JP2011009840A - Noncontact type data receiving/transmitting unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a noncontact type data receiving/transmitting unit equipped with an antenna which has a longer communication range, can operate at broadband, has robustness for disconnection, and can attain miniaturization.SOLUTION: The noncontact type data receiving/transmitting unit 10 includes a base member 11, an antenna 12 formed on one surface 11a of the base member 11, and an IC chip 13 connected to the antenna 12. A radiating element 15 at the antenna 12 consists of three plane-like conductive layers 18, 19 and 20 laminated through insulating layers 16 and 17. The conductive layers 18, 19 and 20 are connected directly at each of edges. It is characterized in that each connected part of two conductive layers mutually connected among the conductive layers 18, 19 and 20 is extended along the width direction of each conductive layer.

Description

  The present invention relates to a non-contact type data receiving / transmitting body capable of receiving information from the outside using electromagnetic waves as a medium, such as an information recording medium for use in RFID (Radio Frequency IDentification), and transmitting information to the outside. Specifically, the present invention relates to a non-contact type data receiver / transmitter having a wide frequency bandwidth capable of transmission / reception.

  An IC tag, which is an example of a non-contact type data transmitting / receiving body, includes an inlet composed of a base material, an antenna provided on one surface thereof and connected to each other, and an information writing / reading When an electromagnetic wave or radio wave is received from the device, an electromotive force is generated in the antenna by a resonance action, and the IC chip in the IC tag is activated by this electromotive force, and the information in the IC chip is converted into a signal. Transmitted from the antenna.

Regarding such an IC tag of the radio wave type, it is desired to increase the communication distance of the antenna and widen the frequency bandwidth capable of transmission / reception (broadband). In particular, by widening the antenna, not only can one antenna share a plurality of frequencies, but also the frequency used for communication can be easily adjusted.
In general, a flat antenna such as a bow tie antenna is used as an antenna corresponding to a wide band (see, for example, Patent Documents 1 and 2). In order to apply such a planar antenna capable of widening the band to an IC tag or the like, it has been desired to reduce the size of the antenna due to the restriction due to the size of the IC tag or the like.
Therefore, in order to reduce the size of the antenna, it is disclosed that the planar antennas as described above are stacked and the respective planar antennas are connected through through holes (for example, see Patent Document 3).

  A chip antenna comprising an insulating base made of a dielectric, a radiation electrode made of a microstrip conductor, a power supply terminal and a fixing terminal formed on the mounting surface, and a power supply electrode connecting the power supply terminal and the radiation electrode An element is disclosed in which a radiation electrode is formed on an opposing surface of a mounting surface and a power supply electrode is provided on a side surface of an insulating base (see, for example, Patent Document 4).

JP 2002-135037 A JP 2006-074187 A JP 2004-064397 A JP 2004-056580 A

However, when the stacked planar antennas are connected through the through holes as in the invention described in Patent Document 3, the connection area between the planar antennas is narrowed by the through holes and the broadband property is impaired. was there.
In addition, as in the invention described in Patent Document 4, it can be formed when a power supply electrode for connecting a power supply terminal and a radiation electrode respectively formed on the front and back surfaces of the insulating base is provided on the side surface of the insulating base. The conductive portion (antenna) is not limited to two layers, but when an impact is applied from the outside, the power supply electrode is disconnected, and as a result, the radiation electrode does not function.

  The present invention has been made in view of the above circumstances, and provides a non-contact type data receiving / transmitting body including an antenna that can be widened and reduced in size without impairing wideband characteristics and is difficult to disconnect. The purpose is to provide.

  A non-contact type data transmitting / receiving body according to the present invention includes a base material, an antenna provided on one surface of the base material, and an IC chip connected to the antenna. And at least a part of the antenna is composed of a plurality of planar conductive layers stacked via an insulating layer, and each of the plurality of conductive layers has an edge on one end side and / or the other end side. At the edge of each of the two conductive layers connected directly to the conductive layer immediately above and / or immediately below the conductive layer, the connection portions of the two conductive layers connected to each other extend along the width direction of each conductive layer. It is characterized by doing.

  According to the non-contact type data receiving / transmitting body of the present invention, a non-contact type data receiving / receiving unit including a base material, an antenna provided on one surface of the base material, and an IC chip connected to the antenna. A transmitter, wherein at least a part of the antenna includes a plurality of planar conductive layers laminated via an insulating layer, and each of the plurality of conductive layers includes an edge portion on one end side thereof and / or another At the edge on the end side, the connection portion of the two conductive layers that are directly connected to the conductive layer immediately above and / or the conductive layer immediately below is connected along the width direction of each conductive layer. Since it extends, a plurality of conductive layers form one planar antenna folded on a surface of one side of the substrate through an insulating layer in a direction perpendicular to the one surface of the substrate. The antenna can be transmitted and received without compromising the broadband characteristics of the It is possible to several bandwidth widely (wide band), it is possible to reduce the occupied area of the antenna in one side of the substrate. Therefore, the contactless data receiving / transmitting body of the present invention can be widened and reduced in size. In addition, since at least a part of the antenna is composed of a plurality of conductive layers stacked in order via an insulating layer, and each conductive layer is connected to each other at the connecting portion on the surfaces having the same width, the conductive layers are connected to each other. Since the connecting portion is not exposed to the outside and the connecting area is relatively large, it is possible to prevent the antenna from being disconnected at the connecting portion.

It is the schematic which shows one Embodiment of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the AA line of (a). It is the schematic which shows one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the BB line of (a). It is the schematic which shows one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the CC line of (a). It is the schematic which shows one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the DD line | wire of (a). It is the schematic which shows one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the EE line | wire of (a). It is the schematic which shows one Embodiment of the manufacturing method of the non-contact-type data transmission / reception body of this invention, (a) is a top view, (b) is sectional drawing which follows the FF line of (a).

An embodiment of the non-contact type data receiving / transmitting body of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

FIG. 1 is a schematic view showing an embodiment of the non-contact type data transmitting / receiving body of the present invention, where (a) is a plan view and (b) is a cross-sectional view taken along line AA of (a). .
The non-contact type data transmitting / receiving body 10 of this embodiment includes a base material 11 having a rectangular shape in plan view, an antenna 12 provided on one surface 11a of the base material 11, and an antenna on one surface 11a of the base material 11. 12 and an IC chip 13 connected to 12.

The antenna 12 is opposed to each other and has a pair of radiating elements 14 and 15 each having a feeding point (portion connected to the IC chip 13) on the opposite side, and a short-circuit portion that short-circuits the vicinity of the feeding point of the radiating elements 14 and 15. (Not shown).
The radiating element 15 of the antenna 12 is composed of three planar conductive layers 18, 19, 20 that are sequentially stacked via two insulating layers 16, 17 and are electrically connected to each other. .
Note that the two insulating layers 16 and 17 may be referred to as a first insulating layer 16 and a second insulating layer 17 in order from the one surface 11a side of the substrate 11. The three conductive layers 18, 19, and 20 may be referred to as the first conductive layer 18, the second conductive layer 19, and the third conductive layer 20 in order from the one surface 11 a side of the substrate 11.

  More specifically, the first conductive layer 18, the second conductive layer 19, and the third conductive layer 20 are sequentially arranged from the one surface 11 a side of the base material 11 through the first insulating layer 16 and the second insulating layer 17. The first conductive layer 18 and the second conductive layer 19 are insulated at portions other than the respective connection portions, and the second conductive layer 19 and the third conductive layer 20 are insulated at portions other than the respective connection portions. Thus, the first conductive layer 18, the second conductive layer 19, and the third conductive layer 20 form one antenna (radiating element 15).

  In other words, the first conductive layer 18 and the second conductive layer 19 are stacked with the first insulating layer 16 interposed therebetween, and the second conductive layer 19 is in contact with the first conductive layer 18 at the edge 19a on one end side. The first conductive layer 18 and the second conductive layer 19 that are directly connected to each other and connected to each other (the edge 18a on the end (one end) side opposite to the feeding point of the first insulating layer 18), The edge portion 19a on one end side of the two conductive layers 19 has a strip shape with an appropriate width extending along the width direction of each of the conductive layers 18 and 19 (the vertical direction of the paper in FIG. 1A). There is no. That is, the width of the connecting portion is the width of the edge portion 18a on one end side of the first insulating layer 18 and the width of the edge portion 19a on one end side of the second conductive layer 19 (in FIG. The first conductive layer 18 and the second conductive layer 19 are connected to each other at the connecting portion (edge portion) at surfaces having the same width.

  Similarly, the second conductive layer 19 and the third conductive layer 20 are laminated via the second insulating layer 17, and the second conductive layer 19 is connected to the third conductive layer 20 at the edge 19 b on the other end side. The second conductive layer 19 and the third conductive layer 20 that are directly connected to each other and connected to each other (the edge 19b on the other end side of the second conductive layer 19 and the edge on the one end side of the third conductive layer 20) (Corresponding to the portion 20a) is in the form of a strip having an appropriate width extending along the width direction of each of the conductive layers 19 and 20 (the vertical direction of the paper in FIG. 1A). That is, the width of the connecting portion is the width of the edge portion 19b on the other end side of the second conductive layer 19 and the width of the edge portion 20a on the one end side of the third conductive layer 20 (in FIG. The second conductive layer 19 and the third conductive layer 20 are connected to each other at the connecting portion (edge portion) at surfaces having the same width.

The first conductive layer 18 has a triangular shape in plan view, like the radiating element 14. The second conductive layer 19, the third conductive layer 20, the first insulating layer 16, and the second insulating layer 17 have substantially the same shape when viewed in plan, and have a rectangular shape in plan.
Therefore, the first insulating layer 16 is provided on one surface (the surface opposite to the surface in contact with the base material 11) 18 b of the first conductive layer 18 and the one surface 11 a of the base material 11. Yes.
Further, the second conductive layer 19 has a portion other than the connection portion with the first conductive layer 18 on one surface of the first insulating layer 16 (the surface opposite to the surface in contact with the first conductive layer 18) 16a. Is provided.
The second insulating layer 17 is provided on one surface (the surface opposite to the surface in contact with the first insulating layer 16) 19 c of the second conductive layer 19.
Further, the third conductive layer 20 has a portion other than the connecting portion with the second conductive layer 19 on one surface of the second insulating layer 17 (surface opposite to the surface in contact with the second conductive layer 19) 17a. Is provided.

  Thus, the radiating element 15 includes a first conductive layer 18, a second conductive layer 19, and a third conductive layer 20 that are connected at their respective edges, and the conductive layers 18, 19, and 20 are connected to each other. It has a planar antenna. The radiating element 15 forms a laminated antenna in a state where the radiating element 15 is folded in a direction perpendicular to the one surface 11a of the base material 11 through the insulating layers 16 and 17 on the one surface 11a of the base material 11. Yes.

  Further, the length (full length) of the antenna 12 is ½ wavelength of the frequency (300 MHz to 30 GHz) of the ultra-high frequency band <UHF> and the microwave band that can be used for a non-contact IC module such as a non-contact IC card. It is the length corresponding to.

The thickness of the insulating layers 16 and 17 is not particularly limited as long as the conductive layers 18, 19 and 20 can be insulated at portions other than the respective connecting portions, but is preferably 10 μm or more and 50 μm or less.
The thickness of the conductive layers 18, 19, and 20 is not particularly limited, but is preferably 1 μm or more and 30 μm or less.

  As the substrate 11, a substrate made of a polyester resin such as polyethylene terephthalate (PET), glycol-modified polyethylene terephthalate (PET-G), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN); polyethylene (PE), polypropylene Base material made of polyolefin resin such as (PP); Base material made of polyfluorinated ethylene resin such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene; Made of polyamide resin such as nylon 6, nylon 6,6 Base material: Base material made of vinyl polymer such as polyvinyl chloride (PVC), ethylene-vinyl acetate copolymer, polyvinyl alcohol, vinylon; polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, polyacryl Base material made of acrylic resin such as butyl; Base material made of polystyrene; Base material made of polycarbonate (PC); Base material made of polyarylate; Base material made of polyimide; Base material made of glass epoxy resin (Glass epoxy resin) Base material); a base material made of paper such as fine paper, thin paper, glassine paper, sulfuric acid paper, or the like is used.

  The antenna 12, that is, the first conductive layer 18, the second conductive layer 19, and the third conductive layer 20 are screen-printed or ink-jetted on a predetermined pattern using a polymer-type conductive ink on one surface 11 a of the substrate 11. It is formed by a printing method such as printing, or is formed by etching a conductive foil, or is formed by metal plating.

  Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is mentioned.

If a thermosetting resin is used as the resin composition, the polymer conductive ink becomes a thermosetting type capable of forming a coating film forming the antenna 12 at 200 ° C. or less, for example, about 100 to 150 ° C. The electric current path of the coating film forming the antenna 12 is formed when the conductive fine particles forming the coating film contact each other, and the resistance value of the coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

  The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photocurable polymer conductive ink include, for example, a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) and 60 masses of conductive fine particles. % Or more and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or a thermoplastic resin Or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate), in which a polyester resin is blended in an amount of 10% by mass or more, ie, a crosslinkable type or a crosslinkable / thermal A plastic combination type is preferably used.

Examples of the conductive foil forming the antenna 12 include copper foil, silver foil, gold foil, platinum foil, and aluminum foil.
Furthermore, examples of the metal plating that forms the antenna 12 include copper plating, silver plating, gold plating, and platinum plating.

  As a material for forming the antenna 12, a polymer type conductive ink is preferable because it can be easily formed into a predetermined pattern by a printing method such as screen printing or ink jet printing. That is, when the antenna 12 is formed by a printing method using a polymer type conductive ink, the first conductive layer 18, the second conductive layer 19 and the third conductive layer 20 are formed by a printing method using the polymer type conductive ink. Printed layer.

  The IC chip 13 is not particularly limited and may be a non-contact type IC tag, a non-contact type IC label, or a non-contact type as long as information can be written and read out in a non-contact state via the antenna 12. Anything applicable to RFID media such as an IC card can be used.

As a material for forming the insulating layers 16 and 17, a resin such as polyimide, polyamide, polyester, polytetrafluoroethylene, or polyphenylene sulfide is used.
Moreover, if these resins are dissolved in an appropriate solvent to prepare a printable solution, the insulating layers 16 and 17 having a very small thickness can be formed by a printing method such as screen printing or ink jet printing. . That is, when the insulating layers 16 and 17 are formed by a printing method using a solution in which the above resin is dissolved, the insulating layers 16 and 17 are formed of a printing layer formed by a printing method using the solution.

  Examples of the solvent include methanol, ethanol, 1-propanol, 2-propanol, diacetone alcohol, furfuryl alcohol, alcohols such as ethylene glycol and hexylene glycol, esters such as acetic acid methyl ester and ethyl acetate, diethyl ether, Ether alcohols such as ethylene glycol monomethyl ether (methyl cellosolve), ethylene glycol monoethyl ether (ethyl cellosolve), ethylene glycol monobutyl ether (butyl cellosolve), diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, ethylene glycol monoethyl ether, dioxane, tetrahydrofuran Ethers such as acetone, methyl ethyl ketone, acetylacetone, Ketones such as Seto acetate, N, N-acid amides such as dimethylformamide, toluene, organic solvents such as aromatic hydrocarbons such as xylene is used.

Next, with reference to FIGS. 1-6, the manufacturing method of the non-contact-type data transmission / reception body of this embodiment is demonstrated.
Here, the manufacturing method of the non-contact type data receiving / transmitting body using the printing method is illustrated.
First, as shown in FIG. 2, a polymer-type conductive ink is applied in a predetermined pattern on one surface 11 a of the substrate 11 by a printing method, and then dried, so that the radiating element 14 and the first conductive layer 18 are formed. Form.

Next, as shown in FIG. 3, one of the first conductive layers 18 is formed by a printing method using a solution prepared by dissolving a resin such as polyimide, polyamide, polyester, polytetrafluoroethylene, or polyphenylene sulfide in the above solvent. The surface 18b covers a region other than the edge 18a on one end side of the first conductive layer 18 and a region other than the vicinity of the feeding point of the first conductive layer 18, and a part of the one surface 11a of the substrate 11 A first insulating layer 16 having a rectangular shape in plan view is formed so as to cover the surface.
In this step, the above-described solution is applied in a predetermined pattern to one surface 18b of the first conductive layer 18 and one surface 11a of the substrate 11 by a printing method, and then dried to obtain a first insulation. Layer 16 is formed.

  Next, as shown in FIG. 4, after the polymer type conductive ink is applied in a predetermined pattern on one surface 16a of the first insulating layer 16 and the edge 18a on one end side of the first conductive layer 18 by a printing method. The second conductive layer 19 is formed by drying.

  Next, as shown in FIG. 5, the above-described solution is applied to a region other than the edge 19b on the other end side of the second conductive layer 19 on one surface 19c of the second conductive layer 19 by a printing method. Then, the second insulating layer 17 is formed by drying.

Next, as shown in FIG. 6, polymer type conductive ink was applied in a predetermined pattern on one surface 17a of the second insulating layer 17 and the edge 19b on the other end side of the second conductive layer 19 by a printing method. Thereafter, the third conductive layer 20 is formed by drying.
Thereby, the radiation element 15 including the first conductive layer 18, the second conductive layer 19, and the third conductive layer 20 is formed, and the formation of the antenna 12 including the pair of radiation elements 14 and 15 is completed.

  Next, the IC chip 13 is connected to the feeding point of the antenna 12 to obtain the non-contact type data receiving / transmitting body 10 shown in FIG.

According to this non-contact type data transmitting / receiving body 10, the radiating element 15 of the antenna 12 is laminated in order via the two insulating layers 16 and 17 and is electrically connected to each other. The conductive layers 18, 19, and 20 are directly connected to each other at equal edges at the edges thereof, so that the conductive layers 18, 19, and 20 are based on the base layers 18, 19, and 20. Since one surface 11a of the material 11 is folded in the direction perpendicular to the one surface 11a of the base material 11 via the insulating layers 16 and 17 through the insulating layers 16 and 17, the broadband property of the antenna 12 is achieved. The frequency bandwidth that can be transmitted and received by the antenna 12 can be widened (broadened) and the area occupied by the antenna 12 on the one surface 11a of the substrate 11 can be reduced. Therefore, the non-contact type data receiving / transmitting body 10 can be widened and reduced in size.
Further, the radiating element 15 of the antenna 12 is composed of conductive layers 18, 19, and 20 stacked in order via insulating layers 16 and 17, and the two conductive layers are connected to each other at the connecting portions on the surfaces having the same width. Therefore, the connection portion between the conductive layers is not exposed to the outside, and the connection area is relatively large. Therefore, it is possible to prevent the radiation element 15 from being disconnected at the connection portion.
If the insulating layers 16 and 17 and the conductive layers 18, 19 and 20 are printed layers formed by printing, the thin antenna 12 can be realized and can be easily manufactured.

In this embodiment, the radiating element 15 includes three planar conductive layers 18, 19, and 20 that are sequentially stacked via two insulating layers 16 and 17 and are electrically connected to each other. Although the non-contact type data receiving / transmitting body 10 is illustrated, the non-contact type data receiving / transmitting body of the present invention is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, at least a part of the antenna may be composed of two or four or more conductive layers laminated via an insulating layer. That is, the antenna configuration (laminated structure) can be appropriately set according to the target communication distance and frequency bandwidth.
In this embodiment, the first conductive layer 18 has a triangular shape in plan view, and the non-contact type data includes the radiation element 15 in which the second conductive layer 19 and the third conductive layer 20 have a rectangular shape in plan view. Although the transmission / reception body 10 is illustrated, the non-contact type data reception / transmission body of the present invention is not limited to this. In the non-contact type data transmitting / receiving body of the present invention, any shape may be used as long as the shape of the conductive layer forming at least a part of the antenna is planar.

  Further, in this embodiment, the antenna 12 is exemplified by the non-contact type data receiving / transmitting body 10 in which one of the radiating elements (the radiating element 15) is a laminated antenna. It is not limited to this. In the non-contact type data receiving / transmitting body of the present invention, the antenna may be a monopole antenna or a dipole antenna, and when the antenna is a dipole antenna, both radiating elements may be laminated antennas. Good.

DESCRIPTION OF SYMBOLS 10 ... Non-contact type data transmission / reception body, 11 ... Base material, 12 ... Antenna, 13 ... IC chip, 14, 15 ... Radiation element, 16 ... 1st insulating layer ( Insulating layer), 17 ... Second insulating layer (insulating layer), 18 ... First conductive layer (conductive layer), 19 ... Second conductive layer (conductive layer), 20 ... Third conductive Layer (conductive layer).

Claims (1)

A non-contact type data receiver / transmitter comprising a base material, an antenna provided on one surface of the base material, and an IC chip connected to the antenna,
At least a part of the antenna is composed of a plurality of planar conductive layers stacked via an insulating layer,
Each of the plurality of conductive layers is directly connected to the conductive layer immediately above and / or the conductive layer immediately below at the edge on one end side and / or the edge on the other end side, and connected to each other. The contact part of two conductive layers is extended along the width direction of each conductive layer, The non-contact-type data transmission / reception body characterized by the above-mentioned.

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