JP2011009655A5 - - Google Patents

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Publication number
JP2011009655A5
JP2011009655A5 JP2009154107A JP2009154107A JP2011009655A5 JP 2011009655 A5 JP2011009655 A5 JP 2011009655A5 JP 2009154107 A JP2009154107 A JP 2009154107A JP 2009154107 A JP2009154107 A JP 2009154107A JP 2011009655 A5 JP2011009655 A5 JP 2011009655A5
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JP
Japan
Prior art keywords
substrate
component
suction head
ultraviolet
irradiating
Prior art date
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Granted
Application number
JP2009154107A
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English (en)
Japanese (ja)
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JP2011009655A (ja
JP5304481B2 (ja
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Priority to JP2009154107A priority Critical patent/JP5304481B2/ja
Priority claimed from JP2009154107A external-priority patent/JP5304481B2/ja
Publication of JP2011009655A publication Critical patent/JP2011009655A/ja
Publication of JP2011009655A5 publication Critical patent/JP2011009655A5/ja
Application granted granted Critical
Publication of JP5304481B2 publication Critical patent/JP5304481B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009154107A 2009-06-29 2009-06-29 実装装置及び実装方法 Expired - Fee Related JP5304481B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009154107A JP5304481B2 (ja) 2009-06-29 2009-06-29 実装装置及び実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009154107A JP5304481B2 (ja) 2009-06-29 2009-06-29 実装装置及び実装方法

Publications (3)

Publication Number Publication Date
JP2011009655A JP2011009655A (ja) 2011-01-13
JP2011009655A5 true JP2011009655A5 (cg-RX-API-DMAC7.html) 2012-05-10
JP5304481B2 JP5304481B2 (ja) 2013-10-02

Family

ID=43565929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009154107A Expired - Fee Related JP5304481B2 (ja) 2009-06-29 2009-06-29 実装装置及び実装方法

Country Status (1)

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JP (1) JP5304481B2 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5562659B2 (ja) * 2010-01-21 2014-07-30 オリンパス株式会社 実装装置および実装方法
JP5440518B2 (ja) 2011-01-20 2014-03-12 パナソニック株式会社 部品実装装置および部品実装装置における機種切替え方法
KR102236269B1 (ko) * 2018-05-09 2021-04-05 한화정밀기계 주식회사 부품 실장 장치
JP7343891B2 (ja) * 2019-06-07 2023-09-13 株式会社ブイ・テクノロジー 貼り合わせ装置、貼り合わせ方法及び表示装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210897A (ja) * 1988-06-29 1990-01-16 Matsushita Electric Ind Co Ltd 電子部品装着装置
JPH0451600A (ja) * 1990-06-20 1992-02-20 Matsushita Electric Ind Co Ltd 部品装着方法
JP2009059874A (ja) * 2007-08-31 2009-03-19 Shin Etsu Polymer Co Ltd 電子部品保持具及びその製造方法

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