JP2010243468A - Pressure detection module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent sensitivity degradation by inhibition of oscillation of a pressure-sensitive element resulting from thermal strain or the like of a package. <P>SOLUTION: This pressure detection module is formed by storing a pressure sensor 10 in the package. In the pressure sensor 10, a diaphragm whose pressure receiving surface face the outer surface is attached to a part of a vessel, and the pressure-sensitive element responding to the fluctuation of pressure reception of the diaphragm is disposed inside the vessel. A lead frame 32 connected to an electrode terminal 28 formed on the outer surface of the vessel of the pressure sensor 10 is disposed, and the pressure sensor 10 is hollowly supported in the package 34. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a pressure detection module, and more particularly to a pressure detection module having a mount structure of a pressure sensor element that can suppress the influence of external stress.

  Conventionally, a pressure sensor using a piezoelectric vibration element as a pressure-sensitive element is known as a water pressure gauge, a barometer, a differential pressure gauge, or the like. For example, the piezoelectric vibration element mounted on a diaphragm having a flexible part that receives and deflects the pressure to be measured via a support part has an electrode pattern formed on a plate-like piezoelectric substrate, and in the force detection direction. A detection axis is set, and when the pressure to be measured is received by the pressure receiving part of the diaphragm from a direction orthogonal to the direction of the detection axis, the flexible part bends and a force is applied to the pressure vibrator via the support part. Since the piezoelectric vibrator generates a tensile stress in the direction of the detection axis, the resonance frequency of the piezoelectric vibrator changes, and the pressure value of the pressure to be measured is detected from the change in the resonance frequency.

  As this type of pressure sensor, there is one disclosed in Patent Documents 1-3. This has a diaphragm as a pressure receiving means and a pressure sensitive element (double tuning fork vibrator) mounted on a support portion formed on the diaphragm. The pressure receiving surface of the diaphragm faces the outer surface while accommodating these in a container. Thus, the structure is vacuum-sealed. These pressure sensors are structured to transmit the amount of diaphragm displacement to the pressure sensitive element. There is a problem that the detection accuracy decreases due to the fact that it acts easily.

  On the other hand, Patent Documents 4-6 disclose a pressure sensor device in which a pressure sensor composed of a pressure-sensitive element of a capacitance change type and a diaphragm is mounted on a lead frame.

However, if the mounting form of Patent Document 4-6 is applied to mounting of a pressure sensor element using a tuning fork vibrator as disclosed in Patent Document 1-3 as a pressure-sensitive element, the container itself is a resin mold. In the container due to stress strain caused by being covered with rigid, stress caused by mounting the pressure sensor element on the lead frame, and thermal strain caused by the difference in thermal expansion coefficient between the lead frame and the pressure sensor Stress due to factors other than the pressure to be measured is transmitted to the pressure-sensitive element. That is, as described above, the pressure sensor element transmits the measured pressure received by the pressure receiving part of the diaphragm as a tensile or compressive force to the pressure sensitive element (tuning fork type vibrator) via the support part, and the double tuning fork generated thereby. The resonance frequency of the vibrator is detected as pressure, but if the container of the pressure sensor element covered with the resin mold deforms due to the stress caused by the above factors, the deformation is transmitted to the diaphragm and supported from the diaphragm. This is transmitted as a tensile or compressive force to the double tuning fork vibrator connected through the section. As a result, both the stress caused by the pressure to be measured and the stress caused by the above factors are generated in the vibrating part of the double tuning fork vibrator, so that the pressure to be measured that should be detected cannot be accurately detected. End up.
Thus, as disclosed in Patent Document 7, it is conceivable to mount the pressure sensor on the lead frame using solder bumps.

JP 2007-333452 A JP 2007-327922 A JP 2008-241287 A Japanese Patent No. 3374620 JP 2006-064611 A JP 2007-258670 A JP-A-2005-249795

  However, since eutectic solder made of a eutectic alloy (Pb-Sn, Au-Sn) is generally used for the solder bump, the eutectic solder is not bonded to Au formed on the surface of the extraction electrode of the pressure sensor. There is a problem that a diffusion phenomenon occurs between them and the joint interface becomes brittle.

  In recent years, solder that does not use lead, so-called lead-free solder, has been put into practical use in the field of electronic components. The melting point of Pb—Sn solder was about 183 ° C., whereas in the case of lead-free solder, the solder melting point is higher than that of Pb—Sn solder, and the reflow temperature is in the high temperature range of 240 ° C. to 260 ° C. Is set. Therefore, when using a mounting process using lead-free solder, it is necessary to reduce thermal stress (thermal strain) and reduce shrinkage stress.

  Further, in the case of a resin package having a rectangular cross section with different lengths and widths, it is easily affected by thermal strain. When the die pad that is the pressure sensor mounting portion of the lead frame is long, if the longitudinal portion is distorted, the stress received by the lead frame may propagate to the pressure sensor, which may cause cracks in the element.

  An object of the present invention has been made to solve the above-described problem, and is a pressure sensor mount structure that suppresses vibration inhibition of a pressure-sensitive element due to thermal distortion of a package and prevents sensitivity deterioration. An object of the present invention is to provide a pressure detection module having It is another object of the present invention to provide a pressure detection module having a configuration in which crack generation due to thermal strain does not occur in a piezoelectric sensor even when a lead frame is used.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
Application Example 1 A package is provided with a pressure sensor that includes a diaphragm having a pressure-receiving surface directed outwardly in a part of the container, and a pressure-sensitive element that responds to fluctuations in pressure received by the diaphragm inside the container. A pressure detection module comprising: a lead frame connected to an electrode terminal formed on an outer surface of the pressure sensor; and the pressure sensor is supported in a hollow space in a package.

  With this configuration, the lead frame is held hollow in the package, and the pressure sensor is held away from the inner wall surface of the package, so the difference in thermal conductivity between the package material and the pressure sensor material. Even if there is, the lead frame can absorb the thermal strain on the package side, and thus the influence on the pressure sensor can be cut off, so that it is possible to suppress the deterioration of the pressure detection accuracy due to the thermal strain of the package.

Application Example 2 The pressure detection module according to Application Example 1, wherein the lead frame is provided more than the number of electrode terminals of the pressure sensor.
In this configuration, the stability of holding the hollow pressure sensor is increased.

Application Example 3 The pressure detection module according to Application Example 1, wherein the pressure sensor is horizontally supported with a cushioning material interposed between the pressure sensor and the package.
In such a configuration, the pressure sensor can be prevented from tilting, and the influence of the gravity component on the detected pressure can be avoided, so that the pressure detection accuracy can be improved.

  Application Example 4 The pressure detection module according to Application Example 1, wherein a lead frame portion that supports the pressure sensor is filled with a buffer material and the lead frame is embedded.

  Since the buffer material is filled in the lower part of the pressure sensor, it has a buffer function and at the same time has a high level holding function of the pressure sensor, which can surely prevent the pressure sensor from tilting, so that the detection accuracy can be further improved it can.

  Application Example 5 The pressure detection module according to Application Example 1, wherein the lead frame is provided with a notch.

Application Example 6 In the pressure detection module according to Application Example 1, the container of the pressure sensor is formed in a rectangular shape, and the lead frame is attached to a short side portion of the container.
Since the lead frame supports the front and rear base sides of the pressure sensor in the detection axis direction at a fixed position, the diaphragm is easily deformed and the sensitivity is increased.

Application Example 7 The pressure detection module according to Application Example 1, wherein the pressure sensor container is formed in a rectangular shape, and the lead frame is attached to a long side portion of the container.
By providing the lead frame on the long side, the degree of freedom of arrangement of the terminal electrodes is increased.

  [Application Example 8] A pressure sensor comprising a diaphragm having a pressure-receiving surface directed to the outer surface in a part of the container, and a pressure-sensitive element that responds to pressure-receiving fluctuations of the diaphragm inside the container; A pressure detection module in which an IC chip having a drive circuit is housed in a package, wherein a recess is formed in a resin package for molding the IC chip and is connected to an electrode terminal formed on the outer surface of the pressure sensor container. A lead frame is provided, the pressure sensor is hollowly supported in the recess in the package, and the package is formed so that the upper and lower resin amounts are equal with the lead frame surface as a boundary. Pressure detection module.

  Since the upper and lower resin amounts are substantially equal with respect to the surface of the lead frame, the resin package itself can be prevented from being distorted even at a high temperature of 245 ° C. or higher in the reflow process. For this reason, the probability that the thermal strain of the resin package propagates to the pressure sensor and cracks occur is greatly reduced.

  Application Example 9 A pressure sensor in which a diaphragm with a pressure-receiving surface facing an outer surface is attached to a part of a container, and a pressure-sensitive element that responds to pressure variation of the diaphragm is provided inside the container; A pressure detection module in which an IC chip having a drive circuit is housed in a package, wherein the package is an H-shaped cross-sectional package, an IC chip is mounted in one recess, and an electrode formed on the outer surface of the pressure sensor container A lead frame connected to a terminal is provided, and the pressure sensor is hollowly supported in the other recess in the package, and the H-type package is formed to have the same cross-sectional area with the surface of the lead frame as a boundary. A pressure detection module.

  According to this configuration, since the upper and lower resin amounts are substantially equal across the lead frame surface, the resin package itself is distorted even at a high temperature of 245 ° C. or higher in the reflow process. Can be prevented. For this reason, the probability that the thermal strain of the resin package propagates to the pressure sensor 10 to cause a crack is greatly reduced.

It is sectional drawing of the pressure detection module which concerns on 1st Embodiment. It is the perspective view of the pressure sensor used for the pressure detection module which concerns on 1st Embodiment, and the structural example of a lead frame. It is a disassembled perspective view which shows the basic composition of the pressure sensor used for the pressure detection module which concerns on embodiment. It is a top view of a tuning fork type vibration piece. It is a frequency characteristic figure of a tuning fork type vibration piece. It is a pattern example of the support form of the pressure sensor by a lead frame. It is sectional drawing of 2nd Embodiment of the pressure detection module which concerns on this invention. It is sectional drawing of 3rd Embodiment of the pressure detection module which concerns on this invention. It is the example of arrangement | positioning of the lead frame provided in the container short side side which supports a pressure sensor. It is the example of arrangement | positioning of the lead frame provided in the container long side side which supports a pressure sensor. It is sectional drawing of 4th Embodiment of the pressure detection module which integrated the pressure sensor and the oscillation circuit. It is sectional drawing of 5th Embodiment of the pressure detection module which integrated the pressure sensor and the oscillation circuit. It is sectional drawing of 6th Embodiment of the pressure detection module which integrated the pressure sensor and the oscillation circuit. 6 is an exploded perspective view of a modified example of the pressure sensor 10. FIG.

  Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. However, the components, types, combinations, shapes, relative arrangements, and the like described in this embodiment are merely illustrative examples and not intended to limit the scope of the present invention only unless otherwise specified. .

  FIG. 1 is a cross-sectional view of a pressure detection module according to the first embodiment, and FIG. 2 is a perspective view of a pressure sensor used in the pressure detection module according to the first embodiment, and a form example of a lead frame used in the pressure sensor. FIG. 3 shows an example of the structure of the pressure sensor 10.

  The pressure sensor 10 includes a base container 12, a vibrating piece 14 with a frame, and a diaphragm 16. As shown in FIG. 3, the frame-shaped portion 18 of the vibrating piece 14 with a frame is used as the base container 12. And a diaphragm 16 and a three-layer structure that is joined by a joining member such as an adhesive. As a result, a diaphragm 16 having a pressure receiving surface directed to the outer surface is attached to a part of the base container 12, and the vibrating piece 14 as a pressure sensitive element that responds to fluctuations in pressure received by the diaphragm 16 inside the base container 12. Is provided.

  As the vibrating piece 14, a double tuning fork type vibrating piece as shown in FIG. 4 is used. The vibrating piece 14 has a base portion 20 at both ends, and a vibrating portion (sensation that forms a double tuning fork shape between the two base portions 20. Pressure part) 22. The double tuning fork resonator element 14 having such a configuration has a characteristic that when a tension is applied to the vibrating portion 22 having a double tuning fork shape, or when the applied tension is changed, the vibration state, that is, the resonance frequency changes. Specifically, as shown in FIG. 5, the frequency increases when a tensile force is applied to the vibrating portion 22, and the frequency decreases when a compression force is applied.

  The pressure sensor 10 according to the present embodiment is capable of detecting pressure using the characteristics of the double tuning fork vibrating piece 14 as described above. Specifically, as shown in FIG. 3, two support portions formed on the thin portion 24 of the diaphragm 16 having the above-described structure, as shown in FIG. It fixes to 26 mounting surfaces. In this way, the tuning fork type vibrating piece 14 is mounted on the diaphragm 16, and the external electrode terminal 28 connected to the excitation electrode of the vibrating piece 14 faces the outer surface of the container 12. Accordingly, when the thin portion 24 of the diaphragm 16 is bent, the thin portion 24 is in a state as shown in FIG. When such a deformation occurs in the thin portion 24, a tensile force (tension) is applied to the vibrating portion 22 of the double tuning fork type vibrating piece 14 mounted on the support portion 26. When tension is applied to the vibrating portion 22, the double tuning fork vibrating piece 14 increases the output oscillation signal, that is, the resonance frequency, as described above. A detection unit (not shown) detects this change in resonance frequency and derives a change in pressure based on the change in frequency, so that the pressure loaded on the diaphragm 16 can be detected.

  By the way, the pressure detection module 30 according to the first embodiment is provided with a lead frame 32 connected to the external electrode terminal 28 formed on the base container 12 of the pressure sensor 10 described above, and the pressure sensor 10 is packaged ( It is characterized in that it is hollowly supported in the (housing) 34. As shown in FIG. 2B, the lead frame 32 is formed by bending (or curving) two portions of a conductive metal strip into a shape similar to a Z shape in a side view. The bent portion is bent so as to have an obtuse angle. By connecting the upper surface of one end of the lead frame 32 to the external electrode terminal 28 of the pressure sensor 10 and connecting the lower surface of the other end to an internal terminal 36 formed on the package 34 with a conductive adhesive, a package 34 is obtained. The pressure sensor 10 is mounted so as to be held hollow in a state of floating from the inner wall surface. Consideration is made so that the bending deformation of the lead frame 32 can be easily performed by bending the lead frame 32 so that the bending angle becomes an obtuse angle. Therefore, even if thermal distortion occurs in the package 34 and the housing is deformed, the lead frame 32 acts as a cushioning material, so that distortion and stress are absorbed, so that the transmission of stress to the pressure sensor is suppressed. The

  Note that a pressure introduction hole 38 is formed in the package 34, and the fluid pressure P to be detected introduced through the package 34 acts on the diaphragm 16 as shown in FIG. In response to this, a tensile force or a compressive force acts on the resonator element 14 to cause a change in the resonance frequency. Since the relative relationship between the shift amount of the resonance frequency and the pressure fluctuation is known from a data structure such as a lookup table prepared in advance (FIG. 5), a detection circuit (not shown) connected via the external terminal 40 of the package 34. The pressure can be detected.

  According to the first embodiment, since the lead frame 32 is held hollow in the package 34 and the pressure sensor 10 is held so as to be separated from the inner wall surface of the package 34, the material of the package 34 and the pressure sensor Even when there is a difference in the thermal conductivity of the ten materials, the lead frame 32 can absorb the thermal strain on the package 34 side, and thus the influence on the pressure sensor 10 can be cut off. It is possible to suppress a situation that degrades the detection accuracy.

  In order to more effectively exert the external force blocking function by the lead frame 32, as shown in FIG. 2 (3), a notch 42 is formed in the middle of the lead frame 32, particularly at a bent portion, and the buffering action by the notch 42 is increased. By doing so, the deformation resistance at the bent portion is reduced, and a higher buffering effect can be obtained. According to this configuration, since the stress buffer portion is provided at the boundary between the mounting region of the pressure sensor 10 and the lead frame 32 extending downward, the stress is relieved at a portion where a large force is applied due to thermal stress, It is possible to prevent the pressure sensor from receiving stress. Therefore, the occurrence of cracks is reduced, and the occurrence of cracks in the pressure sensor can be prevented even when the reflow temperature is increased due to lead-free.

Examples of the arrangement pattern of the lead frame 32 attached to the pressure sensor 10 are shown in FIGS.
The lead frame 32 may be provided as described above in principle as being connected to the plurality of external electrode terminals 28. However, the lead frame 32 is held in a cantilever state by concentrating the lead frame 32 on one short side thereof. You may make it do (FIG. 6 (1)). Alternatively, a four-point support structure in which two points are arranged on both short sides ((2) in the figure), or two points are provided on one short side and one point is provided on the other short side. A support structure can be obtained ((3) in the figure). Both are arranged symmetrically with respect to the detection axis. In each of these patterns, the two lead frames 32 are connected to the excitation electrodes. By making the number of lead frames 32 equal to or greater than the number of electrodes, the stability of the hollow support in the package 34 is increased.

  Next, FIG. 7 shows another arrangement example in which two lead frames 32 that support the pressure sensor 10 are provided on the short side of the sensor container. 7A and 7B show an example in which the external electrode terminal 28 is provided on the upper surface side of the pressure sensor 10 and is supported by the lower surface of the package 34 (FIG. 7A), and the upper surface of the package 34. This is an example of supporting (FIG. 7 (2)). The external electrode terminal 28 is formed on the lower surface of the pressure sensor 10, but the lead frame 32 may be connected to the upper surface of the package 34 (FIG. 7 (3)). In either case, the package 34 can be held hollow, so that an external force acting on the package 34 can be prevented from propagating to the pressure sensor 10. In particular, when the lead frame is provided on the short side, the lead frame supports the front and rear bases in the detection axis direction of the pressure sensor at a fixed position, so that the diaphragm is easily deformed and the sensitivity is increased. On the other hand, the configuration in which the lead frame is provided on the long side increases the degree of freedom in arranging the terminal electrodes.

  FIG. 8 shows an arrangement example of the lead frame 32 when the external electrode terminal 28 of the pressure sensor 10 is provided on the long side of the container. FIGS. 1A and 1B show a case in which the lead frame 32 is connected to the lower surface of the package 34 for hollow support and a case in which the lead frame 32 is connected to the upper surface for hollow support. FIGS. 3 (3) and 4 (4) show the case where the external electrode terminal 28 is formed on the upper surface of the pressure sensor 10, and the case where the lead frame 32 is connected to the lower surface of the package 34 and is supported hollowly, and the upper surface. It shows a case where it is connected to a hollow support.

  Regardless of the arrangement pattern of any lead frame 32, the pressure sensor 10 can be held hollow in various forms such as lifting support and suspension support with respect to the package 34 regardless of the arrangement of the external electrode terminals 28 in the pressure sensor 10. is there.

  Next, FIG. 9 shows a cross-sectional view of the pressure detection module 50 according to the second embodiment. The pressure detection module 50 has a structure in which a pressure sensor 10 including a vibrating element 14 and a diaphragm 16 as pressure sensitive elements is supported by a lead frame 32 and incorporated in a housing. A cushioning material 52 is disposed between the pressure sensor 10 and the pressure sensor 10 in a fixed position inside the package 34 while being held hollow inside the package 34. The buffer material 52 is made of a material used as a potting material or an underfill material, and is held in place by the lead frame 32. In the case of the second embodiment, it is formed into a ball shape by a potting material, and this is interposed between the lead frame 32 and the bottom surface of the package 34. Further, a protrusion 54 is formed on the inner surface of the top plate portion of the package 34 so that the upper surface of the pressure sensor 10 can be pressed by the tip of the protrusion 54. Therefore, the pressure sensor 10 is pressed down from above and below and is reliably held in a state where it is held horizontally.

  Normally, when the pressure sensor 10 is tilted, gravity acts in the expansion and contraction direction of the double tuning fork vibrating piece, and a resonance frequency in which a gravity component is added to the received pressure is detected. Therefore, it is necessary to keep the sensor element (double tuning fork beam) horizontal. By configuring as in the second embodiment, the pressure sensor 10 is held horizontally at a fixed position inside the package 34, and the distortion of the package 34 does not affect the vibrator as an external force, while the detected pressure of the gravity component is not affected. The accuracy is prevented from deteriorating.

  FIG. 10 shows a pressure detection module 60 according to the third embodiment. This third embodiment is also for holding the pressure sensor 10 horizontally as in the case of the second embodiment. The lead frame 32 is filled with a buffer material 62 made of an underfill material, and the pressure sensor 10 It is intended to fill the lower half. Further, a projection 64 is formed on the inner surface of the top plate portion of the package 34 so that the top surface of the pressure sensor 10 can be pressed by the tip of the projection 64. Also with this configuration, it is possible to prevent the influence of the distortion of the package 34 from reaching the pressure sensor while avoiding the influence of the gravity component as in the case of the second embodiment.

  Next, FIGS. 11 to 13 show pressure detection modules 70, 80 and 90 according to the fourth to sixth embodiments. In these embodiments, the pressure sensor 10 and the oscillation circuit are integrated into a module as a pressure sensor.

  In the pressure detection module 70 according to the fourth embodiment shown in FIG. 11, a lead frame 32 is connected to the pressure sensor 10, and an IC chip 72 having an oscillation circuit is bonded to the lead frame 32 of the pressure sensor 10. It is electrically connected by a wire 74. Then, the IC chip 72 is sealed with a mold resin, and the molding package 34 is formed with the mold resin. At this time, the housing recess 78 of the pressure sensor 10 is formed, and the upper and lower resin amounts are set to be the same with respect to the base surface FF of the lead frame. Finally, a lid 79 is attached and sealed. A pressure introducing hole 38 is formed in the lid.

  In such an embodiment, since the molding package 76 is configured such that the upper and lower resin amounts are substantially equal with the lead surface as a boundary, the resin package can be used even at a high temperature of 245 ° C. or higher in the reflow process. It can prevent itself from being distorted. For this reason, the probability that the thermal strain of the resin package propagates to the pressure sensor 10 to cause a crack is greatly reduced. According to this configuration, it is possible to prevent the resin package from being distorted by heat.

  FIG. 12 shows a pressure detection module 80 according to the fifth embodiment. In this embodiment, the package 84 is formed of mold resin in a state where the IC chip 82 is electrically connected to the lead frame 32 of the pressure sensor 10. In this example, the molding package 84 has an H-shaped cross section, and the IC chip 82 also faces the recess of the package 84. The housing recess 88 of the pressure sensor 10 and the housing recess 88 of the IC chip 82 are formed, and the upper and lower resin amounts are set to be the same with respect to the base surface FF of the lead frame.

  The pressure detection module 90 shown in FIG. 13 uses the H-type package 92 without using a mold resin, and stores the pressure sensor 10 in one pressure sensor storage recess 94 and the other IC storage recess 96. It is said. In this example as well, the upper and lower resin amounts are set to be the same at the base surface FF of the lead frame.

  Also in the embodiment shown in FIGS. 12 and 13, since the upper and lower resin amounts are substantially equal with the lead surface as a boundary, the reflow process has a high temperature of 245 ° C. or higher. However, the resin package itself can be prevented from being distorted. For this reason, the probability that the thermal strain of the resin package propagates to the pressure sensor 10 to cause a crack is greatly reduced. Thus, according to this configuration, it is possible to prevent the resin package from being distorted by heat.

  FIG. 14 shows a modification of the pressure sensor 10. This pressure sensor 100 is an example of a single beam type tuning fork vibrating piece. The pressure sensor 100 is also formed as a three-layer structure, and includes a base container 112, a vibrating piece 114 with a frame, and a diaphragm 116. As shown in the drawing, the frame of the vibrating piece 114 with a frame is provided. A three-layer structure is formed in which the shape portion 118 is sandwiched between the base container 112 and the diaphragm 116 and joined by a joining member such as an adhesive. The vibration part 122 is a single beam. The pressure detection module described above can also be constructed using this single beam vibrating piece.

DESCRIPTION OF SYMBOLS 10 ......... Pressure sensor, 12 ......... Base container, 14 ......... Tuning fork type vibration piece, 16 ......... Diaphragm, 18 ......... Frame-shaped part, 20 ......... Base part, 22 ......... Vibration part (Pressure sensitive part), 24 ......... Thin part, 26 ......... Support part, 28 ......... External electrode terminal, 30 ......... Pressure detection module, 32 ......... Lead frame, 34 ......... Package, 36 ......... Internal terminal, 38 ......... Pressure introduction hole, 40 ......... External terminal, 42 ......... Notch, 50 ......... Pressure detection module (second embodiment), 52 ......... Buffer material, 54 ... ...... Protrusions, 60 ......... Pressure detection module (third embodiment), 62 ......... Cushioning material, 64 ......... Protrusions, 70 ...... Pressure detection module (fourth embodiment), 72 ......... IC Chip, 74 ... Bonding wire, 76 ... Molding package, 7 ································································ Pressure Detection Module (Fifth Embodiment) ... IC housing recess, 90 ... Pressure detection module (sixth embodiment), 92 ... H-type package, 94 ... Pressure sensor housing recess, 96 ... IC housing recess.

Claims (9)

  This is a pressure detection module in which a pressure sensor comprising a diaphragm having a pressure-receiving surface directed to the outer surface in a part of the container and a pressure-sensitive element that responds to fluctuations in pressure received by the diaphragm inside the container is housed in a package. A pressure detection module comprising: a lead frame connected to an electrode terminal formed on an outer surface of the container of the pressure sensor; and the pressure sensor being hollowly supported in a package.   The pressure detection module according to claim 1, wherein the lead frame is provided more than the number of electrode terminals of the pressure sensor.   The pressure detection module according to claim 1, wherein the pressure sensor is horizontally supported with a buffer material interposed between the pressure sensor and the package.   The pressure detection module according to claim 1, wherein a buffer material is filled in a lead frame portion that supports the pressure sensor, and the lead frame is embedded.   The pressure detection module according to claim 1, wherein the lead frame is provided with a notch.   The pressure detection module according to claim 1, wherein the container of the pressure sensor is formed in a rectangular shape, and the lead frame is attached to a short side portion of the container.   The pressure detection module according to claim 1, wherein the container of the pressure sensor is formed in a rectangular shape, and the lead frame is attached to a long side portion of the container.   An IC having a pressure sensor in which a pressure-receiving surface is directed to the outer surface in a part of the container, a pressure sensor provided with a pressure-sensitive element that responds to fluctuations in pressure received by the diaphragm, and a drive circuit for the pressure-sensitive element A pressure detection module in which a chip is accommodated in a package, wherein a recess is formed in a resin package for molding an IC chip, and a lead frame connected to an electrode terminal formed on the outer surface of the container of the pressure sensor is provided, The pressure detection module, wherein the pressure sensor is hollowly supported in the recess in a package, and the package is formed so that the upper and lower resin amounts are equal with the surface of the lead frame as a boundary.   An IC having a pressure sensor in which a pressure-receiving surface is directed to the outer surface in a part of the container, a pressure sensor provided with a pressure-sensitive element that responds to fluctuations in pressure received by the diaphragm, and a drive circuit for the pressure-sensitive element A pressure detection module in which a chip is accommodated in a package, wherein the package is an H-shaped cross-section package, an IC chip is mounted in one recess, and is connected to an electrode terminal formed on the outer surface of the pressure sensor container. A lead frame is provided, the pressure sensor is hollowly supported in the other recess in the package, and the H-shaped package is formed so that the cross-sectional areas are equal with the lead frame surface as a boundary. Feature pressure detection module.

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