JP2010527608A - 端部熱損失を低減した熱電デバイス及びヒートシンク・アセンブリ - Google Patents
端部熱損失を低減した熱電デバイス及びヒートシンク・アセンブリ Download PDFInfo
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- JP2010527608A JP2010527608A JP2010509445A JP2010509445A JP2010527608A JP 2010527608 A JP2010527608 A JP 2010527608A JP 2010509445 A JP2010509445 A JP 2010509445A JP 2010509445 A JP2010509445 A JP 2010509445A JP 2010527608 A JP2010527608 A JP 2010527608A
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- temperature control
- control assembly
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
- B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0809—Geometry, shape and general structure rectangular shaped
- B01L2300/0829—Multi-well plates; Microtitration plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
- B01L2300/1822—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using Peltier elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/01—Geometry problems, e.g. for reducing size
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- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Devices For Use In Laboratory Experiments (AREA)
- Control Of Temperature (AREA)
Abstract
【選択図】図1A
Description
Claims (13)
- 複数のサンプルを受容可能なサンプル・ブロックのための温度制御アセンブリであって、
(A)実質的に平坦な表面を占有する、熱電手段と、
(B)ヒートシンクと、
を備え、
前記ヒートシンクは、
(i)前記熱電手段の下側に位置し、前記平坦な表面全面に伸延して選択的には前記平坦な表面を超えて伸延する、熱放散フィンと、
(ii)前記熱電手段の前記下側と前記熱放散フィンとの間に位置して、前記熱電手段の前記下側と前記熱放散フィンとに接触して、前記熱電手段の前記下側と前記熱放散フィンとの間の熱を伝導によって伝達する熱伝導材料からなり、かつ、当該スラブの中心領域を取囲む領域で高いボイド密度を持つボイドを含む当該スラブ全体に分布する、スラブを備える、ヒートシンクを備える、
温度制御アセンブリ。 - 前記中心領域を取囲む前記スラブ内にループ形状を有する凹部を備える、請求項1に記載の温度制御アセンブリ。
- 前記ボイドは、前記熱電手段によって占有されている前記領域の前記周縁部の約0.1mmから約10.0mmの距離内にある最も外側の端部を持つ、請求項1に記載の温度制御アセンブリ。
- 前記ボイドは、前記熱電手段によって占有されている前記領域の前記周縁部の約0.2mmから約3.0mmの距離内にある最も外側の端部を持つ請求項1に記載の温度制御アセンブリ。
- 前記ボイドは、前記中心領域を取囲む前記スラブ内に同心状にループ形状を有する複数の凹部を備え、前記複数の凹部は、最も内側のループ形状を有する凹部、及び最も外側のループ形状を有する凹部を含み、前記最も外側のループ形状を有する凹部は、前記最も内側のループ形状を有する凹部よりも大きい幅を持つ、請求項1に記載の温度制御アセンブリ。
- 前記ボイドは、各々が前記熱電手段によって占有されている前記領域の最小横方向寸法の約1%から約15%の範囲の最大幅を持った複数の別々の凹部を備える、請求項1に記載の温度制御アセンブリ。
- 前記熱電手段によって占有されている前記領域の中心から遠くにある前記凹部は、前記中心に最も近い前記凹部よりも幅が大きい、請求項6に記載の温度制御アセンブリ。
- 前記ボイドは、各々が前記熱電手段によって占有されている前記領域の最小横方向寸法の約1%から約5%の範囲の最大幅を持った複数の別々の凹部を備える、請求項1に記載の温度制御アセンブリ。
- 前記凹部の全部は、等しい直径を持った円形形状をなす、請求項8に記載の温度制御アセンブリ。
- 前記ボイドは、前記熱電手段に面して、かつ、傾斜した端部を持つ開口を備える、請求項1に記載の温度制御アセンブリ。
- 前記凹部は、前記熱電手段に面して、かつ、傾斜した端部を持つ開口を備える、請求項9に記載の温度制御アセンブリ。
- 前記熱電手段は、長方形アレイに配置された2個から12個の熱電デバイスを備える、請求項9に記載の温度制御アセンブリ。
- 前記熱電手段は、長方形アレイに配置された4個から10個の熱電デバイスを備える、請求項1に記載の温度制御アセンブリ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93184607P | 2007-05-24 | 2007-05-24 | |
US60/931,846 | 2007-05-24 | ||
US12/119,241 | 2008-05-12 | ||
US12/119,241 US7958736B2 (en) | 2007-05-24 | 2008-05-12 | Thermoelectric device and heat sink assembly with reduced edge heat loss |
PCT/US2008/063593 WO2008147693A1 (en) | 2007-05-24 | 2008-05-14 | Thermoelectric device and heat sink assembly with reduced edge heat loss |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010527608A true JP2010527608A (ja) | 2010-08-19 |
JP2010527608A5 JP2010527608A5 (ja) | 2011-06-23 |
JP5363463B2 JP5363463B2 (ja) | 2013-12-11 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010509445A Active JP5363463B2 (ja) | 2007-05-24 | 2008-05-14 | 端部熱損失を低減した熱電デバイス及びヒートシンク・アセンブリ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7958736B2 (ja) |
EP (1) | EP2150798B1 (ja) |
JP (1) | JP5363463B2 (ja) |
CA (1) | CA2687570C (ja) |
WO (1) | WO2008147693A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3171100B1 (en) * | 2015-11-17 | 2018-02-21 | Mahle International GmbH | Thermoelectric temperature-control unit and temperature-control device |
CN108700548B (zh) * | 2016-03-18 | 2020-07-07 | 株式会社日立高新技术 | 毛细管电泳装置 |
EP3912199A4 (en) * | 2019-01-14 | 2022-10-12 | Bio-Rad Laboratories, Inc. | HEAT PUMP DEVICE AND ARRANGEMENT |
US11160196B1 (en) * | 2020-05-14 | 2021-10-26 | Dell Products L.P. | Micro-strand heat dissipation system |
Citations (9)
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JPH04231490A (ja) * | 1990-05-16 | 1992-08-20 | Bio Rad Lab Inc | 改良された試料ウエルおよび冷却系を有するスラブ電気泳動装置 |
JP2001521379A (ja) * | 1997-03-28 | 2001-11-06 | ザ パーキン−エルマー コーポレーション | Pcrのための熱サイクラの改良 |
WO2004108288A1 (en) * | 2003-05-30 | 2004-12-16 | Applera Corporation | Thermal cycling apparatus and method for providing thermal uniformity |
JP2005117987A (ja) * | 2003-10-17 | 2005-05-12 | Thermogen Kk | Dna増幅装置 |
JP2006508542A (ja) * | 2002-12-02 | 2006-03-09 | ペルテク エッセ エレ エレ | 一体化された熱電モジュール |
WO2006055073A2 (en) * | 2004-11-12 | 2006-05-26 | Bio-Rad Laboratories, Inc. | Thermal cycler with protection from atmospheric moisture |
JP2006238848A (ja) * | 2005-03-07 | 2006-09-14 | Yamaha Corp | 遺伝子検査用温度調節装置 |
JP2006262788A (ja) * | 2005-03-24 | 2006-10-05 | Toshiba Tec Corp | 反応装置 |
JP2007503217A (ja) * | 2003-05-23 | 2007-02-22 | バイオ−ラッド ラボラトリーズ,インコーポレイティド | 反応培地の空間配列に対し局部化した温度制御 |
Family Cites Families (6)
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EP1464401B1 (en) * | 1999-07-30 | 2006-09-13 | Bio-Rad Laboratories, Inc. | Temperature control for multi-vessel reaction apparatus |
WO2001059363A1 (en) * | 2000-02-10 | 2001-08-16 | Light And Sound Design, Inc. | Super cooler for a heat producing device |
WO2001097974A1 (en) * | 2000-06-19 | 2001-12-27 | Caliper Technologies Corp. | Methods and devices for enhancing bonded substrate yields and regulating temperature |
US6345507B1 (en) * | 2000-09-29 | 2002-02-12 | Electrografics International Corporation | Compact thermoelectric cooling system |
GB2413694A (en) | 2004-04-30 | 2005-11-02 | Ims Nanofabrication Gmbh | Particle-beam exposure apparatus |
JP2008531960A (ja) * | 2005-02-22 | 2008-08-14 | デーウー・エレクトロニクス・コーポレイション | 熱電素子を用いた貯蔵庫 |
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2008
- 2008-05-12 US US12/119,241 patent/US7958736B2/en active Active
- 2008-05-14 JP JP2010509445A patent/JP5363463B2/ja active Active
- 2008-05-14 WO PCT/US2008/063593 patent/WO2008147693A1/en active Application Filing
- 2008-05-14 EP EP08755447.3A patent/EP2150798B1/en active Active
- 2008-05-14 CA CA2687570A patent/CA2687570C/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04231490A (ja) * | 1990-05-16 | 1992-08-20 | Bio Rad Lab Inc | 改良された試料ウエルおよび冷却系を有するスラブ電気泳動装置 |
JP2001521379A (ja) * | 1997-03-28 | 2001-11-06 | ザ パーキン−エルマー コーポレーション | Pcrのための熱サイクラの改良 |
JP2006508542A (ja) * | 2002-12-02 | 2006-03-09 | ペルテク エッセ エレ エレ | 一体化された熱電モジュール |
JP2007503217A (ja) * | 2003-05-23 | 2007-02-22 | バイオ−ラッド ラボラトリーズ,インコーポレイティド | 反応培地の空間配列に対し局部化した温度制御 |
WO2004108288A1 (en) * | 2003-05-30 | 2004-12-16 | Applera Corporation | Thermal cycling apparatus and method for providing thermal uniformity |
JP2005117987A (ja) * | 2003-10-17 | 2005-05-12 | Thermogen Kk | Dna増幅装置 |
WO2006055073A2 (en) * | 2004-11-12 | 2006-05-26 | Bio-Rad Laboratories, Inc. | Thermal cycler with protection from atmospheric moisture |
JP2006238848A (ja) * | 2005-03-07 | 2006-09-14 | Yamaha Corp | 遺伝子検査用温度調節装置 |
JP2006262788A (ja) * | 2005-03-24 | 2006-10-05 | Toshiba Tec Corp | 反応装置 |
Also Published As
Publication number | Publication date |
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US20080314557A1 (en) | 2008-12-25 |
EP2150798A4 (en) | 2011-06-22 |
JP5363463B2 (ja) | 2013-12-11 |
EP2150798A1 (en) | 2010-02-10 |
CA2687570C (en) | 2012-04-10 |
EP2150798B1 (en) | 2016-02-17 |
US7958736B2 (en) | 2011-06-14 |
CA2687570A1 (en) | 2008-12-04 |
WO2008147693A1 (en) | 2008-12-04 |
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