JP2011112480A - Physical quantity detector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact physical quantity detector high in impact resistance. <P>SOLUTION: A relay board 250 to which a gyro vibration piece 100 is joined is connected and fixed with a conductive adhesive 296 to a first protrusion terminal 234, a second protrusion terminal 235, a third protrusion terminal 236, a fourth protrusion terminal 237, and a fifth protrusion terminal 238 which are formed of a third layer substrate 231 of a package 202. Five regions which are a region between the first protrusion terminal 234 and the second protrusion terminal 235, a region between the first protrusion terminal 234 and the third protrusion terminal 236, a region between the second protrusion terminal 235 and the fourth protrusion terminal 237, a region between the third protrusion terminal 236 and the fifth protrusion terminal 238, and a region between the fourth protrusion terminal 237 and the fifth protrusion terminal 238 on a step formed by the third layer substrate 231 in a recess of the package 202 are joined to a part of the relay board 250 located above these regions with an adhesive 299. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a physical quantity detection device that detects a physical quantity by detecting vibration and displacement of a piezoelectric vibrating piece.

  Vibration gyro sensor (hereinafter referred to as vibration gyro sensor) as a physical quantity detection device that enhances vehicle body control in vehicles, vehicle position detection in car navigation systems, and vibration control correction functions (so-called camera shake correction) for digital cameras and digital video cameras. Is widely used. A vibrating gyroscope uses, for example, a gyro vibrating piece as a physical quantity detection element formed by processing a piezoelectric single crystal such as quartz, and generates electricity in a part of the gyro vibrating piece due to vibration such as shaking or rotation of an object. The displacement of the object is obtained by detecting the signal as an angular velocity.

  In recent years, with the progress of miniaturization of the above-mentioned electronic devices on which a vibration gyro is mounted, there is an increasing demand for vibration gyro in addition to high functionality. In order to meet such requirements, a gyro vibrating piece (angular velocity sensor element) and a semiconductor circuit element (IC device) including a drive circuit for driving the gyro vibrating piece are placed in a package via a relay substrate (mounting substrate). A joined vibration gyro (angular velocity sensor) has been introduced (see, for example, Patent Document 1).

The vibration gyro described in Patent Document 1 includes a package in which a recess having a frame-shaped step is formed, and a relay substrate on which one side of the gyro vibration piece and the semiconductor circuit element are mounted side by side. . At least both ends of the relay substrate are joined together with electrical connection by a conductive adhesive on a step in the package. Thereby, the gyro vibrating piece, the semiconductor circuit element, and the package are electrically connected via the relay substrate, and the relay substrate is installed with a gap between the concave bottom portion of the recess. A lid (cap) as a lid is bonded on the package, and the gyro vibrating piece mounted on the relay substrate and the semiconductor circuit element are hermetically sealed.
Note that the vibrating gyroscope disclosed in Patent Document 1 has a gyro vibrating piece and a semiconductor circuit element mounted side by side on a relay board, but the gyro vibrating piece mounted on the relay board by bonding the semiconductor circuit element to the concave bottom portion of the package. Can be constructed so as to be constructed on the step of the package so as to be constructed above the semiconductor circuit element. According to this configuration, the size of the vibration gyro in plan view can be reduced.

Japanese Unexamined Patent Publication No. 2009-41962

  However, in the configuration of the vibrating gyroscope described in Patent Document 1, the junction between the relay substrate on which the gyro vibrating piece is mounted and the package is performed only with a conductive adhesive. In other words, the relay electrode of the relay substrate connected to the drive electrode and the detection electrode of the gyro vibrating piece and the electrical connection by the conductive adhesive with the connection terminal of the corresponding package are joined for the main purpose, There is a possibility that the mechanical bonding strength between the relay substrate and the package is lowered. In particular, in recent years, as the demand for miniaturization of vibration gyros has increased, the connection terminals of packages have also been reduced in area. There is a problem that the impact resistance of the vibrating gyroscope may not be sufficiently ensured due to being low.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A physical quantity detection device according to this application example includes a physical quantity detection element including a package, a vibration part in which a drive electrode is formed, and a detection part in which a detection electrode is formed, the drive electrode, A plurality of relay electrodes to which the detection electrodes are electrically connected, and a relay board that relays the joint with the physical quantity detection element and the package, and is mounted on the relay board. In addition, the physical quantity detection device in which the physical quantity detection element is housed in the package, the package having a plurality of projecting terminals for electrical connection with the relay electrode, the relay electrode, The joint terminal is joined with an electrical connection by a conductive joining member, and the relay substrate and the package serve as a reinforcing joining member in a region between the adjacent projecting terminals. Characterized in that it is joined Ri.

  According to the physical quantity detection device of the above application example, as compared with the physical quantity detection device having a conventional structure in which the joint portion between each relay electrode of the relay board and each corresponding projecting terminal of the package is joined by the conductive adhesive. As a result, the bonding area increases. Therefore, by improving the bonding strength between the relay board on which the physical quantity detection element is mounted and the package, it is possible to provide a physical quantity detection apparatus with high impact resistance.

  Application Example 2 In the physical quantity detection device according to the application example, the reinforcing joint member is non-conductive.

  According to this configuration, an electrical failure such as a short circuit due to adhesion of the reinforcing joining member to the joint portion between the relay electrode and the projecting terminal that may occur when a conductive joining member is used as the reinforcing joining member. Can be avoided. As a result, it is possible to increase the bonding area by the reinforcing bonding member, and it is possible to further improve the bonding strength between the relay board on which the physical quantity detection element is mounted and the package.

  Application Example 3 In the physical quantity detection device according to the application example, among the plurality of protrusion terminals, the protrusion terminal electrically connected to the drive electrode and the detection electrode are electrically connected. The projecting portion in which the reinforcing joining member used for joining the region between the projecting portion terminals has conductivity, and the reinforcing joining member having the conductivity is electrically connected to the drive electrode. It is provided so as not to contact the terminal and the protruding terminal electrically connected to the detection electrode, and to be in contact with an independent ground pattern in the physical quantity detection device. .

  According to this configuration, for example, by using a conductive reinforcing joint member such as silver paste, the reinforcing joint member has a shielding effect, and the drive signal and the detection signal having the largest capacitance in the physical quantity detection device are obtained. Since it is possible to avoid problems such as erroneous detection due to interference, it is possible to provide a physical quantity detection device having stable detection characteristics.

  Application Example 4 In the physical quantity detection device according to the application example, the package is joined to a lid through a seal ring, and the seal ring is used as the ground pattern.

  According to this configuration, the configuration of the conventional package type physical quantity detection device in which the physical quantity detection element and the semiconductor circuit element are accommodated in the package and the lid is joined to the package via the seal ring can be applied as it is. There is no need to provide a grounding pattern on the package.

The schematic plan view seen from the one main surface side concerning a vibration gyro. The schematic plan view seen from the other main surface side concerning a vibration gyro. The schematic plan view which looked at one Embodiment of the vibration gyro from the bottom face side. FIG. 6 is a schematic plan view for explaining the operation of a vibrating piece. (A) is a schematic plan view seen from the upper side explaining one Embodiment of a vibration gyro, (b) is a schematic sectional drawing which shows the AA line cross section of (a). The schematic plan view explaining the IC mounting part concerning the vibration gyro of this embodiment. (A) is the schematic plan view which looked at the relay board concerning the vibration gyroscope of this embodiment from the upper side, (b) is the schematic plan view seen from the lower side. (A) is a schematic plan view explaining the modification of a vibration gyro from the upper side, (b) is a schematic sectional drawing which shows the BB sectional view of (a).

  Preferred embodiments of the present invention will be described below with reference to the drawings.

[Vibration piece]
First, a gyro vibrating piece 100 as a physical quantity detection element according to the present embodiment will be described with reference to the drawings. FIG. 1 is a schematic plan view of the gyro vibrating piece 100 viewed from one main surface (first surface 101) side. FIG. 2 is a schematic plan view of the gyro vibrating piece 100 viewed from the other main surface (second surface 102) side. FIG. 2 is a perspective view of FIG. In FIGS. 1 and 2, the drive vibration electrodes, wiring, terminals, etc. are hatched with diagonal lines, which is provided for convenience to make the configuration of each part easy to understand. It is not shown.

  Hereinafter, the shape and the like of the gyro vibrating piece 100 will be described first, the arrangement of each electrode, wiring, and terminal formed on the gyro vibrating piece 100 will be described, and then the operation of the gyro vibrating piece 100 will be described.

[Shape of vibrating piece, etc.]
Examples of the material of the gyro vibrating piece 100 include piezoelectric materials such as quartz, lithium tantalate, and lithium niobate, and silicon. The gyro vibrating piece 100 according to the present embodiment will be described with a so-called double T-type gyroscope as shown in FIGS. 1 and 2 as an embodiment. The gyro vibrating piece 100 has an extension in a plane defined by, for example, the X axis and the Y axis of the crystal axis of quartz (hereinafter referred to as XY plane), and can have a thickness in the Z axis direction. The gyro vibrating piece 100 has a first surface 101 (see FIG. 1) and a second surface 102 (see FIG. 2) that face opposite to each other, and a side surface 103 that connects the first surface 101 and the second surface 102. The first surface 101 and the second surface 102 are surfaces parallel to the XY plane, and the second surface 102 faces the surface of the concave bottom portion of the recess of the package 202 as shown in FIG. It is. The side surface 103 is a surface orthogonal to the first surface 101 and the second surface 102 and parallel to the Z axis. In the description according to the present invention, the term “X-axis” is used to mean an axis tilted in the range of greater than 0 degrees and less than or equal to 2 degrees around the X-axis and the X-axis. The same applies to the “Y axis” and the “Z axis”.

  As shown in FIGS. 1 and 2, the gyro vibrating piece 100 includes a base 10, a first connecting arm 20 and a second connecting arm 22, a first detecting vibrating arm 30 and a second detecting vibrating arm 32, The drive vibration arm 40 and the second drive vibration arm 42, the first beam 50, the second beam 52, the third beam 54 and the fourth beam 56, and the first support portion 60 and the second support portion 62 are included.

  The base 10 has a center of gravity G of the gyro vibrating piece 100. The center of gravity G can be the position of the center of gravity of the gyro vibrating piece 100. The X axis, the Y axis, and the Z axis are orthogonal to each other and pass through the center of gravity G. The gyro vibrating piece 100 can be point symmetric with respect to the center of gravity G. That is, the gyro vibrating piece 100 can be plane-symmetric with respect to the XZ plane and plane-symmetric with respect to the YZ plane.

  The first connecting arm 20 and the second connecting arm 22 extend from the base 10 along the X axis in the positive and negative directions, respectively. The first detection vibrating arm 30 and the second detection vibrating arm 32 extend in the positive and negative directions from the base 10 along the Y axis, respectively. The first drive vibrating arm 40 extends from the first connecting arm 20 along the Y axis in the positive and negative directions, respectively. The second drive vibrating arm 42 extends from the second connecting arm 22 along the Y axis in the positive and negative directions, respectively. The first detection vibrating arm 30 and the second detection vibrating arm 32 constitute a detection vibration system that detects angular velocity. Further, the first connecting arm 20 and the second connecting arm 22, the first driving vibrating arm 40 and the second driving vibrating arm 42 constitute a driving vibration system for driving the gyro vibrating piece 100.

  The distal end portions 30a and 32a of the first detection vibrating arm 30 and the second detection vibrating arm 32 have a substantially rectangular shape having a larger width (the length in the X-axis direction is larger) than other portions. Similarly, the front end portions 40a and 42a and the front end portions 44a and 46a of the first drive vibrating arm 40 and the second drive vibrating arm 42 have a substantially rectangular shape having a width larger than that of the other portions.

  The first support part 60 is disposed on the positive direction side of the Y axis with respect to the first detection vibrating arm 30. The second support portion 62 is disposed on the negative direction side of the Y axis with respect to the second detection vibrating arm 32. The lengths of the support portions 60 and 62 in the X-axis direction are larger than the lengths of the tip end portions 30a and 32a of the first detection vibrating arm 30 and the second detection vibrating arm 32 in the X-axis direction. The total length of the second connecting arm 22 and the base 10 in the X-axis direction is about the same. In the illustrated example, the planar shape of the support portions 60 and 62 is substantially rectangular, but is not particularly limited. The support portions 60 and 62 are disposed apart from the first detection vibrating arm 30 and the second detection vibrating arm 32, and the first driving vibrating arm 40 and the second driving vibrating arm 42. The first support part 60 and the second support part 62 are parts fixed to the package 202 as shown in FIG.

  As shown in FIGS. 1 and 2, the first beam 50 extends from the base portion 10 to the first support portion 60 through between the first detection vibrating arm 30 and the first drive vibrating arm 40. . The second beam 52 extends from the base portion 10 to the second support portion 62 through the space between the second detection vibrating arm 32 and the first drive vibrating arm 40. The third beam 54 extends from the base portion 10 to the first support portion 60 through between the first detection vibrating arm 30 and the second drive vibrating arm 42. The fourth beam 56 extends from the base portion 10 to the second support portion 62 through the space between the second detection vibrating arm 32 and the second drive vibrating arm 42. Thus, the first and third beams 50 and 54 are connected to the first support portion 60, and the second and fourth beams 52 and 56 are connected to the second support portion 62, and the base portion 10 is connected to the first support portion 60. Can be supported. The beams 50, 52, 54, 56 can have S-shaped portions 50a, 52a, 54a, 56a, respectively. In the illustrated example, for example, the first beam 50 extends from the base 10 in the positive direction of the X axis, then extends in the positive direction of the Y axis, and then extends in the negative direction of the X axis. Are extended in the positive direction of the Y axis, then extended in the positive direction of the X axis, and then extended in the positive direction of the Y axis, and connected to the first support portion 60. That is, in the illustrated example, the first beam 50 has three portions in the S-shaped portion 50a that are parallel to the X-axis direction. Similarly, each of the second beam 52, the third beam 54, and the fourth beam 56 has three portions that are parallel to the X-axis direction in the S-shaped portions 52a, 54a, and 56a. The first beam 50, the second beam 52, the third beam 54, and the fourth beam 56 can obtain elasticity in the X-axis direction and the Y-axis direction by the S-shaped portions 50a, 52a, 54a, and 56a.

  As described above, the outer shape of the gyro vibrating piece 100 described above can be precisely formed by wet etching or dry etching a piezoelectric substrate material such as a quartz wafer with a hydrofluoric acid solution or the like.

[Placement of electrodes, wiring, terminals, etc.]
As shown in FIGS. 1 and 2, the gyro vibrating piece 100 includes a detection signal electrode 110 as a first detection electrode and a third detection electrode, a detection signal wiring 112, a detection signal terminal 114, a second detection electrode, and a fourth detection electrode. Detection ground electrode 120 as detection electrode, detection ground wiring 122, detection ground terminal 124, drive signal electrode 130 as first drive electrode and third drive electrode, drive signal wiring 132, drive signal terminal 134, second drive electrode and A driving ground electrode 140 as a fourth driving electrode, a driving ground wiring 142, and a driving ground terminal 144 are formed. 1 and 2, the detection signal electrode 110, the detection signal wiring 112, and the detection signal terminal 114 are indicated by a lower right diagonal line for the sake of convenience in distinguishing and explaining the various electrodes, wirings, and terminals. The ground wiring 122 and the detection ground terminal 124 are indicated by cross diagonal lines, the drive signal electrode 130, the drive signal wiring 132, and the drive signal terminal 134 are indicated by lower left diagonal lines, and the drive ground electrode 140, the drive ground wiring 142, and the drive ground terminal 144 are crossed. It is indicated by vertical and horizontal lines. 1 and 2, electrodes, wirings, and terminals formed on the side surface 103 of the gyro vibrating piece 100 are indicated by bold lines.

  As materials for the above-mentioned various electrodes, various wirings, and various terminals, for example, those laminated in the order of chromium and gold from the gyro vibrating piece 100 side can be used. Various electrodes are electrically separated from each other. Various wirings are electrically separated from each other. The various terminals are electrically separated from each other.

  Hereinafter, various electrodes, wiring, and terminals will be described in detail.

[Detection signal electrode, detection signal wiring and detection signal terminal]
As shown in FIGS. 1 and 2, the detection signal electrode 110 is formed on the first detection vibrating arm 30 and the second detection vibrating arm 32. In the present invention, the detection signal electrode 110 formed on the first detection vibrating arm 30 is a first detection electrode, and the detection signal electrode 110 formed on the second detection vibrating arm 32 is a third detection electrode. However, in the illustrated example, the detection signal electrode 110 is not formed on each of the tip portions 30 a and 32 a of the first detection vibrating arm 30 and the second detection vibrating arm 32. More specifically, the detection signal electrode 110 is formed on the first surface 101 and the second surface 102 of the first detection vibrating arm 30 and the second detection vibrating arm 32. The detection signal electrodes 110 are arranged symmetrically with respect to the XZ plane. The detection signal electrode 110 is an electrode for detecting the distortion of the piezoelectric material generated by the vibration when the detection vibration of the first detection vibration arm 30 and the second detection vibration arm 32 is excited.

  As shown in FIG. 1, the detection signal wiring 112 is formed on the first and second beams 50 and 52. More specifically, the detection signal wiring 112 can be formed on the first surface 101 of the first and second beams 50 and 52. Further, as shown in FIGS. 1 and 2, the detection signal wiring 112 includes a side surface 103a of the joint portion between the first beam 50 and the base portion 10, a side surface 103b of the joint portion of the second beam 52 and the base portion 10, and The first and second surfaces 101 and 102 of the base 10 can be formed. The detection signal wiring 112 is arranged symmetrically with respect to the XZ plane.

  The detection signal terminal 114 is formed on the first support part 60 and the second support part 62. More specifically, the detection signal terminal 114 can be formed on the first and second surfaces 101 and 102 of the first support portion 60 and the second support portion 62, and further on the side surface 103. The detection signal terminals 114 formed on the surfaces 101 and 102 and the side surface 103 of the first support part 60 are electrically connected to each other. Further, the detection signal terminals 114 formed on the surfaces 101 and 102 and the side surface 103 of the second support portion 62 are electrically connected to each other. In the illustrated example, the detection signal terminal 114 formed on the first support portion 60 has a Y-axis with respect to one tip portion 40a of the first drive vibrating arm 40 on which the drive ground electrode 140 is formed as described later. It is arranged on the positive direction side. That is, it can be said that the detection signal terminal 114 formed on the first support portion 60 and the drive ground electrode 140 formed on the tip end portion 40a face each other in the Y-axis direction. Further, the detection signal terminal 114 formed on the second support portion 62 has a negative Y-axis with respect to the other tip end portion 42a of the first drive vibrating arm 40 on which the drive ground electrode 140 is formed, as will be described later. It is arranged on the direction side. That is, it can be said that the detection signal terminal 114 formed on the second support portion 62 and the drive ground electrode 140 formed on the tip end portion 42a face each other in the Y-axis direction. The detection signal terminals 114 are arranged symmetrically with respect to the XZ plane.

  As shown in FIG. 1, the detection signal terminal 114 formed on the first support portion 60 is formed on the first detection vibrating arm 30 via the detection signal wiring 112 formed on the first beam 50. Are electrically connected to a detection signal electrode 110 as a first detection electrode. More specifically, as shown in FIGS. 1 and 2, the detection signal terminal 114 formed on the first support portion 60 is connected to the detection signal wiring 112 formed on the first surface 101 of the first beam 50. The detection signal wiring 112 passes from the first surface 101 of the first beam 50, the side surface 103 a of the joint portion between the first beam 50 and the base 10, and the first and second surfaces 101 and 102 of the base 10. The detection signal electrode 110 formed on the first and second surfaces 101 and 102 of the first detection vibrating arm 30 can be connected. Thereby, the first detection signal generated by the vibration of the first detection vibrating arm 30 can be transmitted from the detection signal electrode 110 to the detection signal terminal 114 formed on the first support portion 60.

  As shown in FIG. 1, the detection signal terminal 114 formed on the second support portion 62 is formed on the second detection vibrating arm 32 via the detection signal wiring 112 formed on the second beam 52. Are electrically connected to a detection signal electrode 110 as a third detection electrode. More specifically, as shown in FIGS. 1 and 2, the detection signal terminal 114 formed on the second support portion 62 is connected to the detection signal wiring 112 formed on the first surface 101 of the second beam 52. The detection signal wiring 112 passes from the first surface 101 of the second beam 52, through the side surface 103 b of the joint portion between the second beam 52 and the base 10, and through the first and second surfaces 101 and 102 of the base 10. The detection signal electrode 110 formed on the first and second surfaces 101 and 102 of the second detection vibrating arm 32 can be connected. Thereby, the second detection signal generated by the vibration of the second detection vibrating arm 32 can be transmitted from the detection signal electrode 110 to the detection signal terminal 114 formed on the second support portion 62.

[Detection ground electrode, detection ground wiring and detection ground terminal]
As shown in FIGS. 1 and 2, the detection ground electrode 120 is formed on the tip portions 30 a and 32 a on the tip side of the detection signal electrode 110 of the first detection vibrating arm 30 and the second detection vibrating arm 32. In the present invention, the detection ground electrode 120 formed at the distal end portion 30a is the second detection electrode, and the detection ground electrode 120 formed at the distal end portion 32a is the fourth detection electrode. More specifically, the detection ground electrode 120 can be formed on the first and second surfaces 101 and 102 of the tip portions 30a and 32a. Further, the detection ground electrode 120 can be formed on the side surface 103 of the first detection vibration arm 30 and the second detection vibration arm 32. The detection ground electrodes 120 formed on the surfaces 101 and 102 and the side surface 103 of the first detection vibrating arm 30 are electrically connected to each other. The detection ground electrodes 120 formed on the surfaces 101 and 102 and the side surface 103 of the second detection vibrating arm 32 are electrically connected to each other. In the illustrated example, the detection ground electrode 120 is disposed symmetrically with respect to the XZ plane. The detection ground electrode 120 can have a potential that serves as a ground with respect to the detection signal electrode 110.

  The detection ground wiring 122 is formed on the first and second beams 50 and 52. More specifically, the detection ground wiring 122 can be formed on the second surface 102 and the side surface 103 of the first and second beams 50 and 52. Further, the detection ground wiring 122 can be formed on the first and second surfaces 101 and 102 of the base 10. In the example shown in the drawing, the detection ground wiring 122 is arranged symmetrically with respect to the XZ plane.

  The detection ground terminal 124 is formed on the first support portion 60 and the second support portion 62. More specifically, the detection ground terminal 124 can be formed on the first and second surfaces 101 and 102 of the first support portion 60 and the second support portion 62, and further on the side surface 103. The detection ground terminals 124 formed on the surfaces 101 and 102 and the side surface 103 of the first support part 60 are electrically connected to each other. In addition, the detection ground terminals 124 formed on the surfaces 101 and 102 and the side surface 103 of the second support portion 62 are electrically connected to each other. In the illustrated example, the detection ground terminal 124 formed on the first support portion 60 is on the positive direction side of the Y axis with respect to the distal end portion 30a of the first detection vibrating arm 30 on which the detection ground electrode 120 is formed. Has been placed. That is, it can be said that the detection ground terminal 124 formed on the first support portion 60 and the detection ground electrode 120 formed on the distal end portion 30a face each other in the Y-axis direction. Further, the detection ground terminal 124 formed on the second support portion 62 is disposed on the negative direction side of the Y axis with respect to the distal end portion 32a of the second detection vibrating arm 32 on which the detection ground electrode 120 is formed. Yes. That is, it can be said that the detection ground terminal 124 formed on the second support portion 62 and the detection ground electrode 120 formed on the distal end portion 32a face each other in the Y-axis direction. In the example shown in the figure, the detection ground terminals 124 are arranged symmetrically with respect to the XZ plane.

  The detection ground terminal 124 formed on the first support portion 60 is connected to the detection ground electrode as the second detection electrode formed on the first detection vibrating arm 30 via the detection ground wiring 122 formed on the first beam 50. 120 is electrically connected. More specifically, the detection ground terminal 124 formed on the first support portion 60 is connected to the detection ground wiring 122 formed on the second surface 102 and the side surface 103 of the first beam 50, and the detection ground wiring 122 is The first beam 50 is connected to the detection ground electrode 120 formed on the side surface 103 of the first detection vibrating arm 30 from the second surface 102 and the side surface 103 of the first beam 50 through the first and second surfaces 101 and 102 of the base 10. Can be.

  The detection ground terminal 124 formed on the second support portion 62 is connected to the detection ground electrode as the fourth detection electrode formed on the second detection vibrating arm 32 via the detection ground wiring 122 formed on the second beam 52. 120 is electrically connected. More specifically, the detection ground terminal 124 formed on the second support portion 62 is connected to the detection ground wiring 122 formed on the second surface 102 and the side surface 103 of the second beam 52, and the detection ground wiring 122 is The second surface 52 and the side surface 103 of the second beam 52 are connected to the detection ground electrode 120 formed on the side surface 103 of the second detection vibrating arm 32 through the first and second surfaces 101 and 102 of the base 10. Can be.

  As described above, the gyro vibrating piece 100 includes detection signal electrodes, wirings, and terminals (reference numerals: 110,: 112,: 114) and detection ground electrodes, wirings, and terminals (reference numerals: 120,: 122, : 124). Thereby, the detection vibration generated in the first detection vibrating arm 30 appears as a charge between the detection signal electrode 110 and the detection ground electrode 120 formed in the first detection vibrating arm 30 and is formed in the first support portion 60. The detected signal terminal 114 and the detected ground terminal 124 can be taken out as signals. Further, the detected vibration generated in the second detection vibrating arm 32 appears as a charge between the detection signal electrode 110 and the detection ground electrode 120 formed on the second detection vibrating arm 32, and is formed on the second support portion 62. The detection signal terminal 114 and the detection ground terminal 124 can be taken out as signals.

[Drive signal electrode, drive signal wiring and drive signal terminal]
As shown in FIGS. 1 and 2, the drive signal electrode 130 is formed on the first drive vibrating arm 40. However, in the illustrated example, the drive signal electrode 130 is not formed at the distal end portions 40 a and 42 a of the first drive vibrating arm 40. More specifically, the drive signal electrode 130 is formed on the first surface 101 and the second surface 102 of the first drive vibrating arm 40. Further, the drive signal electrode 130 is formed on the side surface 103 of the second drive vibration arm 42 and the first and second surfaces 101 and 102 of the tip portions 44 a and 46 a of the second drive vibration arm 42. The drive signal electrodes 130 formed on the surfaces 101 and 102 and the side surface 103 of the second drive vibrating arm 42 are electrically connected to each other. Further, the drive signal electrodes 130 formed on the surfaces 101 and 102 and the side surface 103 of the second drive vibrating arm 42 are electrically connected to each other. In the illustrated example, the drive signal electrodes 130 are arranged symmetrically with respect to the XZ plane. The drive signal electrode 130 is an electrode for exciting the drive vibration of the first drive vibration arm 40 and the second drive vibration arm 42. In the present invention, the drive signal electrode 130 formed on the first drive vibration arm 40 is used as the first drive electrode, and the drive signal electrode 130 formed on the distal end portions 44a and 46a of the second drive vibration arm 42 is the third drive electrode. A driving electrode is used.

  As shown in FIG. 1, the drive signal wiring 132 is formed on the third and fourth beams 54 and 56. More specifically, the drive signal wiring 132 can be formed on the first surface 101 of the third and fourth beams 54 and 56. Furthermore, the drive signal wiring 132 includes the first surface 101 of the base 10, the first surface 101 of the first connecting arm 20, the side surface 103 c parallel to the YZ plane of the first connecting arm 20, and the second connecting arm 22. The side surface 103d is parallel to the XZ plane. In the illustrated example, the drive signal wirings 132 are arranged symmetrically with respect to the XZ plane.

  As shown in FIGS. 1 and 2, the drive signal terminal 134 is formed on the second support portion 62. More specifically, the drive signal terminal 134 can be formed on the first and second surfaces 101 and 102 of the second support portion 62 and further on the side surface 103. The drive signal terminals 134 formed on the surfaces 101 and 102 and the side surface 103 of the second support part 62 are electrically connected to each other. In the illustrated example, the drive signal terminal 134 formed on the second support portion 62 has a negative Y-axis direction with respect to the one end portion 46a of the second drive vibrating arm 42 on which the drive signal electrode 130 is formed. Arranged on the side. That is, it can be said that the drive signal terminal 134 formed on the second support portion 62 and the drive signal electrode 130 formed on the distal end portion 46a face each other in the Y-axis direction.

  As shown in FIG. 1, the drive signal terminal 134 formed on the second support portion 62 is connected to the first drive vibration arm 40 and the second drive vibration arm via the drive signal wiring 132 formed on the fourth beam 56. The drive signal electrode 130 formed on the electrode 42 is electrically connected. More specifically, the drive signal terminal 134 is connected to the drive signal wiring 132 formed on the first surface 101 of the fourth beam 56, and the drive signal wiring 132 is connected to the first surface 101 of the fourth beam 56 from the first surface 101. Connected to the drive signal electrode 130 as the first drive electrode formed on the first surface 101 of the first drive vibrating arm 40 through the first surface 101 of the base 10 and the first surface 101 of the first connecting arm 20. Can be. Further, as shown in FIGS. 1 and 2, the drive signal wiring 132 extends from the first surface 101 of the first connecting arm 20 through the side surface 103 c of the first connecting arm 20 to the first driving vibration arm 40. Two drive signal electrodes 130 formed on the surface 102 are connected. Further, the drive signal wiring 132 is connected from the first surface 101 of the base 10 to the drive signal electrode 130 formed on the side surface 103 of the second drive vibrating arm 42 through the side surface 103 d of the second connecting arm 22. Further, the second drive vibration arm 42 is connected to a drive signal electrode 130 as a third drive electrode formed on the first surface 101 and the second surface 102 of the tip portions 44a and 46a. Thereby, a drive signal for driving and vibrating the first drive vibrating arm 40 and the second drive vibrating arm 42 can be transmitted from the drive signal terminal 134 to the drive signal electrode 130.

[Drive ground electrode, drive ground wiring and drive ground terminal]
As shown in FIGS. 1 and 2, the drive ground electrode 140 as the second drive electrode is formed at the tip portions 40 a and 42 a on the tip side of the drive signal electrode 130 of the first drive vibrating arm 40. More specifically, the drive ground electrode 140 is formed on the first and second surfaces 101 and 102 of the tip portions 40 a and 42 a of the first drive vibrating arm 40. Further, the drive ground electrode 140 is formed on the side surface 103 of the first drive vibrating arm 40. The drive ground electrodes 140 formed on the surfaces 101 and 102 and the side surface 103 of the first drive vibrating arm 40 are electrically connected to each other. Further, the drive ground electrodes 140 as the fourth drive electrodes formed on the surfaces 101 and 102 and the side surface 103 of the second drive vibrating arm 42 are electrically connected to each other. Further, the drive ground electrode 140 is formed on the first and second surfaces 101 and 102 of the second drive vibrating arm 42. However, in the illustrated example, the drive ground electrode 140 is not formed on the tip portions 44a and 46a. In the illustrated example, the drive ground electrode 140 is disposed symmetrically with respect to the XZ plane. The drive ground electrode 140 has a potential that serves as a ground with respect to the drive signal electrode 130.

  The drive ground wiring 142 is formed on the third and fourth beams 54 and 56. More specifically, the drive ground wiring 142 can be formed on the second surface 102 and the side surface 103 of the third and fourth beams 54 and 56. Further, the drive ground wiring 142 includes the second surface 102 of the base 10, the side surface 103 e parallel to the XZ plane of the first connecting arm 20, the second surface 102 of the second connecting arm 22, and the second connecting arm 22. The side surface 103f is parallel to the YZ plane. In the example shown in the drawing, the drive ground wiring 142 is arranged in plane symmetry with respect to the XZ plane.

  The drive ground terminal 144 is formed on the first support portion 60. More specifically, the drive ground terminal 144 can be formed on the first and second surfaces 101 and 102 of the first support portion 60 and on the side surface 103. The drive ground terminals 144 formed on the surfaces 101 and 102 and the side surface 103 of the first support part 60 are electrically connected to each other. In the illustrated example, the drive ground terminal 144 formed on the first support portion 60 is on the positive direction side of the Y axis with respect to the distal end portion 44a of the second drive vibrating arm 42 on which the drive signal electrode 130 is formed. Has been placed. That is, it can be said that the drive ground terminal 144 formed on the first support portion 60 and the drive signal electrode 130 formed on the distal end portion 44a face each other in the Y-axis direction.

  The drive ground terminal 144 formed on the first support portion 60 is connected to the drive ground formed on the first drive vibration arm 40 and the second drive vibration arm 42 via the drive ground wiring 142 formed on the third beam 54. The electrode 140 is electrically connected. More specifically, the drive ground terminal 144 is connected to the drive ground wiring 142 formed on the second surface 102 and the side surface 103 of the third beam 54, and the drive ground wiring 142 is connected to the second surface of the third beam 54. 102 and the side surface 103 are connected to the drive ground electrode 140 formed on the side surface 103 of the first drive vibration arm 40 through the second surface 102 of the base 10 and the side surface 103e of the first connecting arm 20. Further, the drive ground wiring 142 passes from the second surface 102 of the base 10 through the second surface 102 of the second connecting arm 22, and the drive ground electrode 140 is formed on the second surface 102 of the second drive vibrating arm 42. It is connected to the. Further, the drive ground wiring 142 is driven on the first surface 101 of the second drive vibration arm 42 from the second surface 102 of the second connection arm 22 through the side surface 103f of the second connection arm 22. It is connected to the ground electrode 140.

  As described above, the gyro vibrating piece 100 includes various driving signal electrodes, wirings, and terminals (reference numerals: 130, 132, and 134) and various driving ground electrodes, wirings, and terminals (reference numerals: 140, 142, and 144). And are arranged. As a result, in the gyro vibrating piece 100, the drive signal is applied between the drive signal terminal 134 formed on the second support portion 62 and the drive ground terminal 144 formed on the first support portion 60, thereby An electric field is generated between the drive signal electrode 130 and the drive ground electrode 140 formed on the first drive vibration arm 40 and the second drive vibration arm 42 to drive and vibrate the first drive vibration arm 40 and the second drive vibration arm 42. Can be made.

[Operation of vibrating piece]
3 and 4 are schematic plan views for explaining the operation of the gyro vibrating piece 100. FIG. 3 and 4, for convenience, the base 10, the first connecting arm 20 and the second connecting arm 22, the first detecting vibrating arm 30 and the second detecting vibrating arm 32, the first driving vibrating arm 40 and the second driving. Illustrations other than the vibrating arm 42 are omitted.

  As shown in FIG. 3, in the gyro vibrating piece 100, when an electric field is generated between the drive signal electrode and the drive ground electrode in a state where the angular velocity is not applied, the first drive vibrating arm 40 and the second drive vibrating arm 42 are moved to arrows. Bending vibration is performed in the direction indicated by A. At this time, since the first drive vibrating arm 40 and the second drive vibrating arm 42 perform plane-symmetric vibration with respect to the YZ plane passing through the center of gravity G of the gyro vibrating piece 100, the base 10 and the first connecting arm 20. And the 2nd connection arm 22, the 1st detection vibration arm 30, and the 2nd detection vibration arm 32 hardly vibrate.

  When an angular velocity ω around the Z axis is applied to the gyro vibrating piece 100 in a state where this driving vibration is being performed, the vibration as shown in FIG. 4 is performed. That is, Coriolis force in the direction of arrow B acts on the first drive vibration arm 40, the second drive vibration arm 42, and the connecting arms 20 and 22 constituting the drive vibration system, and new vibration is excited. This vibration in the direction of arrow B is a vibration in the circumferential direction with respect to the center of gravity G. At the same time, the detection vibration arms 30 and 32 are excited in the direction indicated by the arrow C in response to the vibration indicated by the arrow B. The distortion of the piezoelectric material generated by this vibration is detected by the detection signal electrode and the detection ground electrode formed on the detection vibrating arms 30 and 32, and the angular velocity is obtained.

(Vibration gyro)
Next, a vibration gyro as a physical quantity detection device including the gyro vibrating piece 100 will be described with reference to the drawings.
5A and 5B are diagrams for explaining the vibrating gyroscope 201 of the present embodiment, in which FIG. 5A is a schematic plan view seen from above, and FIG. 5B is a schematic cross-sectional view showing a cross section taken along line AA of FIG. 5A shows a state in which the lid 203 as a lid provided above the vibrating gyroscope is removed for convenience of explaining the internal structure of the vibrating gyroscope, and the mounting position of the lid 203 is shown. It is indicated by a broken line. FIG. 6 is a schematic plan view for explaining an IC mounting portion 201A to which an IC chip 260 as a semiconductor circuit element included in the vibration gyro 201 of the present embodiment is bonded. FIG. 7 illustrates a relay board 250 as a relay portion that relays the joining of the gyro vibrating piece 100 and the package 202 in the vibration gyro 201 of the present embodiment. FIG. 7A illustrates the upper side (gyro vibration). FIG. 2 is a schematic plan view seen from the side to which the piece 100 is joined, and FIG.
In the vibrating gyroscope 201 according to the present embodiment, members having the same functions as those of the constituent members of the gyro vibrating piece 100 according to the present embodiment are denoted by the same reference numerals and detailed description thereof is omitted. Part illustration is omitted.

  As shown in FIG. 5, the vibration gyro 201 includes a package having a package 202 as a base substrate and a lid 203, an IC chip 260 as a semiconductor circuit element bonded in the package, and a relay substrate as a relay unit. And a gyro vibrating piece 100 joined through 250.

[Package base]
In the package 202, for example, a rectangular annular second layer substrate 221, a third layer substrate 231, and a fourth layer substrate 241 having different opening sizes are stacked in this order on a flat first layer substrate 211. By providing, a recess having a step or a protrusion is formed, and the gyro vibrating piece 100 and the IC chip 260 can be accommodated in the recess. As a material of the package 202, for example, ceramic or glass can be used.

  As shown in FIG. 5, a die pad 212 on which the IC chip 260 is disposed is provided on the first layer substrate 211 that is the concave bottom portion of the concave portion of the package 202. Although not shown, an external mounting terminal for bonding to an external substrate is provided on a surface different from the surface on which the die pad 212 of the first layer substrate 211 serving as the outer bottom surface of the package 202 is provided.

  On the step formed so as to surround the die pad 212 by the second layer substrate 221 in the recess of the package 202, it corresponds to the plurality of electrode pads 265 provided on the integrated circuit formation surface (active surface) of the IC chip 260. A plurality of IC connection terminals 225 to be joined together are provided.

In the recess of the package 202, a plurality of protrusions formed by the third layer substrate 231 on the second layer substrate 221 provided with the plurality of IC connection terminals 225, and a relay provided on the protrusions. A first projecting terminal 234, a second projecting terminal 235, a third projecting terminal 236, a fourth projecting terminal 237, and a fifth projecting terminal 238 having connection terminals to which the substrate 250 is electrically connected are provided. It has been.
The above-mentioned various terminals provided in the package 202 are connected to each other by an intra-layer wiring such as a lead wiring or a through hole (not shown).

[IC mounting part]
Next, the IC mounting portion 201A on which the IC chip 260 is mounted in the package 202 will be described.
In FIG. 6, the IC chip 260 includes a drive circuit for driving and vibrating the gyro vibrating piece 100 and a detection circuit for detecting detected vibration generated in the gyro vibrating piece 100 when an angular velocity is applied. Specifically, the drive circuit included in the IC chip 260 supplies a drive signal to the drive signal electrode 130 formed on the first drive vibrating arm 40 of the gyro vibrating piece 100. The detection circuit included in the IC chip 260 includes a first detection signal generated at the detection signal electrode 110 formed on the first detection vibration arm 30 of the gyro vibrating piece 100 and a detection ground formed on the second detection vibration arm 32. The second detection signal generated at the electrode 120 is differentially amplified to generate a differential amplification signal, and a physical quantity is detected based on the differential amplification signal.

  As shown in FIGS. 6 and 5B, the IC chip 260 is bonded and fixed to the die pad 212 provided on the concave bottom portion of the concave portion of the package 202 by, for example, a brazing material 294. In the present embodiment, the IC chip 260 and the package 202 are electrically connected using a wire bonding method. That is, the plurality of electrode pads 265 provided on the IC chip 260 and the corresponding IC connection terminals 225 of the package 202 are connected by the bonding wires 291.

[Vibration piece mounting part]
Next, the gyro vibrating piece 100 mounting portion in the vibrating gyro 201 will be described.
As shown in FIG. 5, the gyro vibrating piece 100 is joined via the relay substrate 250 above the IC chip 260 in the recess of the package 202.
As shown in FIG. 7, the relay substrate 250 that relays the connection between the gyro vibrating piece 100 and the package 202 includes a base 251, and relay electrodes and connection wirings formed on the base 251.
Specifically, on one main surface of the base material 251 shown in FIG. 7A (the main surface on the side to which the gyro vibrating piece 100 is joined), two opposing sides of the substantially rectangular base material 251 in plan view. A second relay electrode 245, a first relay electrode 244, and a third relay electrode 246 are provided on one end side in the vicinity (in the present embodiment, the short side of the base member 251). In the present embodiment, the first relay electrode 244 is provided in the approximate center on one side of the base 251, and the second relay electrode 245 and the third relay electrode 246 are disposed on both sides of the first relay electrode 244. .
Further, a fourth relay electrode 247 and a fifth relay electrode 248 are provided on the other end side of the substrate 251. In the present embodiment, the fourth relay electrode 247 and the fifth relay electrode 248 are disposed on the other end side of the base 251 at positions facing the second relay electrode 245 and the third relay electrode 246 described above. Yes.

Further, on the other main surface of the relay substrate 250 shown in FIG. 7B (the side to be joined to the package 202), the position overlapping with each of the first relay electrode 244 to the fifth relay electrode 248 in a plan view, A first relay terminal 254 to a fifth relay terminal 258 are provided. The first relay terminal 254 to the fifth relay terminal 258 and the corresponding first relay electrode 244 to the fifth relay electrode 248 are electrically connected. In the present embodiment, the first relay terminals 254 to 5 are formed by side wirings (not shown) formed on the corners of the substantially rectangular base material 251 and the side walls of the notches C4 to C8 provided on each side. The relay terminal 258 and the corresponding first relay electrode 244 to fifth relay electrode 248 are electrically connected. Specifically, the first relay electrode 244 and the first relay terminal 254 are connected by side wiring provided in the notch C5, and the second relay electrode 245 and the second relay terminal 255 are connected to the notch C4. The third relay electrode 246 and the third relay terminal 256 are connected by the side wiring provided in the notch C6, and the fourth relay electrode 247 and the fourth relay terminal 257 are disconnected. The fifth relay electrode 248 and the fifth relay terminal 258 are connected by the side wiring provided in the notch C8, and are connected by the side wiring provided in the notch C7.
In addition, as a material used for the base material 251 of the relay substrate 250, various materials, such as a polyimide and a glass epoxy resin, can be used.

Next, a form of joining with electrical connection to the package 202 via the relay substrate 250 of the gyro vibrating piece 100 will be described.
As shown in FIG. 5, the support part 60,62 of the gyro vibrating piece 100 is electrically connected and fixed to the relay substrate 250 by a conductive adhesive 295 such as silver paste. The relay substrate 250 on which the gyro vibrating piece 100 is thus placed is fixed in a state where it is electrically connected to the package 202 by a conductive adhesive 296 such as silver paste, for example.

The drive ground terminal 144, the detection ground terminal 124, the detection signal terminal 114 formed on the first support portion 60 of the gyro vibrating piece 100, the drive signal terminal 134 formed on the second support portion 62, and the detection signal terminal 114 ( FIG. 1 and FIG. 2 together) are connected to the corresponding relay electrode provided on one main surface side of the relay substrate 250 with a conductive adhesive 295 such as a silver paste, for example. ing. Specifically, in the present embodiment, the drive ground terminal 144, the detection ground terminal 124, and the detection signal terminal 114 provided on the first support portion 60 are provided on the second relay electrode provided on one end side of the relay substrate 250. 245, the first relay electrode 244, and the third relay electrode 246 are joined in this order, and the drive signal terminal 134 and the detection signal terminal 114 of the second support portion 62 are provided on the other end side of the relay substrate 250. The fourth relay electrode 247 and the fifth relay electrode 248 are joined in this order.
Since the detection ground terminal 124 formed on the second support portion 62 has the same potential as the detection ground terminal 124 formed on the first support portion 60 described above, in the present embodiment, the first support portion 60 side. A configuration in which only the detection ground terminal 124 is connected to the relay substrate 250 will be described.

  The relay substrate 250 to which the gyro vibrating piece 100 is bonded is, for example, a first protrusion terminal 234 formed by the third layer substrate 231 of the package 202 with a conductive adhesive 296 as a conductive bonding member such as silver paste. The second projecting terminal 235, the third projecting terminal 236, the fourth projecting terminal 237, and the fifth projecting terminal 238 are connected and fixed. In the present embodiment, a first relay terminal 254, a second relay terminal 255, a third relay terminal 256, a fourth relay terminal 257, and a fifth relay terminal 258 provided on the other main surface side of the relay board 250, respectively. The corresponding first protrusion terminal 234, second protrusion terminal 235, third protrusion terminal 236, fourth protrusion terminal 237, and fifth protrusion terminal 238 are connected.

As described above, the gyro vibrating piece 100 includes the first relay electrode 244, the second relay electrode 245, the third relay electrode 246, the fourth relay electrode 247, and the fifth relay on one main surface side of the relay board 250. The five relay electrodes of the electrode 248 are connected. Therefore, the connection between the relay substrate 250 and the package 202 can be made by joining five relay terminals and projecting terminals.
As a specific combination of the junction of the relay electrode of the relay substrate 250 and the projecting terminal of the package 202, the first relay electrode 244 (first relay terminal 254), the first projecting terminal 234, and the second relay electrode 245 ( Second relay terminal 255) and second protrusion terminal 235, third relay electrode 246 (third relay terminal 256) and third protrusion terminal 236, fourth relay electrode 247 (fourth relay terminal 257) and fourth protrusion The part terminal 237, the fifth relay electrode 248 (the fifth relay terminal 258), and the fifth projecting terminal 238 correspond to each other, and the relay electrode and the projecting terminal of each combination are aligned, and conductive bonding is performed. It is joined while being electrically connected by the agent 296.

Further, as a major feature of the vibration gyro 201 of the present embodiment, the region between the junctions of the relay electrodes of the relay board 250 and the corresponding protruding terminals of the package 202 is bonded as a reinforcing joint member. Bonded by the agent 299. Specifically, the first protrusion terminal 234 and the third protrusion are located between the first protrusion terminal 234 and the second protrusion terminal 235 on the step formed by the third layer substrate 231 in the recess of the package 202. Between the projecting terminal 236, between the second projecting terminal 235 and the fourth projecting terminal 237, between the third projecting terminal 236 and the fifth projecting terminal 238, and between the fourth projecting terminal 237 and the second projecting terminal 237. The five regions between the five protrusion terminals 238 and a part of the relay substrate 250 positioned above them are joined by an adhesive 299. As a result, the bonding area increases as compared with a vibration gyro having a conventional structure in which the bonding portions of the relay electrodes of the relay board and the corresponding protruding terminals of the package 202 are bonded with a conductive adhesive. As a result, the bonding strength between the relay substrate 250 on which the gyro vibrating piece 100 is mounted and the package 202 is improved, and the impact resistance of the vibrating gyro 201 is improved.
Note that it is desirable to use a non-conductive adhesive 299 as the adhesive 299 that joins the region between the joints of the relay electrodes and the protruding terminals. By using a non-conductive adhesive, it is possible to avoid an electrical failure such as a short circuit due to the adhesive adhering between the joint portions of the relay electrode and the projecting terminal, so the bonding area by the adhesive 299 is increased. Therefore, the bonding strength can be further increased.

  As shown in FIG. 5, a lid 203 as a lid is disposed on the package 202 to which the IC chip 260 and the gyro vibrating piece 100 are joined, and the opening of the package 202 is sealed. As a material of the lid 203, for example, a metal such as 42 alloy (an alloy containing 42% nickel in iron) or Kovar (an alloy of iron, nickel, and cobalt), ceramics, glass, or the like can be used. For example, the lid 203 made of metal is joined to the package 202 by seam welding via a seal ring 209 formed by punching a Kovar alloy or the like into a rectangular ring shape. A cavity T1 formed by the package 202 and the lid 203 becomes a space for the gyro vibrating piece 100 to operate.

  In the vibrating gyroscope 201 of the present embodiment, the cavity T1 can be sealed and sealed in a reduced pressure space or an inert gas atmosphere. For example, when the inside of the cavity T1 is hermetically sealed with a reduced pressure space, a sealing hole (not shown) that connects the cavity T1 provided in the first layer substrate 211 of the package 202 and the outside is provided. For example, a solid sealing material serving as a prototype of a spherical sealing material is placed in a vacuum chamber, the pressure is reduced to a predetermined degree of vacuum, and the gas emitted from the inside of the vibrating gyroscope 201 is discharged from the sealing hole. After that, the sealing material is melted and solidified by irradiating the solid sealing material with an electron beam or a laser, etc., thereby sealing the sealing hole. As the material of the sealing material, a material having a melting point higher than the reflow temperature when mounting the completed vibration gyro 201 on the external mounting substrate is desirable. For example, an alloy of gold and tin (Sn), or An alloy of gold and germanium (Ge) can be used.

According to the vibrating gyroscope 201 of the above-described embodiment, the junction between the relay substrate 250 on which the gyro vibrating piece 100 is mounted and the package 202 is joined by the conductive adhesive 296 between each relay electrode and the projecting terminal. In addition, the stepped portion formed by the third layer substrate 231 of the package 202 in the region between the joints between the relay electrodes and the projecting terminals was joined with a non-conductive adhesive 299. As a result, the bonding area between the relay substrate 250 and the package 202 is increased and the bonding strength is enhanced, so that the impact resistance of the vibration gyro 201 is improved.
In particular, even when the area of a connection terminal such as a projecting terminal of the package is reduced as the demand for downsizing of the vibrating gyroscope increases, according to the configuration of the above embodiment, the relay substrate 250 and the package 202 Therefore, the vibration gyro 201 having a small size and high impact resistance can be provided.

(Modification)
In the vibrating gyroscope 201 of the above-described embodiment, a reinforcing joining member that joins a region between the joining portions of the relay electrodes and the protruding terminals in joining the relay substrate 250 on which the gyro vibrating piece 100 is mounted and the package 202. It was explained that it is desirable to use a non-conductive adhesive as the adhesive 299. Not limited to this, it is possible to provide a vibration gyro with more stable detection characteristics by joining the joint between the specific relay electrode and the projecting terminal with a reinforcing joining member having conductivity. it can.
8A and 8B are diagrams for explaining a modification of the vibrating gyroscope, wherein FIG. 8A is a schematic plan view seen from above, and FIG. 8B is a schematic cross-sectional view showing a cross section taken along line BB in FIG. In FIG. 8A, for convenience of explaining the internal structure of the vibrating gyroscope, a state in which the lid 203 as a lid provided above the vibrating gyroscope is removed is illustrated, and the mounting position of the lid 203 is illustrated. It is indicated by a broken line. Moreover, in FIG. 8, about the same structure as the said embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

In FIG. 8, the vibration gyro 301 of the present modification is the same as the vibration gyro 201 of the above embodiment except that the type of bonding member used for bonding the relay substrate 250 and the package 202 is different in a specific region. It has a configuration.
Among the configurations of the vibration gyro 301 of the present modification, the difference from the vibration gyro 201 of the above embodiment is that each relay electrode of the relay substrate 250 is joined to the relay substrate 250 on which the gyro vibrating piece 100 is mounted and the package 202. And the region between the joint portions of the package 202 corresponding to the respective projecting terminals with an adhesive, the first projecting portion between the first projecting terminal 234 and the second projecting terminal 235. The region between the terminal 234 and the third protrusion terminal 236, between the second protrusion terminal 235 and the fourth protrusion terminal 237, and between the third protrusion terminal 236 and the fifth protrusion terminal 238. The non-conductive adhesive 299 is applied as a reinforcing joint member used for joining, whereas the conductive adhesive is used for joining the region between the fourth projecting terminal 237 and the fifth projecting terminal 238. Agent 399 is used That.
In addition, the conductive adhesive 399 for joining the relay substrate 250 in the region between the fourth projecting terminal 237 and the fifth projecting terminal 238 and the package 202 is brought into contact with the ground pattern provided in the vibration gyro 301. Is provided. In this modification, as shown in FIG. 8B, the conductive adhesive 399 is provided in contact with the seal ring 209 that is grounded in the vibration gyro 301.
In addition, the conductive adhesive 399 has the fourth projecting terminal 237 and the fifth projecting part in the region between the fourth projecting terminal 237 and the fifth projecting terminal 238 within a range that does not cause a short circuit between the terminals. It is desirable to provide as wide a range as possible so that the terminal 238 is blocked in the horizontal direction.

  As described in the above embodiment, the fourth protrusion terminal 237 of the package 202 is connected to the drive signal terminal 134 of the gyro vibrating piece 100 via the fourth relay terminal 257 and the fourth relay electrode 247 of the relay board 250. Has been. Further, the fifth protrusion terminal 238 of the package 202 is connected to the detection signal terminal 114 of the gyro vibrating piece 100 via the fifth relay terminal 258 and the fifth relay electrode 248 of the relay board 250. Thus, the ground pattern (seal ring 209) is electrically connected between the fourth projecting terminal 237 and the fifth projecting terminal 238 connected to the drive signal terminal 134 and the detection signal terminal 114 of the gyro vibrating piece 100, respectively. By providing the conductive adhesive 399 connected to the conductive adhesive 399, the conductive adhesive 399 has a shielding effect, and the drive signal and the detection signal having the largest electrostatic capacitance in the vibration gyro 301 interfere with each other to cause erroneous detection. The trouble can be avoided.

  Although the embodiments of the present invention made by the inventor have been specifically described above, the present invention is not limited to the above-described embodiments and modifications thereof, and various modifications can be made without departing from the spirit of the present invention. It is possible to make changes.

  For example, in the vibrating gyros 201 and 301 according to the above-described embodiment and the modified example, a plurality of electrode pads 265 of the IC chip 260 as a semiconductor circuit element and the corresponding IC connection terminal 225 are bonded to each other by a wire bonding method. It joined by. Not limited to this, the IC chip 260 may be configured to be face-down bonded using a bonding member such as a metal bump or a conductive adhesive.

  In the above modification, the conductive adhesive 399 provided as a shield material between the fourth projecting terminal 237 and the fifth projecting terminal 238 that handles the drive signal and the detection signal is used as the ground pattern. The seal ring 209 was electrically connected. For example, the conductive adhesive 399 may be brought into contact with another ground pattern previously set on the package 202 to be grounded.

Further, in the above-described embodiment, the configuration in which the metal material for forming each electrode, wiring, terminal, or the like is laminated in the order of chromium and gold from the gyro vibrating piece 100 side has been described.
Not limited to this, a layer in which nickel and chromium are laminated in order is used as a base layer, and an electrode layer made of, for example, gold is formed thereon by vapor deposition or sputtering, or titanium, tantalum, tungsten, aluminum A metal material such as can also be used. Magnesium or the like can also be used.

In addition, the specific form described in the embodiment and the modification examples, for example, the base 10 of the gyro vibrating piece 100, the first connecting arm 20 and the second connecting arm 22, the first detecting vibrating arm 30 and the second detecting vibrating arm 32. The shapes of the first drive vibration arm 40 and the second drive vibration arm 42, the first beam 50, the second beam 52, the third beam 54, the fourth beam 56, the first support portion 60, the second support portion 62, and the like. In addition, the step shape in the recess of the package 202 and the shape and arrangement of the first to fifth protruding terminals 234 to 238 are not limited.
Similarly, the positions and shapes of the electrodes, wirings, terminals, and the like of the gyro vibrating piece 100 and the package 202 are not limited to the above-described embodiments and modifications.

  In the embodiment and the modification, the vibration gyros 201 and 301 as the physical quantity detection device have been described. Not limited to this, the present invention uses a physical quantity detection element formed by processing a piezoelectric substrate or the like into a desired shape, and the vibration state of the physical quantity detection element has changed due to the influence of the physical quantity acting from the outside. Sometimes, a physical quantity detection device that detects a physical quantity that can be detected through a detection circuit from the change in the vibration state is targeted. As such physical quantities, acceleration, angular velocity, and angular acceleration applied to the piezoelectric vibrating piece are particularly preferable. Moreover, an inertial sensor is preferable as the physical quantity detection device.

  DESCRIPTION OF SYMBOLS 10 ... Base part, 20 ... 1st connection arm, 22 ... 2nd connection arm, 30 ... 1st detection vibration arm, 30a ... Tip part, 32 ... 2nd detection vibration arm, 32a ... Tip part, 40 ... 1st drive vibration Arm 40a ... tip part 42 ... second drive vibration arm 42a ... tip part 44a ... tip part 46a ... tip part 50 ... first beam 50a ... S-shaped part 52 ... second beam 52a ... S-shaped part, 54 ... third beam, 54a ... S-shaped part, 56 ... fourth beam, 56a ... S-shaped part, 60 ... first support part, 62 ... second support part, 100 ... gyro vibration 101, first surface, 102, second surface, 103, side surface, 103a, side surface, 103b, side surface, 103c, side surface, 103d, side surface, 103e, side surface, 103f, side surface, 110, first and third detections Detection signal electrodes as electrodes, 112... Detection signal wiring, 114. , 120..., Detection ground electrodes as second and fourth detection electrodes, 122... Detection ground wiring, 124... Detection ground terminal, 130... Drive signal electrodes as first and third drive electrodes, 132. DESCRIPTION OF SYMBOLS ... Drive signal terminal, 140 ... Drive ground electrode as 2nd and 4th drive electrode, 142 ... Drive ground wiring, 144 ... Drive ground terminal, 201, 301 ... Vibration gyro as physical quantity detection device, 201A ... IC mounting part, 202 ... Package, 203 ... Lid, 209 ... Seal ring, 211 ... First layer substrate, 212 ... Die pad, 221 ... Second layer substrate, 225 ... IC connection terminal as semiconductor circuit connection terminal, 231 ... Third layer substrate, 234 ... 1st protrusion terminal, 235 ... 2nd protrusion terminal, 236 ... 3rd protrusion terminal, 237 ... 4th protrusion terminal, 238 ... 5th protrusion terminal, 24 ... 4th layer substrate, 244 ... 1st relay electrode, 245 ... 2nd relay electrode, 246 ... 3rd relay electrode, 247 ... 4th relay electrode, 248 ... 5th relay electrode, 250 ... Relay board, 251 ... Base material 254 ... first relay terminal, 255 ... second relay terminal, 256 ... third relay terminal, 257 ... fourth relay terminal, 258 ... fifth relay terminal, 260 ... IC chip as a semiconductor circuit element, 265 ... plurality Electrode pads, 291 ... bonding wire, 294 ... brazing material, 295 ... conductive adhesive, 296 ... conductive adhesive as conductive joining member, 299 ... non-conductive adhesive as reinforcing joining member, 399 ... Conductive adhesive as a reinforcing joining member.

Claims (4)

Package and
A physical quantity detection element having a vibration part formed with a drive electrode and a detection part formed with a detection electrode;
A plurality of relay electrodes to which the drive electrode and the detection electrode are electrically connected, respectively, and a relay substrate that relays the connection with the physical quantity detection element and the package,
The physical quantity detection device in which the physical quantity detection element mounted on the relay substrate is accommodated in the package,
The package has a plurality of protruding terminals for electrical connection with the relay electrode,
The relay electrode and the protruding terminal are joined together with electrical connection by a conductive joining member,
The physical quantity detection device according to claim 1, wherein the relay substrate and the package are joined together by a reinforcing joining member in a region between the adjacent protruding terminals. The physical quantity detection device according to claim 1,
The physical quantity detection device, wherein the reinforcing joining member is non-conductive. The physical quantity detection device according to claim 1,
Of the plurality of projecting terminals, the reinforcement provided for joining a region between the projecting terminal electrically connected to the drive electrode and the projecting terminal electrically connected to the detection electrode. The joint member for electrical conductivity has electrical conductivity, and the joint member for reinforcement having electrical conductivity is electrically connected to the projecting terminal connected to the drive electrode and the detection electrode. A physical quantity detection device provided so as not to contact a projecting terminal and in contact with an independent ground pattern in the physical quantity detection device. The physical quantity detection device according to claim 3,
The package is joined to the lid through a seal ring,
The physical quantity detection device, wherein the seal ring is used as the ground pattern.

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