JP2011014597A - Manufacturing method of multilayer wiring board, and pressure adjusting jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board which can be applied with versatility at lower cost and is high in board thickness accuracy, and to provide a pressure-adjusting jig at press-molding used for the manufacturing method.SOLUTION: The manufacturing method of the multilayer wiring board includes a step of press-molding by sandwiching both sides of a molded object obtained by overlapping a wiring board and an adhesive material for multilayer formation by a lamination jig and further sandwiching the whole body by a hot plate. In the method, the pressure-adjusting plate-like jig having a size smaller than the molded object is arranged between the lamination jig and the hot plate in a region corresponding to the molded object for press-molding.

Description

  The present invention relates to a method for manufacturing a multilayer wiring board and a pressure adjusting jig during press molding, and more particularly to a method for manufacturing a multilayer wiring board having a highly accurate thickness distribution and a pressure adjusting jig used in the manufacturing method. .

  In general, the thickness of the multilayer wiring board tends to be thicker at the center and thinner at the outer periphery due to the resin flow of the prepreg during press molding (hereinafter referred to as a board in a single multilayer wiring board). The maximum and minimum deviation of thickness is called thickness deviation.) Since the number of prepregs to be stacked increases as the number of layers increases, the thickness deviation tends to increase with the increase in the number of layers of wiring boards due to the recent increase in the density of electronic devices. When the plate thickness deviation is large, in the manufacturing process after the press forming of the multilayer wiring board, there is a concern that the processing accuracy and quality are deteriorated due to the non-uniform thickness. In addition, after the completion of the multilayer wiring board, it may be considered to adversely affect the yield and the like when components are mounted on the surface of the multilayer wiring board. From these things, reduction of thickness deviation is calculated | required.

  Conventional techniques for reducing the thickness deviation of multilayer wiring boards include the use of a frame member installed around the object to be molded, which restricts the fluidity of the prepreg resin during press molding to a low level, or heats the prepreg in advance. Methods have been proposed in which the fluidity of the resin is reduced by proceeding with curing by treatment (Patent Documents 1 and 2). In addition, a method has been proposed in which the resin flows sequentially from the center by providing a thermal gradient from the center to the outer periphery of the temperature distribution of the press machine, which is a heat supply source during heating (Patent Document 3). . Further, a method has been proposed in which uniform pressurization and local pressurization are performed and molding is performed with high accuracy by controlling the pressurizing force with a heating medium filled in a container provided on a hot platen of a press machine (Patent Document 4). 5). Furthermore, a method for preventing a reduction in the thickness of the peripheral edge of the substrate by making the peripheral portion of the molding plate used for pressing thinner than the central portion and increasing the resin content of the prepreg at the peripheral portion from the central portion. Has been proposed (Patent Document 6).

JP 2003-298241 A JP-A-6-152131 Japanese Patent Laid-Open No. 5-121876 Japanese Unexamined Patent Publication No. 7-195391 JP-A-8-192300 Japanese Patent Laid-Open No. 8-198982

  However, in the method of reducing the fluidity of the resin described in Patent Documents 1 and 2, there is a risk that the molding performance for filling the gaps between the conductors is lowered and voids remain between the conductors. In addition, as in Patent Documents 3 to 5, a special press machine is required to give a thermal gradient to the press machine heat plate or to control the pressurizing force locally, which requires a large amount of cost. There was a problem. Moreover, in patent document 6, the exclusive shaping | molding plate which adjusted board thickness deviation is required, and the special prepreg which adjusted resin content is needed, and there exists a problem that versatility is scarce.

  The present invention has been made in view of the above problems, and can be applied universally at a lower cost, and has a high thickness accuracy, and a pressure adjustment at the time of press molding used in this manufacturing method. To provide a jig.

The present invention relates to the following.
(1) In a method for producing a multilayer wiring board, comprising a step of sandwiching both sides of a molded article in which a wiring board and an adhesive material for multilayering are stacked with a lamination jig, and further press-molding the whole with a heating platen A multilayer wiring board that press-molds a plate-like pressure adjusting jig having a smaller size than the molding to be placed between the lamination jig and a heating plate in a region corresponding to the molding. Manufacturing method.
(2) In the above (1), the plate-like pressure adjusting jig is a method for manufacturing a multilayer wiring board formed using at least one layer of a plate-like body having a uniform thickness.
(3) In the above (1) or (2), the plate-like pressure adjusting jig is a multilayer formed by stacking a plurality of plate-like bodies having the same shape, thickness and material, but having different sizes only. A method for manufacturing a wiring board.
(4) In any one of the above (1) to (3), the plate-shaped pressure adjusting jig is laminated from the center to the end by stacking the center in the order of size. A method of manufacturing a multilayer wiring board formed to be thin in a stepped manner.
(5) The method for producing a multilayer wiring board according to any one of (1) to (4), wherein the shape of the plate-shaped pressure adjusting jig is any one of a circle, an ellipse, and a rectangle.
(6) In the step of sandwiching both sides of the molding with a lamination jig and further pressing them all with a heating platen, the lamination jig and the heating plate in the region corresponding to the molding are A plate-shaped pressure adjustment jig disposed between the plate-shaped pressure adjustment jigs using at least one layer of a plate-like body having a smaller size and a uniform thickness than the molding object. .

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a multilayer wiring board which can be applied universally at lower cost and has high board thickness accuracy, and the jig for pressure adjustment at the time of press molding used for this manufacturing method can be provided. .

Sectional drawing which isolate | separated and showed the structural member the manufacturing method of the multilayer wiring board of this invention, and the usage method of the jig for pressure adjustment. The top view of the jig | tool for pressure adjustment with a uniform thickness used with the manufacturing method of this invention. Sectional drawing of the jig for pressure adjustment with a uniform thickness used with the manufacturing method of this invention. The top view of the jig | tool for pressure adjustment of the shape used by the manufacturing method of this invention in which the center part of a board | substrate is thick and becomes thin in steps toward a peripheral part. Sectional drawing of the jig for pressure adjustment of the shape used in the manufacturing method of this invention in which the board | substrate center part is thick and becomes thin in steps toward a peripheral part.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the present invention sandwiches the upper and lower sides of a molded article 1 in which a wiring board and a multi-layered adhesive material such as a prepreg are stacked with a lamination jig 7 (end plate 2 and lamination jig board 3), In the method of manufacturing a multilayer wiring board having a step of press-molding the whole with a hot platen 6, a plate-like pressure adjusting jig 4 having a smaller size than the molded object 1 is used as the molded object. Is a method of manufacturing a multilayer wiring board that is placed between the laminating jig 7 and the hot platen 6 in a region corresponding to 1 and is press-molded.

  In the present invention, the wiring substrate refers to an inner layer substrate for multilayering in which a conductor circuit is formed on an insulating substrate. As a wiring board, for example, a substrate having a conductor circuit formed by etching a copper foil of a copper clad laminate, or a cloth with a shield layer having a conductor circuit formed by etching a copper foil laminated on a wiring board A wire substrate etc. are mentioned. The wiring board is a sheet in which a wiring pattern is formed on an adhesive sheet laminated on a wiring core board. The wiring core board is a board in which a prepreg is bonded to both sides of a board on which a conductor circuit is formed. Say. A multilayer wiring board is formed by pressing a multilayer adhesive material such as a prepreg between a plurality of wiring boards.

  The adhesive material for multilayering is a multilayer adhesive between the wiring boards when a plurality of wiring boards are laminated to form a multilayer wiring board. A prepreg using a glass fiber as a reinforcing material or a polyimide resin system An adhesive, an epoxy resin adhesive, a rubber-epoxy resin adhesive, or the like can be used.

  The object 1 is multi-layer bonded by press molding or the like. In the present invention, the multi-layer adhesive material is sandwiched and stacked between a plurality of wiring boards for press molding. The one in the configured state.

  The laminating jig 7 includes the end plate 2 and the laminating jig plate 3, keeps the press surface smooth and transmits heat from the heating platen 6, and shifts the position of the wiring board and the multilayered adhesive material. This is prevented by a guide pin or the like of the laminated jig plate 3.

  The end plate 2 keeps the press surface smooth and transmits heat from the hot platen 6, for example, a stainless steel plate having a thickness of about 1.2 mm, which is usually used in the manufacturing process of a multilayer wiring board. Can be used. The end plate 2 is arranged so as to sandwich both the upper and lower sides of the whole molding object 1 in which a plurality of wiring boards and a multi-layer adhesive material are stacked, and the upper and lower end panels 2 sandwiching the molding object 1 are further arranged. It arrange | positions so that the lamination jig board 3 mentioned later may be in the state pinched | interposed from the up-and-down both sides.

  The laminated jig plate 3 prevents the displacement of the wiring board and the multilayer adhesive material by the guide pins of the laminated jig plate 3 and transmits heat from the hot platen 6. It is ˜12 mm thick and is mainly made of special stainless steel (SUS630 etc.). It arrange | positions so that the up-and-down both sides of the end plate 2 provided in the upper and lower sides of the whole to-be-molded object 1 may be pinched | interposed. Press molding is performed by heating and pressurizing the molding 1 in a sandwiched state.

  The hot platen 6 is generally a member attached to a press used in the press molding process, and sandwiches the entire stacking jig 7 (the stacking jig plate 3 and the end plate 2) and the object to be molded. 7, the object to be molded is heated and pressurized.

  The step of press molding is one of the manufacturing processes of the multilayer wiring board, and is a step of superimposing the wiring board and the multilayered adhesive material, and heating and pressurizing them using a press or the like to integrate them. .

  The pressure adjusting jig 4 adjusts the distribution of pressure applied to the molding 1 from the heating plate via the laminating jig 7 (the laminating jig plate 3 and the end plate 2). As a material of the pressure adjusting jig 4 of the present invention, any material such as a metal material or a resin material can be used as long as it has heat resistance capable of withstanding the press temperature. If the stainless steel material is a metal material, and the copper-clad laminate or copper foil is a multilayer substrate material that is the molding object 1, the thermal conductivity is close to that of the molding object 1, and the temperature distribution during lamination is Since there is little influence, it becomes possible to apply the conventional press temperature conditions.

  As shown in FIG. 1, in the method of manufacturing a multilayer wiring board according to the present invention, a plate-like pressure adjusting jig 4 having a size smaller than that of the molding object 1 is applied to the molding object 1 in the press molding process. It press-molds by arrange | positioning between the lamination jig | tool 7 and the hot platen 6 in a corresponding area | region. As described above, in the present invention, the pressure adjustment prepared separately is not applied to the laminating jig 7 (the laminating jig plate 3 and the end plate 2) and the heating plate 6 itself used in the press molding process. By using the jig 4 for use, the pressure distribution to the article 1 during press molding is adjusted. For this reason, the conventionally used stacking jig 7 and hot platen 6 can be used as they are, and the pressure adjusting jig 4 can be manufactured inexpensively and easily using a general-purpose material, so that it can be manufactured at a lower cost. Applicable universally.

  In the press molding step, a plate-like pressure adjusting jig 4 having a size smaller than that of the molding object 1 is used by being sandwiched between a hot plate 6 and a laminating jig 7 of the press machine. Since the press pressure locally increases at the portion where the adjustment jig 4 is sandwiched, compared to the portion where the pressure adjustment jig 4 is not sandwiched, the resin flow of the molding 1 increases. Note that, when the pressure adjusting jig 4 is sandwiched between the hot platen 6 and the laminating jig 7 of the press machine, a step is generated at the end of the pressure adjusting jig 4. Therefore, the pressure difference does not occur suddenly due to this step, and the pressure changes gently. For this reason, the laminated jig 7 is removed from the heating plate 6 by appropriately arranging the portion sandwiching the pressure adjusting jig 4 and the portion not sandwiching the pressure adjusting jig 4 in the region of the molding 1. Thus, the distribution of the pressure applied to the molding 1 can be adjusted gently. In addition, the magnitude | size of the jig 4 for pressure adjustment of this invention should just be smaller than the to-be-molded object 1, and can set a magnitude | size suitably according to the resin fluidity | liquidity of the to-be-molded object 1, and a product pattern. .

  In the press molding process, when the pressure adjusting jig 4 is sandwiched between the hot platen 6 and the laminating jig 7 of the press machine, the pressure adjusting jig 4 and the hot platen 6 The cushion material 5 is disposed between them. As the cushion material 5, a material generally used in a step of press-molding a multilayer wiring board such as paper or a resin sheet can be used. The thickness of the cushion material 5 is desirably about 1.5 to 5 times thicker than the thickness of the pressure adjusting jig 4. Thereby, it is possible to suppress the heating plate 6 from being damaged or deformed by a step or the like at the end of the pressure adjusting jig 4, and even if there is a step, the cushion material 5 is deformed and follows. The pressure and heat from the hot platen 6 can be transmitted to the workpiece 1 through the pressure adjusting jig 4 and the stacking jig 7.

  As shown in FIGS. 2 and 3, the plate-like pressure adjusting jig 4 is preferably formed using at least one layer of a plate-like body having a uniform thickness. As a result, when the pressure adjusting jig 4 is manufactured, a plate-like body having a uniform thickness may be cut out to a required size, so that the manufacturing is simple. Moreover, since the surface of the pressure adjusting jig 4 is flat, the surface of the molding object 1 corresponding to this can be formed flat. As the thickness of the plate-like body having a uniform thickness used for the pressure adjusting jig 4, a plate having an appropriate pressure distribution by the pressure adjusting jig 4 can be used.

  If the thickness of the pressure adjusting jig 4 is equal to or less than the thickness of the cushion material 5 to be used together, for example, about 0.1 to 0.5 mm, it is preferable that the heating plate 6 and the laminating jig 7 are not deformed.

  As a plate-like body having a uniform thickness, any material such as a metal material or a resin material can be used as long as it has a heat resistance capable of withstanding the pressing temperature. The use of a tension laminate or copper foil is advantageous from the viewpoint of cost and workability.

  As shown in FIGS. 4 and 5, the plate-like pressure adjusting jig 4 is preferably formed by stacking a plurality of plate-like bodies having the same shape, thickness and material, but only different sizes. . As a result, even when a plurality of pressure adjusting jigs 4 are bonded together to produce the pressure adjusting jig 4, a necessary number of plate-like bodies having a uniform thickness can be cut out and bonded together. Therefore, the production is simple. In addition, the pressure adjusting jig 4 having a distribution in thickness can be easily manufactured by changing the thickness in steps for a desired region. When the thickness of the pressure adjusting jig 4 is thus distributed, the pressure can be finely adjusted in the surface where the press molding is performed, so that it is uniform over the entire surface of the molding 1. A plate thickness can be obtained. As the shape of the thickness distribution, for example, as shown in FIG. 4 and FIG. 5, if the shape gradually decreases from the central part of the molding 1 toward the peripheral part, the resin from the central part toward the peripheral part is used. Therefore, the thickness of the center part and the peripheral part of the molding 1 can be made uniform. In addition, for example, if the portion where the thickness is thick due to the denseness of the wires in the multi-wire wiring board is selectively set to a high pressure compared to the portion where the wires are sparse, the board where the wires are dense and sparse The thickness difference can be reduced. For this reason, it becomes possible to control the resin flow of the molding 1 in a desired region, and the thickness accuracy can be improved even when the multilayer wiring board is press-molded.

  As shown in FIGS. 4 and 5, the plate-like pressure adjusting jig 4 is laminated stepwise from the central part to the end part by stacking the central parts in order of size. It is desirable to form so that it becomes. Thereby, since the pressure applied to the central portion of the molding 1 is larger and the pressure applied to the peripheral portion of the molding 1 is smaller, the central portion of the molding 1 having a small resin flow and the periphery having a large resin flow. The difference in the resin flow of the part can be reduced, and the thickness of the multilayer wiring board which is the molding 1 after press molding can be made uniform.

  The shape of the plate-like pressure adjusting jig 4 is preferably a shape that is symmetrical from the center of the molding 1 such as a circle, an ellipse, or a quadrangle. As a result, the wiring substrate or multilayer adhesive material as the molding 1 is often either a circle, an ellipse, or a quadrangle, so that the resin flow of a general multilayer adhesive material such as a prepreg can be reduced. In accordance with the shape of the molded product 1, it can be controlled from the central portion toward the peripheral portion. For this reason, even if it is a multilayer wiring board, a uniform board thickness can be obtained over the whole and board thickness precision can be improved. Note that the shape of the pressure adjusting jig 4 is not limited to a circle, an ellipse, or a quadrangle, and may be an arbitrary shape according to the resin fluidity and the wiring pattern of the molding 1.

  Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to the examples.

Example 1
As a material for the wiring board, MCL-E-679 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a copper-clad laminate, having a substrate size of 510 mm × 615 mm, a resin thickness of 0.10 mm, and a copper foil thickness of 35 μm was used. On both surfaces of the copper-clad laminate, a conductor circuit serving as an inner layer circuit was formed by resist film laminating, baking, developing, and etching processes to obtain a wiring substrate serving as an inner layer substrate. The inner layer circuit was a pattern with a remaining copper ratio of 84% in which a clearance was disposed on the solid copper foil. This operation was performed for 21 sheets, and 21 wiring boards were produced.

  Subsequently, by a pin lamination method, a wiring board, glass epoxy prepreg GEA-679N (trade name, manufactured by Hitachi Chemical Co., Ltd.), high Tg (Tg indicates a glass transition point), and a thickness of 0.06 mm, electrolytic Copper article YGP-18 (manufactured by Nippon Electrolytic Co., Ltd., trade name) was stacked to form object 1. The order of the configuration for press molding is as follows. First, one electrolytic copper foil is placed, and two prepregs and one wiring board are alternately laminated thereon, so that a total of 21 wiring boards and prepreg 44 are formed. The sheets were stacked and finally the electrolytic copper foil was stacked.

  As shown in FIG. 1, the stacking jig 7 has a structure in which SUS301 plates having a thickness of 1.2 mm and a size of 540 mm × 640 mm are arranged on both the upper and lower sides outside the molding 1 as the end plate 2. As the jig plate 3, SUS630 plates having a thickness of 8.0 mm and a size of 540 mm × 640 mm were arranged on both upper and lower sides outside the end plate 2. Further, as the pressure adjusting jig 4, MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a resin thickness of 0.10 mm and a copper foil thickness of 18 μm cut into a circle having a diameter of 300 mm is used. Arranged on both the upper and lower sides outside the central portion, and as the cushion material 5, five sheets of paper cushion material KS190 (trade name, manufactured by Oji Paper Co., Ltd.) having a thickness of 0.2 mm are provided outside the pressure adjusting jig 4. Arranged on both upper and lower sides.

  Thereafter, using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), a hot platen heating rate of 6.0 ° C / min, a maximum hot platen temperature of 200 ° C, a 200 ° C holding time of 120 minutes, a surface pressure. Multilayer adhesion was performed by vacuum press molding at 2.0 MPa. The multilayer wiring board after the multi-layer bonding is cut with a cut-and-saw at 5 mm on the short side of the substrate and 7.5 mm on the two long sides, the substrate size is 500 mm × 600 mm, the plate thickness is 6.2 mm, and the number of inner layers is 42. Multilayer wiring board.

(Example 2)
As a material for the wiring board, MCL-I-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a copper-clad laminate, having a substrate size of 510 mm × 615 mm, a resin thickness of 0.10 mm, and a copper foil thickness of 35 μm was used. Moreover, the structure for press molding was performed similarly to Example 1 except having used the modified polyimide prepreg GIA-671N (made by Hitachi Chemical Co., Ltd., a brand name) of thickness 0.03mm as a prepreg. In addition, using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), a hot platen heating rate of 4.1 ° C./min, a maximum hot platen temperature of 175 ° C., a 175 ° C. holding time of 80 minutes, a surface pressure Multilayer adhesion was performed by vacuum press molding at 4.0 MPa.

(Example 3)
As a wiring board material, a copper-clad laminate MCL-I-671 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a substrate size of 510 mm × 610 mm, a resin thickness of 0.10 mm, and a copper foil thickness of 35 μm was used. On both surfaces of the copper-clad laminate, a conductor circuit serving as an inner layer circuit was formed by resist film laminating, baking, developing, and etching processes to obtain a wiring substrate serving as an inner layer substrate. The inner layer circuit was a pattern with a remaining copper ratio of 84% in which a clearance was disposed on the solid copper foil. This operation was performed for 15 sheets, and 15 wiring boards to be inner layer substrates were produced.

  Thereafter, 12 out of 15 sheets were stored as they were as the wiring board serving as the inner layer board, and a wiring board serving as a wiring board with a shield layer was produced using 3 out of the remaining 15 sheets.

  Fabrication of a wiring board to be a wiring board with a shield layer is as follows. First, a modified polyimide prepreg GIA-671N (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 0.03 mm is formed on both sides of the wiring board to be an inner layer board. Stack one sheet, using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), hot plate heating rate 4.1 ° C./min, maximum hot plate temperature 175 ° C., 175 ° C. holding time 80 minutes, Bonding was performed by vacuum press molding at a surface pressure of 3.0 MPa to obtain a wired core substrate.

  An acrylic adhesive sheet AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 80 μm is laminated on both sides of the wiring core substrate using a roll laminator, and then a core wire is used using a numerical control wiring machine. An insulated wire HAW (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a diameter of 0.08 mm and having a polyimide coating layer was wired to prepare a wiring board. The wire pattern has a wiring length ratio per unit area of an area of one side of the square in the center of the substrate of 200 mm, an area of one side of the square of 200 mm to 400 mm, and an area of one side of the square from 400 mm to the outer periphery of the substrate. 1: 2.44: 0.14 pattern was used.

  Thereafter, two sheets of modified polyimide prepreg GIA-671N (manufactured by Hitachi Chemical Co., Ltd., trade name) having a thickness of 0.03 mm and electrolytic copper foil YGP-35 (manufactured by Nippon Electro Co., Ltd.) are provided on both upper and lower sides of the wiring board. , Product name) are stacked one on the other, and using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), the heating plate heating rate is 4.1 ° C./min, the maximum heating plate temperature is 175 ° C., 175 Bonding was performed by vacuum press molding at a holding pressure of 80 ° C. and a surface pressure of 3.0 MPa. Next, a shield layer pattern was formed on both sides in the same process as that for forming the inner layer circuit, and a wiring board to be a wiring board with a shield layer was produced. The shield layer pattern was a pattern with a residual copper ratio of 84% in which clearance was disposed on the solid copper foil, as in the case of the inner layer circuit.

  Subsequently, by a pin lamination method, a wiring board serving as an inner layer board, a wiring board serving as a wiring board with a shield layer, a modified polyimide prepreg GIA-671N having a thickness of 0.03 mm (trade name, manufactured by Hitachi Chemical Co., Ltd.), The molded object 1 was configured by stacking electrolytic copper foil YGP-18 (manufactured by Nippon Electrolytic Co., Ltd., trade name). The order of the configuration was such that three wiring boards serving as the inner layer board and one wiring board serving as the wiring board with the shield layer were repeatedly configured to form a multilayer structure. At that time, the two prepregs were formed between the respective wiring boards. Moreover, electrolytic copper foil YGP-18 (manufactured by Nippon Electrolytic Co., Ltd., product name) serving as an outer layer was formed on the upper and lower sides on the outermost side.

  As shown in FIG. 1, the stacking jig 7 has a structure in which SUS301 plates having a thickness of 1.2 mm and a size of 540 mm × 640 mm are arranged on both the upper and lower sides outside the molding 1 as the end plate 2. As the jig plate 3, SUS630 plates having a thickness of 8.0 mm and a size of 540 mm × 640 mm were arranged on both upper and lower sides outside the end plate 2. Further, as the pressure adjusting jig 4, MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a resin thickness of 0.10 mm and a copper foil thickness of 18 μm cut into a circle having a diameter of 300 mm is used. It is arranged on both the upper and lower sides outside the center part, and further, as the cushion material 5, five KS190 (product name, manufactured by Oji Paper Co., Ltd.) on the upper and lower sides on the outside of the pressure adjusting jig 4 are placed. Arranged.

  Thereafter, using a vacuum press machine MHPC-V250 (trade name, manufactured by Meiki Seisakusho Co., Ltd.), a hot platen heating rate of 4.1 ° C./minute, a maximum hot platen temperature of 175 ° C., a 175 ° C. holding time of 80 minutes, a surface pressure. Multilayer adhesion was performed by vacuum press molding at 4.0 MPa. The multilayer wiring board after the multi-layer bonding is cut with a cut-and-saw at 5 mm each on the four sides of the substrate, the substrate size is 500 mm × 600 mm, the plate thickness is 6.3 mm, the number of inner layers is 36 layers, and the number of wiring layers is 6 A multilayer multi-wire wiring board was obtained.

Example 4
Except that MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a resin thickness of 0.10 mm and a copper foil thickness of 18 μm cut into a 400 mm square is used as the pressure adjustment jig 4. A multilayer multi-wire wiring board was manufactured in the same manner as in Example 3.

(Example 5)
As the pressure adjusting jig 4, a diameter of 450 mm, a diameter of 350 mm, a diameter of MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a resin thickness of 0.10 mm, a copper foil thickness of 18 μm, and a size of 540 mm × 640 mm. Except for using electrolytic copper foil YGP-35 (trade name, manufactured by Nihon Electrolytic Co., Ltd.) cut to 250 mm, in the order of size, using a multi-stage laminate by bonding with an instantaneous adhesive. In the same manner as in Example 4, a multilayer multi-wire wiring board was produced. In addition, the multistage pressure adjusting jig 4 was used with the MCL-E-67 side facing the lamination jig side and the side where the copper foil was superimposed facing the cushion material 5 side.

(Comparative Example 1)
A substrate was produced in the same manner as in Example 1 except that the pressure adjusting jig 4 was not installed outside the lamination jig 7 in the configuration at the time of press molding.

(Comparative Example 2)
A substrate was produced in the same manner as in Example 2 except that the pressure adjusting jig 4 was not installed outside the lamination jig 7 in the press configuration.

(Comparative Example 3)
A substrate was produced in the same manner as in Example 3 except that the pressure adjusting jig 4 was not installed outside the lamination jig 7 in the press configuration.

Table 1 shows the results obtained by measuring the thicknesses of the multilayer wiring boards and multilayer multi-wire wiring boards manufactured in Examples 1 to 5 and Comparative Examples 1 to 3 with a board thickness measuring system (manufactured by Keyence Corporation) using a CCD laser displacement meter. 1 and Table 2 show. The plate thickness measurement points were in the form of a grid with an interval of 50 mm (total of 143 points, 11 points in the 500 mm direction and 13 points in the 600 mm direction). When Example 1 and Comparative Example 1, Example 2 and Comparative Example 2, and Examples 3 to 5 and Comparative Example 3 are respectively compared, the example using the pressure adjusting jig 4 is for pressure adjustment. It was found that the plate thickness deviation (maximum-minimum of plate thickness) was smaller than that of the comparative example in which the jig 4 was not installed, and the plate thickness accuracy as a multilayer wiring board was excellent.

DESCRIPTION OF SYMBOLS 1 ... Molded object, 2 ... End plate, 3 ... Lamination jig board, 4 ... Pressure adjustment jig, 5 ... Cushion material, 6 ... Hot plate, 7 ... Lamination jig

Claims (6)

  In the method of manufacturing a multilayer wiring board, the method includes a step of sandwiching both sides of a molded article in which a wiring board and a multi-layer adhesive material are stacked with a laminating jig, and further press-molding the whole with a hot platen. A method of manufacturing a multilayer wiring board, wherein a plate-like pressure adjusting jig smaller in size than a molded product is placed between the laminated jig and a heating plate in a region corresponding to the molded product and press-molded. .   2. The method for manufacturing a multilayer wiring board according to claim 1, wherein the plate-shaped pressure adjusting jig is formed by using at least one layer of a plate-like body having a uniform thickness.   3. The method of manufacturing a multilayer wiring board according to claim 1, wherein the plate-like pressure adjusting jig is formed by stacking a plurality of plate-like bodies having the same shape, thickness and material, but having different sizes.   4. The plate-like pressure adjusting jig according to claim 1, wherein the plate-like pressure adjusting jig is thinned stepwise from the central portion toward the end portion by stacking the central portions in order of size. A method of manufacturing a multilayer wiring board formed as described above.   5. The method for manufacturing a multilayer wiring board according to claim 1, wherein the shape of the plate-shaped pressure adjusting jig is any one of a circle, an ellipse, and a rectangle.   Placed between the laminating jig and the heating plate in the area corresponding to the molding in a step of press molding by sandwiching both sides of the molding with a laminating jig and further sandwiching them all with a hot platen A plate-shaped pressure adjusting jig that is formed using at least one layer of a plate-shaped body having a smaller size and a uniform thickness than the molding target.

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