JP2010266598A - Optical wiring member - Google Patents

Optical wiring member Download PDF

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JP2010266598A
JP2010266598A JP2009116673A JP2009116673A JP2010266598A JP 2010266598 A JP2010266598 A JP 2010266598A JP 2009116673 A JP2009116673 A JP 2009116673A JP 2009116673 A JP2009116673 A JP 2009116673A JP 2010266598 A JP2010266598 A JP 2010266598A
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optical
resin layer
layer
wiring member
optical element
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Takemasa Ushiwatari
剛真 牛渡
Mitsuki Hirano
光樹 平野
Shugen Ryu
主鉉 柳
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical wiring member in which strength is enhanced in an optical element mounting part. <P>SOLUTION: In the optical wiring member 11: a conductor wiring layer 3 for mounting an optical element 2 is installed on one side face of a substrate 1; a resin layer 4 to be an optical waveguide is installed on the opposite side face of the substrate 1; and a reflection mirror 6 for optically coupling the optical element 2 and the core 5 of the optical waveguide is formed in the resin layer 4. A reinforcing layer 7 composed of a conductive material is provided on the resin layer 4 side of the substrate 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、電子機器内において光信号を伝送する光配線部材に係り、特に、光素子実装箇所の強度を高めた光配線部材に関する。   The present invention relates to an optical wiring member that transmits an optical signal in an electronic apparatus, and more particularly, to an optical wiring member that increases the strength of an optical element mounting portion.

携帯電話機などの電子機器内において、光信号を伝送するために光配線部材（又は光電気複合配線部材）が用いられる。光配線部材は、基材の片側面に光素子が実装される導体配線層が設けられ、上記基材の反対側面に光導波路となる樹脂層が設けられたものである。光配線部材を電子機器内の狭い空間や可動部分に適用する場合、基材にはフレキシブル基板が用いられ、基材に積層する光導波路となる樹脂層にもフレキシブル基板と同程度に柔軟な樹脂が用いられ、基材及び樹脂層に屈曲部が形成される。   In an electronic device such as a mobile phone, an optical wiring member (or a photoelectric composite wiring member) is used to transmit an optical signal. In the optical wiring member, a conductor wiring layer on which an optical element is mounted is provided on one side surface of a base material, and a resin layer serving as an optical waveguide is provided on the opposite side surface of the base material. When an optical wiring member is applied to a narrow space or a movable part in an electronic device, a flexible substrate is used as a base material, and a resin layer that is an optical waveguide laminated on the base material is also as flexible as a flexible substrate. Is used, and bent portions are formed in the substrate and the resin layer.

特許文献１には、光導波路フィルムの機械的強度を補強するために、コアに設けた部品搭載ガイドに微小ミラー部品を搭載する技術が示されている。   Patent Document 1 discloses a technique for mounting a micromirror component on a component mounting guide provided on a core in order to reinforce the mechanical strength of an optical waveguide film.

特開２００５−１６４８０１号公報JP 2005-164801 A

光配線部材において、導体配線層に光素子を実装するとき、光素子を所定以上の力で導体配線層に押し付ける必要がある。しかし、光素子を押し付けた力により、樹脂層や基材が変形することがある。特に、基材にフレキシブル基板が用いられ、樹脂層に柔軟な樹脂が用いられている場合、光素子を押し付けた力で樹脂層や基材が変形する傾向は顕著となる。樹脂層や基材が変形すると、光素子を押し付ける力が不十分となって光素子が正しく実装されない。   In the optical wiring member, when the optical element is mounted on the conductor wiring layer, it is necessary to press the optical element against the conductor wiring layer with a predetermined force or more. However, the resin layer and the substrate may be deformed by the force of pressing the optical element. In particular, when a flexible substrate is used for the base material and a flexible resin is used for the resin layer, the tendency of the resin layer and the base material to be deformed by the force of pressing the optical element becomes significant. If the resin layer or the base material is deformed, the force for pressing the optical element is insufficient and the optical element is not correctly mounted.

光素子実装箇所には、光素子と光導波路のコアとの光結合のために、樹脂層中に反射ミラーを設置する。つまり、光素子実装箇所は反射ミラー設置箇所でもある。反射ミラーは樹脂層をダイシング等の切削加工によりＶ溝を掘って形成する。この切削加工のときに、樹脂層が変形すると、反射ミラーがコアに正しく形成されない。また、Ｖ溝が形成されたことにより、樹脂層は、反射ミラー設置箇所（＝光素子実装箇所）において強度が低くなるため、光素子を実装するときに変形しやすくなる。   A reflection mirror is installed in the resin layer at the optical element mounting location for optical coupling between the optical element and the core of the optical waveguide. That is, the optical element mounting location is also a reflection mirror installation location. The reflection mirror is formed by digging a V-groove by cutting a resin layer such as dicing. If the resin layer is deformed during the cutting process, the reflecting mirror is not correctly formed on the core. In addition, since the V-groove is formed, the resin layer has a low strength at the reflection mirror installation location (= optical device mounting location), and thus is easily deformed when the optical device is mounted.

そこで、本発明の目的は、上記課題を解決し、光素子実装箇所の強度を高めた光配線部材を提供することにある。   Accordingly, an object of the present invention is to provide an optical wiring member that solves the above-described problems and has increased strength at the location where the optical element is mounted.

上記目的を達成するために本発明は、基材の片側面に光素子が実装される導体配線層が設けられ、上記基材の反対側面に光導波路となる樹脂層が設けられ、上記樹脂層中に上記光素子と上記光導波路のコアとを光結合する反射ミラーが形成された光配線部材において、上記基材の上記樹脂層側に、導電材からなる補強層が設けられたものである。   In order to achieve the above object, the present invention provides a conductive wiring layer on which an optical element is mounted on one side of a substrate, a resin layer serving as an optical waveguide on the opposite side of the substrate, and the resin layer In the optical wiring member in which a reflection mirror for optically coupling the optical element and the core of the optical waveguide is formed, a reinforcing layer made of a conductive material is provided on the resin layer side of the base material. .

上記補強層は、上記光導波路のコアに添わせて設けられてもよい。   The reinforcing layer may be provided along the core of the optical waveguide.

上記補強層は、少なくとも上記光素子と上記反射ミラーとの間を通る光が透過可能に構成されていてもよい。   The reinforcing layer may be configured to transmit at least light passing between the optical element and the reflecting mirror.

上記補強層は、上記反射ミラーの周辺部を覆うように形成されていてもよい。   The reinforcing layer may be formed so as to cover a peripheral portion of the reflecting mirror.

上記基材及び上記樹脂層が屈曲部を有し、上記補強層は、上記基材及び上記樹脂層の屈曲部を避けて設けられていてもよい。   The base material and the resin layer may have a bent portion, and the reinforcing layer may be provided to avoid the bent portion of the base material and the resin layer.

上記補強層は、ヤング率が１ＧＰａ以上であってもよい。   The reinforcing layer may have a Young's modulus of 1 GPa or more.

本発明によれば、光素子実装箇所の強度を高めることができる。   According to the present invention, the strength of the optical element mounting portion can be increased.

本発明の一実施形態を示す光配線部材のコア縦断面図である。It is a core longitudinal cross-sectional view of the optical wiring member which shows one Embodiment of this invention. 本発明の一実施形態を示す光配線部材のコア縦断面図である。It is a core longitudinal cross-sectional view of the optical wiring member which shows one Embodiment of this invention. 本発明の一実施形態を示す光配線部材のコア横断面図である。It is a core cross-sectional view of the optical wiring member which shows one Embodiment of this invention. 本発明の一実施形態を示す光配線部材のコア横断面図である。It is a core cross-sectional view of the optical wiring member which shows one Embodiment of this invention. 本発明の一実施形態を示す光配線部材のコア平断面図である。It is a core plane sectional view of an optical wiring member showing one embodiment of the present invention. 本発明の一実施形態を示す光配線部材のコア平断面図である。It is a core plane sectional view of an optical wiring member showing one embodiment of the present invention.

以下、本発明の一実施形態を添付図面に基づいて詳述する。   Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

図１に示されるように、本発明に係る光配線部材１１は、基材１の片側面に光素子２が実装される導体配線層３が設けられ、基材１の反対側面に光導波路となる樹脂層４が設けられ、樹脂層４中に光素子２と光導波路のコア５とを光結合する反射ミラー６が形成された光配線部材１１において、基材１の樹脂層４側に、導電材からなる補強層７が設けられたものである。   As shown in FIG. 1, an optical wiring member 11 according to the present invention is provided with a conductor wiring layer 3 on which an optical element 2 is mounted on one side of a base material 1, and an optical waveguide on the opposite side of the base material 1. In the optical wiring member 11 in which the reflection mirror 6 that optically couples the optical element 2 and the core 5 of the optical waveguide is formed in the resin layer 4, the resin layer 4 is formed on the resin layer 4 side of the substrate 1. A reinforcing layer 7 made of a conductive material is provided.

基材１は、リジッド基板又はフレキシブル基板である。   The base material 1 is a rigid substrate or a flexible substrate.

光素子２は、ＶＣＳＥＬ等の発光素子又は受光素子である。基材１には、光素子２以外にドライバＩＣ、アンプＩＣなどの半導体回路部品やその他の電気部品を実装してもよい。光素子２は、発光面又は受光面を基材に向けて実装される。   The optical element 2 is a light emitting element such as a VCSEL or a light receiving element. In addition to the optical element 2, a semiconductor circuit component such as a driver IC and an amplifier IC and other electrical components may be mounted on the base material 1. The optical element 2 is mounted with the light emitting surface or the light receiving surface facing the base material.

導体配線層３は、基材１の片側面に、公知のプリント配線法で形成される。光素子２をフリップチップ実装したい場合、導体配線層３はフリップチップ実装用の導体配線層とする。   The conductor wiring layer 3 is formed on one side of the substrate 1 by a known printed wiring method. When the optical element 2 is desired to be flip-chip mounted, the conductor wiring layer 3 is a conductor wiring layer for flip-chip mounting.

樹脂層４は、クラッド８とコア５を有し、光導波路を構成するものである。基材１がフレキシブル基板である場合、樹脂層４は柔軟に形成するのが好ましい。   The resin layer 4 has a clad 8 and a core 5 and constitutes an optical waveguide. When the base material 1 is a flexible substrate, the resin layer 4 is preferably formed flexibly.

反射ミラー６は、光素子２の発光面又は受光面の直下に位置し、コア５の長手方向に対して４５°をなすコア５の傾斜面からなる。反射ミラー６は、樹脂層４の表面をダイシングしてコア５と直角に交わって伸びるＶ溝を加工することにより、形成される。   The reflection mirror 6 is located immediately below the light emitting surface or the light receiving surface of the optical element 2 and includes an inclined surface of the core 5 that forms 45 ° with respect to the longitudinal direction of the core 5. The reflection mirror 6 is formed by dicing the surface of the resin layer 4 and processing a V-groove extending at right angles to the core 5.

本発明では、基材１の樹脂層４側に、導電材からなる補強層７が設けられる。補強層７は、導体配線層３に光素子２を実装するとき、光素子２を押し付けた力により、樹脂層４や基材１が変形することを防止する効果を有する。これにより、光素子２を押し付ける力が不足することなく、光素子２が正しく実装される。   In the present invention, a reinforcing layer 7 made of a conductive material is provided on the resin layer 4 side of the substrate 1. The reinforcing layer 7 has an effect of preventing the resin layer 4 and the base material 1 from being deformed by a force pressing the optical element 2 when the optical element 2 is mounted on the conductor wiring layer 3. Thereby, the optical element 2 is correctly mounted without insufficient force for pressing the optical element 2.

また、補強層７は、反射ミラー６を設けるために樹脂層４を切削加工するときに、樹脂層４が変形することを防止する効果を有する。これにより、反射ミラー６がコア５に正しく形成されるようになる。   Further, the reinforcing layer 7 has an effect of preventing the resin layer 4 from being deformed when the resin layer 4 is cut to provide the reflection mirror 6. As a result, the reflection mirror 6 is correctly formed on the core 5.

また、補強層７は、導体配線層３に光素子２を実装するときに、Ｖ溝の形成によって変形しやすくなった樹脂層４が変形することを防止する効果を有する。   Further, the reinforcing layer 7 has an effect of preventing the resin layer 4 that is easily deformed by forming the V-groove when the optical element 2 is mounted on the conductor wiring layer 3 from being deformed.

なお、補強層７が導電材からなるのは、リジッド基板、フレキシブル基板等の基材１には、片側面に導体配線層３を必ず形成するので、このとき同時一括に反対側面に補強層７を形成すれば、工程が簡素化されるからである。また、導電材は価格が安いので、補強層７を安価に形成することにも寄与する。   The reinforcing layer 7 is made of a conductive material because the conductor wiring layer 3 is always formed on one side surface of the base material 1 such as a rigid substrate or a flexible substrate. At this time, the reinforcing layer 7 is simultaneously formed on the opposite side surface. This is because the process is simplified. Moreover, since a conductive material is cheap, it contributes to forming the reinforcement layer 7 at low cost.

補強層７となる導電材は、導体配線層３と同じ銅に限らず、金属、導電性ポリマ、導電性のフィルムなどでもよい。補強層７は、導電材に限らず、非導電性のフィルム、ガラスでも補強の効果は期待できる。   The conductive material that becomes the reinforcing layer 7 is not limited to the same copper as the conductor wiring layer 3, and may be a metal, a conductive polymer, a conductive film, or the like. The reinforcing layer 7 is not limited to a conductive material, but a reinforcing effect can be expected even with a non-conductive film or glass.

図１の実施形態の光配線部材１１では、補強層７は、光導波路のコア５に添わせて設けられている。すなわち、補強層７とコア５が互いに接した状態を保って伸びている。このように、コア５に対して補強層７が近い位置にあると、コア５の強度を補強する効果が大きい。よって、樹脂層４の切削加工のときコア５の変形をより効果的に防止することができる。   In the optical wiring member 11 of the embodiment of FIG. 1, the reinforcing layer 7 is provided along the core 5 of the optical waveguide. That is, the reinforcing layer 7 and the core 5 are stretched while maintaining a state in contact with each other. As described above, when the reinforcing layer 7 is close to the core 5, the effect of reinforcing the strength of the core 5 is great. Therefore, deformation of the core 5 can be more effectively prevented when the resin layer 4 is cut.

図２の実施形態の光配線部材２１では、補強層７は、光導波路のコア５から離間して設けられている。すなわち、補強層７とコア５が互いに離れた状態を保って伸びている。この実施形態でも、光素子２を実装するとき樹脂層４や基材１が変形することを防止する効果、及び樹脂層４を切削加工するとき樹脂層４が変形することを防止する効果を有する。   In the optical wiring member 21 of the embodiment of FIG. 2, the reinforcing layer 7 is provided apart from the core 5 of the optical waveguide. That is, the reinforcing layer 7 and the core 5 are stretched while being separated from each other. This embodiment also has the effect of preventing the resin layer 4 and the base material 1 from being deformed when the optical element 2 is mounted, and the effect of preventing the resin layer 4 from being deformed when the resin layer 4 is cut. .

補強層７は、少なくとも光素子２と反射ミラー６との間を通る光が透過可能に構成されなければならない。このための実施形態を図３、図４に示す。   The reinforcing layer 7 must be configured to transmit at least light passing between the optical element 2 and the reflecting mirror 6. An embodiment for this purpose is shown in FIGS.

図３の実施形態の光配線部材３１では、補強層７は、光素子２と反射ミラー６との間には存在しない。すなわち、補強層７は、光素子２と反射ミラー６との間の光が通る範囲に穴が形成されている。例えば、補強層７に光を透過しない材料を用いた場合、反射ミラー６を補強層７で覆い隠してしまうと、光が透過しないので、補強層７に穴を形成することで、光が透過可能に構成される。   In the optical wiring member 31 of the embodiment of FIG. 3, the reinforcing layer 7 does not exist between the optical element 2 and the reflection mirror 6. That is, the reinforcing layer 7 has a hole formed in a range through which light passes between the optical element 2 and the reflection mirror 6. For example, when a material that does not transmit light is used for the reinforcing layer 7, if the reflecting mirror 6 is covered with the reinforcing layer 7, the light does not transmit. Therefore, by forming a hole in the reinforcing layer 7, the light is transmitted. Configured to be possible.

図４の実施形態の光配線部材４１では、補強層７は、光素子２と反射ミラー６との間に存在する。この場合、補強層７は、使用される光の帯域において透明な部材からなることで、光が透過可能に構成される。   In the optical wiring member 41 of the embodiment of FIG. 4, the reinforcing layer 7 exists between the optical element 2 and the reflection mirror 6. In this case, the reinforcing layer 7 is made of a transparent member in the band of light to be used, so that light can be transmitted.

補強層７は、反射ミラー６の周辺部を覆うように形成されるのが好ましい。特に、図３のように、光素子２と反射ミラー６との間に光が通るように補強層７に穴を形成する場合、穴径は光素子２と反射ミラー６との間の光路の断面の径より大きい必要がある。しかし、穴径が大きくなりすぎると、反射ミラー６の近傍の樹脂層４に対する補強効果が小さくなる。そこで、穴径を極力小さくするために、補強層７は、反射ミラー６の周辺部（好ましくは光路の断面の外周のすぐ近傍）を覆うように形成する。具体的には、図５又は図６のように構成する。   The reinforcing layer 7 is preferably formed so as to cover the periphery of the reflecting mirror 6. In particular, as shown in FIG. 3, when a hole is formed in the reinforcing layer 7 so that light passes between the optical element 2 and the reflecting mirror 6, the hole diameter is the optical path between the optical element 2 and the reflecting mirror 6. It must be larger than the diameter of the cross section. However, if the hole diameter becomes too large, the reinforcing effect on the resin layer 4 in the vicinity of the reflection mirror 6 is reduced. Therefore, in order to make the hole diameter as small as possible, the reinforcing layer 7 is formed so as to cover the periphery of the reflecting mirror 6 (preferably in the immediate vicinity of the outer periphery of the cross section of the optical path). Specifically, it is configured as shown in FIG.

図５の実施形態の光配線部材５１では、補強層７は、コア５の幅方向両側において、コア５から幅方向に所定距離を隔てた位置に、コア５と平行に長手方向に伸びるよう形成される。補強層７は、光素子２を押し付けたときの樹脂層４や基材１の変形を防止する効果と、反射ミラー６を設けるために樹脂層４を切削加工するときの樹脂層４の変形を防止する効果が有ればよいので、反射ミラー６の周辺部から離れるコア５の長手方向（図示右方向）には長く伸ばす必要はない。   In the optical wiring member 51 of the embodiment of FIG. 5, the reinforcing layer 7 is formed on both sides in the width direction of the core 5 so as to extend in the longitudinal direction in parallel with the core 5 at positions spaced apart from the core 5 in the width direction. Is done. The reinforcing layer 7 prevents the deformation of the resin layer 4 and the base material 1 when the optical element 2 is pressed, and the deformation of the resin layer 4 when the resin layer 4 is cut to provide the reflection mirror 6. Since it only needs to have an effect to prevent, there is no need to extend the length in the longitudinal direction (right direction in the figure) of the core 5 away from the periphery of the reflection mirror 6.

図６の実施形態の光配線部材６１では、補強層７は、反射ミラー６の周辺部を四角形に囲んで覆うように形成される。この場合も、補強層７は、上記と同様の理由で反射ミラー６の周辺部から離れるコア５の長手方向には長く伸ばす必要はない。   In the optical wiring member 61 of the embodiment of FIG. 6, the reinforcing layer 7 is formed so as to surround and cover the periphery of the reflection mirror 6 in a square shape. Also in this case, the reinforcing layer 7 does not need to be elongated in the longitudinal direction of the core 5 away from the periphery of the reflecting mirror 6 for the same reason as described above.

基材１及び樹脂層４が屈曲部を有する場合、補強層７は、基材１及び樹脂層４の屈曲部を避けて設けるのが好ましい。例えば、図５、図６の光配線部材５１，６１において、屈曲部が補強層７よりも図示右方向に位置するように構成する。これにより、屈曲部の柔軟性が確保される。   When the base material 1 and the resin layer 4 have a bent portion, the reinforcing layer 7 is preferably provided so as to avoid the bent portion of the base material 1 and the resin layer 4. For example, in the optical wiring members 51 and 61 of FIGS. 5 and 6, the bent portion is configured to be positioned in the right direction of the drawing with respect to the reinforcing layer 7. Thereby, the flexibility of the bent portion is ensured.

補強層７は、ヤング率が１ＧＰａ以上であるのが好ましい。これにより、基材１及び樹脂層４のヤング率が１ＧＰａ未満であるとき、補強の効果を発揮する。   The reinforcing layer 7 preferably has a Young's modulus of 1 GPa or more. Thereby, when the Young's modulus of the base material 1 and the resin layer 4 is less than 1 GPa, the effect of reinforcement is exhibited.

１ 基材
２ 光素子
３ 導体配線層
４ 樹脂層
５ コア
６ 反射ミラー
７ 補強層
８ クラッド
１１，２１，３１，４１，５１，６１ 光配線部材 DESCRIPTION OF SYMBOLS 1 Base material 2 Optical element 3 Conductor wiring layer 4 Resin layer 5 Core 6 Reflection mirror 7 Reinforcement layer 8 Cladding 11, 21, 31, 41, 51, 61 Optical wiring member

Claims (6)

基材の片側面に光素子が実装される導体配線層が設けられ、上記基材の反対側面に光導波路となる樹脂層が設けられ、上記樹脂層中に上記光素子と上記光導波路のコアとを光結合する反射ミラーが形成された光配線部材において、
上記基材の上記樹脂層側に、導電材からなる補強層が設けられたことを特徴とする光配線部材。 A conductor wiring layer on which an optical element is mounted is provided on one side of the substrate, a resin layer serving as an optical waveguide is provided on the opposite side of the substrate, and the optical element and the core of the optical waveguide are provided in the resin layer. In an optical wiring member formed with a reflection mirror that optically couples
An optical wiring member, wherein a reinforcing layer made of a conductive material is provided on the resin layer side of the base material. 上記補強層は、上記光導波路のコアに添わせて設けられていることを特徴とする請求項１記載の光配線部材。   2. The optical wiring member according to claim 1, wherein the reinforcing layer is provided along the core of the optical waveguide. 上記補強層は、少なくとも上記光素子と上記反射ミラーとの間を通る光が透過可能に構成されていることを特徴とする請求項１又は２記載の光配線部材。   The optical wiring member according to claim 1, wherein the reinforcing layer is configured to transmit at least light passing between the optical element and the reflecting mirror. 上記補強層は、上記反射ミラーの周辺部を覆うように形成されていることを特徴とする請求項１〜３いずれか記載の光配線部材。   The optical wiring member according to claim 1, wherein the reinforcing layer is formed so as to cover a peripheral portion of the reflecting mirror. 上記基材及び上記樹脂層が屈曲部を有し、上記補強層は、上記基材及び上記樹脂層の屈曲部を避けて設けられていることを特徴とする請求項１〜４いずれか記載の光配線部材。   The said base material and the said resin layer have a bending part, and the said reinforcement layer avoids the bending part of the said base material and the said resin layer, and is provided in any one of Claims 1-4 characterized by the above-mentioned. Optical wiring member. 上記補強層は、ヤング率が１ＧＰａ以上であることを特徴とする請求項１〜５いずれか記載の光配線部材。   6. The optical wiring member according to claim 1, wherein the reinforcing layer has a Young's modulus of 1 GPa or more.
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