JP2010513050A - ナノ微粒子充填剤を有する研磨物品並びにそれを作製及び使用する方法 - Google Patents
ナノ微粒子充填剤を有する研磨物品並びにそれを作製及び使用する方法 Download PDFInfo
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- JP2010513050A JP2010513050A JP2009543104A JP2009543104A JP2010513050A JP 2010513050 A JP2010513050 A JP 2010513050A JP 2009543104 A JP2009543104 A JP 2009543104A JP 2009543104 A JP2009543104 A JP 2009543104A JP 2010513050 A JP2010513050 A JP 2010513050A
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- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical class O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87172006P | 2006-12-22 | 2006-12-22 | |
| US11/671,037 US7497885B2 (en) | 2006-12-22 | 2007-02-05 | Abrasive articles with nanoparticulate fillers and method for making and using them |
| PCT/US2007/087598 WO2008079743A1 (en) | 2006-12-22 | 2007-12-14 | Abrasive articles with nanoparticulate fillers and method for making and using them |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010513050A true JP2010513050A (ja) | 2010-04-30 |
| JP2010513050A5 JP2010513050A5 (OSRAM) | 2011-01-27 |
Family
ID=39540892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009543104A Pending JP2010513050A (ja) | 2006-12-22 | 2007-12-14 | ナノ微粒子充填剤を有する研磨物品並びにそれを作製及び使用する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7497885B2 (OSRAM) |
| EP (1) | EP2118226A4 (OSRAM) |
| JP (1) | JP2010513050A (OSRAM) |
| KR (1) | KR20090091302A (OSRAM) |
| TW (1) | TW200902233A (OSRAM) |
| WO (1) | WO2008079743A1 (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012182314A (ja) * | 2011-03-01 | 2012-09-20 | Jsr Corp | 組成物および化学機械研磨パッド、ならびに化学機械研磨方法 |
| KR20220025592A (ko) * | 2020-08-24 | 2022-03-03 | 에스케이씨솔믹스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7591865B2 (en) * | 2005-01-28 | 2009-09-22 | Saint-Gobain Abrasives, Inc. | Method of forming structured abrasive article |
| US8287611B2 (en) * | 2005-01-28 | 2012-10-16 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for making same |
| US8435098B2 (en) * | 2006-01-27 | 2013-05-07 | Saint-Gobain Abrasives, Inc. | Abrasive article with cured backsize layer |
| US8083820B2 (en) * | 2006-12-22 | 2011-12-27 | 3M Innovative Properties Company | Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same |
| EP2327088B1 (en) | 2008-08-28 | 2019-01-09 | 3M Innovative Properties Company | Structured abrasive article, method of making the same, and use in wafer planarization |
| EP2539416A4 (en) | 2010-02-24 | 2017-11-29 | Basf Se | Abrasive articles, method for their preparation and method of their use |
| US20130059506A1 (en) | 2010-05-11 | 2013-03-07 | 3M Innovative Properties Company | Fixed abrasive pad with surfactant for chemical mechanical planarization |
| DE102010042040A1 (de) | 2010-10-06 | 2012-04-12 | Siltronic Ag | Verfahren zum Schleifen einer Halbleiterscheibe |
| JP2013092748A (ja) | 2011-10-26 | 2013-05-16 | Cabot Corp | 複合体粒子を含むトナー添加剤 |
| US9353313B2 (en) | 2012-08-09 | 2016-05-31 | Auburn University | Microdevices and methods of manufacture |
| KR101916555B1 (ko) | 2013-12-20 | 2018-11-07 | 캐보트 코포레이션 | 화학적 기계적 평탄화를 위한 금속 산화물-중합체 복합 입자 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| KR102436416B1 (ko) | 2014-10-17 | 2022-08-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10456886B2 (en) | 2016-01-19 | 2019-10-29 | Applied Materials, Inc. | Porous chemical mechanical polishing pads |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
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| US4314827A (en) * | 1979-06-29 | 1982-02-09 | Minnesota Mining And Manufacturing Company | Non-fused aluminum oxide-based abrasive mineral |
| US4623364A (en) | 1984-03-23 | 1986-11-18 | Norton Company | Abrasive material and method for preparing the same |
| CA1254238A (en) * | 1985-04-30 | 1989-05-16 | Alvin P. Gerk | Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products |
| US4623384A (en) * | 1985-06-03 | 1986-11-18 | Stauffer Chemical Co. | Benzylacrylaryl amide herbicidal compounds and methods of use |
| US4770671A (en) * | 1985-12-30 | 1988-09-13 | Minnesota Mining And Manufacturing Company | Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith |
| US4881951A (en) * | 1987-05-27 | 1989-11-21 | Minnesota Mining And Manufacturing Co. | Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith |
| CH675250A5 (OSRAM) * | 1988-06-17 | 1990-09-14 | Lonza Ag | |
| US5014468A (en) * | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
| US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| US5736371A (en) * | 1991-06-04 | 1998-04-07 | A Et S Biovecteurs | Biodegradable particulate vector for transporting molecules having biological activity |
| US6258137B1 (en) * | 1992-02-05 | 2001-07-10 | Saint-Gobain Industrial Ceramics, Inc. | CMP products |
| WO1995007797A1 (en) | 1993-09-13 | 1995-03-23 | Minnesota Mining And Manufacturing Company | Abrasive article, method of manufacture of same, method of using same for finishing, and a production tool |
| US5391210A (en) * | 1993-12-16 | 1995-02-21 | Minnesota Mining And Manufacturing Company | Abrasive article |
| DE69511068T2 (de) | 1994-02-22 | 2000-04-06 | Minnesota Mining And Mfg. Co. | Schleifartikel, verfahren zum herstellen derselben, und verfahren zum anwenden desselben bei endbearbeitung |
| US5958794A (en) | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
| US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US5876268A (en) * | 1997-01-03 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Method and article for the production of optical quality surfaces on glass |
| US6194317B1 (en) * | 1998-04-30 | 2001-02-27 | 3M Innovative Properties Company | Method of planarizing the upper surface of a semiconductor wafer |
| US5942015A (en) * | 1997-09-16 | 1999-08-24 | 3M Innovative Properties Company | Abrasive slurries and abrasive articles comprising multiple abrasive particle grades |
| TW512170B (en) * | 1998-07-24 | 2002-12-01 | Ibm | Aqueous slurry composition and method for polishing a surface using the same |
| US6287353B1 (en) * | 1999-09-28 | 2001-09-11 | 3M Innovative Properties Company | Abrasive grain, abrasive articles, and methods of making and using the same |
| JP2004508947A (ja) * | 2000-09-08 | 2004-03-25 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨材物品、ならびにその製造方法および使用方法 |
| US6551366B1 (en) * | 2000-11-10 | 2003-04-22 | 3M Innovative Properties Company | Spray drying methods of making agglomerate abrasive grains and abrasive articles |
| US6645624B2 (en) * | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
| US6755721B2 (en) * | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
| US6802878B1 (en) * | 2003-04-17 | 2004-10-12 | 3M Innovative Properties Company | Abrasive particles, abrasive articles, and methods of making and using the same |
| CN1789365A (zh) * | 2004-12-16 | 2006-06-21 | 鸿富锦精密工业（深圳）有限公司 | 抛光磨料及其制造方法 |
| US7591865B2 (en) * | 2005-01-28 | 2009-09-22 | Saint-Gobain Abrasives, Inc. | Method of forming structured abrasive article |
| ES2349429T3 (es) * | 2005-04-14 | 2011-01-03 | Saint-Gobain Abrasives, Inc. | Método de formación de un artículo abrasivo estructurado. |
-
2007
- 2007-02-05 US US11/671,037 patent/US7497885B2/en not_active Expired - Fee Related
- 2007-12-14 WO PCT/US2007/087598 patent/WO2008079743A1/en not_active Ceased
- 2007-12-14 EP EP07865705.3A patent/EP2118226A4/en not_active Withdrawn
- 2007-12-14 KR KR1020097012691A patent/KR20090091302A/ko not_active Ceased
- 2007-12-14 JP JP2009543104A patent/JP2010513050A/ja active Pending
- 2007-12-21 TW TW096149593A patent/TW200902233A/zh unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012182314A (ja) * | 2011-03-01 | 2012-09-20 | Jsr Corp | 組成物および化学機械研磨パッド、ならびに化学機械研磨方法 |
| KR20220025592A (ko) * | 2020-08-24 | 2022-03-03 | 에스케이씨솔믹스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| KR102410612B1 (ko) | 2020-08-24 | 2022-06-20 | 에스케이씨솔믹스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080148651A1 (en) | 2008-06-26 |
| US7497885B2 (en) | 2009-03-03 |
| TW200902233A (en) | 2009-01-16 |
| KR20090091302A (ko) | 2009-08-27 |
| EP2118226A4 (en) | 2013-07-17 |
| EP2118226A1 (en) | 2009-11-18 |
| WO2008079743A1 (en) | 2008-07-03 |
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