JP2010251511A - Electronic circuit component mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a more practical electronic circuit component mounting system. <P>SOLUTION: After printing of solder, the printing time is stored in a host computer while being associated with the identification code of a circuit board. After a circuit board is carried, respectively, in a print inspection machine 12, each mounting module 180 of a mounting module array 14 and a mounting inspection machine 16, the image of the two-dimensional code of the circuit board is captured, the printing time is obtained by reading the identification code of the circuit board, and then the time elapsed from the printing time to the arrival of the circuit board is obtained. If the sum of the elapsed time and the estimated time required from the arrival of the circuit board at a working machine to the start of carrying the circuit board in a reflow furnace 18 exceeds the time allowed from the end of printing of solder to the start of carrying the circuit board in the reflow furnace 18, the work is prohibited after the fact is confirmed. The work is prohibited earlier as compared with the case where the work is prohibited after the elapsed time exceeds the allowable time, and the waste of electronic circuit components is reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic circuit component mounting system for manufacturing an electronic circuit by mounting an electronic circuit component on a circuit board.

  The electronic circuit component mounting system described in Patent Document 1 below includes a solder printing unit, an adhesive application unit, a component mounting unit, an adhesive curing unit, and a soldering unit, and an electronic circuit component using cream-like solder and adhesive. Are bonded to a circuit board to produce an electronic circuit. Therefore, the solder printing part has a solder printer and a solder printing inspection machine, the adhesive application part has an adhesive application machine and a coating inspection machine, the component mounting part has a component mounting machine and a mounting inspection machine, and the adhesive is cured. The part includes an adhesive curing furnace and a curing inspection machine, and the soldering part includes a reflow furnace and a soldering inspection machine. The circuit board is also equipped with a memory, solder printing machine, solder printing inspection machine, adhesive application machine, coating inspection machine, component mounting machine, mounting inspection machine, adhesive curing furnace, curing inspection machine, reflow furnace and solder The data writing / reading means provided in each of the attached inspection machines reads the quality information written in the memory before starting the work, and writes the quality information obtained by processing in each process after the work. Quality information includes that the elapsed time since the solder was printed on the circuit board exceeded the usage limit time, and that the time since the adhesive was applied to the circuit board exceeded the usage limit time. If the information is read, the subsequent processing is stopped.

Japanese Patent No. 3858046

Thus, according to the conventional electronic circuit component mounting system, since the subsequent processing is stopped when the usage limit time is exceeded, the solder printed on the circuit board or the applied adhesive is dry, and the electronic Even though the electrodes of the circuit component cannot be bonded to the circuit board land, or the electronic circuit component cannot be temporarily fixed to the circuit board, the electronic circuit component is mounted, the solder is melted, or the adhesive. Thus, the effect of avoiding the production of low-quality electronic circuits due to poor solder conformity or the like can be obtained. However, there is still room for improvement. For example, work is performed on the circuit board until the solder or adhesive exceeds the use limit time, and when it is found that the use limit time has been exceeded, useless work has already been performed and discarded. The problem of increasing the number of electronic circuit components remains, and there is room for improvement in that respect.
In view of the above circumstances, the present invention has been made to obtain a more practical electronic circuit component mounting system.

  In order to solve the above-mentioned problem, the present invention includes a plurality of circuit board working machines, and the circuit board work that is a work on the circuit boards by the plurality of circuit board working machines is creamed on the land of the circuit board. The printed circuit board is printed, the electronic circuit component is mounted on the circuit board with the printed solder interposed between the land and the electrode of the electronic circuit component, and the circuit board in that state is heated to melt the solder. And by soldering the electrode to the land, an electronic circuit component mounting system for manufacturing an electronic circuit by mounting the electronic circuit component on the circuit board is transferred to the circuit board at at least one location in the electronic circuit component mounting system. The sum of the elapsed time from the solder printing and the estimated time required to melt the solder from the at least one location for the circuit board is: When it is found that the allowable time allowed for the elapsed time from printing to melting exceeds the permissible time, a work prohibition unit is provided that prohibits the circuit board work with the circuit board work machine for the circuit board thereafter. It is characterized by this.

Until the solder is printed on the circuit board, it is contained in a container and shielded from the air, or even if it is placed on the circuit board, the solder on the surface is moved when it is moved on the screen by the squeegee. By being kneaded in, it is not continuously exposed to air, does not dry, or the progress of drying is slow. On the other hand, when printed on the circuit board, the solder is exposed to the air and is in a stationary state on the circuit board. It is necessary to ensure that after printing, it is melted within an acceptable time, since it may not be applied well. The allowable time depends on the type of circuit board. The type of electronic circuit components to be mounted differs depending on the type of circuit board, which determines the type of solder used, the shape and amount of solder printed, and the degree of drying of solder varies depending on the type. This is because the smaller the amount to be printed and the larger the surface area, the easier it is to dry.
In addition, if the configuration of the electronic circuit component mounting system is determined and the counter circuit board work to be performed on the circuit board is determined, the counter circuit board work to be performed between that part and the solder melting in any part of the system Can be estimated.
If the sum of the elapsed time and the estimated required time exceeds the allowable time, after the fact is found, even if the circuit board work is performed on the circuit board, when the solder melting starts, It is anticipated that the drying will exceed acceptable limits and the electrode cannot be properly soldered to the land. Therefore, if it is determined that the sum of the elapsed time and the estimated required time exceeds the allowable time, the work against the circuit board is prohibited, so that it is possible to avoid the production of a low-quality circuit board as in the conventional case. In addition, it is possible to prohibit circuit board work before the elapsed time exceeds the allowable time, and it is not necessary to perform the circuit board work within the time corresponding to the estimated required time. Compared to the case where the work against the circuit board is prohibited for the first time later, the waste of the difference between the allowable time and the elapsed time can be reduced, and the number of discarded electronic circuit components can be reduced.
Circuit board operations include, for example, solder printing, solder printing status inspection, adhesive application, adhesive application status inspection, electronic circuit component mounting, component mounting status inspection, adhesive curing and soldering Various operations performed on the circuit board by various counter circuit board working machines, such as melting, can be included. However, it is not essential that the electronic circuit component mounting system described in this section includes a counter circuit board working machine that performs all of the counter circuit board operations.
In addition, the electronic circuit component mounting system includes a circuit board transport device for transporting circuit boards, a circuit board storage device for temporarily storing circuit boards, a circuit board reversing device for reversing the circuit boards, and circuit board transport between circuit board working machines. In many cases, a substrate handling device including at least one of a transfer direction changing device or the like that changes the orientation of the circuit board is provided, but handling of a circuit board by these substrate handling devices is not included in the counter circuit board work in this specification. Make it not exist. However, prohibiting substrate handling is not excluded, and the time required for substrate handling may or may not be added to the estimated required time.
The location where it is determined whether or not to prohibit the circuit board operation may be provided only at one location of the electronic circuit component mounting system, or may be provided at a plurality of locations. It suffices if it is provided in at least one place in the electronic circuit component mounting system. However, if it is provided in a plurality of places, the opportunity to prohibit the work increases, and the waste reduction effect can be enjoyed more effectively.

Aspects of the Invention

  In the following, the invention that is claimed to be claimable in the present application (hereinafter referred to as “claimable invention”. The claimable invention is at least the “present invention” to the invention described in the claims. Some aspects of the present invention, including subordinate concept inventions of the present invention, superordinate concepts of the present invention, or inventions of different concepts) will be illustrated and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, the prior art, and the like. The added aspect and the aspect in which the constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

  In each of the following terms, (1) corresponds to claim 1, (2) corresponds to claim 2, (3) corresponds to claim 3, (4) corresponds to claim 4, (5) corresponds to claim 5, (6) corresponds to claim 6, (7) corresponds to claim 7, and (13) corresponds to claim 8.

(1) A circuit board work machine including a plurality of circuit board work machines, and a cream-like solder is printed on a land of the circuit board by the work on the circuit board which is a work on the circuit board by the plurality of circuit board work machines. The electronic circuit component is mounted in a state where the printed solder is interposed between the land and the electrode of the electronic circuit component, the circuit board in that state is heated to melt the solder, and the electrode is attached to the land. In an electronic circuit component mounting system for manufacturing an electronic circuit by mounting an electronic circuit component on a circuit board by soldering to
In at least one place in the electronic circuit component mounting system, an elapsed time since the printing of the solder on the circuit board and an estimated required time required to melt the solder from the at least one place on the circuit board Is found to exceed the allowable time allowed as the elapsed time from printing to melting of the solder, the subsequent circuit board work by the circuit board working machine for the circuit board is An electronic circuit component mounting system comprising a prohibited work section.
(2) The work prohibition unit
An intermediate board specifying unit for specifying a circuit board at the at least one location;
For the circuit board specified by the intermediate board specifying unit, an elapsed time acquisition unit that acquires the elapsed time; and
An estimated required time acquisition unit that acquires the estimated required time for the circuit board specified by the intermediate substrate specifying unit, and the estimated required time acquired by the estimated required time acquisition unit and the elapsed time acquiring unit. The electronic circuit component according to (1), wherein when the sum of the acquired elapsed time is found to exceed the allowable time, the circuit board operation for the circuit board thereafter is prohibited. Implementation system.
The intermediate board specifying unit includes, for example, an identification code reading device that reads a board identification code provided on the circuit board, and reads the circuit board identification code at the one place to specify the circuit board at the one place. In addition, it may be read by an identification code reader provided on the upstream side of the circuit board flow in the electronic circuit component mounting system, and sent downstream as the circuit board moves in the electronic circuit component mounting system. The circuit board at the one place may be specified based on the board identification code.
In addition, the intermediate board specifying unit specifies the circuit board when the circuit board reaches the one place, or specifies when a predetermined condition is satisfied within the one place. Or specified at the time of discharge from the one place.
The electronic circuit component mounting system is an electronic circuit component mounting line in which a plurality of counter circuit board working machines each performing a predetermined operation on a circuit board are arranged, at least of the plurality of counter circuit board working machines. Some are installed at positions away from others, and may not be called lines in appearance. However, it is normal that the order of a plurality of circuit board operations to be performed on the circuit board is determined, and when the circuit board is moved in accordance with the work order, the movement of the circuit board is changed to the circuit. Consider the flow of the substrate.
According to the electronic circuit component mounting system described in this section, it is possible to acquire the elapsed time and the estimated required time for the circuit board in at least one place and determine whether or not the sum exceeds the allowable time. .
The circuit boards on which the work prohibition determination is performed may be all circuit boards on which electronic circuit components are mounted or a part of the circuit boards. In the latter case, for example, for a circuit board that is determined every set number of sheets, the circuit board work is not prohibited even if the sum of the elapsed time and the estimated required time exceeds the allowable time However, the elapsed time of a plurality of circuit boards that continuously reach one place is often almost the same, and it is rare that only one board suddenly greatly exceeds the allowable time. Even if the work prohibition determination is made only for the circuit board, the work against the circuit board to be prohibited is not prohibited, and there is almost no possibility that a low-quality electronic circuit is manufactured. In this case, it is sufficient to identify only a part of the circuit boards.
(3) The elapsed time acquisition unit
A printing time storage unit for storing the printing time of the solder in association with a board identification code provided on the circuit board;
A current time acquisition unit that acquires a current time at the at least one location, and the elapsed time as a difference between a current time acquired by the current time acquisition unit and a print time stored in the print time storage unit. The electronic circuit component mounting system according to (2), which is to be acquired.
The printing time may be the time at the start of printing, the time at the end of printing, or the time at which the circuit board is unloaded from the printer. When the printing time is the time when the circuit board is unloaded from the printing machine, for example, a board unloading sensor may be provided in the printing machine to detect the unloading of the circuit board and acquire the printing time. When a substrate transfer device is provided adjacent to the downstream side of the printing press, and a circuit board is received from the printing press and carried out to a work machine on the downstream side, the circuit board is loaded into the substrate transfer device or is loaded. The recognition time of the board may be the printing time. The recognition of the circuit board is performed, for example, by reading the board identification code provided on the circuit board by the identification code reading apparatus provided on the board transfer device.
In addition, the work prohibition determination may be performed before the start of the counter circuit board work in one place, may be performed after the end of the counter circuit board work, or may be performed in both. The estimated required time is estimated according to whether the work prohibition determination is performed before or after the work for the circuit board.
(4) The elapsed time acquisition unit
An initial board specifying portion for specifying a circuit board on which the solder printing is performed;
For each circuit board specified by the initial board specifying unit, a time measuring unit that measures the elapsed time after solder printing,
An intermediate board specifying unit that specifies a circuit board at the at least one location, and reading the measurement time corresponding to the specified circuit board from the time measuring unit in accordance with the specification of the circuit board by the intermediate board specifying unit The electronic circuit component mounting system according to item (2), wherein the elapsed time is acquired by:
At least one of the initial substrate specifying portion and the intermediate substrate specifying portion can be configured in the same manner as the intermediate substrate specifying portion in the item (2).
The timekeeping unit may start measurement with 0 at the time of solder printing, and may increase the measurement time as time elapses. Alternatively, the measurement time at the time of solder printing may be allowed time and as time elapses. The measurement time may be reduced. In the former case, the elapsed time is directly acquired by counting time, and in the latter case, the difference between the allowable time and the measurement time is the elapsed time. In the latter case, the measurement time is the remaining work time allowed for the circuit board, and this remaining work allowance time is compared with the estimated required time at one place. Can be prohibited. The remaining work allowable time is the time obtained by subtracting the elapsed time from the allowable time, and comparing this with the estimated required time determines whether the sum of the elapsed time and the estimated required time exceeds the allowable time Is essentially the same as
(5) The electronic circuit component mounting system includes a solder printer for printing the solder and a reflow furnace for melting the solder, and an electronic circuit board is installed between the solder printer and the reflow furnace. One or more component mounting machines for mounting circuit components are included, and at least one of the one or more component mounting machines is provided with the work prohibition unit, and the at least one component mounting machine is connected to the one place. The electronic circuit component mounting system according to any one of (1) to (4).
If the work prohibition determination is made before starting the mounting of the electronic circuit component on the circuit board in the component mounting machine, the work of the component mounting machine itself is prohibited, and the electronic circuit component is mounted on the circuit board wastefully. If the work prohibition determination is made after the installation is completed, it is possible to avoid performing unnecessary circuit board work by the counter circuit board working machine (including other parts mounting machines) downstream from the component mounting machine. can do.
(6) A plurality of the component placement machines are included, and at least two of the plurality of component placement machines are provided with the work prohibition unit, and each of the two or more component placement machines is defined as the one place. (5) Electronic circuit component mounting system.
The work prohibition unit may be provided on all of the plurality of component mounting machines, or may be provided on a part thereof.
The more component mounting machines that are provided with the work prohibition section, the earlier it can be found that the sum of the elapsed time and the estimated required time exceeds the allowable time, and the unnecessary mounting of electronic circuit components may be avoided. Becomes higher.
As the number of component mounting machines increases, the time required from solder printing to melting becomes longer and the allowable time is easily exceeded, so that the effect of the claimable invention can be enjoyed effectively.
(7) The electronic circuit component mounting system includes a solder printer for printing the solder and a reflow furnace for melting the solder, and an electronic circuit on the circuit board between the solder printer and the reflow furnace. A printing inspection machine that includes one or more component mounting machines for mounting parts, and that inspects the printing result of the solder printer, and a mounting inspection machine that inspects the mounting state of electronic circuit components by the component mounting machine. The work prohibition portion is provided in at least one of the at least one and at least one of the one or more component mounting machines, and at least one of the at least one and at least one of the at least one is the one place (1 The electronic circuit component mounting system according to any one of items) to (4).
By inspecting the printing result, for example, the presence or absence of printing, the deviation of the solder from the land, the printing amount, the presence or absence of occurrence of a bridge, and the like can be inspected to check whether printing has been performed properly. In addition, the inspection of the mounting state checks, for example, whether or not the electronic circuit component is mounted, whether or not the mounting posture is appropriate, whether or not the electronic circuit component type is appropriate, and whether or not the electrode and the land are misaligned. It can be checked whether or not. If the work inspection part is provided in the print inspection machine, the print inspection can be prohibited, or the installation work is prohibited before the installation of the electronic circuit parts on the circuit board is started, and the electronic circuit parts are most wasted. It can be avoided efficiently. The component placement machine is also provided with a work prohibition unit. However, if the print inspection machine is provided with a work prohibition unit, it is possible to prohibit the supply of a circuit board from the print inspection machine to the component placement machine. Further, when a plurality of component mounting machines are provided and a work prohibition unit is provided in the downstream component mounting machine, the mounting operation can be prohibited before the circuit board reaches the work prohibition unit.
In addition, if a work prohibition unit is provided in the mounting inspection machine, mounting inspection can be prohibited, or the circuit board can be prohibited from being sent to the reflow furnace, and mounting inspection and melting of the solder can be performed wastefully. Can be avoided.
(8) an intermediate board specifying unit for specifying a circuit board at the at least one location;
A permissible time storage unit storing a plurality of types of permissible time set in advance according to the type of circuit board;
An allowable time reading unit that reads out the allowable time corresponding to the type of the circuit board specified by the intermediate substrate specifying unit from the allowable time storage unit, according to any one of (1) to (7) Electronic circuit component mounting system.
When the type of electronic circuit component to be mounted varies depending on the type of circuit board, and the type of cream-like solder used for soldering varies, the allowable time may vary. According to the present system, the work for the circuit board can be prohibited or not prohibited depending on the allowable time set for the circuit board.
(9) The work prohibition unit
A current time acquisition unit for acquiring the current time;
A writing device for writing the printing time of solder on the circuit board in an information recording unit capable of writing and reading information provided on the circuit board;
A reading device for reading the printing time from the information recording unit at the at least one location;
An elapsed time acquisition unit that acquires the elapsed time by subtracting the print time read by the reading device from the current time acquired by the current time acquisition unit;
An estimated required time acquisition unit that acquires the estimated required time at the reading time of the printing time by the reading device, and the estimated required time acquired by the estimated required time acquisition unit and the elapsed time acquisition unit. The electronic circuit component mounting system according to item (1), wherein when the sum of the elapsed time and the elapsed time exceeds the permissible time, the subsequent circuit board operation is prohibited.
The current time may be the arrival time at one place on the circuit board, or may be the time when it is determined whether or not the sum of the estimated required time and the elapsed time by the work prohibition unit exceeds the allowable time. The estimated required time at the time of reading the printing time is an estimated required time at one place on the electronic circuit component mounting line, and can be obtained corresponding to that place.
Since the information recording unit is provided on the circuit board, it is easy to obtain the printing time.
The printing time is described in the same manner as in item (3).
The estimated required time is set starting from reading of the printing time at one place.
(10) The estimated required time acquisition unit
An estimated required time storage unit in which the estimated required time is stored in advance;
The electronic circuit component mounting system according to any one of (2), (3), (4), and (9), comprising: an estimated required time reading unit that reads the estimated required time from the estimated required time storage unit .
The estimated required time storage unit may store a plurality of types of estimated required times in association with the types of circuit boards, or may store one estimated required time regardless of the types of circuit boards. It can also be. However, in any case, the estimated required time can be changed depending on where in the electronic circuit component mounting system the one place corresponds to the flow of the circuit board.
(11) The electronic circuit component mounting system includes a board handling device for handling a circuit board between the plurality of circuit board working machines, and the work handling unit is provided in the board handling device (1). Or the electronic circuit component mounting system according to any one of (10) to (10).
In addition to at least one counter circuit board machine belonging to the electronic circuit component mounting system, the board handling apparatus is also provided with a work prohibition unit. If there is a time when the circuit board is stopped on the substrate handling apparatus, it is desirable to determine whether to prohibit the operation when the circuit board is unloaded from the substrate handling apparatus.
(12) The work prohibition unit provided in the substrate handling apparatus prohibits the handling of the circuit board by the substrate handling apparatus, whereby the counter circuit board work by the counter circuit board work downstream from the substrate handling apparatus. The electronic circuit component mounting system according to item (11), wherein the electronic circuit component mounting system is prohibited.
If the handling of the board is prohibited, the circuit board is not supplied downstream from the handling device, and the circuit board work is not performed by the downstream circuit board working machine. Will be prohibited.
(13) The electronic circuit component mounting system includes, in addition to the plurality of circuit board work machines, one or more board handling devices that handle circuit boards between the plurality of circuit board work machines, Item (1) to Item (4), wherein the operation prohibiting unit is provided in at least one of a plurality of circuit board working machines and the one or more substrate handling apparatuses, and at least one of them is the one place. The electronic circuit component mounting system according to any one of the above.
This section is different from the above section (12) in that it includes a mode in which the work prohibition unit is provided only in the board handling apparatus belonging to the electronic circuit component mounting system.
(14) The electronic circuit component mounting system according to any one of (1) to (13), wherein the work prohibition unit includes a work prohibition notification device that notifies a worker of prohibition of the circuit board work.
The work prohibition notification device may be a device that notifies the worker by various notification media such as sound, image, and light, for example, at least one of a buzzer, a lamp, and a display device, and is known as a PDA (Personal Digital Assistant). Notification can also be made by transmission and display of error data to a portable information terminal or personal computer, and transmission of an error occurrence message by a short message to a mobile phone or PHS by E-Mail or SMS (Short Message Service).
It is desirable, but not essential, that the notification includes information on the position of the circuit board that has caused the work prohibition.
Based on the notification, the worker performs a work for canceling the work prohibition, such as taking out the circuit board for which the work is prohibited from the electronic circuit component mounting system.
(15) An adhesive is applied to at least one of the circuit board and the electronic circuit component by the counter circuit board work, which is a work on the circuit board by the plurality of counter circuit board work machines. The electronic circuit component is mounted on the circuit board by temporarily fixing the electronic circuit component with the adhesive and mounting the circuit board on the circuit board, and placing the circuit board in the adhesive curing device to cure the adhesive. In an electronic circuit component mounting system for manufacturing electronic circuits,
Elapsed time since the application of the adhesive to the circuit board at at least one place in the electronic circuit component mounting system, and before the circuit board is put into the adhesive curing device for the adhesive from at least one place. When the sum of the estimated required time estimated to be required exceeds an allowable time allowed as an elapsed time from application of the adhesive to being put into the adhesive curing device, the at least one location on the circuit board An electronic circuit component mounting system, comprising: a work prohibiting unit for prohibiting the counter circuit board work by the counter circuit board working machine thereafter.
The features of the items (2) to (14) can be applied to the electronic circuit component mounting system of this item. However, in that case, it is necessary to change the solder printer, the solder, and the reflow furnace to an adhesive applicator, an adhesive, and an adhesive curing device.
It is also possible to carry out both the invention according to this section and the invention according to the above section (1). In that case, if it is necessary to prohibit the work after the sum of the elapsed time and the estimated required time exceeds the allowable time for either one of the solder and the adhesive, Even if it is not necessary to prohibit the work yet, it is necessary to make the work prohibited.
When the application of the adhesive is performed by a dedicated circuit board working machine, it can literally be referred to as an adhesive application machine. The component mounting machine is provided with an adhesive application device, and the application of the adhesive and the mounting of the electronic circuit component may be performed by a single machine. In that case, it is considered that the adhesive applicator and the component mounting machine are integrally configured, or that one of the adhesive applicator and the component mounting machine serves as the other.

It is a figure which shows schematically the electronic circuit component mounting line which is one Embodiment. It is a side view which shows the solder printer which comprises the said electronic circuit component mounting line. It is a top view which shows the imaging device and imaging device movement apparatus of the said solder printer. It is a top view which shows roughly the screen used for the printing of solder in the said solder printer. It is a top view which shows roughly the circuit board in which an electronic circuit component is mounted in the said electronic circuit component mounting line. It is a top view which shows roughly the printing inspection machine which comprises the said electronic circuit component mounting line. It is a perspective view which shows the mounting module row | line | column which comprises the said electronic circuit component mounting line. It is a perspective view which shows a part of mounting module which comprises the said mounting module row | line | column. It is a perspective view which shows the mounting apparatus which comprises the said mounting module. It is a flowchart which shows the work control routine memorize | stored in ROM of the computer which comprises the main body of the printing inspection machine which comprises the said electronic circuit component mounting line, the most downstream mounting module, and the control apparatus which each controls a mounting inspection machine. It is a flowchart which shows the work prohibition determination routine memorize | stored in ROM of the said computer. It is a flowchart which shows the conveyance control routine memorize | stored in ROM of the host computer of the integrated control apparatus which comprises the said electronic circuit component mounting line. It is a flowchart which shows the mounting control routine memorize | stored in ROM of the computer which comprises the main body of the control apparatus which respectively controls all the mounting modules other than the mounting module of the downstream most of the mounting module row | line | column which comprises the said electronic circuit component mounting line. . It is a flowchart which shows another conveyance control routine memorize | stored in ROM of the said host computer. It is a figure explaining the work prohibition determination in the printing inspection machine of the said electronic circuit component mounting line. It is a figure explaining the determination of work prohibition in the mounting module of the said electronic circuit component mounting line. It is a mounting module of the said electronic circuit component mounting line, Comprising: It is a figure explaining the determination of work prohibition in the mounting module downstream from the mounting module by which determination of work prohibition is demonstrated based on FIG. It is a figure explaining the measurement of the elapsed time in the electronic circuit component mounting line which is another embodiment. It is a flowchart which shows the work prohibition determination routine performed in the printing inspection machine and mounting module of the electronic circuit component mounting line in which the elapsed time shown in FIG. 18 is measured. It is a flowchart which shows the work prohibition determination routine performed in the mounting inspection machine of the electronic circuit component mounting line by which the elapsed time shown in FIG. 18 is measured. It is a top view which shows the circuit board provided with the tag chip | tip. It is a figure which shows the said tag chip and a reader / writer. It is a flowchart which shows the work prohibition determination routine performed in the printing inspection machine, mounting module, and mounting inspection machine which work on the circuit board provided with the said tag chip. It is a figure which shows roughly the electronic circuit component mounting line provided with the adhesive application module and the adhesive hardening apparatus. It is a perspective view which shows the application head of the said adhesive agent application module. It is front sectional drawing which shows the syringe etc. of the said application head. It is a flowchart which shows the operation | work prohibition determination routine performed in the mounting module and mounting | wearing inspection machine of an electronic circuit component mounting line provided with the said adhesive application module and adhesive hardening apparatus. It is a figure which shows schematically the electronic circuit component mounting system which is another embodiment. It is a flowchart which shows the conveyance control routine performed about the board | substrate conveyance apparatus between work machines of the electronic circuit component mounting system which is another embodiment.

  Several embodiments of the claimable invention will be described below with reference to the drawings. In addition to the following embodiments, the claimable invention can be implemented in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  FIG. 1 shows an electronic circuit component mounting line as an electronic circuit component mounting system according to an embodiment of the claimable invention. The electronic circuit component mounting line includes a solder printer 10, a printing inspection machine 12, a mounting module row 14, a mounting inspection machine 16, a reflow furnace 18, and a line substrate transfer device 20. Solder printer 10, print inspection machine 12, mounting module row 14, mounting inspection machine 16, and reflow furnace 18 (hereinafter referred to as solder printing machine 10), which are respectively circuit board working machines (hereinafter abbreviated as working machines). The circuit boards are arranged in a line in the order described, and the circuit board is most downstream from the solder printer 10 provided on the most upstream side of the electronic circuit component mounting line by the line board transport device 20. It is conveyed to the reflow furnace 18 provided on the side.

  In the present electronic circuit component mounting line, the line board transfer device 20 includes a work machine board transfer device, which is a board transfer device provided in each of the solder printers 10, and the like, between the solder printer 10 and the print inspection machine 12, An inter-worker substrate transfer device provided between the print inspection machine 12 and the mounting module row 14, between the mounting module row 14 and the mounting inspection device 16, and between the mounting inspection device 16 and the reflow furnace 18, respectively. Including. The inter-worker board transfer device may be omitted, and the circuit board may be directly transferred between the work machine board transfer devices. In the direction in which the solder printers 10 and the like are arranged, the conveyance direction of the circuit board by the line substrate conveyance device 20 is the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction.

  The solder printing machine 10 is a screen printing machine that prints cream-like solder on a circuit board using a screen 26. As shown in FIG. A machine substrate transfer device 32, a substrate holding device 34, a screen holding device 36, a squeegee device 38, a mark imaging system 40, and a control device 42 (see FIG. 1) are included. As shown in FIG. 4, the screen 26 is stretched and fixed to the screen frame 46 without slack, and is provided with a plurality of printing through holes 48 penetrating in the thickness direction. The screen 26 is also provided with a plurality of, for example, two fiducial marks 50 at two locations separated diagonally.

  As schematically shown in FIG. 5, a plurality of lands 52 are formed on the circuit board 28, and each of the plurality of through holes 48 is formed at a location corresponding to the land 52 of the screen 26. Corresponding shape and dimensions. The circuit board 28 is also provided with a plurality of, for example, two fiducial marks 54 at two locations separated diagonally and a two-dimensional code 56. In the two-dimensional code 56, a board identification code representing data (type of circuit board 28, manufacturer, manufacturing lot number, individual number, etc.) that can identify each circuit board 28 is recorded.

  The printing machine board conveying device 32 is constituted by, for example, a belt conveyor which is a kind of conveyor, supports the circuit board 28 in a horizontal posture, and is conveyed in the X-axis direction and in a direction perpendicular to the paper surface in FIG. To do. The substrate holding device 34 is provided in the middle of the conveyance path of the printing press substrate conveyance device 32, and holds and raises the circuit board 28 in a horizontal posture. The screen holding device 36 is provided in the upper part of the substrate holding device 34 of the frame 10, and the screen 26 is positioned on the screen support base 60 by the positioning device 62, fixed by the fixing device 64, and held in a horizontal posture. .

  As shown in FIG. 2, the squeegee device 38 includes a pair of squeegee heads 66 serving as work heads, a squeegee head moving device 68 serving as a work head moving device, and a pair of squeegee head lifting devices 70. The squeegee head moving device 68 includes a moving member 72 and a moving member moving device 74. The moving member moving device 74 includes a squeegee moving motor 76 that is a driving source, and a feed screw mechanism 82 that is a motion converting mechanism including a ball screw 78 and a nut 80. Each of the pair of squeegee heads 66 includes a squeegee holding member 84 and a squeegee 86. The pair of squeegee heads 66 are provided on the moving member 72 together with the pair of squeegee head lifting and lowering devices 70. Are moved in the Y axis direction by the squeegee head moving device 68 and moved along the screen 26.

  As shown in FIG. 3, the mark imaging system 40 includes an imaging device 90 and an imaging device moving device 92, and is provided in a portion between the substrate holding device 34 and the screen holding device 36 as shown in FIG. 2. Yes. The imaging apparatus 90 is configured to capture an imaging target with a CCD camera, and is configured in the same manner as the imaging apparatus described in Japanese Patent Application Laid-Open No. 2007-38456, and is provided with a circuit board 28 and a screen 26, respectively. The marks 50 and 54 can be imaged.

  The imaging device moving device 92 includes an X-axis direction moving device 96 and a Y-axis direction moving device 98. The X-axis direction moving device 96 includes an X-axis slide 100 and an X-axis slide moving device 102 as movable members. The X-axis slide moving device 102 includes an X-axis moving motor 104 which is a kind of electric rotary motor as a driving source, and a feed screw mechanism 110 including a ball screw 106 and a nut 108, and guides the X-axis slide 100 to a guide device 112. The guide rail 114 as a pair of guide members is guided to an arbitrary position in the X-axis direction. The Y-axis direction moving device 98 is provided on the X-axis slide 100 and includes a Y-axis slide 118 and a Y-axis slide moving device 120 as movable members. The Y-axis slide moving device 120 includes a Y-axis moving motor 122 and And a feed screw mechanism 128 including a ball screw 124 and a nut 126, and the Y-axis slide 118 is moved to an arbitrary position in the Y-axis direction while being guided by the guide rail 132 of the guide device 130. The imaging device 90 is provided on the Y-axis slide 102 and is moved to an arbitrary position in the horizontal plane.

  As conceptually shown in FIG. 1, the control device 42 is mainly configured by a print control computer 134, and controls a drive source and the like of the printing press substrate transport device 32 and the like via a drive circuit (not shown). To do. Further, the image data obtained by the imaging of the imaging device 90 is processed by the image processing computer 136, and the data obtained thereby is sent to the print control computer 134.

  As schematically shown in FIG. 1, an inter-worker board transfer device 138 configured by a belt conveyor is provided between the solder printer 10 and the print inspection machine 12, similarly to the printer board transfer device 32. The circuit board 28 on which the solder has been printed is carried out to the inter-worker board transfer device 138 by the printing machine board transfer device 32, and is transferred from the inter-worker substrate transfer device 138 to the print inspection machine 12.

The print inspection machine 12 will be described.
As shown in FIG. 6, the print inspection machine 12 includes a print inspection machine substrate transfer device 140, a print inspection head 142 as a work head, a print inspection head moving device 144 as a work head moving device, and a control device 146 (see FIG. 1). including. The printing inspection machine substrate transfer device 140 is configured by a belt conveyor, similar to the printing machine substrate transfer device 32. As shown in FIG. 6, the print inspection head moving device 144 includes an X-axis direction moving device 150 and a Y-axis direction moving device 152. These moving devices 150 and 152 are configured in the same manner as the X-axis direction moving device 96 and the Y-axis direction moving device 98 of the image pickup device moving device 92, and the same reference numerals are given to portions that perform the same operations. Correspondence is shown and description is abbreviate | omitted.

  The print inspection head 142 includes a CCD camera as an imaging device, is provided on the Y-axis slide 118 of the Y-axis direction moving device 152, and is moved to an arbitrary position in the horizontal plane above the print inspection machine substrate transfer device 140. . The CCD camera constituting the print inspection head 142 has a wide field of view, the circuit board 28 is divided into a plurality of areas, and the solder printed on the plurality of lands 52 can be collectively imaged for each area. Done quickly.

  As conceptually shown in FIG. 1, the control device 146 is mainly configured by a print inspection control computer 156, and a drive source such as a print inspection machine substrate transport device 140 via a drive circuit (not shown). And a buzzer 158 as a work prohibition notification device is driven. Further, the image data obtained by the image pick-up by the CCD camera of the print inspection head 142 is processed by the image processing computer 160, and the data obtained thereby is sent to the print inspection control computer 156.

The mounting module row 14 will be described.
As shown in FIG. 7, the mounting module row 14 includes a plurality of mounting modules 180 on the module row base 182, 18 in this electronic circuit component mounting line, arranged in parallel to each other and with almost no gap in the X-axis direction. It consists of The mounting module 180 is a component mounting machine whose dimensions and configuration are standardized. The width that is a dimension parallel to the X-axis direction is differentiated into two types. The mounting module 180a has a narrow width and the mounting module 180a has a width of 2 of the mounting module 180a. Double mounting module 180b. In the mounting module row 14, two mounting modules 180b are arranged on the downstream side of the 16 mounting modules 180a in the substrate transport direction. The module row base 182 also includes a plurality of, for example, five base modules 184 arranged side by side. The configuration of the mounting module row can be easily changed by arranging an appropriate number of at least one of the mounting modules 180a and 180b, and the base modules 184 are arranged in accordance therewith to constitute the module row base 182.

  Although the 18 mounting modules 180 are arranged close to each other, like the mounting module described in Japanese Patent Application Laid-Open No. 2004-104075, each of the mounting modules 180 has a plurality of wheels and is mounted on a rail provided on the base module 184. The operator can be moved while being guided, and the operator can individually pull out the mounting module 180, and maintenance, inspection, etc. can be performed in the pulled-out state. It is also possible to connect a gantry (not shown) to the module row base 182 and pull out each mounting module 180 on the gantry for maintenance and inspection. The mounting modules 180a and 180b are similarly configured with different widths, and one of the mounting modules 180a will be described as a representative.

The mounting module 180a is described in detail in, for example, Japanese Patent Application Laid-Open No. 2004-104075, and parts other than those relating to the claimable invention will be briefly described.
As shown in FIG. 8, the mounting module 180a includes a module main body 190 as a mounting machine main body, a mounting module substrate transfer device 192 as a work machine substrate transfer device, a substrate holding device 194, a component supply device 196, a mounting device 198, a reference device. A mark imaging device 200 (see FIG. 9), a component imaging device 202, and a control device 204 (see FIG. 1) are provided.

  As shown in FIG. 8, the mounting module substrate transfer device 192 includes two substrate conveyors 210 and 212 each configured by a belt conveyor, and the mounting module 10 of the base unit 214 constituting the module main body 190 in the front-rear direction. It is provided at the center and conveys the circuit board 28 in the X-axis direction. The substrate holding device 194 is provided for each of the two substrate conveyors 210 and 212, and although not shown in the drawings, a support member that supports the circuit board 28 from below and both side edges parallel to the conveying direction of the circuit board 28 are provided. Each of the clamp members includes a clamp member, and holds the circuit board 28 in a posture in which a mounting surface on which the electronic circuit component is mounted is horizontal. The board conveyors 210 and 212 are configured such that the board conveyance width can be changed. When the width of the circuit board 28 is small, the electronic circuit components are mounted using the board conveyors 210 and 212, and the board conveyor width is large. For this, a substrate conveyor 210 is used.

  As shown in FIG. 8, the component supply device 196 is provided on one side in the Y-axis direction with respect to the mounting module substrate transfer device 192 of the base 214 and on the front side of the mounting module 180a. The component supply device 196 supplies an electronic circuit component by a tape feeder (hereinafter abbreviated as “feeder”) 220 as a component feeder, which is a kind of component supply tool, and includes a plurality of feeders 220 and the feeders 220. And a feeder support base (not shown). Each of the plurality of feeders 220 supplies a large number of electronic circuit components while being held by a tape, and each of the plurality of feeders 220 that hold different types of electronic circuit components is configured so that each component supply unit extends along the X-axis direction. Attached to the feeder support stand in line. As shown in FIG. 7, the component supply device 196 of the wide mounting module 180b holds a large electronic circuit component and supplies the electronic circuit component by a large tape feeder 222 and a tray 224. The electronic circuit component may be supplied only by the tape feeder 222 or the tray 224.

  As shown in FIGS. 8 and 9, the mounting device 198 includes a mounting head 230 that is a work head and a mounting head moving device 232 that is a work head moving device that moves the mounting head 230. The mounting head moving device 232 includes an X-axis direction moving device 234 and a Y-axis direction moving device 236, as shown in FIG. The Y-axis direction moving device 236 includes a linear motor 240 provided across the component supply unit of the component supply device 196 and the two substrate holding devices 194 on the beam unit 238 constituting the module main body 190 as a movable member. The Y-axis slide 242 is moved to an arbitrary position in the Y-axis direction. The X-axis direction moving device 234 is provided on the Y-axis slide 242 and is moved in the X-axis direction with respect to the Y-axis slide 242 and is relatively moved in the X-axis direction with respect to each other. And an X-axis slide moving device 248 for moving the slides 244 and 246 in the X-axis direction (only the moving device 248 for moving the second X-axis slide 246 is shown in FIG. 8). . Each of the two X-axis slide moving devices includes, for example, a servo motor with an encoder which is a kind of an electric rotary motor serving as a drive source, and a feed screw mechanism including a ball screw and a nut, and X-axis slides 244 and 246 are included. Is moved to an arbitrary position in the X-axis direction.

  The mounting head 230 is detachably mounted on the second X-axis slide 246, and the mounting head moving device 232 moves within a mounting work area that is a moving region straddling the component supply unit of the component supply device 196 and the two substrate holding devices 194. Can be moved to any position. The mounting head 230 holds electronic circuit components by a suction nozzle 250 which is a kind of component holder, and includes a nozzle holder which is a holder holder, a holder lifting device, and a holder rotating device.

  The reference mark imaging device 200 is constituted by a CCD camera in the mounting module 180a, is mounted downward on the second X-axis slide 246, and is moved together with the mounting head 230 to an arbitrary position in the horizontal plane. The mounting head moving device 232 also operates as an imaging device moving device, and constitutes a reference mark imaging system together with the reference mark imaging device 200. The component imaging device 202 is constituted by a CCD camera, and is provided in a portion between the mounting module substrate transfer device 192 and the component supply device 196 of the module main body 190 and held by the suction nozzle 250 as shown in FIG. The electronic circuit component is imaged from below.

  As conceptually shown in FIG. 1, the control device 204 is mainly configured by a mounting control computer 270, and controls a driving source and the like of the mounting module substrate transfer device 192 through a driving circuit (not shown). In addition, the buzzer 272 constituting the notification device is controlled. Further, the image data obtained by the imaging of the reference mark imaging device 200 and the component imaging device 202 is processed by the image processing computer 274, and the data obtained thereby is input to the mounting control computer 270.

  Of the 18 mounting modules 180 constituting the mounting module row 14, there is a diagram between the most upstream mounting module 180 a and the printing inspection machine 12 and between the most downstream mounting module 180 b and the mounting inspection machine 14, respectively. As schematically shown in FIG. 1, inter-worker substrate transfer devices 280 and 282 are provided. Each of these substrate transfer devices 280 and 282 is a shuttle type substrate transfer provided with a substrate conveyor constituted by a belt conveyor, and a conveyor moving device for moving the substrate conveyor in a horizontal direction perpendicular to the circuit board transfer direction. The inter-worker substrate transfer device 280 passes the circuit board received from the substrate transfer device 140 of the print inspection machine 12 to one of the substrate conveyors 210 and 212 of the most upstream mounting module 180a. Further, the inter-worker board transfer device 282 receives a circuit board from one of the board conveyors 210 and 212 of the mounting module 180b on the most downstream side, and passes it to the board transfer device of the mounting inspection machine 16.

  The mounting inspection machine 16 is configured in the same manner as the printing inspection machine 12, and includes a mounting inspection machine substrate transfer device, a mounting inspection head as a work head, a mounting inspection head moving device (not shown) as a work head moving device, and a control device. 290 (see FIG. 1), a mounting inspection head constituted by a CCD camera is moved to an arbitrary position in a horizontal plane, and images an electronic circuit component mounted on the circuit board 28. This CCD camera also has a wide field of view similar to the CCD camera constituting the print inspection head 142. The circuit board 28 is divided into a plurality of areas, and a plurality of electronic circuit components mounted in each area are collectively imaged. Inspection is done quickly.

  As shown in FIG. 1, the control device 290 is mainly configured by a mounting inspection control computer 292. The control device 290 controls a driving source and the like of a mounting inspection machine substrate transfer device through a drive circuit (not shown). Then, the buzzer 294 as a notification device is driven. In addition, image data obtained by imaging with the CCD camera of the mounting inspection head is processed by the image processing computer 296, and the data obtained thereby is supplied to the mounting inspection control computer 292.

  The reflow furnace 18 includes a reflow furnace substrate transfer device, a heating device (not shown), and a control device 310 (see FIG. 1). The reflow furnace substrate transfer device includes a substrate conveyor constituted by a belt conveyor, and receives and transfers a circuit board from an inter-worker substrate transfer device 312 provided between the mounting inspection machine 16 and the reflow furnace 18. The control device 310 is mainly configured by a reflow control computer 314 (see FIG. 1), and controls a drive source and the like of a reflow furnace substrate transfer device.

  The solder printer 10, the print inspection machine 12, the mounting module row 14, the mounting inspection machine 16, the reflow furnace 18, and the inter-worker board transfer devices 280, 282, and 312 constituting the electronic circuit component mounting line are shown in FIG. The overall control is performed by the overall control device 330. The overall control device 330 is mainly composed of a host computer 332, and is connected to a print control computer 134, a print inspection control computer 156, and the respective attachment control computers 270 of all the attachment modules 180 by a communication cable (not shown) as a kind of communication means. It is connected to a mounting inspection control computer 292 and a reflow control computer 314, and exchanges data and commands. The RAM of the host computer 332 is provided with a board solder printing time memory, an estimated required time memory, and an allowable time memory. These memories will be described later. The ROM of the host computer 332 stores a conveyance control routine shown in the flowcharts of FIGS. 12 and 14, respectively. Further, the mounting control computers 270 of all the mounting modules 180 are also connected to each other by a communication cable (not shown).

  The operation control routine shown in FIG. 10 is stored in the ROMs of the printing inspection control computer 156 and the mounting control computer 270 of the downstream mounting module 180b and the mounting inspection control computer 292, respectively, and all the mounting modules 180a and the upstream side are stored. A mounting control routine shown in FIG. 13 is stored in each mounting control computer 270 of the mounting module 180b. In the print inspection machine 12, the most downstream mounting module 180b, and the mounting inspection machine 16, since the work procedure is the same, the work control routine is represented by the same flowchart, but the work contents are contents corresponding to each work machine. It is said.

  In the electronic circuit component mounting line configured as described above, a circuit board 28 on which solder is not printed is supplied to the solder printer 10 by a board supply device (not shown), and is transported by the printer board transport device 32. And stopped at a predetermined printing position. Then, in a state where the circuit board 28 is held by the board holding device 34, the imaging device 90 is moved by the imaging device moving device 92 to enter between the screen 26 and the circuit board 28, and the reference marks 50, 54. Image. The imaging data of the fiducial marks 50 and 54 is processed by the image processing computer 136, and the relative positional deviation between the screen 26 and the circuit board 28 is calculated based on the image data of the fiducial marks 50 and 54, and the print control computer 134. Sent. In the present solder printer 10, the screen 26 is moved in the horizontal direction with respect to the circuit board 28 by the positioning device 62, the positional deviation is corrected, and the positions of the through hole 48 and the land 52 are aligned. Further, the two-dimensional code 56 provided on the circuit board 28 is picked up by the image pickup device 90, the board identification code is read based on the image data by the processing by the image processing computer 136, and the solder printed on the circuit board 28. Is identified. The board identification code is sent to the print control computer 134.

  After the imaging device 90 is retracted from between the circuit board 28 and the screen 26, the board holding device 34 is raised so that the circuit board 28 can come into contact with the screen 26. Then, one of the pair of squeegee heads 66 is lowered, and one of the pair of squeegees 86 is moved along the screen 26 while being brought into contact with the screen 26 and placed on the screen 26. The solder that has been moved is pushed into the through-hole 48 while being moved to adhere to the land 52 of the circuit board 28. After printing, the squeegee head 66 is raised, the squeegee 86 is separated from the screen 26, and the substrate holding device 34 is lowered to separate the circuit board 28 from the screen 26. It is unloaded from the solder printer 10. When the squeegee head 66 is moved from one side of the circuit board 28 to the other side and the solder printing on the circuit board 28 is completed, the printing end time is set as the solder printing time, and the two-dimensional code 56 is imaged. Corresponding to the acquired board identification code, it is sent from the printing control computer 134 to the host computer 332 and stored in the solder printing time memory of the host computer 332. The printing time may be sent from the host computer 332 to each control computer 156, 270, 292 and stored in association with the board identification code.

  The circuit board 28 is unloaded from the solder printer 10 to the inter-worker board transfer device 138, transferred from the inter-worker board transfer device 138 to the print inspection machine board transfer device 140, and carried into the print inspection machine 12. It is stopped at the set inspection position. At this time, the stop time is stored as an arrival time in an arrival time memory as an arrival time storage unit which is a current time storage unit in the print inspection control computer 156. Further, the work control routine shown in FIG. 10 is executed by the print inspection control computer 156 as a print inspection control routine. This routine includes an operation prohibition determination step, and subsequent operations are prohibited depending on the elapsed time from the solder printing to the arrival at the print inspection machine 12.

  By executing step 1 of the work control routine (hereinafter abbreviated as S1; the same applies to other steps), the circuit board 28 on which the solder has been printed from the upstream work machine, here, the solder printing machine 10. Is carried in. Loading of the circuit board 28 is performed in a state where the work on the work machine, here, the print inspection in the print inspection machine 12 is completed and the circuit board 28 can be carried in, and the circuit board 28 is stopped at a preset inspection position. It is done. After the stop, the print inspection head 142 is moved by the moving device 144, and the reference mark 54 and the two-dimensional code 56 are imaged. Then, the image data is processed by the image processing computer 160, the position error of the circuit board 28 is calculated based on the image data of the reference mark 54, and the board identification code is read based on the image data of the two-dimensional code 56. .

  Next, S2 is executed, and a work prohibition determination, here, a determination as to whether or not to prohibit printing inspection is performed. This determination is performed according to a work prohibition determination routine shown in FIG. First, S11 is executed, and the board identification code read based on the imaging of the two-dimensional code 56 is read from the image processing computer 160 to the print inspection control computer 156, and the circuit board 28 reaching the print inspection machine 12 is specified. The

  Next, S12 is executed, and based on the board identification code, the print end time stored in association with the board identification code is read from the solder printing time memory of the host computer 332, and then by execution of S13. The time stored when the circuit board 28 is stopped to be loaded is read from the arrival time memory. Then, S14 is executed, and an elapsed time TA from the end of solder printing to the arrival of the circuit board 28 to the print inspection machine 12 is acquired. The elapsed time TA is acquired by subtracting the print end time from the stop time of the circuit board 28. The current time, which is the time when S3 is executed, may be used as the arrival time.

  Next, S15 is executed, and the estimated required time TR is read out. The estimated required time TR is a time estimated to be required from the arrival of the circuit board 28 to the printing inspection machine 12 to the melting of the solder. If a program for making the circuit board 28 an electronic circuit is created, Can be set based on the program. In this electronic circuit component mounting line, “until melting of the solder” refers to the time until the circuit board 28 reaches the interworker board transfer device 312 and starts to be carried into the reflow furnace 18. The same applies to the allowable time TP described later.

  In this electronic circuit component mounting line, the work prohibition determination is performed in each of the print inspection machines 12 and 18 mounting modules 180 and the mounting inspection machine 16, but the work machine to which the circuit board 28 reaches is reflowed. The closer to the furnace 18, the less the remaining work, and the shorter the estimated required time TR. Further, since the work prohibition determination is performed before the work in any work machine, the estimated required time TR is set according to the type of the circuit board 28, and the work machine (location where the work prohibition determination is performed is performed. ) For each work in the work machine and the work machine between the reflow furnace 18 on the downstream side and the host computer 332 in association with the type of the circuit board 28 and the work machine. Is stored in the estimated required time memory. In the present embodiment, the time required to transfer the circuit board 28 by each of the inter-worker board transfer devices 138, 280, 282, 312 is as shown in FIG. Included in the time.

  The estimated required time TR is read from the estimated required time memory of the host computer 332 prior to the start of mounting of the electronic circuit components on the circuit board 28 in the electronic circuit component mounting line, and is stored in the RAM of the print inspection control computer 156. ing. The type of the circuit board 28 on which the electronic circuit component is mounted in the electronic circuit component mounting line is grasped by the host computer 332, and the estimated required time TR is read from the estimated required time memory based on the type, and the host computer From 332, the print inspection control computer 156 is supplied and stored. In S15, the stored estimated required time TR is read out. The same applies to work machines for which other work prohibition determinations are made.

  Next, S16 is executed, and the allowable time TP is read. The allowable time TP is a time allowed as an elapsed time from the end of printing of solder on the circuit board 28 to melting. The allowable time TP is set for each type of circuit board 28 and is common to a plurality of work machines for which work prohibition determination is performed, and is stored in the allowable time memory of the host computer 332 in association with the type of circuit board 28. It has been. The allowable time TP, together with the estimated required time TR, is read from the allowable time memory of the host computer 332 and sent to the print inspection control computer 156 prior to the start of mounting electronic circuit components on the circuit board 28 in the electronic circuit component mounting line. In step S16, the allowable time TP stored in the RAM is read out. The same applies to work machines for which other work prohibition determinations are made.

  Then, S17 is executed, and it is determined whether or not the sum of the elapsed time TA and the estimated required time TR exceeds the allowable time TP. As shown in an example in FIG. 15, for mounting electronic circuit components in this electronic circuit component mounting line, one minute or less is required for printing inspection, and one of the 16 mounting modules 180a is used for mounting electronic circuit components. 1.2 minutes, other mounting modules 180a each 1 minute, two mounting modules 180b 1.1 minutes each, mounting inspection takes less than 1 minute, and from printing inspection to mounting inspection is performed as planned The standard work time that is the work time in the case of breakage is 22.9 minutes or less. In the electronic circuit component mounting line, in order to improve the throughput, it is desirable that the work times of the plurality of circuit board working machines constituting the line be as uniform as possible, but there are some differences depending on the work contents. Therefore, if attention is paid to one work machine, if there is a work machine whose work time is longer than that work machine on the downstream side in the substrate transport direction from that work machine, the circuit is used until the work is completed on the work machine having a long work time. It is necessary to wait for the board 28 to be carried out, and the time during which the circuit board 28 is actually in the work machine is longer than the time required for the work, and in consideration thereof, the estimated required time TR in each of the plurality of work machines. Is set. The standard work time is also a time calculated based on the consideration. In the present embodiment, it is assumed that the allowable time TP is 60 minutes.

  Further, the print inspection time includes the time for transporting the circuit board 28 by the inter-worker board transport devices 138 and 280, and the mounting inspection time includes the time for transporting the circuit board 28 by the inter-worker board transport devices 282 and 312. Is included. Further, the mounting time of the mounting module 180 is such that two circuit board conveyors 210 and 212 are used for transporting the circuit board 28 in the mounting module 180, and the circuit board 28 held by the substrate holding device 194 of one of the circuit board conveyors is electronically connected. When the circuit board 28 is carried out, carried in, and held on the other board conveyor while the circuit components are mounted, the circuit board 28 conveyed by the board conveyor 212 on the side far from the component supply device 196 Is set.

  If the work is performed as scheduled, the sum of the elapsed time TA and the estimated required time TR does not exceed the allowable time TP, and all work and transportation scheduled after reaching the printing inspection machine 12 are performed on the circuit board. Even if the process is performed on the circuit board 28, the circuit board 28 can be heated in the reflow furnace 18 before the allowable time TP from the end of printing has passed and the solder becomes defective. Therefore, the determination result in S17 is NO, and the execution of the work prohibition determination routine ends.

  On the other hand, if the sum of the elapsed time TA and the estimated required time TR is larger than the allowable time TP, the operation after the printing inspection machine 12 on the circuit board 28 to the reflow furnace 18 can be performed as planned. The circuit board 28 cannot be heated before the time TP elapses, and the electrodes cannot be normally soldered to the lands 52 even if the solder is melted by heating. For example, the circuit board 28 on which the solder is printed may be extracted by an operator in the inter-worker board transfer device 138 for visual inspection or the like and then returned to the inter-worker board transfer device 138. In this case, with respect to the extracted circuit board 28, the order in which the work is performed is later, and when the print inspection machine 12 is reached, as shown in FIG. For example, the elapsed time TA is 40 minutes and the estimated required time TR is a little less than 23 minutes, and the sum thereof is a little less than 63 minutes, resulting in a situation exceeding the allowable time TP. Therefore, the determination result in S17 is YES, S18 is executed, the work prohibition flag provided in the RAM of the print inspection control computer 156 is set to 1, and the execution of the work prohibition determination routine ends.

  In the work control routine, after the work prohibition determination is executed, S3 is executed to determine whether the work is prohibited. This determination is made based on whether or not the work prohibition flag is set. If the work prohibition flag is reset to 0 and the work is not prohibited, the determination result in S3 is NO and S4 is executed. Work is performed. In the print inspection machine 12, the print inspection head 142 is moved by the print inspection head moving device 144 and images all the solder print locations. The solder printing surface of the circuit board 28 is divided into a plurality of areas each including a plurality of solder printing locations, and an image is taken for each area. The movement position of the print inspection head 142 is corrected so that the positional deviation of the circuit board 28 obtained based on the imaging of the reference mark 54 is reduced.

  In the image processing computer 160, for example, whether or not solder is printed on the land 52 and whether or not the printed solder has a positional deviation exceeding an allowable range based on the image data obtained by the processing of the imaging data. Whether or not there is a printing defect is checked. The result of this inspection is sent from the image processing computer 160 to the print inspection control computer 156. If there is a print defect, the work defect flag is set to 1, and the occurrence of the defect is notified to the operator by the buzzer 158 ringing. The After the print inspection, S5 is executed, and the circuit board 28 is carried out to the inter-worker board transfer device 280. This unloading is performed in a state where the inter-worker board transfer device 280 can load the circuit board 28.

  On the other hand, if the work is prohibited, the determination result in S3 is YES, S6 is executed, the buzzer 158 is sounded to notify the operator of the work prohibition, and then S5 is executed. The board | substrate 28 is carried out. S4 is skipped, the circuit board 28 is not subjected to the print inspection, and the work after it is found that the sum of the elapsed time TA and the estimated required time TR exceeds the allowable time TP is prohibited. The ringing pattern of the buzzer 158 is different from the ringing pattern of the buzzer 158 when notifying the occurrence of a defect, and the operator determines whether the ringing of the buzzer 158 is a notification of the occurrence of a printing defect or work prohibition. Have been able to distinguish. Alternatively, a display device may be provided in the print inspection machine 12 so that the cause of the notification is displayed. In this case, the sound pattern of the buzzer may be different depending on the cause of notification, or may be the same. The same applies to the mounting inspection machine 16.

  The transfer of the circuit board 28 by the inter-worker board transfer device 280 is controlled by the host computer 332, the transfer control routine shown in FIG. 12 is executed, and the execution of S71 causes the circuit board 28 to be transferred from the print inspection machine 12 to the inter-worker board. It is carried into the transport device 280. The circuit board 28 is unloaded from the print inspection machine 12 and loaded into the inter-worker board transfer device 280 in a state where the circuit board 28 can be carried into the inter-worker board transfer device 280 after the inspection of the circuit board 28 is completed. Is called.

  If the circuit board 28 is carried into the inter-worker board transfer device 280, S72 is executed, and whether or not the work is prohibited is determined depending on whether or not the work prohibition flag is set. If the work is not prohibited, the determination result in S72 is NO and S73 is executed, and it is determined whether or not a work defect, here, a print defect occurs, depending on whether or not the work defect flag is set. Done. If no printing failure has occurred, the determination result in S73 is NO, S74 is executed, and the circuit board 28 is unloaded. This unloading is also performed in a state where the circuit board 28 can be unloaded to the downstream working machine, here, the most upstream mounting module 180a.

  On the other hand, if a work failure has occurred, the determination result in S73 is YES, S75 is executed, the conveyance of the circuit board 28 is stopped, and the work failure flag is reset to 0 to the print inspection control computer 156. An instruction to do so is output, and the execution of the routine ends. S74 is not executed, and unloading of the circuit board 28 is prohibited, and an operator who has come to the print inspection machine 12 by the sound of the buzzer 158 visually checks the circuit board 28 unloaded to the inter-worker board transfer device 280. If it can be used, it returns to the inter-worker board transfer device 280, and if it cannot be used, it is left unplugged. When the operator returns the circuit board 28, the operator inputs the fact to the host computer 332 using an input device (not shown), and the circuit board 28 is carried out from the inter-worker board transfer device 280 to the most upstream mounting module 180a. To be.

  If the work is prohibited, the determination result in S72 is YES, S76 is executed, the conveyance of the circuit board 28 is stopped, and the print inspection control computer 156 is instructed to reset the work prohibition flag. Is output and execution of the routine ends. Therefore, S74 is skipped, the circuit board 28 is not carried out, and the conveyance is prohibited, and the worker who has arrived at the print inspection machine 12 by the sound of the buzzer 158 from the inter-worker board conveyance device 280 to the circuit board 28. Take out.

  If the work is not prohibited and there is no printing defect as a result of the inspection, S74 is executed, the circuit board 28 is carried out to the mounting module row 14, and the electronic circuit component is mounted. Among the 18 mounting modules 180 constituting the mounting module row 14, the mounting control routine shown in FIG. 13 is executed in the mounting modules 180a and 180b excluding the most downstream mounting module 180b, and the most downstream mounting module 180b. The work control routine shown in FIG. 10 is executed as a mounting control routine. In any of the mounting modules 180, it is determined whether or not the mounting is prohibited before the mounting is performed. If not prohibited, the electronic circuit component is mounted on the circuit board 28 and is prohibited. In this case, the circuit board 28 is carried out without being mounted. Since the 18 mounting modules 180 are arranged with almost no gap, the circuit board 28 is not taken out in the middle of the mounting module row 14 but is transported from the most downstream mounting module 180b to the inter-worker board transfer device 282. It is taken out.

  In all the mounting modules 180a and the upstream mounting modules 180b, the mounting control routine shown in FIG. 13 is executed, and by executing S81, the circuit board 28 is carried in and stopped at a predetermined mounting position to hold the board. Held by device 194. The loading and unloading of the circuit board 28 in the mounting module 180 is a state in which the mounting of the electronic circuit components to the circuit board 28 is completed in the mounting module 180 and the circuit board 28 can be delivered to and from the adjacent mounting module 180. Done in Then, the fiducial mark imaging device 200 images the fiducial mark 54 and the two-dimensional code 56 on the circuit board 28, acquires the position error of the component mounting location on the circuit board 28, and reads the board identification code. This position error includes each position error in a direction parallel to the X-axis and Y-axis directions and a position error about an axis perpendicular to the circuit board 28.

  Next, S82 is executed, and a determination of prohibition of attachment is made. This determination is performed in the same manner as the work prohibition determination in the print inspection machine 12 according to the work prohibition determination routine shown in FIG. The cause of the situation where the sum of the elapsed time TA and the estimated required time TR exceeds the allowable time TP in the mounting module 180 is, for example, that the circuit board 28 is extracted by the operator in the inter-work machine substrate transfer devices 138 and 280. Returned to the inter-worker board transfer devices 138 and 280, the time between them is long, the occurrence of component breakage in one of the tape feeders 220 of the component supply device 196, and the equipment constituting the mounting module 180 A defect has occurred. If the remaining number of electronic circuit components decreases in the tape feeder 220, the operator is notified and the electronic circuit components are replenished. If the resumption of the mounting operation is delayed, the elapsed time TA becomes longer and the sum of the estimated required time TR may exceed the allowable time TP. Further, when the mounting operation is stopped due to a defect in the equipment constituting the mounting module 180, the elapsed time becomes long. For example, when the suction nozzle 250 fails and the electronic circuit component cannot be sucked, or when the tape feeder feeding device in the tape feeder 220 fails and the electronic circuit component cannot be supplied, the mounting operation is stopped. Sometimes

  However, in this electronic circuit component mounting line, the prohibition of work is performed before the start of work. Therefore, if the cause is removal of the circuit board 28, it is determined that all the mounting modules 180 have exceeded the time, and the work is not performed. However, since out-of-parts and defective equipment occur during the mounting operation, the mounting module 180 in which they occur is not determined to exceed the time, and the mounting is performed and the adjacent mounting on the downstream side is performed. The module 180 determines that the time has been exceeded and prohibits installation. After the electronic circuit parts are replenished or the mounting defect is resolved and the mounting operation is restarted, the mounting module 180 or mounting adjacent to the mounting module 180 that has caused the work prohibition downstream in the substrate transport direction. The work is prohibited in the inspection machine 16.

  Further, when the stop of the mounting in at least one of the plurality of mounting modules 180 causes the sum of the elapsed time TA and the estimated required time TR to exceed the allowable time TP, resulting in a work-prohibited board in which work is prohibited, From the mounting module 180, in the upstream working machine in the board conveyance direction, the circuit board 28 is put on standby for unloading in a state where the mounting is completed until the cause of stopping the mounting work is resolved. The circuit board 28 in the upstream work machine is affected by the extension of the elapsed time, but if the sum of the elapsed time TA and the estimated required time TR exceeds the allowable time TP, the operation is prohibited and the electronic circuit Parts are prevented from being wasted.

  If, for some reason, 50 minutes have already passed when the circuit board 28 reaches the seventh mounting module 180a from the upstream side as illustrated in FIG. 16, the estimated required time TR is 14.3 minutes. Therefore, the sum with the elapsed time TA exceeds the allowable time TP, and the work is prohibited. Therefore, the determination result in S83 of the mounting control routine is YES, S86 is executed, the buzzer 272 is informed to the worker, and the work prohibition flag is reset. Then, S85 is executed, and the circuit board 28 is carried out to the mounting module 180a on the downstream side. The circuit board 28 that is prohibited from being mounted is carried out after completion of the mounting operation in the mounting module 180 on the downstream side. Also in the downstream mounting module 180a, the mounting control routine is executed, and after the circuit board 28 is carried in and held by the board holding device 194, the reference mark 54 and the two-dimensional code 56 are imaged (S81), and mounting is prohibited. Although the determination is made (S82), since the sum of the elapsed time TA and the estimated required time TR has already exceeded the allowable time TP, the mounting is prohibited and the electronic circuit component is not mounted and is carried out. (S83, S86, S85). The circuit board 28 is also carried out after completion of the mounting work in the mounting module 180 on the downstream side. If there are a plurality of circuit boards 28 in which mounting work is prohibited continuously and there are a plurality of mounting modules 180 in which work is prohibited on the upstream side from the most downstream mounting module 180 b in the mounting module row 14, When the mounting module 180 determines that the work is prohibited, the circuit board 28 is unloaded.

  In addition, for example, the circuit board 28 reaches the 14th mounting module 180a without being prohibited from working, and at that time, as illustrated in FIG. 17, if 55 minutes have already elapsed, the elapsed time The sum of TA and estimated required time TR exceeds the allowable time TP, and work is prohibited. Then, the electronic circuit component is carried out without being mounted.

  Thus, the circuit board 28 in which the mounting of the electronic circuit component is prohibited is sequentially sent to the mounting module 180 on the downstream side without reaching the electronic circuit component, and reaches the mounting module 180b on the most downstream side. Here, the work control routine shown in FIG. 10 is executed as a mounting control routine, the work is prohibited, and the circuit board 28 is carried out to the inter-worker board transfer device 282 without mounting the electronic circuit components. This unloading is performed in a state where the inter-worker board transfer device 282 can load the circuit board 28. For the inter-worker board transfer device 282, the transfer control routine shown in FIG. 14 is executed by the host computer 332, and the circuit board 28 is loaded from the mounting module 180b by the execution of S91, but the work of the circuit board 28 is prohibited. Therefore, the determination result in S92 is YES, S94 is executed, the conveyance of the circuit board 28 is stopped, and the reset of the work prohibition flag is instructed to the mounting control computer 270 of the mounting module 180b on the most downstream side. The routine execution ends. Since the transfer control routine shown in FIG. 14 is executed for the inter-worker board transfer device 282 and the work prohibition flag is used for the determination in S92, the work control routine shown in FIG. Although it is executed as a routine and is notified even if the work is prohibited, the work prohibition flag is not reset, but is reset based on the instruction in S94. Since the unloading of the circuit board 28 in S93 is skipped, the circuit board 28 is not unloaded from the inter-worker board transfer device 282 and is taken out of the inter-worker board transfer device 282 by the worker who has come to sound by the buzzer 272. .

  On the other hand, if the sum of the elapsed time TA and the estimated required time TR does not exceed the allowable time TP and mounting is not prohibited, the mounting control routine S84 is executed in the mounting module 180a and the upstream mounting module 180b. In the downstream mounting module 180b, the work control routine S4 is executed, and the electronic circuit component is mounted on the circuit board 28. After the mounting head 230 is moved and electronic circuit components are received from the tape feeder 220, the mounting head 230 is moved to the substrate holding device 194 and mounted on the circuit substrate 28. An image is captured, and the holding position error of the electronic circuit component by the suction nozzle 250 is calculated. This holding position error includes each position error and rotational position error in the X-axis and Y-axis directions, and is corrected together with the position error of the component mounting location acquired based on the imaging of the reference mark 54, so that the electronic circuit component is corrected. Mounted on the circuit board 28.

  If the circuit board 28 is mounted with the electronic circuit component in the most downstream mounting module 180b without the sum of the elapsed time TA and the estimated required time TR exceeding the allowable time TP, the circuit board 28 is transferred to the inter-worker board transfer device 282. It is carried out. In this case, the determination result in S92 of the transfer control routine executed for the inter-worker board transfer device 282 is NO, S93 is executed, and the circuit board 28 is carried out to the mounting inspection machine 16. In the mounting inspection machine 16, the work control routine shown in FIG. 10 is executed as a mounting inspection routine, and after execution of S1, the mounting inspection head is moved to capture the reference mark 54 and the two-dimensional code 56 after loading the substrate. The position error of the circuit board 28 is acquired, and the board identification code is read.

  Then, S2 is executed, and the work prohibition determination is performed before the start of the mounting inspection. If the sum of the elapsed time TA and the estimated required time TR does not exceed the allowable time TP, S4 is executed and the mounting inspection is performed. Done. The mounting inspection head is moved, and all component mounting locations on the circuit board 28 are imaged, and the mounted electronic circuit components are imaged. The movement position of the mounting inspection head is corrected based on the position error of the circuit board 28. Then, the imaging data is processed to detect whether or not the electronic circuit component is mounted at the component mounting location and whether or not the electrode is detached from the land 52, and the mounting state is inspected, and is carried out to the interworker board transfer device 312. The As a result of the inspection, if there is an abnormality in the mounting state, a work failure flag (mounting failure flag) is set and a buzzer 294 is sounded, and the occurrence of the abnormality is notified to the operator and carried out.

  In the host computer 332, the transfer control routine shown in FIG. 12 is also executed for the inter-worker board transfer device 312. If the work is prohibited in the mounting inspection machine 16, or if the mounting is defective as a result of the inspection, The conveyance of the circuit board 28 is stopped (S75, S76), and is not sent to the reflow furnace 18, but is taken out by the operator. However, in the case of poor mounting, if there is no abnormality in the mounting state as seen by the operator, the circuit board 28 is returned to the inter-worker board transfer device 312 and sent to the reflow furnace 18. If the operation is not prohibited and there is no mounting failure, the circuit board 28 is carried out to the reflow furnace 18 (S74), the solder is melted by heating, and the electrodes are soldered to the lands 52.

  As is clear from the above description, in this electronic circuit component mounting line, the portion of the image processing computer 160, 274, 296 that performs image processing on the captured data of the two-dimensional code 56 to acquire the board identification code is prohibited. The circuit board that has arrived at each of the plurality of locations where the determination is made is specified, and an arrival board specifying unit that is an intermediate board specifying unit that specifies the circuit board at each location is configured. Further, the print time memory of the host computer 332 is the print time An arrival time acquisition unit which constitutes a storage unit and stores the transfer stop time of the circuit board 28 of each control computer 156, 270, 292 in the arrival time memory and a portion which executes S13 are the current time acquisition unit together with the arrival time memory And an elapsed time acquisition unit together with the part for executing S14, and each control computer 1 The portion that stores the estimated required time read from the estimated required time memory of the host computer 332 of 6,270,292 constitutes the estimated required time storage unit, and executes S15 of each control computer 156,270,292. Are configured as an estimated required time acquisition unit, which constitutes an estimated required time acquisition unit, and the arrival board specifying unit, the elapsed time acquisition unit, and the estimated required time acquisition unit are S17 of each control computer 156, 270, 292, The work prohibition unit is configured together with the part that executes S18. Further, the portion for storing the allowable time read from the allowable time memory of the host computer 332 of each control computer 156, 270, 292 constitutes an allowable time storage unit, and S16 of each control computer 156, 270, 292 is stored. The portion that executes the above constitutes the allowable time reading unit. Further, the control computer 156, 292, the portion of the mounting control computer 270 for the downstream mounting module 180b that executes S3 and S5, the mounting control computer 270 for the mounting module 180a, and the mounting control computer 270 for the upstream mounting module 180b. , S85 constitutes a work-prohibited substrate sweeping section, and the parts executing S72, S76, S92, and S94 for the inter-work machine substrate transport devices 280, 282, and 312 of the host computer 332 constitute a transport prohibition section. ing. The printing time may also be supplied from the host computer 332 to each control computer 156, 270, 292 in association with the board identification code and stored in the RAM. Further, it may be considered that the estimated required time memory of the host computer 332 constitutes an estimated required time storage unit, and the estimated required time read from the estimated required time memory of the control computers 156, 270, 292 is estimated together with a part for storing the estimated required time. It may be considered that the required time storage unit is configured. It may be considered that the allowable time memory of the host computer 332 constitutes an allowable time storage unit. When the allowable time storage unit is configured together with a portion for storing the allowable time read from the allowable time memory of the control computers 156, 270, 292. You may think. The portion for storing the solder printing end time of the host computer 332 in the printing time memory and the portion for executing S12 of each control computer 156, 270, 292 constitute the printing time acquisition unit, and the elapsed time acquisition unit together with the printing time memory and the like. It can also be thought of as comprising.

  Note that the circuit board for which work is prohibited in the mounting module 180 may be transported in the direction opposite to that at the time of component mounting, that is, to the print inspection machine 14 side and swept out of the mounting module row 14. For example, when work is prohibited in the mounting module 180 in the middle of the mounting module row 14, depending on the cause, the elapsed time and the estimated required time also in the mounting module 180 upstream in the substrate transport direction from the mounting module 180. When it is estimated that the sum exceeds the allowable time, the circuit board is sent to the upstream side so that the circuit board is also swept out of the mounting module row 14 for the mounting module 180 upstream of the mounting module 180 whose work prohibition has been found. To do.

  Further, the mounting module 180 is movable in the front-rear direction on the base module 184, and when mounting of electronic circuit components on the circuit board is prohibited in any of the plurality of mounting modules 180, the circuit board is swept out. Instead, an operator called by notification by the notification device may pull out the mounting module 180 forward and take out the circuit board. After taking out the circuit board, the operator returns the mounting module 180 onto the base module 184, receives the circuit board from the upstream mounting module 180 in the board transport direction without delay, and performs the mounting work of the electronic circuit components. Like that. The mounting control routine executed in this case is a routine that ends without executing S5 and S85 after executing S6 and S86 in the mounting control routine shown in FIG. 10 or FIG. The step of carrying out the circuit board 28 is skipped, and the carrying of the circuit board 28 by the mounting module board carrying device 192 is prohibited, and the configuration constitutes a carrying prohibition unit.

You may acquire the elapsed time from solder printing by time-keeping. The embodiment will be described with reference to FIG.
The electronic circuit component mounting line is configured in the same manner as the electronic circuit component mounting line except that it relates to the elapsed time measurement. In the solder printer 10, the two-dimensional code 56 is imaged and the board identification code is read prior to the start of solder printing on the circuit board 28. Then, after the printing is completed, the board identification code is sent from the print control computer 134 to the host computer 332. The RAM of the host computer 332 is provided with a plurality of counters. As shown conceptually in FIG. 18, each time a board identification code is transmitted from the print control computer 134, the counters are associated one by one and timed. To start. The count value of the counter is incremented by 1 every set time, and the time from the transmission of the board identification code for each circuit board 28 specified by the transmitted board identification code, that is, the time from the end of the solder printing It is measured. In FIG. 18, the count-up progress is shown for each counter, instead of the count value, in order to explain the start of the counter timing for each transmission of the board identification code.

  In each of the print inspection machine 12 and the 18 mounting modules 180, the work prohibition determination routine shown in FIG. 19 is executed before each work is executed, and in the mounting inspection machine 16, the inspection shown in FIG. 20 is executed before the inspection is executed. A work prohibition determination routine is executed. S21 of the work prohibition determination routine shown in FIG. 19 is executed in the same manner as S11 of the work prohibition determination routine, and the board identification code is read. Next, S22 is executed, and the count value of the counter corresponding to the board identification code read in S21 is read from the host computer 332. This count value represents the elapsed time TA from the end of solder printing, and the elapsed time TA is acquired. S23 to S25 are executed in the same manner as S15 to S17 of the work prohibition determination routine, and it is determined whether or not the sum of the elapsed time TA and the estimated required time TR exceeds the allowable time TP. In this electronic circuit component mounting line, the estimated required time TR and the allowable time TP may be set by a count value in the same manner as the elapsed time TA, or the count value representing the elapsed time TA is converted into time and determined. May be performed.

  If the sum of the elapsed time TA and the estimated required time TR exceeds the allowable time TP, the determination result in S25 is YES, S26 is executed, the work prohibition flag is set, and the host computer 332 from the control computer An instruction to clear the board identification code and reset the counter is transmitted to Based on this, the host computer 332 clears the instructed board identification code, resets the count value of the counter corresponding to the instructed board identification code to 0, and newly prints the circuit board 28. Is used for measuring the elapsed time TA.

If the sum of the elapsed time TA and the estimated required time TR does not exceed the allowable time TP, S26 is not executed, the counter continues to measure the elapsed time TA, and work is prohibited in each work machine constituting the electronic circuit component mounting line. The elapsed time TA is acquired at the time of determination. In the 18 mounting modules 180, the work prohibition determination routine shown in FIG. 19 is executed. When the circuit board 28 reaches the mounting inspection machine 16, the mounting inspection control computer 292 executes a work prohibition determination routine shown in FIG. S31 to S36 of this routine are executed in the same manner as S21 to S26 of the routine shown in FIG. 19, but if the sum of the elapsed time TA and the estimated required time TR does not exceed the allowable time TP, the determination result of S35 is When NO, S37 is executed, and an instruction to clear the board identification code and reset the counter is transmitted to the host computer 332.
In this electronic circuit component mounting line, the part that reads the board identification codes of the imaging device 90, the image processing computer 136, and the print control computer 134 from the image processing computer 136 constitutes the initial board specifying part, and the counter of the host computer 332 is the time measuring part. The image processing apparatus 160 and the like in each work machine after the print inspection machine 12, the part that executes S 21 of the image processing computers 160, 274, 296, and the control computers 156 and 270 and S 31 of the mounting inspection control computer 292 are executed. The part constitutes the reaching board specifying part which is the intermediate board specifying part, and the part executing S22 of the control computers 156 and 270 and the part executing S32 of the mounting inspection control computer 292 constitute the elapsed time reading part, and these are passed. Configures the time acquisition unit

An information recording unit may be provided on the circuit board, and the elapsed time may be acquired by writing the solder printing time on the circuit board. The embodiment will be described with reference to FIG. 21 and FIG.
As shown in FIG. 21, the circuit board 350 on which the electronic circuit component is mounted in the electronic circuit component mounting line is provided with a tag chip 352 on the surface on which the electronic circuit component is mounted, and constitutes an information recording unit. Yes. The tag chip 352 is a kind of IC chip with an antenna for RFID (Radio Frequency Identification), is a chip-shaped, relatively small electronic tag, and is used for wireless communication with the memory 354 as shown in FIG. The communication circuit 356 and a logic circuit 358 that connects them are mainly configured. The tag chip 352 includes an antenna, and can transmit information recorded in the memory 354 to the reader / writer 360 by wireless communication, or record the received information in the memory 354. Various kinds of information can be recorded in the memory 354, and in the present embodiment, a substrate identification code is recorded.

  The reader / writer 360 includes the Y-axis slide 118, together with the imaging devices 90 and 200, the print inspection head 142, and the mounting inspection head in each of the solder printer 10, the printing inspection machine 12, the entire mounting module 180, and the mounting inspection machine 16. It is provided on the second X-axis slide 246 and is moved to an arbitrary position in the horizontal plane. The reader / writer 360 is an information receiving apparatus or information reading apparatus which is a kind of information acquisition apparatus, and is also an information recording apparatus or information writing apparatus, and is also a board identification code receiving apparatus which is a kind of board identification code acquisition apparatus. is there. The reader / writer 360 can receive and acquire information when the tag chip 352 is positioned within the communicable area of the reader / writer 360, or write the information to the tag chip 352.

  In the solder printer 10 of this electronic circuit component mounting line, the board identification code recorded on the tag chip 352 is not read, the solder printing on the circuit board 350 is finished, and the circuit board 350 is separated from the screen 26. After that, the reader / writer 360 is moved between the circuit board 350 and the screen 26, and the printing end time is written in the tag chip 352. The printing end time may be the time when printing is actually ended or the time when the time is written to the tag chip 352. When imaging the reference mark 54 prior to the start of solder printing, the time may be written to the tag chip 352 by the reader / writer 360 and used as the printing time.

In each work machine after the print inspection machine 12, a work prohibition determination routine shown in FIG. 23 is executed. By executing S41, the reader / writer 360 is moved to the tag chip 352, and the print end time recorded in the tag chip 352 is read by communication with the tag chip 352. Next, S42 is executed and the current time is acquired. The time when S42 is executed is read from a clock provided in the control computer. Then, S43 to S47 are executed in the same manner as S14 to S18 of the work prohibition determination routine.
In this electronic circuit component mounting line, the tag chip 352 constitutes an information recording unit, the reader / writer 360 constitutes a writing device and a reading device, the portion executing S42 constitutes a current time acquisition unit, and S43 The portion to be executed constitutes the elapsed time acquisition unit, and the estimated required time storage portion configured by the portion that stores the estimated required time of each control computer 156, 270, 292 and the estimated required time configured by the portion that executes S44. A work prohibition unit is configured together with an estimated required time acquisition unit including a reading unit and a part for executing S46, S47 of each control computer 156, 270, 292.
When the estimated required time and allowable time in the work prohibition determination are read from the memory of the host computer, or in the memory of the work control computer of each work machine, multiple types of estimated required time and allowable values corresponding to the type of circuit board are used. When the time is stored, the board identification code may also be read when reading the solder printing time, and the type of the circuit board may be acquired and used for reading the estimated required time and allowable time.

The electronic circuit component mounting system may be a system including an adhesive applicator that applies an adhesive to a circuit board and an adhesive curing device that cures the adhesive.
For example, in the electronic circuit component mounting line shown in FIG. 1, the adhesive application head 400 shown in FIG. 25 is held on the second X-axis slide 246 in place of the mounting head 230 in the uppermost mounting module 180 a of the mounting module row 14. Thus, the mounting module 180a is referred to as an adhesive application module 402. In this electronic circuit component mounting line, it can be considered that the component mounting machine also serves as an adhesive applicator. Further, as shown in FIG. 24, an adhesive curing device 404 is provided between the mounting inspection machine 16 and the reflow furnace 18. It is assumed that a two-dimensional code is provided on a circuit board on which an electronic circuit component is mounted in the electronic circuit component mounting line, and a board identification code is recorded.

  As shown in FIG. 26, the adhesive application head 400 includes a syringe 410. A piston 412 is fitted in the syringe 410 so as to be airtight and slidable. When compressed air is supplied into the syringe 410, the piston 412 is lowered, and the adhesive is discharged through the discharge pipe 414 by a predetermined amount. And applied to the circuit board. Although not shown, the adhesive application head 400 is a moving device that moves the syringe 410 in the axial direction thereof, and includes an elevating device that moves up and down to approach and separate from the circuit board. Although not shown, the adhesive curing device 404 includes a curing device substrate transport device, a heating device, and a control device. The adhesive substrate curing device 404 heats the circuit board 28 and cures the applied adhesive so that the electronic circuit component is transferred to the circuit board 28. To the reflow furnace 18.

  The print inspection and the work prohibition determination in the print inspection machine 12 are performed according to the flowcharts shown in FIGS. Then, the adhesive application in the adhesive application module 402 is performed in accordance with an application control routine configured in the same manner as the mounting control routine shown in FIG. 13, and the work prohibition determination is the same as the work prohibition determination routine shown in FIG. This is done according to a routine. In the adhesive application module 402, the printed circuit board 28 is held by the substrate holding device 194 after the printing inspection, and then the two-dimensional code 56 is imaged by the reference mark imaging device 200 to obtain the substrate identification code. Prior to the start of application, a work prohibition determination routine is executed. If the operation is not prohibited, the adhesive application head 400 is moved by the mounting head moving device 232 to apply the adhesive to the circuit board 28. After the application is completed, the application end time is associated with the substrate identification code, sent from the mounting control computer 270 functioning as an application control computer to the host computer 332, and applied in the application time memory provided in the RAM of the host computer 332. As memorized. If the coating operation is prohibited, the circuit board is unloaded without waiting for the mounting operation in the mounting module 180a on the downstream side to end without applying the adhesive.

  The work prohibition determination in each of the mounting modules 180 and the mounting inspection machines 16 on the downstream side of the adhesive application module 402 in the substrate transport direction is performed according to the flowchart shown in FIG. By executing the work prohibition determination routine S51, the board identification code is read. In S52, the solder printing time and the adhesive application time are read from the printing time memory and the application time memory of the host computer 332 using the board identification code. It is. Next, S53 is executed in the same manner as S13 to obtain the arrival time of the circuit board. In S54, the elapsed time TAs from the end of the solder printing and the elapsed time TAb from the end of the application of the adhesive are obtained. Then, the estimated required time TR is read by executing S55, and the allowable time TP is read by executing S56. Estimated required time TR is common to solder and adhesive, but allowable time TP is different for solder and adhesive, and is set separately for each type of circuit board and stored in the memory of host computer 332, Prior to the start of mounting of electronic circuit components and the start of mounting inspection, they are read into the mounting control computer 270 and the mounting inspection computer 292 in accordance with the type of circuit board.

  First, in S57, whether or not the sum of the elapsed time TAs and the estimated required time TR exceeds the allowable time TPs is determined for the solder. If it exceeds, the determination result in S57 is YES and S59 is executed. The work prohibition flag is set. If the sum does not exceed the allowable time, the determination result in S57 is NO and S58 is executed, and whether or not the sum of the elapsed time TAb and the estimated required time TR for the adhesive exceeds the allowable time TPb. If it exceeds, the determination result in S58 is YES and S59 is executed. For either one of the solder and the adhesive, the operation is prohibited if a situation occurs in which the sum of the elapsed time TA and the estimated required time TR exceeds the allowable time TP. In any case, the circuit board for which the operation is prohibited is swept out of the working machine without performing the operation. If the sum of the elapsed time TA and the estimated required time TR does not exceed the allowable time TP for the adhesive as well, the determination result in S58 is NO and the execution of the routine ends, and the mounting module 180 returns to the circuit board 28. The electronic circuit parts are mounted.

If the circuit board 28 reaches the mounting inspection machine 16 without prohibiting the work and the mounting inspection is not prohibited and the mounting inspection is performed, the circuit board 28 is provided between the mounting inspection machine 16 and the adhesive curing device 404. The inter-worker substrate transport device 312 is transported to the adhesive curing device 404, and after the adhesive is cured, the inter-worker substrate transport device 420 is transported to the reflow furnace 18 where the solder is melted.
Each of the plurality of mounting modules 180 and mounting inspection machine 16 constituting the electronic circuit component mounting line also has a work prohibition unit configured similarly to the case of soldering with respect to the adhesive.

In the electronic circuit component mounting system, at least a part of the plurality of work machines and devices constituting the system may be provided at a position away from the others.
For example, the electronic circuit component mounting system schematically shown in FIG. 28 includes a solder printer 450, a print inspection machine 452, a component mounting machine 454, 456, a mounting inspection machine 458, and a reflow furnace 460. For example, the component mounting machine 454 includes a mounting head that holds a plurality of suction nozzles, and is a mounting machine that mounts a relatively small electronic circuit component on a circuit board. The component mounting machine 456 is a mounting that holds one suction nozzle. The mounting machine includes a head and mounts a large electronic circuit component on a circuit board.

  The solder printer 450 and the print inspection machine 452 are provided adjacent to each other, but are provided separately from the component mounting machines 454, 456, the mounting inspection machine 458, and the reflow furnace 460, and the solder is printed and printed. The circuit board that has been inspected is accommodated in a substrate accommodating device 462 provided together with the printing inspection machine. The accommodated plural circuit boards are collectively conveyed to the component mounting machines 454 and 456, supplied one by one to the component mounting machines 454, and the electronic circuit components are mounted in the order of the component mounting machines 454 and 456.

  Therefore, the solder printer 450 can perform solder printing on the circuit board regardless of the work progress status on the component mounting machines 454 and 456 side, but is supplied to the component mounting machine 454 after the printing inspection is completed. There is a possibility that there will be time until the sum of the elapsed time and the estimated required time exceeds the allowable time. Therefore, the circuit board is associated with the board identification code and the printing time is stored in the host computer or stored in an information recording unit such as a tag chip provided on the circuit board. Then, in each of the component mounting machines 454 and 456 and the mounting inspection machine 458, the work prohibition determination is performed, and if the sum of the elapsed time and the estimated required time exceeds the allowable time, the work after the time is exceeded is prohibited. The

  When a substrate transfer apparatus is provided between adjacent work machines, the work prohibition determination may be performed in the inter-work machine board transfer apparatus. For example, if a board identification code is provided on a circuit board, a code reader is provided in the inter-worker board transfer device to read the board identification code. The code reader may be provided with a fixed position, and the circuit board may be stopped at a position where the board identification code can be read by the code reader, or a moving device for moving the code reader may be provided to read the code. You may make it read a board | substrate identification code by moving an apparatus. The inter-worker board transfer apparatus is controlled according to, for example, a transfer control routine shown in FIG. If the inter-worker board transfer device is controlled by a host computer that controls the entire electronic circuit component mounting system, the transfer control routine is executed by the host computer, and if a transfer control computer is provided, it is executed there. The

  By executing the transfer control routine S101, the circuit board is carried into the inter-worker board transfer apparatus, the board identification code is read, and the solder printing time is acquired based on the read board identification code. Next, S102 is executed to determine whether to prohibit conveyance. This determination is performed, for example, according to a routine similar to the work prohibition determination routine shown in FIG. 11. If the conveyance is not prohibited, the determination result in S103 is NO, S104 is executed, and the circuit board is connected between work machines. It is made to carry out from a board | substrate conveyance apparatus. On the other hand, if the conveyance is prohibited, the determination result in S103 is YES, S105 is executed, the conveyance prohibition flag set in the conveyance prohibition notification and the conveyance prohibition determination is reset, and the routine is executed. Ends. Since S104 is skipped and the circuit board is not carried out, the part that skips S104 when carrying out S103 of the computer and carrying is prohibited constitutes a carrying inhibition unit.

  In the inter-work machine substrate transfer apparatus, the determination of the prohibition of transfer is performed in the inter-work machine board transfer apparatus provided between the adjacent work machines, in which a plurality of work machines constituting the electronic circuit component mounting system are all provided apart from each other. As in the electronic circuit component mounting line, a work machine provided between work machines provided apart from each other in a mounting line having a mounting module row 14 in which a plurality of mounting modules 18 are arranged without gaps. It may be performed in the inter-substrate transfer apparatus.

  In addition, in the electronic circuit component mounting line having the mounting module row, if the work prohibition determination is performed in the interworker board transfer device, the work prohibition determination may be performed in each of the plurality of mounting modules. , May be omitted in at least some of the mounting modules.

  Furthermore, “until melting of the solder” from at least one place in the electronic circuit component mounting system to melting of the solder may be until the circuit board is carried into the reflow furnace and heating is started.

  Further, the substrate identification code may be recorded on a barcode, and the substrate identification code may be acquired by reading the barcode with a barcode reader.

  Further, in an electronic circuit component mounting line having a mounting module row, the solder printing on the circuit board and the application of the adhesive are slower than the mounting of the electronic circuit component by the mounting module row, and the circuit board is mounted on the mounting module row. If the supply is not in time, two solder printers and adhesive applicators may be provided in parallel or in series to increase the number of supplies. Accordingly, two printing inspection machines may be provided, and two installation inspection machines may be provided in parallel or in series according to the mounting cycle time of the electronic circuit components to the circuit board by the mounting module.

  DESCRIPTION OF SYMBOLS 10: Solder printer 12: Printing inspection machine 14: Mounting module row 16: Mounting inspection machine 18: Reflow furnace 20: Line board transfer device 28: Circuit board 32: Printing machine board transfer device 34: Board holding device 52: Land 54 : Reference mark 56: Two-dimensional code 90: Imaging device 134: Print control computer 136: Image processing computer 138: Interworker substrate transport device 140: Print inspection machine substrate transport device 142: Print inspection head 144: Print inspection head moving device 156: Print inspection control computer 158: Buzzer 160: Image processing computer 180a, 180b: Mounting module 192: Mounting module substrate transfer device 194: Substrate holding device 196: Component supply device 198: Mounting device 200 : Reference mark imaging device 230: Mounting head 250: Suction nozzle 270: Mounting control computer 272: Buzzer 274: Image processing computer 280, 282: Interworker substrate transfer device 292: Mounting inspection control computer 294: Buzzer 296: Image processing computer 312: Inter-worker substrate transfer device 332: Host computer 350: Circuit board 352: Tag chip 360: Reader / writer 400: Adhesive application head 402: Adhesive application module 404: Adhesive curing device 420: Interworker substrate transfer device 450: Solder printer 452: Printing inspection machine 454, 456: Component mounting machine 458: Mounting inspection machine 460: Reflow furnace

Claims (8)

The circuit board working machine includes a plurality of circuit board working machines, and the circuit board work, which is the work on the circuit board by the plurality of circuit board working machines, prints cream-like solder on the land of the circuit board, and the electronic circuit on the circuit board The component is mounted in a state where the printed solder is interposed between the land and the electrode of the electronic circuit component, the circuit board in that state is heated to melt the solder, and the electrode is soldered to the land In an electronic circuit component mounting system for manufacturing an electronic circuit by mounting an electronic circuit component on a circuit board,
In at least one place in the electronic circuit component mounting system, an elapsed time since the printing of the solder on the circuit board and an estimated required time required to melt the solder from the at least one place on the circuit board Is found to exceed the allowable time allowed as the elapsed time from printing to melting of the solder, the subsequent circuit board work by the circuit board working machine for the circuit board is An electronic circuit component mounting system comprising a prohibited work section. The work prohibition unit is
An intermediate board specifying unit for specifying a circuit board at the at least one location;
For the circuit board specified by the intermediate board specifying unit, an elapsed time acquisition unit that acquires the elapsed time; and
An estimated required time acquisition unit that acquires the estimated required time for the circuit board specified by the intermediate substrate specifying unit, and the estimated required time acquired by the estimated required time acquisition unit and the elapsed time acquiring unit. 2. The electronic circuit component mounting according to claim 1, wherein when the sum of the acquired elapsed time is found to exceed the allowable time, the circuit board operation for the circuit board thereafter is prohibited. system. The elapsed time acquisition unit,
A printing time storage unit for storing the printing time of the solder in association with a board identification code provided on the circuit board;
A current time acquisition unit that acquires a current time at the at least one location, and the elapsed time as a difference between a current time acquired by the current time acquisition unit and a print time stored in the print time storage unit. The electronic circuit component mounting system according to claim 2, which is obtained. The elapsed time acquisition unit,
An initial board specifying portion for specifying a circuit board on which the solder printing is performed;
For each circuit board specified by the initial board specifying unit, a time measuring unit that measures the elapsed time after solder printing,
An intermediate board specifying unit that specifies a circuit board at the at least one location, and reading the measurement time corresponding to the specified circuit board from the time measuring unit in accordance with the specification of the circuit board by the intermediate board specifying unit The electronic circuit component mounting system according to claim 2, wherein the elapsed time is acquired.   The electronic circuit component mounting system includes a solder printer for printing the solder and a reflow furnace for melting the solder, and an electronic circuit component is placed on the circuit board between the solder printer and the reflow furnace. Claims that include at least one component mounting machine to be mounted, and that at least one of the one or more component mounting machines is provided with the work prohibition unit, and that at least one component mounting machine is the one place. Item 5. The electronic circuit component mounting system according to any one of Items 1 to 4.   A plurality of the component mounting machines are included, at least two or more of the plurality of component mounting machines are provided with the work prohibition unit, and each of the two or more component mounting machines is defined as the one place. 5. The electronic circuit component mounting system according to 5.   The electronic circuit component mounting system includes a solder printer for printing the solder and a reflow furnace for melting the solder, and the electronic circuit component is mounted on the circuit board between the solder printer and the reflow furnace. At least one of a printing inspection machine that inspects the printing result by the solder printer, and a mounting inspection machine that inspects the mounting state of the electronic circuit component by the component mounting machine. 5. The operation prohibiting portion is provided in at least one of the at least one and at least one of the one or more component mounting machines, and at least one of the at least one and at least one of the at least one of the one or more component mounting machines is the one place. The electronic circuit component mounting system according to any one of the above.   The electronic circuit component mounting system includes, in addition to the plurality of circuit board working machines, one or more board handling devices that handle circuit boards between the plurality of circuit board working machines. 5. The electronic circuit according to claim 1, wherein the work prohibition unit is provided in at least one of a circuit board working machine and the one or more board handling apparatuses, and at least one of the work prohibition parts is the one place. Component mounting system.

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