JP2010092959A - Mounting substrate, display, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display which connects an electrode terminal on the display panel side and connection wiring on the circuit substrate side, with low resistance in a configuration where the circuit substrate is face-down mounted for the display panel. <P>SOLUTION: An electrode terminal 9 is led out to the mounting region 3b on the periphery of a display panel 3, and a circuit substrate 5 on which connection wiring 15 is extended is mounted in a display 1A. Between the display panel 3 and the circuit substrate 5, an anisotropic conductive film 7 which connects the electrode terminal 9 and the connection wiring 15, and pastes up the display panel 9 on the circuit substrate 5 is sandwiched. The mounting region 3b of the display panel 3 is covered with an organic protective film 13 having an opening 13A, which is shaped, along with a connection opening 11A which exposes the electrode terminal 9 provided on an inorganic insulating film 11 under the organic protective film 13, to continuously expose the region on the side closer to the edge of the display panel 3 than the connection opening 11A. The circuit substrate 5 is mounted on the bottom of the opening 13A in such a state that the circuit substrate 5 faces the connection wiring 15. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting substrate, a display device, and an electronic device, and more particularly, to a mounting substrate, a display device, and an electronic device having a configuration in which a device panel and a circuit substrate are connected via an anisotropic conductive film.

  In a flat display device such as a liquid crystal display device or an organic EL display device using an organic electroluminescence element, the display panel and the circuit board are connected via an adhesive anisotropic conductive film (ACF). In general, the mounting structure is electrically and mechanically connected.

  In this case, the electrode terminal is drawn out from the inner region in the peripheral portion of the display panel, and an opening in which only the connection portion of the electrode terminal is exposed is provided in the organic protective film covering the peripheral portion. On the other hand, a connection wiring is also provided on the peripheral edge of the circuit board, and is wired. And the peripheral part of a display panel and the peripheral part of a circuit board are opposingly arranged, and an anisotropic conductive film is clamped. Thereby, the peripheral part of a display panel and the peripheral part of a circuit board are joined by the adhesiveness of an anisotropic conductive film. In the display panel, the electrode terminal exposed in the opening provided in the organic protective film and the connection wiring on the circuit board side are electrically connected by the anisotropic conductive film.

  In the above configuration, since the adhesion between the organic protective film covering the peripheral portion on the display panel side and the anisotropic conductive film is weak, the anisotropic conductive film temporarily fixed on the display panel side in the mounting process is displaced. In some cases, the intended mounting state could not be obtained. In view of this, a configuration has been proposed in which an opening for exposing a portion other than the electrode terminal is provided in the organic protective film, and this portion is used as a close contact region of the anisotropic conductive film (see, for example, Patent Document 1 below).

JP 2006-41064 A

  However, in the mounting structure described above, the connection wiring provided on the circuit board side is wired from the inside of the opening provided in the organic protective film on the display panel side to the outside of the opening. However, the organic protective film is for protecting the electrodes on the display panel side and the like, and is formed with a certain thickness, so that the opening provided in the organic protective film also has a certain depth. Become. Therefore, in the vicinity of the side wall of the opening having such a depth, the gap between the electrode terminal on the display panel side exposed in the opening and the connection wiring provided on the circuit board side becomes wide, and the anisotropic conductive film is formed. It is difficult to maintain a low connection resistance between the electrode terminal and the connection wiring.

  Accordingly, the present invention provides a mounting substrate, a display device, and an electronic device that can connect the electrode terminal on the device panel side and the connection wiring on the circuit board side with a low resistance in a configuration in which the circuit board is mounted face down on the device panel. The purpose is to provide.

  In order to achieve such an object, the mounting board of the present invention has a circuit board with connection wiring extending in the peripheral portion mounted on the device panel in which the electrode terminals are drawn out in the mounting region in the peripheral portion. Is. An anisotropic conductive film is connected between the device panel and the circuit board to connect the electrode terminal and the connection wiring and to bond the device panel and the circuit board. In such a configuration, the mounting area of the device panel is covered with an organic protective film having an opening. The opening is provided in a state in which the region on the edge side of the device panel is continuously exposed with the connection portion with the external wiring in the electrode terminal. Then, at the bottom of such an opening, the circuit board is mounted in a state where the connection wiring is opposed from the connection portion described above toward the edge of the device panel.

  In the mounting substrate having the above-described configuration, the connection wiring on the circuit board side facing the edge of the device panel from the connection portion of the terminal wiring is the opening of the organic insulating film at a position away from the connection portion. It will be wired over the side wall. For this reason, it is prevented that the distance between the electrode terminal and the connection wiring is widened due to overcoming the opening side wall of the organic protective film at the edge of the connection portion in the electrode terminal. Therefore, it is possible to sufficiently connect the electrode terminal and the connection wiring through the anisotropic conductive film.

  The present invention is also a display device in which the device panel is a display panel in the mounting substrate having the above-described configuration. The present invention is also an electronic apparatus provided with such a display panel.

  As described above, according to the present invention, in the configuration in which the circuit board is face-down mounted on the device panel via the anisotropic conductive film, the electrode terminal on the device panel side and the connection wiring on the circuit board side are reduced. It is possible to obtain a mounting substrate, a display device, and an electronic device that can be connected by a resistor.

Hereinafter, embodiments of the present invention will be described in the following order.
1. 1st Embodiment (example which has an opening part which opens a connection part and its edge side continuously)
2. Second Embodiment (Example in which an opening for opening an outer peripheral portion of a connecting portion together with the connecting portion and its end edge side is provided)
3. Third Embodiment (Example having an opening that continuously opens adjacent connecting portions)
4). Fourth embodiment (an example in which the opening for opening the connecting portion is open in the edge direction)
5). Fifth embodiment (example in which an inorganic insulating film is not provided)

<< 1. First Embodiment >>
<Configuration of display device (mounting substrate)>
FIG. 1 is a perspective view showing the overall configuration of the mounting substrate, which is the display device of the first embodiment. As shown in this figure, a display device (mounting substrate) 1A includes a display panel 3 on which a display function is formed as a substantial functional unit, and a circuit board 5 for connecting the display panel 3 to an external device. I have. The display panel 3 and the circuit board 5 are electrically and mechanically connected via an anisotropic conductive film.

  FIG. 2 is a plan view for explaining the characteristic part of the first embodiment, and is an enlarged view of a Z part in FIG. 1. 3 is a cross-sectional view taken along line A-A ′ and a cross-sectional view taken along line B-B ′ in FIG. 2. Next, the detailed configuration of the display device (mounting substrate) 1A will be described with reference to FIGS.

  The display panel 3 may be provided with a display unit as a substantial functional unit, for example, and is configured as a display panel of an active matrix type or passive matrix type display device. Such a display panel 3 includes a display region 3a in which a plurality of pixels are arranged above a support substrate 3-1 configured using a glass substrate or other transparent material, and a plurality of display regions 3a. Mounting region 3b from which the electrode terminal 9 is drawn out.

  Among these, each pixel arranged in the display area 3a is provided with, for example, an organic EL element. If the display panel 3 constitutes an active matrix display device, each pixel is provided with a drive circuit for driving the organic EL element together with the organic EL element. A peripheral circuit that sends a scanning signal and a data signal to the driving circuit is disposed in the area surrounding the display area 3a.

  A counter substrate 3-2 is provided on the support substrate 3-1 so as to cover the display region 3a and its peripheral region as described above, and is sandwiched between the support substrate 3-1 and the counter substrate 3-2. The above-described organic EL element, drive circuit, and peripheral circuit are provided in this portion.

  The mounting region 3b is a peripheral portion of the support substrate 3-1, and is arranged in a state where a plurality of electrode terminals 9 drawn out from the display region 3a are extended toward the edge of the support substrate 3-1. Is formed. The mounting region 3b in which the electrode terminals 9 are arranged in this manner is covered with an inorganic insulating film 11 provided continuously from the display region 3a, and further, this upper portion is covered with an organic protective film 13.

  Of these, the inorganic insulating film 11 is made of, for example, silicon nitride or silicon oxide, and has a thickness of about 1 μm or less. The inorganic insulating film 11 is provided with a connection opening 11A that exposes only the electrode terminal 9 in the mounting region 3b. This connection portion opening 11A is provided so as to expose a portion where an external wiring is connected to the electrode terminal 9, and the bottom surface is constituted only by the electrode terminal 9. The connection portion opening 11A has an independently closed planar shape such as a rectangular shape or a substantially square shape in a state where the electrode terminals 9 are individually exposed.

  The organic protective film 13 covering the inorganic insulating film 11 is made of, for example, polyimide, epoxy resin, acrylate resin, or the like. The organic protective film 13 is provided with an opening 13A that exposes the connection opening 11A in the mounting region 3b. It is characteristic that the opening 13A is provided in a state where the region on the edge side of the display panel 3 with respect to the connection opening 11A is continuously exposed together with the connection opening 11A. As a result, the electrode terminal 9 constituting the bottom of the connection portion opening 11A and the inorganic insulating film 11 on the edge side of the display panel 3 with respect to the connection portion opening 11A are exposed on the bottom surface of the opening portion 13A. Is important.

  The opening 13A has a planar shape that is independently closed, such as a rectangular shape or a substantially square shape, and the outermost edge of the display panel 3 is continuously covered with the organic protective film 13. To do. Thereby, when the display panel 3 of one large-sized board | substrate is formed, the panel division property at the time of dividing this large-side board | substrate into each display panel 3 can be ensured, and the process protection property of the inorganic insulating film 11 is ensured. can do.

  The organic protective film 13 as described above is for protecting the electrode on the display panel 3 side, and is formed to have a certain thickness of, for example, 1 μm or more. However, the film thickness of the organic protective film 13 is in a range not exceeding the film thickness of the connection wiring 15 described below. For this reason, the opening 13A provided in this also has a certain depth. Therefore, it is assumed that the opening 13A is configured by a forward tapered peripheral wall.

  The display panel 3 having the above configuration is not limited to the one provided with the organic EL element, and may be a liquid crystal display panel or an LED display panel.

  On the other hand, the circuit board 5 mounted on the display panel 3 is a board serving as an interface for connecting the display panel 3 to an external device. The circuit board 5 used here has a plurality of connection wirings 15 on a support board 5-1 that is flexibly bent such as a flexible printed circuit (FPC) or a tape carrier package (TCP). It is provided. However, since it is mounted on the display panel 3 via the anisotropic conductive film 7, the amount of elastic compression deformation of the conductive fine particles constituting the anisotropic conductive film 7 is required to some extent. For this reason, when the deformation of the circuit board 5 is smaller, the compressive force applied to the conductive fine particles is uniformly stabilized, leading to good electrical connection.

  The connection wiring 15 provided on such a circuit board 5 has a film thickness of about 5 to 20 μm. These connection wirings 15 are arranged in a state extending to one end edge of the support substrate 5-1.

  Such a circuit board 5 is arranged in a state where the formation surface of the connection wiring 15 is opposed to the formation surface of the electrode terminal 9 in the display panel 3. Then, from the position where the edge of the circuit board 5 where the connection wiring 15 is extended and the edge of the display panel 3 on the mounting region 3b side where the electrode terminal 9 is provided are opposed to each other. The edges of the circuit board 5 are superposed on each other.

  In addition, in the overlapped state, the connection wiring 15 on the circuit board 5 side is disposed opposite to the electrode terminal 9 exposed in the opening 13A on the display panel 3 side. Each connection wiring 15 is formed on the portion where the inorganic insulating film 11 is exposed in the opening 13A from the connection opening 11A toward the edge of the display panel 3 from the connection opening 11A. It is arranged so as to pass over the organic protective film 13 over the side wall of the opening 13A. Thus, the opening 13A of the organic protective film 13 is provided not only in the electrode terminal 9 but also in the region facing the connection wiring 15.

  As described above, the anisotropic conductive film 7 (see the cross-sectional view) is sandwiched between the portions where the display panel 3 and the circuit board 5 are overlapped. The anisotropic conductive film 7 is formed by dispersing conductive fine particles 7b in an adhesive material 7a such as a thermosetting resin, and the display panel 3 and the circuit board 5 are formed by the adhesiveness of the adhesive material 7a. The end edges are joined to each other. In addition, the conductive fine particles 7b are sandwiched between the electrode terminal 9 and the connection wiring 15 in the connection portion opening 11A, so that these electrical connections are made.

<Manufacturing procedure of display device (mounting substrate)>
A manufacturing procedure of the display device (mounting substrate) 1A having the above configuration will be described with reference to FIG.

  First, the anisotropic conductive film 7 shaped into a film is placed on the mounting region 3b of the display panel 3 and temporarily fixed. Next, the circuit board 5 is arranged on the mounting area 3b of the display panel 3, and the display wiring 3 is arranged so that the connection wiring 15 on the circuit board 5 side is arranged in a predetermined state with respect to the connection opening 11A on the display panel 3 side. The panel 3 and the circuit board 5 are aligned. In this state, the display panel 3 and the circuit board 5 are heated while pressing the anisotropic conductive film 7 to melt the resin component of the anisotropic conductive film 7, and the resin component is further cured. Thus, the electrode terminals 9 and the connection wiring 15 are electrically connected by the conductive fine particles 7b included in the anisotropic conductive film 7, and the circuit board 5 is bonded and fixed to the mounting region 3b of the display panel 3. And implement.

  According to the display device (mounting substrate) 1A shown in FIGS. 1 to 3 obtained as described above, the opening 13A provided in the organic protective film 13 exposes the electrode terminal 9. The shape is such that not only 11A but also the edge side of the device panel 3 is exposed wider than this. Thereby, as shown in the BB ′ cross section of FIG. 3, the opening 13 </ b> A for exposing the electrode terminal 9 and the connection opening 11 </ b> A gradually open toward the edge of the device panel 3. It becomes an enlarged shape.

  For this reason, the connection wiring 15 on the circuit board 5 side is arranged through the portion where the opening width is gradually increased from the connection portion opening 11A toward the edge of the display panel 3 rather than the connection portion opening 11A. It will be. Therefore, the distance d between the electrode terminal 9 and the connection wiring 15 is widened due to the connection wiring 15 getting over a large step on the side wall of the opening 13A of the organic protective film 13 at the edge of the connection opening 11A. Is prevented.

  Here, in FIG. 5, as a comparative example, a plan view of a configuration in which the opening 13a ′ of the organic protective film 13 is provided so as to expose only the connection opening 11a provided in the inorganic insulating film 11, and a cross section taken along the line BB ′. The figure is shown. In such a configuration, the distance d between the electrode terminal 9 and the connection wiring 15 is wide at the edge of the connection portion between the electrode terminal 9 and the connection wiring 15.

  On the other hand, in the display device 1A according to the first embodiment, the distance d is prevented from becoming wide at the edge of the connection portion between the electrode terminal 9 and the connection wiring 15 as described above. The electrode terminal 9 and the connection wiring 15 through the conductive film 7 can be connected with low resistance.

  In addition, the inorganic insulating film 11 is exposed in the opening 13 </ b> A of the organic protective film 13. For this reason, the bonding between the display panel 3 and the circuit board 5 can be reinforced by the adhesiveness at the interface between the inorganic insulating film 11 and the anisotropic conductive film 7.

  6 is a graph showing the relationship between the high-temperature and high-humidity storage time and the adhesion strength for the display device 1A according to the first embodiment described with reference to FIGS. 1 to 3 and the comparative example shown in FIG. . As shown in this graph, in the configuration of the first embodiment in which the inorganic insulating film 11 is exposed in the opening portion 13A of the organic protective film 13, the circuit is compared with the configuration of the comparative example in which the inorganic insulating film 11 is not exposed. It was confirmed that the adhesion strength of the substrate (FPC) was improved.

  In addition to the above, the organic protective film 13 having a high oxygen and moisture permeability and content rate is reduced from the vicinity of the electrode terminal 9, a short circuit between adjacent electrodes due to metal ionization of the electrode terminal 9, and an inorganic film due to organic film swelling. The effect which can reduce the adhesive fall of this is also acquired.

≪2. Second Embodiment >>

  FIG. 7 is a plan view for explaining the characteristic part of the display device (mounting substrate) of the second embodiment. The overall configuration diagram of the display device (mounting substrate) 1B of the second embodiment is the same as that of the first embodiment, and FIG. 7 corresponds to an enlarged view of a Z portion in FIG.

  The display device (mounting substrate) 1B of the second embodiment shown in this figure is different from the first embodiment in the size of the opening 13B provided in the organic protective film 13, and the other configuration is the first embodiment. The form is the same.

  That is, the opening 13B is provided in a state where the region on the edge side of the display panel 3 is continuously exposed together with the connection opening 11A together with the connection opening 11A, and the outer peripheral portion of the connection opening 11A is also exposed. It has the size to do. Here, the outer peripheral portion of the connection portion opening 11 </ b> A is an outer peripheral portion of the connection portion opening 11 </ b> A in the arrangement direction of the electrode terminals 9 and is a portion on the inorganic insulating film 11.

  Even with the display device (mounting substrate) 1B of the second embodiment having such a configuration, the same effects as those of the first embodiment can be obtained. Further, the area of the inorganic insulating film 11 exposed in the opening 11B is enlarged as compared with the configuration of the first embodiment. Thereby, compared with 1st Embodiment, it becomes possible to further reinforce the junction of the display panel 3 and the circuit board 5 by the adhesiveness of the interface between the inorganic insulating film 11 and the anisotropic conductive film 7. .

≪3. Third Embodiment >>
FIG. 8 is a plan view for explaining the characteristic part of the display device (mounting substrate) of the third embodiment. The overall configuration diagram of the display device (mounting substrate) 1C of the third embodiment is the same as that of the first embodiment, and FIG. 8 corresponds to an enlarged view of a portion Z in FIG.

  The display device (mounting substrate) 1C of the second embodiment shown in this figure is different from the first embodiment in the size of the opening 13C provided in the organic protective film 13, and the other configuration is the first embodiment. The form is the same.

  That is, the opening 13 </ b> C has an opening shape that continuously opens a plurality of adjacent connection openings 11 </ b> A among the connection openings 11 </ b> A provided in each electrode terminal 9. That is, a plurality of (for example, two) connection opening 11A and the electrode terminal 9 provided adjacent to each other are exposed at the bottom of the opening 13C.

  Even with the display device (mounting substrate) 1C of the third embodiment having such a configuration, the same effects as those of the first embodiment can be obtained. In addition, the area of the inorganic insulating film 11 exposed in the opening 11C is further expanded as compared with the configuration of the first embodiment and the configuration of the second embodiment. Thereby, compared with 1st Embodiment, it becomes possible to further reinforce the junction of the display panel 3 and the circuit board 5 by the adhesiveness of the interface between the inorganic insulating film 11 and the anisotropic conductive film 7. .

<< 4. Fourth Embodiment >>
FIG. 9 is a plan view for explaining the characteristic part of the display device (mounting substrate) of the fourth embodiment. The overall configuration diagram of the display device (mounting substrate) 1D of the fourth embodiment is the same as that of the first embodiment, and FIG. 9 corresponds to an enlarged view of a portion Z in FIG.

  The display device (mounting substrate) 1D of the fourth embodiment shown in this figure is different from the first embodiment in the shape of the opening 13D provided in the organic protective film 13, and the other configuration is the first embodiment. It shall be the same as that.

  That is, the opening 13D is provided in a state where the region on the edge side of the display panel 3 is continuously exposed together with the connection portion opening 11A, and is further opened to the edge side of the display panel 3. It has a different shape. Thereby, the peripheral edge of the mounting region 3b of the display panel 3 is in a state where the portions covered with the organic protective film 13 and the portions not covered are alternately arranged.

  In the display device (mounting substrate) 1D of the fourth embodiment having such a configuration, the connection wiring 15 on the circuit board 5 side is not placed on the organic protective film 13. Accordingly, since the connection wiring 15 can be wired without any height, the distance between the electrode terminal 9 and the connection wiring 15 can be more reliably maintained constant as compared with other embodiments, and the connection between the electrode terminal 9 and the connection wiring 15 can be maintained. The connection resistance can be further reduced.

≪5. Fifth embodiment >>
FIG. 10 is a plan view for explaining the characteristic part of the display device (mounting substrate) of the fifth embodiment. The overall configuration diagram of the display device (mounting substrate) 1E of the fifth embodiment is the same as that of the first embodiment, and FIG. 10 corresponds to an enlarged view of a Z portion in FIG.

  The display device (mounting substrate) 1D of the fifth embodiment shown in this figure is different from the other embodiments in that the mounting region 3b is not provided with the inorganic insulating film (11), and is directly on the electrode terminal 9. The organic protective film 13 is provided. For this reason, the opening part of the organic protective film 13 exposes the connection part 9E set at the line end part of the electrode terminal 9, and further continuously exposes the region on the edge side of the display panel 3 from the connection part 9E. It is provided in the state to let you. Thereby, the surface of the support substrate 3-1 on the edge side of the display panel 3 with respect to the connection portion 9E is exposed together with the connection portion 9E of the electrode terminal 9 on the bottom surface of the opening portion 13A.

  In the (mounting board) 1D having the configuration of the fifth embodiment as described above, the connection wiring 15 on the circuit board 5 side is arranged by being pulled down from the edge of the electrode terminal 9 to the surface of the support board 3-1. For this reason, when compared with the configuration of the first to third embodiments, an element that increases the interval between the electrode terminal 9 and the connection wiring 15 is eliminated, and this interval is easily maintained constant. Therefore, the connection resistance between the electrode terminal 9 and the connection wiring 15 can be further reduced as compared with the configurations of the first to third embodiments.

  Further, the surface of the support substrate 3-1 is exposed in the opening 13 </ b> A of the organic protective film 13. Therefore, the bonding between the display panel 3 and the circuit board 5 can be reinforced by the adhesiveness at the interface between the support substrate 3-1 and the anisotropic conductive film 7.

<Application example>
The display device obtained by the manufacturing method according to the present invention described above includes various electronic devices shown in FIGS. 11 to 15 such as a digital camera, a notebook personal computer, a mobile terminal device such as a mobile phone, a video camera, etc. The present invention can be applied to display devices of electronic devices in various fields that display video signals input to electronic devices or video signals generated in electronic devices as images or videos. An example of an electronic device to which the present invention is applied will be described below.

  FIG. 11 is a perspective view showing a television to which the present invention is applied. The television according to this application example includes a video display screen unit 101 including a front panel 102, a filter glass 103, and the like, and is created by using the display device according to the present invention as the video display screen unit 101.

  12A and 12B are diagrams showing a digital camera to which the present invention is applied. FIG. 12A is a perspective view seen from the front side, and FIG. 12B is a perspective view seen from the back side. The digital camera according to this application example includes a light emitting unit 111 for flash, a display unit 112, a menu switch 113, a shutter button 114, and the like, and is manufactured by using the display device according to the present invention as the display unit 112.

  FIG. 13 is a perspective view showing a notebook personal computer to which the present invention is applied. A notebook personal computer according to this application example includes a main body 121 including a keyboard 122 that is operated when characters and the like are input, a display unit 123 that displays an image, and the like. It is produced by using.

  FIG. 14 is a perspective view showing a video camera to which the present invention is applied. The video camera according to this application example includes a main body 131, a lens 132 for shooting an object on a side facing forward, a start / stop switch 133 at the time of shooting, a display unit 134, and the like. It is manufactured by using such a display device.

  FIG. 15 is a diagram showing a mobile terminal device to which the present invention is applied, for example, a mobile phone, in which (A) is a front view in an open state, (B) is a side view thereof, and (C) is in a closed state. (D) is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view. The mobile phone according to this application example includes an upper housing 141, a lower housing 142, a connecting portion (here, a hinge portion) 143, a display 144, a sub display 145, a picture light 146, a camera 147, and the like. And the sub display 145 is manufactured by using the display device according to the present invention.

  In each of the embodiments described above, the configuration of the display devices 1A to 1E in which the circuit board 5 is mounted on the display panel 3 in which a display function is formed as a substantial functional unit has been described. However, the present invention is not limited to application to a display device using a display panel. For example, a device panel having an arithmetic function and other functions may be used as a substantial functional unit, and the present invention can be widely applied to a mounting board in which a circuit board is mounted on such a device panel.

It is a perspective view which shows the whole structure of the display apparatus of 1st Embodiment. It is an enlarged plan view for demonstrating the principal part of the display apparatus of 1st Embodiment. It is principal part sectional drawing of the display apparatus of 1st Embodiment. It is a figure for demonstrating manufacture of the display apparatus of 1st Embodiment. It is a top view of the display apparatus compared with this invention, and its B-B 'sectional drawing. It is a graph which shows the relationship between the high-temperature, high-humidity storage time and adhesive strength of the display apparatus of 1st Embodiment, and a comparative example. It is an enlarged plan view for demonstrating the principal part of the display apparatus of 2nd Embodiment. It is an enlarged plan view for demonstrating the principal part of the display apparatus of 3rd Embodiment. It is an enlarged plan view for demonstrating the principal part of the display apparatus of 4th Embodiment. It is an enlarged plan view for demonstrating the principal part of the display apparatus of 5th Embodiment. It is a perspective view which shows the television to which this invention is applied. It is a figure which shows the digital camera to which this invention is applied, (A) is the perspective view seen from the front side, (B) is the perspective view seen from the back side. 1 is a perspective view showing a notebook personal computer to which the present invention is applied. It is a perspective view which shows the video camera to which this invention is applied. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the portable terminal device to which this invention is applied, for example, a mobile telephone, (A) is the front view in the open state, (B) is the side view, (C) is the front view in the closed state , (D) is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view.

Explanation of symbols

  1A, 1B, 1C, 1D, 1E ... display device (mounting substrate), 3 ... display panel, 3b ... mounting area, 5 ... circuit board, 7 ... anisotropic conductive film, 9 ... electrode terminal, 9E ... connection part, DESCRIPTION OF SYMBOLS 11 ... Inorganic insulating film, 11A ... Connection part opening (connection part), 13 ... Organic protective film, 13A, 13B, 13C, 13D ... Opening part, 15 ... Connection wiring

Claims (8)

A device panel in which electrode terminals are drawn out to the mounting region of the peripheral portion;
An organic protective film covering the mounting area;
An opening provided in the organic protective film in a state of continuously exposing the connection portion with the external wiring in the electrode terminal and the region on the edge side of the device panel from the connection portion,
A circuit board mounted on the device panel in a state in which a connection wire is extended to the periphery, and the connection wire faces the edge of the device panel from the connection portion at the opening bottom of the organic protective film; ,
A mounting substrate comprising an anisotropic conductive film that is sandwiched between the device panel and the circuit board, connects the electrode terminal and the connection wiring, and bonds the device panel and the circuit board. The mounting area of the device panel is covered with the organic protective film via an inorganic insulating film,
The mounting substrate according to claim 1, wherein the inorganic insulating film is provided with a connection opening serving as a connection portion with an external wiring in the electrode terminal. The mounting substrate according to claim 1, wherein the opening of the organic protective film has a closed opening shape. The opening part of the said organic protective film has a magnitude | size which exposes the outer peripheral part of the said connection part with the area | region of the edge side of the said apparatus panel rather than the said connection part. The mounting board described. The mounting substrate according to claim 1, wherein the opening portion of the organic protective film has an opening shape that continuously opens the electrode terminals arranged adjacent to each other. The mounting substrate according to claim 1, wherein the opening of the organic protective film is configured by a forward tapered peripheral wall. A display panel in which electrode terminals are drawn out to the mounting area of the peripheral portion;
An organic protective film covering the mounting area;
An opening provided in the organic protective film in a state of continuously exposing the connection portion with the external wiring in the electrode terminal and the region on the edge side of the display panel from the connection portion,
A circuit board mounted on the display panel in a state in which a connection wiring is extended to the periphery, and the connection wiring faces the edge of the display panel from the connection part at the bottom of the opening of the organic protective film ,
A display device, comprising: an anisotropic conductive film that is sandwiched between the display panel and the circuit board, connects the electrode terminal and the connection wiring, and bonds the display panel and the circuit board. A display panel in which electrode terminals are drawn out to the mounting area of the peripheral portion;
An organic protective film covering the mounting area;
An opening provided in the organic protective film in a state of continuously exposing the connection portion with the external wiring in the electrode terminal and the region on the edge side of the display panel from the connection portion,
A circuit board mounted on the display panel in a state in which a connection wiring is extended to the periphery, and the connection wiring faces the edge of the display panel from the connection part at the bottom of the opening of the organic protective film ,
An electronic apparatus comprising an anisotropic conductive film that is sandwiched between the display panel and the circuit board, connects the electrode terminal and the connection wiring, and bonds the display panel and the circuit board.

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