JP2011009427A - Terminal connection structure and display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal connection structure which is adaptive to a finer inter-terminal pitch and secures high reliability associated with electric connections, and to provide a display including the terminal connection structure.SOLUTION: A substrate 100 of a display panel part is provided with a plurality of terminals 1211. A flexible wiring board is also provided with a plurality of wiring terminals 321 on a principal surface of a wiring board body 320. Here, projections 122 are protruded on respective principal surfaces of the terminals 1211 of the substrate 100 toward the flexible wiring board. The terminals 1211 and wiring terminals 321 are electrically connected as top parts of the plurality of projections 122 protruded from the principal surfaces of the terminals 1211 come into contact with the wiring terminals 321. Then the substrate 100 and wiring board body 320 are fixed together with an adhesive layer 40 interposed therebetween.

Description

  The present invention relates to an electrode terminal connection structure and a display device, and more particularly to a structure related to connection between a terminal of a display panel unit and a drive control unit.

In recent years, flat panel display devices typified by liquid crystal display devices and plasma display devices have become widespread. As a next-generation flat panel display device, an organic electroluminescence (EL) display device using an electroluminescence effect has been developed and studied.
By the way, the display device has a configuration in which a display panel section that displays an image and a drive control section that controls and drives the display panel section are connected. For example, a flexible wiring board is used for connection between the display panel unit and the drive control unit (see, for example, Patent Documents 1 and 2). A connection structure between a display panel unit and a flexible wiring board according to the related art will be described with reference to FIG.

  As shown in FIG. 18, in the display device according to the prior art, a display unit 901 is provided at a substantially central portion of the display panel unit 90, and a plurality of lead terminals 921, 941 are provided on the main surface of the substrate 900 in the periphery. Are arranged in a row. Each of the lead terminals 921, 941,... Extends from the display unit 901 and is provided in a region up to the edge portion of the substrate 900. The flexible wiring boards 96 to 99 are connected to the lead terminals 921, 941,.

A drive circuit (driver IC) is connected to each other of the flexible wiring boards 96 to 99, and a control circuit is connected further to the other (not shown). In the completed display device, the flexible wiring boards 96 to 99 may be bent around the X axis or the Y axis.
As shown in the enlarged portion of FIG. 18, the flexible wiring board 97 has a flexible wiring board main body 970 and a plurality of wiring terminals 971 arranged on the lower main surface of the wiring board main body 970. Configured. The wiring terminals 971 on the wiring board main body 970 are provided corresponding to the respective lead terminals 921 of the display panel unit 90.

    As shown in the enlarged portion of FIG. 18, the substrate 900 and the wiring substrate main body 970 are mechanically joined by an adhesive layer 940 interposed therebetween. The adhesive layer 940 is obtained by solidifying the anisotropic conductive adhesive and includes the conductive particles 940a in a dispersed state. The lead terminal 921 provided on the substrate 900 and the wiring terminal 971 provided on the wiring board main body 970 are electrically connected to each other through the conductive particles 940a included in the adhesive layer 940. .

JP 2003-271069 A JP 2004-096047 A

However, in the terminal connection structure according to the above-described prior art, when the pitch between terminals becomes narrower or the terminal length becomes shorter due to further high definition and narrower frame of the display device, the conductivity is improved. It is conceivable that a short circuit between adjacent terminals is caused by the distribution density of the particles 940a. Or conversely, it is also conceivable that a situation may occur in which the terminals cannot be joined.
Furthermore, when connecting between terminals using an anisotropic conductive adhesive, it must be heated at a temperature of about 150 [° C.] or more for solidification. For example, a fine structure included in the display panel unit 90 There is also a risk of damaging a light emitting element. In particular, it becomes a serious problem in an organic EL display device including an organic EL element composed of an organic EL material.

  The present invention has been made to solve the above-mentioned problems, and can cope with further miniaturization of the pitch between terminals and shortening of the terminal length due to further high definition and narrow frame, and the like. An object of the present invention is to provide a terminal connection structure capable of ensuring high reliability related to electrical connection, and a display device including the terminal connection structure.

In order to achieve the above object, the present invention employs the following configuration.
The terminal connection structure according to the present invention is a structure in which a plurality of terminals arranged in parallel on the main surfaces of the first substrate and the second substrate are electrically connected to each other. Then, at least a part of the plurality of terminals provided on the first substrate has a protrusion protruding from each main surface toward the terminal of the second substrate. In the terminal connection structure according to the present invention, the some of the terminals on the first substrate are electrically connected to the terminals on the second substrate by abutment at the top of the protrusion. Features.

  Further, in the display device according to the present invention, a display panel portion in which a plurality of lead terminals are formed on the outer edge portion, and a plurality of connection terminals electrically connected to each of the plurality of lead terminals in the display panel portion. In the display device having the drive control circuit unit, the terminal connection structure according to the present invention is employed for connection between the plurality of lead terminals and the plurality of connection terminals.

  As described above, in the present invention, a plurality of protrusions protrude from the terminal main surface of the first substrate, and the top portion of the protrusion is brought into contact with the terminal of the second substrate. Adopts a structure that achieves an ideal connection. For this reason, the short circuit between adjacent terminals by the dispersion | distribution density | concentration of electroconductive particle etc. does not arise like the case where anisotropic conductive adhesive is used like the terminal connection structure which concerns on the said prior art. It is particularly effective to employ the configuration of the present invention when the pitch between terminals is narrow and the terminal length is shortened in accordance with the demand for higher definition and narrower frame in the display device.

  Further, in the terminal connection structure and the display device according to the present invention, since the electrical connection between the terminals is made by contact at the top portion of the protrusion, it is not necessary to use an anisotropic conductive adhesive. The first substrate and the second substrate can be joined using a structure that mechanically presses each other with a clip or the like, or a room temperature curing shrinkable adhesive (resin) or ultraviolet (UV) curing. It can also be performed using a shrinkable adhesive (resin). Therefore, the terminal junction structure and the display device according to the present invention do not damage the fine circuit formed on the substrate and the light emitting element in the display device. In particular, when the present invention is applied to a display device including an organic EL element, the organic EL element is not damaged during terminal connection.

In the terminal connection structure according to the present invention and the display device using the same, the following variations can be adopted.
In the terminal connection structure according to the present invention, a configuration in which an adhesive layer is inserted at least partially between the first substrate and the second substrate can be employed. As described above, for joining the first substrate and the second substrate, a mechanical structure using a clip or the like can be adopted. However, from the viewpoints of ease of manufacture and reliability of joining, etc. The structure in which the adhesive layer is interposed is excellent. And as above-mentioned, the structure that the contact bonding layer is formed using the resin material which has normal temperature cure shrinkage, or the resin material which has ultraviolet curing shrinkage property is employable.

In the terminal connection structure according to the present invention, each of the plurality of protrusions protruding from the main surface of the partial terminal of the first substrate is circular in the cross-sectional direction along the main surface of one substrate. Or it can have a configuration of having a polygonal outer peripheral shape. However, the outer peripheral shape is not limited to the aforementioned shape.
In the terminal connection structure according to the present invention, a configuration in which protrusions are provided on all of the plurality of terminals in the first substrate can be employed. By adopting such a configuration, first, it is possible to maintain high electrical connection reliability between the terminals of the substrate and the terminals of the second substrate.

  In the terminal connection structure according to the present invention, a configuration in which three or five or more protrusions are provided for each terminal on the first substrate can be employed. Compared to the case where an anisotropic conductive adhesive is used, as in the case of the terminal connection structure according to the above prior art, even when the connection pitch is narrow, at the top part of the protrusions at three points or five or more points. This is desirable from the viewpoint that the electrical resistance at the connection portion can be reduced.

  In the display device according to the present invention, the display panel unit includes a plurality of light emitting elements arranged two-dimensionally, and each of the plurality of light emitting elements has an organic light emitting layer inserted between two electrodes. It is possible to employ a configuration in which In this case, the plurality of lead terminals are composed of a power supply terminal for supplying current and a signal terminal for signal, and the projecting portion is a power supply terminal or a connection terminal connected thereto. It is possible to adopt a configuration in which the at least one is formed. As described above, when the connection structure according to the present invention is employed for the power supply terminal for supplying current, it is particularly advantageous from the viewpoint of reducing the electrical resistance between the terminals related to connection.

  In the display device according to the present invention, a core portion having a shape similar to the protrusion is formed on the surface of the terminal base having conductivity in at least a part of the lead terminals in the display panel portion. The structure that the shell part which has electroconductivity is formed in the state covered is employable. Here, the shell can be configured to be electrically connected to the terminal base, and the protrusion is formed by a combination of the core and the shell. The protrusion can be formed by raising a part of the terminal, but it is desirable to adopt the above configuration from the viewpoint of simplicity in manufacturing.

Here, the core part can be formed using an inorganic material or an organic material.
In the display panel unit, a plurality of light emitting elements are two-dimensionally arranged on the TFT substrate, and a planarization film is interposed between the TFT substrate and the plurality of light emitting elements. In addition, it can be said that the core portion is formed using a material common to the planarization film. If such a configuration is adopted, it is not necessary to insert a separate process for forming the protrusion, which is advantageous from the viewpoint of man-hours and manufacturing costs during manufacturing.

Further, when the above configuration is employed, a configuration in which the shell is formed using a material common to one of the two electrodes sandwiching the organic light emitting layer can be employed. This is also advantageous from the viewpoints of man-hours during manufacturing and material costs.
The display device according to the present invention employs a configuration in which, when a plurality of light emitting elements are each defined by a bank, the core portion is formed using a material common to the bank. be able to. Employing such a configuration is also advantageous from the viewpoints of man-hours during manufacturing and material costs. In the above, it is more desirable to adopt a configuration in which the shell is formed using the same material as that of the electrode on the upper side in the stacking direction of the two electrodes.

  In the display device according to the present invention, in the first substrate, a portion corresponding to at least a part of the plurality of terminals is raised, and a conductive film constituting the terminal is formed on the raised portion. It is possible to adopt a configuration in which a terminal is formed by covering the protrusion from the main surface by being covered. For example, by forming irregularities on the main surface of the substrate by nanoimprint method or photolithography method and covering the surface of the protruding portion with a conductive film, a terminal with a plurality of protrusions protruding from the main surface can be configured. Can do.

1 is a block diagram showing an overall configuration of a display device 1 according to Embodiment 1. FIG. 3 is a schematic perspective view showing a connection structure between the display panel unit 10 and wiring boards 31 to 34. FIG. 3 is a schematic cross-sectional view showing a main part of the display panel unit 10. FIG. 3 is a schematic plan view showing an arrangement configuration of terminals 121 in the display panel unit 10. FIG. (A) is a schematic cross-sectional view showing a configuration of the protrusion 122 in the display panel unit 10, and (b) is a schematic cross-sectional view showing a connection structure between the display panel unit 10 and the wiring substrate 32. (A)-(d) is a schematic cross section which shows the formation process of the projection part 122 in the display panel part 10 in order. (A)-(d) is a schematic cross section which shows the formation process of the projection part 122 in the display panel part 10 in order. FIG. 9 is a schematic cross-sectional view showing a connection structure between a display panel unit and a wiring board in the configuration of a display device according to modification example 1; It is a schematic cross section which shows the connection structure of a display panel part and a wiring board among the structures of the display apparatus which concerns on the modification 2. FIG. FIG. 11 is a schematic perspective view (partially cross-sectional view) showing a configuration of a protrusion 162 in a display panel portion in the configuration of a display device according to Modification 3. (A)-(d) is a schematic cross section which shows in order the formation process of the projection part in a display panel part especially in the manufacturing process of the display apparatus which concerns on the modification 4. FIG. (A) And (b) is a schematic cross section which shows the formation process of the projection part in a display panel part in order among the manufacturing processes of the display apparatus which concerns on the modification 4. FIG. (A) is a schematic cross section which shows the structure of the board | substrate 800 in a display panel part among the structures of the display apparatus which concerns on the modification 5, (b) is a schematic cross section which shows the structure of a terminal. (A) And (b) is a schematic cross section which shows the process in the middle of formation of the projection part in a display panel part among the manufacturing processes of the display apparatus which concerns on the modification 6, (c) is a display panel part. It is a schematic cross section which shows the structure of the projection part in. (A) is a schematic cross section which shows the structure which concerns on the connection of the printed circuit board 150 which concerns on Embodiment 2, and a wiring board, (b) is the connection of the printed circuit board 150 of a modification 7, and a wiring board. It is a schematic cross section which shows the structure which concerns. 10 is a schematic cross-sectional view showing a structure relating to connection between a printed circuit board 150 and a wiring board according to Modification 8. FIG. 10 is a schematic cross-sectional view showing a structure related to connection between a printed circuit board 750 and a wiring board according to Modification 9. FIG. It is a model perspective view which shows the connection structure of the display panel part 90 and wiring board 96-99 based on a prior art.

Hereinafter, the best mode for carrying out the present invention will be described using an example.
The embodiment used in the following description is an example used to explain the configuration, operation, and effect of the present invention in an easy-to-understand manner, and the present invention is not limited to the following essential features. Not limited.
[Embodiment 1]
1. Overall Configuration of Display Device 1 The overall configuration of the display device 1 according to the present embodiment will be described with reference to FIG.

As shown in FIG. 1, the display device 1 includes a display panel unit 10 and a drive control unit 20 connected to the display panel unit 10. The display panel unit 10 is an organic EL panel using an electroluminescence effect, and the drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.
In the display device 1, flexible wiring boards 31 to 34 are inserted in the connection between the display panel unit 10 and the drive circuits 21 to 24. In FIG. 1, the display panel unit 10 and the drive control unit 20 are illustrated as being arranged on a plane. However, in the actual display device 1, the arrangement of the drive control unit 20 with respect to the display panel unit 10 is as follows. It is not limited to this.

2. Connection of Display Panel Unit 10 and Flexible Wiring Boards 31 to 34 Next, a connection structure between the display panel unit 10 and the flexible wiring boards 31 to 34 will be described with reference to FIG.
As shown in FIG. 2, the display panel unit 10 is formed on the basis of a rectangular flat substrate 100. As shown in FIG. 2, a display unit 101 is formed on the display panel unit 10 (a portion surrounded by a two-dot chain line in FIG. 2). The display unit 101 is provided at a substantially central portion of the substrate 100, and terminals 121, 141,... Extend outward from the four edge portions of the substrate 100, respectively.

In the display panel unit 10, flexible wiring boards 31 to 34 are connected to terminals 121, 141,. As shown in the enlarged portion of FIG. 2, the flexible wiring board 32 includes a plurality of flexible wiring boards 32 corresponding to the terminals 121 of the display panel unit 10 on the lower main surface of the wiring board main body 320 (the main surface facing the substrate 100). A wiring terminal 321 is laid.
Each of the terminals 121 in the display panel unit 10 has a plurality of protrusions 122 protruding from the upper main surface thereof (the main surface facing the wiring terminals 321 of the flexible wiring board 32). In the display device 1, the top portions of the plurality of protrusions 122 protruding from the terminals 121 are in contact with the wiring terminals 321 of the flexible wiring board 32, so that electrical connection is achieved.

Note that an insulating adhesive layer 40 having an insulating property is interposed between the substrate 100 and the wiring substrate body 320, and the substrate 100 and the wiring substrate body 320 are mechanically connected by the insertion of the adhesive layer 40. It is joined.
For the connection between the other terminals 141,... In the display panel unit 10 and the corresponding flexible wiring boards 31, 33, 34, the same configuration as described above is adopted. A connection structure with the protrusions 122 provided on the terminals 121, 141,... And the flexible wiring boards 31 to 34 will be described later.

3. Here, an internal structure of the display unit 101 in the display panel unit 10 will be described with reference to FIG. In FIG. 3, one of a plurality of subpixels included in the display unit 101 in the display panel unit 10 is extracted and schematically illustrated.
As shown in FIG. 3, a TFT circuit is formed on the upper main surface of the substrate 100 in the Z-axis direction. Specifically, the TFT circuit on the substrate 100 includes a thin film transistor 110 including a gate 111, a drain 112, a source 113, and a gate insulating film 114. In FIG. 3, the TFT circuit is schematically shown, and the entire drawing is omitted. Here, the substrate 100 is made of, for example, soda glass, non-fluorescent glass, phosphate glass, borate glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicon resin, Alternatively, it is formed based on an insulating material such as alumina.

The TFT circuit formed on the substrate 100 is covered with a passivation film 115 and a planarization film 120. The planarization film 120 is made of, for example, an acrylic resin material.
On the planarization film 120, an anode 131 is formed at each location corresponding to each subpixel. The anode 131 includes, for example, Ag (silver), APC (alloy of silver, palladium and copper), ARA (alloy of silver, rubidium and gold), MoCr (alloy of molybdenum and chromium), NiCr (nickel and nickel). For example, an alloy with chromium), and has a function as a light reflection layer.

The anode 131 is connected to the source 113 of the thin film transistor 110 by a contact plug.
A bank 132 is formed on the main surface of the planarizing film 120 so as to cover the end of the anode 131. The banks 132 are formed in a line shape extending in a direction perpendicular to the paper surface, or in a grid shape surrounding the periphery of each anode 131. The bank 132 is formed using, for example, an insulating organic material such as polyimide, acrylic resin, or novolac type phenol resin.

  A light emitting laminate 133 is formed in a recess having the anode 131 as a bottom surface and surrounded on both sides by the slopes of the banks 132. Specifically, the light emitting laminate 133 is formed by laminating a hole injection layer, a hole transport layer, a light emitting layer, and an electron injection transport layer in order from the lower side in the Z-axis direction. For example, ITO (Indium Tin Oxide) may be interposed between the anode 131 and the hole injection layer.

The hole injection layer may be, for example, a conductive polymer material such as PEDOT (a mixture of polythiophene and polystyrene sulfonic acid), a metal oxide such as WO _X (tungsten oxide) or MoWO _X (molybdenum-tungsten oxide), or Metal nitride or metal oxynitride is used.
The light emitting layer is formed using, for example, a material disclosed in Japanese Patent Laid-Open No. 05-163488. Specifically, oxinoid compounds, perylene compounds, coumarin compounds, azacoumarin compounds, oxazole compounds, oxadiazole compounds, perinone compounds, pyrrolopyrrole compounds, naphthalene compounds, anthracene compounds, fluorene compounds, fluoranthene compounds, tetracene compounds, pyrene compounds, Coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone compound, styrin compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran Compound, fluorescein compound, pyrylium compound, thiopyrylium compound, serenapyri Umum compounds, telluropyrylium compounds, aromatic ardadiene compounds, oligophenylene compounds, thioxanthene compounds, anthracene compounds, cyanine compounds, acridine compounds, metal chains of 8-hydroxyquinoline compounds, metal chains of 2,2′-bipyridine compounds, It is formed using a fluorescent material such as a chain of a Schiff salt and a group III metal, an oxine metal chain, or a rare earth chain.

The electron injecting and transporting layer is formed using, for example, barium, phthalocyanine, lithium fluoride, or a combination of these.
The surfaces of the light emitting laminate 133 and the bank 132 are covered with a cathode 134. The cathode 134 is formed using, for example, ITO (indium tin oxide), IZO (indium zinc oxide), or the like. Each light emitting element portion (subpixel) 130 is configured by a laminated structure from the anode 131 to the cathode 134.

  Although not shown in FIG. 3, a sealing layer is laminated on the cathode 134 shown in FIG. 3, and a glass substrate alone or a glass substrate with a color filter layer is formed thereon. May be stacked. Here, the sealing layer is a layer having a function of preventing moisture from entering the light-emitting stacked body 133, and is formed using, for example, SiN (silicon nitride), SiON (silicon oxynitride), or the like. .

4). The structure of the terminals 121, 141,... In the display panel unit 10 will be described with reference to FIG. FIG. 4 is a plan view of an edge portion of the substrate 100 on which the plurality of terminals 121 are laid in the display panel unit 10.
As shown in FIG. 4, in the display panel unit 10 in the display device 1, the terminal 121 is configured by a combination of a power supply power supply terminal 1211 and a signal input signal terminal 1212. The protrusions 122 are desirably provided so as to protrude on all the terminals 121, but may be provided so as to protrude at least on the power supply terminal 1211. This is because in the display panel unit 10 which is an organic EL panel using the electroluminescence effect, it is necessary to pass a current of about several hundred [mA] to the power supply terminal 1211 when driving to emit light. This is because it is necessary to suppress. Note that it is desirable that the protrusion 122 be formed so as to protrude from the signal terminal 1212.

As shown in FIG. 4, the terminals 121 in the display panel unit 10 are grouped by a combination of a plurality of power supply terminals 1211 and a plurality of signal terminals 1212 (groups A1, A2,...), And each group. The driver circuits 21 to 24 are connected to the driver ICs.
The width of the power terminal 1211 is, for example, about 100 to 200 [μm], and the width of the signal terminal 1212 is, for example, 20 to 50 [μm]. Further, the extension amount of the terminal 121 in the Y-axis direction is, for example, about 2.0 to 3.5 [mm], and the pitch (line and space) of the signal terminal 1212 is, for example, 50 to 80 It is about [μm].

The gap between adjacent power supply terminals 1211 is, for example, about 20 to 40 [μm].
Further, in FIG. 4, the number of protrusions 122 formed on the terminal 121 is typically 12 for one terminal 121, but may be at least 5 or more, and may be 10 or more. desirable.
The same applies to the structures of the other terminals 141,... In the display panel unit 10.

5. Structure of Protrusion 122 The structure of the protrusion 122 provided on the terminal 121 in the display panel unit 10 and the connection structure between the wiring terminals 321 will be described with reference to FIG.
As shown in FIG. 5 (a), the protrusion 122 is formed in a hemispherical shape in a state of being spaced apart from each other on the upper main surface in the Z-axis direction of a power supply terminal (hereinafter simply referred to as "terminal") 1211. Has been. As shown in the enlarged portion of FIG. 5A, the protrusion 122 is configured by a combination of a protruding core part 1221 and a protruding shell part 1222. Specifically, the protruding core portion 1221 has a hemispherical shape similar to the shape of the protruding portion 122, and the protruding shell portion 1222 covers the surface of the protruding core portion 1221 and is electrically connected to the terminal 1211. Is formed. Here, for the protruding core portion 1221, a conductive material or an insulating material can be used.

Note that the plurality of protrusions 122 on the terminal 1211 are formed so that the heights in the Z-axis direction to the top of each other are substantially equal.
In FIG. 5A, a configuration in which the protruding shell portion 1222 is provided for each protruding core portion 1221 is adopted as an example in which the protruding portions 122 are separated from each other. However, the protruding portions 122 are not necessarily separated from each other. There is no need, and the protrusion 122 may be configured to be continuous in units of terminals 121.

  As shown in FIG. 5B, the connection between the display panel unit 10 and the flexible wiring board 32 is arranged so as to cover the flexible wiring board 32 on the outer edge portion of the substrate 100 including the terminals 1211. At this time, an adhesive for forming the adhesive layer 40 is filled between the substrate 100 and the wiring board main body 320. However, in order to ensure electrical connection, it is desirable that the top portion of the protrusion 122 is not covered with an adhesive.

Note that the shape of the protrusion 122 is hemispherical as an example in FIGS. 5A and 5B, but is not limited thereto, and is not limited to this. A trapezoidal or pyramidal trapezoidal shape can also be employed. In addition, it is practically desirable that the cross-sectional size and height of the protrusion 122 be 10 [μm] or less.
Bonding between the substrate 100 and the wiring board main body 320 is performed by solidifying the adhesive interposed between the top portion of the protrusion 122 and the wiring terminal 321 while pressing so as not to generate a gap. The At this time, since the wiring board main body 320 has flexibility, it may be corrugated as shown in FIG. 5B (B region).

  As a material for forming the adhesive layer 40, for example, a room temperature solidifying resin material or an ultraviolet (UV) curable resin material can be used. For this reason, in the manufacture of the display device 1 according to the present embodiment, it is not necessary to heat at a high temperature for connection between terminals or to apply ultrasonic waves, and the light emitting element portion 130 that has already been formed. Will not cause damage.

6). Formation of Terminal 1211 and Protrusion 122 A method for forming the terminal 1211 and the protrusion 122 will be described with reference to FIGS. 6 (a) to 6 (d) and FIGS. 7 (a) to 7 (d). 6A to 6D and FIGS. 7A to 7D, among the terminals 121 in the display panel unit 10, the power supply terminals 1211 and the protrusions 122 formed thereon are shown. Although only the formation is illustrated, the signal terminal 1212 and a case where a protrusion is provided thereon can be similarly performed.

As shown in FIG. 6A, a flat substrate 100 is prepared. As described above, the substrate 100 is made of glass or a resin material.
Next, as illustrated in FIG. 6B, the terminal 1211 is formed on the principal surface on the upper side in the Z-axis direction of the substrate 100. The terminal 1211 is connected to the TFT circuit in the display unit 101. As shown in FIG. 6C, a planarization preparation layer 1226 is formed on the substrate 100 including the terminal 1211 by the same material and the same material as the planarization film 120.

  As shown in FIG. 6D, a mask 500 having openings 500a having a predetermined pattern is formed on the planarization preparation layer 1226 and patterned using a photolithography method. In this embodiment, patterning with a positive resist is shown as an example, but it is of course possible to perform patterning with a negative resist. As a result, as shown in FIG. 7A, a plurality of projecting core portions 1221 separated from the planarizing film 120 in the display portion 101 are formed.

Next, as shown in FIG. 7B, an anode metal layer 1227 is formed so as to cover the entire surface of the planarizing film 120 and the protruding core portion 1221. The anode metal film 1227 is formed using a conductive material such as silver (Ag) as described above.
As shown in FIG. 7C, a mask 501 having a predetermined pattern of openings 501a is formed on the anode metal film 1227, and patterned using a photolithography method. Also in this step, patterning with a positive resist is employed as an example. Thus, as shown in FIG. 7D, the anode 131 is formed on the planarizing film 120, and the protruding shell 1222 is formed so as to cover the protruding core 1221 in the terminal portion. A plurality of protrusions 122 are formed. Note that the protruding shell 1222 is electrically connected to the terminal 121.

As described above, the terminal 1211 and the protrusion 122 are completed.
6 (a) to 6 (d) and FIGS. 7 (a) to 7 (d), only portions related to the terminals 1211 and the protrusions 122 are extracted and schematically illustrated. The element is omitted.
Further, as shown in FIG. 7C and the like, in the present embodiment, each protrusion 122 is independent, and the protrusion core part 1221 and the protrusion shell part 1222 are separated from the adjacent ones as an example. However, the protrusion shell 1222 and the protrusion core part 1221 do not necessarily have to be separated from those of the adjacent protrusion 122, and the protrusion core part 1221 and the protrusion shell part 1222 of the protrusion 122 are continuous for each terminal 121 unit. Also good. It is not always necessary to have a separate and independent state, and they can be formed one by one.

7). Superiority The display device 1 according to the present embodiment employs the above-described structure for connecting the display panel unit 10 and the flexible wiring boards 31 to 34, thereby providing the following superiority.
In the display device 1 according to the present embodiment, no short circuit occurs between the adjacent terminals 121 when the display panel unit 10 and the flexible wiring boards 31 to 34 are connected. This is because the connection of the above-described portion in the display device 1 according to the present embodiment is performed using the protrusion 122 provided on the main surface of the terminal 121, and thus different from the terminal connection structure according to the prior art. Unlike the case of using a conductive adhesive, it is possible to reliably connect the terminals without causing a short circuit between adjacent terminals. In particular, when the terminal connection structure according to the present embodiment is adopted, even when the display panel unit 10 has a higher definition and a narrower frame, this reduces the pitch between terminals and the terminal length. High connection performance can be secured without being affected by shortening.

  Further, in the terminal connection structure in the display device 1 according to the present embodiment, since the anisotropic conductive adhesive is not used for the connection between the terminals, it is not necessary to apply high temperature to the display panel unit 10 during solidification, and light emission The element part 130 is not damaged. In addition, joining of the board | substrate 100 of the display panel part 10 and the flexible wiring boards 31-34 can also be performed using the structure which presses each other mechanically with a clip etc. other than filling with a resin material.

In the present embodiment, the protruding core portion 1221 is formed of a material different from that of the substrate 100, specifically, a material common to the planarization film 120. For example, the substrate is formed using a nanoimprint method or the like. The protruding core portion can also be formed by forming a convex portion in itself.
[Modification 1]
A terminal connection structure according to Modification 1 will be described with reference to FIG. In FIG. 8, only the portion related to the connection between the terminal 621 in the display panel unit 10 and the wiring terminal 321 in the wiring board main body 320 of the flexible wiring board 32 is drawn and drawn.

  As shown in FIG. 8, in the terminal connection structure according to the first modification, a plurality of protrusions 622 are protruded from the wiring terminal 321 in the wiring board body 320 of the flexible wiring board. The protrusion 622 may have a two-layer structure of a protrusion core part and a protrusion shell part, as in the case of the protrusion 122 according to the first embodiment, or a single layer made of a conductive material as shown in FIG. It may be a structure.

As described above, in the terminal connection structure according to Modification 1, the top portion of the protrusion 622 is in contact with the terminal 621 on the substrate 100, and in this state, the adhesive layer made of an insulating material such as a resin material is formed in the gap portion. By being inserted, mutual connection is made.
As a specific example of the method of forming the protrusions 622, for example, a method of laminating a thick metal film on the wiring terminal 321 and selectively patterning the metal film can be employed. Alternatively, a method of laminating a multilayered metal film on the wiring terminal 321 and selectively patterning the metal film can be employed.

Note that in this modification as well, the size and number of protrusions 622 can be the same as those in the above embodiment. Moreover, the same change as the said embodiment is also possible.
[Modification 2]
A terminal connection structure according to Modification 2 will be described with reference to FIG. In FIG. 9, only the portion related to the connection between the terminal 721 in the display panel unit 10 and the wiring terminal 321 in the wiring board main body 320 of the flexible wiring board 32 is drawn and drawn.

  As shown in FIG. 9, in the substrate 700 according to the second modification, a plurality of recesses 700a are formed in a region where a connection terminal is formed. A conical protrusion remains between the adjacent recesses 700a. Thus, the terminal 721 is formed along the surface of the substrate 700 on which the concave portion 700a is formed, and the terminal 721 in the display panel portion is formed.

  In the terminal connection structure according to Modification 2, since the terminal 721 is formed along the unevenness of the substrate 700, a portion protruding between the adjacent recesses 700a is formed. In the second modification, the top portion of the projecting portion abuts on the wiring terminal 321 provided on the wiring board body 320 of the flexible wiring board, and is joined by an adhesive layer (not shown) filled therebetween. Is planned.

Note that as the shape of the concave portion provided in the substrate 700, each shape exemplified in Embodiment 1 such as a hemispherical shape or a cylindrical shape can be employed.
[Modification 3]
A terminal structure according to Modification 3 will be described with reference to FIG. In FIG. 10, the terminals 1211 provided on the substrate 100 in the display panel portion and the protrusions 162 protruding from the terminals 1211 are extracted and schematically illustrated.

  As shown in FIG. 10, in the display panel unit according to this modification, a plurality of flat strip-like terminals 1211 are formed on the substrate 100, which is the same as in the first embodiment. In the third modified example, a plurality of columnar protruding core portions 1621 having a semicircular cross section are formed, and a metal thin film as a protruding shell portion 1622 is formed on each terminal 1211. In the third modification, the protrusion 162 is configured by a combination of a semi-cylindrical protrusion core part 1621 and a protrusion shell part 1622 covered on the surface thereof.

It is desirable that five or more protrusions 162 are formed for each terminal 1211, and the size and the like are the same as those in the first embodiment.
Even when such a configuration is adopted, the connection quality is assured as described above.
[Modification 4]
A method for forming the protrusion 122 according to Modification 4 will be described with reference to FIGS. 11A to 11D and FIGS. 12A to 12B. 11A to 11D and FIGS. 12A to 12B also schematically illustrate the shape of the terminal 1211 and the shape of the protrusion 122.

  As shown in FIG. 11A, a terminal 1211 is formed on the main surface, and a hole injection layer 1331 which is a part of the constituent elements of the light emitting element unit 130 is stacked on the display unit 101 (left side in the Y-axis direction). The formed substrate 100 is prepared. Next, as shown in FIG. 11B, a bank preparation layer 1228 for forming the bank 132 is laminated so as to cover the entire surface of the substrate 100 including the hole injection layer 1331.

  As shown in FIG. 11C, a negative resist mask 502 having a predetermined pattern of openings 502a is disposed at a position corresponding to the edge portion of the substrate 100. As shown in FIG. In this state, by patterning using a photolithography method, a bank 132 is formed on the display unit 101 (left side in the Y-axis direction) and a protruding core unit 1221 is formed on the edge of the substrate 100 as shown in FIG. Is done. That is, in the manufacturing method according to the fourth modification, the protruding core portion 1221 is formed using the same material as the bank 132 and in the same process.

As shown in FIG. 12A, a mask having a predetermined pattern of openings 503a is arranged to form a cathode preparation film for forming a cathode. Thus, as shown in FIG. 12B, the cathode electrode 134 is formed in the display unit 101, and the protruding shell 1222 is formed in the edge portion of the substrate 100. Thus, the formation of the protruding 122 is completed. To do.
As described above, in the manufacturing method according to Modification Example 4, the protruding core portion 1221 is formed simultaneously with the bank 132, and the protruding shell portion 1222 is formed simultaneously with the cathode 134.

In this modification, the method of forming the protrusions 122 in a state of being separated and independent from each other has been described as an example. However, as described above, it is not necessary to form the protrusions 122 in a state of being separated and independent from each other. You can also.
[Modification 5]
A method for forming the protrusion 821a of the terminal 821 according to Modification 5 will be described with reference to FIGS. 13 (a) and 13 (b). 13A and 13B also schematically show the shape of the protrusion 821a.

As shown in FIG. 13 (a), in the manufacturing method according to the modified example 5, the substrate surface made of glass is protruded only at the portion where the protrusion on the terminal is to be provided (protrusion 800a). The protrusion 800a can be formed, for example, by using a nanoimprint method or by patterning with a resist.
Next, as shown in FIG. 13B, a terminal 821 is formed using a conductive material (for example, a metal material) on the surface of the substrate 800 including the protrusion 800a. As a result, the portion of the substrate 800 where the protrusion 800a is provided becomes the protrusion 821a of the terminal 821.

As described above, the terminal 821 provided with the plurality of protrusions 821a is completed.
[Modification 6]
A method of forming the protrusion 826a of the terminal 826 according to Modification 6 will be described with reference to FIGS. 14 (a) to 14 (c). 14A to 14C also schematically show the shape of the protrusion 826a.

As shown in FIG. 14A, a flat substrate 100 made of glass is prepared. Next, as illustrated in FIG. 14B, a plurality of protruding core portions 8221 are formed on the upper main surface in the Z-axis direction of the substrate 100. The protruding core portion 8221 can be formed by nanoimprinting using, for example, a glass material.
As shown in FIG. 14C, by forming a conductive film on the surface of the substrate 100 including the protruding core portion 8221, a terminal 826 including a plurality of protrusions 826a is completed.
[Embodiment 2]
A terminal connection structure according to the second embodiment will be described with reference to FIG. The second embodiment is characterized by a terminal connection structure between the printed board 150 and the wiring board.

As shown in FIG. 15A, a predetermined pattern of wiring (terminal) 171 is laid on the upper main surface in the Z-axis direction of the printed board 150. A plurality of electronic components 180 are mounted on the printed board 150. The right portion in the Y-axis direction of the wiring 171 becomes a terminal provided for connection to the wiring board.
A plurality of protrusions 172 protrude from the main surface of the wiring 171 at the edge portion of the printed circuit board 150. The projection 172 basically has a two-layer structure of a projection core portion 1771 made of an insulating material and a projection shell portion 1772 covering the surface thereof, like the projection 122 according to the first embodiment. . The method for forming the protrusion 172 is the same as described above.

The wiring (terminal) 171 of the printed circuit board 150 and the wiring terminal 371 laid on the wiring board main body 370 are connected to each other by the top portion of the projection 172 projecting on the wiring 171 contacting the wiring terminal 371. Connection is achieved. And although illustration is abbreviate | omitted, when the contact bonding layer is inserted between the printed circuit board 150 and the wiring board main body 370, mechanical joining between each other is achieved.
[Modification 7]
A terminal connection structure according to Modification 7 will be described with reference to FIG. This modification 7 also has a feature in the terminal connection structure between the printed circuit board 150 and the wiring board.

As shown in FIG. 15B, in the present modified example 7, a part of the wiring 173 itself on the printed board 150 is raised, and the part is in a protruding state (protrusion 173a). The protrusion 173a in the wiring 173 can be formed, for example, by patterning a metal film that has been formed thick in advance, leaving a portion where the protrusion 173a is to be formed.
As shown in FIG. 15B, the top portion of the protrusion 173a of the wiring 173 abuts against the wiring terminal 371 of the wiring board main body 370, and a normal temperature curable resin material or an ultraviolet curable resin in this state. By using a material and bonding the substrates 150 and 370, bonding between each other is performed in the same manner as described above.
[Modification 8]
A terminal connection structure according to Modification 8 will be described with reference to FIG. This modification 8 also has a feature in the terminal connection structure between the printed board 150 and the wiring board.

As shown in FIG. 16, in Modification 8, a plurality of protrusions 672 are provided to protrude on a wiring terminal 371 disposed on the lower main surface in the Z-axis direction of the wiring board body 370.
On the other hand, the wiring 671 on the printed circuit board 150 is not formed with a protrusion even in the connection portion.
As shown in FIG. 16, in the terminal connection structure according to the modified example 8, the top portion of the protrusion 672 of the wiring terminal 371 in the wiring board main body 370 comes into contact with the wiring 671 of the printed circuit board 150. Connection is achieved. Also in this modification, the printed circuit board 150 and the wiring board main body 370 are mechanically bonded by inserting an adhesive layer (not shown).
[Modification 9]
A terminal connection structure according to Modification 9 will be described with reference to FIG. This modification 9 also has a feature in the terminal connection structure between the printed board 750 and the wiring board.

  As shown in FIG. 17, the printed circuit board 750 has a plurality of recesses 750a at the right edge portion in the Y-axis direction. The wiring 771 on the printed circuit board 750 is laid along the surface of the recess 750a, and a portion between the adjacent recess 750a and the recess 750a protrudes. In the present modification 8, the protrusions of the terminals are formed by forming the plurality of recesses 750a. Then, the connection between the wiring terminal 371 and the wiring 771 of the wiring board main body 370 is made by contact with the top portion of the protruding portion that is formed between the recess 750a and the recess 750a.

The printed circuit board 750 and the wiring board main body 370 are mechanically joined by inserting an adhesive layer (not shown).
[Other matters]
In the first embodiment and the first to sixth modifications, the display device 1 including the display panel unit 10 including the organic EL light emitting element is used as an example. However, the present invention is a display device other than this, for example, a liquid crystal The present invention can also be applied to display devices, plasma display devices, and the like.

In addition, the constituent materials and the like of the elements used above are shown as an example, and the present invention is not limited thereto. Similarly, the size of each element is not limited.
The configuration of the present invention shown as an example in the first and second embodiments and the first to sixth modifications is effective particularly when a flexible substrate is used because terminal connection can be performed without applying heat.

  In Embodiments 1 and 2 and Modifications 2 to 6 and the like, since the protrusion is formed by coating the conductive protrusion shell on the protrusion core, for example, the protrusion is formed only from the metal material. Compared with the case, it will have elasticity. That is, in the case of only a metal material, the shape is not restored once it is crushed by pressure, but in the case of the present invention using a projecting core part such as a resin, an attempt is made to restore the original shape by the projecting core part. The power to do will work. Therefore, even when the adhesive expands, etc., the present invention is excellent from the viewpoint of maintaining conductivity and ensuring conductivity.

  INDUSTRIAL APPLICABILITY The present invention is useful for reliably connecting terminals arranged at a narrow pitch without damaging the light emitting element portion in manufacturing a high-definition display device.

1. Display device 10. Display panel section 20. Drive control part 21-24. Drive circuit 25. Control circuit 31-34. Flexible wiring board 40. Adhesive layer 100,700,750,800. Substrate 101. Display unit 110. Thin film transistor 111. Gate 112. Drain 113. Source 114. Gate insulating film 115. Passivation film 120. Planarization film 121,141,721,821,826. Terminals 122, 162, 172, 622, 672. Protrusion 130. Light-emitting element portion 131. Anode 132. Bank 133. Light emitting laminate 134. Cathode 150. Printed circuit boards 171, 173, 671, 771. Wiring 180. Electronic component 320,370. Wiring board main body 321,371. Wiring terminal 500-503. Resist mask 1211. Power terminal 1212. Signal terminals 1221, 1621, 1771, 8221. Protrusion core part 1222,1622,1772. Protrusion shell 1226. Planarization preparation layer 1227. Anode preparation layer 1228. Bank preparation layer 1331. Hole injection layer

Claims (15)

A plurality of terminals arranged in parallel on the main surface of each of the first substrate and the second substrate is a terminal connection structure that is electrically connected,
At least a part of the plurality of terminals provided on the first substrate has a protrusion protruding from each main surface toward the terminal of the second substrate,
The terminal connection structure characterized in that the partial terminals of the first substrate are electrically connected to the terminals of the second substrate by contact with the top portions of the protrusions. body. The terminal connection structure according to claim 1, wherein an adhesive layer is interposed at least in part between the first substrate and the second substrate. The terminal connection structure according to claim 2, wherein the adhesive layer is formed using a resin material having normal temperature curing shrinkage or a resin material having ultraviolet curing shrinkage. 4. The terminal connection structure according to claim 1, wherein the projecting portion has a circular or polygonal outer peripheral shape in a cross-sectional direction along the main surface of the one substrate. body. The terminal connection structure according to any one of claims 1 to 4, wherein the protrusion is provided in all of the plurality of terminals in the first substrate. A display panel part in which a plurality of lead terminals are formed on the outer edge part;
A drive control circuit unit having a plurality of connection terminals electrically connected to each of the plurality of lead terminals in the display panel unit,
The display device according to claim 1, wherein the terminal connection structure according to claim 1 is employed for connection between the plurality of lead terminals and the plurality of connection terminals. The display panel unit has a plurality of light emitting elements arranged two-dimensionally,
Each of the plurality of light emitting elements has a configuration in which an organic light emitting layer is inserted between two electrodes,
The plurality of lead terminals are composed of a power supply terminal for supplying current and a signal terminal for signal.
The display device according to claim 6, wherein the protrusion is formed at least on the power supply terminal or the connection terminal connected to the power supply terminal. In at least a part of the lead terminals in the display panel unit,
A protruding core portion is formed on the surface of the terminal base having conductivity, and a shell portion having conductivity is formed in a state of covering the surface of the core portion.
The display device according to claim 7, wherein the protrusion is formed by electrically connecting the shell portion to the terminal base. The display device according to claim 8, wherein the core portion is formed using an organic material. In the display panel unit, the plurality of light emitting elements are two-dimensionally arranged on the TFT substrate,
A planarization film is interposed between the TFT substrate and the plurality of light emitting elements,
The display device according to claim 8, wherein the core portion is formed of a material common to the planarization film. The display device according to claim 10, wherein the shell is formed of a material common to one of the two electrodes. The plurality of light emitting elements are each defined by a bank,
The display device according to claim 8, wherein the core portion is formed of a material common to the bank. The display device according to claim 12, wherein the shell is formed of a material common to an electrode on the upper side in the stacking direction of the organic light emitting layer among the two electrodes. In the one substrate, a portion corresponding to at least a part of the plurality of terminals is raised,
The display device according to claim 7, wherein the protrusion is formed by covering the protruding portion with a conductive film constituting the terminal. In the one substrate, a dimple-like or groove-like recess is formed at a location corresponding to at least a part of the plurality of terminals,
On the portion where the concave portion is formed, a conductive film constituting the terminal is coated,
The display device according to claim 7, wherein a crest portion between adjacent concave portions corresponds to the protrusion in a state where the conductive film is coated.

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