JP2010256668A - Electrooptic device and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve heat radiating performance of an electrooptic panel and a driving IC chip on an external substrate, and to achieve space-saving. <P>SOLUTION: This electrooptic device includes: a reflection type electrooptic panel (100); the external substrate (150) connected to the electrooptic panel; the driving IC chip (160) provided on the external substrate for driving the electrooptic panel; and a heat radiating member (400) disposed at least partly to overlap one face of the electrooptic panel for radiating the heat of the electrooptic panel. The external substrate is bent so that the driving IC chip overlaps the heat radiating member. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a technical field of an electro-optical device such as a liquid crystal device and an electronic apparatus such as a liquid crystal projector including the electro-optical device.

  As this type of electro-optical device, an electro-optical device including an electro-optical panel such as a liquid crystal panel and an external substrate on which a driving IC (Integrated Circuit) chip for driving the electro-optical panel is mounted. (For example, refer to Patent Documents 1 to 3). As such an electro-optical panel, a reflective liquid crystal panel is known. In a reflective liquid crystal panel, an element substrate on which a plurality of reflective pixel electrodes are arranged in a matrix and a switching element for switching these elements is provided, and a counter electrode that is disposed to face the pixel electrode are provided. A liquid crystal as an electro-optical material is sandwiched between the counter substrate thus formed. In such a liquid crystal panel, incident light incident from the counter substrate side is reflected by the reflective pixel electrode and emitted as display light from the counter substrate side.

JP-A-9-96828 Japanese Patent Laid-Open No. 11-288003 JP 2003-330041 A

  When the above-described electro-optical device is used as a light valve in an electronic device such as a projector, for example, powerful light source light from the light source is condensed on the electro-optical panel in order to perform enlarged projection on the screen. Incident in the state. When such strong light source light is incident, the temperature of the electro-optical panel rises and the display performance of the electro-optical device may be degraded. In addition, the driving IC chip generates heat during operation and tends to become high temperature, and there is a possibility that a malfunction may occur as the temperature rises. For this reason, in the electro-optical device as described above, there is a demand to improve heat dissipation of the electro-optical panel and the driving IC chip. In order to improve these heat dissipation properties, for example, it is conceivable to provide a heat dissipation plate for each of the electro-optical panel and the driving IC chip. However, simply providing a heat sink individually for each of the electro-optical panel and the driving IC chip increases the manufacturing cost of the electro-optical device and increases the size of the electro-optical device (in other words, For example, a space required for installing the electro-optical device in an electronic device such as a projector is increased).

  The present invention has been made in view of, for example, the above-described problems. For example, it is possible to improve heat dissipation of driving IC chips on an electro-optical panel and an external substrate, and to save space. It is an object of the present invention to provide an electro-optical device capable of performing the above and an electronic apparatus including the electro-optical device.

  In order to solve the above problems, an electro-optical device of the present invention is provided with a reflective electro-optical panel, an external substrate connected to the electro-optical panel, and the external substrate, and drives the electro-optical panel. A driving IC chip for disposing the electro-optical panel, and a heat dissipating member disposed to at least partially overlap one surface of the electro-optical panel, and dissipating heat of the electro-optical panel. The IC chip is bent so as to overlap the heat radiating member.

  In the present invention, the reflective electro-optical panel is, for example, a reflective liquid crystal panel, and a plurality of reflective pixel electrodes are arranged in a matrix, for example, on a substrate such as a glass substrate, a quartz substrate, or a silicon substrate. An element substrate on which switching elements and the like that are arranged and controlled to switch are provided, and a counter substrate in which a counter electrode that is disposed to face the pixel electrode is provided on a transparent substrate such as a glass substrate or a quartz substrate. An electro-optical material such as liquid crystal is sandwiched between the two. The reflective pixel electrode is formed from a reflective film such as an Al (aluminum) film alone, or by laminating a reflective film such as an Al film on a transparent conductive film such as ITO (Indium Tin Oxide). Or formed. For example, an external substrate on which a driving IC chip in which an image signal supply circuit or the like is configured as an IC chip for driving the electro-optical panel is mounted is connected to the electro-optical panel. The external substrate is made of a flexible substrate such as a flexible printed circuit (FPC), and is electrically connected to the electro-optical panel via a connection terminal provided along one side of the element substrate, for example. Connected to. During operation of the electro-optical device, a voltage is applied to an electro-optical material such as liquid crystal between the pixel electrode and the counter electrode based on, for example, an image signal from the driving IC chip, and image display is performed in the display area. At this time, light incident on the electro-optical device is reflected by each pixel electrode and emitted from the electro-optical device as display light. Examples of such an electro-optical device include a liquid crystal device mounted as a light valve in a projection display device.

  In the present invention, the heat dissipating member is provided on one surface of the electro-optical panel (for example, the surface opposite to the surface on which light enters and exits the electro-optical panel, that is, the surface as the display surface of the electro-optical panel. More specifically, it is disposed so as to at least partially overlap a surface opposite to the substrate surface, more specifically, for example, a substrate surface opposite to the substrate surface on the side of the element substrate on which the plurality of pixel electrodes are provided. The heat radiating member is typically formed of a metal such as aluminum, and is disposed so as to cover the entire surface of one surface of the electro-optical panel. According to such a heat radiating member, the heat conducted from the electro-optical panel to the heat radiating member can be reliably dissipated to the outside, so that the heat dissipation of the electro-optical panel can be improved. Thereby, it is possible to suppress or prevent a decrease in display performance of the electro-optical panel accompanying a temperature rise.

  Particularly in the present invention, the external substrate is bent so that the driving IC chip overlaps the heat dissipation member. In other words, the external substrate is connected to, for example, one side of the electro-optical panel, and is bent so as to wrap around the heat dissipation member disposed on one surface from the end connected to the one side, and The driving IC chip on the external substrate overlaps the heat radiating member when viewed from the normal direction of one surface, for example. Typically, at least one of the external substrate and the driving IC chip is fixed to the heat dissipation member by an insulating material having adhesiveness such as silicon grease.

  Therefore, the driving IC chip can be at least partially brought into contact with the heat radiating member, or can be brought into contact with an adhesive insulating material or an external substrate. Therefore, heat generated in the driving IC chip during operation of the electro-optical device can be released to the outside through the heat dissipation member. That is, the heat dissipation of the driving IC chip can be improved. Accordingly, it is possible to suppress or prevent the occurrence of malfunctions of the driving IC chip due to the temperature rise. As a result, it is possible to reduce or prevent the adverse effect on the image display due to the malfunction of the driving IC chip, and it is possible to display a high-quality image.

  As described above, in the present invention, the heat dissipation of the electro-optical panel and the driving IC chip can be improved by the heat dissipation member. In other words, in the present invention, the electro-optical panel and the driving IC chip share one heat radiating member. Therefore, for example, it is possible to reduce the manufacturing cost of the electro-optical device and to reduce the size of the electro-optical device as compared with the case where a heat sink is individually provided for each of the electro-optical panel and the driving IC chip. (In other words, it is possible to save the space necessary for installing the electro-optical device in an electronic apparatus such as a projector).

  As described above, according to the electro-optical device of the present invention, for example, the heat dissipation of the driving IC chip on the electro-optical panel and the external substrate can be improved, and space saving can be achieved.

  In one aspect of the electro-optical device of the present invention, the driving IC chip is provided on a substrate surface of the external substrate opposite to the side facing the heat dissipation member.

  According to this aspect, the driving IC chip can be brought into contact with the heat radiating member via the external substrate. Therefore, it is possible to reduce or prevent an electrical adverse effect such as an electrical short (that is, a short circuit) due to the driving IC chip being in direct contact with a heat dissipation member made of, for example, metal. Therefore, the reliability of the electro-optical device can be improved.

  In another aspect of the electro-optical device of the present invention, the driving IC chip is provided on a substrate surface of the external substrate that faces the heat dissipation member.

  According to this aspect, the driving chip can be brought into contact with the heat radiating member without using the external substrate. Therefore, the heat dissipation of the driving IC chip can be improved more reliably.

  The driving IC chip is preferably in contact with the heat radiating member via an adhesive insulating material such as silicon grease. In this case, it is possible to reduce or prevent an adverse electrical effect caused by the driving IC chip directly contacting a heat radiating member made of metal, for example. Therefore, the reliability of the electro-optical device can be improved.

  In another aspect of the electro-optical device of the present invention, the external substrate includes a first end connected to the electro-optical panel on one side of the electro-optical panel, and extends from the first end. An extension part that extends along the one side and extends from the extension part when viewed from the normal direction of the surface, and is located on the other side adjacent to the one side of the electro-optical panel. And a second end.

  According to this aspect, the external substrate can be connected to the electro-optical panel on one side of the electro-optical panel and to an external circuit on the other side of the electro-optical panel. Here, for example, when the electro-optical device is installed in an electronic apparatus such as a projector, the terminal on the external circuit side cannot be arranged on one side of the electro-optical panel due to layout restrictions, for example. Sometimes placed on the other side of the panel. Therefore, as in this aspect, it is very advantageous in practice that the external substrate can be connected to an external circuit on the other side of the electro-optical panel.

  Note that one side of the electro-optical panel to which the first end portion of the external substrate is connected is preferably longer than the other side of the electro-optical panel. In this case, for example, the first end portion of the external substrate and the electro-optical panel (specifically, a plurality of connection terminals arranged along one side on the element substrate constituting the electro-optical panel), For example, when connecting by crimping using an anisotropic conductive film (ACF), the first end and the electro-optical panel can be easily connected. In other words, when one side of the electro-optic panel is longer than the other side, the arrangement pitch of the plurality of connection terminals arranged along one side on the element substrate constituting the electro-optic panel can be increased. In the manufacturing process, the first end portion of the external substrate and the electro-optical panel can be pressure-bonded using, for example, an anisotropic conductive film without causing an electrical short between adjacent connection terminals, for example. .

  In another aspect of the electro-optical device of the present invention, the electro-optical panel is held while being surrounded from the peripheral edge side, and a holding member in contact with the heat radiating member is provided.

  According to this aspect, the electro-optical panel is held by the holding member from the peripheral side thereof, and is held by the heat dissipation member from one surface side thereof. The holding member is made of, for example, a metal such as aluminum, and comes into contact with the heat dissipation member on the peripheral side of the electro-optical panel, for example. Therefore, the heat of the electro-optical panel can be dissipated to the outside by the holding member from the peripheral side of the electro-optical panel, and the heat conducted from the electro-optical panel to the holding member can be dissipated to the outside by the heat radiating member. Therefore, the heat dissipation of the electro-optical panel can be further improved.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects).

  According to the electronic apparatus of the present invention, since the electro-optical device of the present invention described above is included, a projection display device, a television, a mobile phone, an electronic notebook, a word processor, and a viewfinder capable of displaying a high-quality image. Various electronic devices such as a video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized. In addition, as an electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper, an electron emission device (Field Emission Display and Conduction Electron-Emitter Display), and a display device using these electrophoretic device and electron emission device Is also possible.

  The operation and other advantages of the present invention will become apparent from the following embodiments for carrying out the invention described below.

It is a disassembled perspective view which shows the whole structure of the liquid crystal device which concerns on 1st Embodiment. It is a perspective view which shows the external appearance of the liquid crystal device which concerns on 1st Embodiment. It is a top view which shows the structure of the liquid crystal panel which concerns on 1st Embodiment. FIG. 4 is a cross-sectional view taken along line H-H ′ in FIG. 3. 3 is an equivalent circuit diagram of a plurality of pixel units of the liquid crystal device according to the first embodiment. FIG. It is a block diagram including the drive part of the liquid crystal device which concerns on 1st Embodiment. 1 is a cross-sectional view of a liquid crystal device according to a first embodiment. It is a top view which shows typically the structure of FPC of the liquid crystal device which concerns on 1st Embodiment. It is sectional drawing with the same meaning as FIG. 7 in a modification. FIG. 6 is a plan view showing a configuration of a projection type liquid crystal projector as an example of an electronic apparatus to which the electro-optical device according to the invention is applied.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, an active matrix drive type reflective liquid crystal device, which is an example of the electro-optical device of the present invention, is taken as an example.

<First Embodiment>
The liquid crystal device according to the first embodiment will be described with reference to FIGS.

  First, the overall configuration of the liquid crystal device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is an exploded perspective view showing the overall configuration of the liquid crystal device according to the present embodiment, and FIG. 2 is a perspective view showing the appearance of the liquid crystal device according to the present embodiment.

  1, the liquid crystal device 1 according to the present embodiment includes a liquid crystal panel 100, an FPC 150 connected to the liquid crystal panel 100, an IC chip 160 provided on the FPC 150, and one surface 100a of the liquid crystal panel 100. A heat radiating member 400 disposed on the side, and a frame 600 that holds the liquid crystal panel 100 are provided.

  The liquid crystal panel 100 is an example of the “electro-optical panel” according to the present invention, and is an active matrix drive type reflective liquid crystal panel using TFTs (Thin Film Transistors) as switching elements. The configuration of the liquid crystal panel 100 will be described in detail later with reference to FIGS.

  The FPC 150 is an example of an “external substrate” according to the present invention, and is a flexible printed circuit board that is electrically and mechanically connected to an external circuit connection terminal 102 (see FIG. 3) formed on the element substrate 10. One end 151 of the FPC 150 is connected to the external circuit connection terminal 102, and the other end 152 of the FPC 150 is connected to an external circuit. The FPC 150 is made of, for example, a polyimide resin and has flexibility. An IC chip 160 for driving the liquid crystal panel 100 is mounted on the FPC 150. The IC chip 160 is an example of the “driving IC chip” according to the present invention. That is, the IC chip 160 is mounted on the FPC 150 by a COF (Chip On Film) method. The IC chip 160 is formed on the surface of the FPC 150 opposite to the side in contact with the element substrate 10. The FPC 150 has an L-shaped planar shape bent about 90 degrees in the middle thereof.

  As shown in FIG. 2, in this embodiment, the FPC 150 will be described later when the IC chip 160 is viewed from the normal direction (Z direction in the drawing) of one surface 100a of the liquid crystal panel 100 (see FIG. 1). It is bent so as to overlap the heat radiating member 400. Therefore, the heat dissipation of the IC chip 160 can be improved and space saving can be achieved. This point will be described in detail later with reference to FIG.

  In FIG. 1 and FIG. 2, the heat radiating member 400 is a member mainly for dissipating the heat of the liquid crystal panel 100, and is formed of a metal such as aluminum, for example, so as to cover the entire one surface 100 a of the liquid crystal panel 100. Placed in. The heat dissipating member 400 has a plurality of heat dissipating fins 410. According to such a heat radiating member 400, the heat conducted from the liquid crystal panel 100 to the heat radiating member 400 can be reliably dissipated to the outside, so that the heat dissipation of the liquid crystal panel 100 can be improved. Thereby, the fall of the display performance of the liquid crystal panel 100 accompanying a temperature rise can be suppressed or prevented. The heat radiating member 400 may be formed of, for example, quartz or ceramics. The heat dissipation member 400 also has a function of holding the liquid crystal panel 100 together with a frame 600 described later.

  The frame 600 is a member that surrounds and holds the liquid crystal panel 100 from the peripheral edge side, and is formed of a metal such as aluminum, for example. The frame 600 is an example of the “holding member” according to the present invention. The frame 600 has an opening 610 corresponding to the image display area 10a (see FIG. 3) of the liquid crystal panel 100. During the operation of the liquid crystal device 1, incident light from the light source enters the image display region 10a through the opening 610, and reflected light reflected by the pixel electrodes 9 (see FIG. 4) arranged in the image display region 10a opens. The light is emitted as display light through 610. The frame 600 may be formed of, for example, resin or ceramics. The configuration of the frame 600 will be described later with reference to FIGS.

  Next, the configuration of the liquid crystal panel according to the present embodiment will be described with reference to FIGS.

  FIG. 3 is a plan view showing the configuration of the liquid crystal panel according to the present embodiment, and FIG. 4 is a cross-sectional view taken along line H-H ′ of FIG. 3. In FIG. 3, the illustration of the dustproof substrate 220 shown in FIG. 4 is omitted for convenience of explanation. In FIG. 4, the scales of the respective layers and members are different from each other in order to make each layer and each member recognizable on the drawing. This also applies to FIGS. 7 and 9.

  3 and 4, in the liquid crystal panel 100 according to the present embodiment, the element substrate 10 and the counter substrate 20 are disposed to face each other. The element substrate 10 is made of a transparent substrate such as a glass substrate or a quartz substrate. The element substrate 10 may be formed from, for example, a silicon substrate. The counter substrate 20 is made of a transparent substrate such as a glass substrate or a quartz substrate. A liquid crystal layer 50 is sealed between the element substrate 10 and the counter substrate 20, and the element substrate 10 and the counter substrate 20 are mutually connected by a sealing material 52 provided in a seal region located around the image display region 10a. It is glued to.

  In FIG. 3, a light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10 a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. A data line driving circuit 101 and an external circuit connection terminal 102 are provided along one side of the element substrate 10 in a region located outside the sealing region where the sealing material 52 is disposed in the peripheral region. The sampling circuit 7 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. Further, the scanning line driving circuit 104 is provided so as to be covered with the frame light-shielding film 53 inside the seal region along two sides adjacent to the one side. On the element substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the element substrate 10 and the counter substrate 20.

  On the element substrate 10, lead wirings 90 are formed for electrically connecting the external circuit connection terminals 102 to the data line driving circuit 101, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like.

  In FIG. 4, on the element substrate 10, a laminated structure in which wirings such as pixel switching TFTs, scanning lines, and data lines are formed. In the image display area 10a, pixel electrodes 9 are provided in a matrix form on the upper layer of wiring such as pixel switching TFTs, scanning lines, and data lines. The pixel electrode 9 is made of, for example, aluminum, and reflects incident light incident from the counter substrate 20 side. An alignment film is formed on the pixel electrode 9. On the other hand, a light shielding film 23 is formed on the surface of the counter substrate 20 facing the element substrate 10. The light shielding film 23 is formed of, for example, a light shielding metal film or the like, and is patterned, for example, in a lattice shape in the image display region 10a on the counter substrate 20. A counter electrode 21 made of a transparent conductive film such as ITO is formed in a solid shape on the light shielding film 23 so as to face the plurality of pixel electrodes 9. An alignment film is formed on the counter electrode 21. Further, the liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  Although not shown here, on the element substrate 10, in addition to the data line driving circuit 101 and the scanning line driving circuit 104, an inspection for inspecting the quality, defects, etc. of the liquid crystal device during manufacturing or at the time of shipment. A circuit, an inspection pattern, or the like may be formed.

  In FIG. 4, a dustproof substrate 220 is provided on the side of the counter substrate 20 that does not face the liquid crystal layer 50. The dustproof substrate 220 is made of a transparent substrate such as a glass substrate or a quartz substrate, and is bonded to the counter substrate 20 through an adhesive layer made of an adhesive. The dustproof substrate 220 is provided so as to substantially overlap the counter substrate 20. Therefore, the dust-proof substrate 220 can prevent the dust from directly adhering to the surface of the counter substrate 20 that does not face the liquid crystal layer 50, and even if dust adheres to the dust-proof substrate 220, the dust-proof substrate. Since 220 has a predetermined thickness, a situation in which an image of dust is projected on the image can be avoided in advance.

  FIG. 5 is an equivalent circuit diagram of a plurality of pixel units provided in the image display area 10 a of the liquid crystal panel 100.

  As shown in FIG. 5, a plurality of scanning lines 11 and a plurality of data lines 6 are arranged in the image display area 10a of the liquid crystal panel 100 so as to intersect each other, and the scanning lines correspond to these intersections. 11 and a pixel portion selected by each one of the data lines 6 are provided. Each pixel portion is provided with a pixel switching TFT 30, a pixel electrode 9, and a storage capacitor. The TFT 30 is provided to apply data signals S1, S2,..., Sn supplied from the data line 6 to the selected pixel. The TFT 30 has a gate electrically connected to the scanning line 11, a source electrically connected to the data line 6, and a drain electrically connected to the pixel electrode 9. The pixel electrode 9 forms a liquid crystal capacitance with the counter electrode 21 (see FIG. 4), and the input data signals S1, S2,..., Sn are applied to the pixel portion and held for a certain period. Yes. One electrode of the storage capacitor 70 is electrically connected to the drain of the TFT 30 in parallel with the pixel electrode 9, and the other electrode is electrically connected to the fixed potential capacitor wiring 300 so as to have a constant potential. ing.

  The liquid crystal panel 100 adopts a TFT active matrix driving method, and sequentially applies scanning signals G1, G2,..., G2m from the scanning line driving circuit 104 (see FIG. 3) to each scanning line 11, thereby turning on the TFT 30. Data signals S 1, S 2,..., Sn from the data line driving circuit 101 (see FIG. 3) are applied through the data line 6 to the selected horizontal pixel portion column in the state. At this time, the data signals S1, S2,..., Sn may be supplied to each data line 6 sequentially, or supplied to a plurality of data lines 6 (for example, for each group) at the same timing. Also good. Thereby, the data signal is supplied to the pixel electrode 9 corresponding to the selected pixel. Since the element substrate 10 is disposed so as to face the counter substrate 20 via the liquid crystal layer 50 (see FIG. 4), an electric field is applied to the liquid crystal layer 50 for each pixel region partitioned and arranged as described above. The amount of light transmitted through the liquid crystal layer 50 is controlled for each pixel region, and an image is displayed in gradation. Further, the data signal held in each pixel area at this time is prevented from leaking by the storage capacitor 70.

  Next, the configuration of the drive unit of the liquid crystal device according to the present embodiment will be described with reference to FIG.

  FIG. 6 is a block diagram including a drive unit of the liquid crystal device according to the present embodiment.

  In FIG. 6, the driving unit of the liquid crystal device 1 includes a timing control circuit 511, an image signal supply circuit 512, and the like in addition to the data line driving circuit 101 and the scanning line driving circuit 104 described above.

  The timing control circuit 511 is mounted on the FPC 150 as a part of the IC chip 160 described above with reference to FIGS. 1 and 2, and is configured to output various timing signals used in each unit. The timing control circuit 511 generates a Y clock signal based on a horizontal synchronization signal Hs, a vertical synchronization signal Vs, and a dot clock DCLK supplied from an external circuit via a terminal provided at an end 152 (see FIG. 1) of the FPC 150. CLY, inverted Y clock signal CLYB, X clock signal CLX, inverted X clock signal CLXB, Y start pulse DY and X start pulse DX are generated. The timing control circuit 511 supplies the Y clock signal CLY, the inverted Y clock signal CLYB, and the Y start pulse DY to the scanning line driving circuit 104, and drives the X clock signal CLX, the inverted X clock signal CLXB, and the X start pulse DX as the data line. Supply to the circuit 101.

  The image signal supply circuit 512 is mounted on the FPC 150 as a part of the IC chip 160 together with the timing control circuit 511 described above, and various timings supplied from the timing control circuit 511 to input image data DATA input from the outside. Based on the signal, the signal is converted into a data signal Sx (where x = 1, 2,..., N) and output to the data line driving circuit 101. The data line driving circuit 101 supplies the data signal Sx to the corresponding data line 6. In the image signal supply circuit 512, each voltage of the data signal Sx is inverted to a positive polarity and a negative polarity with respect to a predetermined reference potential, and the data signal Sx whose polarity is thus inverted is output. May be.

  In the present embodiment, the timing control circuit 511 and the image signal supply circuit 512 are both mounted on the FPC 150 as the IC chip 160. However, the timing control circuit 511 and the image signal supply circuit 512 are respectively separate ICs. It may be mounted on the FPC 150 as a chip, or only one of them may be mounted on the FPC 150 as an IC chip and the other may be configured as an external circuit. In the present embodiment, the data line driving circuit 101 is configured as a liquid crystal panel with a built-in driving circuit formed on the element substrate 10, but the data line driving circuit 101 may be mounted on the FPC 150 as an IC chip. .

  Next, a characteristic configuration of the liquid crystal device according to the present embodiment will be described in detail with reference to FIGS. 7 and 8 in addition to FIG.

  FIG. 7 is a cross-sectional view of the liquid crystal device according to the present embodiment. FIG. 7 schematically shows a cross section when the liquid crystal device 1 shown in FIG. 2 is temporarily cut along a cutting line along the X direction and crossing the IC chip 160.

  In FIG. 7, the heat radiating member 400 is on one surface 100a of the liquid crystal panel 100 (that is, the substrate surface opposite to the substrate surface on the side where the plurality of pixel electrodes 9 (see FIG. 4) in the element substrate 10 are provided). It is arranged so as to cover the entire surface. As described above, according to such a heat dissipation member 400, the heat dissipation of the liquid crystal panel 100 can be improved.

  2 and 7, particularly in the present embodiment, the FPC 150 is bent so that the IC chip 160 overlaps the heat radiating member 400 when viewed from the normal direction (Z direction in the drawing) of the one surface 100a. . In other words, the FPC 150 is connected to one side of the liquid crystal panel 100 (that is, one side where a plurality of external circuit connection terminals 102 (see FIG. 3) in the element substrate 10 are arranged), and an end connected to the one side 151 (see FIG. 1) is bent so as to wrap around the heat dissipating member 400 disposed on one surface 100a, and the IC chip 160 on the FPC 150 is viewed from the normal direction of the one surface 100a. It overlaps with the heat dissipation member 400. The IC chip 160 is provided on the substrate surface opposite to the side facing the heat dissipation member 400 in the FPC 150. The FPC 150 is fixed to the heat dissipation member 400 by an insulating layer 710 made of an insulating material having adhesive properties such as silicon grease, at least in a portion where the IC chip 160 is formed. Therefore, the IC chip 160 is in contact with the heat radiating member 400 through the insulating layer 710 and the FPC 150. Therefore, heat generated in the IC chip 160 during the operation of the liquid crystal device 1 can be released to the outside through the heat dissipation member 400. That is, the heat dissipation of the IC chip 160 can be improved. Therefore, it is possible to suppress or prevent the occurrence of malfunctions in the operation of the IC chip 160 (in other words, the timing control circuit 511 and the image signal supply circuit 512 described above with reference to FIG. 6) due to the temperature rise. As a result, it is possible to reduce or prevent the adverse effect on the image display due to the malfunction of the operation of the IC chip 160, and high-quality image display is possible.

  Thus, in this embodiment, the heat dissipation of the liquid crystal panel 100 and the IC chip 160 can be improved by the heat dissipation member 400. In other words, in the present embodiment, the liquid crystal panel 100 and the IC chip 160 share one heat radiating member 400. Therefore, for example, it is possible to reduce the manufacturing cost of the liquid crystal device and to reduce the size of the liquid crystal device (in other words, in other words, compared to the case where the heat sink is individually provided for each of the liquid crystal panel 100 and the IC chip 160. Thus, it is possible to achieve a space saving necessary for installing the liquid crystal device in an electronic device such as a projector.

  Further, particularly in the present embodiment, the IC chip 160 is provided on the FPC board surface opposite to the side facing the heat dissipation member 400 in the FPC 150. Therefore, since the IC chip 160 can be brought into contact with the heat radiating member 400 via the FPC 150, for example, an electrical short (that is, short-circuit) caused by the IC chip 160 being in direct contact with the heat radiating member 400 made of metal. Electrical adverse effects can be reduced or prevented. Therefore, the reliability of the liquid crystal device 1 can be improved.

  In FIG. 7, the frame 600 holds the liquid crystal panel 100 while surrounding the liquid crystal panel 100 from the peripheral edge side. Between the liquid crystal panel 100 (mainly its side surfaces) and the frame 600, a filler 800 made of, for example, silicon resin is filled.

  Particularly in the present embodiment, the frame 600 is in contact with the heat dissipation member 400 on the peripheral side of the liquid crystal panel 100. Therefore, the heat of the liquid crystal panel 100 can be dissipated to the outside by the frame 60 from the peripheral side of the liquid crystal panel 100, and the heat conducted from the liquid crystal panel 100 to the frame 600 can be dissipated to the outside by the heat dissipation member 400. . Therefore, the heat dissipation of the liquid crystal panel 100 can be further improved. The frame 600 may be in direct contact with the heat radiating member 400 or may be in indirect contact with an adhesive or the like, for example.

  FIG. 8 is a plan view schematically showing the configuration of the FPC 150.

  As shown in FIG. 8, in this embodiment, in particular, the FPC 150 includes an end 151 (see also FIG. 1) connected to the liquid crystal panel 100 on one side 100 x of the liquid crystal panel 100, and extends from the end 151. An extension portion 153 that overlaps the heat dissipation member 400 when viewed from the normal direction of one surface 100a of the liquid crystal panel 100 and extends along one side 100x of the liquid crystal panel 100 (along the X direction in the figure); It has an end 152 (see also FIG. 1) that extends from 153 and is located on the other side 100y side adjacent to one side 100x of the liquid crystal panel 100. The end 151 (more specifically, a plurality of terminals formed on the end 151) is connected to a plurality of external circuit connection terminals 102 arranged on the element substrate 10 along one side 100x, for example, ACF (anisotropic) Electrically and mechanically connected by pressure bonding using a conductive conductive film). The end 152 is electrically and mechanically connected to an external circuit.

  According to such an FPC 150, the end 151 can be connected to the liquid crystal panel 100 on one side 100x of the liquid crystal panel 100, and the end 152 can be connected to an external circuit on the other side 100y side of the liquid crystal panel 100. Here, for example, when the liquid crystal device 1 is installed in an electronic apparatus such as a projector, the terminals on the external circuit side cannot be arranged on the one side 100x side of the liquid crystal panel 100 due to layout restrictions. It may be arranged on the other side 100y side of the panel 100. Therefore, it is very advantageous in practice that the FPC 150 can be connected to an external circuit on the other side 100y side of the liquid crystal panel 100 as in this embodiment.

  Furthermore, in this embodiment, one side 100x of the liquid crystal panel 100 to which the end 151 of the FPC 150 is connected is longer than the other side 100y of the liquid crystal panel 100. Therefore, for example, when the end portion 151 of the FPC 150 and the liquid crystal panel 100 (specifically, the plurality of external circuit connection terminals 102) are connected by, for example, ACF bonding, the end portion 151 and the liquid crystal are connected. The panel 100 can be easily connected. In other words, since one side 100x of the liquid crystal panel 100 is longer than the other side 100y, the arrangement pitch of the plurality of external circuit connection terminals 102 arranged along the one side 100x on the element substrate 10 constituting the liquid crystal panel 100 is made larger. Therefore, in the manufacturing process, the end portion 151 of the FPC 150 and the liquid crystal panel 100 can be pressure-bonded using an ACF without causing an electrical short between the adjacent external circuit connection terminals 102, for example. it can.

  As described above, according to the liquid crystal device 1 according to the present embodiment, for example, the heat dissipation of the IC chip 160 on the liquid crystal panel 100 and the FPC 150 can be improved, and space saving can be achieved.

<Modification>
Next, a modification of the liquid crystal device according to the present embodiment will be described with reference to FIG. Below, only a different point from this embodiment mentioned above about a modification is demonstrated. In other respects, the liquid crystal device according to the modification is configured in substantially the same manner as the liquid crystal device according to the present embodiment described above.

  FIG. 9 is a sectional view having the same concept as in FIG. 7 in a modified example.

  As shown as a modification in FIG. 9, the IC chip 160 may be provided on the FPC board surface of the FPC 150 facing the heat radiating member 400. The IC chip 160 is fixed to the heat radiating member 400 by an insulating layer 710 made of an insulating material having adhesive properties such as silicon grease.

  Therefore, the IC chip 160 is in contact with the heat dissipation member 400 without passing through the FPC 150. Therefore, the heat dissipation of the IC chip 160 can be improved more reliably.

  Further, particularly in this modification, the IC chip 160 is in contact with the heat dissipation member 400 via the insulating layer 710. Therefore, it is possible to reduce or prevent an adverse electrical effect caused by the IC chip 160 directly contacting the heat radiating member 400. Therefore, the reliability of the liquid crystal device 1 can be improved.

<Electronic equipment>
Next, the case where the reflective liquid crystal device, which is the above-described electro-optical device, is applied to an electronic device will be described. Here, a projection type liquid crystal projector is taken as an example of the electronic apparatus according to the present invention. FIG. 10 is a schematic cross-sectional view of the projection type liquid crystal projector according to the present embodiment.

  In FIG. 10, a liquid crystal projector 1100 is constructed as a multi-plate color projector using three liquid crystal light valves 100R, 100G, and 100B for RGB. Each of the liquid crystal light valves 100R, 100G, and 100B uses the reflective liquid crystal device 1 described above.

  As shown in FIG. 10, in the liquid crystal projector 1100, when projection light is emitted from a lamp unit 1102 of a white light source such as a metal halide lamp, two mirrors 1106, two dichroic mirrors 1108, and three polarization beam splitters (PBS) ) 1113 is divided into light components R, G, and B corresponding to the three primary colors of RGB and led to the liquid crystal light valves 100R, 100G, and 100B corresponding to the respective colors. At this time, in order to prevent light loss in the optical path, a lens may be appropriately provided in the middle of the optical path. The light components corresponding to the three primary colors modulated by the liquid crystal light valves 100R, 100G, and 100B are combined by the cross prism 1112 and then projected as a color image on the screen 1120 via the projection lens 1114.

  Since light corresponding to the primary colors of R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108 and the polarization beam splitter 1113, there is no need to provide a color filter.

  In addition to the electronic apparatus described with reference to FIG. 10, a mobile personal computer, a mobile phone, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation device, a pager, and an electronic notebook , Calculators, word processors, workstations, videophones, POS terminals, devices with touch panels, and the like. Needless to say, the present invention can be applied to these various electronic devices.

  In addition to the liquid crystal device described in the above embodiment, the present invention includes a plasma display (PDP), a field emission display (FED, SED), an organic EL display, a digital micromirror device (DMD), an electrophoresis device, and the like. It is also applicable to.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change. In addition, an electronic apparatus including the electro-optical device is also included in the technical scope of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 10 ... Element board | substrate, 100 ... Liquid crystal panel, 150 ... FPC, 160 ... IC chip, 220 ... Dust-proof substrate, 400 ... Heat dissipation member, 600 ... Frame, 710 ... Insulating layer

Claims (6)

A reflective electro-optic panel;
An external substrate connected to the electro-optic panel;
A driving IC chip provided on the external substrate for driving the electro-optical panel;
A heat dissipating member that is disposed so as to at least partially overlap one surface of the electro-optical panel, and dissipates heat of the electro-optical panel;
The electro-optical device, wherein the external substrate is bent so that the driving IC chip overlaps the heat dissipation member.   The electro-optical device according to claim 1, wherein the driving IC chip is provided on a substrate surface of the external substrate opposite to a side facing the heat dissipation member.   The electro-optical device according to claim 1, wherein the driving IC chip is provided on a substrate surface of the external substrate that faces the heat dissipation member. The external substrate is
A first end connected to the electro-optical panel on one side of the electro-optical panel;
An extending portion extending from the first end portion and extending along the one side while overlapping the heat dissipation member when viewed from the normal direction of the one surface;
4. The device according to claim 1, further comprising: a second end portion extending from the extending portion and positioned on the other side adjacent to the one side of the electro-optic panel. 5. Electro-optic device.   5. The electro-optical device according to claim 1, further comprising a holding member that surrounds and holds the electro-optical panel from a peripheral edge side thereof, and that is in contact with the heat radiating member.   An electronic apparatus comprising the electro-optical device according to claim 1.

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