JP2011005583A - Cutting tool - Google Patents

Cutting tool Download PDF

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JP2011005583A
JP2011005583A JP2009150613A JP2009150613A JP2011005583A JP 2011005583 A JP2011005583 A JP 2011005583A JP 2009150613 A JP2009150613 A JP 2009150613A JP 2009150613 A JP2009150613 A JP 2009150613A JP 2011005583 A JP2011005583 A JP 2011005583A
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lower layer
cutting edge
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JP5349164B2 (en
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Kazunori Ishikawa
和範 石川
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Kyocera Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a cutting tool which restricts peeling of a coating layer within the ridge of the cutting blade, is improved in chipping resistance in a cutting blade, and has a long service life.SOLUTION: In a throw-away tip 1 coated with a plurality of coating layers 9 including a lower layer 9L and an upper layer 9U on the surface of a base body 8, a nearly V-shaped lower layer chipped part 10 exists in the ridge 4 of the cutting blade in the lower layer 9L, and at least the surface of the lower layer chipped part 10 of the lower layer 9L is coated with the upper layer 9U.

Description

本発明は、基体の表面に被覆層が形成された切削工具に関する。   The present invention relates to a cutting tool in which a coating layer is formed on the surface of a substrate.

従来から、基体の表面に被覆層をコーティングした切削工具が知られており、その切刃における被覆層の状態が検討されている。例えば、特許文献1ではアークイオンプレーティング法によって被覆層を成膜する際に、二次スパッタによって切刃稜線部のみの被覆層を除去したドリルが開示され、切削初期における欠損や膜剥離を防止できることが記載されている。また、同号の図4では、被覆層を2層成膜した構成において上層のみが切刃稜線部で除去され、下層にはほとんど影響がない構成となっていることが記載されている。   Conventionally, a cutting tool in which a surface of a substrate is coated with a coating layer is known, and the state of the coating layer on the cutting edge has been studied. For example, Patent Document 1 discloses a drill in which only a cutting edge ridge line portion is removed by secondary sputtering when a coating layer is formed by an arc ion plating method, thereby preventing defects and film peeling in the initial stage of cutting. It describes what you can do. Further, FIG. 4 of the same document describes that in the configuration in which two coating layers are formed, only the upper layer is removed at the cutting edge ridge portion and the lower layer is hardly affected.

また、特許文献2では、ダイヤモンドまたはcBNを主体とする第1硬質膜(下層)を被覆した後、切れ刃稜(切刃稜線部)において母材(基体)が露出するようにホーニングし、その後、改めて第2硬質膜(上層)を成膜した切削工具が開示され、切刃稜線部において硬質膜の剥離や被削材の融着が抑制されることが記載されている。   Further, in Patent Document 2, after coating the first hard film (lower layer) mainly composed of diamond or cBN, honing is performed so that the base material (substrate) is exposed at the cutting edge ridge (cutting edge line portion), and then Further, a cutting tool in which a second hard film (upper layer) is formed again is disclosed, and it is described that the peeling of the hard film and the fusion of the work material are suppressed at the cutting edge ridge line portion.

特開2000−52118号公報JP 2000-52118 A 特開平08−174309号公報Japanese Patent Laid-Open No. 08-174309

しかしながら、特許文献1や特許文献2のような被覆層の構成においても、切刃稜線部における被覆層の耐剥離性および耐欠損性は不十分であり、耐欠損性の更なる向上が求められていた。   However, even in the configuration of the coating layer as in Patent Document 1 and Patent Document 2, the peeling resistance and fracture resistance of the coating layer at the cutting edge ridge line portion are insufficient, and further improvement in fracture resistance is required. It was.

本発明は、上記従来の課題を改善して、切刃稜線部における被覆層の耐剥離性および耐欠損性が高く、長寿命の切削工具を提供することを目的とする。   An object of the present invention is to provide a long-life cutting tool that improves the above-described conventional problems and has high peeling resistance and fracture resistance of the coating layer at the edge portion of the cutting edge.

本発明の切削工具は、基体の表面に下層と上層とを含む複数の被覆層を被覆しており、切刃稜線部に直交する断面にて観察した際に、前記下層は切刃稜線部において略V字状の下層欠如部が存在しているとともに、少なくとも前記下層の前記下層欠如部の表面を前記上層が被覆しているものである。   The cutting tool of the present invention covers a plurality of coating layers including a lower layer and an upper layer on the surface of the base, and when observed in a cross section orthogonal to the cutting edge ridge line, the lower layer is at the cutting edge ridge line. A substantially V-shaped lower layer lacking portion exists, and the upper layer covers at least the surface of the lower layer lacking portion of the lower layer.

ここで、すくい面の中央部において、前記下層の厚みtが1〜3μm、前記上層の厚みtが2〜5μmであり、前記厚みtと前記厚みtとの比率(t/t)が1.5〜3であることが望ましい。 Here, in the central portion of the rake face, the thickness t L of the lower layer is 1 to 3 μm, the thickness t U of the upper layer is 2 to 5 μm, and the ratio of the thickness t L to the thickness t U (t U / t L ) is preferably 1.5-3.

また、前記略V字状の下層欠如部の深さが0.5〜3μmであることが望ましい。   Moreover, it is desirable that the depth of the substantially V-shaped lower layer lacking portion is 0.5 to 3 μm.

さらに、前記下層欠如部における前記上層の厚みtと前記厚みtとの比率(t/t)が1.2〜1.5であることが望ましい。 Furthermore, it is desirable that a ratio (t E / t U ) between the thickness t E of the upper layer and the thickness t U in the lower layer lacking portion is 1.2 to 1.5.

本発明の切削工具によれば、切刃稜線部に直交する断面にて観察した際に、切刃稜線部において下層に略V字状の下層欠如部が存在しているとともに、前記下層欠如部の表面を前記上層が被覆している構成からなることによって、上層に下層欠如部が存在する構成や、切刃稜線部における下層を基体が露出するまでホーニングした後に改めて上層を被覆した構成に比べて、切刃稜線部における耐欠損性が高いことが判明した。   According to the cutting tool of the present invention, when observed in a cross-section orthogonal to the cutting edge ridge line, a substantially V-shaped lower layer lacking part exists in the lower layer in the cutting edge ridge line part, and the lower layer lacking part Compared to the structure in which the upper layer covers the surface of the surface, the structure in which the lower layer is absent in the upper layer, and the structure in which the lower layer in the cutting edge ridge line portion is honed until the base is exposed and then the upper layer is covered again. Thus, it was found that the fracture resistance at the cutting edge ridge was high.

ここで、すくい面の中央部において、前記下層の厚みtが1〜3μm、前記上層の厚みtが2〜5μmであり、前記厚みtと前記厚みtとの比率(t/t)が1.5〜3である構成において、切刃稜線部における耐欠損性が高くなる。 Here, in the central portion of the rake face, the thickness t L of the lower layer is 1 to 3 μm, the thickness t U of the upper layer is 2 to 5 μm, and the ratio of the thickness t L to the thickness t U (t U / In the configuration in which t L ) is 1.5 to 3, the chipping resistance at the cutting edge ridge is increased.

また、前記略V字状の下層欠如部の深さが0.5〜3μmである場合に、特に切刃稜線部における耐欠損性が高くなる。   Moreover, when the depth of the substantially V-shaped lower layer lacking portion is 0.5 to 3 μm, the fracture resistance particularly at the cutting edge ridge line portion is enhanced.

さらに、前記下層欠如部における前記上層の厚みtと前記厚みtとの比率(t/t)が1.2〜1.5であることが、切刃稜線部における耐欠損性が高いとともに、耐摩耗性も向上する点で望ましい。 Furthermore, the ratio (t E / t U ) between the thickness t E of the upper layer and the thickness t U in the lower layer lacking portion is 1.2 to 1.5. It is desirable in that it is high and wear resistance is also improved.

本発明の切削工具の好適例であるスローアウェイチップの一例を示す概略斜視図である。It is a schematic perspective view which shows an example of the throw away tip which is a suitable example of the cutting tool of this invention. 図1のスローアウェイチップの切刃についての断面図である。It is sectional drawing about the cutting edge of the throw away tip of FIG. 図1のスローアウェイチップの切刃稜線部に直交する断面にて観察した模式図である。It is the schematic diagram observed in the cross section orthogonal to the cutting-edge ridgeline part of the throw away tip of FIG. 本発明の切削工具の他の実施態様におけるスローアウェイチップの切刃稜線部に直交する断面にて観察した模式図である。It is the schematic diagram observed in the cross section orthogonal to the cutting-edge ridgeline part of the throw away tip in the other embodiment of the cutting tool of this invention.

本発明の切削工具の好適例であるスローアウェイチップについて、その一例についての概略斜視図である図1、側面図である図2および切刃稜線部に直交する断面にて観察した模式図である図3を基に説明する。   FIG. 1 is a schematic perspective view of a throwaway tip which is a preferred example of the cutting tool of the present invention, FIG. 1 which is a schematic perspective view of the example, FIG. 2 which is a side view, and a cross-sectional view perpendicular to a cutting edge ridge line portion. This will be described with reference to FIG.

図1によれば、スローアウェイチップ(以下、単にチップと略す。)1は、主面2が多角形形状の略平板状をなして、一方の主面がすくい面2aを、側面が逃げ面3を、すくい面2aと逃げ面3との切刃稜線部4のうちノーズ部5を含んで切刃6が形成されている。なお、すくい面2aとは反対の主面は図2に示すように着座面2bをなしている。   According to FIG. 1, a throw-away tip (hereinafter simply referred to as a tip) 1 has a main surface 2 having a substantially flat plate shape with a polygonal shape, one main surface being a rake surface 2a, and a side surface being a flank. 3, the cutting edge 6 is formed including the nose part 5 of the cutting edge ridge line part 4 of the rake face 2a and the flank face 3. The main surface opposite to the rake surface 2a forms a seating surface 2b as shown in FIG.

チップ1は、図2および図3に示すように、基体8の表面に下層9Lと上層9Uを含む複数層からなる被覆層9が少なくともすくい面2aから逃げ面3にわたって被着形成されている。なお、図2によれば、すくい面2aの中央部には着座面2bにわたって貫通するネジ穴7が設けられている。   As shown in FIGS. 2 and 3, the chip 1 has a coating layer 9 including a plurality of layers including a lower layer 9 </ b> L and an upper layer 9 </ b> U formed on the surface of a base 8 so as to be deposited from at least the rake face 2 a to the flank face 3. In addition, according to FIG. 2, the screw hole 7 penetrated over the seating surface 2b is provided in the center part of the rake face 2a.

ここで、図3によれば、チップ1において、下層9Lは切刃稜線部4において略V字状の下層欠如部10が存在しているとともに、下層9Lの下層欠如部10の表面を上層9Uが被覆している。この構成によって切刃稜線部4における耐欠損性が高くなる。なお、この構成において、切刃稜線部4の耐欠損性が向上する理由は不明であるが、上層9Uの切刃稜線部4における結晶成長状態が複雑になって、成長した上層9Uに存在する残留応力が最適化されるためではないかと推察される。   Here, according to FIG. 3, in the chip 1, the lower layer 9 </ b> L has a substantially V-shaped lower layer lacking portion 10 in the cutting edge ridge line portion 4, and the surface of the lower layer lacking portion 10 of the lower layer 9 </ b> L is the upper layer 9 </ b> U. Is covered. With this configuration, the fracture resistance in the cutting edge ridge portion 4 is increased. In this configuration, the reason why the fracture resistance of the cutting edge ridge portion 4 is improved is unknown, but the crystal growth state in the cutting edge ridge portion 4 of the upper layer 9U becomes complicated and exists in the grown upper layer 9U. It is assumed that the residual stress is optimized.

なお、下層9Lの下層欠如部(以下、下層欠如部と略す。)10の断面形状が図3に示すように少なくとも1つの折れ曲り部11を有し、さらには階段状をなすことが、切刃6における被覆層9の残留応力を効率よく有効に低減して大きなチッピングや欠損を抑制できるとともに、すくい面2aおよび逃げ面3における被覆層9の耐摩耗性をともに維持できることができる点で望ましい。なお、本発明によれば、下層欠如部10の断面形状としては、図4のように上に凸状の折れ曲り部11を持たない曲線状であってもよく、また、階段状としては図3のように上に凸の折れ曲り部11が1つのみであってもよいが、図4(b)のように複数の上に凸状の折れ曲り部11を有する多段の階段状であってもよい。   Note that the cross-sectional shape of the lower layer lacking portion (hereinafter abbreviated as the lower layer lacking portion) 10 of the lower layer 9L has at least one bent portion 11 as shown in FIG. It is desirable in that the residual stress of the coating layer 9 on the blade 6 can be efficiently and effectively reduced to suppress large chipping and chipping, and the wear resistance of the coating layer 9 on the rake face 2a and the flank face 3 can be maintained together. . According to the present invention, the cross-sectional shape of the lower layer lacking portion 10 may be a curved shape having no convex bent portion 11 as shown in FIG. As shown in FIG. 4B, the number of the convex bent portions 11 may be only one. However, as shown in FIG. May be.

ここで、すくい面2aの中央部において、下層9Lの厚みtが1〜3μmであること、上層9Uの厚みtが2〜5μmであり、厚みtと厚みtとの比率(t/t)が1.5〜3、特に2〜3である構成において、切刃稜線部4における耐欠損性が高くなる。 Here, in the central part of the rake face 2a, the thickness t L of the lower layer 9L is 1 to 3 μm, the thickness t U of the upper layer 9U is 2 to 5 μm, and the ratio of the thickness t L to the thickness t U (t In the configuration in which (U / t L ) is 1.5 to 3, particularly 2 to 3, the chipping resistance at the cutting edge ridge portion 4 is increased.

また、略V字状の下層欠如部10の深さ(図3のdとdの平均値d)が0.5〜3μm、特に1.5〜2.5μmである場合に、特に切刃稜線部4における耐欠損性が高くなる。なお、下層欠如部10の開口部の幅wが2〜5μmであることが、切刃稜線部における耐欠損性および耐摩耗性のバランスを保つ点で望ましい。 Further, when the depth of the substantially V-shaped lower layer lacking portion 10 (average value d of d 1 and d 2 in FIG. 3) is 0.5 to 3 μm, particularly 1.5 to 2.5 μm, it is particularly cut off. The chipping resistance in the edge line part 4 becomes high. In addition, it is desirable that the width w of the opening of the lower layer lacking portion 10 is 2 to 5 μm from the standpoint of maintaining a balance between chipping resistance and wear resistance in the cutting edge ridge line portion.

さらに、下層欠如部10における上層9Uの厚みtとすくい面2aの中央部における厚みtとの比率(t/t)が1.2〜1.5であることが、切刃稜線部4における耐欠損性が高いとともに、耐摩耗性も向上する点で望ましい。 Further, the cutting edge ridgeline indicates that the ratio (t E / t U ) between the thickness t E of the upper layer 9U in the lower layer lacking portion 10 and the thickness t U in the central portion of the rake face 2a is 1.2 to 1.5. This is desirable in that the fracture resistance in the portion 4 is high and the wear resistance is improved.

なお、被覆層9は、周期表4、5、6族金属、AlおよびSiの群から選ばれる少なくとも1種の炭化物、窒化物、炭窒化物、ダイヤモンド、ダイヤモンドライクカーボン(DLC)、窒化硼素(cBN)の少なくとも1層からなる。上記構成においては、下層9Lおよび上層9Uが同じ材種からなるものであってもよく、または下層がTiCN層からなり、上層9Uが(Ti,Al)N層からなるように、異なる材種からなる構成であってもよい。   The covering layer 9 is composed of at least one carbide, nitride, carbonitride, diamond, diamond-like carbon (DLC), boron nitride (selected from the group of Periodic Tables 4, 5, and 6 metals, Al and Si. cBN). In the above configuration, the lower layer 9L and the upper layer 9U may be made of the same material type, or different material types so that the lower layer is made of a TiCN layer and the upper layer 9U is made of a (Ti, Al) N layer. The structure which becomes may be sufficient.

ここで、本発明によれば、上記のような下層欠如部10を形成するには、切刃稜線部4がシャープエッジ、すなわち切刃6断面の曲率半径Rが10μm以下の状態にした基体に対して、被覆層9をアークイオンプレーティング法やスパッタ法等のバイアス電圧を印加して成膜する方法によって被覆層を成膜する。このとき、下層を成膜するときは、バイアス電圧を定常成膜条件の1.5倍以上に高めて成膜し、その後、上層を成膜する際のバイアス電圧は下層を成膜するときのバイアス電圧に比べて低くして定常成膜条件に戻す方法で作製することができる。 Here, according to the present invention, in forming the lower lack portion 10 as described above, cutting ridge 4 is sharp edge, i.e. the radius of curvature R r of the cutting edge 6 cross section is in the following state 10μm substrate On the other hand, the coating layer 9 is formed by a method of forming the coating layer 9 by applying a bias voltage such as an arc ion plating method or a sputtering method. At this time, when forming the lower layer, the bias voltage is increased to 1.5 times or more of the steady film formation conditions, and then the bias voltage when forming the upper layer is the same as that when forming the lower layer. It can be manufactured by a method in which the bias voltage is lowered and the steady film formation conditions are restored.

さらに、切刃6はことが、下層欠如部10を確実に形成できるとともに、切刃6の切れ味の向上の点で望ましい。なお、切刃6断面の曲率半径Rは5μm以下、さらに3μm以下であることが望ましい。 Further, the cutting edge 6 is desirable in terms of improving the sharpness of the cutting edge 6 while being able to reliably form the lower layer lacking portion 10. The curvature radius R r of the cross section of the cutting edge 6 is preferably 5 μm or less, and more preferably 3 μm or less.

また、本発明においては、図2に示すように、チップ1の切刃6からすくい面2a側に凹状または凸状のブレーカ部12を形成してもよく、これによって切り屑の排出性が向上して切れ味を高めることができ、かつびびり発生の抑制および加工面粗度の向上を図ることができるとともに、特に凹状のブレーカ部12は切刃6をよりシャープにして下層欠如部10を確実に形成することができる。   Moreover, in this invention, as shown in FIG. 2, you may form the concave-shaped or convex-shaped breaker part 12 in the rake face 2a side from the cutting blade 6 of the chip | tip 1, and, thereby, the chip | tip discharge property improves. As a result, the sharpness can be increased, chattering can be suppressed, and the roughness of the machined surface can be improved. In particular, the concave breaker portion 12 makes the cutting edge 6 sharper and the lower layer lacking portion 10 is reliably secured. Can be formed.

さらに、本発明によれば、すくい面2aおよび逃げ面4の算術平均粗さ(Ra)が1μm以下、特に0.5μm以下であることが加工面粗度の向上および切れ味の向上の点で望ましい。   Furthermore, according to the present invention, the arithmetic average roughness (Ra) of the rake face 2a and the flank face 4 is preferably 1 μm or less, particularly 0.5 μm or less from the viewpoint of improving the roughness of the machined surface and improving the sharpness. .

材種A:表1に示す平均粒径のWC粉末に対して、平均粒径1.5μmのCr粉末を0.6質量%、平均粒径1.2μmのVC粉末を0.3質量%、平均粒径0.5μmのCo粉末を表1に示す割合で添加、
材種B:表1に示す平均粒径のTiCN粉末に対して、平均粒径2μmのTiN粉末を15質量%、平均粒径2μmのTaC粉末を3質量%、平均粒径2μmのNbC粉末を2質量%、平均粒径1μmのCo粉末およびNi粉末を合計で表1に示す割合で添加、
混合して、TMMGチップ形状に成形、焼成した後、すくい面および逃げ面の算術平均粗さ(Ra)が0.5μm以下となるように研磨加工を行った。なお、切刃は断面で見た曲率半径が表1に示す値となるように加工した。なお、ノーズ部の先端角度θは60°、切刃のポジ角αは11°とした。
Grade A: 0.6% by mass of Cr 3 C 2 powder having an average particle size of 1.5 μm and 0.3% of VC powder having an average particle size of 1.2 μm with respect to the WC powder having an average particle size shown in Table 1. % By weight, Co powder having an average particle size of 0.5 μm was added in the ratio shown in Table 1,
Grade B: 15% by mass of TiN powder with an average particle size of 2 μm, 3% by mass of TaC powder with an average particle size of 2 μm, and NbC powder with an average particle size of 2 μm with respect to the TiCN powder with the average particle size shown in Table 1. 2% by mass, Co powder having an average particle diameter of 1 μm and Ni powder were added in the proportions shown in Table 1,
After mixing, forming into a TMMG chip shape and firing, polishing was performed so that the arithmetic average roughness (Ra) of the rake face and flank face was 0.5 μm or less. The cutting edge was machined so that the radius of curvature seen in the cross section was the value shown in Table 1. The tip angle θ of the nose portion was 60 °, and the positive angle α of the cutting edge was 11 °.

そして、上記母材に対して、アルカリ洗浄を行い、1×10−2Paで真空排気を行った後、炉内を550℃に加熱してアークイオンプレーティング法にて下層および上層とも(Ti,Al)Nからなる被覆層を表1に示す条件にて成膜してスローアウェイチップを作製した。なお、表中、試料No.5については、下層を成膜した後で一旦取り出して切刃部にホーニング加工を施し、その後、再び成膜装置内に戻して上層を成膜した。 The base material is washed with alkali and evacuated at 1 × 10 −2 Pa. Then, the inside of the furnace is heated to 550 ° C. and both the lower layer and the upper layer are formed by the arc ion plating method (Ti , Al) N was formed under the conditions shown in Table 1 to produce a throw-away tip. In the table, sample No. Regarding No. 5, after forming the lower layer, it was once taken out and subjected to honing processing on the cutting edge, and then returned to the film forming apparatus again to form the upper layer.

得られたチップについて、切刃の断面形状を確認するためにノーズ先端を含む断面をFIB加工(収束イオンビーム加工)によってカットし、その断面を走査型電子顕微鏡により観察することによって切刃の断面形状および被覆層の下層欠如部との境界における膜厚すくい面側t、逃げ面側tを測定し、その平均値を算出した。なお、下層欠如部を持たない試料については切刃における膜厚を括弧書きで表記した。また、チップの上斜め方向から角度を変えながら下層欠如部を顕微鏡観察して下層欠如部の最大幅を測定した。 In order to confirm the cross-sectional shape of the cutting edge of the obtained chip, the cross-section including the nose tip is cut by FIB processing (focused ion beam processing), and the cross-section of the cutting edge is observed by observing the cross-section with a scanning electron microscope. the shape and thickness of the rake face t p at the boundary between the lower lack portion of the coating layer, the flank face-side t s were measured, and the average value was calculated. In addition, about the sample which does not have a lower layer lacking part, the film thickness in a cutting blade was described with the parenthesis writing. Further, the lower layer lacking portion was observed with a microscope while changing the angle from the upper oblique direction of the chip, and the maximum width of the lower layer lacking portion was measured.

また、上記条件にて作製したチップに対して、下記条件で切削加工を行い、300個の定数加工を行った時点でのチッピングおよび欠損の状態を確認して耐欠損性として表記するとともに、被削材の算術平均表面粗さ(Ra)が0.10μmを超えた時点を寿命としてワークの加工数を測定した。
切削条件
被削材 SUS430F
加工形態 Φ8mm 外径端面仕上げ切削
切削速度 V=150m/min
切り込み 0.03mm
送り 0.03mm/rev
切削状態 湿式
結果は表1に示した。
In addition, the chip manufactured under the above conditions is subjected to cutting under the following conditions, and the chipping and chipping states at the time of performing 300 constant machinings are confirmed and indicated as chipping resistance. The number of workpieces processed was measured with the time when the arithmetic average surface roughness (Ra) of the cutting material exceeded 0.10 μm as the lifetime.
Cutting condition work material SUS430F
Machining form φ8mm Outer diameter end face finishing cutting cutting speed V = 150m / min
Notch 0.03mm
Feed 0.03mm / rev
Cutting state The wet results are shown in Table 1.

Figure 2011005583
Figure 2011005583

表1の結果から明らかなように、下層欠如部がない試料No.5では、切刃にチッピングや欠損が発生して耐欠損性が低いものであった。下層欠如部がなくて上層欠如部が存在する試料No.6でも、耐欠損性が悪くてチッピングした。さらに、下層も上層も欠如した試料No.7では、摩耗の進行が早くて加工数が少なかった。   As is apparent from the results in Table 1, the sample No. having no lower layer lacking portion was obtained. In No. 5, chipping and chipping occurred on the cutting edge, and the chipping resistance was low. Sample No. with no lower layer lacking part and upper layer lacking part present. 6 also chipped due to poor chipping resistance. Furthermore, sample No. which lacked both the lower layer and the upper layer. In No. 7, the progress of wear was fast and the number of processing was small.

これに対して、切刃に下層欠如部が存在するとともにその表面を上層が被覆する形態の試料No.1〜4については、いずれも耐欠損性が高く、長寿命なチップとなった。   In contrast, Sample No. in which the cutting blade has a lower layer lacking portion and the upper layer covers the surface thereof. About 1-4, all became a chip | tip with a high chipping resistance and a long lifetime.

1 スローアウェイチップ
2 主面
2a すくい面
2b 着座面
3 逃げ面
4 切刃稜線部
5 ノーズ部
6 切刃
7 ネジ穴
8 基体
9 被覆層
10 下層欠如部
11 凸状の折れ曲がり部
12 ブレーカ部
:すくい面の中央部における下層の厚み
:すくい面の中央部における上層の厚み
:切刃稜線部における上層の厚み
:略V字状の下層欠如部のすくい面側の深さ
:略V字状の下層欠如部の逃げ面側の深さ
DESCRIPTION OF SYMBOLS 1 Throw away tip 2 Main surface 2a Rake surface 2b Seating surface 3 Relief surface 4 Cutting edge ridge part 5 Nose part 6 Cutting edge 7 Screw hole 8 Base body 9 Covering layer 10 Lower layer lacking part 11 Convex bending part 12 Breaker part t L : Thickness of the lower layer at the center of the rake face t U : Thickness of the upper layer at the center of the rake face t E : Thickness of the upper layer at the edge of the cutting edge d 1 : Depth on the rake face side of the substantially V-shaped lower layer missing part D 2 : Depth on the flank side of the substantially V-shaped lower layer lacking portion

Claims (4)

基体の表面に下層と上層とを含む複数の被覆層を被覆した切削工具であって、切刃稜線部に直交する断面にて観察した際に、前記下層は切刃稜線部において略V字状の下層欠如部が存在しているとともに、少なくとも前記下層の前記下層欠如部の表面を前記上層が被覆している切削工具。   A cutting tool in which a surface of a substrate is coated with a plurality of coating layers including a lower layer and an upper layer, and the lower layer is substantially V-shaped at the cutting edge ridge when observed in a cross section perpendicular to the cutting edge ridge. A cutting tool in which the lower layer lacking portion is present, and the upper layer covers at least the surface of the lower layer lacking portion of the lower layer. すくい面の中央部において、前記下層の厚みtが1〜3μm、前記上層の厚みtが2〜5μmであり、前記厚みtと前記厚みtとの比率(t/t)が1.5〜3である請求項1記載の切削工具。 In the central portion of the rake face, the thickness t L of the lower layer is 1 to 3 μm, the thickness t U of the upper layer is 2 to 5 μm, and the ratio of the thickness t L to the thickness t U (t U / t L ) The cutting tool according to claim 1, wherein is 1.5-3. 前記略V字状の下層欠如部の深さが0.5〜3μmである請求項1または2記載の切削工具。   The cutting tool according to claim 1 or 2, wherein a depth of the substantially V-shaped lower layer lacking portion is 0.5 to 3 µm. 前記下層欠如部における前記上層の厚みtと前記厚みtとの比率(t/t)が1.2〜1.5である請求項3記載の切削工具。 The cutting tool according to claim 3, wherein a ratio (t E / t U ) between the thickness t E of the upper layer and the thickness t U in the lower layer lacking portion is 1.2 to 1.5.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3520939A4 (en) * 2016-09-29 2020-05-27 Sumitomo Electric Hardmetal Corp. Cutting tool

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174309A (en) * 1994-12-21 1996-07-09 Showa Denko Kk Hard-film coated cutting tool and its manufacture
JP2005103658A (en) * 2003-09-26 2005-04-21 Kyocera Corp Throwaway tip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174309A (en) * 1994-12-21 1996-07-09 Showa Denko Kk Hard-film coated cutting tool and its manufacture
JP2005103658A (en) * 2003-09-26 2005-04-21 Kyocera Corp Throwaway tip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3520939A4 (en) * 2016-09-29 2020-05-27 Sumitomo Electric Hardmetal Corp. Cutting tool
US11376668B2 (en) 2016-09-29 2022-07-05 Sumitomo Electric Hardmetal Corp. Cutting tool

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