JP2010250035A - Method for manufacturing display, the display, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a region required to mount a semiconductor element and a wiring board, in comparison with the case of securing a space for the escape of a surplus part of an adhesive film, when mounting the semiconductor element to the board using the adhesive film of outline dimensions which are larger than ideal dimensions. <P>SOLUTION: A display includes a drive board 3, having a display region E1 and a non-display region E2; the semiconductor element 5 mounted on the non-display region E2 of the drive board 3 using the adhesive film 7; and the wiring board 6 mounted on the non-display region E2 of the drive board 3, side by side with the semiconductor element 5. The display is manufactured by carrying out a first mounting process for mounting the wiring board 6 on the non-display region E2 of the drive board 3 via the adhesive film 8, and a second mounting process for mounting the semiconductor element 5 on the non-display region E2 of the drive board 3, side by side with the mounted wiring board 6, after sticking the adhesive film 7 to the non-display region E2 of the drive board 3. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a display device configured using a substrate, a manufacturing method thereof, and an electronic device.

  In general, a display panel of a liquid crystal display device has a structure in which liquid crystals are sandwiched between two substrates. Of the two substrates sandwiching the liquid crystal, one substrate has a larger outer dimension than the other substrate, so when two substrates are bonded together, a part of one substrate having a larger outer dimension is separated from the other substrate. It will be overhanging. As described above, a semiconductor element and a wiring board are mounted on an extended region of one substrate protruding from the other substrate (see, for example, Patent Document 1).

  FIG. 12 is a perspective view showing a configuration example of a conventional liquid crystal display device, and FIG. 13 is a cross-sectional side view of the same. The display panel 52 of the illustrated liquid crystal display device 51 is configured using two substrates 53 and 54 each having a rectangular shape. One substrate 53 is a drive substrate, and the other substrate 54 is a counter substrate.

  The drive substrate 53 and the counter substrate 54 are bonded to each other with a liquid crystal (not shown) facing each other. A semiconductor element 55 and a wiring board 56 are mounted on the drive board 53. The semiconductor element 55 is mounted using an adhesive film 57. The wiring board 56 is mounted using an adhesive film 58.

  FIG. 14 is a flowchart of a mounting process applied when manufacturing a liquid crystal display device. As illustrated, the mounting process F100 is divided into a first mounting process F101 and a second mounting process F102. The first mounting step F101 is a step of mounting the semiconductor element 55 on the drive substrate 53 of the display panel 52, and includes an attaching step F101a, a temporary pressure bonding step F101b, and a main pressure bonding step F101c. The second mounting process F102 is a process of mounting the wiring board 56 on the drive substrate 53 of the display panel 52, and includes an attaching process F102a and a main press bonding process F102b.

  First, the first mounting process F101 will be described. In the attaching step F101a, the adhesive film 57 is attached to the drive substrate 53 in accordance with the mounting position of the semiconductor element 55. In the pre-bonding step F101b, the semiconductor element 55 is positioned and temporarily attached to a predetermined position on the adhesive film 57 attached in the attaching step F101a. In the main pressure bonding process F101c, the semiconductor element 55 temporarily bonded in the temporary pressure bonding process F101b is pressurized and heated by a high-temperature pressure bonding head so as to press against the drive substrate 53.

  Next, the second mounting process F102 will be described. In the attaching step F102a, an adhesive film 58 is attached to the electrode forming surface of the FPC board 56 corresponding to the position of the electrode formed on the wiring board 56. In the main press-bonding step F102b, the wiring substrate 56 to which the adhesive film 58 has been attached in the attaching step F102a is positioned at a predetermined position on the drive substrate 53, and is then crimped to the drive substrate 53 by pressurization and heating.

  Among the mounting processes F100 described above, in the attaching process F101a of the first mounting process F101, an outer shape larger than the outer dimensions of the semiconductor element 55 is provided in order to reliably cover the mounting position of the semiconductor element 55 with the adhesive film 57. It is necessary to use an adhesive film 57 having dimensions. In that case, ideally, an extra dimension in consideration of a dimensional tolerance in manufacturing of the adhesive film 57 and an attaching tolerance depending on accuracy of equipment used for attaching the adhesive film 57 is used as an outer dimension of the semiconductor element 55. What is necessary is just to prescribe | regulate the external dimension of the adhesive film 57 by the dimension added on.

  However, the external dimensions of the adhesive film 57 cannot be freely changed in accordance with the external dimensions of the semiconductor element 55. The reason is that when the adhesive film 57 is manufactured, the outer dimensions (width, length) of the film are limited to a plurality of types for the convenience of the film manufacturing facility. Specifically, when the adhesive film material made into a sheet shape is cut with a cutter that is one of the film manufacturing facilities, the outer dimensions of the adhesive film obtained by cutting are determined by the type (size) of the cutter. A dedicated cutter is prepared for each type of outer dimensions of the adhesive film. Therefore, when manufacturing the adhesive film 57, there may be a case where there is no dedicated cutter that matches the ideal outer dimensions of the adhesive film 57.

  In such a case, for example, when a dedicated cutter is newly produced, in addition to the production cost for that purpose, a great deal of labor is required for condition setting and adjustment of the film production equipment. For this reason, conventionally, the semiconductor element 55 is mounted using an adhesive film 57 having a larger outer dimension than an ideal outer dimension (hereinafter also referred to as “ideal dimension”).

JP 2002-229055 A

  However, when the semiconductor element 55 is mounted using the adhesive film 57 larger than the ideal dimension, it is necessary to secure a space on the drive substrate 53 for releasing an excess film portion generated around the mounting position of the semiconductor element 55. There is. When the surplus portion of the adhesive film 57 is allowed to escape to the counter substrate 54 side, when the adhesive film 57 is attached to the drive substrate 53, a part of the adhesive film 57 interferes (contacts) with the counter substrate 54, whereby the adhesive film 57, an attachment failure, a displacement of the attachment position, and the like occur. For this reason, the surplus part of the adhesive film 57 cannot escape to the counter substrate 54 side.

  On the other hand, when the surplus portion of the adhesive film 57 is released to the wiring substrate 56 side, it is necessary to dispose the surplus portion of the adhesive film 57 so as not to reach the mounting position of the wiring substrate 56. For this reason, in the arrangement direction of the semiconductor element 55 and the wiring substrate 56, the mounting position of the semiconductor element 55 and the mounting position of the wiring substrate 56 are set in the plane of the drive substrate 53 in view of the excess dimension of the adhesive film 57. There is a need. Therefore, an area necessary for mounting the semiconductor element 55 and the wiring board 56 is widened.

  As an example, a case where the arrangement direction of the semiconductor element 55 and the wiring board 56 is defined as the width direction of each member and the semiconductor element 55 having a chip width of 1140 μm is mounted is considered. In this case, if the ideal width dimension of the adhesive film 57 is defined as “chip width + 200 μm”, the ideal width dimension of the adhesive film 57 is 1340 μm. On the other hand, it is assumed that the ideal adhesive film 57 having a width of 1340 μm does not exist due to film manufacturing, and that the film width closest to the ideal dimension is 1800 μm with a larger adhesive film. In such a case, the semiconductor element 55 is mounted on the drive substrate 53 using the adhesive film 57 having a width of 1800 μm.

  For this reason, in order to reliably cover the mounting position of the semiconductor element 55 with the adhesive film 57 without interfering with the bonding position of the counter substrate 54, each component is considered in consideration of the dimensional tolerance of each member and the capability of the equipment. For example, the distance between the members needs to be set as shown in FIG. In FIG. 15, one end of the adhesive film 57 is disposed at a position separated by 200 μm from the end of the counter substrate 54, and the adhesive film is disposed at a position separated by 200 μm from the end of the wiring board 56. The other end of 57 is disposed. The separation distance between the counter substrate 54 and the semiconductor element 55 is set to 550 μm including the surplus dimension of the adhesive film 57. Further, the separation distance between the semiconductor element 55 and the wiring substrate 56 is set to 510 μm including the surplus dimension of the adhesive film 57. For this reason, the separation distance between the counter substrate 54 and the wiring substrate 56 is 2200 μm.

  On the other hand, when the ideal adhesive film 57 having a width of 1340 μm is used, no excessive dimension is generated in the adhesive film 57. Therefore, as shown in FIG. 16, the separation distance between the counter substrate 54 and the semiconductor element 55 and the separation distance between the semiconductor element 55 and the wiring board 56 can both be set to 300 μm. Therefore, the separation distance between the counter substrate 54 and the wiring substrate 56 is 1740 μm, which is 460 μm shorter than that when an adhesive tape having a width of 1800 μm is used.

  The display device manufacturing method according to the present invention includes a substrate having a display region and a non-display region, a semiconductor element mounted on the non-display region of the substrate using an adhesive film, and the semiconductor in the non-display region of the substrate. When manufacturing a display device including a wiring substrate mounted side by side with an element, a first mounting step of mounting the wiring substrate in a non-display region of the substrate, and the adhesive film in the non-display region of the substrate Then, a second mounting step of mounting the semiconductor element in a non-display region of the substrate is performed along with the wiring board mounted in the first mounting step.

  In the method of manufacturing a display device according to the present invention, when a semiconductor element is mounted on a substrate using an adhesive film having an outer dimension larger than the ideal dimension, a space for allowing an excess portion of the adhesive film to escape is formed on the substrate. There is no need to secure it. For this reason, it becomes possible to determine the mounting position of the semiconductor element and the mounting position of the wiring board in the non-display area of the substrate regardless of the outer dimensions of the adhesive film used for mounting the semiconductor element.

  A display device according to the present invention includes a substrate having a display region and a non-display region, a semiconductor element mounted on the non-display region of the substrate using an adhesive film, and the semiconductor element in the non-display region of the substrate. The adhesive film is attached to a non-display area of the substrate corresponding to the mounting position of the semiconductor element, and a part of the adhesive film is not displayed on the substrate. It is the structure arrange | positioned in the state which overlaps with the said wiring board mounted in the area | region. An electronic apparatus according to the present invention includes the display device having the above structure.

  In a display device according to the present invention and an electronic apparatus having the same, when a semiconductor element is mounted on a substrate using an adhesive film having an outer dimension larger than the ideal dimension, a part of the adhesive film is placed on the wiring substrate. By overlapping, the surplus part of the adhesive film is released. Thereby, it is not necessary to secure a space on the substrate for allowing the excess portion of the adhesive film to escape. For this reason, it becomes possible to determine the mounting position of the semiconductor element and the mounting position of the wiring board in the non-display area of the substrate regardless of the outer dimensions of the adhesive film used for mounting the semiconductor element.

  According to the present invention, when a semiconductor element is mounted on a substrate using an adhesive film having an outer dimension larger than the ideal dimension, compared to a case where a space for releasing an excess portion of the adhesive film is secured on the substrate, The area required for mounting the semiconductor element and the wiring board can be reduced.

It is a perspective view which shows the structural example of the liquid crystal display device which concerns on embodiment of this invention. It is a sectional side view which shows the structural example of the liquid crystal display device which concerns on embodiment of this invention. It is a flowchart of the mounting process applied when manufacturing the liquid crystal display device which concerns on embodiment of this invention. It is a figure explaining the 1st mounting process concerning an embodiment of the invention. It is a figure explaining the 2nd mounting process concerning an embodiment of the invention. It is sectional drawing which shows the example of a dimension in the state which mounted the semiconductor element and the wiring board. It is a perspective view which shows the television used as the 1st application example. It is a figure which shows the digital camera used as the 2nd application example. It is a perspective view which shows the notebook personal computer used as the 3rd application example. It is a perspective view which shows the video camera used as the 4th application example. It is a figure which shows the portable terminal device used as the 5th application example. It is a perspective view which shows the structural example of the conventional liquid crystal display device. It is a sectional side view which shows the structural example of the conventional liquid crystal display device. It is a flowchart of the mounting process applied when manufacturing a liquid crystal display device conventionally. It is sectional drawing which shows the example of a dimension in the state which mounted the semiconductor element and the wiring board. It is sectional drawing which shows the example of a dimension in the state which mounted the semiconductor element and the wiring board.

  Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the technical scope of the present invention is not limited to the embodiments described below, and various modifications and improvements have been made within the scope of deriving specific effects obtained by the constituent requirements of the invention and combinations thereof. Including form.

Embodiments of the present invention will be described in the following order.
1. 1. Configuration of display device 2. Manufacturing method of display device Application examples

<1. Configuration of display device>
FIG. 1 is a perspective view showing a configuration example of a liquid crystal display device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional side view thereof. The display panel 2 of the illustrated liquid crystal display device 1 is configured using two substrates 3 and 4 each having a rectangular shape. One substrate 3 is a drive substrate having a relatively large external dimension, and the other substrate 4 is a counter substrate having a relatively small external dimension. The drive substrate 3 and the counter substrate 4 are each configured using a glass substrate. For example, a pixel circuit including a thin film transistor and a wiring pattern connected to the pixel circuit are formed on the drive substrate 3. On the counter substrate 4, for example, a color filter layer that is color-coded in red, green, and blue in pixel units is formed. The counter substrate 4 on which the color filter layer is formed is also called a color filter substrate.

  The drive substrate 3 and the counter substrate 4 are bonded to each other with a liquid crystal (not shown) facing each other. A gap is secured between the drive substrate 3 and the counter substrate 4 by interposing a spherical or columnar spacer (not shown). In contrast, the liquid crystal is sealed in a gap secured by a spacer between the driving substrate 3 and the counter substrate 4. In a state in which the driving substrate 3 and the counter substrate 4 are bonded together, a part of the driving substrate 3 protrudes from the counter substrate 4, and the semiconductor element 5 and the wiring substrate 6 are mounted on the protruding portion.

  The semiconductor element 5 constitutes, for example, a drive circuit (vertical drive circuit, horizontal drive circuit, etc.) that drives the display panel 2 of the liquid crystal display device 1. The semiconductor element 5 is composed of, for example, a rectangular IC chip, LSI chip or the like in plan view. The semiconductor element 5 is mounted on the drive substrate 3 in a bare chip state. The semiconductor element 5 is mounted on the drive substrate 3 in a so-called face-down state in which a surface on which an electrode (not shown) is formed faces downward.

  The wiring board 6 is constituted by, for example, a flexible printed wiring board. The flexible printed wiring board is a wiring board in which a wiring pattern is formed on a thin film-like insulating substrate to give flexibility (flexibility) to the entire substrate. As an insulating substrate for a flexible printed wiring board, for example, a resin film such as a polyester film or a polyimide film is used. Moreover, as a wiring pattern for flexible printed wiring boards, for example, a copper wiring pattern is used. Terminals (not shown) for electrical connection with the drive board 3 are formed at the end of the wiring board 6.

  Here, of the entire area when the drive substrate 3 is viewed in plan, the area where the drive substrate 3 and the counter substrate 4 are bonded together is defined as the display area E1, and the other areas are defined. Is defined as a non-display area E2. In such a case, the display area E1 of the driving substrate 3 corresponds to a bonding area with the counter substrate 4, and the non-display area E2 of the driving substrate 3 corresponds to an area of a portion protruding from the counter substrate 4. Become. For this reason, the area of the display region E1 of the drive substrate 3 is the same as the area of the counter substrate 4, and the area of the non-display region E2 of the drive substrate 3 is changed from the plane area of the drive substrate 3 to the area of the display region E1. Subtracted value. Further, in the plane of the driving substrate 3, the display area E1 and the non-display area E2 are in a positional relationship adjacent to each other. Incidentally, if an area where an image (video) is actually displayed on the display panel 2 is defined as an effective display area, this effective display area is located on the inner side of the frame-shaped sealing material that joins the drive substrate 3 and the counter substrate 4. It becomes an area. For this reason, the area of the effective display region is narrower than the area of the counter substrate 4.

  The semiconductor element 5 is mounted on the non-display area E <b> 2 of the drive substrate 3 using the adhesive film 7. The semiconductor element 5 is mounted on the same surface of the drive substrate 3 as the surface on which the counter substrate 4 is bonded. That is, when one surface of the drive substrate 3 is defined as the first main surface 3 a and the other surface is defined as the second main surface 3 b, the counter substrate 4 is formed on the first main surface 3 a of the drive substrate 3. The semiconductor element 5 is mounted along with the counter substrate 4 on the same surface. The mounting position of the semiconductor element 5 is set between the bonding position of the counter substrate 4 and the mounting position of the wiring substrate 6 in the first main surface 3 a of the drive substrate 3. The mounting position of the semiconductor element 5 is determined in advance in order to electrically and mechanically connect the drive substrate 3 and the wiring substrate 6 in the non-display area E2 on the first main surface 3a of the drive substrate 3. Says the position. The mounting position of the semiconductor element 5 is defined by a dimension corresponding to the outer dimension of the semiconductor element 5 because the entire semiconductor element 5 is mounted on the driving substrate 3 in an overlapping manner.

  The wiring board 6 is mounted on the non-display area E <b> 2 of the driving board 3 using the adhesive film 8. The wiring board 6 is mounted on the first main surface 3 a of the drive board 3. That is, the wiring substrate 6 is mounted on the first main surface 3 a of the drive substrate 3 along with the counter substrate 4 and the semiconductor element 5. The mounting position of the wiring board 6 is set closer to the end of the driving board 3 than the semiconductor element 5 in the arrangement direction of the semiconductor element 5 and the wiring board 6. The mounting position of the wiring board 6 is determined in advance in order to electrically and mechanically connect the driving board 3 and the wiring board 6 within the non-display area E2 on the first main surface 3a of the driving board 3. Says the position. The mounting position of the wiring board 6 is defined by a dimension smaller than the outer dimension of the wiring board 6 because a part (end part) of the wiring board 6 is mounted on the driving board 3 in an overlapping manner. Become.

  The adhesive film 7 is attached to the non-display area E <b> 2 of the drive substrate 3 corresponding to the mounting position of the semiconductor element 5. The outer dimension of the adhesive film 7 is set larger than the outer dimension of the semiconductor element 5. In the non-display area E <b> 2 of the drive substrate 3, the adhesive film 7 is attached to the first main surface 3 a of the drive substrate 3 so as to cover the mounting position of the semiconductor element 5. The semiconductor element 5 is mounted on the first main surface 3 a of the drive substrate 3 via the adhesive film 7. Further, the semiconductor element 5 is disposed so as to be located on the inner side (film center side) than the outer edge portion of the adhesive film 7. For this reason, a part of the adhesive film 7 protrudes outside the semiconductor element 5 over the entire circumference of the semiconductor element 5.

  A part 7 a of the adhesive film 7 that protrudes to the mounting position side of the wiring board 6 is disposed so as to overlap the wiring board 6 mounted in the non-display area E <b> 2 of the driving board 3. More specifically, the adhesive film 7 is attached to the first main surface 3a of the driving substrate 3 at and around the mounting position of the semiconductor element 5, but the adhesive film 7 protruding to the mounting position side of the wiring substrate 6 is used. The part 7 a is not attached to the first main surface 3 a of the drive substrate 3. Specifically, a part 7 a of the adhesive film 7 is bent obliquely in a state where it is lifted (separated) from the first main surface 3 a of the drive substrate 3, and the bent portion runs on the wiring substrate 6. It overlaps with. And the adhesive film 7 is affixed on the 1st main surface 3a of the drive substrate 3 except the part 7a.

  The adhesive film 8 is attached to the non-display area E <b> 2 of the drive substrate 3 corresponding to the mounting position of the wiring substrate 6. A plurality of electrodes are formed on the first main surface 3 a of the drive substrate 3 in accordance with the mounting position of the wiring substrate 6. The adhesive film 8 is affixed to the first main surface 3a of the drive substrate 3 in accordance with the mounting position of the wiring substrate 6 including those electrode forming portions. The wiring substrate 6 is mounted on the first main surface 3 a of the drive substrate 3 via the adhesive film 8.

  As the adhesive films 7 and 8, an anisotropic conductive film can be used. An anisotropic conductive film is obtained by dispersing conductive particles in an insulating resin. For this reason, an anisotropic conductive film has electroconductivity in the thickness direction, and has insulation in the surface direction orthogonal to it.

  The adhesive film 7 is not limited to an anisotropic conductive film, and a non-conductive film can also be used. The non-conductive film is formed of an insulating resin that does not include conductive particles.

<2. Manufacturing method of display device>
Next, a manufacturing method of the liquid crystal display device according to the embodiment of the present invention will be described.

[Mounting process]
FIG. 3 is a flowchart of a mounting process applied when manufacturing the liquid crystal display device according to the embodiment of the present invention. As illustrated, the mounting process F10 is divided into a first mounting process F11 and a second mounting process F12. The second mounting process F12 is performed after the first mounting process F11.

[First mounting process]
First, the first mounting process F11 will be described. The first mounting process F <b> 11 is a process of mounting the wiring board 6 in the non-display area E <b> 2 of the driving substrate 3 and is performed before mounting the semiconductor element 5 on the driving substrate 3. As shown in FIG. 3, the first mounting process F11 includes an attaching process 11a and a main press bonding process 11b. The mounting method employed in the first mounting process F11 is also referred to as a FOG (film on glass) mounting method because the film-like wiring substrate 6 is mounted on the glass substrate when the driving substrate 3 is a glass substrate. .

[Paste process]
In the attaching step F11a, as shown in FIG. 4A, the adhesive film 8 is attached to the end portion (terminal forming portion) of the wiring board 6 corresponding to the position of the terminal formed on the wiring board 6. . At this time, the end of the adhesive film 8 and the end of the wiring substrate 6 are aligned. As a result, the terminals formed on the wiring board 6 are covered with the adhesive film 8.

[Main crimping process]
In the main press-bonding step F11b, as shown in FIG. 4B, after the wiring substrate 6 to which the adhesive film 8 has been attached in the attaching step F11a is positioned at a predetermined position of the driving substrate 3, by pressurization and heating. The drive substrate 3 is pressure bonded (main pressure bonded). As a result, the wiring board 6 is electrically and mechanically connected to the driving board 3.

[Second mounting process]
Next, the second mounting process F12 will be described. The second mounting step F <b> 12 is a step of mounting the semiconductor element 5 in the non-display area E <b> 2 of the driving substrate 3 and is performed after mounting the wiring substrate 6 on the driving substrate 3. As shown in FIG. 3, the second mounting process F12 includes a bonding process F12a, a temporary pressure bonding process F12b, and a main pressure bonding process F12c. The mounting method employed in the second mounting step F12 is also called a COG (chip on glass) mounting method because the chip-like semiconductor element 5 is mounted on the glass substrate when the driving substrate 3 is a glass substrate. .

[Paste process]
In the attaching step F12a, the adhesive film 7 is attached to the non-display area E2 of the drive substrate 3 corresponding to the mounting position of the semiconductor element 5, as shown in FIG. The mounting position of the semiconductor element 5 is determined in accordance with the position of the electrode formed on the drive substrate 3 in order to be electrically connected to the semiconductor element 5. When the adhesive film 7 is attached, in order to reliably cover the mounting position of the semiconductor element 5 with the adhesive film 7, the adhesive film 7 is bonded to the first main surface 3a of the drive substrate 3 with a larger area than at least the mounting position of the semiconductor element 5. A film 7 is pasted.

  As a specific pasting method, for example, the following method is used. When the adhesive film 7 made of an anisotropic conductive film with a separator is used, the adhesive film 7 with the separator is disposed above the drive substrate 3 of the display panel 2 and is aligned with the mounting position of the semiconductor element 5 there. Then, the adhesive film 7 is positioned. Next, the head (not shown) is lowered from above the adhesive film 7 and the adhesive film 7 is lowered together with the head, so that the adhesive film 7 is attached to the drive substrate 3. The size of the head is such that it does not interfere with the bonding position of the counter substrate 4 or the mounting position of the wiring substrate 6. Next, the separator is peeled off from the adhesive film 7.

  At that time, when a part 7a of the adhesive film 7 protrudes so large as to interfere with the mounting position of the wiring board 6 among the surplus parts of the adhesive film 7 protruding from the mounting position of the semiconductor element 5, a part of the adhesive film 7 7a is superposed so as to ride on the wiring board 6. Thereby, a part 7a of the adhesive film 7 is in a state of being overlaid on the wiring substrate 6 mounted on the driving substrate 3 in the first mounting step F11. In this case, the combined thickness dimension of the wiring substrate 6 and the adhesive film 8 is sufficiently smaller than the thickness dimension of the counter substrate 4. For this reason, even if the adhesive film 7 is pasted on the drive substrate 3 in a state where the part 7a of the adhesive film 7 is overlapped on the wiring board 6, there is a problem of poor pasting of the adhesive film 7 or displacement of the pasting position. There is no fear. Further, when the part 7 a of the adhesive film 7 does not protrude so much as to interfere with the mounting position of the wiring board 6, the part 7 a of the adhesive film 7 is bonded to the driving board 3 without overlapping the wiring board 6. . In that case, the entire adhesive film 7 is affixed to the drive substrate 3.

[Temporary crimping process]
In the temporary press-bonding step F12b, as shown in FIG. 5B, the semiconductor element 5 is positioned and temporarily attached to a predetermined position on the adhesive film 7 attached in the attaching step F12a. Specifically, for example, the semiconductor element 5 is held by a head (not shown), and the semiconductor element 5 is positioned above the drive substrate 3 in that state, and then the semiconductor element 5 is pressed against the adhesive film 7 by lowering the head. Thereby, the positions of the electrodes formed on the drive substrate 3 and the electrodes formed on the semiconductor element 5 corresponding thereto are aligned. In addition, the semiconductor element 5 is mounted in the non-display area E2 of the drive substrate 3 along with the wiring substrate 6 mounted previously.

[Main crimping process]
In the main pressure bonding process F12c, the semiconductor element 5 temporarily bonded in the temporary pressure bonding process F12b is pressurized and heated by a high-temperature pressure bonding head so as to press against the drive substrate 3. As a result, the semiconductor element 5 is firmly bonded to the drive substrate 3 by the adhesive action of the adhesive film 7. The head used in the temporary press-bonding step F12b and the head (crimp head) used in the main press-bonding step F12c may be a common head or separate heads.

  Among the mounting processes F10 described above, in the first mounting process F11, after the adhesive film 8 is attached to the non-display area E2 of the drive substrate 3, the non-display area of the drive substrate 3 is interposed via the adhesive film 8. The wiring board 6 is mounted on E2. In the second mounting step F12 performed after the first mounting step F11, the adhesive film 7 is attached to the non-display area E2 of the drive substrate 3, and then the drive substrate 3 is interposed via the adhesive film 7. The semiconductor element 5 is mounted in the non-display area E2. In the second mounting step F12, the semiconductor element 5 is mounted in the non-display area E2 of the drive substrate 3 along with the wiring substrate 6 mounted in the first mounting step F11. In the second mounting step F12, the adhesive film 7 is applied to the non-display area E2 of the drive substrate 3 in a state where a part 7a of the adhesive film 7 is overlapped on the wiring substrate 6 mounted in the first mounting step F11. Paste.

  If such a manufacturing method is adopted, it is not necessary to secure a space for escaping the excess portion of the adhesive film 7 between the two (5, 6) in the direction in which the semiconductor element 5 and the wiring substrate 6 are arranged. Accordingly, the separation distance between the driving substrate 4 and the semiconductor element 5 and the separation distance between the semiconductor element 5 and the wiring substrate 6 should be set to the same dimensions as when the adhesive film 7 having an ideal outer dimension is used. Can do.

  For example, when the ideal width dimension of the adhesive film 7 is defined by “chip width + 200 μm”, when the semiconductor element 5 having a chip width of 1140 μm is mounted, the ideal width dimension of the adhesive film 7 is 1340 μm. In this case, it is assumed that the ideal adhesive film 7 having a width of 1340 μm does not exist, and the film width closest to the ideal dimension with an adhesive film larger than that is 1800 μm. In such a case, the semiconductor element 5 is mounted on the drive substrate 3 using the adhesive film 7 having a width of 1800 μm.

  For this reason, in order to reliably cover the mounting position of the semiconductor element 5 with the adhesive film 7 without interfering with the bonding position of the counter substrate 4, in consideration of the dimensional tolerance of each member, the capability of equipment, etc. For example, the distance between the members needs to be set as shown in FIG. In FIG. 6, one end portion of the adhesive film 7 is disposed at a position separated from the end portion of the counter substrate 4 by a distance of 200 μm. For this reason, the separation distance between the counter substrate 4 and the semiconductor element 5 is set to 300 μm. Further, the separation distance between the semiconductor element 5 and the wiring substrate 6 is set to 300 μm, which is the same as the separation distance between the counter substrate 4 and the semiconductor element 5. Further, a part (excess part) 7 a of the adhesive film 7 that protrudes from the mounting position of the semiconductor element 5 to the wiring board 6 side overlaps the wiring board 6.

  Thus, the following effects are acquired by letting the excess part of the adhesive film 7 escape to the wiring board 6 side in the state where the part 7a of the adhesive film 7 is overlapped on the wiring board 6. That is, even when the 1800 μm wide adhesive film 7 larger than the ideal 1340 μm width is used, the separation distance between the members is set as in the case of using the ideal 1340 μm wide adhesive film (see FIG. 16). Can be set. Specifically, the separation distance between the counter substrate 4 and the semiconductor element 5 and the separation distance between the semiconductor element 5 and the wiring board 6 can be set to 300 μm, respectively. For this reason, the distance between the counter substrate 4 and the wiring substrate 6 is the same as the case where the ideal 1340 μm wide adhesive tape is used, although the 1800 μm wide adhesive tape larger than the ideal dimension is used. Similarly, it is 1740 μm. Therefore, as compared with the mounting form shown in FIG. 15, the separation distance between the counter substrate 4 and the wiring substrate 6 can be shortened by 460 μm.

  As a result, a narrow frame of the liquid crystal display device can be realized. In addition, the number of display panels that can be created from the panel substrate material per unit area can be increased. For this reason, the cost of the liquid crystal display device can be reduced. In addition, since a part of the adhesive film 7 is overlapped on the wiring substrate 6 to allow positional interference between the two, the semiconductor element 5 and the wiring substrate can be used without depending on the external dimensions of the adhesive film 7. 6 mounting positions can be determined. Furthermore, in determining the mounting position of the semiconductor element 5 and the wiring board 6, it is not necessary to consider the tolerance of the dimension (film width) of the adhesive film 7.

  The display device according to the present invention is applicable not only to a liquid crystal display device but also to other flat display devices such as an organic EL (Electro Luminescence) display device. Further, the present invention can be applied not only to one having a non-display region on only one side of the drive substrate 3 but also to one having a non-display region on two or more sides of the drive substrate 3. Further, the number of semiconductor elements 5 mounted in the non-display area of the drive substrate 3 is not limited to one, and may be plural. Similarly, the number of FPC boards 6 mounted on the non-display area of the drive board 3 is not limited to one and may be plural.

<3. Application example>
The display device according to the present invention can be applied to various electronic devices. For example, the present invention can be applied to display devices of electronic devices in all fields that display video signals input to electronic devices or video signals generated in electronic devices as images or videos. Specifically, for example, the present invention can be applied to a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, a video camera, and the like. An example of an electronic device to which the present invention is applied will be described below.

  FIG. 7 is a perspective view showing a television as a first application example. The television according to this application example includes a video display screen unit 101 including a front panel 102, a filter glass 103, and the like, and the display device of the present invention can be applied to the video display screen unit 101.

  8A and 8B are diagrams showing a digital camera as a second application example, where FIG. 8A is a perspective view seen from the front side, and FIG. 8B is a perspective view seen from the back side. The digital camera according to this application example includes a light emitting unit 111 for flash, a display unit 112, a menu switch 113, a shutter button 114, and the like, and the display device of the present invention can be applied to the display unit 112.

  FIG. 9 is a perspective view showing a notebook personal computer as a third application example. The notebook personal computer according to this application example includes a main body 121 including a keyboard 122 operated when inputting characters and the like, a display unit 123 that displays an image, and the like, and the display device of the present invention is applied to the display unit 123. Is possible.

  FIG. 10 is a perspective view showing a video camera as a fourth application example. The video camera according to this application example includes a main body 131, a lens 132 for photographing an object on a side facing forward, a start / stop switch 133 at the time of photographing, a display unit 134, and the like. A display device can be applied.

  FIG. 11 is a diagram showing a mobile terminal device, for example, a mobile phone, as a fifth application example. (A) in a figure is a front view in the state which opened the mobile telephone, (B) is the side view. Also, (C) in the figure is a front view with the mobile phone closed, (D) is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view. is there. A cellular phone according to this application example includes an upper casing 141, a lower casing 142, a connecting portion (here, a hinge portion) 143, a display 144, a sub-display 145, a picture light 146, a camera 147, and the like. The display device of the present invention can be applied to the display 144 and the sub display 145.

  3 ... Drive substrate, 4 ... Counter substrate, 5 ... Semiconductor element, 6 ... Wiring substrate, 7 ... Adhesive film

Claims (5)

A substrate having a display area and a non-display area;
A semiconductor element mounted using an adhesive film in a non-display area of the substrate;
When manufacturing a display device comprising a wiring board mounted in parallel with the semiconductor element in a non-display area of the substrate,
A first mounting step of mounting the wiring substrate on a non-display area of the substrate;
A second mounting step of mounting the semiconductor element in the non-display region of the substrate side by side with the wiring substrate mounted in the first mounting step after the adhesive film is attached to the non-display region of the substrate; A method for manufacturing a display device. 2. In the second mounting step, the adhesive film is attached to a non-display area of the substrate in a state where a part of the adhesive film is overlaid on the wiring substrate mounted in the first mounting step. The manufacturing method of the display apparatus of description. A substrate having a display area and a non-display area;
A semiconductor element mounted using an adhesive film in a non-display area of the substrate;
A wiring board mounted side by side with the semiconductor element in a non-display area of the board,
The adhesive film is attached to the non-display area of the substrate corresponding to the mounting position of the semiconductor element, and a part of the adhesive film is placed on the wiring board mounted on the non-display area of the substrate. A display device that is placed in a state of overlapping. The display device according to claim 3, wherein the adhesive film is an anisotropic conductive film or a non-conductive film. A substrate having a display area and a non-display area;
A semiconductor element mounted using an adhesive film in a non-display area of the substrate;
A wiring board mounted side by side with the semiconductor element in a non-display area of the board,
The adhesive film is attached to the non-display area of the substrate corresponding to the mounting position of the semiconductor element, and a part of the adhesive film is placed on the wiring board mounted on the non-display area of the substrate. An electronic device having a display device arranged so as to overlap with the display device.

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