JP2011005586A - Substrate dividing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate dividing device capable of dividing a substrate and a frame section that holds the substrate while minimizing scattering of cutting chips.SOLUTION: The substrate dividing device 1 includes: an elastic member 20 independently and respectively holding the substrate 10 at a substrate section 11 and a frame section 12, the substrate 10 including a substrate section 11 in which electronic components are mounted, a frame section 12 surrounding the substrate section 11, and a rib 13 connecting the substrate section 11 and the frame section 12; a base member 30 holding the elastic member 20; a rotary drive section 50 rotating a router bit 51 for removing the ribs 13; a rotary controlling section 60 controlling the rotary drive section 50; a moving means 70 successively moving the router bit 51 together with the rotary drive section 50 to a plurality of positions; movement controlling section 80 controlling the moving means 70; and a dust collection section 90 sucking the substrate section 11 and cutting chips generated during removal of the ribs 13.

Description

  The present invention relates to a board dividing apparatus that divides a printed wiring board, a board such as a mounting board on which electronic components are mounted on the printed wiring board, and a frame part that is partially connected to the board and holds the board.

A board dividing apparatus that divides a printed wiring board or a board such as a mounting board on which electronic components are mounted on the printed wiring board and a frame part that is partially connected to the board and holds the board is generally a press plate. It is roughly divided into a type using a type and a type using a router bit.
A substrate splitting device of the type using a press die can cut a plurality of ribs connecting the substrate and the frame portion at the same time. On the other hand, since a large stress is applied to the substrate during the cutting, it is mounted on the substrate or the substrate. In some cases, the electronic component is damaged or a connection failure between the substrate and the electronic component occurs.
On the other hand, a substrate dividing apparatus using a router bit has a lower productivity than a type using a press die to remove the plurality of ribs one by one, but it is an electronic component mounted on a substrate or a substrate. Can be reduced, and the occurrence of poor connection between the board and the electronic component can be reduced.

In recent years, the possibility of breakage of a substrate or an electronic component is increased when the substrate is divided due to the downsizing of the substrate and the electronic component. In addition, since the connection area between the substrate and the electronic component has been reduced along with the miniaturization of the substrate and the electronic component, there is a high possibility that a connection failure between the substrate and the electronic component will occur. Therefore, recently, a substrate dividing apparatus using a router bit has attracted attention.
An example of a substrate dividing apparatus using such a router bit is disclosed in Patent Document 1.

Japanese Patent Laying-Open No. 2005-069771

In the substrate dividing apparatus disclosed in Patent Document 1, generally, the surface of the substrate on the side where the dust collector for sucking the chips is disposed is exposed, so that the chips are widely distributed on the surface of the substrate. It adheres over. For this reason, a process of cleaning the substrate and removing chips after the substrate division is necessary, which is a factor that deteriorates productivity.
In addition, in a substrate in which a plurality of electronic components are mounted on the substrate at a high density, it is difficult to remove chips that have entered the gap between the substrate and the electronic component or between the electronic components. If the chips enter the gap between the substrate and the electronic component or the gap between the electronic components, the chip causes a connection failure between the substrate and the electronic component and a connection failure between the electronic components.

  Therefore, an object of the present invention is to provide a substrate dividing apparatus that divides a substrate and a frame portion that holds the substrate while minimizing the scattering of chips.

In order to solve the above problems, the present invention provides the following substrate dividing apparatus.
1) A board (10) having a mounting board part (11) on which electronic components are mounted, a frame part (12) surrounding the mounting board part, and a rib (13) connecting the mounting board part and the frame part. The elastic member (20) that holds the mounting substrate part and the frame part independently, the base member (30) that holds the elastic member, and the router bit (51) that removes the rib are rotated. A rotation drive unit (50) for controlling, a rotation control unit (60) for controlling the rotation drive unit, a moving unit (70) for sequentially moving the router bit to a plurality of positions together with the rotation drive unit, and the moving unit A movement control unit (80) for controlling the mounting substrate unit, and a dust collection unit (90) for sucking chips generated when the ribs are removed, and the elastic member, The mounting board part is sucked by the dust collecting part. A first suction hole (23) for forming the dust and collecting dust generated when the mounting substrate is held by the elastic member and corresponding to the rib and generated when the rib is removed. And a second suction hole (24) for sucking at the portion, the first suction hole and the second suction hole are provided independently of each other, and the base member is 1. A substrate dividing apparatus (1) characterized in that a first suction hole and a third suction hole (31, 32) connected to the second suction hole are provided.
2) The substrate dividing apparatus according to 1), wherein the elastic member has conductivity.
3) The substrate dividing apparatus according to 1), wherein the second suction hole has a shape into which the router bit can be inserted in a state where the substrate is held by the elastic member.
4) The substrate has a positioning hole (14) in the frame portion, the elastic member has a positioning pin (21) into which the positioning hole is inserted, and the positioning hole is inserted into the positioning pin. The substrate dividing apparatus according to 1), wherein the substrate and the elastic member are positioned by the above.

  According to the present invention, it is possible to divide the substrate and the frame portion that holds the substrate while minimizing the scattering of the chips.

It is the apparatus schematic for demonstrating the Example of the board | substrate division | segmentation apparatus of this invention. It is a schematic diagram for demonstrating the relationship between the board | substrate holding | maintenance part in the board | substrate division | segmentation apparatus of an Example, and the board | substrate hold | maintained at the board | substrate holding part. It is typical sectional drawing in the AA line of FIG. It is typical sectional drawing in the BB line of FIG. It is typical sectional drawing in the CC line of FIG. It is a schematic diagram for demonstrating the board | substrate hold | maintained at the board | substrate holding part in the board | substrate division | segmentation apparatus of an Example. It is a schematic diagram for demonstrating the elastic member of the board | substrate holding part in the board | substrate division | segmentation apparatus of an Example. It is a schematic diagram for demonstrating the base member of the board | substrate holding part in the board | substrate division | segmentation apparatus of an Example. It is a schematic diagram which shows the mounting board | substrate after board | substrate division | segmentation.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIGS.

<Example>
[Configuration of substrate splitting device]
As shown in FIG. 1, the substrate dividing apparatus 1 includes a substrate holding unit 40 including an elastic member 20 that holds the substrate 10 and a base member 30 that holds the elastic member 20.
FIG. 1 is an image diagram schematically showing a perspective view when the rib 13 of the substrate 10 is seen from the front upper side of the paper in a cross section that bisects the rib 13 into the front and back of the paper.

  Further, the substrate dividing apparatus 1 includes a rotation driving unit 50 that is disposed on the side of the substrate holding unit 40 that holds the substrate 10 and rotates the router bit 51 that removes the ribs 13 of the substrate 10 about the rotation axis Z51, and the router bit 51. The rotation control unit 60 that controls the rotation of the rotation drive unit 50 and the rotation driving unit 50 together with the router bit 51 are arranged in the x direction (the left and right direction on the paper surface), the y direction (the front and back direction on the paper surface), and the z direction (the vertical direction on the paper surface). A moving means 70 that moves to an arbitrary position, a movement control unit 80 that controls the moving means 70, and a hood 91 that covers the side of the substrate holding unit 40 that is opposite to the side that holds the substrate 10 are provided. And a dust collecting portion 90 that sucks the chips generated when 13 is removed through the hood 91.

As the router bit 51, a cutting blade is formed in a spiral shape on a substantially rod-shaped peripheral surface, and a commercially available one can be used. In the substrate dividing apparatus 1, the dust collecting portion 90 is provided on the side opposite to the side on which the router bit 51 is disposed with respect to the substrate 10, so it is desirable to use a left-twisted type router bit.
The rotation drive unit 50 includes, for example, a high-speed spindle motor.
The moving means 70 is configured to have, for example, a three-axis (X, Y, Z) orthogonal coordinate system slider or robot. The Z axis may be configured with a simple positioning device using an air cylinder.
The dust collector 90 is, for example, a dust collector including a rotary blower that uses a motor as a drive source.
The rotation control unit 60 is an inverter control device that can variably set the rotation speed of the router bit, for example.
The movement control unit 80 is, for example, a numerical controller or a personal computer having a numerical control function capable of controlling the movement amount of the moving unit 70.

Here, the relationship between the substrate holding unit 40 and the substrate 10 held by the substrate holding unit 40 will be described with reference to FIGS.
FIG. 2 is a schematic view for explaining the relationship between the substrate holding unit 40 and the substrate 10 held by the substrate holding unit 40 in the substrate dividing apparatus 1, and is a plan view seen from the substrate 10 side. FIG. 3 is a schematic cross-sectional view taken along the line AA of FIG. 4 is a schematic cross-sectional view taken along line BB in FIG. FIG. 5 is a schematic cross-sectional view taken along the line CC of FIG. 6A and 6B are schematic views for explaining the substrate 10 held by the substrate holding unit 40. FIG. 6A is a plan view, and FIG. 6B is a schematic cross section taken along line AA in FIG. FIG. 6C is a schematic cross-sectional view taken along line BB in FIG. 6A, and FIG. 6D is a schematic cross-sectional view taken along line CC in FIG. 7A and 7B are schematic views for explaining the elastic member 20 in the substrate holding unit 40, FIG. 7A is a plan view, and FIG. 7B is a schematic cross-sectional view taken along line AA in FIG. FIG. 7C is a schematic cross-sectional view taken along the line BB in FIG. 7A, and FIG. 7D is a schematic cross-sectional view taken along the line CC in FIG. 6A to 6D correspond to FIGS. 7A to 7D, respectively. FIG. 8 is a schematic diagram for explaining the base member 30 in the substrate holding unit 40, FIG. 8A is a plan view, and FIG. 8B is a schematic cross-sectional view taken along line AA in FIG. FIG.8 (c) is typical sectional drawing in the BB line of (a). Moreover, FIG. 6 (a)-(c), FIG. 7 (a)-(c), and FIG. 8 (a)-(c) respond | correspond, respectively.

As shown in FIGS. 2 to 6, the substrate 10 includes a mounting substrate portion 11 on which a plurality of electronic components are mounted, a frame portion 12 disposed so as to surround the mounting substrate portion 11, and the mounting substrate portion 11 and the frame. A plurality of ribs 13 that connect the portion 12 and a positioning hole 14 provided in the frame portion 12 are provided.
In FIGS. 2, 3, and 6, a region where a plurality of electronic components are mounted is schematically shown as A11.

The substrate 10 is, for example, a printed wiring board. The gap portion between the mounting substrate portion 11 and the frame portion 12 and the rib 13 can be formed by an outer shape processing machine using a router bit. The positioning hole 14 can be formed by, for example, drilling.
In the embodiment, the mounting region A11 is provided on one surface side of the mounting substrate unit 11. However, the present invention is not limited to this, and the mounting region A11 is provided on both surfaces of the mounting substrate unit 11, that is, the mounting substrate unit. 11 may have a configuration in which a plurality of electronic components are mounted on both surfaces, or a printed wiring board on which no electronic components are mounted.

As shown in FIGS. 2 to 5 and 7, the elastic member 20 in the substrate holding unit 40 is made of an elastic body having conductivity, and the positioning hole 14 of the substrate 10 is inserted into the elastic member 20 and the elastic member. 20 and the positioning pin 21 and the electronic components mounted in the mounting area A11 so that the electronic component mounted in the mounting area A11 does not contact the elastic member 20 when the substrate 10 is positioned and held by the elastic member 20. Corresponding to each rib 13 in a state in which the concave portion 22 that accommodates components, the suction hole (first suction hole) 23 for sucking the mounting substrate portion 11, and the substrate 10 is positioned and held by the elastic member 20. And a suction hole (second suction hole) 24 for sucking swarf generated when the rib 13 is removed by the router bit 51.
The opening area of the suction hole 24 is preferably as small as possible so long as the router bit 51 can be inserted and the rib 13 can be removed when the substrate 10 is held by the elastic member 20. By making the suction hole 24 small, the range in which the chips adhere to the substrate 10 can be suppressed only to the region corresponding to the suction hole 24.

As the conductive elastic body, conductive rubber in which carbon is dispersed as a filler in rubber or silicone can be used.
It is desirable that the diameter of the positioning pin 21 and the inner diameter of the positioning hole 14 be approximately the same value so that the substrate 10 is positioned and fixed to the elastic member 20.
If no electronic component is mounted, the recess 22 may not be provided.
A suction hole 23 for sucking the mounting substrate portion 11 and a suction hole 24 for sucking chips are formed independently of each other. Although it is desirable to form the suction holes 24 independently for each rib 13, for example, when the ribs 13 are formed adjacent to each other, a common suction hole may be used.

  As shown in FIGS. 2 to 5 and 8, the base member 30 in the substrate holding unit 40 is made of metal such as aluminum or stainless steel, and corresponds to the suction hole 23 and the suction hole 24 of the elastic member 20, respectively. Thus, a suction hole (third suction hole) 31 and a suction hole (third suction hole) 32 are formed.

[Substrate division method]
Next, a substrate dividing method using the substrate dividing apparatus 1 described above will be described with reference to FIGS.

  First, the positioning hole 14 of the substrate 10 is inserted into the positioning pin 21 of the elastic member 20 in the substrate holding part 40 to position the substrate 10 and the elastic member 20. At this time, the electronic component mounted in the mounting area A <b> 11 of the substrate 10 is accommodated in the recess 22 of the elastic member 20.

  Next, since the dust collecting unit 90 is operated, the mounting substrate unit 11 of the substrate 10 is sucked to the dust collecting unit 90 side through the suction hole 23, the suction hole 31, and the hood 91. The member 20 is held elastically in close contact. At this time, the rib 13 of the substrate 10 and the area in the vicinity thereof are also sucked to the dust collecting unit 90 side through the suction hole 24, the suction hole 32, and the hood 91.

The rotation control unit 60 controls the rotation driving unit 50 to rotate the router bit 51 at a preset number of rotations.
Next, the movement control unit 80 moves the moving unit 70 based on a preset program. For example, it is moved along a locus indicated by an arrow S in FIG.
Then, by sequentially removing all the ribs 13 with the router bit 51, the mounting substrate portion 11 and the frame portion 12 can be separated.

  Next, after the rotation of the router bit 51 is stopped and the rotation drive unit 50 is retracted from the substrate 10 together with the router bit 51 and the operation of the dust collecting unit 90 is stopped, the mounting substrate unit 11 and the frame unit 12 are separated from the substrate dividing device. Remove from 1 separately. FIG. 9 shows the mounting substrate 11 after substrate division. 9B is a schematic cross-sectional view taken along line AA in FIG. 9A, and FIGS. 9A and 9B are respectively shown in FIGS. 6A to 8B. Corresponding.

By the way, swarf is generated when the rib 13 is removed by the router bit 51, and this swarf is quickly sucked into the dust collecting part 90 through the suction hole 24, the suction hole 32, and the hood 91. In addition, some chips may adhere to the substrate 10, but since the substrate 10 and the elastic member 20 are in close contact with each other around the suction hole 24, the adhesion of the chips to the substrate 10 It is limited only to the area corresponding to the suction hole 24.
Therefore, according to the board | substrate division | segmentation apparatus 1 mentioned above, it can prevent that a chip enters into the clearance gap between an electronic component and a board | substrate, or the clearance gap between electronic components.

  In addition, when all the ribs 13 are removed and the mounting substrate portion 11 and the frame portion 12 are divided, conventionally, at least one of the mounting substrate portion 11 and the frame portion 12 is scattered to break the mounting substrate portion 11. However, according to the substrate dividing apparatus 1 described above, the mounting substrate portion 11 is sucked to the dust collecting portion 90 side through the suction hole 23, the suction hole 31, and the hood 91, and is elastic to the elastic member 20. Since the positioning hole 14 is inserted and held in the positioning pin 21 of the elastic member 20, the frame 12 can be prevented from being scattered together. .

  By the way, when static electricity is charged on the mounting substrate on which the electronic component is mounted, the mounted electronic component may be electrostatically broken. Therefore, in the substrate dividing apparatus 1 described above, by using a conductive elastic body for the elastic member 20, static electricity can be efficiently discharged from the mounting substrate portion 11 to the outside via the elastic member 20. It is possible to prevent electrostatic breakdown of the electronic components.

  The embodiment of the present invention is not limited to the configuration and procedure described above, and it goes without saying that modifications may be made without departing from the scope of the present invention.

  For example, the shape of the elastic member 20 and the base member 30 and the shape and number of the suction holes 13, 14, 23, 24 are not limited to the embodiments, and depend on the shape of the substrate to be divided and the number of ribs. Are appropriately designed.

  In the embodiment, the positioning hole 14 is formed in the substrate 10, the positioning pin 21 is formed in the elastic member 20, and the positioning hole 14 is inserted into the positioning pin 21 to position the substrate 10 and the elastic member 20. However, the present invention is not limited to this, and any means may be used as long as the positioning of the substrate and the elastic member is possible and the frame portion does not scatter when all the ribs are removed.

  In the embodiment, the base member 30 is provided with suction holes (third suction holes) 31 and 32 corresponding to the suction holes 23 and 24 (first suction holes and second suction holes) of the elastic member 20, respectively. Although provided, it is not limited to this. For example, the third suction hole may be a suction hole common to the plurality of suction holes (second suction holes) 24, or the suction hole (first suction hole) 23 and the suction hole (second suction hole). ) 24 may be a common suction hole.

1_ substrate dividing device, 10_ substrate, 11_ mounting substrate portion, 12_ frame portion, 13_ rib, 14_ positioning hole, 20_ elastic member, 21_ positioning pin, 22_ concave portion, 23, 24, 31, 32_ suction hole, 30_ base member, 40_ Substrate holding part, 50_rotation drive part, 51_router bit, 60_rotation control part, 70_moving means, 80_movement control part, 90_dust collecting part, Z51_rotating shaft, A11_mounting area

Claims (4)

A mounting substrate portion on which an electronic component is mounted, a frame portion surrounding the mounting substrate portion, and a substrate having a rib connecting the mounting substrate portion and the frame portion, the mounting substrate portion and the frame portion are independent of each other. An elastic member to hold and
A base member for holding the elastic member;
A rotation drive unit that rotates a router bit that removes the rib;
A rotation control unit for controlling the rotation driving unit;
Moving means for sequentially moving the router bit to a plurality of positions together with the rotation driving unit;
A movement control unit for controlling the moving means;
While sucking the mounting substrate portion, a dust collection portion for sucking chips generated when the ribs are removed,
With
The elastic member is formed corresponding to the rib in a state where the mounting substrate is held by the elastic member, and a first suction hole for sucking the mounting substrate portion by the dust collecting portion. And a second suction hole for sucking the chips generated when the dust is removed by the dust collecting portion, and the first suction hole and the second suction hole are provided independently of each other. And
3. The substrate dividing apparatus according to claim 1, wherein the base member is provided with a third suction hole connected to the first suction hole and the second suction hole.   The substrate dividing apparatus according to claim 1, wherein the elastic member has conductivity.   2. The substrate dividing apparatus according to claim 1, wherein the second suction hole has a shape into which the router bit can be inserted in a state where the substrate is held by the elastic member. The substrate has a positioning hole in the frame;
The elastic member has a positioning pin through which the positioning hole is inserted,
The substrate dividing apparatus according to claim 1, wherein the substrate and the elastic member are positioned by inserting the positioning hole through the positioning pin.

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