JP5537143B2 - Fusible stopper - Google Patents

Fusible stopper Download PDF

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JP5537143B2
JP5537143B2 JP2009283724A JP2009283724A JP5537143B2 JP 5537143 B2 JP5537143 B2 JP 5537143B2 JP 2009283724 A JP2009283724 A JP 2009283724A JP 2009283724 A JP2009283724 A JP 2009283724A JP 5537143 B2 JP5537143 B2 JP 5537143B2
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solder alloy
hole
main
fusible
fusible plug
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JP2011127776A (en
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侯史 細川
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株式会社不二工機
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Description

  The present invention relates to a fusible plug, and more particularly to a fusible plug used for a high temperature and high pressure liquid reservoir, an accumulator or the like in a refrigeration apparatus.

  Conventionally, in high temperature and high pressure liquid reservoirs and accumulators in a refrigeration apparatus, fusible stoppers have been used in order to prevent damage to the apparatus due to increased pressure in the apparatus (accumulator, etc.) and increased refrigerant temperature. This fusible plug is composed of a main body having a through hole and a low melting point solder alloy filled while ensuring airtightness in the through hole. When the inside of the apparatus reaches a predetermined temperature, the through hole The solder alloy filled in is melted and the refrigerant inside the apparatus is discharged to the outside, thereby preventing the apparatus from being damaged.

  However, if the solder alloy filled in the through-hole in the main body contains harmful substances such as lead and cadmium, the fusible plug is activated and melted or the device to which the fusible plug is applied is discarded. In this case, there is a problem that lead, cadmium, and the like dissolve and flow out and contaminate land, groundwater, and the like.

  Therefore, in Patent Document 1, two types of solder alloys filled in the main body are selected from the group consisting of tin (Sn), bismuth (Bi), indium (In), zinc (Zn), and gallium (Ga). A fusible stopper made of a metal containing no lead (Pb) has been proposed.

JP 2002-115940 A

  However, the fusible plug described in Patent Document 1 does not contaminate groundwater or the like even if the device equipped with the fusible plug is discarded, but has a creep characteristic in a temperature range of 58 ° C to 65 ° C. Since it is bad, even before the fusible plug reaches the operating temperature, the solder alloy may be pushed out by the pressure in the refrigeration apparatus, and there is room for improvement.

  In recent years, in consideration of preventing destruction of the ozone layer, carbon dioxide, which is a natural refrigerant rather than chlorofluorocarbon, is sometimes used as a refrigerant. Since the pressure is high (close to the critical pressure), a solder alloy having creep characteristics that can withstand a high pressure atmosphere is required.

  Therefore, the present invention has been made in view of the problems in the above-described conventional technology, and does not contain harmful substances such as lead, and has excellent creep characteristics in a temperature range of 58 ° C. to 65 ° C. The purpose is to provide a stopper.

  In order to achieve the above object, the fusible plug of the present invention comprises a main body having a through hole and a solder alloy filled in the through hole, and the solder alloy is indium (In) 65 ± 2 mass%. , Having a composition comprising copper (Cu) 0.5 ± 0.2 mass%, antimony (Sb) 0.5 ± 0.2 mass% and the balance bismuth (Bi), and harmful substances such as lead (Pb) and It is characterized by not containing tin (Sn).

  The fusible plug of the present invention does not contain any harmful substances such as lead and cadmium, and of course, even if the device equipped with the fusible plug is discarded, it does not contaminate the groundwater etc. By using the alloy, excellent creep characteristics are exhibited in a wide temperature range of 58 ° C. to 65 ° C., and it is possible to prevent the disadvantage that the solder alloy is extruded by the internal pressure in the apparatus before reaching the operating temperature. Furthermore, the solder alloy can be melted in a temperature range of 69 ° C. to 75 ° C., and the original function required for the fusible stopper is not impaired. In addition, by using a solder alloy having the above-described composition, the fluidity when filling the main body is increased, and voids (bubbles) are not generated and the strength is not varied.

  In the fusible plug, the inner diameter of the through hole of the main body is preferably 3 mm or more and 5 mm or less. That is, if the inner diameter of the through hole does not reach 3 mm, it is difficult to fill the through hole with a solder alloy, and if the inner diameter of the through hole exceeds 5 mm, the above-described excellent creep characteristics may not be realized. Because there is.

  In the fusible plug, it is preferable that the total length of the through hole in the axial direction is 37 mm or more. This makes it easier to obtain excellent creep characteristics in the above temperature range.

  As described above, according to the present invention, there is provided a fusible stopper that does not contain harmful substances such as lead, has an operating temperature near 70 ° C., and has excellent creep characteristics in a temperature range of 58 ° C. to 65 ° C. can do.

It is a partially broken sectional view which shows 1st Embodiment of the soluble stopper which concerns on this invention. It is a partially broken sectional view which shows 2nd Embodiment of the soluble stopper which concerns on this invention.

  Next, modes for carrying out the present invention will be described with reference to the drawings.

  FIG. 1A shows an embodiment of a fusible plug according to the present invention. The fusible plug 1 is formed in a plug shape and has a wrench engaging portion on a main body 2 having a through hole 2e inside. 2a and a female screw portion provided in a condenser, a liquid receiver, or the like of a high-pressure side accessory of the refrigeration apparatus, or a liquid reservoir or an accumulator (hereinafter referred to as “connected portion”) on the high-pressure side. The first male screw portion 2b for screw connection and a part of the piping of the refrigeration apparatus (when the inside of the refrigeration apparatus becomes hot and high in pressure and the fusible plug operates and the refrigerant is discharged to the outside, the refrigeration apparatus A second male screw portion 2c for threading connection with a female screw portion for guiding the refrigerant to a place where there is no influence on surrounding workers, an annular groove 2d formed on the inner wall surface of the main body 2, and a through hole 2e, and a solder alloy 3 that melts when the inside of the apparatus reaches a predetermined temperature is provided. Constructed. In addition, as shown in FIG.1 (b), it can replace with the annular groove 2d, and can also provide the screw part 2f.

  The main body 2 is formed so that the total length L thereof is 37 mm or more, and the diameter φa of the through hole 2 e provided therein is 3 mm or more and 5 mm or less. As a result, the solder alloy can be easily filled into the through hole 2e of the main body 2, and excellent creep characteristics can be obtained in a temperature range of 58 ° C to 65 ° C.

  The annular groove 2d or the threaded portion 2f is formed in an annular shape on the inner wall surface of the main body 2 and plays a role of increasing the adhesion area between the main body 2 and the solder alloy 3. Thereby, the adhesive strength between the main body 2 and the solder alloy 3 is strengthened, and the solder alloy 3 is prevented from being peeled off, and when the pressure in the apparatus is rapidly increased, the solder alloy 3 is prevented from jumping out vigorously. .

  The solder alloy 3 does not contain harmful substances such as lead (Pb) and tin (Sn), and indium (In) 65 ± 2 mass%, copper (Cu) 0.5 ± 0.2 mass%, antimony (Sb ) A low melting point metal having a composition of 0.5 ± 0.2 mass% and the balance bismuth (Bi). The composition of the solder alloy 3 is a characteristic part of the present invention, whereby excellent creep characteristics can be obtained in the above temperature range. Further, when the solder alloy 3 is generated with the above composition, the fluidity when filling the main body 2 is increased, and generation of voids (bubbles) and variation in strength can be suppressed.

  In the above embodiment, the fusible plug 1 is connected to the connected portion of the refrigeration apparatus and the pipe via the first male screw portion 2b and the second male screw portion 2c, respectively. In the case of a unit that is not necessary, a fusible plug 11 as shown in FIGS. 2A and 2B is configured, and the male screw portion 12 is screwed with the female screw portion provided at the connected portion of the refrigeration apparatus. Accordingly, the fusible stopper 11 can be attached. In addition, it is the component of the soluble stopper 11, Comprising: The component which has the same function as the soluble stopper 1 of FIG. 1 attaches | subjects the same code | symbol.

  In each of the five devices, the internal pressure of the device was maintained at 4.2 MPa, and the entire soluble stopper was immersed in the glycerin solution, and then the temperature inside the device was increased at a rate of temperature increase of 1 ° C./min. In addition, the solder alloy 3 does not contain tin (Sn), and is composed of 65% by mass of indium (In), 0.5% by mass of copper (Cu), 0.5% by mass of antimony (Sb), and the balance bismuth (Bi). The composition is as follows. As a result of the test, the solder alloy 3 was melted in a temperature range of 69 ° C. to 75 ° C. in any of the soluble stoppers.

  Further, in each of the above devices, the entire soluble plug was immersed in the glycerin solution, and then the presence or absence of the solder alloy 3 was investigated with the soluble plug mounted on the device for two months. At this time, the internal pressure of the apparatus was maintained at 5 to 6.3 MPa, and the temperature in the apparatus was set to 65 ° C., which is lower than the temperature at which the fusible plug should operate. As a result of the test, no jumping out of the solder alloy 3 was observed in any of the soluble stoppers.

  As described above, according to the present invention, (a) the solder alloy 3 melts in the temperature range of 69 ° C. to 75 ° C. and operates reliably in the temperature range to be operated, (b) is lower than the temperature range to be operated. It is possible to obtain a soluble stopper that exhibits excellent creep characteristics in a temperature range (58 ° C. to 65 ° C.) and exhibits the effect that the solder alloy 3 does not pop out due to the internal pressure (5 to 6.3 MPa) of the refrigeration apparatus. did it.

DESCRIPTION OF SYMBOLS 1 Soluble plug 2 Main body 2a Wrench engaging part 2b 1st male screw part 2c 2nd male screw part 2d Annular groove 2e Through-hole 2f Screw part 11 Soluble plug 12 Male screw part

Claims (3)

  1.   A main body having a through hole; and a solder alloy filled in the through hole. The solder alloy includes indium (In) 65 ± 2 mass%, copper (Cu) 0.5 ± 0.2 mass%, A fusible plug characterized by having a composition comprising 0.5% by mass of antimony (Sb) and the balance of bismuth (Bi).
  2.   The inner diameter of the said through-hole is 3 mm or more and 5 mm or less, The soluble stopper of Claim 1 characterized by the above-mentioned.
  3.   3. The fusible plug according to claim 1, wherein the axial length of the through hole is 37 mm or more.
JP2009283724A 2009-12-15 2009-12-15 Fusible stopper Active JP5537143B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009283724A JP5537143B2 (en) 2009-12-15 2009-12-15 Fusible stopper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009283724A JP5537143B2 (en) 2009-12-15 2009-12-15 Fusible stopper

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JP2011127776A JP2011127776A (en) 2011-06-30
JP5537143B2 true JP5537143B2 (en) 2014-07-02

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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002115940A (en) * 2000-10-06 2002-04-19 Senju Sprinkler Kk Fusible stop
JP4136844B2 (en) * 2002-08-30 2008-08-20 富士電機ホールディングス株式会社 Electronic component mounting method
JP4223316B2 (en) * 2003-04-03 2009-02-12 内橋エステック株式会社 Secondary battery fuse
JP4032094B2 (en) * 2007-07-17 2008-01-16 千住金属工業株式会社 Soluble stopper alloy and fusible stopper
JP2009203501A (en) * 2008-02-27 2009-09-10 Fuji Koki Corp Fusible stop

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