JP2010232644A5 - - Google Patents

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Publication number
JP2010232644A5
JP2010232644A5 JP2010043727A JP2010043727A JP2010232644A5 JP 2010232644 A5 JP2010232644 A5 JP 2010232644A5 JP 2010043727 A JP2010043727 A JP 2010043727A JP 2010043727 A JP2010043727 A JP 2010043727A JP 2010232644 A5 JP2010232644 A5 JP 2010232644A5
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JP
Japan
Prior art keywords
optical semiconductor
semiconductor device
groove
manufacturing
resin
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JP2010043727A
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English (en)
Japanese (ja)
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JP2010232644A (ja
JP5423475B2 (ja
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Priority to JP2010043727A priority Critical patent/JP5423475B2/ja
Priority claimed from JP2010043727A external-priority patent/JP5423475B2/ja
Publication of JP2010232644A publication Critical patent/JP2010232644A/ja
Publication of JP2010232644A5 publication Critical patent/JP2010232644A5/ja
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Publication of JP5423475B2 publication Critical patent/JP5423475B2/ja
Expired - Fee Related legal-status Critical Current
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JP2010043727A 2009-03-06 2010-03-01 光半導体装置の製造方法 Expired - Fee Related JP5423475B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010043727A JP5423475B2 (ja) 2009-03-06 2010-03-01 光半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009052789 2009-03-06
JP2009052789 2009-03-06
JP2010043727A JP5423475B2 (ja) 2009-03-06 2010-03-01 光半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013245523A Division JP5720759B2 (ja) 2009-03-06 2013-11-28 光半導体装置

Publications (3)

Publication Number Publication Date
JP2010232644A JP2010232644A (ja) 2010-10-14
JP2010232644A5 true JP2010232644A5 (https=) 2013-04-18
JP5423475B2 JP5423475B2 (ja) 2014-02-19

Family

ID=43048132

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2010043727A Expired - Fee Related JP5423475B2 (ja) 2009-03-06 2010-03-01 光半導体装置の製造方法
JP2013245523A Active JP5720759B2 (ja) 2009-03-06 2013-11-28 光半導体装置
JP2015064042A Active JP6060994B2 (ja) 2009-03-06 2015-03-26 光半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2013245523A Active JP5720759B2 (ja) 2009-03-06 2013-11-28 光半導体装置
JP2015064042A Active JP6060994B2 (ja) 2009-03-06 2015-03-26 光半導体装置

Country Status (1)

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JP (3) JP5423475B2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049494B2 (ja) 1997-12-26 2000-06-05 京都機械工具株式会社 可搬型電動式パイプベンダー
JP5423475B2 (ja) * 2009-03-06 2014-02-19 日亜化学工業株式会社 光半導体装置の製造方法
JP5760379B2 (ja) * 2010-10-25 2015-08-12 日立化成株式会社 光半導体装置の製造方法及び光半導体装置
JP2013062416A (ja) * 2011-09-14 2013-04-04 Toshiba Corp 半導体発光装置およびその製造方法
JP6323217B2 (ja) * 2013-07-10 2018-05-16 日亜化学工業株式会社 発光装置
JP6181523B2 (ja) * 2013-11-05 2017-08-16 京セラ株式会社 多数個取り配線基板、配線基板および電子部品
DE102014102183A1 (de) 2014-02-20 2015-08-20 Osram Opto Semiconductors Gmbh Herstellung optoelektronischer Bauelemente
CN107994109A (zh) * 2016-10-27 2018-05-04 佛山市国星光电股份有限公司 一种cob显示模组及其制造方法
DE102017117150A1 (de) * 2017-07-28 2019-01-31 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
JP6485503B2 (ja) * 2017-08-01 2019-03-20 日亜化学工業株式会社 発光装置の製造方法
JP7177336B2 (ja) * 2018-07-20 2022-11-24 日亜化学工業株式会社 発光装置
US11056624B2 (en) 2018-10-31 2021-07-06 Nichia Corporation Method of manufacturing package and method of manufacturing light-emitting device
KR102644916B1 (ko) * 2019-09-18 2024-03-06 취안저우 산안 세미컨덕터 테크놀러지 컴퍼니 리미티드 발광다이오드 패키징 어셈블리
JP7196813B2 (ja) * 2019-10-14 2022-12-27 豊田合成株式会社 発光装置およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274378A (ja) * 1995-03-30 1996-10-18 Kyocera Corp 発光素子収納用パッケージ
JP3613041B2 (ja) * 1998-12-16 2005-01-26 日亜化学工業株式会社 発光装置及びその製造方法
JP2006339362A (ja) * 2005-06-01 2006-12-14 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP2010093185A (ja) * 2008-10-10 2010-04-22 Showa Denko Kk ランプおよびランプの製造方法
JP5423475B2 (ja) * 2009-03-06 2014-02-19 日亜化学工業株式会社 光半導体装置の製造方法

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