JP2010267822A - Superconducting coil device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To sufficiently reduce a peel force working on a superconducting wire in a resin-impregnated superconducting coil device, also secure a heat transfer path in a radial direction of a coil between superconducting wires with different winding numbers and improve heat transfer performance in a breadthwise direction of the superconducting wire. <P>SOLUTION: In the superconducting coil device comprising a tape-like superconducting wire 4 and an insulative material 5 which are coiled, release treatment for reducing the peel force working on the superconducting wire 4 on the surface of the insulative material 5 is applied to at least a part except both breadthwise ends in a plane of a tape-like insulative material 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a superconducting coil device, and more particularly, to a superconducting coil device applied to superconducting application equipment such as a magnetic resonance imaging diagnosis device, a superconducting magnetic energy storage device, and a single crystal pulling device.

  In recent years, with the improvement of superconducting technology, superconducting applications such as a magnetic resonance imaging diagnostic apparatus (MRI), a superconducting magnetic energy storage apparatus (SMES), and a metal single crystal pulling apparatus have been put into practical use.

  These devices have a structure in which a superconducting coil wound with a superconducting wire is built in, and development of a superconducting coil using a high-temperature superconducting wire excellent in critical current characteristics in a high magnetic field is being promoted.

  As a high-temperature superconducting wire constituting the superconducting coil, for example, a thin film superconducting wire having a multilayer structure in which a tape-shaped metal substrate, an intermediate layer, a superconducting layer, and a protective metal layer are laminated has been proposed (see Patent Document 1).

  By the way, a superconducting coil is generally used in a state of being impregnated with a resin, and in such a thin film superconducting wire, a tensile force (peeling in the laminating direction due to a difference in thermal contraction rate between the resin and the wire during cooling is used. Force), delamination or cracks occur in the superconducting thin film, and stable superconducting properties may not be obtained.

  In addition, until now, as a measure to reduce the peeling force acting on the superconducting wire, the entire surface of the insulating material to be wound together is intentionally peeled off at the interface between the release material and the resin, Means for preventing the superconducting wire itself from being pulled has been proposed (see, for example, Patent Document 2).

JP 2007-280710 A JP 2008-243588 A

  However, if the entire surface of the insulating material is demolded, the heat transfer path in the coil radial direction between superconducting wires having different numbers of turns will be cut off during cooling or the like, which may cause thermal damage during coil heating. There is.

  The present invention has been made in view of such circumstances, and in a superconducting coil apparatus impregnated with a resin, it is possible to sufficiently reduce the peeling force acting on the superconducting wire and to coil the superconducting wires having different winding numbers. An object is to secure a heat transfer path in the radial direction and improve the heat transfer performance in the radial direction of the superconducting wire.

  In order to achieve the above object, in the present invention, in a superconducting coil device in which a tape-shaped superconducting wire and an insulating material are wound, a mold release treatment that reduces the peeling force acting on the superconducting wire on the surface of the insulating material. Is provided on at least a part of a portion excluding both ends in the width direction in the surface of the tape-shaped insulating material.

  Further, in the present invention, in a superwire coil device formed by winding a tape-shaped superconducting wire having an insulating coating and a metal tape, a mold release for reducing the peeling force acting on the superconducting wire on the surface of the metal tape. Provided is a superconducting coil device characterized in that the treatment is performed on at least a part of a portion excluding both ends in the width direction in the plane of the metal tape.

  In the present invention, the superconducting wire comprises a tape-shaped metal substrate, a superconducting layer made of a high-temperature superconducting wire formed on the metal substrate via an intermediate layer, and a protection formed on the superconducting layer. There is provided a superconducting coil device having a metal layer and having only a surface of an insulating material close to the superconducting layer being subjected to release treatment.

  In the present invention, there is also provided a superconducting coil device, wherein the release material is at least one selected from the group consisting of a fluororesin tape, paraffin, grease, and silicon oil.

  Further, in the present invention, a superconducting wire is attached with a wide tape wire wider than the superconducting wire, and both ends of the wide tape wire in the direction perpendicular to the longitudinal direction are non-separation processing portions. A coil device is provided.

  The present invention also provides a superconducting coil device in which the tape wire is attached to a side of the superconducting wire close to the metal substrate.

  According to the present invention, a release treatment that reduces the peeling force acting on the superconducting wire on the surface of the insulating material is applied to at least a part of the portion in the plane of the tape-shaped insulating material or the metal tape except for both ends in the width direction, By adopting a structure in which the tape-shaped superconducting wire is in contact with the resin at both ends in the width direction of the superconducting wire, it is possible to secure a heat transfer path in the coil radial direction between the superconducting wires having different winding numbers, and the width of the superconducting wire. The heat transfer performance with respect to the direction can be improved.

The block diagram which shows the superconducting coil apparatus by 1st Embodiment of this invention. The expanded sectional view which shows the structure of the superconducting wire shown in FIG. The block diagram which shows the superconducting coil apparatus by 2nd Embodiment of this invention. The block diagram which shows the superconducting coil apparatus by 3rd Embodiment of this invention.

  Embodiments of a superconducting coil device according to the present invention will be described below with reference to the drawings.

First Embodiment (FIGS. 1 and 2)
FIG. 1 is a block diagram showing the whole superconducting coil device 1A according to the first embodiment of the present invention, and FIG. 2 is an enlarged view showing a state in which the annular portion of the superconducting coil device 1A shown in FIG. It is a longitudinal cross-sectional view.

  As shown in FIG. 1, the superconducting coil device 1A of the present embodiment is composed of a superconducting coil 2 having an annular shape as a whole.

  In FIG. 1, a superconducting coil 2 includes a tape-like superconducting wire 4, an insulating material 5, and a release material 6 in order from the inner diameter side to the outer diameter side. These superconducting wire 4, insulating material 5, and release material 6 are fixed by resin 7.

  And it is set as the structure which wound the tape-shaped superconducting wire 4 and the insulating material 5 by which the mold release process was carried out by the mold release material 6, and the resin 7 is filled between these. A stabilizing metal layer 4e (copper, stainless steel, etc.) may be further formed on the protective metal layer 4d or around the multilayer structure.

  As shown in FIG. 2, the superconducting wire 4 includes a tape-shaped metal substrate 4a, a superconducting layer 4c made of a high-temperature superconducting wire formed on the metal substrate 4a via an intermediate layer 4b, and the superconducting layer 4c. Only the surface of the insulating material 5 on the side in contact with the superconducting layer 4c is subjected to a release treatment. A stabilizing metal layer 4e (copper, stainless steel, etc.) may be further formed on the protective metal layer 4d or around the multilayer structure.

  Thereby, in this embodiment, the tape-like insulating material 5 is configured such that both ends in the direction perpendicular to the longitudinal direction in the tape surface, that is, the width direction are not separated. In FIG. 2, an example is shown in which all but the both ends are subjected to the release treatment. However, it is needless to say that the release treatment may be performed on at least a part so as to obtain the effect of the present invention.

  In this way, the insulating material 5 having the same width as this is superposed on the tape-like superconducting wire 4 and wound in a ring shape, so that the separation force that partially acts on the superconducting wire on the surface of the insulating material 5 is reduced. Forming treatment is performed, and within the tape surface of the tape-shaped insulating material 5, release processing is performed except for both ends in the direction perpendicular to the longitudinal direction.

  In addition, as the mold release material 6, at least one selected from the group consisting of a fluororesin tape, paraffin, grease, and silicon oil is applied. Also, a tape made of Teflon (registered trademark) can be applied.

  Further, when the superconducting wire 4 is covered with insulation, the insulating material 5 is not necessary. Furthermore, a metal tape such as Cu or stainless steel may be wound together for the purpose of reinforcement, and in this case, the metal tape may be subjected to a release treatment.

  In the present embodiment configured as described above, the surface of the insulating material 5 subjected to the release treatment by the release material 6 does not directly contact the resin 7.

  In addition, since the adhesive force between the release material 6 and the resin 7 is relatively weak compared to the direct adhesive force between the insulating material 5 and the resin 7, the resin 7 between the superconducting wire 4 and the insulating material 5. When the shrinkage occurs, peeling occurs at the interface between the release material 6 and the resin 7, and a space is formed between the two. On the other hand, both ends in the width direction of the insulating material 5 not subjected to the release treatment are in direct contact with the resin 7.

  According to the superconducting coil device 1A of the present embodiment, when the resin 7 provided between the superconducting wire 4 and the insulating material 5 contracts, the surface of the superconducting wire 4 is normally pulled, but in this embodiment, the separation is performed. Peeling occurs at the interface between the shape member 6 and the resin 7, and a space is created between the release member 6 and the resin 7. Therefore, the peeling force acting on the superconducting wire 4 can be greatly reduced.

  In addition, since both ends in the width direction of the insulating material 5 are not subjected to the release treatment, it is possible to secure a heat transfer path in the coil radial direction between the superconducting wires 4 having different winding numbers.

[Second Embodiment] (FIG. 3)
FIG. 3 is a block diagram showing the entire superconducting coil device 1B according to the second embodiment of the present invention.

  In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIGS. 1 and 2, and redundant descriptions are omitted.

  In FIG. 3, in this embodiment, the superconducting wire 4 includes a tape-like metal substrate 4a shown in FIG. 2, and a superconducting layer 4c made of a high-temperature superconducting wire formed on the metal substrate 4a via an intermediate layer 4b. The multilayer structure has a protective metal layer 4d formed on (on the surface of) the superconducting layer 4c, and only the surface of the insulating material 5 in contact with the superconducting layer 4c is subjected to a release treatment.

  The high temperature superconducting wire has a wire structure generally called a Coated Conductor, and is composed of a plurality of laminated members. That is, a metal substrate 4a (Hastelloy (registered trademark), etc.), a superconducting layer 4c (high-temperature superconducting thin film such as Re123 series) formed thereon via an intermediate layer 4b (polycrystalline thin film, etc.), and the superconductivity This is a protective metal layer 4d (gold, silver, etc.) formed on the layer 4c. A stabilizing metal layer 4e (copper, stainless steel, etc.) may be further formed on the protective metal layer 4d or around the multilayer structure.

  The high-temperature superconducting wire 4 configured in this manner is asymmetric with respect to the stacking direction. In this embodiment, only the surface of the insulating material 5 on the side close to the superconducting layer 4c is partially released by the release material 6. It becomes the composition.

  The surface of the insulating material 5 on the side close to the superconducting layer 4c is subjected to the release treatment, but the surface of the insulating material 5 on the side close to the metal substrate 4a is not subjected to the release treatment, and is in direct contact with the resin 7. .

  A member with high strength is often used for the metal substrate 4a, and the superconducting wire 4 is formed on the surface of the wire close to the metal substrate 4a as compared with the tensile force perpendicular to the surface of the wire close to the superconducting layer 4c. Strong against vertical tensile forces.

  For this reason, according to the superconducting coil device 1B of the present embodiment, not only can a heat transfer path in the coil radial direction between the superconducting wires 4 having different winding numbers be secured, but also from the surface of the superconducting wire 4 closer to the metal substrate 4a. The heat transfer performance can be improved.

[Third Embodiment] (FIG. 4)
FIG. 4 is a block diagram showing the entire superconducting coil device 1C according to the third embodiment of the present invention.

  In addition, about the structure same as the structure to 1st Embodiment 1 and 2nd Embodiment, the same code | symbol is attached | subjected to the same part of illustration, and the overlapping description is abbreviate | omitted.

  As shown in FIG. 4, in the superconducting coil device 1 </ b> C of the present embodiment, a wide tape wire 8 wider than the superconducting wire 4 is attached to the superconducting wire 4. Both ends in the direction perpendicular to the longitudinal direction are used as non-release processing sections.

  The wide tape wire 8 is attached to the superconducting wire 4 on the side close to the metal substrate 4a.

  Thus, according to the present embodiment, the wide tape wire 8 wider than the superconducting wire 4 is attached to the surface of the wire near the metal substrate 4a. The wide tape wire 8 is preferably a member (copper, stainless steel, aluminum, or the like) having better thermal conductivity than a metal substrate (Hastelloy (registered trademark), etc.).

  According to the superconducting coil device 1C of the present embodiment, the wide tape wire 8 wider than the wire is attached to the superconducting wire 4, so that the wide tape wire 8 is in contact with the resin 7 at both ends in the width direction. Can do.

1A to 1C Superconducting coil device 1 Superconducting wire 2 Superconducting coil 4a Metal substrate 4b Intermediate layer 4c Superconducting layer 4d Protective metal layer 4e Stabilizing metal layer 4 Superconducting wire 5 Insulating material 6 Release material 7 Resin 8 Wide tape wire

Claims (6)

In a superconducting coil device in which a tape-shaped superconducting wire and an insulating material are wound, a release treatment for reducing the peeling force acting on the superconducting wire on the surface of the insulating material is performed on the surface of the tape-shaped insulating material. A superconducting coil device characterized by being applied to at least a part of a portion excluding both ends in the direction. In a superconductor coil device formed by winding a tape-shaped superconducting wire having an insulating coating and a metal tape, a release treatment for reducing the peeling force acting on the superconducting wire on the surface of the metal tape is performed on the metal tape. A superconducting coil device characterized in that it is applied to at least a part of a portion excluding both ends in the width direction in the plane. The superconducting wire has a tape-shaped metal substrate, a superconducting layer made of a high-temperature superconducting wire formed on the metal substrate via an intermediate layer, and a protective metal layer formed on the superconducting layer. The superconducting coil device according to claim 1 or 2, wherein only the surface of the insulating material close to the superconducting layer is subjected to a release treatment. The superconducting coil device according to claim 1 or 2, wherein the release material is made of at least one selected from the group consisting of fluororesin, paraffin, grease, and silicon oil. A wide tape wire wider than the superconducting wire is attached to the superconducting wire, and both ends of the wide tape wire in a direction perpendicular to the longitudinal direction are non-separation processing portions in the tape surface. 2. The superconducting coil device according to 2. The superconducting coil device according to claim 1 or 2, wherein the tape wire is attached to a side of the superconducting wire close to the metal substrate.

Images