JP2011002390A - Temperature sensor for wafer chuck - Google Patents

Temperature sensor for wafer chuck Download PDF

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Publication number
JP2011002390A
JP2011002390A JP2009147061A JP2009147061A JP2011002390A JP 2011002390 A JP2011002390 A JP 2011002390A JP 2009147061 A JP2009147061 A JP 2009147061A JP 2009147061 A JP2009147061 A JP 2009147061A JP 2011002390 A JP2011002390 A JP 2011002390A
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Prior art keywords
temperature sensor
wafer chuck
fixing block
wafer
temperature
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JP5197505B2 (en
JP2011002390A5 (en
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Eiichi Shinohara
榮一 篠原
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to KR1020100053856A priority patent/KR101267670B1/en
Priority to TW99119932A priority patent/TWI471538B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a temperature sensor for wafer chuck having a withstand voltage characteristic of about 10 kV and readily enabling attachment/removal operation to/from a wafer chuck to be carried out.SOLUTION: The temperature sensor for wafer chuck 10 is attached, such that a fixing block 13 which has a first through-hole 13A corresponding to the insertion hole 21B of a chuck top 21 of the wafer chuck 20, is connected to the side face of the chuck top 21 through a first screw member 15, and the temperature sensor 10 is screwed to the fixing block 13 through an attaching member 14, which is disposed at the base section of a temperature sensing element 11 to be inserted into the insertion hole 21B of the chuck top 21 from the first through-hole 13A.

Description

本発明は、ウエハチャックで保持されたウエハの温度を測定する温度センサに関し、更に詳しくは、ウエハチャックに対する着脱性、及び耐電圧性に優れたウエハチャック用の温度センサに関する。   The present invention relates to a temperature sensor that measures the temperature of a wafer held by a wafer chuck, and more particularly to a temperature sensor for a wafer chuck that is excellent in detachability and voltage resistance with respect to the wafer chuck.

例えば検査装置に用いられるウエハチャックは、ウエハに形成された複数のデバイスを真空吸着するなどして保持し、複数のデバイスそれぞれの電気的特性検査を行う際に用いられる。ウエハの検査はウエハを低温領域から高温領域まで種々の温度に設定して行われるため、ウエハチャックには温度センサが装着され、この温度センサによってウエハチャック上のウエハの温度を正確に測定するようにしている。そこで、従来の温度センサを備えた検査装置について図３及び図４を参照しながら説明する。   For example, a wafer chuck used in an inspection apparatus is used when a plurality of devices formed on a wafer are held by vacuum suction or the like, and electrical characteristics inspection of each of the plurality of devices is performed. Since the wafer inspection is performed by setting the wafer at various temperatures from a low temperature region to a high temperature region, a temperature sensor is attached to the wafer chuck, and the temperature sensor accurately measures the temperature of the wafer on the wafer chuck. I have to. Therefore, an inspection apparatus equipped with a conventional temperature sensor will be described with reference to FIGS.

従来の検査装置は、例えば図３に示すように、互いに隣接するローダ室１及びプローバ室２を備えている。ローダ室１は、複数枚のウエハＷをカセット単位で収納するカセット収納部と、カセットからウエハＷを一枚ずつ搬出入するウエハ搬送機構と、ウエハ搬送機構によってウエハＷを搬送する間にウエハＷをプリアライメントするプリアライメント機構と、を備えている。プローバ室２は、図３に示すように、ウエハＷを保持しＸ、Ｙ、Ｚ及びθ方向で移動可能に構成されたウエハチャック３と、このウエハチャック３上のウエハＷに形成された複数の電極パッドに接触する複数のプローブ４Ａを有するプローブカード４と、このプローブカード４をカードホルダ（図示せず）によって固定する固定機構５と、プローブカード４とテストヘッドＴとを電気的に接続する接続リング６と、を備え、制御装置の制御下でウエハＷに形成された各デバイスの電気的特性検査を行なうように構成されている。尚、図３において、７はウエハチャック３と協働してウエハＷとプローブカード４との位置合わせを行うアライメント機構で、７Ａは上カメラ、７Ｂは下カメラであり、８はプローブカード３の固定機構５が装着されたヘッドプレートである。   A conventional inspection apparatus includes a loader chamber 1 and a prober chamber 2 adjacent to each other as shown in FIG. The loader chamber 1 includes a cassette storage unit that stores a plurality of wafers W in units of cassettes, a wafer transfer mechanism that loads and unloads wafers W from the cassette one by one, and a wafer W that is being transferred by the wafer transfer mechanism. And a pre-alignment mechanism for pre-aligning. As shown in FIG. 3, the prober chamber 2 has a wafer chuck 3 configured to hold the wafer W and move in the X, Y, Z, and θ directions, and a plurality of wafer chucks 3 formed on the wafer chuck 3. The probe card 4 having a plurality of probes 4A that come into contact with the electrode pads, a fixing mechanism 5 that fixes the probe card 4 with a card holder (not shown), and the probe card 4 and the test head T are electrically connected. And a connection ring 6 configured to inspect electrical characteristics of each device formed on the wafer W under the control of the control device. In FIG. 3, 7 is an alignment mechanism for aligning the wafer W and the probe card 4 in cooperation with the wafer chuck 3, 7A is the upper camera, 7B is the lower camera, and 8 is the probe card 3. It is a head plate to which the fixing mechanism 5 is attached.

ウエハチャック３は、温度調節機構を内蔵し、ウエハＷを所定の検査温度に設定し、高温検査や低温検査に供される。例えば高温検査を行う場合にはウエハＷを例えば２００℃に設定する。ウエハＷを２００℃に設定するには、図４に示すようにウエハチャック３に装着された温度センサ９によってウエハチャック３の温度を検出して、検出温度に基づいてウエハＷを２００℃に設定、制御している。   The wafer chuck 3 incorporates a temperature adjustment mechanism, sets the wafer W to a predetermined inspection temperature, and is used for high temperature inspection and low temperature inspection. For example, when performing a high temperature inspection, the wafer W is set to 200 ° C., for example. In order to set the wafer W to 200 ° C., the temperature of the wafer chuck 3 is detected by the temperature sensor 9 mounted on the wafer chuck 3 as shown in FIG. 4, and the wafer W is set to 200 ° C. based on the detected temperature. Have control.

ここでウエハチャック３と温度センサ９について説明する。ウエハチャック３の側面には図４に示すように温度センサ９の測温体９Ａが挿入される挿入孔３Ａが形成され、この挿入孔３Ａの開口部には雌ネジが形成されている。一方、温度センサ９の測温体９Ａの基端にはアルミナセラミックスからなる接続部９Ｂが一体化され、この接続部９Ｂにおいてケーブル９Ｃが接続されている。この接続部９Ｂの測温体９Ａ側には雄ネジが形成され、接続部９Ｂの雄ネジとウエハチャック３の挿入孔３Ａの雌ネジが螺合することによって、温度センサ９がウエハチャック３に取り付けられる。   Here, the wafer chuck 3 and the temperature sensor 9 will be described. As shown in FIG. 4, the side surface of the wafer chuck 3 is formed with an insertion hole 3A into which the temperature sensor 9A of the temperature sensor 9 is inserted, and a female screw is formed at the opening of the insertion hole 3A. On the other hand, a connecting portion 9B made of alumina ceramics is integrated with the base end of the temperature sensor 9A of the temperature sensor 9, and a cable 9C is connected to the connecting portion 9B. A male screw is formed on the temperature measuring body 9A side of the connecting portion 9B, and the temperature sensor 9 is attached to the wafer chuck 3 by the male screw of the connecting portion 9B and the female screw of the insertion hole 3A of the wafer chuck 3 being screwed together. It is attached.

ところで、ウエハＷに形成されたパワーデバイスの電気的特性検査を高温下で行う場合には、ウエハチャック３上のウエハＷを２００℃に加熱し、ウエハチャック３のウエハ載置面に高電圧を印加して高温検査を行っている。   By the way, when the electrical characteristic inspection of the power device formed on the wafer W is performed at a high temperature, the wafer W on the wafer chuck 3 is heated to 200 ° C., and a high voltage is applied to the wafer mounting surface of the wafer chuck 3. Applied high temperature inspection.

しかしながら、従来の温度センサ９の場合には、温度センサ９をウエハチャック３に装着する際、ウエハチャック３の挿入孔３Ａに測温体９Ａを挿入し、接続部９Ｂを回転操作し、接続部９Ｂの雄ネジと挿入孔の雌ネジを螺合させなければ温度センサ９をウエハチャック３に装着、固定することができないため、温度センサ９をウエハチャック３に着脱する度に接続部９Ｂからケーブル９Ｃを一旦取り外さなければ着脱することができず、温度センサ９の着脱操作が煩雑であった。また、従来の温度センサ９の接続部９Ｂは、５ｋＶ程度の高電圧にしか耐えることができないため、最近のパワーデバイスのように、例えば１０ｋＶ程度の高電圧検査を要求される場合には、従来の温度センサ９の接続部９Ｂではこのような高電圧の要求に応えることができず、火花放電することがあった。   However, in the case of the conventional temperature sensor 9, when the temperature sensor 9 is mounted on the wafer chuck 3, the temperature measuring body 9A is inserted into the insertion hole 3A of the wafer chuck 3, the connection portion 9B is rotated, and the connection portion Since the temperature sensor 9 cannot be attached to and fixed to the wafer chuck 3 unless the male screw 9B and the female screw of the insertion hole are screwed together, the cable from the connection portion 9B is required each time the temperature sensor 9 is attached to or detached from the wafer chuck 3. If 9C was not once removed, it could not be attached and detached, and the temperature sensor 9 was complicated to attach and detach. In addition, since the connection portion 9B of the conventional temperature sensor 9 can only withstand a high voltage of about 5 kV, when a high voltage inspection of about 10 kV is required as in recent power devices, for example, The connection portion 9B of the temperature sensor 9 cannot meet such a high voltage requirement, and spark discharge may occur.

本発明は、上記課題を解決するためになされたもので、例えば１０ｋＶ程度の耐電圧特性を有すると共に、ウエハチャックに対する着脱操作を簡単に行うことができるウエハチャック用の温度センサを提供することを目的としている。   The present invention has been made to solve the above problems, and provides a temperature sensor for a wafer chuck that has a withstand voltage characteristic of, for example, about 10 kV and can be easily attached to and detached from the wafer chuck. It is aimed.

本発明の請求項１に記載のウエハチャック用の温度センサは、ウエハチャックの側面に形成された挿入孔内に挿入された測温体によってウエハチャックに保持されたウエハの処理温度を測定する温度センサであって、上記ウエハチャックの挿入孔に対応する貫通孔を有する固定用ブロックを上記ウエハチャックの側面に連結部材を介して連結し、且つ、上記貫通孔から上記挿入孔に挿入される測温体の基部に設けられた取付部材を介して上記温度センサを上記固定用ブロックに取り付けることを特徴とするものである。   A temperature sensor for a wafer chuck according to claim 1 of the present invention is a temperature sensor for measuring a processing temperature of a wafer held on the wafer chuck by a temperature measuring element inserted into an insertion hole formed on a side surface of the wafer chuck. A sensor, a fixing block having a through-hole corresponding to the insertion hole of the wafer chuck is connected to the side surface of the wafer chuck via a connecting member, and is inserted into the insertion hole from the through-hole. The temperature sensor is attached to the fixing block through an attachment member provided at the base of the warm body.

また、本発明の請求項２に記載のウエハチャック用の温度センサは、ウエハチャックに保持されたウエハの処理温度を測定するために、上記ウエハチャックの側面に形成された挿入孔に測温体が挿入され、固定用ブロックを介して上記ウエハチャックに取り付けられる温度センサであって、上記固定用ブロックは、上記測温体が貫通し且つ上記測温体の基部で一体化した取付部材が装着される貫通孔と、上記固定用ブロックを上記ウエハチャックに連結するための連結部材と、を備え、上記取付部材を介して上記温度センサを上記固定用ブロックに取り付けることを特徴とするものである。   According to a second aspect of the present invention, there is provided a temperature sensor for a wafer chuck, wherein a temperature measuring body is inserted into an insertion hole formed on a side surface of the wafer chuck in order to measure a processing temperature of the wafer held by the wafer chuck. Is a temperature sensor that is attached to the wafer chuck via a fixing block, and the fixing block is mounted with an attachment member that penetrates the temperature measuring body and is integrated at the base of the temperature measuring body. And a connecting member for connecting the fixing block to the wafer chuck, and the temperature sensor is attached to the fixing block via the attachment member. .

また、本発明の請求項３に記載のウエハチャック用の温度センサは、請求項１または請求項２に記載の発明において、上記測温体は、保護管内に収納された白金抵抗素子を主体に構成されていることを特徴とするものである。   The temperature sensor for a wafer chuck according to claim 3 of the present invention is the temperature sensor according to claim 1 or 2, wherein the temperature measuring element is mainly a platinum resistance element housed in a protective tube. It is characterized by being comprised.

また、本発明の請求項４に記載のウエハチャック用の温度センサは、請求項１〜請求項３のいずれか１項に記載の発明において、上記固定用ブロックは高絶縁性材料によって形成されていることを特徴とするものである。   A temperature sensor for a wafer chuck according to a fourth aspect of the present invention is the temperature sensor according to any one of the first to third aspects, wherein the fixing block is made of a highly insulating material. It is characterized by being.

また、本発明の請求項５に記載のウエハチャック用の温度センサは、請求項４に記載の発明において、上記高絶縁性材料は高純度のアルミナセラミックスによって形成されていることを特徴とするものである。   The temperature sensor for a wafer chuck according to claim 5 of the present invention is the temperature sensor for wafer chuck according to claim 4, wherein the highly insulating material is formed of high-purity alumina ceramics. It is.

本発明によれば、例えば１０ｋＶ程度の耐電圧特性を有すると共に、ウエハチャックに対する着脱操作を簡単に行うことができるウエハチャック用の温度センサを提供することができる。   According to the present invention, it is possible to provide a temperature sensor for a wafer chuck that has a withstand voltage characteristic of, for example, about 10 kV and can be easily attached to and detached from the wafer chuck.

（ａ）、（ｂ）が本発明の温度センサの一実施形態が適用されたウエハチャックを示す図で、（ａ）はその斜視図、（ｂ）はその要部の側面図である。(A), (b) is a figure which shows the wafer chuck to which one Embodiment of the temperature sensor of this invention was applied, (a) is the perspective view, (b) is the side view of the principal part. （ａ）、（ｂ）はそれぞれ図１に示すウエハチャックの要部を示す図で、（ａ）はその一部を破断して示す平面図、（ｂ）はその一部を示す断面図である。(A), (b) is a figure which shows the principal part of the wafer chuck shown in FIG. 1, respectively, (a) is a top view which fractures | ruptures that part, (b) is sectional drawing which shows the part is there. 従来の検査装置のプローバ室の一部を破断して示す正面図である。It is a front view which fractures | ruptures and shows a part of prober chamber of the conventional inspection apparatus. 図３に示す検査装置に用いられたウエハチャックの一部を破断して示す平面図である。It is a top view which fractures | ruptures and shows a part of wafer chuck used for the inspection apparatus shown in FIG.

以下、図１及び図２に示す実施形態に基づいて本発明のウエハチャック用の温度センサについて説明する。   Hereinafter, a temperature sensor for a wafer chuck according to the present invention will be described based on the embodiment shown in FIGS.

本実施形態のウエハチャック用の温度センサ（以下、単に「温度センサ」と称す。）１０は、例えば図１の（ａ）、（ｂ）に示すように、ウエハチャック２０の側面に装着されている。このウエハチャック２０は、チャックトップ２１、冷却ジャケット２２及び加熱用プレート２３を備え、これらは積層されて一体化し、例えばウエハに形成された複数のパワーデバイスをチャックトップ２１上に載置し、所定の高温検査に資するように構成されている。そして、本実施形態の温度センサ１０は、例えば２０ｋＶの高電圧を印加できる構造になっている。尚、チャックトップ２１の上面には従来公知の同心円状の溝２１Ａがウエハの吸着用溝として形成されている。尚、図１の（ａ）、（ｂ）では温度センサ１０の一部の部材（後述の固定用ブロック）のみが図示されている。   The wafer chuck temperature sensor (hereinafter simply referred to as “temperature sensor”) 10 according to the present embodiment is mounted on the side surface of the wafer chuck 20 as shown in FIGS. 1A and 1B, for example. Yes. The wafer chuck 20 includes a chuck top 21, a cooling jacket 22, and a heating plate 23, which are stacked and integrated. For example, a plurality of power devices formed on a wafer are placed on the chuck top 21, and predetermined It is configured to contribute to high temperature inspection. And the temperature sensor 10 of this embodiment has a structure which can apply the high voltage of 20 kV, for example. A conventionally known concentric groove 21A is formed on the upper surface of the chuck top 21 as a wafer adsorption groove. 1A and 1B, only a part of the temperature sensor 10 (fixing block described later) is shown.

また、チャックトップ２１には例えば２０ｋＶの高電圧を印加してウエハの高温検査を行うため、チャックトップ２１に装着される温度センサ１０はこの高電圧に耐える構造を備えている。そこで、本実施形態の温度センサ１０とチャックトップ２０について以下説明する。   In addition, since a high voltage of, for example, 20 kV is applied to the chuck top 21 to perform high temperature inspection of the wafer, the temperature sensor 10 mounted on the chuck top 21 has a structure that can withstand this high voltage. Therefore, the temperature sensor 10 and the chuck top 20 of this embodiment will be described below.

本実施形態の温度センサ１０は、図２の（ａ）、（ｂ）に示すように、チャックトップ２１の温度を測定する棒状の測温体１１と、測温体１１に接続されたケーブル１２と、チャックトップ２１の側面に連結、固定された矩形状の固定用ブロック１３と、固定用ブロック１３に温度センサ１０を取り付けるための取付部材１４と、を備え、棒状の測温体１１がチャックトップ２１の側面から中央部に向かって径方向に延びる挿入孔２１Ｂに挿入されている。測温体１１は、先端が閉じた保護管内にケーブル１２に接続された白金抵抗素子（図示せず）が収納され、白金抵抗素子を介してチャックトップ２１の温度、延いてはウエハの温度を測定するようにしている。本実施形態の温度センサ１０は、固定用ブロック１３を介してチャックトップ２１に着脱できる点に特徴があり、測温体１１及びケーブル１２は従来公知と同一のものを使用することができる。   As shown in FIGS. 2A and 2B, the temperature sensor 10 of this embodiment includes a rod-shaped temperature measuring body 11 that measures the temperature of the chuck top 21 and a cable 12 connected to the temperature measuring body 11. A rectangular fixing block 13 connected to and fixed to the side surface of the chuck top 21 and an attachment member 14 for attaching the temperature sensor 10 to the fixing block 13. It is inserted into an insertion hole 21 </ b> B that extends in the radial direction from the side surface of the top 21 toward the center. The temperature measuring element 11 has a platinum resistance element (not shown) connected to the cable 12 housed in a protective tube having a closed tip, and the temperature of the chuck top 21 and thus the temperature of the wafer are measured via the platinum resistance element. I am trying to measure. The temperature sensor 10 of the present embodiment is characterized in that it can be attached to and detached from the chuck top 21 via the fixing block 13, and the temperature measuring body 11 and the cable 12 can be the same as those conventionally known.

チャックトップ２１の側面に取り付けられる固定用ブロック１３は、図２の（ａ）、（ｂ）に示すように、チャックトップ２１と略同一の厚さを呈するように高絶縁性材料によって形成されている。高絶縁性材料としては、例えば高純度のアルミナセラミックス（純度：９９．７％）が好ましいが、２０ｋＶの高電圧に耐え得る絶縁材料であればアルミナセラミックスに制限されるものではない。   As shown in FIGS. 2A and 2B, the fixing block 13 attached to the side surface of the chuck top 21 is formed of a highly insulating material so as to have substantially the same thickness as the chuck top 21. Yes. As the highly insulating material, for example, high-purity alumina ceramics (purity: 99.7%) are preferable. However, any insulating material that can withstand a high voltage of 20 kV is not limited to alumina ceramics.

而して、固定用ブロック１３は、図２の（ａ）、（ｂ）に示すように、チャックトップ２１の挿入孔２１Ｂに対応させて形成された第１の貫通孔１３Ａと、固定用ブロック１３をチャックトップ２１の側面に連結するための連結部材（第１のネジ部材）１５を装着するように形成された第２の貫通孔１３Ｂと、温度センサ１０を固定用ブロック１３に固定するための第２のネジ部材１６の雄ネジと螺合する雌ネジ１３Ｃと、を有している。第１の貫通孔１３Ａが第２の貫通孔１３Ｂと雌ネジ１３Ｃの間に配置されている。第１の貫通孔１３Ａには温度センサ１０を固定用ブロック１３に固定するための取付部材１４が装着される。   Thus, as shown in FIGS. 2A and 2B, the fixing block 13 includes a first through hole 13A formed corresponding to the insertion hole 21B of the chuck top 21, and a fixing block. In order to fix the temperature sensor 10 to the fixing block 13 and the second through hole 13B formed so as to attach a connecting member (first screw member) 15 for connecting the side 13 of the chuck top 21 to the side surface of the chuck top 21. And a female screw 13 </ b> C that engages with the male screw of the second screw member 16. The first through hole 13A is disposed between the second through hole 13B and the female screw 13C. An attachment member 14 for fixing the temperature sensor 10 to the fixing block 13 is attached to the first through hole 13A.

第１の貫通孔１３Ａは、図２の（ａ）、（ｂ）に示すように、測温体１１が貫通する小径孔１３Ａ１と、小径孔１３Ａ１から拡径し、測温体１１を固定用ブロック１３に固定するための取付部材１４が装着される大径孔１３Ａ２と、からなり、小径孔１３Ａ１と大径孔１３Ａ２の境界に取付部材１４が係止される段部が形成されている。取付部材１４は、第１の貫通孔１３Ａの大径孔１３Ａ２に収納される小径部１４Ａと、小径部１４Ａから拡径し、固定用ブロック１３の側面に接する大径部１４Ｂと、小径部１４Ａと大径部１４Ｂの境界において固定用ブロック１３の雌ネジ１３Ｃ側に延設された固定部１４Ｃと、からなり、大径部１４Ｂで固定用ブロック１３の側面に係止され、固定部１４Ｃの孔を介して第２のネジ部材１６を雌ネジ１３Ｃと螺合させて、温度センサ１０を固定用ブロック１３に固定するようにしてある。 The first through-hole 13A, as shown in FIGS. 2 (a), (b) , the small-diameter hole 13A 1 to temperature sensing element 11 passes, and enlarged from the small-diameter hole 13A 1, the temperature sensing element 11 a large diameter hole 13A 2 which mounting member 14 for fixing the fixing block 13 is mounted, consists of a stepped portion of the mounting member 14 is locked to the boundary of the small-diameter hole 13A 1 and the large-diameter hole 13A 2 Is formed. Mounting member 14 includes a small diameter portion 14A which is accommodated in the large diameter hole 13A 2 of the first through-hole 13A, and expanded from the small diameter portion 14A, and a large diameter portion 14B in contact with the side surfaces of the fixing block 13, the small diameter portion 14A and a fixed portion 14C extending to the female screw 13C side of the fixing block 13 at the boundary between the large diameter portion 14B and the large diameter portion 14B being engaged with the side surface of the fixing block 13 to fix the fixing portion 14C. The temperature sensor 10 is fixed to the fixing block 13 by screwing the second screw member 16 with the female screw 13C through the hole.

また、第２の貫通孔１３Ｂは、図２の（ａ）、（ｂ）に示すように、第１のネジ部材１５の雄ネジが貫通する小径孔１３Ｂ１と、小径孔１３Ｂ１から拡径し、第２のネジ部材１５の頭部が収納される大径孔１３Ｂ２と、からなり、小径孔１３Ｂ１と大径孔１３Ｂ２の境界に第１のネジ部材１５の頭部が係止される段部が形成されている。そして、小径孔１３Ｂ１は、第１のネジ部材１５の雄ネジが螺合するようにチャックトップ２１に形成された雌ネジに対応して形成されている。第１のネジ部材１５の頭部が収められた第２の貫通孔１３Ｂの大径孔１３Ｂ２の残余の空間には耐熱、耐寒性、耐衝撃性等に優れた樹脂、例えばＲＴＶ(Room Temperature Vulcanizing Rubber)ゴムが充填されている。また、ＲＴＶゴムは、固定用ブロック１３の表面にコーティングされていると共に固定用ブロック１３とチャックトップ２１を接着している。 The second through-hole 13B, as shown in FIGS. 2 (a), (b) , the small-diameter hole 13B 1 of the male thread of the first screw member 15 passes, expanded from the small diameter hole 13B 1 and a large diameter hole 13B 2 the head of the second screw member 15 is accommodated, made, the head of the first screw member 15 is engaged with the border of the small diameter hole 13B 1 and the large-diameter hole 13B 2 A stepped portion is formed. The small-diameter hole 13B 1 is a male thread of the first screw member 15 is formed corresponding to the female thread formed in the chuck top 21 as screwed. The remaining space of the large-diameter hole 13B 2 of the second through-hole 13B in which the head of the first screw member 15 is housed heat, cold resistance, a resin having excellent impact resistance, for example, RTV (Room Temperature Vulcanizing Rubber) is filled with rubber. The RTV rubber is coated on the surface of the fixing block 13 and bonds the fixing block 13 and the chuck top 21 together.

従って、固定用ブロック１３をチャックトップ２１に装着する場合には、第１のネジ部材１５を固定用ブロック１３の第２の貫通孔１３Ｂに通し、チャックトップ２１の側面の雌ネジと螺合させ、また、固定用ブロック１３のチャックトップ２１側の側面をチャックトップ２１に接合することによって、固定用ブロック１３がチャックトップ２１の側面に連結、固定される。固定用ブロック１３がチャックトップ２１の側面に固定されると、第１のネジ部材１５の頭部が第２の貫通孔１３Ｂの大径部１３Ｂ２の底面に接し、第２の貫通孔１３Ｂに空間が残る。この空間内にＲＴＶゴム１７を充填し、固定用ブロック１３の側面を平坦面として形成されている。尚、固定用ブロック１３の表面には予めＲＴＶゴムなどがコーティングされている。 Accordingly, when the fixing block 13 is mounted on the chuck top 21, the first screw member 15 is passed through the second through hole 13 </ b> B of the fixing block 13 and screwed with the female screw on the side surface of the chuck top 21. Further, the fixing block 13 is connected and fixed to the side surface of the chuck top 21 by joining the side surface of the fixing block 13 on the chuck top 21 side to the chuck top 21. When the fixing block 13 is fixed to the side surface of the chuck top 21, the head of the first screw member 15 is in contact with the bottom surface of the large diameter portion 13B 2 of the second through-hole 13B, the second through-hole 13B Space remains. The space is filled with the RTV rubber 17 and the side surface of the fixing block 13 is formed as a flat surface. The surface of the fixing block 13 is coated with RTV rubber or the like in advance.

温度センサ１０は、測温体１１、ケーブル１２及び取付部材１４が一体化したまま回転操作することなく、固定用ブロック１３を介しててチャックトップ２１に対して簡単に着脱することができる。   The temperature sensor 10 can be easily attached to and detached from the chuck top 21 via the fixing block 13 without rotating the temperature sensor 11, the cable 12, and the attachment member 14 in an integrated manner.

そこで、本実施形態の温度センサ１０の着脱操作について説明する。上述のように、予めチャックトップ２１の側面に連結、固定された固定用ブロック１３を介して温度センサ１０をチャックトップ２１に対して着脱する。   Therefore, the attaching / detaching operation of the temperature sensor 10 of the present embodiment will be described. As described above, the temperature sensor 10 is attached to and detached from the chuck top 21 through the fixing block 13 that is connected and fixed to the side surface of the chuck top 21 in advance.

即ち、温度センサ１０をチャックトップ２１に装着する場合には、固定用ブロック１３の第１の貫通孔１３Ａからチャックトップ２１の挿入孔２１Ｂ内に温度センサ１０の測温体１１を挿入し、温度センサ１０の取付部材１４の小径部１４Ａを第１の貫通孔１３Ａの大径孔１３Ａ２に装着する。次いで、取付部材１４の固定部１４Ｃの孔から固定用ブロック１３の雌ネジ１３Ｃに対して第２のネジ部材１６を螺合させて温度センサ１０を固定用ブロック１３に固定し、チャックトップ２１への温度センサ１０の装着を終了する。 That is, when the temperature sensor 10 is mounted on the chuck top 21, the temperature sensor 11 of the temperature sensor 10 is inserted into the insertion hole 21B of the chuck top 21 from the first through hole 13A of the fixing block 13, and the temperature mounting the small-diameter portion 14A of the mounting member 14 of the sensor 10 to the large-diameter hole 13A 2 of the first through-hole 13A. Next, the second screw member 16 is screwed into the female screw 13 </ b> C of the fixing block 13 from the hole of the fixing portion 14 </ b> C of the mounting member 14 to fix the temperature sensor 10 to the fixing block 13, and to the chuck top 21. The mounting of the temperature sensor 10 is terminated.

また、温度センサ１０をチャックトップ２１から取り外す場合には、第２のネジ部材１６を固定用ブロック１３から取り外すと、温度センサ１０と固定用ブロック１３との連結が解け、そのまま取付部材１４を掴んで測温体１１をチャックトップ２１から引き抜くことで、簡単に温度センサ１０を抜き取ることができる。   Further, when removing the temperature sensor 10 from the chuck top 21, if the second screw member 16 is removed from the fixing block 13, the connection between the temperature sensor 10 and the fixing block 13 is broken and the attachment member 14 is gripped as it is. The temperature sensor 10 can be easily extracted by pulling out the temperature measuring element 11 from the chuck top 21.

ところで、本実施形態の温度センサ１０は、固定用ブロック１３が高絶縁性材料であるアルミナによって形成されているため、パワーデバイスの電気的特性検査を行う場合などのようにチャックトップ２１に１０ｋＶの高電圧を印加しても固定用ブロック１３が絶縁破壊されることなく、高電圧下でもチャックトップ２１の温度を正確に測定することができ、検査の信頼性を確保することができる。   By the way, in the temperature sensor 10 of this embodiment, since the fixing block 13 is made of alumina, which is a highly insulating material, the chuck top 21 has 10 kV as in the case of performing electrical characteristic inspection of a power device. Even if a high voltage is applied, the fixing block 13 does not break down, so that the temperature of the chuck top 21 can be accurately measured even under a high voltage, and the reliability of the inspection can be ensured.

以上説明したように本実施形態によれば、ウエハチャック２０、具体的にはチャックトップ２１の挿入孔２１Ｂに対応する第１の貫通孔１３Ａを有する固定用ブロック１３をチャックトップ２１の側面に第１のネジ部材１５を介して連結し、且つ、第１の貫通孔１３Ａからチャックトップ２１の挿入孔２１Ｂに挿入される測温体１１の基部に設けられた取付部材１４を介して温度センサ１０を固定用ブロック１３にネジ止めして取り付けるようにしたため、温度センサ１０の測温体１１を固定用ブロック１３の第１の貫通孔１３Ａからチャックトップ２１の挿入孔２１Ｂへ挿入し、取付部材１４の固定部１４Ｃを第２のネジ部材１６で固定用ブロック１３の側面に締め付けるだけで、温度センサ１０をチャックトップ２１へ簡単に装着することができる。また、第２のネジ部材１６を固定用ブロック１３から取り外すだけで温度センサ１０をチャックトップ２１から簡単に取り外すことができる。   As described above, according to the present embodiment, the fixing block 13 having the first through hole 13A corresponding to the insertion hole 21B of the wafer chuck 20, specifically, the chuck top 21, is formed on the side surface of the chuck top 21. The temperature sensor 10 is connected via a mounting member 14 that is connected via a single screw member 15 and is provided at the base of the temperature sensing element 11 that is inserted into the insertion hole 21B of the chuck top 21 from the first through hole 13A. Since the temperature measuring element 11 of the temperature sensor 10 is inserted into the insertion hole 21B of the chuck top 21 from the first through hole 13A of the fixing block 13, the mounting member 14 is fixed to the fixing block 13. The temperature sensor 10 can be easily mounted on the chuck top 21 by simply tightening the fixing portion 14C of the fixing block 14C to the side surface of the fixing block 13 with the second screw member 16. Can. Further, the temperature sensor 10 can be easily detached from the chuck top 21 simply by removing the second screw member 16 from the fixing block 13.

また、本実施形態によれば、測温体１１が保護管内に収納された白金抵抗素子を主体に構成されているため、２００℃の高温下でもチャックトップ２１上のウエハの温度を正確に測定することができる。また、固定用ブロックが高絶縁性材料、例えば純度９９．７％のアルミナセラミックスによって形成されているため、ウエハに形成されたデバイスが高電圧仕様のパワーデバイスであっても安定した温度測定を行うことができ、検査の信頼性を確保することができる。   Further, according to the present embodiment, since the temperature measuring element 11 is mainly composed of a platinum resistance element housed in a protective tube, the temperature of the wafer on the chuck top 21 is accurately measured even at a high temperature of 200 ° C. can do. In addition, since the fixing block is made of a highly insulating material, for example, alumina ceramic having a purity of 99.7%, stable temperature measurement can be performed even if the device formed on the wafer is a high-voltage power device. And the reliability of the inspection can be ensured.

尚、上記実施形態では検査装置のウエハチャックに用いられる温度センサについて説明したが、ウエハチャックを介してウエハの温度を測定する温度センサに広く適用することができる。要するに、本発明は、上記実施形態に何ら制限されるものではなく、本発明の要旨を逸脱しない限り、各構成要素を適宜設計変更することができる。   In the above embodiment, the temperature sensor used for the wafer chuck of the inspection apparatus has been described. However, the present invention can be widely applied to a temperature sensor that measures the temperature of the wafer via the wafer chuck. In short, the present invention is not limited to the above-described embodiment, and each component can be appropriately changed in design without departing from the gist of the present invention.

本発明は、ウエハチャックの温度を測定する温度センサに好適に利用することができる。   The present invention can be suitably used for a temperature sensor that measures the temperature of a wafer chuck.

１０ 温度センサ
１１ 測温体
１２ ケーブル
１３ 固定用ブロック
１３Ａ 第１の貫通孔（貫通孔）
１４ 取付部材
１５ 連結部材（第１のネジ部材）
２０ ウエハチャック
２１Ｂ 挿入孔 DESCRIPTION OF SYMBOLS 10 Temperature sensor 11 Temperature measuring body 12 Cable 13 Fixing block 13A 1st through-hole (through-hole)
14 Mounting member 15 Connecting member (first screw member)
20 Wafer chuck 21B Insertion hole

Claims (5)

ウエハチャックの側面に形成された挿入孔内に挿入された測温体によってウエハチャックに保持されたウエハの処理温度を測定する温度センサであって、上記ウエハチャックの挿入孔に対応する貫通孔を有する固定用ブロックを上記ウエハチャックの側面に連結部材を介して連結し、且つ、上記貫通孔から上記挿入孔に挿入される測温体の基部に設けられた取付部材を介して上記温度センサを上記固定用ブロックに取り付けることを特徴とするウエハチャック用の温度センサ。   A temperature sensor for measuring a processing temperature of a wafer held on a wafer chuck by a temperature measuring element inserted in an insertion hole formed on a side surface of the wafer chuck, wherein a through hole corresponding to the insertion hole of the wafer chuck is provided. The fixing block is connected to the side surface of the wafer chuck via a connecting member, and the temperature sensor is connected to the temperature sensor via an attachment member provided at the base of a temperature measuring body inserted into the insertion hole from the through hole. A temperature sensor for a wafer chuck, wherein the temperature sensor is attached to the fixing block. ウエハチャックに保持されたウエハの処理温度を測定するために、上記ウエハチャックの側面に形成された挿入孔に測温体が挿入され、固定用ブロックを介して上記ウエハチャックに取り付けられる温度センサであって、上記固定用ブロックは、上記測温体が貫通し且つ上記測温体の基部で一体化した取付部材が装着される貫通孔と、上記固定用ブロックを上記ウエハチャックに連結するための連結部材と、を備え、上記取付部材を介して上記温度センサを上記固定用ブロックに取り付けることを特徴とするウエハチャック用の温度センサ。   In order to measure the processing temperature of the wafer held by the wafer chuck, a temperature sensor is inserted into the insertion hole formed on the side surface of the wafer chuck and is attached to the wafer chuck via a fixing block. The fixing block includes a through hole through which the temperature measuring body passes and a mounting member integrated at a base of the temperature measuring body is mounted, and the fixing block for connecting the fixing block to the wafer chuck. A temperature sensor for a wafer chuck, wherein the temperature sensor is attached to the fixing block via the attachment member. 上記測温体は、保護管内に収納された白金抵抗素子を主体に構成されていることを特徴とする請求項１または請求項２に記載のウエハチャック用の温度センサ。   The temperature sensor for a wafer chuck according to claim 1 or 2, wherein the temperature measuring body is mainly composed of a platinum resistance element housed in a protective tube. 上記固定用ブロックは高絶縁性材料によって形成されていることを特徴とする請求項１〜は請求項３のいずれか１項に記載のウエハチャック用の温度センサ。   4. The temperature sensor for a wafer chuck according to claim 1, wherein the fixing block is made of a highly insulating material. 上記高絶縁性材料は高純度のアルミナセラミックスによって形成されていることを特徴とする請求項４に記載のウエハチャック用の温度センサ。
5. The temperature sensor for a wafer chuck according to claim 4, wherein the highly insulating material is made of high-purity alumina ceramics.
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