JP2010227776A - Electrostatic atomizer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrostatic atomizer capable of being miniaturized as a whole without damaging a radiation effect. <P>SOLUTION: A case member 11 is constituted of a member having radiation properties and a control device 20 is constituted by mounting various electronic parts 30-36 on a circuit board 37. Both of electronic parts 30-32, which have high heat value to rise to a predetermined temperature (e.g., 20°C) or above by the operation thereof, among the electronic parts 30-36, and a radiation fin 16 of a water supply means are connected to the case member 11 so as to be capable of transmitting the heat produced in the respective members 16 and 30-32 to the case member 11. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electrostatic atomizer that discharges a liquid by electrostatic atomization.

  Conventionally, by applying a high voltage to a discharge electrode to which water is attached and discharging it, the water attached to the discharge electrode is subjected to Rayleigh splitting and electrostatic atomization to generate a mist of a small size. An electroatomizing device is known (see, for example, Patent Document 1).

  In the electrostatic atomizer of Patent Document 1, the discharge electrode accommodated in the cover member is cooled by a Peltier element (Peltier module), so that water is supplied to the discharge electrode based on moisture in the air. It has become so. Then, the supplied water is electrostatically atomized by applying a high voltage between the discharge electrode and the counter electrode, so that a very small mist is generated.

JP 2006-239632 A

  By the way, in said electrostatic atomizer, various circuits, such as a high voltage generation circuit (high voltage application part), are used in order to apply a high voltage between electrodes. In this circuit, electronic components (amplifiers) such as transistors are used, and heat is easily generated in the cover member (device) by these electronic components. For this reason, it is conceivable to provide heat radiating fins for heat dissipation in electronic components such as transistors, which have a relatively large heat loss.

  Moreover, in said electrostatic atomizer, the Peltier device is used in order to supply water with respect to a discharge electrode. For this reason, when the discharge electrode is cooled, heat is generated from the heat generation surface opposite to the cooling surface that cools the Peltier element by absorbing the heat of the discharge electrode. Therefore, a radiation fin is provided to radiate heat from the heat generating surface side.

  As described above, in the conventional electrostatic atomizer, it is possible to provide heat radiation fins in each of the places where heat is likely to be generated, and to effectively dissipate heat with each heat radiation fin. This leads to an increase in the size of the entire apparatus, and the improvement is desired.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electrostatic atomizer capable of reducing the size of the entire apparatus without impairing the heat dissipation effect.

  In order to solve the above problems, the invention described in claim 1 includes a discharge electrode that generates a discharge based on application of a high voltage, a cooling unit, and a heat radiating unit that emits heat based on a cooling operation of the cooling unit. The water supply means for generating dew condensation water from the moisture in the air in the cooling unit and supplying it to the discharge electrode, and the power supply and control of either the discharge electrode or the water supply means. An electrostatic atomizer that houses the control device in a case member and discharges the supplied water by electrostatic atomization based on the discharge of the discharge electrode, wherein the case member dissipates heat The control device is composed of various electronic components mounted on a circuit board. The electronic device that generates a large amount of heat that rises above a predetermined temperature by the operation of the electronic components. Release of parts and water supply means At least one of the parts is that the heat generated at their respective members is connected to said casing member so as to be transmitted from the casing member and the gist thereof.

  In this invention, a case member is comprised with the member which has heat dissipation, and a control apparatus is comprised by mounting various electronic components on a circuit board. In addition, at least one of the electronic component that generates a large amount of heat that rises above a predetermined temperature by the operation of the electronic component and the heat radiating portion of the water supply means, the heat generated in each member can be transferred from the case member to the case member. Connected. In other words, since heat of at least one of the heat generating electronic component and the water supply means can be radiated from the heat radiating case member, it is not necessary to provide a heat radiating portion (heat radiating fin) for each member, and the heat radiating effect is not impaired. The size of the apparatus can be reduced.

  According to a second aspect of the present invention, there is provided the electrostatic atomizer according to the first aspect, wherein at least one of the electronic component that generates a large amount of heat and the heat dissipating part of the water supply means are between the case member and the heat conductive paste. The gist is that the agent is interposed and connected.

  In this invention, since the heat conductive paste is interposed between the case member and at least one of the heat generating electronic component and the heat radiating portion of the water supply means, the paste reduces the vibration and mechanical stress. As a result, damage to the circuit board or the like can be suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, the electrostatic atomizer which can achieve size reduction of the whole apparatus, without impairing the thermal radiation effect can be provided.

It is sectional drawing of the electrostatic atomizer in this embodiment. It is sectional drawing of the electrostatic atomizer in the same as the above. It is a block diagram of the electrostatic atomizer in the same as the above.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
FIG.1 and FIG.2 shows schematic structure of the electrostatic atomizer of this embodiment. As shown in FIGS. 1 and 2, the electrostatic atomizer 10 includes a case member 11 having heat dissipation properties, and a discharge electrode 12 is accommodated in the case member 11. The discharge electrode 12 is provided so as to extend toward the tip opening 11 a of the case member 11, and the tip of the discharge electrode 12 faces the tip opening 11 a side of the case member 11. An annular counter electrode 13 that is opposed to the discharge electrode 12 is disposed at the tip opening 11 a of the case member 11. The center of the hole 13 a of the counter electrode 13 is arranged so as to be on the extension line of the axial center of the discharge electrode 12.

  A Peltier element 15 as a cooling unit for cooling the discharge electrode 12 and generating condensed water on the surface of the discharge electrode 12 from moisture in the air around the discharge electrode 12 is provided at the base end of the discharge electrode 12. Abutment is arranged. The Peltier element 15 is configured by sandwiching a plurality of thermoelectric elements (not shown) between two metal plates (not shown) and causing a cooling action based on power supply. The rear surface 15a of the Peltier element 15 is disposed with a heat radiation fin 16 as a heat radiation portion. A plurality of (for example, five) fin portions 16a and an extending portion 16b formed by bending from a part of the fin portions 16a are configured. In addition, the extended portion 16b is in contact with a first electronic component group 40 (electronic components 30 to 32) as electronic components with large heat generation, which will be described later.

  Further, as shown in FIGS. 1 and 3, a heat conductive paste 17 is interposed between the fin portion 16 a having the extending portion 16 b and the case member 11. The heat conductive paste 17 is capable of transferring heat and relieves mechanical stress accompanying expansion and contraction of the material due to vibration and temperature change. Is transmitted to the case member 11 side. In FIG. 3, only the fin portion 16a having the extending portion 16b is shown, and the other fin portions 16a are not shown.

  When electric power is supplied to the thermoelectric element of the Peltier element 15, the Peltier element 15 absorbs heat from the discharge electrode 12 and the like, and can be moved by the radiation fins 16 and the radiation fins 16 and the heat conductive paste agent 17. The case member 11 configured as described above radiates heat. Therefore, the discharge electrode 12 is thereby cooled and condensed, and the condensed water is generated (supplied) to the discharge electrode 12. In the present embodiment, the Peltier element 15 and the heat radiating fins 16 constitute water supply means.

  Further, on the side of the heat radiating fins 16, a heat radiating fan 18 is disposed as a blower that sends air along the planar direction of the fin portions 16 a of the heat radiating fins 16. The heat radiating fan 18 takes air (outside air) into the case member 11 from the air intake port 11c formed in the side surface 11b at a substantially intermediate position in the longitudinal direction of the case member 11 by its operation, and is opposite to the side surface 11b. The air (heat) in the case member 11 is discharged to the outside from an air discharge port 11e formed on the side surface 11d. Thereby, the heat radiation of the radiation fins 16 is efficiently performed, the cooling effect by the Peltier element 15 is improved, and the ambient temperature in the case member 11 is also reduced.

  In the case member 11, a control device 20 is disposed on the base end side of the heat radiation fin 16. As shown in FIG. 3, the control device 20 includes a high voltage generation circuit 21, a high voltage detection circuit 22, a discharge current detection circuit 23, a Peltier power supply circuit 24, a temperature measurement circuit 25, and a microcomputer (microcomputer) 26. ing. The high voltage generation circuit 21 generates and supplies a high voltage to the discharge electrode 12 so as to cause corona discharge at the discharge electrode 12, and the microcomputer 26 detects the generated high voltage via the high voltage detection circuit 22. In addition, the discharge current is detected via the discharge current detection circuit 23, and the high voltage generation circuit 21 is controlled based on each detection. The Peltier power supply circuit 24 generates and supplies power to the Peltier element 15 so that the Peltier element 15 performs a cooling operation. The microcomputer 26 supplies the temperature measurement circuit 25 to the ambient temperature in the case member 11. And the Peltier power supply circuit 24 is controlled based on the detection.

  Such a control device 20 is configured by mounting various electronic components 30 to 36 and the like on the circuit board 37, and the electronic components 30 to 36 constituting the circuits 21 to 25 are roughly divided into first and second electronic components. They are divided into parts groups 40 and 41.

  The first electronic component group 40 can increase by a predetermined temperature (for example, 20 degrees) or more from the ambient temperature during use of the apparatus 10 such as a switching element such as a diode or FET, a regulator, an inductor, or the like, that is, has a large heat loss (heat generation). This is a set of electronic components. On the other hand, the second electronic component group 41 is a set of electronic components that do not rise in temperature compared to the first electronic component group 40 such as an electrolytic capacitor and a fuse, that is, heat loss is small (heat generation is small). The electronic components 30 to 33 of the first electronic component group 40 are disposed close to the heat dissipating fin 16 side on the circuit board 37, and the electronic components 30 to 32 are in contact with the extending portion 16b, so that the heat generation is large. The heat of the electronic components 30 to 32 is moved to the extending portion 16b (radiating fin 16) side. The electronic components 30 to 33 of the first electronic component group 40 are subjected to cooling air from the heat radiating fan 18, and the electronic components 34 and 35 of the second electronic component group 41 are radiated on the circuit board 37. It is arranged at a position farther than the fins 16.

  In the present embodiment, the height between the first and second electronic component groups 40 and 41 is higher than the electronic components 30 to 35 of the first and second electronic component groups 40 and 41 (in FIG. An electronic component 36 as a third electronic component such as a high voltage application module having a large continuous casing in the direction) is disposed. In other words, the air heated by the first electronic component group 40 that generates a large amount of heat is prevented from flowing toward the second electronic component group 41 by the electronic component 36.

  In the electrostatic atomizer 10 configured as described above, the microcomputer 26 supplies power from the Peltier power supply circuit 24 to the Peltier element 15, thereby cooling the front surface 15 b side of the Peltier element 15. In this way, the contact side of the Peltier element 15 with the discharge electrode 12 is cooled, so that the discharge electrode 12 is cooled, moisture in the air is condensed and water (condensed water) is supplied to the discharge electrode 12. It has become.

  When a high voltage is applied between the discharge electrode 12 and the counter electrode 13 by the high voltage generation circuit 21 in a state where water is supplied to the discharge electrode 12, the voltage is applied between the discharge electrode 12 and the counter electrode 13. Due to the high voltage, the supplied water repeatedly splits and scatters (Rayleigh splitting), and a large amount of minute mist charged positively or negatively is generated. And the produced | generated mist is discharge | released outside toward the front-end | tip opening part 11a side of the case member 11. FIG.

  Further, when electric power is supplied to the Peltier element 15 in the electrostatic atomizer 10 configured as described above, air (outside air) is taken in from the air intake port 11 c by driving the heat radiating fan 18. And since the taken-in air is carried to the air discharge port 11e side by the drive of the heat radiating fan 18, the heat of the radiating fins 16 and the first electronic component group 40 arranged in the flow path of the taken-in air Together with the taken-in air (cooling air), the air is discharged from the air discharge port 11e.

  In addition, since the extended portion 16b and the electronic components 30 to 32 that generate a large amount of heat are brought into contact with each other and the heat of the electronic components 30 to 32 that generate a large amount of heat is efficiently moved to the radiation fin 16 side, the electronic component 30 that generates a large amount of heat. The heat dissipation of ~ 32 is also suitably performed. For this reason, it is not necessary to provide heat radiating fins for each of the members 15, 30, 31, and 32, and the overall size of the apparatus 10 is reduced.

  Further, since the air flow to the second electronic component group 41 side is blocked by the high voltage application module having a large housing constituting the electronic component 36, the heat radiation fin 16 and the first electronic component group 40 are heated. Air is suppressed from reaching the second electronic component group 41 side. Therefore, it is possible to suppress the influence exerted on the second electronic component group 41 by the heat generated in the radiating fins 16 and the first electronic component group 40, and to obtain desired circuit characteristics.

  Moreover, since the 1st electronic component group 40 is arrange | positioned in the Peltier element 15 and the radiation fin 16 side which comprise a water supply apparatus compared with the 2nd electronic component group 41, it is necessary to lengthen the full length of the radiation fin 16. FIG. Therefore, it is possible to contribute to downsizing of the entire apparatus 10.

  Moreover, the heat conduction paste agent 17 is interposed between the fin part 16a of the heat radiating fin 16 and the case member 11 having heat radiating properties, and the heat can be transferred to the case member 11 side. Thereby, since the heat of the fin part 16a is radiated also from the case member 11 through the heat conductive paste agent 17, heat radiation and cooling can be performed more efficiently. Further, by interposing the heat conductive paste 17 that relieves vibration and mechanical stress, the transmission of stress to the circuit board 37 and the like is suppressed, so that the circuit board 37 is damaged, so-called solder cracks, printed circuit pattern cuts, etc. Can be suppressed.

Next, characteristic effects of the present embodiment will be described.
(1) The case member 11 is configured by a member having heat dissipation, and the control device 20 is configured by mounting various electronic components 30 to 36 on a circuit board 37. Then, both of the electronic components 30 to 32 that generate a large amount of heat and rise to a predetermined temperature (for example, 20 degrees) or more by the operation of the electronic components 30 to 36 and the heat dissipating fins 16 of the water supply means are the members 16, 30 to The heat generated at 32 is connected to the case member 11 so that the heat can be transmitted to the case member 11. That is, since heat of both the electronic components 30 to 32 and the water supply means radiating fins 16 having large heat generation can be radiated from the case member 11 having heat radiating properties, a radiating portion (radiating fin) is provided for each of the members 16 and 30 to 32. There is no need to provide it, and the device 10 can be downsized without impairing the heat dissipation effect.

  (2) Since the heat conductive paste 17 is interposed between the case member 11 and both of the electronic components 30 to 32 that generate large heat and the small heat radiating portion 32 of the water supply means, vibration and machine Stress can be relaxed and damage to the circuit board 37 and the like can be suppressed.

  (3) The control device 20 is configured by mounting various electronic components 30 to 36 on a circuit board 37. And the electronic components 30-32 of the 1st electronic component group 40 comprised by the electronic components 30-33 with the big heat_generation | fever which raises more than predetermined temperature by the operation | movement among the electronic components 30-36 comprise a water supply means. It is configured to be in contact with the radiating fins 16 as the radiating portions. Thereby, since heat generated from the first electronic component group 40 (electronic components 30 to 32) can be radiated by the radiating fins, the radiating fins do not have to be provided for each of the members 30, 31, and 32. 10 can be downsized as a whole.

  (4) By providing the heat dissipating fan 18 as a blower that blows air to the heat dissipating fins 16, heat can be radiated more effectively by sending air to the heat dissipating fins 16 by the heat dissipating fan 18.

  (5) The first electronic component group 40 is arranged close to the heat dissipating fins 16, and the cooling air of the heat dissipating fan 18 as a blower is supplied to the first electronic component group 40 and cooled together with the heat dissipating fins 16. . That is, since the first electronic component group 40 (electronic components 30 to 33), which are members that easily generate heat, and the radiating fins 16 can be brought close to (aggregated) and cooled by the single radiating fan 18, the apparatus 10 can be efficiently used. The temperature in the (case member 11) can be dissipated, and the heat generated at other locations in the device 10 (case member 11) can be reduced.

  (6) Among the various electronic components 30 to 36 constituting the control device 20, the electronic components 34 and 35 that generate less heat than the electronic components 30 to 33 constituting the first electronic component group 40 are defined as a second electronic component group 41. In addition, the electronic component 36 having a larger housing than the first and second electronic component groups 40 and 41 is used as the third electronic component, and the alternating atmosphere between the first and second electronic component groups 40 and 41 is suppressed. An electronic component 36 having a large casing is arranged to be achieved. That is, by arranging the electronic component 36 having a large casing among the electronic components 30 to 36 constituting the control device 20 between the first and second electronic component groups 40 and 41, the first electronic component group 40 side is arranged. It can suppress that the heat which generate | occur | produces in the electronic components 30-33 is transmitted to the 2nd electronic component group 41 side, and can suppress the influence of the heat given to the 2nd electronic component group 41 side. Therefore, desired circuit characteristics can be obtained on the second electronic component group 41 side.

  (7) Compared with the second electronic component group 41, the first electronic component group 40 is arranged on the side of the Peltier element 15 and the radiation fins 16 constituting the water supply device, so that the total length of the radiation fins 16 needs to be increased. This contributes to downsizing of the entire apparatus 10.

In addition, you may change embodiment of this invention as follows.
In the above embodiment, the radiating fins 16 connected to the Peltier element 15 constituting the water supply means and the electronic components 30 to 32 (first electronic component group 40) generating a large amount of heat are brought into contact with each other. May be. In this case, for example, a configuration in which the electronic components 30 to 32 with large heat generation and the case member 11 having heat dissipation directly contact each other, or a heat conductive paste agent between the electronic components 30 to 32 with large heat generation and the case member 11. You may employ | adopt the structure which arrange | positions. Moreover, you may add the structure which the electronic component 33 with large heat_generation | fever and the radiation fin 16 are contact | abutted.

  In the above embodiment, the configuration in which the radiation fins 16 are provided on the base end side of the Peltier element 15 constituting the water supply means is not limited thereto, and a configuration in which the radiation fins 16 are omitted may be employed. In this case, a configuration in which the Peltier element 15 and the heat radiating case member 11 are in direct contact with each other, or a configuration in which a heat conductive paste agent is disposed between the Peltier element 15 and the case member 11 are employed.

  In the above embodiment, the heat conductive paste agent 17 is provided between the heat radiating fins 16 and the heat radiating case member 11. However, the heat conductive paste agent 17 is not limited to this, and for example, a heat conductive sheet is used instead of the heat conductive paste agent 17. May be. Moreover, the structure which abbreviate | omits the heat conductive paste agent 17 and directly contacts the radiation fin 16 and the case member 11 may be adopted.

  In the above-described embodiment, the configuration in which the heat radiating fan 18 is provided is adopted. With such a configuration, it is possible to reduce the number of parts and further contribute to downsizing of the apparatus 10.

Next, a technical idea that can be grasped from the above embodiment and another example will be added below.
(A) In the electrostatic atomizer according to claim 1 or 2,
An electrostatic atomizer comprising: an electronic component that generates a large amount of heat that rises by a predetermined temperature or more due to an operation thereof in contact with the heat radiating portion of the water supply unit.

  The control device is configured by mounting various electronic components on a circuit board. And among the electronic components, an electronic component that generates a large amount of heat and rises by a predetermined temperature or more due to its operation is brought into contact with the heat radiating portion of the water supply means. As a result, the heat generated from the first electronic component can be dissipated by the heat dissipating part constituting the water supply means. Therefore, it is not necessary to provide the heat dissipating part for each member, and the entire apparatus can be downsized. It becomes possible.

(B) In the electrostatic atomizer according to any one of claims 1 and 2 and (a),
An electrostatic atomizer comprising a blower for blowing air to the heat radiating unit.
By providing the air blower that blows air to the heat radiating unit, the air can be radiated more effectively by sending air to the heat radiating unit by the air blower.

(C) In the electrostatic atomizer described in (b) above,
Among the electronic components, an electronic component that generates a large amount of heat and that rises by a predetermined temperature or more due to its operation is used as the first electronic component, and the first electronic component is disposed in proximity to the heat radiating portion. An electrostatic atomizer configured to be supplied to the first electronic component and cooled together with the unit.

  In this way, the first electronic component, which is a member that easily generates heat, and the heat dissipating part can be brought close together (collected) and cooled by one heat dissipating part, so that the temperature in the device (case member) can be efficiently dissipated. The heat generated at other locations in the apparatus (case member) can be reduced.

(D) In the electrostatic atomizer described in (c) above,
Of the various electronic components constituting the control device, an electronic component that generates less heat than the first electronic component is defined as a second electronic component, and an electronic component having a larger housing than the first and second electronic components is defined as a third electronic component. Electronic components,
The electrostatic atomizer characterized in that the third electronic component having a large casing is arranged between the first and second electronic components so as to suppress mutual alternating current atmosphere.

  In this way, by arranging the third electronic component having a large casing among the electronic components constituting the control device between the first and second electronic components, the heat generated in the first electronic component is generated by the second electronic component. Transmission to the component side can be suppressed, and the influence of heat on the second electronic component side can be suppressed. Therefore, desired circuit characteristics can be obtained on the second electronic component side. In addition, since the first electronic component is arranged on the side of the Peltier element and the heat dissipating part constituting the water supply device as compared with the second electronic component, it is not necessary to lengthen the entire length of the heat dissipating fin, and the entire device is downsized. Can contribute.

  DESCRIPTION OF SYMBOLS 10 ... Electrostatic atomizer, 11 ... Case member, 12 ... Discharge electrode, 15 ... Peltier element which comprises a water supply means and a cooling part, 17 ... Thermal conductive paste agent, 20 ... Control apparatus, 30-33 ... Heat generation Large electronic component 36... Electronic component constituting third electronic component 37. Circuit board.

Claims (2)

A discharge electrode for generating discharge based on application of a high voltage;
A water supply unit that includes a cooling unit and a heat dissipating unit that emits heat based on a cooling operation of the cooling unit, and generates condensed water from moisture in the air in the cooling unit and supplies the condensed water to the discharge electrode;
A control device that performs power supply and control of either the discharge electrode or the water supply means;
An electrostatic atomizer that discharges the supplied water by electrostatic atomization based on the discharge of the discharge electrode,
The case member is composed of a member having heat dissipation,
The control device is configured by mounting various electronic components on a circuit board,
At least one of the electronic component that generates a large amount of heat that rises above a predetermined temperature by the operation of the electronic component and the heat radiating portion of the water supply means is capable of transferring heat generated from each of the members to the case member. An electrostatic atomizing device connected to a case member. In the electrostatic atomizer of Claim 1,
At least one of the electronic component with large heat generation and the heat radiating part of the water supply means is connected to the case member with a heat conductive paste interposed therebetween, and the electrostatic atomizer.

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