JP2010283979A - Electric circuit device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent malfunction and damage of a switching element or the like. <P>SOLUTION: An electronic device 4 which is resin-sealed with the switching element or the like is mounted to a plurality of conductive plate materials 31 to 33 to which terminals on the side of a power supply or an electric load are fitted. Bends are formed at the conductive plate materials 31 to 33, and the conductive plate materials are held by a hold mold part 6 different from the electronic device 4 in regions including the bends. Since mechanical loads acting on the conductive plate materials 31 to 33 can reliably be received by engagement between the bends and the hold mold part 6, the mechanical loads acting on the conductive plate material 31 to 33 are not imposed on the electronic device 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electric circuit device that opens and closes between a power source and an electric load.

  Conventionally, as an electric circuit device of this type, a switching element that opens and closes between a power source and an electric load, a conductive plate made of a metal plate on which the switching element is mounted, and a control member that controls the switching element are made of resin. What was sealed at the mold part is known. In addition, the terminal portion formed at one end of the conductive plate material is exposed from the mold portion, and the terminal on the power source or electric load side is fitted and connected to the terminal portion of the conductive plate material (for example, Patent Documents). 1).

JP 2007-123314 A

  However, when the terminal on the power supply or electric load side and the terminal part of the conductive plate material are attached (that is, when the connector is attached or detached), the conductive plate material is pushed toward the mold part or pulled away from the mold part. As a result, a mechanical load acts on the conductive plate material. Further, even when the power supply or electric load side terminal and the terminal portion of the conductive plate member are fitted and connected, a mechanical load acts on the conductive plate member.

  And the mechanical load which acts on said electrically-conductive board | plate material also reaches a switching element, and a stress generate | occur | produces in a switching element. Further, due to a mechanical load acting on the conductive plate material, the mold part and the conductive plate material are peeled off to generate a gap between the mold part and the conductive plate material, and moisture enters the mold part from the gap.

  As a result, there arises a problem that the switching element or the control member malfunctions or is damaged due to the stress generated in the switching element or the dew condensation of moisture that has entered the mold portion.

  In view of the above points, an object of the present invention is to prevent malfunction and damage of a switching element and a control member.

  In order to achieve the above object, in the invention described in claim 1, the switching element (41) for opening and closing between the power source and the electric load and the control member (42) for controlling the switching element (41) are made of resin. A sealed electronic device (4) and a plurality of conductive plate materials (31 to 33) made of a metal plate material are provided. The electronic device (4) is mounted on the conductive plate material (31 to 33), and a conductive plate material (31 To 33) are formed with terminal portions (311, 321, 331) into which terminals on the power source or electric load side are fitted and connected, and the mounting portion of the electronic device (4) in the conductive plate (31-33) Bent portions (312, 322, 323, 332, 333) are formed between the terminal portions (311, 321, 331), and the plurality of conductive plate members (31-33) are bent portions (312, 322, 323). 332 At the site containing the 333), the electronic device (4), characterized in that it is held by separate holding member (6).

  According to this, since the mechanical load acting on the conductive plate material (31 to 33) is reliably received by the engagement between the bent portions (312, 322, 323, 332, 333) and the holding member (6), The mechanical load acting on the conductive plate (31 to 33) does not reach the electronic device (4). Therefore, it is possible to prevent the generation of stress in the switching element (41) and the intrusion of moisture into the electronic device (4), thereby preventing malfunction and damage of the switching element (41) and the control member (42). it can.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a perspective view which shows the electric circuit apparatus which becomes one Embodiment of this invention. It is A arrow directional view of FIG. It is a perspective view of the bus bar 3 and the coupling mold part 6. FIG. 3 is a plan view showing a shape of a bus bar 3. FIG. FIG. 3 is a plan view showing a part of the electronic device 4 in a transparent manner. It is an exploded perspective view of an electric circuit device. It is a figure which shows the 1st modification of the electric circuit apparatus which becomes one Embodiment. It is a perspective view which shows the 2nd modification of the electric circuit apparatus which becomes one Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The electric circuit device according to the present embodiment is used as a control device that controls an electric load such as an automobile lamp or a motor.

  FIG. 1 is a perspective view showing an electric circuit device according to an embodiment of the present invention, and FIG. 2 is a view taken in the direction of arrow A in FIG. As shown in FIGS. 1 and 2, a large number of electrical components 2 such as mechanical relays are mounted on the printed circuit board 1, and an electronic device 4 (detailed later) is mounted on the bus bar 3. Further, the printed circuit board 1 and the bus bar 3 are arranged in two layers. Furthermore, the printed circuit board 1 and the bus bar 3 are inserted into the first to third connectors 51 to 53.

  The first connector 51 performs electrical connection between an electric circuit device and a power source (not shown), and a mating connector (not shown) connected to the power source is inserted therein. The second connector 52 and the third connector 53 perform electrical connection between the electric circuit device and an external electric load (not shown) or GND, and a mating connector (not shown) connected to the electric load or GND. It is supposed to be inserted.

  3 is a perspective view of the bus bar 3 and the holding mold portion 6, and FIG. 4 is a plan view showing the shape of the bus bar 3 alone. As shown in FIGS. 3 and 4, the bus bar 3 is covered at a predetermined portion by a holding mold portion 6 as a holding member formed by resin insert molding or heat caulking.

  The bus bar 3 is divided into a large number of conductive plate materials by punching and bending one conductive metal plate material. Specifically, the bus bar 3 is connected to one first conductive plate member 31 connected to the first connector 51, a plurality of second conductive plate members 32 connected to the second connector 52, and the third connector 53. A plurality of third conductive plate members 33 and a plurality of fourth conductive plate members 34 connected to the printed circuit board 1 are divided.

  However, all the conductive plate members are connected before the molding. And the penetration part 61 is formed by the punching process after mold forming, and the connected site | part is removed. The divided conductive plate material is integrally held by the holding mold portion 6.

  One end side of the first conductive plate material 31 protrudes from the holding mold portion 6, and a connector terminal portion 311 that is inserted into the first connector 51 and is connected to the power supply side terminal is formed at the protruding side end portion. Has been. The other end side of the first conductive plate material 31 is exposed to the penetrating portion 61 of the holding mold portion 6.

  One end sides of the second conductive plate member 32 and the third conductive plate member 33 protrude from the holding mold portion 6, and the protruding side end portion is inserted into the second connector 52 or the third connector 53 to be connected to the electric load or the GND side. Connector terminal portions 321 and 331 are formed to which the terminals are fitted and connected. The other end sides of the second conductive plate member 32 and the third conductive plate member 33 are exposed to the penetrating portion 61 of the holding mold portion 6.

  One end side of the fourth conductive plate member 34 protrudes from the holding mold portion 6, and the protruding portion is bent at a substantially right angle by a bending portion 341 by bending. A board connection terminal part 342 that is inserted into the insertion hole of the printed board 1 and connected to the wiring pattern of the printed board 1 is formed on the tip side of the bent part 341. The other end side of the fourth conductive plate member 34 is exposed to the penetrating portion 61 of the holding mold portion 6.

  Of the first to third conductive plate members 31 to 33, punched bent portions 312, 322, and 332 punched into a shape bent substantially at right angles by punching are formed at portions covered by the holding mold portion 6. Yes.

  Between the connector terminal portions 321 and 331 and the punched bent portions 322 and 332 in the second conductive plate member 32 and the third conductive plate member 33, the bent portions 323 and 333 are bent at the substantially right angles by two bending portions 323 and 333. It is bent (see FIG. 2). These bent portions 323 and 333 are covered with the holding mold portion 6.

  In other words, the first to third conductive plate members 31 to 33 are held by the holding mold portion 6 at a portion including the punched bent portions 312, 322, and 332 and the bent bent portions 323 and 333.

  A portion of the first conductive plate material 31 that protrudes from the holding mold portion 6 is bent at a substantially right angle by a bending portion 313 by bending. Further, a board connection terminal part 314 that is inserted into the insertion hole of the printed board 1 and connected to the wiring pattern of the printed board 1 is formed between the bent part 313 and the connector terminal part 311 in the first conductive plate material 31. Has been.

  Since the second conductive plate member 32 and the third conductive plate member 33 are bent at the bent portions 323 and 333, the vertical dimension between the printed circuit board 1 and the bus bar 3 is increased as shown in FIG. Can do.

  FIG. 5 is a plan view showing the electronic device 4 in a partially transparent manner. As shown in FIG. 5, the electronic device 4 includes a plurality (8 in this example) of MOSFETs 41 as switching elements that open and close between a power source and an electric load, and further controls the switching operation of these MOSFETs 41. IC 42 as a control member is provided. The MOSFET 41 and the IC 42 are electrically connected to the lead 44 by a bonding wire 43. The MOSFET 41 and the IC 42 are sealed by a sealing mold part 45 formed by resin molding.

  Next, a method for assembling the electric circuit device will be described. FIG. 6 is an exploded perspective view of the electric circuit device. As shown in FIG. 6, a large number of terminals 54 to be connected to the wiring pattern of the printed circuit board 1 later are inserted into holes at predetermined positions of the first to third connectors 51 to 53 to prepare connector subassemblies. . Moreover, although not shown in figure, the electrical component 2 is mounted in the printed circuit board 1, and a printed circuit board subassembly is prepared.

  Further, the electronic device 4 is mounted on the bus bar 3 to prepare a bus bar subassembly. Specifically, the electronic device 4 is arranged in the penetration part 61 (see FIG. 3) of the holding mold part 6, and the lead 44 (see FIG. 5) of the electronic device 4 and the first to fourth conductive plate members 31 to 34 are arranged. Join by laser welding. The lower surface of the electronic device 4 is brought into contact with the first conductive plate material 31 so that the heat of the electronic device 4 is radiated through the first conductive plate material 31.

  Then, the connector terminal portions 311, 321, and 331 of the first to third conductive plate members 31 to 33 are press-fitted into holes at predetermined positions of the first to third connectors 51 to 53, and the connector subassembly and the bus bar subassembly are assembled. Integrate.

  Subsequently, the terminal 54 of the first to third connectors 51 to 53, the board connection terminal portion 314 of the first conductive plate material 31, and the board connection terminal portion 342 of the fourth conductive plate material 34 are inserted into the insertion holes of the printed board 1. Then, it is electrically connected to the wiring pattern of the printed circuit board 1 by soldering or the like. This completes the assembly of the electric circuit device (see FIG. 1).

  In the present embodiment, the mechanical loads acting on the first to third conductive plate members 31 to 33 connected to the power supply or electric load side terminals are punched bent portions 312, 322 and 332 and bent bent portions 323 and 333. Therefore, the mechanical load acting on the first to third conductive plate members 31 to 33 does not reach the electronic device 4. Therefore, generation of stress in the MOSFET 41 and moisture intrusion into the sealing mold portion 45 can be prevented, and consequently malfunction and damage of the MOSFET 41 and the IC 42 can be prevented.

  Since the electronic device 4 is mounted on the bus bar 3, the degree of freedom of arrangement of the electrical components 2 mounted on the printed board 1 and the arrangement of the printed board 1 is high.

  Since the electronic device 4 is not mounted on the printed circuit board 1, the electronic device 4 is not subject to the limit temperature restriction of the printed circuit board 1.

  Since the electronic device 4 is not mounted on the printed circuit board 1, the heat of the electronic device 4 is not easily transmitted to the printed circuit board 1.

  Since the bent portion 341 is formed in the fourth conductive plate member 34, the fourth conductive plate member 34 can be easily bent under a thermal cycle environment.

  In the above embodiment, the second conductive plate member 32 and the third conductive plate member 33 are bent at the bent portions 323 and 333, but it is not necessary to increase the vertical dimension between the printed circuit board 1 and the bus bar 3. As in the first modification shown in FIG. 7, the bent portions 323 and 333 may be eliminated.

  Moreover, in the said embodiment, although the board | substrate connection terminal part 314 of the 1st electroconductive board | plate material 31 and the board | substrate connection terminal part 342 of the 4th electroconductive board | plate material 34 were inserted in the insertion hole of the printed circuit board 1, FIG. As shown in the second modification example, the board connection terminal portion 314 of the first conductive plate material 31 and the board connection terminal portion 342 of the fourth conductive plate material 34 are brought into contact with the surface of the printed circuit board 1 facing the bus bar 3, You may make it electrically connect with the wiring pattern of the printed circuit board 1 by soldering.

4 Electronic device 6 Holding mold part (holding member)
31 conductive plate material 32 conductive plate material 33 conductive plate material 41 MOSFET (switching element)
42 IC (Control member)
311 Terminal portion 312 Bending portion 321 Terminal portion 322 Bending portion 323 Bending portion 331 Terminal portion 332 Bending portion 333 Bending portion

Claims (2)

An electronic device (4) in which a switching element (41) for opening and closing between a power source and an electric load and a control member (42) for controlling the switching element (41) are sealed with resin;
A plurality of conductive plate materials (31 to 33) made of a metal plate material,
The electronic device (4) is mounted on the conductive plate (31 to 33),
Terminal portions (311, 321, 331) to which the terminals on the power source or electric load side are fitted and connected are formed at the ends of the conductive plate members (31-33),
Bent portions (312, 322, 323, 332, 333) are formed between the mounting portions of the electronic device (4) in the conductive plate members (31-33) and the terminal portions (311, 321, 331),
The plurality of conductive plate members (31 to 33) are held by a holding member (6) separate from the electronic device (4) at a portion including the bent portions (312, 322, 323, 332, 333). An electric circuit device characterized by being made.   The electric circuit device according to claim 1, wherein the holding member is made of resin.