JP2010278176A - Optical device, optical scanner, and image formation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical device improved in an environment resistance characteristic without increasing cost. <P>SOLUTION: This optical device includes: a laser chip 110; a package member 120 for holding the laser chip 110 in a region 121 having a circumference surrounded by a wall; and translucent cover glass 140 joined to the package member 120 with an epoxy resin-based adhesive 160 for sealing the region 121 having the circumference surrounded by the wall. The epoxy resin-based adhesive 160 is applied at a uniform width (a) to surround the region 121 surrounded by the wall, and the value of [application width (a) of the epoxy resin-based adhesive 160 relating the adhesion]/[length (4b) of outer periphery of the epoxy resin-based adhesive 160 relating the adhesion] is ≥0.057. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical device, an optical scanning apparatus, and an image forming apparatus, and more specifically, an optical device in which an optical element is held by a package member, an optical scanning apparatus having the optical device, and an image including the optical scanning apparatus. The present invention relates to a forming apparatus.

  In recent years, light-receiving elements such as CCD sensors and CMOS sensors, light-emitting elements such as surface-emitting lasers, and optical elements such as optical scanner elements and optical switching elements using MEMS mirrors have been put into practical use and are used in various optical devices. Yes.

  These optical elements are generally used in a two-dimensional array for efficient use. Since the optical elements that are two-dimensionally arrayed have many signal lines, it is difficult to store them in a general CAN package, and they are mainly stored in a ceramic package.

  The optical element housed in the ceramic package is sealed using a light-transmitting lid member such as glass or sapphire in order to obtain environmental resistance.

  Conventionally, methods such as hermetic seal bonding (for example, see Patent Document 1) and solder bonding (for example, see Patent Document 2) have been used for bonding a ceramic package and a lid member.

  In recent years, in order to reduce the cost, the use of a resin material (resin-based adhesive) has increased for joining the ceramic package and the lid member (see, for example, Patent Document 3).

  However, when the optical device in which the ceramic package and the glass lid member are bonded with a resin adhesive is left in an environmental resistance test apparatus at a temperature of 85 ° C. and a humidity of 85% for 50 hours and then observed at room temperature, Condensation occurred on the inner surface of the translucent lid member. In the optical device, the fogging of the inner surface of the translucent lid member is a fatal defect.

  The inventors have studied various conditions of moisture permeation in the resin, and have obtained new knowledge that the amount of moisture permeation greatly depends on the length of the outer periphery of the joint surface and the width of the joint.

  The present invention has been made on the basis of the novel findings obtained by the inventors described above, and has the following configuration.

  According to a first aspect of the present invention, an optical element, a package member that holds the optical element in a region surrounded by a wall, and a resin material joined to the package member, the periphery is a wall. In an optical device having a light-transmitting lid member that seals an enclosed area, the resin material involved in bonding is applied with a uniform width so as to surround the area enclosed by the wall. And the application width of the resin material participating in the joining / the length of the outer periphery of the application surface of the resin material participating in the joining ≧ 0.057. It is a device.

  According to this, it is possible to improve the environmental resistance without increasing the cost.

  According to a second aspect of the present invention, there is provided an optical scanning device that scans the surface to be scanned with light, the light source having the optical device of the present invention; the deflector that deflects the light from the light source; A scanning optical system for condensing the light deflected by the deflector onto the surface to be scanned.

  According to this, stable optical scanning can be performed without increasing the cost.

  According to a third aspect of the present invention, there is provided at least one image carrier; and at least one optical scanning device according to the invention that scans the at least one image carrier with light including image information. An image forming apparatus provided.

  According to this, it is possible to form a high-quality image without increasing the cost.

It is a figure for demonstrating schematic structure of the laser printer which concerns on one Embodiment of this invention. It is the schematic which shows the optical scanning device in FIG. It is FIG. (1) for demonstrating an optical device. It is FIG. (2) for demonstrating an optical device. It is FIG. (3) for demonstrating an optical device. It is FIG. (4) for demonstrating an optical device. It is a figure for demonstrating a laser chip. It is a figure for demonstrating the arrangement state of the several light emission part in a laser chip. It is a figure for demonstrating the structure of each light emission part. It is a figure for demonstrating the shape of a cover glass. It is a figure (the 1) for demonstrating the shape of the application surface of an adhesive agent. It is FIG. (2) for demonstrating the shape of the application surface of an adhesive agent. It is a figure for demonstrating the part in connection with joining in an adhesive agent. It is FIG. (1) for demonstrating the relationship between the shape of an application surface, and a lifetime. It is FIG. (2) for demonstrating the relationship between the shape of an application surface, and a lifetime. It is a figure for demonstrating the modification 1 of the joining state of a package member and a cover glass. It is a figure for demonstrating the modification 2 of the joining state of a package member and a cover glass. It is a figure for demonstrating the modification 3 of the joining state of a package member and a cover glass. It is FIG. (1) for demonstrating the modification of an optical device. It is FIG. (2) for demonstrating the modification of an optical device. It is FIG. (3) for demonstrating the modification of an optical device. It is FIG. (1) for demonstrating the shape of the application surface of the adhesive agent in the modification of an optical device. It is FIG. (2) for demonstrating the shape of the application surface of the adhesive agent in the modification of an optical device. 1 is a diagram illustrating a schematic configuration of a color printer.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a schematic configuration of a laser printer 1000 according to an embodiment.

  The laser printer 1000 includes an optical scanning device 1010, a photosensitive drum 1030, a charging charger 1031, a developing roller 1032, a transfer charger 1033, a charge eliminating unit 1034, a cleaning unit 1035, a toner cartridge 1036, a paper feeding roller 1037, a paper feeding tray 1038, A registration roller pair 1039, a fixing roller 1041, a paper discharge roller 1042, a paper discharge tray 1043, a communication control device 1050, a printer control device 1060 that comprehensively controls the above-described units, and the like are provided. These are housed in predetermined positions in the printer housing 1044.

  The communication control device 1050 controls bidirectional communication with a host device (for example, a personal computer) via a network or the like.

  The photosensitive drum 1030 is a cylindrical member, and a photosensitive layer is formed on the surface thereof. That is, the surface of the photoconductor drum 1030 is a scanned surface. The photosensitive drum 1030 rotates in the direction of the arrow in FIG.

  The charging charger 1031, the developing roller 1032, the transfer charger 1033, the charge removal unit 1034, and the cleaning unit 1035 are each disposed in the vicinity of the surface of the photosensitive drum 1030. Then, along the rotation direction of the photosensitive drum 1030, the charging charger 1031 → the developing roller 1032 → the transfer charger 1033 → the discharging unit 1034 → the cleaning unit 1035 are arranged in this order.

  The charging charger 1031 uniformly charges the surface of the photosensitive drum 1030.

  The optical scanning device 1010 scans the surface of the photosensitive drum 1030 charged by the charging charger 1031 with a light beam modulated based on image information from the host device, and corresponds to the image information on the surface of the photosensitive drum 1030. A latent image is formed. The latent image formed here moves in the direction of the developing roller 1032 as the photosensitive drum 1030 rotates. The configuration of the optical scanning device 1010 will be described later.

  The toner cartridge 1036 stores toner, and the toner is supplied to the developing roller 1032.

  The developing roller 1032 causes the toner supplied from the toner cartridge 1036 to adhere to the latent image formed on the surface of the photosensitive drum 1030 to visualize the image information. Here, the latent image to which the toner is attached (hereinafter also referred to as “toner image” for the sake of convenience) moves in the direction of the transfer charger 1033 as the photosensitive drum 1030 rotates.

  Recording paper 1040 is stored in the paper feed tray 1038. A paper feed roller 1037 is disposed in the vicinity of the paper feed tray 1038, and the paper feed roller 1037 takes out the recording paper 1040 one by one from the paper feed tray 1038 and conveys it to the registration roller pair 1039. The registration roller pair 1039 temporarily holds the recording paper 1040 taken out by the paper supply roller 1037, and in the gap between the photosensitive drum 1030 and the transfer charger 1033 according to the rotation of the photosensitive drum 1030. Send it out.

  A voltage having a polarity opposite to that of the toner is applied to the transfer charger 1033 in order to electrically attract the toner on the surface of the photosensitive drum 1030 to the recording paper 1040. With this voltage, the toner image on the surface of the photosensitive drum 1030 is transferred to the recording paper 1040. The recording sheet 1040 transferred here is sent to the fixing roller 1041.

  In the fixing roller 1041, heat and pressure are applied to the recording paper 1040, whereby the toner is fixed on the recording paper 1040. The recording paper 1040 fixed here is sent to the paper discharge tray 1043 via the paper discharge roller 1042 and is sequentially stacked on the paper discharge tray 1043.

  The neutralization unit 1034 neutralizes the surface of the photosensitive drum 1030.

  The cleaning unit 1035 removes the toner remaining on the surface of the photosensitive drum 1030 (residual toner). The surface of the photosensitive drum 1030 from which the residual toner has been removed returns to the position facing the charging charger 1031 again.

  Next, the configuration of the optical scanning device 1010 will be described.

  As shown in FIG. 2 as an example, the optical scanning device 1010 includes a deflector-side scanning lens 11a, an image plane-side scanning lens 11b, a polygon mirror 13, a light source 14, a coupling lens 15, an aperture plate 16, and a cylindrical lens 17. , A reflection mirror 18, a scanning control device (not shown), and the like. These are assembled at predetermined positions of the optical housing 30.

  In this specification, in the XYZ three-dimensional orthogonal coordinate system, the direction along the longitudinal direction of the photosensitive drum 1030 is defined as the Y-axis direction, and the direction along the optical axis of each scanning lens (11a, 11b) is defined as the X-axis direction. explain.

  For convenience, the direction corresponding to the main scanning direction is abbreviated as “main scanning corresponding direction”, and the direction corresponding to the sub scanning direction is abbreviated as “sub scanning corresponding direction”.

  As shown in FIGS. 3 to 6 as an example, the light source 14 includes an optical device 100 including a laser chip 110, a package member 120 that holds the laser chip 110, and a cover glass 140. 4 is a cross-sectional view taken along the line AA in FIG. FIG. 5 is a view when the cover glass 140 in FIG. 3 is removed.

  The package member 120 is a ceramic package member, and the surface on the + X side has a recess 121 at the center. A metal plate 128 is provided on the bottom surface of the recess 121. The metal plate 128 is electrically connected to the package electrode 127 provided on the −X side surface of the package member 120.

  The indented portion 121 has a two-step step structure, and a plurality of (here, 32) package electrodes 126 are provided on the step portion on the −X side (first step portion). Yes. Each package electrode 126 is exposed to the −X side surface through the side surface of the package member 120. As shown in FIG. 6, on the −X side surface of the package member 120, the package electrode 127 is located at the center and the plurality of package electrodes 126 are located at the periphery.

  The laser chip 110 is held on the metal plate 128 at the substantially center of the bottom surface of the indented portion 121. That is, the laser chip 110 is held in a region surrounded by a wall.

  Then, the cover glass 140 is bonded to the step portion (second step portion) on the + X side of the dent portion 121 with an epoxy resin adhesive 160 so as to cover the region where the laser chip 110 is held. Thereby, the laser chip 110 is protected.

  The cover glass 140 is an optical glass transparent to the light emitted from the laser chip 110, and at least one surface is coated with an antireflection film.

  The epoxy resin adhesive 160 is a thermosetting adhesive. Here, an epoxy sealer resin (model number: NCO-150SZ) manufactured by Kyocera Corporation containing 45% by weight or more of a bisphenol A type epoxy resin was used.

  The laser chip 110 is electrically connected to a plurality of package electrodes 126 by a plurality of bonding wires 150. In FIG. 5, the bonding wire 150 is not shown.

  As shown in FIG. 7 as an example, the laser chip 110 is provided around 32 light emitting units arranged in a two-dimensional manner and 32 light emitting units, and 32 light sources corresponding to the respective light emitting units. It has an electrode pad. Each electrode pad is electrically connected to the corresponding light emitting portion by a wiring member. Each electrode pad is electrically connected to the corresponding package electrode 126 by a bonding wire 150.

  As shown in FIG. 8, the 32 light emitting units have the same light emitting unit interval (“c” in FIG. 8) when all the light emitting units are orthogonally projected onto a virtual line extending in the Z-axis direction. Has been placed. In this specification, the “light emitting portion interval” refers to the distance between the centers of two light emitting portions. Here, as an example, c = 2.3 μm. Further, the interval between the light emitting portions in the Y-axis direction (X in FIG. 8) is 30 μm, and the interval between the light emitting portions in the Z-axis direction (d in FIG. 8) is 18.4 μm.

  Each light emitting unit is a vertical cavity surface emitting laser having an oscillation wavelength of 780 nm. That is, the laser chip 110 is a surface emitting laser array chip.

  As shown in FIG. 9 as an example, each light emitting unit includes a substrate 101, a buffer layer 102, a lower semiconductor DBR 103, a lower spacer layer 104, an active layer 105, an upper spacer layer 106, an upper semiconductor DBR 107, a contact layer 109, and the like. is doing.

  The substrate 101 is an n-GaAs single crystal substrate.

  The buffer layer 102 is laminated on the + X side surface of the substrate 101 and is a layer made of n-GaAs.

The lower semiconductor DBR 103 is stacked on the surface of the buffer layer 102 on the + X side, and includes a low refractive index layer made of n-Al _0.93 Ga _0.07 As and n-Al _0.3 Ga _0.7 As. There are 42.5 pairs of high refractive index layers. A composition gradient layer is provided between the refractive index layers. Each refractive index layer includes half of the adjacent composition gradient layer, and is set to have an optical thickness of λ / 4 when the oscillation wavelength is λ. When the optical thickness is λ / 4, the actual thickness D of the layer is D = λ / 4n (where n is the refractive index of the medium of the layer).

The lower spacer layer 104 is laminated on the + X side of the lower semiconductor DBR 103 and is a layer made of non-doped Al _0.33 Ga _0.67 As.

The active layer 105 is stacked on the + X side of the lower spacer layer 104 and is an active layer having a triple quantum well structure made of GaInAsP / Al _0.33 Ga _0.67 As.

The upper spacer layer 106 is laminated on the + X side of the active layer 105 and is a layer made of non-doped Al _0.33 Ga _0.67 As.

  A portion composed of the lower spacer layer 104, the active layer 105, and the upper spacer layer 106 is also called a resonator structure.

The upper semiconductor DBR 107 is stacked on the + X side of the upper spacer layer 106 and has a low refractive index layer made of p-Al _0.93 Ga _0.07 As and a high refractive index made of p-Al _0.33 Ga _0.67 As. It has 32 pairs of layers. A composition gradient layer is provided between the refractive index layers. Each refractive index layer is set to have an optical thickness of λ / 4 including 1/2 of the adjacent composition gradient layer.

In one of the low refractive index layers in the upper semiconductor DBR 107, a selective oxidation layer 108 made of p-Al _0.99 Ga _0.01 As is inserted with a thickness of 30 nm. This selective oxidation layer 108 is inserted in the second pair of low refractive index layers from the upper spacer layer 106.

  The contact layer 109 is stacked on the + X side of the upper semiconductor DBR 107 and is a layer made of p-GaAs.

  Note that a structure in which a plurality of semiconductor layers are stacked on the substrate 101 is also referred to as a “stacked body” for convenience in the following.

  Next, a method for manufacturing the laser chip 110 will be briefly described.

(1) The laminate is formed by crystal growth by metal organic vapor phase epitaxy (MOCVD) or molecular beam epitaxy (MBE).

Here, trimethylaluminum (TMA), trimethylgallium (TMG), and trimethylindium (TMI) are used as Group III materials, and phosphine (PH ₃ ) and arsine (AsH ₃ ) are used as Group V materials. ing. Further, carbon tetrabromide (CBr ₄ ) and dimethyl zinc (DMZn) are used as the raw material for the p-type dopant, and hydrogen selenide (H ₂ Se) is used as the raw material for the n-type dopant.

(2) A square resist pattern having a side of 25 μm corresponding to a desired mesa shape is formed on the surface of the laminate.

(3) Using an ICP dry etching method, a square columnar mesa is formed using the resist pattern as an etching mask. Here, the bottom surface of the etching is located in the lower spacer layer 104.

(4) The etching mask is removed.

(5) The laminated body is heat-treated in water vapor. As a result, Al (aluminum) in the selectively oxidized layer 108 is selectively oxidized from the outer peripheral portion of the mesa, and an unoxidized region 108b surrounded by the Al oxide layer 108a remains in the central portion of the mesa. . In other words, a so-called oxidized constriction structure is formed that restricts the drive current path of the light emitting part only to the central part of the mesa. The non-oxidized region 108b is a current passage region (current injection region).

(6) The protective layer 111 made of SiN, SiON, or SiO ₂ is formed using a vapor phase chemical deposition method (CVD method).

(7) Open a window for the P-side electrode contact on the top of the mesa. Here, after masking with a photoresist, the opening at the top of the mesa was exposed to remove the photoresist at that portion, and the protective layer 111 was etched and opened with BHF.

(8) A square resist pattern having a side of 10 μm is formed in a region to be a light emitting portion on the upper part of the mesa, and a p-side electrode material is deposited. As the electrode material on the p side, a multilayer film made of Cr / AuZn / Au or a multilayer film made of Ti / Pt / Au is used.

(9) The electrode material of the light emitting part is lifted off to form the p-side electrode 113.

(10) After polishing the back side of the substrate 101 to a predetermined thickness (for example, about 100 μm), the n-side electrode 114 is formed. Here, the n-side electrode 114 is a multilayer film made of AuGe / Ni / Au.

(11) Ohmic conduction is established between the p-side electrode 113 and the n-side electrode 114 by annealing. Thereby, the mesa becomes a light emitting part.

(12) Cut for each chip.

  The laser chip 110 manufactured as described above is held by the package member 120 by bonding the n-side electrode 114 to the metal plate 128 of the package member 120 using a conductive adhesive.

  As shown in FIG. 10, the cover glass 140 is a square transparent glass plate with a side length of b.

  The epoxy resin adhesive 160 is applied with a uniform width a along the outer periphery of the cover glass 140 as shown in FIGS. 11 and 12. Then, the cover glass 140 to which the epoxy resin adhesive 160 is applied is placed on the second step portion of the dent portion 121, and is urged in the −Z direction by a spring member from above, the epoxy resin system. The adhesive 160 is cured.

  By the way, as shown in FIG. 13 as an example, the epoxy resin adhesive 160 may protrude. Here, the protruding portion is ignored, and the width of the portion involved in the bonding is a.

  A plurality of optical devices in which at least one of the values of a and b was different were prepared, left in an environmental resistance test apparatus at a temperature of 85 ° C. and a humidity of 85% for various times, and observed at room temperature. And the shortest leaving time (hr) when the inner surface of the cover glass 140 condensed was made into the lifetime. A part of the result is shown in FIG.

  Here, it has been found that when the value of a / (4b) is taken on the horizontal axis and the logarithm of life (hr) is taken on the vertical axis, a linear relationship is obtained as shown in FIG. This relationship is expressed by the following equation (1) using the method of least squares when the value of a / (4b) is x and the lifetime (hr) is y.

  y = 6.0834 · exp (77598x) (1)

  As a standard for high-temperature and high-humidity resistance of optical devices, the EIAJ standard (Japan Electronic Instrument Manufacturers Association standard) stipulates that it can withstand 500 hours in an environment of a temperature of 85 ° C. and a humidity of 85%.

  Therefore, when 500 is substituted for y in the above formula (1), x becomes 0.0568, and it has been found that if the value of a / (4b) is 0.057 or more, the EIAJ standard is satisfied.

  In the present embodiment, a = 2.75 mm and b = 9.7 mm, that is, a / (4b) = 0.071. Therefore, the EIAJ standard can be satisfied.

  The optical device 100 is mounted on a control board (not shown) together with a light source control device (not shown) that supplies a drive current to the laser chip 110.

  The light source 14 is attached to the optical housing 30 so as to be rotatable about an axis parallel to the X-axis direction. Thereby, the pitch in the sub-scanning direction of the light beam condensed on the surface of the photosensitive drum 1030 can be adjusted to a predetermined pitch.

  Returning to FIG. 2, the coupling lens 15 converts the light beam output from the light source 14 into substantially parallel light.

  The aperture plate 16 has an aperture and defines the beam diameter of the light beam through the coupling lens 15.

  The cylindrical lens 17 forms an image of the light flux that has passed through the opening of the aperture plate 16 in the vicinity of the deflection reflection surface of the polygon mirror 13 via the reflection mirror 18 in the sub-scanning corresponding direction.

  The optical system arranged on the optical path between the light source 14 and the polygon mirror 13 is also called a pre-deflector optical system. In the present embodiment, the pre-deflector optical system includes a coupling lens 15, an aperture plate 16, a cylindrical lens 17, and a reflection mirror 18.

  As an example, the polygon mirror 13 has a hexahedral mirror having an inscribed circle radius of 18 mm, and each mirror serves as a deflecting reflection surface. The polygon mirror 13 deflects the light flux from the reflection mirror 18 while rotating at a constant speed around an axis parallel to the Z-axis direction.

  The deflector-side scanning lens 11 a is disposed on the optical path of the light beam deflected by the polygon mirror 13.

  The image plane side scanning lens 11b is disposed on the optical path of the light beam via the deflector side scanning lens 11a. Then, the light beam that has passed through the image plane side scanning lens 11b is irradiated onto the surface of the photosensitive drum 1030, and a light spot is formed. This light spot moves in the longitudinal direction of the photosensitive drum 1030 as the polygon mirror 13 rotates. That is, the photoconductor drum 1030 is scanned. The moving direction of the light spot at this time is the “main scanning direction”. The rotation direction of the photosensitive drum 1030 is the “sub-scanning direction”.

  The optical system arranged on the optical path between the polygon mirror 13 and the photosensitive drum 1030 is also called a scanning optical system. In the present embodiment, the scanning optical system includes a deflector side scanning lens 11a and an image plane side scanning lens 11b. Note that at least one folding mirror is disposed on at least one of the optical path between the deflector side scanning lens 11a and the image plane side scanning lens 11b and the optical path between the image plane side scanning lens 11b and the photosensitive drum 1030. May be.

  As described above, according to the optical device 100 according to the present embodiment, the laser chip 110, the package member 120 that holds the laser chip 110 in the region 121 surrounded by the wall, and the epoxy on the package member 120 It has a translucent cover glass 140 which is bonded with a resin adhesive 160 and seals a region 121 surrounded by a wall.

  The epoxy resin adhesive 160 is applied with an outer peripheral length b and a width a so as to surround the region 121 surrounded by the wall, and the value of a / (4b) is 0.071. is there.

  That is, the relationship of “applying width of epoxy resin adhesive 160 participating in joining ÷ length of outer periphery of application surface of epoxy resin adhesive 160 participating in joining” ≧ 0.057 is satisfied. ing. Therefore, the optical device 100 can satisfy the EIAJ standard regarding high temperature and high humidity resistance.

  In this case, the cost can be significantly reduced as compared with the case where hermetic seal bonding or solder bonding is used for bonding the package member 120 and the cover glass 140.

  Therefore, it is possible to improve the environmental resistance without increasing the cost.

  Further, the size of the expensive cover glass 140 can be set to the minimum necessary size. In this case, cost reduction can be achieved.

  Furthermore, it can be set as the application surface of a suitable shape according to the required lifetime. Also, a cover glass 140 having an appropriate size according to the required life can be used. That is, it is possible to provide an optical device with excellent cost performance according to the application.

  In the optical scanning apparatus 1010 according to this embodiment, since the light source 14 includes the optical device 100, high-accuracy optical scanning can be stably performed without increasing the cost.

  Further, since the light source 14 has a plurality of light emitting portions, a plurality of scans can be performed at the same time, and the speed of image formation can be increased.

  The laser printer 1000 according to the present embodiment includes the optical scanning device 1010. As a result, it is possible to form a high-quality image without increasing the cost.

  Moreover, since the light source 14 has a plurality of light emitting portions, it is possible to increase the density of the image.

  In the above embodiment, the case where the value of a / (4b) is 0.071 has been described. However, the present invention is not limited to this, and the value of a / (4b) may be 0.057 or more. .

  In this case, as an example, as shown in FIGS. 16 to 18, a part of the contact portion between the cover glass 140 and the package member 120 may be bonded with an epoxy resin adhesive 160.

  Moreover, in the said embodiment, as FIG. 19-21 shows as an example, the wall of the dent part 121 has a stepped structure part of one step, and the cover glass 140 is joined to the end surface of the + X side. Also good. 20 is a cross-sectional view taken along the line AA in FIG. Moreover, FIG. 21 is a figure when the cover glass 140 in FIG. 19 is removed.

  Moreover, although the said embodiment demonstrated the case where the laser chip 100 had 32 light emission parts, it is not limited to this.

  Moreover, although the said embodiment demonstrated the case where the oscillation wavelength of each light emission part of the laser chip 100 was a 780 nm band, it is not limited to this. The oscillation wavelength of the light emitting unit may be changed according to the characteristics of the photoreceptor.

  Moreover, although the optical device 100 demonstrated the case where the optical device 100 had the laser chip 100 in which the several light emission part was arranged two-dimensionally, it is not limited to this. For example, the optical device 100 may include a laser chip in which a plurality of light emitting units are arranged one-dimensionally instead of the laser chip 100. Further, in the optical device 100, the light emitting unit may have one laser chip instead of the laser chip 100.

  Moreover, although the said embodiment demonstrated the case where the laser chip 100 was a surface emitting laser array chip, it is not limited to this.

  In the above embodiment, the laser printer 1000 is described as the image forming apparatus. However, the present invention is not limited to this. In short, any image forming apparatus including the optical scanning device 1010 may be used.

  For example, an image forming apparatus that directly irradiates laser light onto a medium (for example, paper) that develops color with laser light may be used.

  Further, an image forming apparatus using a silver salt film as the image carrier may be used. In this case, a latent image is formed on the silver salt film by optical scanning, and this latent image can be visualized by a process equivalent to a developing process in a normal silver salt photographic process. Then, it can be transferred to photographic paper by a process equivalent to a printing process in a normal silver salt photographic process. Such an image forming apparatus can be implemented as an optical plate making apparatus or an optical drawing apparatus that draws a CT scan image or the like.

  Further, for example, as shown in FIG. 24, a color printer 2000 including a plurality of photosensitive drums may be used.

  The color printer 2000 is a tandem multicolor printer that forms a full-color image by superimposing four colors (black, cyan, magenta, and yellow), and is a black station (photosensitive drum K1, charging device K2). , Developing device K4, cleaning unit K5, and transfer device K6), cyan station (photosensitive drum C1, charging device C2, developing device C4, cleaning unit C5, and transfer device C6), and magenta station ( The photosensitive drum M1, the charging device M2, the developing device M4, the cleaning unit M5, and the transfer device M6), and the yellow station (the photosensitive drum Y1, the charging device Y2, the developing device Y4, the cleaning unit Y5, and the transfer device Y6). ), Optical scanning device 2010, and transfer belt 2 80, and a fixing unit 2030.

  Each photoconductor drum rotates in the direction of the arrow in FIG. 24, and a charging device, a developing device, a transfer device, and a cleaning unit are arranged around each photoconductor drum along the rotation direction.

  Each charging device uniformly charges the surface of the corresponding photosensitive drum. The surface of each photosensitive drum charged by the charging device is optically scanned by the optical scanning device 2010, and a latent image is formed on each photosensitive drum.

  Then, a toner image is formed on the surface of each photosensitive drum by a corresponding developing device. Further, the toner image of each color is sequentially transferred onto the recording paper on the transfer belt 2080 by the corresponding transfer device, and finally the image is fixed on the recording paper by the fixing unit 2030.

  The optical scanning device 2010 has a light source similar to the light source 14 for each color. Therefore, the same effect as that of the optical scanning device 1010 can be obtained.

  The color printer 2000 can obtain the same effects as the laser printer 1000.

  Note that in a tandem multicolor printer, color misregistration of each color may occur due to machine accuracy or the like. However, the accuracy of correcting color misregistration of each color can be increased by selecting a light emitting unit to be lit.

  Further, in this color printer 2000, an optical scanning device may be provided for each color, or may be provided for every two colors.

  In the above embodiment, the case where the optical scanning device 1010 is used in a printer has been described. However, the present invention is also suitable for an image forming apparatus other than a printer, for example, a copier, a facsimile machine, or a multifunction machine in which these are integrated. .

  Moreover, although the said embodiment demonstrated the case where the optical device 100 was used for an optical scanning apparatus, it is not limited to this. In that case, the oscillation wavelength of each light emitting portion of the laser chip 100 may be a wavelength band such as a 650 nm band, an 850 nm band, a 980 nm band, a 1.3 μm band, or a 1.5 μm band, depending on the application. .

  Moreover, although the said embodiment demonstrated the case of the optical device which has a surface emitting laser array in which the several light emission part was arranged two-dimensionally as an optical device, the surface light emission in which the several light emission part was arranged one-dimensionally. The present invention can be applied to an optical device having a laser array and an optical device having a surface emitting laser element having one light emitting portion.

  Further, the present invention can be applied to an optical device having a light receiving element such as a CCD sensor or a CMOS sensor, an optical scanner element using a MEMS mirror, and an optical element such as an optical switching element.

  As described above, the optical device of the present invention is suitable for improving the environmental resistance without increasing the cost. Further, the optical scanning device of the present invention is suitable for performing stable optical scanning without causing an increase in cost. The image forming apparatus of the present invention is suitable for forming a high-quality image without incurring an increase in cost.

  DESCRIPTION OF SYMBOLS 11a ... Deflector side scanning lens (a part of scanning optical system), 11b ... Image surface side scanning lens (a part of scanning optical system), 13 ... Polygon mirror (deflector), 14 ... Light source, 110 ... Laser chip ( Optical element), 120 ... package member, 121 ... dent (area surrounded by a wall), 140 ... cover glass (lid member), 160 ... epoxy resin adhesive (resin material), 1000 ... laser printer (Image forming apparatus) 1010 ... Optical scanning apparatus, 1030 ... Photosensitive drum (image carrier), 2000 ... Color printer (image forming apparatus), 2010 ... Optical scanning apparatus, K1, C1, M1, Y1 ... Photosensitive drum (Image carrier).

JP 2004-228549 A JP 2005-329532 A Japanese Patent Laid-Open No. 2001-267681

Claims (9)

An optical element, a package member that holds the optical element in a region surrounded by a wall, and a light-transmitting property that is bonded to the package member with a resin material and seals the region surrounded by the wall In an optical device having a lid member of
The resin material involved in the bonding is applied with a uniform width so as to surround the region surrounded by the wall,
An optical device characterized by satisfying a relationship of application width of a resin material involved in the joining ÷ length of an outer periphery of an application surface of the resin material involved in the joining ≧ 0.057.   The optical device according to claim 1, wherein the resin material is applied with a uniform width along an outer periphery of the lid member. The wall has a stepped structure;
The optical device according to claim 1, wherein the lid member is joined to a step portion of the stepped structure portion.   The optical device according to claim 1, wherein the lid member is bonded to an end surface of the wall.   The optical device according to claim 1, wherein the optical element is a surface emitting laser array.   The optical device according to claim 1, wherein the optical element is a surface emitting laser element. An optical scanning device that scans a surface to be scanned with light,
A light source comprising the optical device according to claim 5;
A deflector for deflecting light from the light source;
A scanning optical system for condensing the light deflected by the deflector onto the surface to be scanned. At least one image carrier;
An image forming apparatus comprising: at least one optical scanning device according to claim 7 that scans the at least one image carrier with light including image information.   The image forming apparatus according to claim 8, wherein the image information is multicolor color image information.