JP2010272841A - Package for mounting electronic component and electronic device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component that has no occurrence of poor hermeticity even if a through hole for fixing a signal terminal is enlarged to increase the characteristic impedance, and also to provide an electronic device using the same. <P>SOLUTION: The package for mounting an electronic component includes a substrate 1 and signal terminals 4. The substrate 1 has a cover joining portion 1b in an outer peripheral region of the top face, a portion 1a for mounting an electronic component 5, and a plurality of through holes 2, 2 that pass through the substrate 1 from the top to bottom faces in a region on the inner side of the outer peripheral region. The signal terminals 4 are fixed through a sealing material 3 filled in the through holes 2. The through holes 2 each have a large diameter portion 2a and a small diameter portion 2b, and the signal terminals 4 are fixed through the sealing material 3 filled in the larger diameter portions 2a. The through holes 2 each have the large diameter portion 2a on the bottom face side of the substrate 1 and the small diameter portion 2b on the top face side of the substrate 1, and the sealing material 3 is filled in the large diameter portion 2a of each through hole 2 with a space to a step surface 2c on the small diameter portion 2b side. By setting the sealing material 3 apart from the cover joining portion 1b, a poor hermeticity is suppressed and at the same time impedance matching can be achieved. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting package for storing an electronic component such as an optical semiconductor element used in the field of optical communication and the like, and an electronic apparatus using the same.

  In recent years, the demand for high-speed communication at a transmission distance of 40 km or less has increased rapidly, and research and development on high-speed and large-capacity information transmission has been promoted. In particular, attention has been paid to increasing the speed of electronic devices such as semiconductor devices that receive and transmit optical signals using optical communication devices, and the issue of increasing the output and speed of optical signals by electronic devices to improve transmission capacity. As research and development.

The optical output of an electronic device typified by a conventional semiconductor device is about 0.2 to 0.5 mW, and the driving power of a semiconductor element used as an electronic component is about 5 mW. However, in a semiconductor device having a higher output, the optical output has become a level of 1 mW, and the driving power of the semiconductor element is required to be 10 mW or more. Furthermore, the transmission speed by the conventional semiconductor device is 2.5-10G.
Although it was about bps (Giga bit per second), in recent years, it has been improved to about 25 to 40 Gbps, and there is a demand for higher output and higher speed of semiconductor devices.

  The figure of the example of the package for electronic component mounting which mounts the electronic components containing optical semiconductor elements, such as LD (Laser Diode: Laser diode) and PD (Photo Diode: Photodiode) which are used for the conventional optical communication apparatus. 10 shows a cross-sectional view.

The conventional electronic component mounting package shown in FIG. 10 includes an iron (Fe) -nickel (Ni) -cobalt (Co) alloy or an iron (Fe) -manganese (Mn) alloy having a mounting portion 21a for the electronic component 25 on the upper surface. A disc-shaped base 21 made of a metal such as the above, and a through hole 22 having a diameter of 0.5 to 2 mm formed from the upper surface to the lower surface of the base 21 are inserted into the center, and at least the lower end protrudes from the through hole 22 Thus, the signal terminal 24 fixed through the sealing material 23 is provided. The signal terminal 24 is fixed through a sealing material 23 made of insulating glass containing borosilicate as a main component, and the base 21 and the signal terminal 24 are electrically insulated by the sealing material 23. A ground terminal 28 is connected to the lower surface of the base 21 between the two through holes 22. If necessary, the electronic component 25 is mounted on the mounting portion 21a of the electronic component mounting package via the circuit board 25a, and the upper end of the signal terminal 24 and the terminal of the electronic component 25 of the electronic component mounting package are connected to the circuit board. A lid 26 made of a metal such as an Fe-Ni-Co alloy is welded to the outer peripheral region of the upper surface of the base 21 so as to cover the electronic component 25 by welding such as YAG laser welding or seam welding. Or it was set as the electronic device by joining by brazing and airtightly sealing. In addition, an optical fiber may be fixed to a portion of the lid 26 that faces the electronic component 25, or a window that transmits light may be provided in a portion that faces the electronic component 25 (see, for example, Patent Document 1). .)

When the transmission speed is 10 Gbps or less, the impedance of the peripheral component is 25 Ω. However, as the frequency increases, the impedance of the peripheral component is 50 Ω. When trying to match the impedance of the signal terminal 24 to 50Ω, it has been found that the diameter of the through hole 22 is almost twice that when the impedance is designed with the conventional 25Ω. When the electronic component 25 driven by a high frequency signal of 25 Gbps or more is mounted and the diameter of the through hole 22 through which the signal terminal 24 passes in order to match the impedance to 50Ω, the lid 26 is YAG laser welded, seam welded or brazed. There has been a problem in that airtight defects are likely to occur when airtightly sealed by a joining method such as contact. This is because the distance between the lid joint portion 21b and the through-hole 22 has become closer due to the increase in the diameter of the through-hole 22, so that, for example, mechanical impact is mainly applied in the case of seam welding, and the base 21 in the case of brazing. The thermal stress due to the difference in the thermal expansion coefficient between the lid body 26 and the lid body 26 is applied to the lid joint portion 21b and is transmitted to the through hole 22, thereby generating cracks in the sealing material 23 in the through hole 22 or through holes. This is probably because peeling occurs between the inner wall 22 and the sealing material 23 or between the signal terminal 24 and the sealing material 23. In addition, in the case of seam welding or YAG laser welding, the inner surface of the through-hole 22 is immediately heated to a high temperature since the heat is not rapidly diffused when the distance from the lid joint 21b to the through-hole 22 is short. On the other hand, the glass sealing material 23 having a low thermal conductivity with respect to the metal base 21 takes time for the temperature to rise, and a difference in thermal expansion occurs between the two, resulting in the through hole 22. It is considered that peeling occurs between the inner wall and the sealing material 23 or between the signal terminal 24 and the sealing material 23.

  In order to increase the distance from the lid joint portion 21b to the sealing material 23, the lid joint portion of the through hole 22 is enlarged as shown in FIG. A configuration in which the diameter on the upper surface side close to 21b is reduced or the sealing material 23 is disposed only on the lower side of the through hole 22 as shown in FIG. (See Patent Document 3). Furthermore, in such a configuration, impedance is not matched in a portion where the diameter of the through hole 22 is small or a portion where the sealing material 23 is not present, so that the sealing material 23 is placed on the bottom surface as shown in FIG. It is conceivable that the air coaxial is arranged only on the side and the upper surface side has a reduced diameter and matched impedance (for example, see Patent Document 4).

JP-A-8-130266 JP 2008-130834 A JP 2007-88233 A JP-A-6-338709

  However, since the through-hole 22 has a large-diameter portion and a small-diameter portion, the small-diameter portion side of the large-diameter portion has a step surface perpendicular to the length direction of the signal terminal 24. Normally, impedance is matched by the amount of coupling between the signal terminal 24 and the inner surface of the large-diameter portion parallel to the outer surface of the signal terminal 24, but the distance from the step surface is short on the small-diameter side of the large-diameter portion. Since the terminal 24 and the stepped surface are also coupled, there is a problem that the impedance is reduced in this portion.

  The present invention has been completed in view of the above-mentioned conventional problems, and its purpose is to achieve a poor airtightness even if the through hole for fixing the signal terminal is enlarged in order to increase the characteristic impedance and transmit the high-frequency signal. It is an object of the present invention to provide an electronic component mounting package and an electronic device using the same.

  The electronic component mounting package of the present invention has a lid joint portion for joining the lid body by welding or brazing to the outer peripheral region of the upper surface, and an electronic component mounting portion on the upper surface in the inner region of the lid joint portion. And a substrate having a plurality of through holes penetrating from the upper surface to the lower surface, and a signal terminal fixed through the sealing material filled in the through holes, The through-hole has a large-diameter portion on the lower surface side of the base and a small-diameter portion on the upper surface side, and the sealing material is between the large-diameter portion of the through-hole and the step surface on the small-diameter portion side. It is characterized by being filled with a gap.

  The electronic component mounting package of the present invention is characterized in that, in the above configuration, the step surface is inclined from the large diameter portion toward the small diameter portion.

  The electronic component mounting package of the present invention is characterized in that, in each of the above configurations, an insulating member is disposed between the inner surface of the small diameter portion and the signal terminal.

  The electronic device of the present invention is characterized in that an electronic component is mounted on the mounting portion of the electronic component mounting package of the present invention having the above-described configuration, and a lid is bonded to the lid bonding portion of the base. Is.

  According to the electronic component mounting package of the present invention, the through hole has the large diameter portion on the lower surface side of the base and the small diameter portion on the upper surface side, and the sealing material is on the small diameter portion side on the large diameter portion of the through hole. Even if the lid is joined to the lid joint on the outer periphery of the upper surface of the base by welding or brazing, the lid joint is sealed. Since the distance to the material is large, the impact during joining and the thermal stress after joining are alleviated by the part between the lid joint part of the base and the sealing material. The generated heat is diffused, and the sealing material in the through hole is not cracked or peeled off between the sealing material and the signal terminal or the inner wall surface of the through hole, and the airtightness is impaired. And a highly reliable electronic device can be obtained. In addition, since air with a low relative dielectric constant exists in the gap between the signal terminal and the stepped surface, the electromagnetic coupling between them is reduced, and the large diameter portion parallel to the outer surface of the signal terminal and the signal terminal is reduced. Since the electromagnetic coupling between the inner surface and the inner surface becomes almost equal, the portion where impedance is not matched in the length direction is shortened in the portion filled with the sealing material of the large diameter portion, and the transmission characteristic of the high frequency signal is reduced. improves.

  According to the electronic component mounting package of the present invention, in the above configuration, when the stepped surface is inclined from the large diameter portion toward the small diameter portion, the diameter of the through hole is rapidly changed from the large diameter to the small diameter. Therefore, the impedance does not change abruptly, and the transmission characteristics of the high frequency signal are further improved.

  Further, according to the electronic component mounting package of the present invention, in each of the above configurations, when the insulating member is disposed between the inner surface of the small diameter portion and the signal terminal, the signal terminal sealing material to the through hole The relative position between the signal terminal and the small diameter part when the electronic component mounting package is assembled, such as when the signal terminal and the circuit board are joined together Even if the position of the signal terminal in the small-diameter portion is shifted due to the displacement or the signal terminal is deformed by handling during assembly, an insulating member is disposed between the inner surface of the small-diameter portion and the signal terminal. As a result, the signal terminal and the inner surface (base) of the small-diameter portion do not come into contact with each other, and insulation is maintained, so that a more reliable package for housing a semiconductor element is obtained.

  According to the electronic device of the present invention, since the electronic component is mounted on the mounting portion of the electronic component mounting package of the present invention having the above-described configuration, and the lid body is joined to the lid joint portion of the base body, Even when the diameter of the portion where the signal terminal is fixed by the sealing material is large, the lid is welded or brazed to the outer peripheral portion of the upper surface of the substrate by separating the sealing material from the lid joint. Since the airtightness is not impaired by the impact or thermal stress after the bonding due to bonding, a highly reliable electronic device with excellent airtightness is obtained.

It is a perspective view which shows an example of embodiment of the electronic component mounting package of this invention. It is a perspective view which shows the other example of embodiment of the electronic component mounting package of this invention. It is sectional drawing which shows the other example of embodiment of the electronic component mounting package of this invention. It is sectional drawing which shows the other example of embodiment of the electronic component mounting package of this invention. (A) is sectional drawing which shows the other example of embodiment of the electronic component mounting package of this invention, (b) is a bottom view. (A) is sectional drawing which shows the other example of embodiment of the electronic component mounting package of this invention, (b) is a bottom view. It is sectional drawing which shows the other example of embodiment of the electronic component mounting package of this invention. It is sectional drawing which shows the other example of embodiment of the electronic component mounting package of this invention. It is sectional drawing which shows the other example of embodiment of the electronic component mounting package of this invention. It is sectional drawing which shows the example of the conventional electronic component mounting package. (A)-(c) is sectional drawing to which the principal part of the conventional electronic component mounting package was expanded, respectively.

  An electronic component mounting package and an electronic apparatus using the same according to the present invention will be described in detail with reference to the accompanying drawings. 1 and 2 are perspective views showing an example of an embodiment of an electronic mounting package according to the present invention and another example, respectively, and FIG. 3 is a cross-sectional view showing a cross section taken along line AA in FIG. 4 is a cross-sectional view showing another example of the electronic mounting package of the present invention. FIGS. 5 (a) and 6 (a) are embodiments of the electronic component mounting package of the present invention, respectively. FIG. 5B and FIG. 6B are bottom views showing the bottom surfaces of FIG. 5A and FIG. 6A, respectively. 7 to 9 are sectional views showing other examples of the embodiment of the electronic component mounting package of the present invention.

  1 to 9, 1 is a base, 1a is a mounting portion, 1b is a lid joint portion, 1c is a notch, 1d is a groove, 2 is a through hole, 2a is a large diameter portion of the through hole 2, and 2b is a through hole. Small diameter portion of hole 2, 2 c is a stepped surface of through-hole 2, 3 is a sealing material, 4 is a signal terminal, 5 is an electronic component, 5 a is a circuit board on which the electronic component is mounted, 6 is a lid, and 7 is a bonding wire , 8 are ground terminals, and 9 is an insulating member.

  In the example shown in FIG. 1, the electronic component 5 is directly mounted on the upper surface of the base 1, and the upper ends of the signal terminals 4 and 4 are connected to the electronic component 5 by bonding wires 7. In the example shown in FIG. 2, the protruding part protruding from the upper surface of the base 1 is used as the mounting part 1 a, and the electronic component 5 is mounted on the side surface via the circuit board 5 a. Further, the ends of the signal terminals 4 and 4 and the wiring on the circuit board 5a are connected by a bonding material (not shown) such as a brazing material. Further, as in the example shown in FIGS. 3 to 9, the electronic device of the present invention is basically configured by joining the lid 6 as shown by the broken line to the lid joint 1b.

  The electronic component mounting package of the present invention has a lid joint portion 1b for joining the lid body 6 by welding or brazing to the outer peripheral region of the top surface, and the electronic component 5 on the top surface in the inner region of the lid joint portion 1b. And a base 1 having a plurality of through holes 2, 2 penetrating from the upper surface to the lower surface, and a signal terminal 4 fixed through the sealing material 3 filled in the through hole 2. The through-hole 2 has a large-diameter portion 2 a on the lower surface side and a small-diameter portion 2 b on the upper surface side of the base 1, and the sealing material 3 is a large-diameter portion of the through-hole 2. 2a is filled with a gap between the stepped surface 2c on the side of the small diameter portion 2b.

Even if the lid body 6 is joined to the lid joint portion 1b on the outer peripheral portion of the upper surface of the base body 1 by welding or brazing because of such a configuration, the gap between the lid joint portion 1b and the sealing material 3 is not limited. Therefore, the impact at the time of joining and the thermal stress after joining are alleviated by the part between the lid joined part 1b of the base 1 and the sealing material 3. In addition, the heat generated in the lid joint portion 1b is diffused by this portion, and the sealing material 3 in the large diameter portion 2a of the through hole 2 is cracked or the sealing material 3 and the signal terminal 4 or the through hole 2 It is possible to obtain a highly reliable electronic device in which no peeling occurs between the inner wall surface and the airtightness is not impaired. In addition, since air having a small relative dielectric constant exists in the gap between the signal terminal 4 and the stepped surface 2c, electromagnetic coupling between them becomes small and parallel to the outer surfaces of the signal terminal 4 and the signal terminal 4. Since the electromagnetic coupling with the inner surface of the large-diameter portion 2a is almost, in the portion filled with the sealing material 3 of the large-diameter portion, the portion where the impedance is not matched in the length direction is shortened, High-frequency signal transmission characteristics are improved.

  Further, according to the electronic component mounting package of the present invention, as in the example shown in FIGS. 4 to 6, in the above configuration, when the step surface 2c is inclined from the large diameter portion 2a toward the small diameter portion 2b. Since the diameter of the through hole 2 does not change suddenly from the large diameter to the small diameter, the impedance does not change suddenly, and the transmission characteristics of the high frequency signal are further improved.

  Further, according to the electronic component mounting package of the present invention, as in the examples shown in FIGS. 7 to 9, the insulating member 9 is disposed between the inner surface of the small diameter portion 2 b and the signal terminal 4 in each of the above configurations. When the signal terminal 4 is fixed to the through hole 2 with the sealing material 3, the position of the signal terminal 4 is shifted and the relative position between the signal terminal 4 and the small diameter portion 2b is shifted. The signal terminal 4 in the small-diameter portion 2b is deformed when the relative position of the signal terminal 4 and the small-diameter portion 2b is shifted at the time of assembling the electronic component mounting package at the time of joining or the like. Even if the position of the signal is shifted, the insulating member 9 is disposed between the inner surface of the small diameter portion 2b and the signal terminal 4, so that the signal terminal 4 and the inner surface (base 1) of the small diameter portion 2b come into contact with each other. And insulation is maintained In, a more highly reliable semiconductor device package for housing.

  The electronic device of the present invention is characterized in that the electronic component 5 is mounted on the mounting portion 1a of the electronic component mounting package of the present invention having the above-described configuration, and the lid body 6 is joined to the lid joint portion 1b of the base body 1. To do. Since it was set as such a structure, even if it is a case where the diameter of the part to which the signal terminal 4 of the through-hole 2 was fixed by the sealing material 3 is large, the sealing material 3 is separated from the cover body junction part 1b. Thus, the airtightness is not impaired by the impact or thermal stress after joining when the lid 6 is joined to the lid joint 1b on the outer peripheral portion of the upper surface of the base body 1 by welding or brazing. And a highly reliable electronic device.

The substrate 1 has a mounting portion 1a for the electronic component 5 at the center of the upper surface and has a function of radiating heat generated by the mounted electronic component 5 to the outside of the package. For this reason, the base body 1 is made of a metal having good thermal conductivity, and is close to the thermal expansion coefficient of the electronic component 5 or ceramic circuit board 5a to be mounted or has a low cost. For example, Fe-Ni-Co An alloy such as an alloy or an Fe-Mn alloy or a metal such as pure iron is selected. More specifically, there is an SPC (Steel Plate Cold) material of Fe 99.6 mass% -Mn 0.4 mass%. For example, when the substrate 1 is made of an Fe—Mn alloy, the ingot (lumb) is manufactured in a predetermined shape by applying a known metal processing method such as rolling or punching, and the through-hole 2 is drilled or molded. It is formed by punching. Moreover, when the base | substrate 1 is a shape which has a protrusion part as the mounting part 1a, it can form by cutting or pressing.

The shape of the substrate 1 is usually a flat plate having a thickness of 0.5 to 2 mm, and the shape thereof is not particularly limited, but for example, a disk having a diameter of 3 to 10 mm and a circumference having a radius of 1.5 to 8 mm. For example, a semicircular plate with a part cut off, a square plate with a side of 3 to 15 mm, and the like. The thickness of the substrate 1 may not be uniform. For example, only the region where the through holes 2 and 2 are formed is thick on the lower surface side of the substrate 1, and faces the lid joint portion 1 b on the lower surface of the substrate 1. A cutout 1c may be provided in the portion so that the thickness of this portion is thin. If it does in this way, the heat | fever which generate | occur | produced in the cover body junction part 1b of the upper surface of the base | substrate 1 will be carried out.
It is easy to dissipate heat from the portion of the lower surface facing the lid joint 1b, and the shortest heat transfer path to the sealing material 3 of the heat generated in the lid joint 1b (the lid joint 1b and the sealing material) Since an air layer is formed in the middle of the straight line connecting 3), heat transfer from the lid joint portion 1 b to the sealing material 3 can be suppressed, which is preferable. Further, as in the example shown in FIGS. 5 (a) and 5 (b), by forming a notch 1c having a shape along a line extending radially from the center of the substrate 1, the surface of this portion is made uneven. The heat generated at the lid joint 1b can be radiated more efficiently.

  Further, as in the example shown in FIGS. 6A and 6B, the groove 1 d may be formed so as to surround a region where the through holes 2 and 2 are formed on the lower surface of the base 1. As in the example shown in FIGS. 6A and 6B, the shortest heat transfer path (the lid joint portion 1b and the sealing material 3) to the sealing material 3 of the heat generated in the lid joint portion 1b. A groove 1d that crosses the connecting straight line) is preferable because heat transfer from the lid joint portion 1b to the sealing material 3 can be suppressed. A similar groove 1 d may be formed on the upper surface of the substrate 1. In addition, by forming a plurality of such grooves 1d, the lower surface may be made uneven to further improve the heat dissipation from the lower surface.

  In the example shown in FIGS. 1 to 9, one electronic component 5 is mounted on the base 1 having two through holes 2, but a plurality of electronic components 5 are mounted, the number of electronic components 5 and the number of electronic components 5 Depending on the number of terminals of the component 5, three or more through holes 2 for fixing the signal terminals 4 may be formed.

  The thickness of the substrate 1 is preferably 0.5 mm or more and 2 mm or less. When the thickness is less than 0.5 mm, when the metal lid 6 for protecting the electronic component 5 is bonded to the upper surface of the metal substrate 1, the substrate 1 may be bent depending on the bonding conditions such as the bonding temperature. It becomes easy to deform, and the airtightness tends to be lowered by the deformation. On the other hand, if the thickness exceeds 2 mm, the thickness of the electronic component mounting package or the electronic device becomes unnecessarily thick, and it is difficult to reduce the size.

  The surface of the substrate 1 is excellent in corrosion resistance, excellent in wettability with a brazing material for joining and fixing the electronic component 5, the circuit board 5a or the lid body 6, and a Ni layer having a thickness of 0.5 to 9 μm and a thickness. It is preferable to sequentially deposit an Au layer having a thickness of 0.5 to 5 μm by a plating method. Thereby, it is possible to effectively prevent the base body 1 from being oxidatively corroded, and to satisfactorily braze the electronic component 5, the circuit board 5 a, or the lid body 6 to the base body 1.

  The through hole 2 has a shape having a large diameter portion 2a and a small diameter portion 2b. As in the example shown in FIGS. 3 to 9, the large-diameter portion 2 a on the lower surface side and the small-diameter portion 2 b on the upper surface side are arranged in the same center. And the signal terminal 4 is being fixed to the large diameter part 2a of the two through-holes 2 and 2 with the sealing material 3. Thereby, the sealing material 3 can be moved further away from the lid joint portion 1b, and the possibility that the airtightness is impaired by the heat generated in the lid joint portion 1b can be reduced.

  The signal terminal 4 has one end (upper end) flush with the upper surface of the base 1 or protrudes to about 2 mm, and the other end (lower end) of about 1 to 20 mm from the lower surface of the base 1. It is fixed by protruding. For example, as in the example shown in FIG. 1, when the upper end of the signal terminal 4 and the electronic component 5 (or the circuit board 5a on which the electronic component 5 is mounted) are electrically connected via the bonding wire 7, The upper end portion of the signal terminal 4 does not necessarily protrude from the upper surface of the base 1. On the other hand, it is preferable that the lower end portion of the signal terminal 4 protrudes from the lower surface of the base 1 in order to connect to an external electric circuit (not shown). For example, as in the example shown in FIG. 1 or FIG. 2, the upper end of the signal terminal 4 and the electronic component 5 are electrically connected, and the lower end of the signal terminal 4 is electrically connected to an external electric circuit (not shown). Thus, the signal terminal 4 functions to transmit an input / output signal between the electronic component 5 and the external electric circuit.

The sealing material 3 is made of an insulating inorganic material such as glass or ceramics, and has a function of securing an insulating interval between the signal terminal 4 and the base 1 and fixing the signal terminal 4 in the through hole 2 of the base 1. Have. Examples of such a sealing material 3 include glass such as borosilicate glass and soda glass, and a glass filler added with a ceramic filler for adjusting the thermal expansion coefficient and relative dielectric constant of the sealing material 3. The relative dielectric constant is appropriately selected for impedance matching. Examples of the filler that lowers the dielectric constant include lithium oxide.

The diameter of the small-diameter portion 2b of the through hole 2 is set such that an air coaxial with a characteristic impedance of 50Ω is formed when the signal terminal 4 passes through the center. For example, the signal terminal 4 has a diameter of 0.2.
In the case of mm, the diameter of the small diameter portion 2b may be 0.46 mm. For example, when the outer diameter of the signal terminal 4 is also 0.2 mm, the diameter of the large diameter portion 2a is 1.75 mm when the sealing material 3 having a relative dielectric constant of 6.8 is used. 50Ω can be used. Further, when the outer diameter of the signal terminal 4 is 0.25 mm, when the sealing material 3 having a relative dielectric constant of 5 is used, the diameter of the large diameter portion 2a may be 1.65 mm. When the signal terminal 4 having an outer diameter of 0.25 mm and the sealing material 3 having a relative dielectric constant of 6.8 is used, the diameter of the large diameter portion 2a may be 2.2 mm.

  The length (depth) of the large-diameter portion 2a of the through hole 2 is preferably increased in order to increase the strength of fixing the signal terminal 4 to the base body 1.

The signal terminal 4 is made of a metal such as Fe-Ni-Co alloy or Fe-Ni alloy. For example, when the signal terminal 4 is made of Fe-Ni-Co alloy, the ingot (lumb) is rolled or punched, By applying a known metal processing method such as cutting, a wire having a length of 1.5 to 22 mm and a diameter of 0.1 to 1 mm is manufactured. In order to reduce the size while performing matching with a higher impedance while ensuring the strength of the signal terminal 4, the diameter of the signal terminal 4 is preferably 0.15 to 0.25 mm. When the diameter of the signal terminal 4 is smaller than 0.15 mm, the signal terminal 4 is easily bent by handling when mounting the electronic component mounting package, and the workability is likely to be lowered. If the diameter is larger than 0.25 mm, the diameter of the through hole 2 when impedance matching is increased with the diameter of the signal terminal 4, which is not suitable for downsizing of the product.

  To fix the signal terminal 4 through the sealing material 3 filled in the through-hole 2, for example, when the sealing material 3 is made of glass, first, a known powder pressing method or extrusion molding method is used. Using this, the glass powder is molded, the inner diameter is matched with the outer diameter of the signal terminal 4, the cylindrical shaped body is made with the outer diameter matched with the diameter of the large diameter portion 2 a of the through hole 2, and this sealing material 3 The signal terminal 4 is inserted into the hole of the molded body, the molding pair is inserted into the mold, the glass is melted by heating to a predetermined temperature, and then cooled and solidified to fix the signal terminal 4. The sealing material 3 having a predetermined shape is formed. The sealing material 3 is inserted into the large diameter portion 2a of the through hole 2 and heated to join the sealing material 3 to the inner surface of the large diameter portion 2a. The heating at this time is such that the glass is not completely melted and is softened and joined to the inner surface of the large-diameter portion 2a, so that the glass is not spread to the stepped surface 2c and a gap is formed. As a result, the through hole 2 is hermetically sealed by the sealing material 3, and the signal terminal 4 is insulated and fixed from the base body 1 by the sealing material 3 to form a coaxial line. Only the sealing material 3 is formed in advance, and this is inserted into the large diameter portion 2a, and the signal terminal 4 is also inserted into the hole of the sealing material 3, and the sealing material 3 and the inner surface of the large diameter portion 2a and the signal terminal The four outer surfaces may be joined at the same time. When the step surface 2c is inclined from the large diameter portion 2a toward the small diameter portion 2b, a jig for positioning the sealing material 3 is used when the sealing material 3 is inserted into the large diameter portion 2a. Can be easily done.

Alternatively, a metal tubular body having the same length as that of the large-diameter portion 2 a with the length of the sealing material 3 is filled with the sealing material 3 and the signal terminal 4 is fixed. A through hole 2 having a portion 2b, a gap portion and a tubular body fixing portion is formed, and the tubular body in which the signal terminal 4 is fixed by the sealing material 3 is fitted into the tubular body fixing portion of the through hole 2 to conduct electricity. May be joined with an adhesive material.

  In addition, the base body 1 is divided into upper and lower parts with the upper surface portion of the sealing material 3 as a boundary, and the through hole 2 (large diameter portion 2a) of the lower base body is filled with the sealing material 3 to thereby form a signal terminal. The base 1 may be formed by fixing 4 and joining the upper base with a joining material such as solder that can be hermetically sealed. At this time, the gap between the sealing material 3 and the stepped surface 2c may be formed by setting the thickness of the bonding material to the length of the gap, or the upper base body has a small diameter portion 2b and a large diameter portion having a gap length. You may form by forming 2a.

In order to suppress this change in impedance, as described above, a gap is provided between the step surface 2c and the sealing material 3 is filled. This is because by providing the gap, the relative permittivity between the signal terminal 4 and the stepped surface 2c can be reduced to reduce the coupling. Such an effect can be obtained if there is a gap between the sealing material 3 and the stepped surface 2c on the small diameter portion 2b side. For example, when a 40 GHz signal is transmitted to the signal terminal 4 having a diameter of 0.2 mm. The diameter of the small diameter portion 2b having an impedance of 50Ω is 0.46 mm, and the distance (the length of the gap) between the small diameter portion 2b and the signal terminal 4 is 0.13 mm. When the distance to the step surface 2c (the length of the gap) is 0.13 mm or more, the coupling between the signal terminal 4 and the step surface 2c can be made sufficiently small. Further, if the distance from the stepped surface 2c of the sealing material 3 is ¼ or less of the wavelength of the frequency to be transmitted, even if there is an impedance mismatch, no signal is reflected and the mismatch is hardly affected. If the distance from the stepped surface 2c of the sealing material 3 is 1.8 mm or less, which is 1/4 or less of the wavelength of 40 GHz, the impedance due to the gap portion being a large-diameter air coaxial. It is hardly affected by this inconsistency.

  When the stepped surface 2c is inclined from the large diameter portion 2a toward the small diameter portion 2b, the diameter of the through hole 2 does not change suddenly from the large diameter to the small diameter. Since the average diameter of the portion becomes smaller, the influence of the gap portion becoming a large-diameter air coaxial becomes smaller. Further, when the signal terminal 4 is fixed to the large-diameter portion 2a, even if the molded body of the sealing material 3 is inserted into the large-diameter portion 2a of the through hole 2 with the stepped surface 2c facing down, Since the molded body remains on the stepped surface 2c having a small diameter, the molded body of the sealing material 3 can be easily arranged.

  A ground terminal 8 is joined to the lower surface of the substrate 1. The ground terminal 8 is manufactured in the same manner as the signal terminal 4 and is bonded to the lower surface of the base 1 using a brazing material or the like. In order to facilitate positioning and improve the bonding strength, a hole may be formed in advance on the lower surface of the substrate 1, and the ground terminal 8 may be inserted into the hole for bonding. For the same reason, as in the example shown in FIGS. 3 to 9, the grounding terminal 8 may be made to be in contact with the lower surface of the base 1 to increase the bonding area. When the connection terminal 4 is connected to the external electric circuit by joining the ground terminal 8 to the base body 1 in this way, the base body 1 also functions as a ground conductor.

The insulating member 9 may be disposed between the inner surface of the small diameter portion 2b and the signal terminal 4 as in the example shown in FIG. 7, or the small diameter as in the example shown in FIG. You may arrange | position so that at least one of the inner surface of the part 2b and the outer surface of the part located in the small diameter part 2b of the signal terminal 4 may be coat | covered. Alternatively, as shown in the example shown in FIG. 9, the gap between the inner surface of the small diameter portion 2b and the signal terminal 4 may be filled in a part of the small diameter portion 2b in the length direction (in a range smaller than the thickness of the small diameter portion 2b). The signal terminal 4 and the base 1 (the inner wall of the small diameter portion 2b) do not come into contact with each other, and the insulating property may be maintained. In order to match the impedance of the signal terminal 4 in the entire length direction of the small diameter portion 2b, the capacitance between the inner surface of the small diameter portion 2b and the signal terminal 4 is the same in the length direction of the small diameter portion 2b. Therefore, when the insulating member 9 is filled between the inner surface of the small-diameter portion 2b and the signal terminal 4, it is filled over the entire length direction of the small-diameter portion 2b as shown in FIG. It is good to do. Similarly, when the inner surface of the small-diameter portion 2b and the outer surface of the signal terminal 4 are covered with the insulating member 9, the thickness is preferably constant in the small-diameter portion 2b. As in the example shown in FIG. 9, when the insulating member 9 is disposed by filling the space between the inner surface of the small diameter portion 2 b and the signal terminal 4 in a part of the small diameter portion 2 b in the length direction, What is necessary is just to fill with the length (thickness) according to the dielectric constant of the insulating member 9 so that impedance may be matched in the average of a length direction. Further, if the insulating member 9 is filled between the inner surface of the small diameter portion 2b and the signal terminal 4, the signal terminal 4 is deformed when the electronic device is mounted on the external circuit board. The position of the terminal 4 is not shifted and the impedance is not shifted.

The insulating member 9 is selected from those that are not melted or decomposed by heat such as when the lid 6 is joined to the base 1. When the space between the inner surface of the small diameter portion 2b and the signal terminal 4 is filled with the insulating member 9, if the relative dielectric constant is large, the diameter of the small diameter portion 2b must be increased. Because of the influence of heat when joining the lid body 9 as the distance from the joint portion becomes smaller, a tetrafluoroethylene resin (relative dielectric constant: about 2.0), a polyphenyl ether resin (relative dielectric constant: about 2.0) having a small relative dielectric constant A resin such as a relative dielectric constant: about 2.7) or a cycloolefin resin (relative dielectric constant: about 2.4) is used. In the case where the insulating member 9 is disposed so as to cover at least one of the inner surface of the small diameter portion 2 b and the outer surface of the portion located in the small diameter portion 2 b of the signal terminal 4, it is between the inner surface of the small diameter portion 2 b and the signal terminal 4. Since the space is formed and the relative dielectric constant of the portion is small, the same material as the sealing material 3 having a larger relative dielectric constant can be used in addition to the resin as described above. The same applies to the case where the insulating member 9 is disposed by filling the space between the inner surface of the small diameter portion 2b and the signal terminal 4 in a part of the small diameter portion 2b in the length direction.

When a tetrafluoroethylene resin having a relative dielectric constant of 2.0 is used as the insulating member 9, FIG.
When the insulating member 9 is filled between the inner surface of the small-diameter portion 2b and the signal terminal 4 and the signal terminal 4 has an outer diameter of 0.25 mm, the characteristic impedance is 50Ω. The diameter of the small diameter portion 2b is 0.8 mm. When covering the inner surface of the small diameter portion 2b with the same insulating member 9 as in the example shown in FIG. 8, if the thickness is 0.025 mm and the signal terminal 4 has an outer diameter of 0.25 mm, the characteristic impedance is In order to make it 50Ω, the diameter of the small diameter portion 2b is 0.6 mm.
Further, as in the example shown in FIG. 9, a disk-shaped insulating member 9 having a thickness of 0.2 mm in the length direction of the small diameter portion 2b is arranged with respect to the small diameter portion 2b having a length of 0.5 mm (insulation). Member 9 with small diameter portion 2b
If the outer diameter of the signal terminal 4 is 0.25 mm, the length direction of the small diameter portion 2b is filled with 0.2 mm in the length direction of the small diameter portion 2b. In order to set the average characteristic impedance of 50Ω to 50Ω, the diameter of the small diameter portion 2b is 0.64 mm.

When glass having a relative dielectric constant of 5.0 is used as the insulating member 9, when the inner surface of the small diameter portion 2b is covered with the insulating member 9 as in the example shown in FIG. If the outer diameter of the signal terminal 4 is 0.25 mm, the diameter of the small diameter portion 2b is 0.62 mm in order to set the characteristic impedance to 50Ω. Using the same insulating member 9, as in the example shown in FIG. 9, a disc-shaped insulating member 9 having a thickness of 0.2 mm in the length direction of the small diameter portion 2b with respect to the small diameter portion 2b having a length of 0.5 mm. When the signal terminal 4 having an outer diameter of 0.25 mm is used and the average characteristic impedance in the length direction of the small diameter portion 2b is 50Ω, the diameter of the small diameter portion 2b is 0.73 mm.

  In order to dispose the insulating member 9, if the insulating member 9 is made of glass, a glass paste prepared by adding an appropriate solvent or binder to the glass powder in the same manner as the sealing material 3 or having a small diameter is used. What is necessary is just to make it melt and solidify by heating and cooling after apply | coating or filling the inner surface of the part 2b. If the insulating member 9 is made of a resin, it may be cured by applying a liquid thermosetting resin on the inner surface of the small-diameter portion 2b, filling it, and then heating, or the small-diameter portion 2b. What is necessary is just to fit what was shape | molded in the shape according to the internal diameter of this, and the external shape of the signal terminal 4 in the small diameter part 2b, and to fix with an adhesive agent as needed.

Further, when the signal terminal 4 is fixed in the through-hole 2 by the sealing material 3, or the signal terminal 4 and the circuit board 5a.
If the position of the signal terminal 4 is shifted at the time of bonding, the impedance is shifted in the small diameter portion 2b. Therefore, before the signal terminal 4 is fixed or the signal terminal 4 and the circuit board 5a are bonded, the small diameter portion 2b. The insulating member 9 is preferably filled between the inner surface of the small diameter portion 2b and the signal terminal 4 in a part or all of the length direction.

  By mounting the electronic component 5 on the mounting portion 1a of the electronic component mounting package of the present invention and joining the lid body 6 to the lid joint portion 1b of the base 1, the electronic device of the present invention is obtained.

  In order to mount and electrically connect the electronic component 5 to the electronic component mounting package, as described above, a method of mounting and connecting the electronic component 5 directly on the upper surface of the base 1 as in the example shown in FIG. Alternatively, there is a method of mounting and connecting the electronic component 5 via the circuit board 5a as in the example shown in FIG.

  Examples of the electronic component 5 include optical semiconductor elements such as LD (laser diode) and PD (photodiode), semiconductor elements including semiconductor integrated circuit elements, piezoelectric elements such as crystal resonators and surface acoustic wave elements, and pressure sensor elements. , Capacitive elements, resistors and the like.

The circuit board 5a is obtained by forming a wiring conductor on an insulating substrate made of a ceramic insulating material such as an aluminum oxide (alumina: Al ₂ O ₃ ) sintered body or an aluminum nitride (AlN) sintered body. If the insulating substrate is made of, for example, an aluminum oxide sintered body, first, an organic solvent suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. , A solvent is added and mixed to form a slurry, which is formed into a sheet by a known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). Thereafter, the green sheet is punched into a predetermined shape, and a plurality of sheets are laminated as necessary, and the green sheet is fired at a temperature of about 1600 ° C.

  For example, in the circuit board 5a of the example shown in FIGS. 4 to 6, the wiring conductor has the terminal conductor for connecting the signal terminals 4 and 4 and the electronic component 5 mounted on the upper surface of the insulating substrate. 5 is formed with a grounding conductor for connecting the ground electrode on the lower surface, and a mounting conductor for mounting on the base 1 is formed on the lower surface. The grounding conductor and the mounting conductor are insulated from each other. They are connected by connection conductors formed on the side surfaces of the substrate or formed through the insulating substrate. Such a wiring conductor is formed in accordance with the connection of the electronic component 5 depending on the connection. In addition, the electronic component 5 and the wiring conductor are connected by, for example, a bonding wire. In order to reduce the signal transmission loss by shortening the bonding wire, for example, a terminal conductor is used as shown in FIG. It is preferable that the connection position of the bonding wire be as close as possible to the electronic component 5 as a bent shape.

When the terminal conductor is bent, for example, as shown in FIGS. 4 to 6, it is bent stepwise so that the bending angle is larger than 90 °, or the corner of the bent portion is rounded. It is preferable to add a mark since the loss of high frequency due to reflection at the bent portion can be reduced. In the case of bending stepwise, it is preferable to set the bending angle to 120 ° or more because loss is reduced. Further, in the example shown in FIGS. 4 to 6, only the outer side of the bent portion is bent stepwise, but it is more preferable that the inner side of the bent portion is bent stepwise and rounded similarly.

As a method for forming the wiring conductor, there are a well-known method of forming metal metallization by co-firing with an insulating substrate or after forming an insulating base, and a method of forming the insulating substrate by vapor deposition or photolithography after forming the insulating substrate. Since the electronic device is small and the circuit board 5a mounted on the electronic device is smaller, the wiring conductor is fine, and in order to increase the alignment accuracy between the wiring conductor and the signal terminals 4 and 4, vapor deposition or photo A method of forming by a lithography method is preferable. In this case, the main surface of the insulating substrate may be polished as necessary.

  Hereinafter, the case where the wiring conductor is formed by vapor deposition or photolithography will be described in detail. The wiring conductor is composed of a conductor layer having a three-layer structure in which, for example, an adhesion metal layer, a diffusion prevention layer, and a main conductor layer are sequentially laminated.

From the standpoint of improving the adhesion with an insulating substrate made of ceramics or the like, the adhesion metal layer is made of titanium (Ti), chromium (Cr), tantalum (Ta), niobium (Nb), nickel-chromium (Ni- It is preferable that the thermal expansion coefficient is at least one of metals close to that of ceramics, such as a Cr) alloy and tantalum nitride (Ta ₂ N), and the thickness is preferably about 0.01 to 0.2 μm. If the thickness of the adhesion metal layer is less than 0.01 μm, it tends to be difficult to firmly adhere the adhesion metal layer to the insulating substrate. If the thickness exceeds 0.2 μm, the adhesion metal layer is insulated by the internal stress during film formation. It tends to become easy to peel off.

  From the viewpoint of preventing mutual diffusion between the adhesion metal layer and the main conductor layer, the diffusion preventing layer is platinum (Pt), palladium (Pd), rhodium (Rh), nickel (Ni), Ni—Cr alloy, Ti— It is preferably made of at least one metal having good thermal conductivity such as W alloy, and the thickness is preferably about 0.05 to 1 μm. If the thickness of the diffusion prevention layer is less than 0.05 μm, defects such as pinholes tend to be generated, making it difficult to perform the function as the diffusion prevention layer. If the thickness exceeds 1 μm, the diffusion prevention layer is caused by internal stress during film formation. There is a tendency to easily peel from the adhesion metal layer. When a Ni—Cr alloy is used for the diffusion preventing layer, the adhesion metal layer can be omitted because the Ni—Cr alloy has good adhesion to the insulating substrate.

  The main conductor layer is preferably made of at least one of gold (Au), Cu, Ni and silver (Ag) having a low electric resistance, and the thickness is preferably about 0.1 to 5 μm. If the thickness of the main conductor layer is less than 0.1 μm, the electric resistance tends to be large and the electric resistance required for the wiring conductor of the circuit board 5a tends to be unsatisfactory. If the thickness exceeds 5 μm, it is driven by internal stress during film formation. There is a tendency that the body layer is easily peeled off from the diffusion preventing layer. Further, since Cu is easily oxidized, a protective layer made of Ni and Au may be coated thereon.

  The electronic component 5 may be mounted on the electronic component mounting package or the circuit board 5a, or the circuit board 5a may be mounted on the electronic component mounting package by fixing with a low melting point brazing material. For example, when the electronic component 5 is mounted on the circuit board 5a after the circuit board 5a is mounted on the base body 1, a gold-tin (Au—Sn) alloy or gold-germanium (Au—) is used to fix the circuit board 5a. Ge) alloy is used as a brazing material, and for fixing the electronic component 5, a brazing material of a tin-silver (Sn-Ag) alloy or a tin-silver-copper (Sn-Ag-Cu) alloy having a lower melting point than these, A resin adhesive such as Ag epoxy that can be cured at a temperature lower than the melting point may be used. In addition, after mounting the electronic component 5 on the circuit board 5a, the circuit board 5a may be mounted on the base body 1. In this case, contrary to the above, it is used when mounting the circuit board 5a on the base body 1. The melting point of the brazing material may be lowered. In any case, a brazing material paste is printed on the circuit board 5a or the mounting portion 1a of the base body 1 by using a well-known screen printing method, a brazing material layer is formed by a photolithography method, A preform of a melting point brazing material may be placed.

  The lid body 6 has an outer shape along the shape of the lid joint portion 1b in the outer peripheral area of the upper surface of the base body 1 as viewed from above, and has a space that covers the electronic component 5 mounted on the mounting portion 1a on the upper surface of the base body 1. It has a shape. A window that transmits light may be provided in a portion facing the electronic component 5, or an optical fiber and an optical isolator for preventing return light may be joined in place of or in addition to the window.

  The lid 6 is made of a metal such as an Fe—Ni—Co alloy, an Fe—Ni alloy, or an Fe—Mn alloy, and is produced by subjecting these plate materials to a known metal working method such as press working or punching. . The lid 6 preferably has the same thermal expansion coefficient as the material of the base 1, and more preferably the same as the material of the base 1. When the lid 6 has a window, a plate-like or lens-like glass window member is joined to a member provided with a hole in the portion facing the electronic component 5 with a low melting point glass or the like.

  The lid 6 is joined to the lid joint 1b of the base body 1 by welding such as seam welding or YAG laser welding or brazing with a brazing material such as an Au-Sn brazing material.

DESCRIPTION OF SYMBOLS 1 ... Base 1a ... Mounting part 1b ... Lid joint part 1c ... Notch 1d ... Groove 2 ... Through-hole 2a ... Large Diameter portion 2b ··· Small diameter portion 2c ··· Stepped surface 3 ··· Sealing material 4 ··· Signal terminal 5 ··· Electronic component 5a ··· Circuit board 6 ··· .... Lid 7 ... Bonding wire 8 ... Grounding terminal 9 ... Insulating material

Claims (4)

A plurality of parts having a lid joint part for joining the lid body by welding or brazing to the outer peripheral area of the upper surface, penetrating from the upper surface to the lower surface in the inner region of the lid joint part, the electronic component mounting part on the upper surface An electronic component mounting package comprising a base having a through hole and a signal terminal fixed through the sealing material filled in the through hole, the through hole being provided on a lower surface side of the base. It has a large diameter portion and a small diameter portion on the upper surface side, and the sealing material is filled with a gap between the large diameter portion of the through hole and the step surface on the small diameter portion side. A package for mounting electronic components. 2. The electronic component mounting package according to claim 1, wherein the stepped surface is inclined from the large diameter portion toward the small diameter portion. The electronic component mounting package according to claim 1, wherein an insulating member is disposed between an inner surface of the small diameter portion and the signal terminal. An electronic component is mounted on the mounting portion of the electronic component mounting package according to any one of claims 1 to 3, and a lid is bonded to the lid bonding portion of the base. apparatus.

Images