JP2010502028A - Equipment for welding semiconductor chip bumps with liquid material - Google Patents

Equipment for welding semiconductor chip bumps with liquid material Download PDF

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JP2010502028A
JP2010502028A JP2009526081A JP2009526081A JP2010502028A JP 2010502028 A JP2010502028 A JP 2010502028A JP 2009526081 A JP2009526081 A JP 2009526081A JP 2009526081 A JP2009526081 A JP 2009526081A JP 2010502028 A JP2010502028 A JP 2010502028A
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semiconductor chip
recess
carrier plate
steel plate
substrate
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ワーン，ドミニク
ボウマン，ダミアン
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オーリコン アッセンブリー エクイップメント エージー ステインハウセン
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1182—Applying permanent coating, e.g. in-situ coating
    • H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

半導体チップのバンプをはんだ付用フラックスにより溶着する装置は、表面および背面を有するキャリア板（１４）と、キャリア板（１４）の表面に取り外し可能に設置され、少なくとも１個の陥凹部（３）を有する鋼板（１５）とを含む。好ましくは、陥凹部はエッチングにより形成される。好ましくは、鋼板（１５）を固定するために、少なくとも１個の磁石（１６）をキャリア板（１４）の背面に設置する。
【選択図】図４An apparatus for welding bumps of a semiconductor chip with a soldering flux is provided on a carrier plate (14) having a front surface and a back surface, and is detachably installed on the surface of the carrier plate (14), and at least one recessed portion (3). Steel plate (15) having Preferably, the recess is formed by etching. Preferably, at least one magnet (16) is placed on the back side of the carrier plate (14) in order to fix the steel plate (15).
[Selection] Figure 4

Description

本発明は、半導体チップのバンプを、はんだ付用フラックス等の液状物質により溶着するための装置に関する。   The present invention relates to an apparatus for welding bumps of a semiconductor chip with a liquid material such as a soldering flux.

半導体チップを実装する技術としては、いわゆるダイボンダにより半導体チップをあらかじめ基板に設置しておく技術が広く知られている。この技術によれば、半導体チップの電気接続面は、いわゆるワイヤボンダにより基板にワイヤ接続される。その他の技術としてはフリップチップ技術があり、半導体チップの接続面にはいわゆるバンプが設けられ、技術用語において「フリップ」と言われるように、半導体チップを反転して基板に実装する。その後、半導体チップのバンプをはんだ付用フラックスにより溶着する。溶着するために、半導体チップのバンプをはんだ付用フラックス等を充填した陥凹部に浸積する。この技術によれば、半導体チップは、バンプが基板の電気接続面に接触した様態で基板に設置される。その後、半導体チップおよび基板をリフローして焼成する。   As a technique for mounting a semiconductor chip, a technique in which a semiconductor chip is previously installed on a substrate by a so-called die bonder is widely known. According to this technique, the electrical connection surface of the semiconductor chip is wire-connected to the substrate by a so-called wire bonder. As another technique, there is a flip-chip technique, so-called bumps are provided on the connection surface of the semiconductor chip, and the semiconductor chip is inverted and mounted on a substrate as called “flip” in technical terms. Thereafter, bumps of the semiconductor chip are welded with a soldering flux. For welding, the bumps of the semiconductor chip are immersed in the recesses filled with soldering flux or the like. According to this technique, the semiconductor chip is placed on the substrate in such a manner that the bump contacts the electrical connection surface of the substrate. Thereafter, the semiconductor chip and the substrate are reflowed and fired.

請求項１の前提部に記載の、半導体チップのバンプをはんだ付用フラックスにより溶着する装置は、特許文献１に開示されている。当該装置は、はんだ付用フラックスを充填した少なくとも１つの陥凹部を有する基板を含む。陥凹部内のはんだ付用フラックス層の厚さは、通常、０〜２００μｍの範囲である。はんだ付用フラックス層の厚みを均一にするために、基板として鋼板を使用する。鋼板は、表面を十分に滑らかな平らな面にするために、均質な素材を切削および機械処理して形成する。その後、陥凹部を切削により形成する。基板および陥凹部の製造工程は極度に複雑であり、そのため高コストである。   An apparatus for welding bumps of a semiconductor chip with a soldering flux described in the premise part of claim 1 is disclosed in Patent Document 1. The apparatus includes a substrate having at least one recess filled with a soldering flux. The thickness of the soldering flux layer in the recessed portion is usually in the range of 0 to 200 μm. In order to make the thickness of the soldering flux layer uniform, a steel plate is used as a substrate. The steel sheet is formed by cutting and machining a homogeneous material in order to make the surface sufficiently smooth and flat. Thereafter, the recess is formed by cutting. The manufacturing process of the substrate and the recess is extremely complicated and therefore expensive.

半導体チップのバンプを溶着するその他の装置としては、特許文献２〜４が知られている。
ＣＨ６９４６３４ ＥＰ７８９３９１ ＷＯ０１／３５７０９ 特開平８−３４０１７５ Patent Documents 2 to 4 are known as other apparatuses for welding bumps of a semiconductor chip.
CH694634 EP78991 WO01 / 35709 JP-A-8-340175

本発明が解決しようとする課題は、上記のような装置において、製造が容易で費用効率の高い装置を提供することである。   The problem to be solved by the present invention is to provide an apparatus that is easy to manufacture and cost-effective in the apparatus as described above.

上記課題は、本発明の請求項１に記載の特徴により解決できる。   The above problem can be solved by the features described in claim 1 of the present invention.

上記の課題は、切削により形成された陥凹部を有する基板を、キャリア板、および陥凹部を有する（置換可能な）鋼板とを備える機構に変更することにより解決される。鋼板としては例えば、ＤＩＮ ＥＮ １０１３０規格における「最良の表面」の表面品質を有し、その表面が「非常に滑らか」な品質に形成される、標準的に入手できる板部材が適している。当該ＤＩＮ規格においては、表面タイプ「最良の表面」は「Ｂ」の文字、また実際の表面品質である「非常に滑らか」は「ｂ」の文字で表示されている。例としては、「ＥＮ１０１３０−ＤＣ０４Ｂｂ」で表示される板部材がある。ＤＣ０４は鋼の種類を表しており、このＤＣ０４からなる板部材は、表面の滑らかさや粗さに関する条件を満たしている。好ましくは、陥凹部はエッチングにより形成される。陥凹部の表面は、鋼板におけるその他の面に比べて肉眼にはつや消し面に見える。また、陥凹部は切削や研磨など他の材料除去方法によって形成してもよい。 Said subject is solved by changing the board | substrate which has a recessed part formed by cutting into the mechanism provided with a carrier plate and the steel plate which has a recessed part (replaceable). As the steel plate, for example, a standardly available plate member having a surface quality of “best surface” in the DIN EN 10130 standard and having the surface formed in a “very smooth” quality is suitable. In the DIN standard, the surface type “best surface” is indicated by the letter “B”, and the actual surface quality “very smooth” is indicated by the letter “b”. As an example, there is a plate member indicated by “EN10130-DC04Bb”. DC04 represents the type of steel, and the plate member made of DC04 satisfies the conditions regarding the smoothness and roughness of the surface. Preferably, the recess is formed by etching. The surface of the recess appears to be a matte surface to the naked eye compared to the other surfaces of the steel plate. The recessed portion may be formed by other material removing methods such as cutting and polishing.

図１は、特許文献１に開示の、半導体チップのバンプを溶着するための装置の上面図および側面図である。FIG. 1 is a top view and a side view of an apparatus disclosed in Patent Document 1 for welding bumps of a semiconductor chip. 図２は、特許文献１に開示の、半導体チップのバンプを溶着するための装置の上面図および側面図である。FIG. 2 is a top view and a side view of an apparatus disclosed in Patent Document 1 for welding bumps of a semiconductor chip. 図３は、当該装置における、陥凹部を有する基板を示す図である。FIG. 3 is a view showing a substrate having a recess in the apparatus. 図４は、キャリア板を示す図である。FIG. 4 is a diagram showing a carrier plate. 図５は２個の陥凹部を有する鋼板を示す図である。FIG. 5 is a view showing a steel plate having two recesses.

以下、本発明の実施の形態について図面を参照しながら詳細に説明する。図面は原寸大ではない。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The drawings are not full scale.

図１および図２はそれぞれ、はんだ付用フラックス、導電性エポキシ樹脂、又ははんだペースト等の液状物質により半導体チップのバンプを溶着する、特許文献１に開示の装置１の上面図および側面図である。装置１は、少なくとも１個の陥凹部３を有する長方形の基板２、および液状物質を収容する、底部に開口部を有する容器４を備える。溶着動作において、容器４は、基板２上で２つの位置Ｐ１および位置Ｐ２の間を所定の速度で前後にスライドする。位置Ｐ１および位置Ｐ２は、陥凹部３の左右に設けられる。 1 and 2 are a top view and a side view, respectively, of an apparatus 1 disclosed in Patent Document 1 in which bumps of a semiconductor chip are welded by a liquid material such as soldering flux, conductive epoxy resin, or solder paste. . The apparatus 1 comprises a rectangular substrate 2 having at least one recess 3 and a container 4 having an opening at the bottom for containing a liquid substance. In the welding operation, the container 4 slides back and forth between the two positions P 1 and the position P 2 on the substrate 2 at a predetermined speed. The position P 1 and the position P 2 are provided on the left and right of the recessed portion 3.

容器４は、例えば容器４が取り外し可能に取り付けられたスライドにより駆動される。スライドは、下部スライド部８ａおよび上部スライド部８ｂを備える。容器４は、上部スライド部８ｂにおける円形凹部に実装される２個のピン１０を有する。上部スライド部８ｂは、ばねにより、下部スライド部８ａが引っ張られる方向とは逆方向に基板２の方向に引っ張られ、これにより容器４の下部端が基板２に所定の強さで押し付けられる。スライド８自体は空圧駆動（図示せず）により、例えば基板に並行して設けられるガイドレール９に沿って前後に移動する。これにより、容器４も基板２上をスライド移動する。   The container 4 is driven by, for example, a slide to which the container 4 is detachably attached. The slide includes a lower slide portion 8a and an upper slide portion 8b. The container 4 has two pins 10 mounted in a circular recess in the upper slide portion 8b. The upper slide portion 8b is pulled by the spring in the direction of the substrate 2 in the direction opposite to the direction in which the lower slide portion 8a is pulled, whereby the lower end of the container 4 is pressed against the substrate 2 with a predetermined strength. The slide 8 itself moves back and forth along a guide rail 9 provided in parallel with the substrate, for example, by pneumatic driving (not shown). As a result, the container 4 also slides on the substrate 2.

図３は、陥凹部３に液状物質としてはんだ付用フラックス１２を充填した図である。フラックス層の厚さｄは、陥凹部３の深さｔより約２０〜３０μｍ薄いが、はんだ付用フラックス１２は陥凹部３の外周に沿って陥凹部３の上部端１３まで延伸している。陥凹部３にははんだ付用フラックス１２が均一に充填されており、はんだ付用フラックス１２の粘度は、少なくとも８〜４５Ｎｓ／ｍ２（８０００〜４５０００ｃｐ）の広範囲にあり影響しない。従って、半導体チップおよびバンプを陥凹部３に浸漬した際、はんだ付用フラックスによって全てのバンプが均一に溶着する。 FIG. 3 is a diagram in which the recessed portion 3 is filled with a soldering flux 12 as a liquid substance. The thickness d of the flux layer is about 20-30 μm thinner than the depth t of the recess 3, but the soldering flux 12 extends to the upper end 13 of the recess 3 along the outer periphery of the recess 3. The recessed portion 3 is uniformly filled with the soldering flux 12, and the viscosity of the soldering flux 12 is at least in the wide range of 8 to 45 Ns / m 2 (8000 to 45000 cp) and is not affected. Therefore, when the semiconductor chip and the bumps are immersed in the recess 3, all the bumps are uniformly welded by the soldering flux.

次に、図４および図５を参照して本発明を説明する。本発明によれば、基板２を、キャリア板１４および、少なくとも１個の陥凹部３を備え、交換可能にキャリア板１４に取り付けられた鋼板１５に変更する。キャリア板１４の背面には、少なくとも１個、好ましくは複数の磁石１６が設けられる。好ましくは、磁石１６はキャリア板１４背面の凹部１７に収容される。鋼板１５がキャリア板１４の表面に置かれると、鋼板１５は磁石１６の力によりキャリア板１４に引き付けられる。   Next, the present invention will be described with reference to FIGS. According to the present invention, the substrate 2 is changed to a steel plate 15 that includes the carrier plate 14 and at least one recessed portion 3 and is attached to the carrier plate 14 in a replaceable manner. At least one, preferably a plurality of magnets 16 are provided on the back surface of the carrier plate 14. Preferably, the magnet 16 is accommodated in the recess 17 on the back surface of the carrier plate 14. When the steel plate 15 is placed on the surface of the carrier plate 14, the steel plate 15 is attracted to the carrier plate 14 by the force of the magnet 16.

好ましくは、鋼板１５に対向するキャリア板１４の表面は平らな面、すなわち凹凸のない表面である。凹凸のない表面は、突起を有する表面に比べて製造工程がより単純である。鋼板１５をキャリア板１４に挿入する際、鋼板１５が正しい位置に収容され、また動作中にずれないよう、表面の両端から突出する部材１８をキャリア板１４に更に設ける。部材１８は例えばＵ字形状を有し、キャリア板１４の相対する両端面に取り付けられる。   Preferably, the surface of the carrier plate 14 facing the steel plate 15 is a flat surface, that is, a surface without unevenness. An uneven surface has a simpler manufacturing process than a surface having protrusions. When inserting the steel plate 15 into the carrier plate 14, the carrier plate 14 is further provided with members 18 protruding from both ends of the surface so that the steel plate 15 is accommodated in the correct position and does not shift during operation. The member 18 has, for example, a U shape, and is attached to opposite end surfaces of the carrier plate 14.

好ましくは、鋼板１５における少なくとも１個の陥凹部３はエッチングにより形成される。従って、陥凹部の表面は肉眼にはつや消し面のように見え、鋼板１５の表面のうち、陥凹部形成時に処理されない部分は平滑面に見える。少なくとも１個の陥凹部３はまた、切削や研磨など他の材料除去方法により形成してもよい。切削や研磨により形成された面は、光沢面に見える。表面が切削により形成された場合、形成作業時に付く切削ヘッド痕を更に有する。   Preferably, at least one recess 3 in the steel plate 15 is formed by etching. Therefore, the surface of the recess appears to the naked eye as a matte surface, and the portion of the surface of the steel plate 15 that is not treated when forming the recess appears to be a smooth surface. At least one recess 3 may also be formed by other material removal methods such as cutting or polishing. A surface formed by cutting or polishing appears to be a glossy surface. When the surface is formed by cutting, it further has a cutting head mark attached during the forming operation.

本発明よる装置においては、次の複数の利点がある。まず、キャリア板１４を相当の精度で形成するだけで製造精度が向上する。平面として形成されるキャリア板１４表面は、陥凹部を有する基板に比べて形成がより容易である。また、キャリア板１４は摩耗せず、実装機械に恒久的に設置することが可能である。また、鋼板１５における少なくとも１個の陥凹部３をエッチングにより形成することにより、切削により形成する場合に比べて、費用効率が非常に高い。また、鋼板１５は使用により摩耗するが、鋼板１５の交換は、切削により形成された陥凹部を有する基板を交換する場合に比べて、費用効率が非常に高い。さらに、陥凹部３の深さを製造条件の変化に合わせて調節しなければならない場合、鋼板１５を簡単に素早く交換することができる。   The apparatus according to the present invention has the following advantages. First, the manufacturing accuracy is improved only by forming the carrier plate 14 with considerable accuracy. The surface of the carrier plate 14 formed as a flat surface is easier to form than a substrate having a recess. Further, the carrier plate 14 does not wear and can be permanently installed in the mounting machine. Further, by forming at least one recessed portion 3 in the steel plate 15 by etching, the cost efficiency is very high as compared with the case of forming by cutting. Further, although the steel plate 15 is worn by use, the replacement of the steel plate 15 is very cost effective as compared with the case of replacing the substrate having the recess formed by cutting. Furthermore, when the depth of the recessed part 3 must be adjusted according to the change of manufacturing conditions, the steel plate 15 can be replaced easily and quickly.

上記のような、キャリア板１４および交換可能な鋼板１５を備える機構は、その点以外は例えば特許文献１または特許文献３の教示により構成される、半導体チップのバンプを溶着するための装置に使用してもよい。ただし、上記機構の使用は、そのような構成に制限されるものではない。   The mechanism including the carrier plate 14 and the replaceable steel plate 15 as described above is used in an apparatus for welding bumps of a semiconductor chip, which is configured according to the teaching of Patent Document 1 or Patent Document 3 except for that point. May be. However, use of the mechanism is not limited to such a configuration.

Claims (3)

半導体チップのバンプを液状物質により溶着するために、液状物質を収容する少なくとも１個の陥凹部（３）を有し、前記半導体チップを、バンプを溶着する前記少なくとも１個の陥凹部（３）に浸漬する装置において、
表面および背面を有するキャリア板（１４）と、
前記キャリア板（１４）の前記表面に取り外し可能に設置され、前記少なくとも１個の陥凹部（３）を有する鋼板（１５）とを備えることを特徴とする、半導体チップのバンプを液状物質により溶着するための装置。 In order to weld the bumps of the semiconductor chip with a liquid material, the semiconductor chip has at least one recess (3) for containing the liquid material, and the semiconductor chip has the at least one recess (3) for welding the bump. In the apparatus immersed in
A carrier plate (14) having a front surface and a back surface;
A bump of a semiconductor chip is welded with a liquid material, wherein the bump is mounted on the surface of the carrier plate (14) so as to be removable and has a steel plate (15) having the at least one recess (3). Device to do. 前記陥凹部（３）の前記表面は、前記鋼板（１５）におけるその他の面に比べて、肉眼にはつや消し面に見えることを特徴とする、請求項１に記載の装置。   Device according to claim 1, characterized in that the surface of the recess (3) appears to the matte surface to the naked eye compared to the other surfaces of the steel plate (15). 前記キャリア板（１４）の前記背面に、少なくとも１個の磁石（１６）を設置することを特徴とする、請求項１もしくは請求項２に記載の装置。   3. Device according to claim 1 or 2, characterized in that at least one magnet (16) is installed on the back side of the carrier plate (14).
JP2009526081A 2006-09-01 2007-08-28 Equipment for welding semiconductor chip bumps with liquid material Pending JP2010502028A (en)

Applications Claiming Priority (2)

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CH14262006 2006-09-01
PCT/EP2007/058916 WO2008025764A1 (en) 2006-09-01 2007-08-28 Device for wetting bumps of a semiconductor chip with a liquid substance

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