JP2010232492A - Multilayer printed wiring board combination body and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer printed board combination body reduced in thickness, in which heat generating components are attached on the surface of a multilayer printed board, and also to provide a method for manufacturing the same. <P>SOLUTION: The multilayer printed board combination body 60 is equipped with: a heat generating component 40 provided on the surface of the multilayer printed board 30; heat conducting members 18 provided so as to penetrate through a plurality of insulating layers 14 of the multilayer printed wiring board 30 and extend from one surface to the other surface of the multilayer printed wiring board 30 in such a way that they are connected to the heat generating component 40; a first heat dissipating member 52 attached to the heat generating component 40; and a second heat conducting member 54 provided so as to be connected to the heat conducting members 18 on the surface on a side where the heat generating component 40 is not provided on the multilayer printed wiring board 30. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a multilayer printed wiring board combination in which a heat-generating component is attached to the surface of the multilayer printed wiring board and a method for manufacturing the same, and more particularly to a multilayer printed wiring board combination capable of reducing the thickness and It relates to the manufacturing method.

  Conventionally, a multilayer formed by alternately stacking a substrate sheet with conductive bumps in which a plurality of substantially conical conductive bumps are formed on the surface of a substrate sheet such as copper foil and an insulating layer such as a prepreg. Printed wiring boards are known. In such a multilayer printed wiring board, the conductive bumps formed on the surface of the substrate sheet penetrate the insulating layer, so that the substrate sheets on both sides of the insulating layer are electrically connected by the conductive bump (interlayer). Connected) (see, for example, Patent Documents 1 to 3).

  Patent Document 4 discloses a multilayer printed wiring board combination in which components such as semiconductor components and chip components are incorporated in the multilayer printed wiring board.

Japanese Patent No. 3167840 Japanese Patent Laid-Open No. 2004-6577 JP 2002-305376 A JP 2008-135767 A

  When providing a component such as a semiconductor component or a chip component on the multilayer printed wiring board, when such a component has heat generation, the component is provided on the surface of the multilayer printed wiring board, and for this component, It is necessary to provide a heat sink having a heat dissipation property (for example, a fin having a high heat transfer property). However, when the components provided on the surface of the multilayer printed wiring board are of high heat generation such as a CPU or a transistor that generates a large amount of heat or low durability such that the allowable temperature is low. It is necessary to make the heat sink provided in such a component large. In this case, the height of the heat sink must be increased, and as a result, the thickness of the multilayer printed wiring board combination in which a heat-generating component is attached to the surface of the multilayer printed wiring board is increased. There is a problem.

  The present invention has been made in consideration of the above points, and can reduce the thickness of a multilayer printed wiring board combination in which a heat-generating component is attached to the surface of the multilayer printed wiring board. It is an object of the present invention to provide a printed wiring board combination and a manufacturing method thereof.

  The multilayer printed wiring board combination of the present invention is formed by alternately superimposing a substrate sheet and an insulating layer, and the conductive bumps penetrate the insulating layer so that the substrate sheets on both sides of the insulating layer are Penetrates through a plurality of insulating layers of the multilayer printed wiring board, a multilayer printed wiring board that is electrically connected by the conductive bumps, a heat-generating component provided on the surface of the multilayer printed wiring board, and A heat transfer member provided to extend from one surface of the multilayer printed wiring board to the other surface, the heat transfer member provided to be connected to the heat generating component, and attached to the heat generating component. The first heat dissipating member and the surface of the multilayer printed wiring board on the side where the heat generating component is not provided are provided so as to be connected to the heat conducting member. A second heat radiation member, characterized by comprising a.

  In such a multilayer printed wiring board combination, a heat conductive member is provided so as to extend from one surface of the multilayer printed wiring board to the other surface through a plurality of insulating layers of the multilayer printed wiring board, The heat generating component is connected to the heat conductive member. The heat-generating component is provided with the first heat-dissipating member, and the second heat-dissipating member is connected to the heat-conductive member on the surface of the multilayer printed wiring board where the heat-generating component is not provided. A member is provided. For this reason, the heat generated by the heat generating component is dissipated by the first heat dissipating member provided in the heat generating component, and this heat is transmitted to the second heat dissipating member via the heat conductive member. The second heat dissipating member dissipates heat.

  As described above, since the heat generated by the heat-generating component is dissipated by both the first heat-dissipating member and the second heat-dissipating member, a single heat-dissipating member is simply added to the heat-generating component as in the prior art. Compared with the case where it provides, the size of the 1st heat dissipation member and the 2nd heat dissipation member can be made small, and the height can be made small as a result. This can reduce the thickness of the multilayer printed wiring board combination.

  Moreover, according to the multilayer printed wiring board combination as described above, the temperature in the multilayer printed wiring board can be made uniform by providing a heat conductive member that penetrates the multilayer printed wiring board. The durability against delamination of the multilayer printed wiring board can be improved, and the warpage of the multilayer printed wiring board due to heat can be prevented.

  In the multilayer printed wiring board combination of the present invention, a plurality of the heat generating components are provided on the surface of the multilayer printed wiring board, and the heat transfer member is a part of the heat generating components of the plurality of heat generating components. It is preferable that it is provided so that it may connect to. At this time, it is more preferable that the heat transfer member is provided so as to be connected to a highly exothermic component having a relatively large exothermic property among the plurality of exothermic components. Note that “high heat generation” means that the heat generation amount (heat flux) per unit surface area is large.

  In the multilayer printed wiring board combination of the present invention, the heat conductive member is formed by overlapping a plurality of heat conductive bumps, and each of the heat conductive bumps penetrates each insulating layer of the multilayer printed wiring board. It is preferable to be provided.

  At this time, it is more preferable that the heat conductive bump is formed of a silver paste.

  The method for producing a multilayer printed wiring board combination of the present invention includes a substrate sheet, an insulating layer provided on the surface of the substrate sheet, conductive bumps provided on the substrate sheet so as to penetrate the insulating layer, and the insulation A step of preparing a laminated body composed of heat conductive bumps provided on the substrate sheet so as to penetrate the layer, and a plurality of the laminated bodies are superposed and a pair of adjacent laminated bodies is sandwiched by sandwiching the superposed bodies. A step of bonding a substrate sheet of one laminate and a conductive bump and a heat conductive bump of the other laminate to form a multilayer printed wiring board, and the heat conductive bump on the surface of the multilayer printed wiring board Providing a heat-generating component to be connected to the heat-generating component, attaching a first heat-dissipating member to the heat-generating component, and forming the heat-generating component in the multilayer printed wiring board. The side surfaces of the goods is not provided, and further comprising a step, of providing a second heat radiating member so as to be connected to the heat conducting bumps.

  According to such a method for manufacturing a multilayer printed wiring board assembly, the heat generated by the heat-generating component is dissipated by the first heat-dissipating member provided on the heat-generating component, and the heat-transmitting member is interposed. A multilayer printed wiring board combination is obtained in which the heat is transmitted to the second heat dissipating member and is dissipated by the second heat dissipating member. For this reason, according to the manufacturing method of the above multilayer printed wiring board combination, the thickness of the multilayer printed wiring board combination obtained by the manufacturing method can be reduced. In addition, according to the method for manufacturing a multilayer printed wiring board combination as described above, the conductive property can be obtained simply by changing the design of the bump arrangement when manufacturing the laminate in the conventional manufacturing process of the multilayer printed wiring board combination. Bumps and heat conductive bumps can be formed at a time, so that a multilayer printed wiring board combination with a small thickness can be easily obtained.

  According to the multilayer printed wiring board combination and the manufacturing method thereof of the present invention, the thickness of the multilayer printed wiring board combination in which a heat-generating component is attached to the surface of the multilayer printed wiring board can be reduced.

It is explanatory drawing which shows the structure of a multilayer printed wiring board combination body in which the exothermic component was attached to the surface of the multilayer printed wiring board in embodiment of this invention. It is explanatory drawing which shows the single-sided board used when manufacturing the multilayer printed wiring board shown in FIG. It is explanatory drawing which shows the structure of a multilayer printed wiring board combination body in which the exothermic component was attached to the surface of the multilayer printed wiring board in a comparative example. It is explanatory drawing which shows the single-sided board used when manufacturing the multilayer printed wiring board shown in FIG.

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are diagrams showing an embodiment of a multilayer printed wiring board combination and a manufacturing method thereof according to the present invention.
Among these, FIG. 1 is explanatory drawing which shows the structure of a multilayer printed wiring board combination body in which the exothermic component was attached to the surface of the multilayer printed wiring board in this Embodiment, FIG. 2 is FIG. It is explanatory drawing which shows the single-sided board used when manufacturing the multilayer printed wiring board shown in FIG.

  Hereinafter, the multilayer printed wiring board combination of the present embodiment and the manufacturing method thereof will be sequentially described.

[Production method of single-sided plate]
Initially, the manufacturing method of the single-sided board 10 as shown in FIG. 2 is demonstrated. This single-sided board 10 is used when manufacturing the multilayer printed wiring board 30 shown in FIG. First, a substrate sheet 12 such as a flat copper foil is prepared. Next, a plurality of substantially conical conductive bumps 16 are formed on the substrate sheet 12 by screen printing or the like. Here, the conductive bumps 16 are made of, for example, silver paste or the like. Further, when performing the screen printing as described above, the substantially conical heat conductive bumps 18 are formed on the substrate sheet 12. Here, the heat conductive bumps 18 are also made of, for example, silver paste. Then, the conductive bumps 16 and the heat conductive bumps 18 in the substrate sheet 12 are formed in a state where the substrate sheet 12 on which the conductive bumps 16 and the heat conductive bumps 18 are formed is placed on a flat plate member (not shown). An insulating layer 14 made of a thermosetting material such as a prepreg is placed on the finished surface.

  Thereafter, the conductive bump 16 is sandwiched between a pair of rollers or the like, for example, from above and below with a flat member, the substrate sheet 12 on which the conductive bump 16 or the heat conductive bump 18 is formed, and the insulating layer 14. And the heat conductive bumps 18 penetrate the insulating layer 14. Then, by removing the flat plate member from the superposed body of the flat plate member, the substrate sheet 12 on which the conductive bumps 16 and the heat conductive bumps 18 are formed, and the insulating layer 14, the single-sided plate 10 as shown in FIG. Is obtained.

  Here, as shown in FIG. 2, the single-sided plate 10 includes a flat substrate sheet 12, an insulating layer 14 provided on one surface of the substrate sheet 12, and one of the substrate sheets 12 penetrating the insulating layer 14. The conductive bumps 16 are provided on the surface of the substrate sheet 12 and the heat conductive bumps 18 are provided on one surface of the substrate sheet 12 so as to penetrate the insulating layer 14. Further, the insulating layer 14 of the single-sided plate 10 has not been cured yet, and the insulating layer 14 has fluidity. Thereafter, the insulating layer 14 of the single-sided plate 10 is cured by heating the single-sided plate 10 shown in FIG.

[Manufacturing method of multilayer printed wiring board]
Next, a method of manufacturing the multilayer printed wiring board 30 as shown in FIG. 1 using the single-sided board 10 on which the insulating layer 14 has been cured will be described.

  First, the single-sided plates 10 on which the insulating layer 14 has been cured are overlapped. At this time, the single-sided plates 10 are overlapped so that the positions of the heat conductive bumps 18 substantially coincide with each other in the vertical direction. Then, the superposed body in which the single-sided plates 10 on which the insulating layer 14 has been cured is sequentially superposed is sent to a press device (not shown), and the superposed body is sandwiched from above and below by the press device and heated. To do. Specifically, for example, the stacked body is pressed from above and below by a pair of rollers (not shown). As a result, the conductive bumps 16 and the heat conductive bumps 18 of the single-sided plate 10 are bonded to the substrate sheet 12 of the other single-sided plate 10 adjacent to the single-sided plate 10. Thereby, as shown in FIG. 1, the multilayer printed wiring board 30 is manufactured. In such a multilayer printed wiring board 30, a plurality of superposed heat conductive bumps 18 pass through each insulating layer 14 of the multilayer printed wiring board 30 from one surface of the multilayer printed wiring board 30 to the other surface. It will be provided to extend. Thus, by superimposing the plurality of heat conductive bumps 18, a heat conductive member is formed by the plurality of heat conductive bumps 18 and the substrate sheet 12 connected to the heat conductive bumps 18.

  Thereafter, as shown in FIG. 1, the heat generating components 40 and 42 are attached to the surface of the multilayer printed wiring board 30. Here, of the exothermic components 40 and 42, the high exothermic component 40 made of, for example, a CPU or a transistor having a relatively large calorific value is adjacent to the heat conductive bump 18 so as to be adjacent to the surface of the multilayer printed wiring board 30. Attach to. On the other hand, of the exothermic components 40 and 42, the low exothermic component 42 having a relatively small calorific value may not be adjacent to the heat conductive bump 18, as shown in FIG.

  Thereafter, heat sinks (for example, fins having high heat transfer properties) 52 and 56 made of, for example, a metal body and having heat dissipation properties are provided on each of the heat generating components 40 and 42. Here, the heat sink 52 provided in the high heat generating component 40 and the heat sink 56 provided in the low heat generating component 42 are of the same size, shape and material. In the present embodiment, the heat sink 52 provided in the high heat generating component 40 is smaller in size than the heat sink provided in the high heat generating component of the conventional multilayer printed wiring board combination, as will be described later. Its height is also getting smaller.

  Further, as shown in FIG. 1, a heat sink 54 is provided on the surface of the multilayer printed wiring board 30 on the side where the high heat generating component 40 is not provided so as to be connected to the heat conductive bumps 18. The heat sink 54 is provided at a position facing the highly exothermic component 40. Further, the heat sink 54 and the heat sink 52 provided in the highly heat-generating component 40 have the same size, shape and material.

  In this way, as shown in FIG. 1, a multilayer printed wiring board combination 60 in which the heat generating components 40 and 42 are provided on the surface of the multilayer printed wiring board 30 is obtained.

  According to the multilayer printed wiring board assembly 60 of the present exemplary embodiment, the plurality of multilayer printed wiring boards 30 penetrates the plurality of insulating layers 14 and extends from one surface of the multilayer printed wiring board 30 to the other surface. A heat conductive bump 18 (heat conductive member) is provided, and the high heat generating component 40 is connected to the heat conductive bump 18. The high heat generating component 40 is provided with a heat sink 52 (first heat dissipating member), and a heat conductive bump is formed on the surface of the multilayer printed wiring board 30 where the high heat generating component 40 is not provided. A heat sink 54 (second heat dissipating member) is provided so as to be connected to 18 (heat conducting member). Therefore, the heat generated by the high heat generating component 40 is dissipated by the heat sink 52 (first heat dissipating member) provided in the high heat generating component 40 and a plurality of heat conductive bumps 18 (heat conductive members). ) Is transmitted to the heat sink 54 (second heat radiating member), and is radiated by the heat sink 54 (second heat radiating member).

  As described above, the heat generated by the highly exothermic component 40 is dissipated by both the heat sink 52 (first heat dissipating member) and the heat sink 54 (second heat dissipating member). Compared with the case where one heat dissipating member is provided in the high heat generating component 40, the size of the heat sink 52 (first heat dissipating member) and the heat sink 54 (second heat dissipating member) can be reduced. As a result, the height can be reduced. As a result, the thickness “a” (see FIG. 1) of the multilayer printed wiring board combination 60 can be reduced.

  Further, according to the multilayer printed wiring board combination 60 of the present embodiment, the temperature inside the multilayer printed wiring board 30 can be made uniform by providing a plurality of heat conductive bumps 18 penetrating the multilayer printed wiring board 30. Therefore, durability against delamination of the multilayer printed wiring board 30 can be improved, and warpage of the multilayer printed wiring board 30 due to heat can be prevented.

  In the method of manufacturing the multilayer printed wiring board assembly 60 of the present embodiment, first, the substrate sheet 12, the insulating layer 14 provided on the surface of the substrate sheet 12, and the substrate sheet 12 so as to penetrate the insulating layer 14. A single-sided plate 10 (laminated body) composed of conductive bumps 16 provided on the substrate and heat conductive bumps 18 provided on the substrate sheet 12 so as to penetrate the insulating layer 14 is prepared, and a plurality of single-sided plates 10 (laminated body) are prepared. Are stacked, and the substrate sheet 12 of one single-sided plate 10 and the conductive bumps 16 and the heat-conductive bumps 18 of the other single-sided plate 10 in each pair of adjacent single-sided plates 10 are bonded together by sandwiching the stacked body. The multilayer printed wiring board 30 is formed by bonding. Thereafter, a heat-generating component 40 is provided on the surface of the multilayer printed wiring board 30 so as to be connected to the heat-conductive bump 18 (heat-conductive member), and a heat sink 52 (first heat-dissipating member) is attached to the heat-generating component 40, A heat sink 54 (second heat dissipating member) is provided on the surface of the multilayer printed wiring board 30 where the heat generating component 40 is not provided so as to be connected to the heat conductive bump 18 (heat conducting member). According to such a method of manufacturing the multilayer printed wiring board assembly 60, the conductive bumps 16 can be obtained only by changing the design of the bump arrangement when manufacturing the single-sided board in the conventional manufacturing process of the multilayer printed wiring board combination. In addition, the heat conductive bumps 18 can be formed at a time, so that a multilayer printed wiring board assembly 60 having a small thickness as shown in FIG. 1 can be easily obtained.

[Comparative Example]
Next, as a comparative example, a multi-layer printed wiring board is manufactured by superimposing single-sided boards that are not provided with heat conductive bumps on the substrate sheet, and a high heat generating component and a low heat generating component are formed on the multilayer printed wiring board. The case of providing the above will be described with reference to FIGS. FIG. 3 is an explanatory view showing a configuration of a multilayer printed wiring board combination in which a heat-generating component is attached to the surface of the multilayer printed wiring board in a comparative example, and FIG. 4 is a multilayer printed wiring shown in FIG. It is explanatory drawing which shows the single-sided board used when manufacturing a board.

  First, it is composed of a flat substrate sheet 12, an insulating layer 14 provided on one surface of the substrate sheet 12, and conductive bumps 16 provided on one surface of the substrate sheet 12 so as to penetrate the insulating layer 14. The single-sided plate 10a is manufactured (see FIG. 4). The single-sided plate 10a is not provided with the heat conductive bumps 18 as shown in FIG. Thereafter, the single-sided plate 10a shown in FIG. 4 is heated to cure the insulating layer 14 of the single-sided plate 10a.

  Next, the single-sided plates 10a on which the insulating layer 14 has been cured are overlapped. Then, the superposed body in which the single-sided plates 10a on which the insulating layer 14 has been cured is sequentially superposed is sent to a press device (not shown), and the superposed body is sandwiched from above and below by the press device and heated. To do. Specifically, for example, the stacked body is pressed from above and below by a pair of rollers (not shown). Thus, the conductive bumps 16 of the single-sided plate 10a are joined to the substrate sheet 12 of another single-sided plate 10a adjacent to the single-sided plate 10a. Thereby, as shown in FIG. 3, the multilayer printed wiring board 32 is manufactured.

  Thereafter, as shown in FIG. 3, the heat generating components 40 and 42 are attached to the surface of the multilayer printed wiring board 32. More specifically, among the heat generating components 40 and 42, the heat generation amount is relatively large, for example, a high heat generating component 40 made of a CPU or a transistor, and a low heat generation that is less heat generating than the high heat generating component 40. Each of the functional parts 42 is attached to the surface of the multilayer printed wiring board 30.

  Thereafter, a heat sink 58 having a heat dissipation property made of, for example, a metal body is attached to the high heat generating component 40, and a heat sink 56 having a heat dissipation property of the same material as that of the high heat generating component 40 is attached to the low heat generating component 42. Here, since the high heat generating component 40 has higher heat generation than the low heat generating component 42, the heat sink 58 attached to the high heat generating component 40 is larger in size than the heat sink 56 attached to the low heat generating component 42. The height of the heat sink 58 is also increased. Therefore, as shown in FIG. 3, the thickness “b” of the multilayer printed wiring board assembly 62 in which the heat-generating components 40 and 42 are attached to the multilayer printed wiring board 32 is such that the height of the heat sink 58 is increased. The thickness “b” of the multilayer printed wiring board combination 62 is larger than the thickness “a” of the multilayer printed wiring board combination 60 of the present embodiment as shown in FIG. turn into. More specifically, the thickness “b” of the multilayer printed wiring board combination 62 according to the comparative example as shown in FIG. 3 is, for example, 18 mm, whereas the multilayer according to the present embodiment as shown in FIG. The thickness “a” of the printed wiring board combination 60 is, for example, 13 mm.

10. Single-sided board 10a according to the present embodiment Single-sided board 12 according to the comparative example 12 Substrate sheet 14 Insulating layer 16 Conductive bump 18 Thermal conductive bump 30 Multilayer printed wiring board 32 according to the present embodiment Multilayer printed wiring board 40 according to the comparative example High heat generation Component 42 Low heat-generating component 52 Heat sink 54 Heat sink 56 Heat sink 58 Heat sink 60 according to comparative example Multi-layer printed wiring board combination 62 according to this embodiment Multi-layer printed wiring board combination according to comparative example

Claims (6)

The substrate sheet and the insulating layer are alternately stacked, and the conductive bumps penetrate the insulating layer so that the substrate sheets on both sides of the insulating layer are electrically connected to each other by the conductive bump. Multilayer printed wiring boards like
Exothermic parts provided on the surface of the multilayer printed wiring board;
A heat transfer member provided so as to pass through a plurality of insulating layers of the multilayer printed wiring board and extend from one surface of the multilayer printed wiring board to the other surface, provided to connect to the heat-generating component. A heat conductive member,
A first heat dissipating member attached to the exothermic component;
On the surface of the multilayer printed wiring board on the side where the exothermic component is not provided, a second heat dissipating member provided to connect to the heat conducting member,
A multilayer printed wiring board combination comprising:   A plurality of the exothermic parts are provided on the surface of the multilayer printed wiring board, and the heat conductive member is provided so as to be connected to some exothermic parts among the plurality of exothermic parts. The multilayer printed wiring board combination according to claim 1.   3. The multilayer printed wiring board combination according to claim 2, wherein the heat conductive member is provided so as to be connected to a highly exothermic component having a relatively large exothermic property among the plurality of exothermic components.   The heat transfer member is formed by superimposing a plurality of heat transfer bumps, and the heat transfer bumps are provided so as to penetrate the insulating layers of the multilayer printed wiring board. Item 4. The multilayer printed wiring board combination according to any one of Items 1 to 3.   The multilayer printed wiring board combination according to claim 4, wherein the heat conductive bump is formed of a silver paste. A substrate sheet, an insulating layer provided on the surface of the substrate sheet, a conductive bump provided on the substrate sheet so as to penetrate the insulating layer, and a heat transfer property provided on the substrate sheet so as to penetrate the insulating layer Preparing a laminate comprising bumps;
By superposing a plurality of the laminated bodies and sandwiching the laminated bodies, the substrate sheet of one laminated body and the conductive bumps and the heat conductive bumps of the other laminated body are bonded to each other in a pair of adjacent laminated bodies. A step of forming a multilayer printed wiring board;
Providing a heat-generating component on the surface of the multilayer printed wiring board to connect to the heat-conductive bump;
A first heat dissipating member is attached to the heat generating component, and a second heat dissipating member is connected to the heat conductive bump on the surface of the multilayer printed wiring board where the heat generating component is not provided. Providing step,
A method for producing a multilayer printed wiring board combination, comprising:

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