JP2010500606A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010500606A5 JP2010500606A5 JP2009523184A JP2009523184A JP2010500606A5 JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5 JP 2009523184 A JP2009523184 A JP 2009523184A JP 2009523184 A JP2009523184 A JP 2009523184A JP 2010500606 A5 JP2010500606 A5 JP 2010500606A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- carrier substrate
- layer
- positional relationship
- multilayer body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006037433A DE102006037433B4 (de) | 2006-08-09 | 2006-08-09 | Verfahren zur Herstellung eines Mehrschichtkörpers sowie Mehrschichtkörper |
| DE102006037433.9 | 2006-08-09 | ||
| PCT/EP2007/006884 WO2008017426A1 (de) | 2006-08-09 | 2007-08-03 | Verfahren zur herstellung mindestens eines mehrschichtkörpers sowie mehrschichtkörper |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010500606A JP2010500606A (ja) | 2010-01-07 |
| JP2010500606A5 true JP2010500606A5 (OSRAM) | 2010-09-09 |
| JP4944200B2 JP4944200B2 (ja) | 2012-05-30 |
Family
ID=38608712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009523184A Expired - Fee Related JP4944200B2 (ja) | 2006-08-09 | 2007-08-03 | 少なくとも一つの多層体の製造プロセスと多層体 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8129217B2 (OSRAM) |
| EP (1) | EP2050150B1 (OSRAM) |
| JP (1) | JP4944200B2 (OSRAM) |
| DE (1) | DE102006037433B4 (OSRAM) |
| DK (1) | DK2050150T3 (OSRAM) |
| WO (1) | WO2008017426A1 (OSRAM) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
| US7557367B2 (en) | 2004-06-04 | 2009-07-07 | The Board Of Trustees Of The University Of Illinois | Stretchable semiconductor elements and stretchable electrical circuits |
| CN101517700B (zh) | 2006-09-20 | 2014-04-16 | 伊利诺伊大学评议会 | 用于制造可转移半导体结构、器件和器件构件的松脱策略 |
| JP5700750B2 (ja) | 2007-01-17 | 2015-04-15 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 印刷ベースの組立により製作される光学システム |
| WO2010042653A1 (en) | 2008-10-07 | 2010-04-15 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US9156107B2 (en) * | 2009-03-30 | 2015-10-13 | Boegli-Gravures S.A. | Method and device for structuring the surface of a hard material coated solid body by means of a laser |
| PT2414130E (pt) | 2009-03-30 | 2015-06-08 | Boegli Gravures Sa | Método e dispositivo de estruturação de uma superfície de corpo sólido com um revestimento duro com um primeiro laser com pulsos no domínio dos nanossegundos e um segundo laser com pulsos no domínio dos pico ou fentossegundos; película de embalagem |
| TWI671811B (zh) | 2009-05-12 | 2019-09-11 | 美國伊利諾大學理事會 | 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成 |
| WO2011041727A1 (en) | 2009-10-01 | 2011-04-07 | Mc10, Inc. | Protective cases with integrated electronics |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| JP6046491B2 (ja) | 2009-12-16 | 2016-12-21 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | コンフォーマル電子機器を使用した生体内での電気生理学 |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| CN105496423A (zh) | 2010-03-17 | 2016-04-20 | 伊利诺伊大学评议会 | 基于生物可吸收基质的可植入生物医学装置 |
| US9442285B2 (en) | 2011-01-14 | 2016-09-13 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
| WO2012118713A2 (en) * | 2011-03-03 | 2012-09-07 | Orthogonal, Inc. | Process for patterning materials in thin-film devices |
| WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
| JP2014523633A (ja) | 2011-05-27 | 2014-09-11 | エムシー１０ インコーポレイテッド | 電子的、光学的、且つ／又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法 |
| US8934965B2 (en) | 2011-06-03 | 2015-01-13 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| JP6231489B2 (ja) | 2011-12-01 | 2017-11-15 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | プログラム可能な変化を被るように設計された遷移デバイス |
| KR20150004819A (ko) | 2012-03-30 | 2015-01-13 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 표면에 상응하는 부속체 장착가능한 전자 장치 |
| DE102012108170B4 (de) * | 2012-09-03 | 2015-01-22 | Bundesdruckerei Gmbh | Sicherheitselement und Verfahren zur Herstellung eines Sicherheitselements |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| BR112017025609A2 (pt) | 2015-06-01 | 2018-08-07 | The Board Of Trustees Of The University Of Illinois | sistemas eletrônicos miniaturizados com potência sem fio e capacidades de comunicação de campo próximo |
| JP2018524566A (ja) | 2015-06-01 | 2018-08-30 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | 代替的ｕｖセンシング手法 |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| EP3985715A4 (en) * | 2020-06-01 | 2022-11-09 | Changxin Memory Technologies, Inc. | Design method for wafer layout and lithography machine exposure system |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3829213A (en) * | 1972-06-02 | 1974-08-13 | Mos Technology Inc | Artproof method for semiconductor devices |
| US4374911A (en) * | 1978-04-28 | 1983-02-22 | International Business Machines Corporation | Photo method of making tri-level density photomask |
| GB9404675D0 (en) * | 1994-03-11 | 1994-04-27 | Dow Corning Sa | Foils |
| US5932397A (en) * | 1996-05-28 | 1999-08-03 | Rvm Scientific, Inc. | Multicolor lithography for control of three dimensional refractive index gradient processing |
| US6133933A (en) * | 1997-01-13 | 2000-10-17 | Xerox Corporation | Color Xerographic printing system with multicolor printbar |
| US6255130B1 (en) * | 1998-11-19 | 2001-07-03 | Samsung Electronics Co., Ltd. | Thin film transistor array panel and a method for manufacturing the same |
| JP2003515782A (ja) * | 1999-12-02 | 2003-05-07 | ジェムファイア コーポレイション | 光デバイスの光画定 |
| US6569580B2 (en) * | 2001-03-13 | 2003-05-27 | Diverging Technologies, Inc. | Binary and phase-shift photomasks |
| US20020195928A1 (en) * | 2001-06-25 | 2002-12-26 | Grace Anthony J. | Electroluminescent display device and method of making |
| US7160649B2 (en) * | 2002-07-11 | 2007-01-09 | Hitachi Via Mechanics, Ltd. | Gray level imaging masks, optical imaging apparatus for gray level imaging masks and methods for encoding mask and use of the masks |
| CN1757124B (zh) * | 2003-03-07 | 2010-06-16 | 皇家飞利浦电子股份有限公司 | 制造电子装置的方法 |
| JP3746497B2 (ja) * | 2003-06-24 | 2006-02-15 | 松下電器産業株式会社 | フォトマスク |
| DE10349963A1 (de) * | 2003-10-24 | 2005-06-02 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung einer Folie |
| DE102004059467A1 (de) * | 2004-12-10 | 2006-07-20 | Polyic Gmbh & Co. Kg | Gatter aus organischen Feldeffekttransistoren |
| DE102004059798A1 (de) * | 2004-12-10 | 2006-06-29 | Ovd Kinegram Ag | Optisch variables Element mit elektrisch aktiver Schicht |
| JP4769544B2 (ja) * | 2005-10-28 | 2011-09-07 | Ｈｏｙａ株式会社 | 二次鋳型の製造方法 |
| US8906490B2 (en) * | 2006-05-19 | 2014-12-09 | Eastman Kodak Company | Multicolor mask |
-
2006
- 2006-08-09 DE DE102006037433A patent/DE102006037433B4/de not_active Expired - Fee Related
-
2007
- 2007-08-03 JP JP2009523184A patent/JP4944200B2/ja not_active Expired - Fee Related
- 2007-08-03 US US12/309,908 patent/US8129217B2/en not_active Expired - Fee Related
- 2007-08-03 EP EP07801506.2A patent/EP2050150B1/de not_active Not-in-force
- 2007-08-03 WO PCT/EP2007/006884 patent/WO2008017426A1/de not_active Ceased
- 2007-08-03 DK DK07801506.2T patent/DK2050150T3/da active
-
2012
- 2012-01-25 US US13/358,007 patent/US8502213B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010500606A5 (OSRAM) | ||
| US10236398B2 (en) | Method for manufacturing transparent electrode | |
| TWI510372B (zh) | 電極、含其之電子裝置及其製造方法 | |
| JP2011129165A5 (OSRAM) | ||
| JP2008021987A5 (OSRAM) | ||
| RU2005113274A (ru) | Пленка с органическими полупроводниками | |
| JP2010244808A5 (OSRAM) | ||
| JP2010529598A5 (OSRAM) | ||
| JP2013532365A5 (OSRAM) | ||
| JP2007013092A5 (OSRAM) | ||
| JP2009135184A5 (OSRAM) | ||
| CN102629593A (zh) | 软性电子装置及其制作方法 | |
| JP2013542569A (ja) | カプセル化を伴う有機電子デバイス | |
| CN104678461B (zh) | 渐变折射率材料制备方法 | |
| JP2009088162A5 (OSRAM) | ||
| JP2009505386A5 (OSRAM) | ||
| JP2010500779A5 (OSRAM) | ||
| JP2005013985A5 (OSRAM) | ||
| KR20160110837A (ko) | 금속 나노홀 패턴층을 구비한 다층 투명전극 | |
| JP2007150275A5 (OSRAM) | ||
| CN106536783A (zh) | 反射片及其制造方法 | |
| JP2011103358A5 (OSRAM) | ||
| EP1876876A4 (en) | TRANSPARENT ELECTRICALLY CONDUCTIVE FILM AND PROCESS FOR ITS MANUFACTURE | |
| JP2017517142A5 (OSRAM) | ||
| WO2012161051A1 (ja) | パターン構造体の製造方法 |