JP2010228977A - Molding apparatus and molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide molding techniques improving use efficiency of energy in a molding process. <P>SOLUTION: A molding apparatus M1 is provided, which includes a heating stage 11, a pressing stage 12 and a cooling stage 13 where a molding die 50 is sequentially moved are disposed inside a molding chamber 6, and which carries out each process of heating, press-molding and cooling. In the apparatus, a thermal power generation module 30A and a thermal power generation module 30B are disposed on the back faces of a first cooling plate 25 and a second cooling plate 27, respectively, of the cooling stage 13 opposite to the molding die 50, so as to convert the thermal energy obtained in the cooling process of the molding die 50 into electric power and recover the power, which improves the use efficiency of energy in the molding process. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a molding apparatus and a molding method.

  For example, in the production of optical elements such as glass lenses, prisms, and mirrors, a molding technique using a hot press is often used because of high productivity.

  In such heating and press molding of an optical element, generally, an optical element material is placed in a mold, the mold is heated and pressed by a heating block that is a block-shaped heating means, and then cooled by a cooling plate. It is used.

  For example, in the molding of a high-precision optical element using an optical glass material having a relatively high molding temperature, a large amount of electric power is required because it is necessary to heat the molding die to a high temperature.

  In order to reduce the amount of electric power during heating, for example, in Patent Document 1, in the heating block, a cavity is formed so as to surround the heater provided inside the heater block on the surface opposite to the surface that contacts the mold. The heat insulation part is formed, the heat transfer from the back side of a heating block is suppressed, and the technique which tries to raise the heat transfer efficiency with respect to a shaping | molding die from a heating block is disclosed.

  However, in the above-mentioned Patent Document 1, heat energy stored in the mold heated to a high temperature is dissipated and lost to the environment in the process of cooling the mold in the cooling process, so that energy loss occurs. It was.

Japanese Unexamined Patent Publication No. 2007-112539

  The objective of this invention is providing the shaping | molding technique which can improve the utilization efficiency of the energy in a shaping | molding process.

A first aspect of the present invention is a heating stage for heating a mold on which a molding material is mounted,
A press stage for pressing the heated mold and molding the molding material;
A cooling stage for cooling the formed mold,
The cooling stage is
A first cooling plate and a second cooling plate that sandwich the mold,
A thermoelectric generator that is disposed on at least one of the first cooling plate and the second cooling plate and converts thermal energy released from the mold during cooling into electric power;
Is provided.

According to a second aspect of the present invention, there is provided a heating step of heating a molding die on which a molding material is mounted, a pressing step of pressing the heated molding die to mold the molding material, and cooling the molding die. A molding method for performing a cooling process,
In the cooling step, there is provided a molding method for cooling the mold by converting heat of the mold into electric power.

  A third aspect of the present invention is arranged on at least one of the first cooling plate and the second cooling plate that sandwich the mold and the first cooling plate and the second cooling plate, and is discharged from the mold. And a thermoelectric generator for converting thermal energy into electric power.

  ADVANTAGE OF THE INVENTION According to this invention, the shaping | molding technique which can improve the utilization efficiency of the energy in a shaping | molding process can be provided.

It is sectional drawing which shows an example of the whole structure of the shaping | molding apparatus which is one embodiment of this invention. It is sectional drawing which shows the structural example of the cooling stage of the shaping | molding apparatus which is one embodiment of this invention. It is sectional drawing which shows an example of the structure of the thermoelectric generation module which comprises the shaping | molding apparatus which is one embodiment of this invention. It is sectional drawing which shows the structural example of the cooling stage in the modification of the shaping | molding apparatus of one embodiment of this invention.

  In one aspect of the present embodiment, for example, in an optical element molding apparatus that molds an optical element by sandwiching a molding die containing a molding material such as glass from above and below, and sequentially performing heating, pressing, and cooling, the molding die The cooling stage for cooling is arranged in surface contact with the cooling plate that contacts the mold and absorbs the heat of the mold, the water cooling block that is cooled by the cooling water, and both the cooling plate and the water cooling block. It consists of a thermoelectric power generation module.

For example, a configuration in which a plurality of P-type thermoelectric material elements and N-type thermoelectric material elements are PN-connected in series can be used for this thermoelectric generator module.
Furthermore, the compliance mechanism which can adjust the contact force and contact state with respect to the cooling plate and water cooling block of a thermoelectric generation module is provided.

  In the molding apparatus of this aspect, the heat energy of the mold heated to a high temperature heats the joint surface on the cooling plate side of the thermoelectric generator module by increasing the temperature of the cooling plate.

  Moreover, since the water cooling block is cooled by the cooling water path for keeping the whole molding apparatus at a constant temperature, a temperature difference is generated between both end faces of the thermoelectric generation module.

  The temperature difference between the two end faces of this thermoelectric generator module makes it possible to generate power, and the heat energy used to heat the mold is recovered as electric power at the cooling stage without dissipating it into the environment. It can be accumulated and reused.

That is, it is possible to improve the utilization efficiency of energy necessary for the molding process by collecting the thermal energy of the mold heated to a high temperature as electric power during cooling.
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an overall view showing an example of a configuration of a molding apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing an example of a cooling stage of the molding apparatus according to an embodiment of the present invention. FIG. 3 is a cross-sectional view showing an example of the structure of the thermoelectric generator module constituting the molding apparatus of the present embodiment.

In the molding apparatus M1 of the present embodiment, a case where it is applied to an optical glass element manufacturing apparatus will be described as an example.
In the present embodiment, in FIG. 1, the left-right direction is described as the X direction, the up-down direction as the Z direction, and the direction perpendicular to the paper surface as the Y direction. As an example, the Z direction is the vertical direction, and the XY plane is the horizontal plane.

  As illustrated in FIG. 1, the molding apparatus M <b> 1 of the present embodiment includes a molding chamber 6 including a lower base 4, an upper base 3, and side plates 9.

  Inside the molding chamber 6, a heating stage 11 (heating process) and a press stage 12 ( The pressing stage) and the cooling stage 13 (cooling process) are arranged in a row in the X direction.

  The inside of the molding chamber 6 in which the heating stage 11, the press stage 12, and the cooling stage 13 are accommodated prevents the mold 50 from being oxidized and does not adversely affect the reducing atmosphere such as devitrification of the glass. It is an atmosphere of a mixed gas 92 obtained by mixing 9% or more of nitrogen gas and 0.1% or less of hydrogen gas.

The mixed gas 92 constituting the atmosphere in the molding chamber 6 is supplied to the molding chamber 6 through a gas supply path 91 from a gas supply device 90 provided outside the molding chamber 6.
The gas supply unit 90 is configured to be able to change the mixing ratio of the mixed gas 92 depending on molding conditions such as the material of the mold 50, the glass material, and the molding temperature.

  In the molding chamber 6, a side shutter 9 facing each of the heating stage 11 and the cooling stage 13 positioned at the arrangement end in the X direction is provided with a closing shutter 7 and a discharging shutter 8. A loading table 1 is disposed, and a discharge table 2 is disposed on the discharge shutter 8 side.

  The loading table 1 is provided with a loading claw 5 that reciprocates in the X direction, and a molding die 50 (described later) placed on the loading table 1 is pushed into the heating stage 11 in the molding chamber 6 through the loading shutter 7. The operation to input is performed.

  The molding chamber 6 is provided with a molding conveying means (not shown), and the molding die 50 put into the heating stage 11 from the loading table 1 is sequentially moved to the press stage 12 and the cooling stage 13, and then from the discharge shutter 8. It is discharged to an external discharge stand 2.

Each of the heating stage 11 and the press stage 12 is provided with a lower cooling block 17, a lower heat insulation block 18, and a lower heating plate 20 supported on the lower base 4 side.
The lower heating plate 20 is provided with a heater 20a so that the molding die 50 placed on the lower heating plate 20 can be heated to a desired temperature from the lower side.

  The lower heat insulation block 18 located on the back side opposite to the mold 50 of the lower heating plate 20 prevents the heat of the lower heating plate 20 from being dissipated to the lower base 4 side and improves the heating efficiency of the mold 50. Let

  Further, the lower cooling block 17 located between the lower heat insulating block 18 and the lower base 4 on the back side opposite to the lower heating plate 20 is provided with a water passage (not shown) inside, and the cooling water is passed through the water passage. Thus, the lower base 4 is prevented from being overheated by the heat of the lower heating plate 20.

  On the other hand, an upper heating plate 19, an upper heat insulating block 16, and an upper cooling block 15 supported on the upper base 3 side via the upper shaft 14 and the cylinder 10 are provided at positions facing the lower heating plate 20 in the Z direction. It has been.

  The upper heating plate 19 that comes into contact with the mold 50 from above is provided with a heater 19a so that the mold 50 can be heated to a desired temperature from above.

  The upper heat insulating block 16 is provided on the back side opposite to the mold 50 of the upper heating plate 19 to prevent the heat of the upper heating plate 19 from being dissipated to the upper base 3 side. Improves efficiency.

The upper cooling block 15 provided between the upper insulating block 16 and the upper shaft 14 on the back side has the same structure as the lower cooling block 17 described above, and includes the upper upper shaft 14, the cylinder 10, the upper base 3 and the like. Is prevented from overheating by the heat of the upper heating plate 19.
The cylinder 10 performs an operation of driving the upper heating plate 19 in the vertical direction (Z direction) via the upper shaft 14.

  In the case of the present embodiment, in the heating stage 11, the cylinder 10 operates so that the upper heating plate 19 is brought into contact with the upper side of the molding die 50 and the molding die 50 is sandwiched between the lower heating plate 20.

  In the press stage 12, the cylinder 10 performs a molding operation by bringing the upper heating plate 19 into contact with the molding die 50 with a predetermined pressing pressure and sandwiching the molding die 50 with the lower heating plate 20.

  On the other hand, as illustrated in FIGS. 1 and 2, the cooling stage 13 of the present embodiment located at the end of the arrangement of each stage includes a cylinder 10, a cooling block drive shaft 21, a first water cooling block 22, and a first compliance. Mechanism 23, first cooling water channel 24, first cooling plate 25, second cooling water channel 26, second cooling plate 27, second compliance mechanism 28, second water cooling block 29, thermoelectric generator module 30A (thermoelectric generator), heat A power generation module 30B (thermoelectric power generation means) is provided.

In the molding apparatus M1 of the present embodiment, the first compliance mechanism 23, the thermoelectric generator module 30A, and the first water cooling block 22 are disposed on the back surface of the first cooling plate 25 opposite to the surface that contacts the mold 50. The cooling block drive shaft 21 is connected.
The cooling block drive shaft 21 is supported by the upper base 3 via the cylinder 10.

  Similarly, on the back side of the second cooling plate 27 facing the first cooling plate 25 in the Z direction and on which the mold 50 is placed, the second compliance mechanism 28, the thermoelectric generator module 30A, and the second water cooling block 29 is disposed, and the second water cooling block 29 is supported by the lower base 4.

  The first compliance mechanism 23 is a flexible support structure that displaceably supports the first cooling plate 25 with respect to the first water cooling block 22, and the first compliance mechanism 23 is a first for the thermoelectric generation module 30 </ b> A fixed to the first water cooling block 22 side. By flexibly changing the posture of the cooling plate 25, the influence of dimensional changes due to temperature fluctuations is corrected, and the contact surface between the back surface of the first cooling plate 25 and the thermoelectric generator module 30A maintains the maximum contact area. That is, it arrange | positions so that the heat transfer efficiency between the 1st cooling plate 25 and the thermoelectric generation module 30A may become the maximum.

  Similarly, the second compliance mechanism 28 is a flexible support structure that displaceably supports the second cooling plate 27 with respect to the second water-cooling block 29, and corrects the influence of dimensional changes due to temperature fluctuations and the like. The contact surface between the back surface of the cooling plate 27 and the thermoelectric generation module 30B can maintain the maximum contact area, that is, the heat transfer efficiency between the second cooling plate 27 and the thermoelectric generation module 30B is maximized. Are arranged as follows.

  The first water cooling block 22 is arranged so that the cooling block drive shaft 21 connected to the first water cooling block 22 and the cylinder 10 that drives the cooling block drive shaft 21 are not deformed by heat.

  The first water cooling block 22 has a first cooling water passage 24 disposed therein, and a cooling medium such as cooling water is always flowing, so that the thermoelectric generator module 30A and the like are always cooled.

  Similarly, the second cooling water channel 26 is also arranged inside the second water cooling block 29 that supports the second cooling plate 27 from the back via the second compliance mechanism 28, and the cooling medium always flows so that cooling is always performed. The lower base 4 and the like constituting the molding chamber 6 of the molding apparatus M1 are protected from heat.

  In this case, the thermoelectric generator module 30A disposed between the back surface side of the first cooling plate 25 and the first water cooling block 22, and the back surface side of the second cooling plate 27 and the second water cooling block 29. Each of the thermoelectric generation modules 30B has a configuration in which a plurality of P-type thermoelectric material elements and N-type thermoelectric material elements are connected in series so as to constitute a PN junction, for example, and there is a temperature difference between both end faces. As a result, the thermoelectric generation module 30A (thermoelectric generation module 30B) generates electricity.

  FIG. 3 is a side view illustrating the configuration of the thermoelectric generator module 30A and the thermoelectric generator module 30B in the present embodiment. In this case, the thermoelectric generator module 30A and the thermoelectric generator module 30B have the same configuration, and the attachment postures are reversed in the Z direction.

  Thermoelectric generation module 30A (thermoelectric generation module 30B) includes a plurality of heat sources such that a plurality of P-type semiconductors 31 (P-type thermoelectric material elements) and N-type semiconductors 32 (N-type thermoelectric material elements) constitute a PN junction. It is configured to be alternately connected in series via the side electrode 33 and the cooling side electrode 34, and the lead wire 35 and the lead wire 36 are connected to the cooling side electrode 34 at both ends thereof.

  The outer surfaces of the heat source side electrode 33 and the cooling side electrode 34 are covered with an insulating cover 37 and an insulating cover 38 made of a heat resistant insulator such as ceramics, for example.

  Then, the heat source side electrode 33 (insulating cover 37) side is brought into contact with the high temperature first cooling plate 25, and the cooling side electrode 34 (insulating cover 38) side is brought into contact with the low temperature first water cooling block 22 side. By doing so, the electric power according to the temperature difference between the first water cooling block 22 and the first cooling plate 25 is taken out from the lead wire 35 and the lead wire 36 to the lead wire 35 and the lead wire 36 of the thermoelectric generator module 30A.

  Similarly, the heat source side electrode 33 (insulating cover 37) side is brought into contact with the high temperature second cooling plate 27, and the cooling side electrode 34 (insulating cover 38) side is brought into contact with the low temperature second water cooling block 29 side. By making contact, power corresponding to the temperature difference between the second water cooling block 29 and the second cooling plate 27 is taken out from the lead wire 35 and the lead wire 36 to the lead wire 35 and the lead wire 36 of the thermoelectric generator module 30B.

  In the case of the present embodiment, as an example, the lead wire 35 and the lead wire 36 of the thermoelectric generation module 30A and the thermoelectric generation module 30B described above are connected to the secondary battery 60 capable of storing electric power, and the thermoelectric generation module 30A. The electric power generated by the thermoelectric generation module 30B is stored in the secondary battery 60.

  Moreover, it is good also as a structure which connects the above-mentioned secondary battery 60 to a part of shaping | molding apparatus M1, or the electric equipment of another apparatus, and utilizes the electric power which thermoelectric generation module 30B generated.

  As exemplified in FIG. 2, as an example, the molding die 50 includes an upper die 51 and a lower die 52 that are disposed inside a cylindrical sleeve 53 so as to face each other. A thermoplastic molding material 40 is mounted between the molding surface 51a and the molding surface 52a.

  A vent hole 53a is formed in the wall surface portion of the sleeve 53 so as to communicate with a molding space formed between the molding surface 51a of the upper mold 51 and the molding surface 52a of the lower mold 52. Air in the space is quickly discharged outside.

  Then, the molding surface 51a and the molding surface 52a are transferred to the molding material 40 by clamping the upper die 51 and the lower die 52 in the axial direction with the entire molding die 50 heated to a desired molding temperature. Is done.

(Function)
Hereinafter, the operation of the molding apparatus M1 of the present embodiment will be described.
First, in each of the heating stage 11 and the press stage 12, the upper heating plate 19 and the lower heating plate 20 are heated to a predetermined temperature by the heater 19a and the heater 20a.

  In this state, the molding die 50 is introduced into the molding chamber 6 from the introduction base 1 through the introduction shutter 7 through the introduction shutter 7 and placed on the lower heating plate 20 of the heating stage 11.

  Then, by driving the upper shaft 14 by the cylinder 10, the upper heating plate 19 is lowered in the Z direction and brought into contact with the upper mold 51 of the molding die 50, so that the lower heating plate 20 and the upper heating plate 19 are in contact with each other. The temperature of the molding die 50 is raised to a predetermined temperature at which the molding material 40 can be molded by sandwiching the molding die 50 and transmitting heat from the heater 19a and the heater 20a to the molding die 50 from above and below.

  Next, the mold 50 is transferred to the lower heating plate 20 of the press stage 12 by a mold conveying means (not shown).

  Then, the upper heating plate 19 is lowered by driving the upper shaft 14 of the press stage 12 by the cylinder 10, the mold 50 is sandwiched between the lower heating plate 20 and the upper heating plate 19, and the heater is viewed from above and below. The heat of 19a and heater 20a is transmitted to the mold 50 to maintain the temperature of the mold 50, and the upper heating plate 19 is lowered by the upper shaft 14 to press the upper mold 51 of the mold 50 in the Z direction. Pressure is applied, and the shapes of the molding surfaces 51 a and the molding surfaces 52 a of the upper mold 51 and the lower mold 52 in the molding die 50 are transferred to the molding material 40.

  Next, the mold 50 is transferred onto the second cooling plate 27 of the cooling stage 13 by a mold conveying means (not shown), the cooling block drive shaft 21 is driven by the cylinder 10, and the first cooling plate 25 is lowered. The mold 50 is sandwiched between the second cooling plate 27 and the second cooling plate 27.

  At this time, in the case of the present embodiment, since the first cooling plate 25 is supported by the first water cooling block 22 via the first compliance mechanism 23, the back surface of the first cooling plate 25 is the thermoelectric module 30A. The posture of the first cooling plate 25 is autonomously adjusted so that the heat transfer resistance is reduced by being in close contact with the entire surface.

  Similarly, since the second cooling plate 27 is also supported by the second water cooling block 29 via the second compliance mechanism 28, the back surface of the second cooling plate 27 is in close contact with the entire surface of the thermoelectric generation module 30B, and the heat transfer resistance is reduced. The attitude of the second cooling plate 27 is autonomously adjusted so as to be smaller.

Then, the heat energy of the mold 50 is transmitted to the first cooling plate 25 and the second cooling plate 27 through the contact surface with the mold 50.
In this case, the heat transferred from the mold 50 to the first cooling plate 25 is efficiently transferred to the thermoelectric generator module 30A that is in close contact with the first cooling plate 25 as described above.

Similarly, the heat transferred from the mold 50 to the second cooling plate 27 is efficiently transferred to the thermoelectric generator module 30B that is in close contact with the second cooling plate 27 as described above.
As a result, the temperature of the mold 50 is cooled to near room temperature, and the heat released from the mold 50 in the cooling process is converted into electric power and recovered as described later.

  Thereafter, the mold 50 is carried out to the discharge table 2 outside the molding apparatus M1 through the discharge shutter 8, and the optical element that is the molded material 40 that has been molded inside is taken out.

  Here, in the case of the present embodiment, when the mold 50 is cooled by the cooling stage 13, the heat energy of the mold 50 heated to a high temperature is transmitted to the first cooling plate 25, and this first One end face of the thermoelectric generator module 30A that is in close contact with the cooling plate 25 (on the insulating cover 37 side of the heat source side electrode 33) is simultaneously heated.

Similarly, the heat is transmitted to the second cooling plate 27, and the one end surface of the thermoelectric generator module 30B in close contact with the first cooling plate 25 (insulating cover 37 side of the heat source side electrode 33) is heated at the same time.
The other end face of the thermoelectric generator module 30A is in contact with the first water cooling block 22 and is always cooled.

  Similarly, the other end surface of the thermoelectric generator module 30B is in contact with the second water cooling block 29 and is always cooled.

  Therefore, in the thermoelectric generator module 30A, one end surface (the insulating cover 38 side of the heat source side electrode 33) is heated through the first cooling plate 25, and the other end surface (the insulating cover 38 side of the cooling side electrode 34) is first water cooled. The block 22 is cooled, and a temperature difference is generated between the heat source side electrode 33 and the cooling side electrode 34.

  Similarly, in the thermoelectric generator module 30B, one end surface (the insulating cover 38 side of the heat source side electrode 33) is heated through the second cooling plate 27, and the other end surface (the insulating cover 38 side of the cooling side electrode 34) is the second water cooling block. 29 is cooled, and a temperature difference is generated between the heat source side electrode 33 and the cooling side electrode 34.

  When a temperature difference occurs between both ends of the thermoelectric generator module 30A, the P-type semiconductor 31 and the N-type semiconductor 32 generate power. Therefore, the lead wire 35 and the lead wire 36 are connected to the secondary battery 60, thereby forming the molding apparatus M1. In the cooling stage 13, it is possible to recover the thermal energy that was discarded when cooling the mold 50 heated to a high temperature as electric power, store it in the secondary battery 60, and reuse it for an appropriate purpose. It becomes.

  Similarly, also in the thermoelectric generator module 30B, electric power can be recovered from the lead wire 35 and the lead wire 36, and can be effectively reused.

  As described above, in the molding apparatus M1 of the present embodiment, in the process of manufacturing an optical element by molding using the molding die 50 similar to the conventional one, conventionally, in the atmosphere, the first water cooling block 22, the first The energy necessary for heating the mold 50 is recovered by converting the waste heat energy released into the cooling water of the two-water cooling block 29 into wasted power by the thermoelectric generator module 30A and the thermoelectric generator module 30B. It becomes possible to realize the collection, accumulation and reuse of a part of the product.

  That is, in the molding apparatus M1 of the present embodiment, it is possible to reliably improve the utilization efficiency of energy input to the molding cycle of the molding die 50.

  In addition, the thermoelectric generation module 30A and the thermoelectric generation module 30B of the present embodiment are configured using a plurality of P-type semiconductors 31 and N-type semiconductors 32, and therefore there are movable mechanisms that require maintenance management. It does not exist, and its operation reliability and durability are high.

  Therefore, for example, even when the molding apparatus M1 is operated for a long time by continuous operation or the like, the power can be stably taken out from the thermoelectric generation module 30A and the thermoelectric generation module 30B, and the molding apparatus M1 for maintenance management. The frequency of stopping the operation is also reduced, and the productivity of the molding process is improved by improving the operation rate of the molding apparatus M1.

  In the case of the present embodiment, the first cooling plate 25 in contact with the thermoelectric generation module 30A and the mold 50 is supported by the first water cooling block 22 via the first compliance mechanism 23, and the thermoelectric generation module 30B and Since the second cooling plate 27 in contact with the mold 50 is supported by the second water cooling block 29 via the second compliance mechanism 28, each of the first cooling plate 25 and the second cooling plate 27 can transfer heat. The thermoelectric generator module 30A and the thermoelectric generator module 30B are in close contact with each other in the maximum area so that the resistance is reduced.

Thereby, the power generation efficiency of the thermoelectric generation module 30A and the thermoelectric generation module 30B due to the heat of the mold 50 is further improved, and the recovery efficiency and reuse efficiency of the energy used in the molding cycle of the mold 50 are reliably improved.
FIG. 4 is a cross-sectional view showing a configuration example of a cooling stage of a molding apparatus M2, which is a modification of the molding apparatus M1 of the present embodiment.

  In this case, the electric power generated by the thermoelectric generator module 30A is used for the lighting device 70 constituting a part of the molding apparatus M2, and the electric power generated by the thermoelectric generator module 30B is used for the external electric device 80. However, unlike the above-described molding apparatus M1, the rest is the same.

  As illustrated in the molding apparatus M2 of this modification, the electric power obtained from the thermoelectric generation module 30A and the thermoelectric generation module 30B is directly used in the lighting apparatus 70 and the external electric device 80, so that the molding apparatus M2 It becomes possible to reduce the power consumption required for operation and the running cost of the molding apparatus M2.

Needless to say, the present invention is not limited to the configuration exemplified in the above-described embodiment, and can be changed without departing from the spirit of the present invention.
For example, the thermoelectric generation module 30A and the thermoelectric generation module 30B are not limited to the configuration using thermoelectric material elements such as a P-type semiconductor and an N-type semiconductor, and may use a heat engine that operates at a relatively low temperature.

(Appendix 1)
Heat that is disposed on at least one of the first cooling plate and the second cooling plate that sandwich the mold, and the first cooling plate and the second cooling plate, and converts heat energy obtained by heat transfer from the mold into electric power. And a power generation module.

(Appendix 2)
The molding apparatus according to appendix 1, further comprising a first water cooling block and a second water cooling block that support the back surfaces of the first cooling plate and the second cooling plate, wherein the thermoelectric generator module includes the first cooling plate. And the first water cooling block, and between the second cooling plate and the second water cooling block, the molding apparatus.

(Appendix 3)
The molding apparatus according to appendix 1 or appendix 2, wherein the thermoelectric generator module is connected to a secondary battery that stores electric power.

(Appendix 4)
The molding apparatus according to appendix 1 or appendix 2, wherein the thermoelectric generator module is connected to an electrical device constituting a part of the molding apparatus.

(Appendix 5)
The molding apparatus according to appendix 1 or appendix 2, wherein the thermoelectric generator module is connected to an electrical device other than the molding apparatus.

DESCRIPTION OF SYMBOLS 1 Input base 2 Discharge base 3 Upper base 4 Lower base 5 Input claw 6 Molding chamber 7 Input shutter 8 Discharge shutter 9 Side plate 10 Cylinder 11 Heating stage 12 Press stage 13 Cooling stage 14 Upper shaft 15 Upper cooling block 16 Upper heat insulation block 17 Below Cooling block 18 Lower heat insulation block 19 Upper heating plate 19a Heater 20 Lower heating plate 20a Heater 21 Cooling block drive shaft 22 First water cooling block 23 First compliance mechanism 24 First cooling water channel 25 First cooling plate 26 Second cooling water channel 27 First 2 cooling plate 28 second compliance mechanism 29 second water cooling block 30A thermoelectric generation module 30B thermoelectric generation module 31 P-type semiconductor 32 N-type semiconductor 33 heat source side electrode 34 cooling side electrode 35 lead wire 36 lead wire 37 insulating cover 38 insulating cover 40 Molding Material 50 mold 51 upper mold 51a forming surface 52 the lower mold 52a molding surface 53 the sleeve 53a vent hole 60 rechargeable battery 70 illumination device 80 external electrical device 90 gas supplying device 91 gas supply line 92 the mixed gas M1 molding device M2 molding device

Claims (5)

A heating stage for heating the mold on which the molding material is mounted;
A press stage for pressing the heated mold and molding the molding material;
A cooling stage for cooling the formed mold,
The cooling stage is
A first cooling plate and a second cooling plate that sandwich the mold,
A thermoelectric generator that is disposed on at least one of the first cooling plate and the second cooling plate and converts thermal energy released from the mold during cooling into electric power;
A molding apparatus comprising: The cooling stage for cooling the mold further includes a first water-cooling that displaceably supports the back surfaces of the first cooling plate and the second cooling plate on the opposite side of the mold through a compliance mechanism. A block and a second water cooling block;
The thermoelectric generator is disposed between at least one of the first cooling plate and the first water cooling block and between the second cooling plate and the second water cooling block. The molding apparatus according to claim 1.   The thermoelectric generator is in contact with the plurality of heat source side electrodes in contact with the first cooling plate or the second cooling plate on the high temperature side in contact with the mold, and on the first water cooling block or the second water cooling block on the low temperature side. The molding apparatus according to claim 2, wherein the molding apparatus is a thermoelectric generation module including a plurality of P-type thermoelectric material elements and a plurality of N-type thermoelectric material elements alternately connected in series to a plurality of cooling side electrodes. A heating step for heating the mold on which the molding material is mounted, a pressing step for pressing the heated molding die to mold the molding material, and a cooling step for cooling the molded die are executed. A molding method,
In the cooling step, the mold is cooled by converting heat of the mold into electric power.   Thermoelectric power generation that is disposed on at least one of the first cooling plate and the second cooling plate that sandwich the mold and the first cooling plate and the second cooling plate, and converts the thermal energy released from the mold into electric power. And a molding apparatus.