JP2010245396A5 - - Google Patents
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- JP2010245396A5 JP2010245396A5 JP2009094164A JP2009094164A JP2010245396A5 JP 2010245396 A5 JP2010245396 A5 JP 2010245396A5 JP 2009094164 A JP2009094164 A JP 2009094164A JP 2009094164 A JP2009094164 A JP 2009094164A JP 2010245396 A5 JP2010245396 A5 JP 2010245396A5
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- JP
- Japan
- Prior art keywords
- wafers
- mounting table
- wafer
- container
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (8)
前記載置台は、載置面が凹状に形成されている貼り合わせ装置。 Of the two wafers to be bonded, a container for storing the two wafers having an oxide film formed on the bonding surface of at least one wafer, and the two wafers provided in the container A mounting table that is superposed and mounted; at least three support members that are erected around the mounting table in accordance with the outer diameter of the wafer; and a decompression unit that exhausts and decompresses the inside of the container,
The mounting table is a bonding apparatus in which the mounting surface is formed in a concave shape.
前記載置台は、載置面が水平方向に対して０°を超え５°以下傾斜して形成されている貼り合わせ装置。 Of the two wafers to be bonded, a container for storing the two wafers having an oxide film formed on the bonding surface of at least one wafer, and the two wafers provided in the container A mounting table that is superposed and mounted; at least three support members that are erected around the mounting table in accordance with the outer diameter of the wafer; and a decompression unit that exhausts and decompresses the inside of the container,
The mounting table is a bonding apparatus in which the mounting surface is formed with an inclination of more than 0 ° and not more than 5 ° with respect to the horizontal direction.
前記載置台は、載置面が前記ウェーハの貼り合わせ面よりも小さく形成されていることを特徴とする貼り合わせ装置。 In the bonding apparatus according to claim 1 or 2 ,
The bonding apparatus, wherein the mounting table has a mounting surface formed smaller than a bonding surface of the wafer.
前記載置台の載置面上方には押圧部材が設けられていることを特徴とする貼り合わせ装置。 In the bonding apparatus according to any one of claims 1 to 3 ,
A bonding apparatus, wherein a pressing member is provided above the mounting surface of the mounting table.
前記載置台の載置面は凹状に形成されていることを特徴とする製造方法。 In the manufacturing method of the SOI wafer according to claim 5 ,
The manufacturing method according to claim 1, wherein the mounting surface of the mounting table is formed in a concave shape.
前記載置台の載置面は水平方向に対して０°を超え５°以下傾斜して形成され、前記載置台の周りには前記ウェーハの移動を規制する少なくとも３つの支持部材が立設されていることを特徴とするＳＯＩウェーハの製造方法。 In the manufacturing method of the SOI wafer according to claim 5 ,
The mounting surface of the mounting table is formed to incline from 0 ° to 5 ° or less with respect to the horizontal direction, and at least three support members for restricting the movement of the wafer are erected around the mounting table. A method for producing an SOI wafer, comprising:
前記減圧の後に前記ウェーハを押圧して前記ウェーハ同士の接合を開始させることを特徴とするＳＯＩウェーハの製造方法。 In the manufacturing method of the SOI wafer in any one of Claims 5 thru | or 7 ,
A method of manufacturing an SOI wafer, wherein the wafer is pressed after the pressure reduction to start bonding of the wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009094164A JP5668275B2 (en) | 2009-04-08 | 2009-04-08 | SOI wafer manufacturing method and bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009094164A JP5668275B2 (en) | 2009-04-08 | 2009-04-08 | SOI wafer manufacturing method and bonding apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010245396A JP2010245396A (en) | 2010-10-28 |
| JP2010245396A5 true JP2010245396A5 (en) | 2012-02-16 |
| JP5668275B2 JP5668275B2 (en) | 2015-02-12 |
Family
ID=43098058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009094164A Active JP5668275B2 (en) | 2009-04-08 | 2009-04-08 | SOI wafer manufacturing method and bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5668275B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2963848B1 (en) * | 2010-08-11 | 2012-08-31 | Soitec Silicon On Insulator | LOW PRESSURE MOLECULAR ADHESION COLLAGE PROCESS |
| JP2012151407A (en) * | 2011-01-21 | 2012-08-09 | Ushio Inc | Work stage and exposure device using work stage |
| JP2012175043A (en) * | 2011-02-24 | 2012-09-10 | Tokyo Electron Ltd | Joining device, joining system, joining method, program and computer storage medium |
| JP5352609B2 (en) * | 2011-03-04 | 2013-11-27 | 東京エレクトロン株式会社 | Joining method, program, computer storage medium, joining apparatus and joining system |
| AT511384B1 (en) | 2011-05-11 | 2019-10-15 | Thallner Erich | PROCESS AND DEVICE FOR BONDING TWO WAFER |
| JP6727048B2 (en) * | 2016-07-12 | 2020-07-22 | 東京エレクトロン株式会社 | Substrate transfer device and bonding system |
| JP7243649B2 (en) * | 2020-02-07 | 2023-03-22 | 株式会社Sumco | SOI wafer bonding method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5012971A (en) * | 1973-06-04 | 1975-02-10 | ||
| JPS5850410B2 (en) * | 1976-05-29 | 1983-11-10 | 株式会社東芝 | Susceptor for semiconductor vapor phase growth |
| JPS5742174Y2 (en) * | 1978-07-28 | 1982-09-17 | ||
| JPH07226350A (en) * | 1994-02-10 | 1995-08-22 | Sony Corp | Wafer pasting device and its method |
| JP2000164588A (en) * | 1998-11-30 | 2000-06-16 | Ebara Corp | Substrate-heating method and device |
| JP2000216365A (en) * | 1999-01-21 | 2000-08-04 | Denso Corp | Semiconductor board laminating method and its device |
| JP2004052098A (en) * | 2002-05-31 | 2004-02-19 | Tokyo Electron Ltd | Substrate treatment apparatus and susceptor used for it |
| JP2004221447A (en) * | 2003-01-17 | 2004-08-05 | Toshiba Ceramics Co Ltd | Stuck substrate manufacturing device and method for manufacturing stuck substrate thereby |
-
2009
- 2009-04-08 JP JP2009094164A patent/JP5668275B2/en active Active
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