JP2010281463A - Soluble plug - Google Patents
Soluble plug Download PDFInfo
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- JP2010281463A JP2010281463A JP2009132678A JP2009132678A JP2010281463A JP 2010281463 A JP2010281463 A JP 2010281463A JP 2009132678 A JP2009132678 A JP 2009132678A JP 2009132678 A JP2009132678 A JP 2009132678A JP 2010281463 A JP2010281463 A JP 2010281463A
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- solder alloy
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- soluble
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- 229910045601 alloy Inorganic materials 0.000 claims abstract description 36
- 239000000956 alloy Substances 0.000 claims abstract description 36
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052738 indium Inorganic materials 0.000 claims abstract description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- 230000004323 axial length Effects 0.000 claims abstract 2
- 238000011109 contamination Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000383 hazardous chemical Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 14
- 230000008018 melting Effects 0.000 description 13
- 238000005057 refrigeration Methods 0.000 description 11
- 239000003507 refrigerant Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000003673 groundwater Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明は、可溶栓に関し、特に、冷凍装置において、高温、高圧となる液溜まりやアキュムレータ等に使用される可溶栓に関する。 The present invention relates to a fusible plug, and more particularly to a fusible plug used for a high temperature and high pressure liquid reservoir, an accumulator or the like in a refrigeration apparatus.
従来、冷凍装置内の高温、高圧となる液溜まりやアキュムレータ等において、装置(アキュムレータ等)内の圧力上昇や冷媒の温度上昇による本体の破損を防止するため、可溶栓が使用されている。この可溶栓は、本体に穿設された貫通孔と、この貫通孔に気密性を確保しながら充填されるはんだ合金等で構成され、装置内が所定の温度に達した場合には、貫通孔に充填されたはんだ合金が溶融して内部の冷媒を外部に放出することにより、装置の破損を防止している。 Conventionally, in high temperature and high pressure liquid reservoirs and accumulators in a refrigeration apparatus, fusible stoppers have been used to prevent damage to the main body due to an increase in pressure in the apparatus (accumulator or the like) or an increase in refrigerant temperature. This fusible plug is composed of a through-hole drilled in the main body and a solder alloy that fills the through-hole while ensuring airtightness. The solder alloy filled in the holes is melted and the internal coolant is discharged to the outside, thereby preventing damage to the apparatus.
しかし、本体内部の貫通孔に充填されるはんだ合金が、鉛やカドミウム等の有害物質を含んでいると、可溶栓を適用した装置が廃棄処分された場合、鉛やカドミウム等が水に溶解し、地下水等を汚染するという問題があった。 However, if the solder alloy filled in the through-hole inside the main body contains harmful substances such as lead and cadmium, when the device to which the fusible stopper is applied is disposed of, the lead and cadmium will dissolve in water. However, there was a problem of contaminating groundwater.
そこで、特許文献1には、本体内に充填するはんだ合金が、錫(Sn)、ビスマス(Bi)、インジウム(In)、亜鉛(Zn)及びガリウム(Ga)からなる群から選択される二種以上の金属からなる可溶栓が提案されている。 Therefore, in Patent Document 1, two types of solder alloys filled in the main body are selected from the group consisting of tin (Sn), bismuth (Bi), indium (In), zinc (Zn), and gallium (Ga). A fusible stopper made of the above metal has been proposed.
しかし、特許文献1に記載の可溶栓においては、可溶栓を適用した装置を廃棄処分しても地下水等を汚染することはないが、58℃〜65℃の温度域でのクリープ特性が悪いため、冷凍装置内が所定の温度に達して可溶栓が作動する前に、冷凍装置内の圧力によってはんだ合金が押し出されてしまう虞があり、改善の余地があった。 However, the fusible plug described in Patent Document 1 does not contaminate groundwater or the like even if the device to which the fusible plug is applied is disposed of, but has a creep characteristic in a temperature range of 58 ° C to 65 ° C. Since it is bad, there is a possibility that the solder alloy may be pushed out by the pressure in the refrigeration apparatus before the fusible stopper is actuated when the inside of the refrigeration apparatus reaches a predetermined temperature, and there is room for improvement.
また、近年、オゾン層の破壊防止を考慮して、フロンではなく二酸化炭素を冷媒として使用しているが、二酸化炭素を冷媒として使用した場合には、冷凍装置内が従来よりさらに高圧となるため、高圧雰囲気に耐えうるクリープ特性を有するはんだ合金の開発が求められていた。 In recent years, carbon dioxide instead of chlorofluorocarbon has been used as a refrigerant in consideration of preventing the destruction of the ozone layer. However, when carbon dioxide is used as a refrigerant, the inside of the refrigeration apparatus has a higher pressure than before. Therefore, development of a solder alloy having creep characteristics that can withstand a high-pressure atmosphere has been demanded.
そこで、本発明は、上記従来の技術における問題点に鑑みてなされたものであって、鉛等の有害物質を含むことなく、58℃〜65℃の温度域でのクリープ特性に優れた可溶栓を提供することを目的とする。 Therefore, the present invention has been made in view of the problems in the above-described conventional technology, and does not contain harmful substances such as lead, and has excellent creep characteristics in a temperature range of 58 ° C. to 65 ° C. The purpose is to provide a stopper.
上記目的を達成するため、本発明は、可溶栓であって、プラグ状の本体内の貫通孔に、銀1.5質量%以上2.5質量%以下、ビスマス33質量%以上35質量%以下、インジウム63質量%以上65質量%以下の組成を有するはんだ合金を充填したことを特徴とする。 In order to achieve the above-mentioned object, the present invention is a fusible plug, wherein 1.5 mass% to 2.5 mass% of silver, 33 mass% to 35 mass% of bismuth are formed in the through hole in the plug-shaped body. Hereinafter, a solder alloy having a composition of 63% by mass to 65% by mass of indium is filled.
そして、本発明によれば、銀、ビスマス及びインジウムではんだ合金を組成しているため、鉛やカドミウム等の有害物質を含まず、可溶栓を適用した装置を廃棄処分しても地下水等を汚染することがない。また、58℃〜65℃の温度域ではんだ合金が優れたクリープ特性を発揮し、作動温度に達する前に装置の内圧で押し出されるのを防止することができる。さらに、69℃〜75℃の温度域(作動すべき温度域)ではんだ合金を溶融させることができ、可溶栓に求められる本来の機能を損なうこともない。加えて、上記組成によりはんだ合金を生成することで、本体内に充填する際の流動性が高くなり、ボイド(気泡)の発生や強度のばらつきを抑制することもできる。 And according to the present invention, since the solder alloy is composed of silver, bismuth and indium, it does not contain harmful substances such as lead and cadmium, and even if the device to which the fusible stopper is applied is disposed of, groundwater etc. There is no contamination. In addition, the solder alloy exhibits excellent creep characteristics in the temperature range of 58 ° C. to 65 ° C., and can be prevented from being pushed out by the internal pressure of the apparatus before reaching the operating temperature. Furthermore, the solder alloy can be melted in a temperature range of 69 ° C. to 75 ° C. (temperature range to be operated), and the original function required for the fusible stopper is not impaired. In addition, by producing a solder alloy with the above composition, the fluidity when filling the body is increased, and generation of voids (bubbles) and variation in strength can be suppressed.
前記可溶栓において、前記はんだ合金を、前記本体内の内径4mm以上7mm以下の貫通孔に充填することができる。貫通孔の内径が4mmに達しないと、貫通孔にはんだ合金を充填することが困難であり、貫通孔の内径が7mmを超えると、上記優れたクリープ特性を実現することができない。 In the fusible plug, the solder alloy can be filled into a through hole having an inner diameter of 4 mm to 7 mm in the main body. If the inner diameter of the through hole does not reach 4 mm, it is difficult to fill the through hole with a solder alloy. If the inner diameter of the through hole exceeds 7 mm, the above-described excellent creep characteristics cannot be realized.
前記可溶栓において、前記はんだ合金を、前記本体内の軸線方向の全長が25mm以上の貫通孔に充填することができる。これにより、上記温度域で、優れたクリープ特性を得ることができる。 In the fusible stopper, the solder alloy can be filled into a through hole having an axial total length of 25 mm or more in the main body. Thereby, excellent creep characteristics can be obtained in the above temperature range.
以上のように、本発明によれば、鉛等の有害物質を含むことなく、58℃〜65℃の温度域でのクリープ特性に優れた可溶栓を提供することができる。 As described above, according to the present invention, it is possible to provide a fusible stopper excellent in creep characteristics in a temperature range of 58 ° C. to 65 ° C. without containing harmful substances such as lead.
次に、本発明を実施するための形態について、図面を参照しながら詳細に説明する。 Next, an embodiment for carrying out the present invention will be described in detail with reference to the drawings.
図1は、本発明にかかる可溶栓の一実施の形態を示し、この可溶栓1は、プラグ状に形成され、内部に貫通孔を有する本体2に、レンチ係合部2aと、冷凍装置の高圧側付属機器の凝縮器や受液器等、あるいは、前記の高圧側となる液溜まり部やアキュムレータ等(以下、「被接続箇所」という)に設けられた雌ねじ部と螺合接続するための第1雄ねじ部2bと、冷凍装置の配管の一部(冷凍装置内が高温、高圧となって可溶栓が作動し、外部に冷媒が放出される場合に、冷凍装置周辺の作業者に影響がない場所に冷媒を導くためのもの)の雌ねじ部と螺合接続するための第2雄ねじ部2cと、本体2の内壁面に形成される環状溝2dと、貫通孔に充填され、装置内が所定の温度に達した場合等に溶融する低融点合金3とを設けて構成される。
FIG. 1 shows an embodiment of a fusible plug according to the present invention. The fusible plug 1 is formed in a plug shape, and has a wrench engaging portion 2a, a freezing unit, a
本体2は、その全長Lが25mm以上となるように、また、内部に設けられた貫通孔の直径φaが4mm以上7mm以下となるように形成される。これらにより、本体2の貫通孔へのはんだ合金の充填が容易で、かつ、58℃〜65℃の温度域で優れたクリープ特性を得ることができる。
The
環状溝2dは、本体2の内壁面に環状に形成され、本体2と低融点合金3との接着面積を大きくする役割を担う。これにより、本体2と低融点合金3との接着強度が強化され、低融点合金3の剥離を防止するとともに、装置内の圧力が急激に上昇した場合に、低融点合金3が勢いよく飛び出すことを防止する。
The
低融点合金3は、銀(Ag)1.5質量%以上2.5質量%以下、ビスマス(Bi)33質量%以上35質量%以下、インジウム(In)63質量%以上65質量%以下の組成を有するはんだ合金である。この低融点合金3の組成が本発明の特徴部分であり、これにより、上記温度域で優れたクリープ特性を得ることができる。また、上記組成により低融点合金3を生成した場合には、本体2内に充填する際の流動性が高くなり、ボイド(気泡)の発生や強度のばらつきを抑制することもできる。
The low melting point alloy 3 is composed of 1.5% by mass to 2.5% by mass of silver (Ag), 33% by mass to 35% by mass of bismuth (Bi), and 63% by mass to 65% by mass of indium (In). It is a solder alloy having The composition of the low melting point alloy 3 is a characteristic part of the present invention, whereby excellent creep characteristics can be obtained in the above temperature range. Further, when the low melting point alloy 3 is generated with the above composition, the fluidity when filling the
上記実施の形態においては、可溶栓1を第1の雄ねじ部2b及び第2の雄ねじ部2cを介して、冷凍装置の前記被接続箇所及び前記配管と各々接続したが、例えば、前記配管が必要でないユニットの場合には、図2に示すような可溶栓11を構成し、雄ねじ部12を冷凍装置の前記被接続箇所に設けられた雌ねじ部と螺合することにより、可溶栓11を装着することもできる。尚、可溶栓11の構成要素であって、図1に記載の可溶栓1と同一の機能を有する構成要素については、同一の符号を付している。
In the above embodiment, the fusible plug 1 is connected to the connected portion of the refrigeration apparatus and the pipe via the first
5台の装置の各々において、装置内圧を4.2MPaに維持し、可溶栓全体をグリセリン液中に浸漬した後、昇温速度を1℃/minとして装置内の温度を上昇させた。尚、低融点合金3の組成は、銀(2質量%)、ビスマス(34質量%)及びインジウム(64質量%)とした。試験の結果、いずれの可溶栓においても、69℃〜75℃の温度範囲で低融点合金3が溶融した。 In each of the five devices, the internal pressure of the device was maintained at 4.2 MPa, and the entire soluble stopper was immersed in the glycerin solution, and then the temperature inside the device was increased at a rate of temperature increase of 1 ° C./min. The composition of the low melting point alloy 3 was silver (2% by mass), bismuth (34% by mass), and indium (64% by mass). As a result of the test, the low melting point alloy 3 was melted in the temperature range of 69 ° C. to 75 ° C. in any of the soluble stoppers.
また、上記装置の各々において、可溶栓全体をグリセリン液中に浸漬した後、可溶栓を装置に2ヶ月間装着させた状態で、低融点合金3の飛び出しの有無を試験した。この際、装置の内圧は4.2MPaに維持し、また、装置内の温度は、可溶栓が作動すべき温度より低い65℃に設定した。試験の結果、いずれの可溶栓においても、低融点合金3の飛び出しは認められなかった。 In each of the above devices, the entire soluble stopper was immersed in a glycerin solution, and then the low melting point alloy 3 was tested for popping out with the soluble stopper attached to the device for two months. At this time, the internal pressure of the apparatus was maintained at 4.2 MPa, and the temperature in the apparatus was set to 65 ° C., which is lower than the temperature at which the fusible plug should operate. As a result of the test, the low-melting point alloy 3 did not pop out in any of the soluble stoppers.
以上の通り、本発明によれば、(a)69℃〜75℃の温度域で低融点合金3が溶融し、作動すべき温度域で確実に作動する、(b)作動すべき温度域より低い温度域(58℃〜65℃)において、冷凍装置の内圧(4.2MPa)により低融点合金3が飛び出すことがない、の両要件を満足する可溶栓を実現することができた。 As described above, according to the present invention, (a) the low melting point alloy 3 melts in the temperature range of 69 ° C. to 75 ° C., and operates reliably in the temperature range to be operated. In a low temperature range (58 ° C. to 65 ° C.), it was possible to realize a fusible stopper satisfying both requirements that the low melting point alloy 3 does not pop out due to the internal pressure (4.2 MPa) of the refrigeration apparatus.
1 可溶栓
2 本体
2a レンチ係合部
2b 第1雄ねじ部
2c 第2雄ねじ部
2d 環状溝
11 可溶栓
12 雄ねじ部
DESCRIPTION OF SYMBOLS 1
Claims (3)
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JP2009132678A JP5469922B2 (en) | 2009-06-02 | 2009-06-02 | Fusible stopper |
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JP2009132678A JP5469922B2 (en) | 2009-06-02 | 2009-06-02 | Fusible stopper |
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JP2010281463A true JP2010281463A (en) | 2010-12-16 |
JP5469922B2 JP5469922B2 (en) | 2014-04-16 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20220243872A1 (en) * | 2021-01-29 | 2022-08-04 | Nippon Piston Ring Co., Ltd. | Fusible plug |
Citations (6)
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---|---|---|---|---|
JP2001201218A (en) * | 2000-01-24 | 2001-07-27 | Mitsubishi Electric Corp | Fusible plug and refrigerating system mounting the same |
JP2002150906A (en) * | 2000-11-08 | 2002-05-24 | Uchihashi Estec Co Ltd | Alloy-type thermal fuse |
JP2004146228A (en) * | 2002-10-25 | 2004-05-20 | Nec Schott Components Corp | Lead free alloy thermal fuse |
JP2005282764A (en) * | 2004-03-30 | 2005-10-13 | Toyota Motor Corp | Safety valve for high pressure gas tank |
WO2006112015A1 (en) * | 2005-04-14 | 2006-10-26 | Senju Metal Industry Co., Ltd | Alloy for fusible plug and fusible plug |
JP2007303001A (en) * | 2007-07-17 | 2007-11-22 | Senju Metal Ind Co Ltd | Alloy for fusible plug and fusible plug |
-
2009
- 2009-06-02 JP JP2009132678A patent/JP5469922B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001201218A (en) * | 2000-01-24 | 2001-07-27 | Mitsubishi Electric Corp | Fusible plug and refrigerating system mounting the same |
JP2002150906A (en) * | 2000-11-08 | 2002-05-24 | Uchihashi Estec Co Ltd | Alloy-type thermal fuse |
JP2004146228A (en) * | 2002-10-25 | 2004-05-20 | Nec Schott Components Corp | Lead free alloy thermal fuse |
JP2005282764A (en) * | 2004-03-30 | 2005-10-13 | Toyota Motor Corp | Safety valve for high pressure gas tank |
WO2006112015A1 (en) * | 2005-04-14 | 2006-10-26 | Senju Metal Industry Co., Ltd | Alloy for fusible plug and fusible plug |
JP2007303001A (en) * | 2007-07-17 | 2007-11-22 | Senju Metal Ind Co Ltd | Alloy for fusible plug and fusible plug |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220243872A1 (en) * | 2021-01-29 | 2022-08-04 | Nippon Piston Ring Co., Ltd. | Fusible plug |
US11859766B2 (en) * | 2021-01-29 | 2024-01-02 | Nippon Piston Ring Co., Ltd. | Fusible plug |
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JP5469922B2 (en) | 2014-04-16 |
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