JP2010518611A - ガンダイオード - Google Patents
ガンダイオード Download PDFInfo
- Publication number
- JP2010518611A JP2010518611A JP2009548606A JP2009548606A JP2010518611A JP 2010518611 A JP2010518611 A JP 2010518611A JP 2009548606 A JP2009548606 A JP 2009548606A JP 2009548606 A JP2009548606 A JP 2009548606A JP 2010518611 A JP2010518611 A JP 2010518611A
- Authority
- JP
- Japan
- Prior art keywords
- gunn diode
- contact
- active layer
- diode according
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims description 33
- 238000002161 passivation Methods 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000011253 protective coating Substances 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 230000003472 neutralizing effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 18
- 239000013078 crystal Substances 0.000 description 8
- 238000000926 separation method Methods 0.000 description 7
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N80/00—Bulk negative-resistance effect devices
- H10N80/10—Gunn-effect devices
- H10N80/107—Gunn diodes
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
【選択図】 図1
Description
Claims (16)
- 活性層(2)の上面および下面が、活性層(2)と比較して高ドープされた同一材料の隣接コンタクト層(4)に各々接しているガンダイオード(1)であって、
前記コンタクト層(4)の少なくとも1つがその外側領域(12)を、各コンタクト層(4)と比較してなお一層高ドープされた同一材料の外側コンタクト層(14)で構成されているガンダイオード。 - 前記外側コンタクト層(14)がアノードコンタクト(10)を形成する請求項1記載のガンダイオード。
- 前記コンタクト層(4)の1つが基板(8)を形成する請求項1又は2記載のガンダイオード。
- 相応するコンタクトが基板(8)の下面に配置されている請求項3記載のガンダイオード。
- 前記活性層(2)がヒートシンク(16)と熱的に結合されている請求項1から4の1つに記載のガンダイオード。
- 前記ヒートシンク(16)の熱伝導率が基板(8)の熱伝導率よりも高い請求項5記載のガンダイオード。
- 前記活性層(2)と前記ヒートシンク(16)との熱的結合が基板(8)を介して実現されている請求項5又は6記載のガンダイオード。
- 前記ヒートシンク(16)が冷却ピンとして形成されている請求項5から7の1つに記載のガンダイオード。
- カソードコンタクト(6)が誘電体スリーブによって取り囲まれている請求項1から8の1つに記載のガンダイオード。
- 活性層(2)が側方において通路域に限定されており、該通路域が横方向で各々中性化縁領域(18)により限定されている請求項1から9の1つに記載のガンダイオード。
- 活性層(2)の少なくとも表面がパッシベーション層を備えている請求項1から10の1つに記載のガンダイオード。
- パッシベーション層がヒートシンクとして形成されている請求項11記載のガンダイオード。
- カソードコンタクト(6)が保護被覆を備えている請求項1から12の1つに記載のガンダイオード。
- 基礎材料として窒化物系材料が設けられている請求項1から13の1つに記載のガンダイオード。
- 基礎材料として酸化物系材料が設けられている請求項1から13の1つに記載のガンダイオード。
- 基礎材料が付加的にアルミニウム成分を含んでいる請求項14又は15記載のガンダイオード。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007007159A DE102007007159B4 (de) | 2007-02-09 | 2007-02-09 | Gunn-Diode |
DE102007007159.2 | 2007-02-09 | ||
PCT/EP2008/000772 WO2008095639A1 (de) | 2007-02-09 | 2008-01-31 | Gunn-diode |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010518611A true JP2010518611A (ja) | 2010-05-27 |
JP5676109B2 JP5676109B2 (ja) | 2015-02-25 |
Family
ID=39523758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009548606A Active JP5676109B2 (ja) | 2007-02-09 | 2008-01-31 | ガンダイオード |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100163837A1 (ja) |
EP (1) | EP2115793B1 (ja) |
JP (1) | JP5676109B2 (ja) |
AT (1) | ATE541326T1 (ja) |
DE (1) | DE102007007159B4 (ja) |
WO (1) | WO2008095639A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2651010B1 (en) | 2012-04-12 | 2014-12-17 | ABB Technology AG | A method for manufacturing a rotor of a synchronous reluctance motor, a rotor of a synchronous reluctance motor, and a synchronous reluctance motor |
DE102018121672A1 (de) * | 2018-09-05 | 2020-03-05 | Technische Universität Darmstadt | Gunndiode und Verfahren zum Erzeugen einer Terahertzstrahlung |
US11742800B2 (en) * | 2021-11-19 | 2023-08-29 | Sixpoint Materials, Inc. | Terahertz Gunn oscillator using gallium nitride |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08228033A (ja) * | 1995-02-21 | 1996-09-03 | Japan Energy Corp | 半導体装置 |
JP2005050832A (ja) * | 2003-07-28 | 2005-02-24 | Kyocera Corp | ミリ波発振器 |
WO2006029607A1 (de) * | 2004-09-15 | 2006-03-23 | Forschungszentrum Jülich GmbH | Gunn-diode |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3516017A (en) * | 1967-06-14 | 1970-06-02 | Hitachi Ltd | Microwave semiconductor device |
NL6900787A (ja) * | 1969-01-17 | 1970-07-21 | ||
FR2160759B1 (ja) * | 1971-11-26 | 1974-05-31 | Thomson Csf | |
GB1529853A (en) * | 1975-05-13 | 1978-10-25 | Secr Defence | Transferred electron devices |
US4064620A (en) * | 1976-01-27 | 1977-12-27 | Hughes Aircraft Company | Ion implantation process for fabricating high frequency avalanche devices |
US4212020A (en) * | 1978-07-21 | 1980-07-08 | California Institute Of Technology | Solid state electro-optical devices on a semi-insulating substrate |
FR2520931B1 (fr) * | 1982-02-02 | 1986-12-12 | Thomson Csf | Procede collectif de fabrication de diodes hyperfrequences avec encapsulation incorporee et diodes obtenues par ce procede |
US4539581A (en) * | 1982-07-12 | 1985-09-03 | The United States Of America As Represented By The Secretary Of The Army | Planar doped barrier transferred electron oscillator |
US4649405A (en) * | 1984-04-10 | 1987-03-10 | Cornell Research Foundation, Inc. | Electron ballistic injection and extraction for very high efficiency, high frequency transferred electron devices |
JPH07120807B2 (ja) * | 1986-12-20 | 1995-12-20 | 富士通株式会社 | 定電流半導体装置 |
US5311034A (en) * | 1990-05-28 | 1994-05-10 | Nippon Mining Co., Ltd. | Indium phosphide Gunn diode with dopant gradient |
GB2245421A (en) * | 1990-06-20 | 1992-01-02 | Philips Electronic Associated | Gunn effect device having a heat sink |
US5463275A (en) * | 1992-07-10 | 1995-10-31 | Trw Inc. | Heterojunction step doped barrier cathode emitter |
US5347141A (en) * | 1993-11-09 | 1994-09-13 | The United States Of America As Represented By The Secretary Of The Army | Multiterminal lateral S-shaped negative differential conductance device |
GB9414311D0 (en) * | 1994-07-15 | 1994-09-07 | Philips Electronics Uk Ltd | A transferred electron effect device |
US5661074A (en) * | 1995-02-03 | 1997-08-26 | Advanced Technology Materials, Inc. | High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same |
US6048777A (en) * | 1997-12-18 | 2000-04-11 | Hughes Electronics Corporation | Fabrication of high power semiconductor devices with respective heat sinks for integration with planar microstrip circuitry |
US6249025B1 (en) * | 1997-12-29 | 2001-06-19 | Intel Corporation | Using epitaxially grown wells for reducing junction capacitances |
JP3578381B2 (ja) * | 1998-03-25 | 2004-10-20 | シャープ株式会社 | ガンダイオード |
JP4493773B2 (ja) * | 1999-12-27 | 2010-06-30 | 新日本無線株式会社 | ガンダイオード及びその製造方法 |
US20030001167A1 (en) * | 2001-06-08 | 2003-01-02 | Zarlink Semiconductor Ab | Optical detector with integrated filter |
US7211833B2 (en) * | 2001-07-23 | 2007-05-01 | Cree, Inc. | Light emitting diodes including barrier layers/sublayers |
US7384854B2 (en) * | 2002-03-08 | 2008-06-10 | International Business Machines Corporation | Method of forming low capacitance ESD robust diodes |
DE10261238A1 (de) * | 2002-12-20 | 2004-07-15 | Forschungszentrum Jülich GmbH | Schichtenfolge |
US7566917B2 (en) * | 2004-09-28 | 2009-07-28 | Sharp Kabushiki Kaisha | Electronic device and heterojunction FET |
US7436039B2 (en) * | 2005-01-06 | 2008-10-14 | Velox Semiconductor Corporation | Gallium nitride semiconductor device |
GB0506588D0 (en) * | 2005-03-31 | 2005-05-04 | E2V Tech Uk Ltd | Gun diode |
TWI255055B (en) * | 2005-06-29 | 2006-05-11 | Chunghwa Picture Tubes Ltd | Light emitting diode and method for improving luminescence efficiency thereof |
US7745820B2 (en) * | 2005-11-03 | 2010-06-29 | The Ohio State University | Negative differential resistance polymer devices and circuits incorporating same |
US7495323B2 (en) * | 2006-08-30 | 2009-02-24 | Semiconductor Components Industries, L.L.C. | Semiconductor package structure having multiple heat dissipation paths and method of manufacture |
-
2007
- 2007-02-09 DE DE102007007159A patent/DE102007007159B4/de active Active
-
2008
- 2008-01-31 EP EP08707459A patent/EP2115793B1/de active Active
- 2008-01-31 JP JP2009548606A patent/JP5676109B2/ja active Active
- 2008-01-31 WO PCT/EP2008/000772 patent/WO2008095639A1/de active Application Filing
- 2008-01-31 US US12/526,534 patent/US20100163837A1/en not_active Abandoned
- 2008-01-31 AT AT08707459T patent/ATE541326T1/de active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08228033A (ja) * | 1995-02-21 | 1996-09-03 | Japan Energy Corp | 半導体装置 |
JP2005050832A (ja) * | 2003-07-28 | 2005-02-24 | Kyocera Corp | ミリ波発振器 |
WO2006029607A1 (de) * | 2004-09-15 | 2006-03-23 | Forschungszentrum Jülich GmbH | Gunn-diode |
Non-Patent Citations (2)
Title |
---|
JPN6014051935; O. Yilmazoglu, K. Mutamba, D. Pavlidis, T. Karaduman: 'Measured negative differential resistivity for GaN Gunn diodes on GaN substrate' Electronics Letters Vol. 43, No. 8, 20070412, IEEE * |
JPN7013000547; C. Sevik, C. Bulutay: 'Efficiency and harmonic enhancement trends in GaN-based Gunn diodes: Ensemble Monte Carlo analysis' Applied Physics Letters Vol. 85, No. 17, 20041025, p. 3908 - 3910, American Institute of Physics * |
Also Published As
Publication number | Publication date |
---|---|
WO2008095639A1 (de) | 2008-08-14 |
EP2115793A1 (de) | 2009-11-11 |
DE102007007159A1 (de) | 2008-08-21 |
DE102007007159B4 (de) | 2009-09-03 |
ATE541326T1 (de) | 2012-01-15 |
US20100163837A1 (en) | 2010-07-01 |
EP2115793B1 (de) | 2012-01-11 |
JP5676109B2 (ja) | 2015-02-25 |
WO2008095639A8 (de) | 2009-09-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7842974B2 (en) | Gallium nitride heterojunction schottky diode | |
CN109923678B (zh) | 肖特基势垒二极管和具备其的电子电路 | |
US8384115B2 (en) | Bond pad design for enhancing light extraction from LED chips | |
US9960152B2 (en) | Optoelectronic device with light-emitting diodes comprising at least one zener diode | |
US9324645B2 (en) | Method and system for co-packaging vertical gallium nitride power devices | |
US10763392B2 (en) | Light emitting device | |
JP2021182635A (ja) | 半導体レーザーダイオード | |
US11923662B2 (en) | Edge-emitting laser bar | |
EP1296379A3 (en) | Schottky barrier diode and method for manufacturing it | |
JP5261923B2 (ja) | 化合物半導体素子 | |
US9331453B2 (en) | Laser diode device | |
JP2010171167A (ja) | 発光素子 | |
US10002862B2 (en) | Solid-state lighting structure with integrated short-circuit protection | |
JP5676109B2 (ja) | ガンダイオード | |
WO2020033431A1 (en) | Extrinsic field termination structures for improving reliability of high-voltage, high-power active devices | |
US8884332B2 (en) | Nitride semiconductor device | |
WO2019176138A1 (en) | High electron mobility transistor | |
CN113851927B (zh) | 一种半导体激光器 | |
JP5532636B2 (ja) | 半導体装置 | |
KR102035630B1 (ko) | 발광 장치 | |
KR20150014641A (ko) | 질화갈륨계 다이오드 및 그 제조 방법 | |
JPH1022570A (ja) | 窒化物半導体レーザ素子 | |
US11979000B2 (en) | Surface-emitting semiconductor laser chip | |
TW201145610A (en) | Semiconductor diode and method for manufacturing a semiconductor diode | |
CN109860363B (zh) | 半导体元件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130219 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130520 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130527 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130610 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140114 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140411 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140418 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140516 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140521 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20141209 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141225 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5676109 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |