  The IC chip 70 has almost the same configuration as the IC chip 30 (see FIGS. 1 and 2) of the above embodiment. In FIG. 3, the vibration gyro 51 of the present modification has two gyro vibrating pieces (first and second gyro vibrating pieces 20A, 20B), and therefore is slightly more than the IC chip 30 of the above embodiment. The IC chip 70 provided with many electrode pads 75 is illustrated.

  Similar to the package 10 of the above-described embodiment (see FIGS. 1 and 2), the package 60 is formed on a flat plate-like first layer substrate 61 and a rectangular annular second layer substrate 62 having different opening sizes, and By providing the third layer substrate 63 so as to overlap in this order, an upper end is opened and a recess having a step or a protrusion is formed inside. In FIG. 3, a plurality of electrode pads 75 that are slightly larger than the IC chip 30 (see FIG. 1) of the above embodiment are provided. The package 60 in which the IC connection terminal 66 is disposed on the step formed by the second layer substrate 62 formed at a position surrounding two sides connected at the corners of the IC chip 70 in plan view is illustrated.

  The IC chip 70 is bonded and fixed by, for example, a brazing material 29 on a die pad 65 provided on the first layer substrate 61 that is a concave bottom portion of the concave portion of the package 60. A plurality of electrode pads 75 provided on the IC chip 70 and corresponding IC connection terminals 66 of the package 60 are connected by bonding wires 27.

  Of the four side surfaces of the IC chip 70, on the (+) X-axis side surface shown in FIG. 3, the first gyro vibrating piece 20A has its main surface parallel to the X-axis side surface of the IC chip 70. It is joined via the first relay substrate 40A in the faced manner. Specifically, the first relay substrate 40A is bonded and fixed with an insulating adhesive 39 or the like with one main surface facing the side surface of the IC chip 70 on the (+) X side. In addition, the first gyro vibrating piece 20A is in a state in which a connection electrode (not shown) formed on one main surface is aligned with a vibrating piece connection terminal drawn from the IC connection terminal 45A of the first relay board 40A. It is bonded and fixed with a conductive silver paste 49 or the like. At this time, the detection axis of the first gyro vibrating piece 20A faces the X-axis direction shown in FIG.

  Further, among the four side surfaces of the IC chip 70, the second gyro vibration is provided on the side surface (the (+) Y-axis side surface shown in FIG. 3) orthogonal to the side surface to which the first gyro vibrating piece 20A is joined. The piece 20B is joined via the second relay substrate 40B in such a manner that its main surface is oriented parallel to the side surface of the IC chip 70 on the Y-axis side. Specifically, the second relay substrate 40B is bonded and fixed with an insulating adhesive 39 or the like with one main surface facing the side surface of the IC chip 70 on the (+) Y side. Further, the second gyro vibrating piece 20B is in a state in which a connection electrode (not shown) formed on one main surface is aligned with the vibrating piece connection terminal drawn out from the IC connection terminal 45B of the second relay substrate 40B. It is bonded and fixed with a conductive silver paste 49 or the like. At this time, the detection axis of the second gyro vibrating piece 20B faces the Y-axis direction shown in FIG.

The plurality of IC connection terminals 45A and 45B of the first and second relay boards 40A and 40B and the corresponding electrode pads 75 of the IC chip 70 are joined and electrically connected by the bonding wires 27. Thus, the IC chip 70 and the first and second gyro vibrating pieces 20A and 20B are electrically connected.
Also, a lid is disposed on the package 60 in which the IC chip 70 and the first and second gyro vibrating pieces 20A and 20B are joined in the recess, similarly to the vibrating gyroscope 1 of the above embodiment, and the interior of the package 60 is A hermetically sealed vibrating gyroscope 51 is formed.

  According to the vibration gyro 51 of the first modification, it is possible to provide a small vibration gyro 51 corresponding to the sensing of the two-axis angular velocities of the X axis and the Y axis with one vibration gyro 51.

(Modification 2)
In the embodiment and the first modification, the gyro vibrating piece 20 and the first and second gyro vibrating pieces 20A and 20B are arranged on the side surfaces of the IC chips 30 and 70, respectively. Not only this but also the vibration which has many detection axes in one unit by arranging a gyro vibrating piece on one side of the active surface (one main surface) of the IC chip in addition to the side surface of the IC chip 70. You can get a gyro.
4 is a schematic plan view for explaining a modification 2 of the vibrating gyroscope in which the gyro vibrating piece is also arranged on the active surface of the IC chip, and FIG. 5 is a schematic sectional view showing a cross section taken along line BB in FIG. is there. In FIG. 4, as in FIGS. 1 and 3, a state in which the lid disposed above the vibrating gyroscope is removed is illustrated for convenience of describing the internal structure. Further, in the vibration gyro of the present modification shown in FIGS. 4 and 5, the same components as those of the vibration gyro 1 and 51 of the above-described embodiment and the first modification are denoted by the same reference numerals and description thereof is omitted.

  4 and 5, the vibration gyro 91 according to the second modification includes an IC chip 70 bonded in the package 60, the first gyro vibrating piece 20 </ b> A and the first gyro vibrating piece 20 </ b> A disposed on two side surfaces of the IC chip 70. The gyro vibrating piece 20 </ b> B of 2 and the third gyro vibrating piece 20 </ b> C disposed on the active surface (one main surface) of the IC chip 70 are hermetically sealed by bonding the lid 19 on the package 60. ing.

  Of the four side surfaces of the IC chip 70, the side surface on the (+) X-axis side shown in FIGS. 4 and 5 has the first gyro vibrating piece 20 </ b> A, the main surface of which is the side surface on the X-axis side of the IC chip 70. Are bonded and fixed by an insulating adhesive 39 or the like through the first relay substrate 40A in a manner oriented in parallel with the first relay substrate 40A. In addition, the first gyro vibrating piece 20A is in a state in which a connection electrode (not shown) formed on one main surface is aligned with a vibrating piece connection terminal drawn from the IC connection terminal 45A of the first relay board 40A. It is bonded and fixed with a conductive silver paste 49 or the like. At this time, the detection axis of the first gyro vibrating piece 20A faces the X-axis direction shown in FIGS.

  Of the four side surfaces of the IC chip 70, the second gyro vibration is provided on a side surface (the (+) Y-axis side surface shown in FIG. 4) orthogonal to the side surface to which the first gyro vibrating piece 20A is joined. The piece 20B is bonded and fixed by an insulating adhesive 39 or the like via the second relay substrate 40B. Further, the second gyro vibrating piece 20B is in a state in which a connection electrode (not shown) formed on one main surface is aligned with the vibrating piece connection terminal drawn out from the IC connection terminal 45B of the second relay substrate 40B. It is bonded and fixed with a conductive silver paste 49 or the like. At this time, the detection axis of the second gyro vibrating piece 20B faces the Y-axis direction shown in FIG.

  In addition, on the active surface (the surface on the (+) Z-axis side in FIGS. 4 and 5) which is one main surface of the IC chip 70, the third gyro vibrating piece 20C is interposed via the third relay substrate 40C. Are bonded and fixed by an insulating adhesive 39 or the like. Further, in the third gyro vibrating piece 20C, the connection electrode (not shown) formed on one main surface is aligned with the vibrating piece connection terminal drawn out from the IC connection terminal 45C of the third relay substrate 40C. It is bonded and fixed with a conductive silver paste 49 or the like. At this time, the detection axis of the third gyro vibrating piece 20C faces the Z-axis direction shown in FIGS.

The plurality of IC connection terminals 45A to 45C of each of the first to third relay boards 40A to 40C and the corresponding electrode pads 75 of the IC chip 70 are joined and electrically connected by the bonding wires 27. Thus, the IC chip 70 and the first to third gyro vibrating pieces 20A to 20C are electrically connected.
Further, the lid 19 is disposed on the package 60 in which the IC chip 70 and the first to third gyro vibrating pieces 20A to 20C are joined in the recess, and the vibrating gyro 91 in which the inside of the package 60 is hermetically sealed is formed. Is done.

  According to the vibration gyro 91 of the second modified example, a small vibration gyro 91 that can handle sensing of the three-axis angular velocities of the X axis, the Y axis, and the Z axis with a single vibration gyro 91 is provided. Can do.

  Although the embodiments of the present invention made by the inventor have been specifically described above, the present invention is not limited to the above-described embodiments and modifications thereof, and various modifications can be made without departing from the spirit of the present invention. It is possible to make changes.

  For example, in the vibrating gyros 1, 51 and 91 of the above embodiment, the IC chips 30 and 70 and the packages 10 and 60 as the substrates are bonded by the bonding wire 27 using a wire bonding method. Not limited to this, the IC chips 30 and 70 may be face-down bonded to the package (substrate) using a bonding member such as a metal bump or a conductive adhesive.

Moreover, in the said embodiment, the structure using what laminated | stacked in order of chromium and gold | metal | money etc. was demonstrated as forming metal materials, such as each electrode, wiring, and a terminal.
Not limited to this, a layer in which nickel and chromium are laminated in order is used as a base layer, and an electrode layer made of, for example, gold is formed thereon by vapor deposition or sputtering, or titanium, tantalum, tungsten, aluminum A metal material such as can also be used. Magnesium or the like can also be used.

In addition, the specific form described in the embodiment and the modified example, for example, the shape of the gyro vibrating piece 20 or the like is not limited.
Similarly, the position and shape of each electrode, wiring, terminal, and the like are not limited to the above-described embodiments and modifications.

Further, in the embodiment and the modification, the vibration gyros 1, 51, 91 using the packages 10, 60 as the substrates have been described.
Not only such a package but also a physical quantity detection element such as the gyro vibrating piece 20 and a semiconductor circuit element such as the IC chips 30 and 70 can be mounted on one main surface side, and the other main surface parallel to the one main surface. Any substrate may be used as long as an external mounting terminal provided for bonding to the external substrate is provided on the surface side.

  Further, in the above embodiment, the vibration gyros 1, 51, 91 as the physical quantity detection device have been described. The present invention is not limited to this, and the present invention provides a physical quantity detection device that detects a physical quantity that can be detected through a detection circuit from a change in the vibration state when a change occurs in the vibration state of the physical quantity detection element due to the influence of the physical quantity acting from the outside. Is targeted. As such a physical quantity, acceleration, angular velocity, and angular acceleration applied to a piezoelectric vibrating piece as a physical quantity detection element are particularly preferable. Moreover, an inertial sensor is preferable as the physical quantity detection device.

  DESCRIPTION OF SYMBOLS 1,51,91 ... Vibration gyro as a physical quantity detection device 10, 60 ... Package as a substrate, 10b ... Bottom surface, 11, 61 ... First layer substrate, 12, 62 ... Second layer substrate, 13, 63 ... First Three-layer substrate, 15, 65 ... die pad, 16, 66 ... IC connection terminal (of package), 18 ... seal ring, 19 ... lid, 20 ... gyro vibrating piece as physical quantity detection element, 20A ... first as physical quantity detection element 1 gyro vibrating piece, 20B: second gyro vibrating piece as a physical quantity detecting element, 20C: third gyro vibrating piece as a physical quantity detecting element, 27: bonding wire, 29: brazing material, 30, 70: semiconductor circuit IC chip as an element, 30t... Active surface, 35, 75... Electrode pad, 39 .. insulating adhesive, 40 .. relay board, 40A. B ... 2nd relay board, 40C ... 3rd relay board, 45, 45A-45C ... (connection board) IC connection terminal, 49 ... Silver paste.

Claims (5)

A physical quantity detection element that has a detection axis in a direction perpendicular to both main surfaces and detects a physical quantity;
A semiconductor circuit element including a drive circuit for driving the physical quantity detection element and electrically connected to the physical quantity detection element;
The substrate on which the physical quantity detection element and the semiconductor circuit element are mounted on one main surface side, and an external mounting terminal provided for bonding to an external substrate is provided on the other main surface side parallel to the one main surface; With
The semiconductor circuit element has a rectangular parallelepiped outer shape having both main surfaces parallel to each other and side surfaces connecting the two main surfaces at four sides,
The physical quantity detection device, wherein the physical quantity detection element is joined to the side surface of the semiconductor circuit element via a relay substrate in a form in which the two main surfaces of the physical quantity detection element are parallel to each other. The physical quantity detection device according to claim 1,
The physical quantity detection device, wherein the substrate is a package having a concave bottom surface of a concave portion as the one main surface of the substrate. The physical quantity detection device according to claim 1 or 2,
A second physical quantity detection element is bonded to the side surface of the semiconductor circuit element perpendicular to the side surface to which the physical quantity detection element is bonded, in the same manner as the physical quantity detection element, and the second physical quantity detection element is A physical quantity detection device, wherein the physical quantity detection device is electrically connected to the semiconductor circuit element. In the physical quantity detection device according to any one of claims 1 to 3,
A third physical quantity detection element is bonded to a main surface of the semiconductor circuit element on a side different from the side facing the substrate, and the third physical quantity detection element is connected to the semiconductor circuit. A physical quantity detection device characterized by being electrically connected to an element. In the physical-quantity detection apparatus as described in any one of Claims 1-4,
The physical quantity detection device according to claim 1, wherein a thickness between the two principal surfaces of the semiconductor circuit element and a length in a thickness direction between the two principal surfaces of the semiconductor circuit element of the physical quantity detection elements are approximate.

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