JP2010271160A - Electrical connection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To maximally suppress a circuit chip from being heated to a high temperature. <P>SOLUTION: The electrical connection device includes a support having an upper surface and a lower surface; a probe substrate supported by being assembled on the lower surface of the support with a thickness direction used as a vertical direction; a plurality of contactors mounted on the lower surface of the probe substrate; a chip substrate having a plurality of circuit chips arranged on the upper surface, which is a chip substrate positioned at an interval over the support, in a state where a thickness direction is used as a vertical direction; a heat treatment member for absorbing the heat and discharging the heat on the chip substrate side and on the side different from the chip substrate side, which is a heat treatment member arranged on the lower surface of the chip substrate; and a heat treatment plate mounted on the lower side of the heat treatment member. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electrical connection device such as a probe card used for an electrical test of a flat test object such as a semiconductor integrated circuit, and in particular, a connection between the test object and an electrical circuit of a tester performing the electrical test. The present invention relates to an electrical connection device used in the above.

  As one example of this type of electrical connection device, a plate-like support having an upper surface and a lower surface, a probe substrate disposed on the lower side of the support at an interval and supported by the support, There is a technique that includes an electrical connector that is disposed between a support and the probe substrate and is attached to the support, and a plurality of contacts that are attached to the lower surface of the probe substrate (for example, Patent Documents). 1).

  As another electrical connection device, a probe substrate having a plurality of contacts attached to the lower surface and a chip substrate having a plurality of circuit chips attached to the upper surface are superposed in an up-and-down relationship, There is a technique for causing the circuit chip to perform a signal transfer function, for example, an interface function between a tester and an object to be inspected, an electric signal distribution function, and the like (for example, Patent Document 2).

  According to the former, since the probe substrate to which the contact is attached can be made of a material having excellent heat resistance such as a ceramic material instead of a material having poor heat resistance such as an epoxy resin containing glass, the connecting device can be used. Even when maintained in a high temperature environment, there is an advantage that bending deformation of the probe substrate is prevented.

  On the other hand, according to the latter, since the circuit chip transfers the electric signal to the contact, the channel for the test signal between the electric circuit of the conventional tester and the connecting device is remarkably reduced, and at one time This has the advantage that the number of objects to be tested can be increased.

  2. Description of the Related Art In recent years, testing of a flat object such as a semiconductor integrated circuit in a state where it is maintained at a high temperature such as 60 ° C. or higher and 100 ° C. or higher has been performed (Patent Document 1). During the test under such a high temperature environment, the object to be inspected is maintained at a high temperature by the chuck top itself holding the same or a heating element provided on the chuck top. As a result, the connection device is used in a high-temperature environment where the connection device itself is heated from below by heat from the object to be inspected or the chuck top.

  For this reason, when the technique described in Patent Document 2 is applied to the technique described in Patent Document 1, not only the probe substrate but also the chip substrate and the circuit chip disposed thereon are inspected objects and chuck tops. It is heated to a high temperature from the lower side by heat from etc. As a result, the circuit chip often fails to operate normally.

WO2007 / 015314 US Pat. No. 6,275,051

  An object of this invention is to suppress that a circuit chip is heated to high temperature as much as possible.

  An electrical connection device according to the present invention includes a support body having an upper surface and a lower surface, a probe substrate assembled and supported on the lower surface of the support body in a state in which the thickness direction is set to the vertical direction, and the probe substrate And a plurality of contacts attached to the lower surface of the chip substrate, and a chip substrate that is spaced upward from the support in a state in which the thickness direction is vertical, and the plurality of circuit chips are disposed on the upper surface. A chip substrate disposed, a heat treatment member disposed on a lower surface of the chip substrate, the heat treatment member performing heat absorption and heat dissipation on the side of the chip substrate and on a side different from the side of the chip substrate, and the heat treatment And a heat treatment plate attached to the lower side of the member.

  The heat treatment member may include a member that absorbs heat from the chip substrate side and releases the heat to a side different from the chip substrate side, and the heat treatment plate may include a heat sink.

  The chip substrate includes a plurality of first internal wirings electrically connected to the circuit chip, and the support body includes a plurality of second internal wirings electrically connected to the first internal wiring and the contacts. Internal wiring can be provided.

  The electrical connection device according to the present invention is further a first connector disposed on the lower surface of the chip substrate, and a plurality of first connectors electrically connected to at least a part of the first internal wiring. A first connector having a connection terminal and a second connector disposed on the upper surface of the support and coupled to the first connector, wherein at least a part of the second internal wiring is electrically connected And a second connector having a plurality of second connection terminals connected to each other.

  The first and second connectors may couple the support and the chip substrate with an interval in the vertical direction. In addition, the connection device according to the present invention may further include a spacer that couples the support and the chip substrate. In the latter case, the first and second internal wirings may be electrically connected by a flat cable having a plurality of wirings.

  The electrical connection device according to the present invention is further a third connector disposed on the upper surface of the support body, and a plurality of electrical connectors electrically connected to at least the remaining part of the second internal wiring. A third connector having a third connection terminal can be included.

  The connection device according to the present invention may further include a temperature sensor that is disposed on the support and detects the temperature of the support, and that is disposed on the probe substrate to heat the probe substrate. It can also contain the body.

  In the electrical connection device of the present invention, the chip substrate on which the circuit chip is arranged on the upper surface is arranged at a distance above the support, and the chip substrate side is different from the chip substrate side. A heat treatment member that absorbs and dissipates heat is disposed on the lower surface of the chip substrate, and a heat treatment plate that absorbs and dissipates heat is disposed below the heat treatment member.

  For this reason, since the ventilation between the support and the chip substrate is good and the heat treatment member and the heat treatment plate operate efficiently, the chip substrate is efficiently cooled and the circuit chip disposed on the chip substrate Temperature rise is suppressed.

  As a result of the above, according to the present invention, even if the technique described in Patent Document 2 is applied to the technique described in Patent Document 1, the chip substrate and the circuit chip disposed on the chip substrate are arranged on the support side. Heating to a high temperature due to heat from the heat is efficiently suppressed, and malfunction of the circuit chip due to temperature change is prevented.

It is a front view which shows one Example of the electrical connection apparatus which concerns on this invention. It is a top view of the connection apparatus shown in FIG. FIG. 2 is a plan view of the connection device shown in FIG. 1 with the chip substrate removed. It is a top view which shows one Example of a chip substrate. It is a bottom view which shows one Example of a chip substrate. FIG. 6 is a cross-sectional view taken along line 6-6 in FIG. It is a figure which shows one Example of a coupling device. It is a figure which shows the other Example of a coupling device. It is a front view which shows the other Example of the electrical connection apparatus which concerns on this invention.

  [Terminology]

  In the present invention, in FIG. 1, the vertical direction is referred to as the vertical direction or the Z direction, the horizontal direction is referred to as the horizontal direction or the X direction, and the paper back direction is referred to as the front-rear direction or the Y direction. However, their directions differ depending on the probe board in which a large number of contacts are arranged and the probe card using the probe board, that is, the electrical connection device in a state where the probe is attached to the tester, particularly the posture of the probe board.

  Therefore, in the electrical connection device according to the present invention, in the state where it is attached to the tester, the vertical direction in the present invention is actually the vertical direction, the upside down state, and the diagonal direction. It may be used in any state such as a state.

  [Example]

  Referring to FIG. 1, an electrical connection device 10 uses a plurality of uncut integrated circuits formed on a disk-shaped semiconductor wafer as a device under test 12, and these integrated circuits are used once or a plurality of times. Separately test or test at the same time. Each integrated circuit has a plurality of electrodes 14 such as pad electrodes on the top surface.

  The wafer is vacuum-removably attracted to an inspection stage (not shown), and is moved in the three-dimensional directions of front and rear, left and right, and up and down, and angularly around the θ axis extending in the up and down direction prior to the test. It is rotated. Thereby, each electrode 14 is positioned so that contact is possible with the needle point of the contactor 20 demonstrated later.

  1 to 5, in addition to the plurality of contacts 20 described above, the connection device 10 further includes a reinforcing member 22 having a flat lower surface, and a circular flat plate shape held on the lower surface of the reinforcing member 22. The wiring board 24, the flat electrical connector 26 disposed on the lower surface of the wiring board 24, the probe substrate 28 disposed on the lower surface of the electrical connector 26, the reinforcing member 22, and the wiring board 24 upwardly spaced from each other. The chip substrate 30 disposed at a distance, the plurality of circuit chips 32 disposed on the upper surface of the chip substrate 30, the disk-shaped heat treatment member 34 disposed on the lower surface of the chip substrate 30, and the lower surface of the heat treatment member 34 And a plurality of heat radiating plates 36 attached thereto.

  In the illustrated example, each contact 20 uses a plate-like probe having a crank shape. Such a contact 20 is a known one described in, for example, Japanese Patent Application Laid-Open No. 2005-201844, and is supported on the lower surface of the probe substrate 28 in a cantilever shape.

  However, each contact 20 includes a probe made from a fine metal wire such as a tungsten wire, a plate-like probe produced using a photolithography technique and a deposition technique, and one surface of an electrical insulating sheet such as polyimide. A plurality of wirings may be formed, and a conventionally known shape and structure such as a probe using a part of the wirings as a contact may be used.

  The reinforcing member 22 is made of a metal material such as a stainless steel plate and has a flat front shape. However, actually, as shown in FIG. 3, the reinforcing member 22 includes an inner annular portion 22a, an outer annular portion 22b, a plurality of connecting portions 22c that connect both the annular portions 22a and 22b, and an outer portion. A plurality of extending portions 22d extending radially outward from the annular portion 22b, and a cross-shaped central frame portion 22e integrally extending inside the inner annular portion 22a, and the upper and lower directions between these portions. It has a shape like a steered wheel that acts as a space that opens to the front.

  For example, as described in JP 2008-145238 A, an annular thermal deformation suppressing member that suppresses thermal deformation of the reinforcing member 22 may be disposed above the reinforcing member 22.

  The wiring board 24 is manufactured in a disk shape from an electrically insulating resin such as a glass-filled epoxy resin, and a plurality of wiring boards used for passing test signals to the probe board 28 (and thus the contact 20), the circuit chip 32, and the like. It has a conductive path, that is, internal wiring (not shown). The test signal is an electrical signal such as power for testing, a supply signal supplied to the integrated circuit for testing, and a response signal from the integrated circuit to the supply signal.

  A plurality of connectors 38 (see FIGS. 2 and 3) that are long in the radial direction are arranged at intervals in the circumferential direction on the outer peripheral edge of the upper surface of the wiring board 24. In addition, a plurality of connectors 40 (see FIGS. 2 and 3) that are long in the radial direction are arranged at intervals in the circumferential direction in the middle portion of the upper surface of the wiring board 24.

  The connector 38 is electrically connected to an electric circuit of the tester, and is used for passing an electric signal between the electric circuit and the connection device 10, particularly the wiring board 24. The connector 40 protrudes upward from the space between the inner annular portion 22a and the outer annular portion 22b of the reinforcing member 22.

  As shown in FIG. 7, each connector 40 is coupled to another radially long connector 42 attached to the lower surface of the chip substrate 30. One of the connected connectors 40 and 42 is either a male or female connector, and the other is a male or female connector.

  Each internal wiring of the wiring board 24 includes an electrical connection between the connector 38 and the connector 40 (and thus the circuit chip 32), an electrical connection between the connector 38 and the electrical connector 26 (and thus the contact 20), and a connector. This contributes to electrical connection between 40 (and thus the circuit chip 32) and the electrical connector 26 (and thus the contact 20).

  For this reason, one end of each internal wiring of the wiring board 24 is connected to a terminal (not shown) of the connector 38 and a part of the terminal (not shown) of the connector 40 (and thus a part of the terminal of the connector 42). The chip 32) and the electrical connector 26 are electrically connected to any one of the internal wirings (and thus the contacts 20) of the probe board 28.

  On the other hand, the other end of each internal wiring of the wiring board 24 is a part of the remaining terminals of the connector 40 (and thus the circuit chip 32 via a part of the remaining terminals of the connector 42), and an electrical connector. 26 is electrically connected to any one of the internal wirings (and thus the contacts 20) of the probe substrate 28 via 26.

  Thereby, each contact 20 is electrically connected to the terminal of the connector 38 via a part of the internal wiring of the wiring board 24 or a circuit via a part of the remaining internal wiring of the wiring board 24. It is electrically connected to the chip 32.

  As a result, each terminal of the connector 38 acts as a terminal for connecting the contact 20 to the electrical circuit of the tester. Each circuit chip 32 is electrically connected to an electric circuit of a tester (not shown) via connectors 38, 40, and 42 and electrically connected to the contact 20 via connectors 40 and 42. It is connected.

  The reinforcing member 22 and the wiring board 24 are coaxially coupled by a plurality of screw members (not shown) in a state where the lower surface of the reinforcing member 22 and the upper surface of the wiring board 24 are in contact with each other.

  The electrical connector 26 includes a plate-like electrically insulating pin holder (not shown) and a number of connection pins (not shown) extending through the pin holder in the vertical direction. Such an electrical connector 26 is described in, for example, Japanese Patent Application Laid-Open No. 2008-145238.

  The electrical connector 26 electrically connects the internal wiring of the wiring board 24 to the conductive path of the probe board 28, that is, the internal wiring (not shown) by the connection pins described above.

  The electrical connector 26 is coupled to the lower surface of the wiring board 24 at the pin holder by a plurality of screw members and appropriate members (none of which are shown) while the upper surface of the pin holder is in contact with the lower surface of the wiring board 24. Has been.

  As each connection pin, a pogo pin having an upper end and a lower end separated by a spring can be used. Each connection pin is pressed by a connection land (not shown) having an upper end provided on the lower surface of the wiring board 24 and electrically connected to the internal wiring of the wiring board 24, and a lower end being the upper surface of the probe board 28. And is pressed by a connection land (not shown) electrically connected to the internal wiring of the probe board 28.

  In the illustrated example, the probe substrate 28 is a multilayer substrate (not shown) formed of an electrically insulating resin such as ceramic from a multilayer sheet (not shown) formed of an electrically insulating resin such as polyimide resin. The contact board 20 is attached to the lower surface of the multilayer sheet in a cantilever manner.

  The multilayer sheet has a known shape and structure having a plurality of internal wirings (not shown) inside and a plurality of probe lands (not shown) electrically connected to the internal wirings of the multilayer sheet on the lower surface. And is formed integrally with the multilayer substrate.

  The multilayer substrate has a plurality of internal wirings (not shown) that are electrically connected to the connection lands where the connection pins of the electrical connector 26 are pressed. Each internal wiring of the multilayer substrate is electrically connected to the internal wiring of the multilayer sheet described above, and is used for passing test signals to the contact 20 together with the internal wiring.

  Each contact 20 is cantilevered on the above-described probe land by a method such as bonding with a conductive bonding material such as solder, laser welding, or the like with its tip (that is, the needle tip) protruding downward. It is attached to the shape.

  The probe board 28 as described above is pressed against the lower surface of the wiring board 24 by an appropriate member at each of a plurality of locations in a state where the upper surface of the multilayer board is pressed toward the lower surface of the electrical connector 26. 24 and the reinforcing member 22. For this reason, in the illustrated example, the wiring board 24 and the reinforcing member 52 act as a support for supporting the probe board 28.

  Similar to the wiring substrate 24, the chip substrate 30 is manufactured in a disk shape having a smaller diameter than the wiring substrate 24 by an electrically insulating resin such as an epoxy resin containing glass. One end of the internal wiring of the chip substrate 30 is electrically connected to the terminal of the connector 42, and the other end is electrically connected to either the circuit chip 32 or the heat treatment member 34.

  As shown in FIG. 5, the connector 42 is received in a notch 44 provided in the heat treatment member 34, and is attached to the lower surface of the chip substrate 30 by an appropriate attachment member.

  In the chip substrate 30, the connector 42 is coupled to the connector 40, so that the heat treatment member 34 and the heat radiating plate 36 are maintained on the wiring substrate 24 at the peripheral portion with the reinforcing member 22 and the wiring substrate 24 spaced apart upward. Has been. The chip substrate 30 is also maintained on the wiring substrate 24 in the central portion as described above by the spacer 46 (see FIG. 1) attached to the central portion of the upper surface of the wiring substrate 24 in an upright state. For this reason, the wiring substrate 24 also functions as a support for the chip substrate 30.

  The spacer 46 and the chip substrate 30 are detachably coupled by a screw member 48 (see FIG. 2) that penetrates the chip substrate 30 from above and is screwed to the spacer 46.

  As described above, the chip substrate 30 is supported by the wiring substrate 24 via the screw member 48 and the spacer 46 at the center thereof, and is connected to the wiring substrate 24 via the connectors 40 and 42 at the outer peripheral edge. It is supported. For this reason, the chip substrate 46 is stably supported by the wiring substrate 24.

  In addition, the chip substrate 30 is attached to the spacer 46 attached to the wiring substrate 24 by the screw member 48 at the center thereof, and the connectors 38, 40, and 42 are long in the radial direction. The direction of thermal expansion and contraction of the substrate 30 becomes the radial direction, and the thermal change of the chip substrate 30 is stabilized.

  In the illustrated example, as the heat treatment member 34, a thermo module that absorbs the heat of the chip substrate 30 from the chip substrate 30 side and releases the absorbed heat to the heat radiating plate 36 side (the side opposite to the chip substrate 30 side). Is used.

  As shown in FIGS. 5 to 7, the heat radiating plate 36 is a known one having a plurality of heat radiating fins 36b protruding in the same direction from one surface of the plate-like base 36a, and the other surface of the base 36a. Is detachably attached to the lower surface of the heat treatment member 34 such that the heat radiation fin 36b protrudes downward and the heat radiation fin 36b extends in the radial direction.

  Each circuit chip 32 is an electronic component such as an LSI (integrated circuit) including a plurality of electronic circuits, an IC relay, or an IC capacitor, and is electrically connected to the internal wiring of the chip substrate 30.

  During the electrical test of the inspection object 12, the inspection object 12 is heated and maintained at a high temperature such as plus 120 ° C. by the inspection stage. As a result, the probe board 28, the electrical connector 26, the wiring board 24, the reinforcing member 22 and the chip board 30 of the electrical connection device 10 are also heated from below by the inspection stage and the inspected body 12 and heated to a high temperature. The

  However, the chip substrate 30 is spaced upward from the reinforcing member 22 and the wiring substrate 24, and there is a space that allows the passage of air between the heat treatment member 34 and the plurality of heat radiating plates 36 and the reinforcing member 22 and the wiring substrate 24. Therefore, the chip substrate 30 is cooled by the heat absorbing action and the heat releasing action by the heat treatment member 34 and the plurality of heat sinks 36.

  For this reason, the air permeability between the reinforcing member 22 and the wiring substrate 24 and the chip substrate 30 is good, and the heat treatment member 34 and the heat radiating plate 36 operate efficiently. Therefore, the chip substrate 30 is efficiently cooled, and the chip substrate The temperature rise of the circuit chip 32 arranged at 30 is effectively suppressed.

  As a result, according to the connection device 10, the plurality of circuit chips 32 are disposed on the chip substrate 30, and the chip substrate 30 is disposed above the reinforcing member 22 and the wiring substrate 24. 30 and the circuit chip 32 disposed thereon are efficiently suppressed from being heated to a high temperature by heat from the reinforcing member 22 and the wiring board 24 side, and malfunction of the circuit chip 32 due to the temperature rise is prevented. The

  Instead of connecting the internal wiring of the wiring substrate 24 and the internal wiring of the chip substrate 30 by the connectors 40 and 42 coupled to each other, as shown in FIG. 8, they may be connected via a flat cable (FPC) 50. Good. In this case, the flat cable 50 includes connectors 52 and 54 coupled to the connectors 40 and 42 at one end and the other end.

  Further, a heating element 62 such as a heater for adjusting the temperature of the connection device 60 may be provided on the probe substrate 28 as in the electrical connection device 60 shown in FIG. In this case, the heating element 62 receives the heating power from the prober electric circuit, and the heating power amount is adjusted by the prober electric circuit so that the temperature of the probe substrate 28 becomes a set temperature corresponding to the test temperature of the device under test 12. Be controlled.

  As a result, the probe substrate 28 is heated from the lower side by the inspection object 12 and the inspection stage and is heated by the internal heating element 62 to be maintained at a temperature corresponding to the temperature of the inspection object 12.

  As a result, according to the connection device 60, the probe substrate 28 is restrained from thermal deformation of the probe substrate 28 and the reinforcing member 22 whose central portion is convex downward, and the thermal deformation of the reinforcing member 22 and the probe substrate 28. The change in the height position and the coordinate position of the needle tip due to this is remarkably reduced.

  Furthermore, a temperature sensor 64 for detecting the temperature of the chip substrate 30 may be provided on the chip substrate 30 as in the electrical connection device 60 shown in FIG. In this case, the amount of heating power supplied to the heating element 62 may be adjusted based on the temperature of the chip substrate 30 detected by the temperature sensor 64, and the degree of heat absorption and heat dissipation may be adjusted by the heat treatment member 34. .

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit described in the claims.

DESCRIPTION OF SYMBOLS 10,60 Electrical connection apparatus 12 Test object 14 Electrode 20 Contact 22 Reinforcing member 24 Wiring board 26 Electrical connector 28 Probe board 30 Chip board 32 Circuit chip 34 Heat treatment member 36 Heat sink 38, 40, 42 Connector 44 Notch Part 46 Spacer 50 Flat cable 52, 54 Flat cable connector 62 Heating element 64 Temperature sensor

Claims (10)

  A support body having an upper surface and a lower surface; a probe board assembled and supported on the lower surface of the support body in a state where the thickness direction is set to the vertical direction; and a plurality of contacts attached to the lower surface of the probe board A chip substrate having a thickness direction set to the vertical direction and spaced upward from the support, wherein the chip substrate has a plurality of circuit chips disposed on an upper surface thereof, and the chip substrate. A heat treatment member disposed on the lower surface of the chip substrate, wherein the heat treatment member absorbs and dissipates heat on the chip substrate side and a side different from the chip substrate side, and a heat treatment plate attached to the lower side of the heat treatment member And an electrical connection device.   The connection device according to claim 1, wherein the heat treatment member includes a member that absorbs heat from the chip substrate side and releases the heat to a side different from the chip substrate side, and the heat treatment plate includes a heat dissipation plate.   The chip substrate includes a plurality of first internal wirings electrically connected to the circuit chip, and the support body includes a plurality of second electrical connections electrically connected to at least a part of the first internal wirings. The connection device according to claim 1, comprising an internal wiring and a plurality of third internal wirings electrically connected to the contact.   A first connector disposed on a lower surface of the chip substrate, the first connector having a plurality of first connection terminals electrically connected to at least a part of the first internal wiring; A second connector disposed on the upper surface of the support and coupled to the first connector, wherein the second connectors are electrically connected to at least a part of the second internal wiring. The connection device according to claim 1, further comprising a second connector having a connection terminal.   5. The connection device according to claim 4, wherein the first and second connectors couple the support and the chip substrate with an interval in the vertical direction.   Furthermore, the connection apparatus of any one of Claim 1 to 6 containing the spacer which couple | bonds the said support body and the said chip | tip board | substrate.   The connection device according to claim 6, wherein the first and second internal wirings are electrically connected by a flat cable including a plurality of wirings.   And a third connector disposed on the upper surface of the support body, the third connector having a plurality of third connection terminals electrically connected to at least the remaining part of the second internal wiring. The connection device according to claim 4, comprising a connector.   Furthermore, the connection apparatus of any one of Claim 1 to 8 including the temperature sensor arrange | positioned at the said support body and detecting the temperature of this support body.   The connection device according to claim 1, further comprising a heating element that is disposed on the probe substrate and heats the probe substrate.

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